Automatic loading machine for semiconductor cylindrical material
By designing an automatic feeding machine for cylindrical semiconductor materials, which employs vibration sorting and weight height screening, combined with laser sensors and precision weight detection, the problems of dust accumulation and material compliance are solved, achieving automated and accurate material feeding and detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2026-03-24
AI Technical Summary
Existing semiconductor material dispensing equipment is prone to dust accumulation during transportation, which can cause material to get stuck in the hoses, and it lacks a material compliance inspection process.
An automatic feeding machine for semiconductor cylindrical materials was designed. After vibration sorting and weight and height screening, the materials are fed in using a special magazine. Combined with laser sensors and precision weight detection sensors, the compliance of the materials is ensured.
It effectively prevents dust accumulation, ensures material compliance, and achieves automated and precise material dispensing and testing, eliminating non-compliant materials.
Smart Images

Figure CN117864801B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automatic feeding machine technology, specifically an automatic feeding machine for semiconductor cylindrical materials. Background Technology
[0002] With bottlenecks in semiconductor manufacturing processes and limitations in chip architecture optimization, processor performance development will gradually slow down in the coming years, and Moore's Law will gradually become obsolete. Therefore, advanced packaging technology offers a lifeline for the industry, helping to improve chip performance. From the perspective of the entire industry, improved chip performance will in turn promote the development of the computer and IT industries, indirectly creating more possibilities for breakthroughs in chip design, manufacturing, and packaging technologies. Therefore, the development of the packaging industry will drive a positive industrial cycle, which is of great significance and has a very broad development prospect.
[0003] However, existing semiconductor material feeding equipment on the market uses a vibrator and a hose to deliver materials to a robotic arm. The disadvantage of this equipment is that dust accumulation during transportation can cause the hose to jam, and it lacks a testing process, which cannot guarantee the compliance of the materials. Summary of the Invention
[0004] The purpose of this invention is to solve the problem that dust accumulation during transportation can cause material to get stuck in the hose, and the lack of a detection process can not guarantee the compliance of the material. The invention provides an automatic feeding machine for cylindrical semiconductor materials. This equipment sorts regular cylindrical materials by vibration, then performs weight and height screening, and finally feeds them into a specially designed magazine.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic semiconductor cylindrical material loading machine, comprising a machine frame assembly, wherein the machine frame assembly is composed of an upper profile frame assembly, a lower welding frame assembly, a platform, a bottom plate, and a touch screen assembly; the platform is installed above the lower welding frame assembly; the upper profile frame assembly is assembled from profiles and installed above the platform; the bottom plate is installed at the bottom of the lower welding frame assembly; and the touch screen assembly is installed at the front of the lower welding frame assembly; a feeding assembly is installed on the rear side of the platform; a material handling assembly is installed at the rear of the lower welding frame assembly; a bottom plate is provided inside the machine frame assembly; the material handling assembly is installed on the bottom plate; a feeding assembly is installed on the platform; and a dust treatment assembly is installed below the feeding assembly.
[0006] As a further embodiment of the present invention: the feeding assembly includes: a material bin, a partition, a bin cover, a bin vibrating feeder, a material vibrating plate, and a feed detection sensor. The material bin is installed above the platform, the bin cover is installed on the upper part of the material bin via a hinge, the partition is installed in the middle of the material bin, the bin vibrating feeder is installed below the material bin, the bin vibrating feeder can vibrate the material and drop it into the material vibrating plate, the material vibrating plate is installed on the bottom plate below the material bin, and the material vibrating plate can axially change the direction of cylindrical material through