A double-layer microchannel jet cooling heat sink device

Abstract

The present invention belongs to the field of three-dimensional integrated circuits and high-power semiconductor heat dissipation and cooling technology, and is specifically a double-layer microchannel jet cooling heat sink device. It includes an inlet cover plate (1), a jet orifice plate (2), a herringbone rib cooling plate (3), a jet upper base plate (4), an intermediate skeleton (5) spiral ribs (6), spoiler ribs (7), a jet lower base plate (8), and an outflow hole (9). A double-layer heat exchange plate is used, and the jet holes correspond to the gaps between the working units of the jet upper base plate, so that the heat exchange is more sufficient. The spiral shape of the spiral ribs (6) will cause swirl, increase fluid disturbance, improve cooling efficiency, and enhance heat exchange. The structure of the spoiler ribs (7) can cause turbulence and destroy the boundary layer of the fluid, significantly improving the heat exchange effect. The jet upper base plate working unit and the jet lower base plate working unit exchange heat simultaneously, realizing secondary heat exchange, and the heat exchange effect is more obvious.

Description

Technical Field

[0001] The invention belongs to the technical field of three-dimensional integrated circuit and high-power semiconductor heat dissipation and cooling, and specifically is a double-layer microchannel jet cooling heat sink device. Background Art

[0002] With the rapid development of micro-electromechanical systems, three-dimensional integrated circuits have become a research focus. As the integration of three-dimensional integrated circuits becomes higher and higher, more heat will be generated per unit area. For electronic equipment, increased temperature means reduced reliability. According to relevant research, when the temperature of electronic equipment reaches 70-80℃, its reliability decreases by 5% for every 10℃ increase in temperature. Therefore, the thermal problem of chips is an important factor that affects or even limits cutting-edge technologies such as three-dimensional integrated circuits and lasers.

[0003] On the one hand, existing three-dimensional integrated circuits have begun to use through silicon vias instead of the original silicon dioxide through vias, which has a certain effect on chip heat exchange, but the overall heat exchange effect is not obvious.

[0004] On the other hand, the development of microchannel liquid cooling technology has greatly enhanced the heat exchange capacity, especially the introduction of nanofluids, which has taken microchannel liquid cooling technology to a higher level. However, the development of cooling fluids has encountered a bottleneck.

[0005] The existing direction of heat transfer enhancement is mainly to improve the microchannel liquid cooling effect by changing the shape of the microchannel, the internal roughness, etc. However, double-layer or even multi-layer cooling structures are relatively rare.

[0006] At present, the chip heat dissipation has the following defects:

[0007] (1) It only has a single-layer structure with limited heat exchange capacity, and the development space of the single-layer microchannel structure has come to an end.

[0008] (2) A single long channel is not conducive to enhancing heat exchange. Summary of the invention

[0009] The purpose of the present invention is to make full use of the cooling medium through a new structure, improve the cooling efficiency, strengthen the heat exchange, and ensure uniform and stable heat exchange. To achieve this purpose, the scheme of the present invention is as follows:

[0010] A double-layer microchannel jet cooling heat sink device comprises an inlet cover plate 1, a jet orifice plate 2, a herringbone rib cooling plate 3, a jet upper bottom plate 4, an intermediate frame 5, spiral ribs 6, spoiler ribs 7, a jet lower bottom plate 8, and an outflow hole 9.

[0011] The jet orifice plate 2 has four jet holes as a group, which are 20d apart in the horizontal direction and 25d apart in the vertical direction. The middle jet hole of the jet orifice plate 2, the jet hole of the jet upper bottom plate 4, and the jet hole of the middle frame 5 are cocentric.

[0012] The working units of the jet upper bottom plate 4 are the herringbone rib cooling plates 3 ; the working units of the jet lower bottom plate 8 are the spiral ribs 6 and the spoiler ribs 7 ; and the outflow holes 9 are located on both sides of the short sides of the jet lower bottom plate 8 .

[0013] The jet upper base plate 4 is a 161d×89d rectangle in top view with a wall thickness of 2d. A herringbone rib cooling plate 3 is formed as a working group, and the working groups are arranged 6×3. There is a row of oblong jet holes in the middle of the upper base plate, which corresponds to the jet holes of the middle frame 5 for the cooling medium to enter the jet lower base plate 8.

[0014] The herringbone rib cooling plate 3 is a regular hexagon with a side length of 12.5d. The ribs spread outward from the center point, with a total of five layers. The innermost rib is shaped like an isosceles triangle and a semi-cylinder with a diameter of 0.2d is dug out.

[0015] The jet bottom plate 8 is a 161d×89d rectangle in top view, with a wall thickness of 2d. The working units are spiral ribs 6 and spoiler ribs 7 with an inner cylindrical diameter of 2d and an outer contour diameter of 10d, which are symmetrically arranged on the bottom plate.

[0016] The advantages of the present invention are:

[0017] 1. The middle jet hole of the jet orifice plate 2, the jet hole of the jet upper bottom plate 4, and the jet hole of the middle frame 5 are cocentric. The jet orifice plate 2 simultaneously jets to the jet upper bottom plate 4 and the jet lower bottom plate 8 to avoid overheating of the working fluid entering the jet lower bottom plate 8 and thus affect the heat exchange effect.

[0018] 2. The herringbone rib cooling plate 3 on the jet upper bottom plate 4 will form a turbulent flow, which can improve the cooling efficiency and enhance the heat exchange.

[0019] 3. The working unit of the jet lower bottom plate 8 will form a turbulent flow, destroy the thermal boundary layer, and make the heat exchange effect more obvious.

[0020] 4. The spiral ribs 6 on the jet bottom plate 8 can rotate under the impact of the jet, thereby achieving a better heat exchange effect.

[0021] 5. The outer side of the jet hole of the middle frame 5 is slotted, and holes are opened on the front and rear sides and passed through flowing liquid nitrogen to cool the jet, which has a better heat exchange effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Appearance of double-layer microchannel jet cooling heat sink device

[0023] Figure 2 Double-layer microchannel jet cooling heat sink device orifice plate structure diagram

[0024] Figure 3 Schematic diagram of the jet upper bottom plate of the double-layer microchannel jet cooling heat sink device

[0025] Figure 4 Three views of the jet upper base plate of the double-layer microchannel jet cooling heat sink device

[0026] Figure 5 Schematic diagram of the jet bottom plate of the double-layer microchannel jet cooling heat sink device

[0027] Figure 6 Three views of the jet bottom plate of the double-layer microchannel jet cooling heat sink device

[0028] Figure 7 The structure diagram of the herringbone rib column of the double-layer microchannel jet cooling heat sink device

[0029] Figure 8 The structure diagram of the triangular rib column of the double-layer microchannel jet cooling heat sink device

[0030] Fig. 9 Three views of the middle frame of the double-layer microchannel jet cooling heat sink device

[0031] Fig.10 Double-layer microchannel jet cooling heat sink device spiral rib structure diagram

[0032] Fig.11 The structure diagram of the rib column of the bottom plate of the double-layer microchannel jet cooling heat sink device

[0033] Fig.12 The structure diagram of the rib column of the bottom plate of the double-layer microchannel jet cooling heat sink device DETAILED DESCRIPTION

[0034] The double-layer microchannel jet cooling heat sink device comprises an inlet cover plate 1, a jet orifice plate 2, a herringbone rib column cooling plate 3, a jet upper bottom plate 4, an intermediate frame 5, a spiral rib 6, a spoiler rib 7, a jet lower bottom plate 8, and an outflow hole 9. The cooling medium enters from the upper inlet, passes through the jet orifice plate 2 and simultaneously jets to the upper and lower bottom plates, exchanges heat with the herringbone rib column cooling plate 3, and then flows down from the oblong jet hole of the jet upper bottom plate 4. The jet passes through the oblong jet hole in the intermediate frame 5 and is cooled by the liquid nitrogen flowing outside the jet hole, and then ejects to the jet lower bottom plate 8 for secondary heat exchange, and then flows out from the outflow holes 9 on both sides of the jet lower bottom plate 8.

[0035] The lower part of the inlet cover plate 1 is welded to the upper part of the jet orifice plate 2, the lower part of the jet upper bottom plate 4 is welded to the upper part of the intermediate frame 5, and the lower part of the intermediate frame 5 is welded to the upper part of the jet lower bottom plate 8. The above structural materials are all oxygen-free copper, and the connection method is completed by vacuum welding.

[0036] refer to Figure 2The jet orifice plate 2 is made of oxygen-free copper, and the jet holes thereon are formed by micro-milling. The jet orifice plate 2 is 161d long, 89d wide, and 10d thick. The jet holes are spaced 20d in the horizontal direction and 25d in the vertical direction, and are evenly distributed in a 7×4 array on the jet orifice plate 2, and the jet holes correspond to the gaps between the herringbone rib cooling plates 3 on the jet upper bottom plate 4.

[0037] refer to Figure 4 The jet upper bottom plate 4 is made of oxygen-free copper by smelting. The jet upper bottom plate 4 is 161d long, 89d wide and 8d high. The bottom of the jet upper bottom plate 4 is 3d thick, and 6×3 regular hexagonal grooves with a depth of 1d and a side length of 12.5d are arranged to place and position the herringbone rib cooling plate 3. The grooves are processed by a micro milling cutter, and the ribs are welded to the bottom plate by vacuum brazing technology.

[0038] refer to Figure 6 The jet bottom plate 8 is made of oxygen-free copper by smelting. The jet bottom plate 8 is 161d long, 89d wide and 7d high. The bottom of the jet bottom plate 8 is 2d thick, and 9 boss-shaped grooves are arranged symmetrically on the left and right to place and position the spiral ribs 6, and the grooves are processed by a micro-milling cutter.

[0039] refer to Figure 7 and Figure 8 The material of the rib is silicon, and the shape is cut by wire cutting technology, and then polished. The rib is welded to the bottom plate by vacuum brazing technology.

[0040] refer to Fig. 9 The middle frame 5 is 161d long, 89d wide and 3.9d high. There are 14 circular holes arranged evenly in the middle, and the external liquid nitrogen cooling tank is 89d long, 6d wide and 3.5d high.

[0041] refer to Fig.10 , Fig.11 , Fig.12 The rib column is cut by wire cutting technology. In the device structure, the rib column and the herringbone rib column cooling plate 3 are made of silicon.

[0042] Matters not covered by the present invention are known technologies.

[0043] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A double-layer microchannel jet cooling heat sink device, comprising an inlet cover plate (1), a jet orifice plate (2), a herringbone rib cooling plate (3), a jet upper bottom plate (4), an intermediate frame (5), spiral ribs (6), spoiler ribs (7), a jet lower bottom plate (8), and an outflow hole (9), characterized in that: The inlet cover plate (1), the jet orifice plate (2), the jet upper bottom plate (4), the middle frame (5), and the jet lower bottom plate (8) are stacked in five layers from top to bottom; the jet orifice plate (2) is provided with an array of jet holes, and the middle jet holes of the jet orifice plate (2), the jet holes of the jet upper bottom plate (4), and the jet holes of the middle frame (5) are coaxially arranged in the vertical direction and are respectively located at different heights; the jet upper bottom plate (4) is in a concave shape, and a herringbone rib column cooling plate (3) is provided on the inner bottom surface of the concave cavity of the jet upper bottom plate (4); the jet lower bottom plate (8) is in a concave shape, and a spiral rib (6) and a spoiler rib (7) including a triangular column are provided on the inner bottom surface of the concave cavity of the jet lower bottom plate (8); the outflow hole (9) is located on both sides of the short side of the jet lower bottom plate (8); a through groove is provided on the outer side of the jet hole of the middle frame (5), and the through groove passes liquid nitrogen flowing upward to cool the working medium, thereby achieving a better heat exchange effect.

2. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The jet orifice plate (2) is 161d long, 89d wide and 10d thick. The jet holes have a lateral spacing of 20d and a longitudinal spacing of 25d, and are evenly distributed in an array of 7×4 on the jet orifice plate (2).

3. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The working unit of the jet upper bottom plate (4) is a herringbone ribbed column cooling plate (3) in a 6×3 uniform array; the jet upper bottom plate (4) is a 161d×89d rectangle in top view with a wall thickness of 2d, with a herringbone ribbed column cooling plate (3) as a working group, and the working groups are arranged in 6×3. There is a row of oblong jet holes in the middle of the upper bottom plate, which corresponds to the jet holes of the middle frame (5) for the cooling medium to enter the jet lower bottom plate (8); the herringbone ribbed column cooling plate (3) is a regular hexagon with a side length of 12.5d, and the ribs spread outward from the center point, with a total of five layers, and the innermost rib is shaped like an isosceles triangle and a semi-cylinder with a diameter of 0.2d is dug out.

4. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The jet lower bottom plate (8) is a 161d×89d rectangle in top view with a wall thickness of 2d. The working units of the jet lower bottom plate (8) are spiral ribs (6) with an inner cylindrical diameter of 2d and an outer contour diameter of 10d and spoiler ribs (7) including triangular columns, which are arranged symmetrically on the lower bottom plate.

5. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The jet upper bottom plate (4) is 8d high and 3d thick at the bottom, and is provided with 6×3 regular hexagonal grooves with a depth of 1d and a side length of 12.5d for placing and positioning the herringbone rib cooling plate (3).

6. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The middle jet hole of the jet orifice plate (2), the jet hole of the jet upper bottom plate (4), and the jet hole of the middle frame (5) are coaxially arranged in the vertical direction and are respectively located at different heights. The jet orifice plate (2) simultaneously jets toward the jet upper bottom plate (4) and the jet lower bottom plate (8), thereby preventing the working fluid entering the jet lower bottom plate (8) from being overheated and thus affecting the heat exchange effect.

7. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The middle frame (5) is 161d long, 89d wide and 3.9d high, with 14 circular holes arranged equidistantly in the middle; the external liquid nitrogen cooling tank is 89d long, 6d wide and 3.5d high.

8. A double-layer microchannel jet cooling heat sink device according to claim 1, characterized in that: The jet bottom plate (8) is 7d high and 2d thick at the bottom, and has 9 boss-shaped grooves arranged symmetrically on the left and right for placing and positioning the spiral ribs (6). The spiral ribs (6) on the jet bottom plate (8) can rotate under the impact of the jet, thereby achieving a better heat exchange effect.

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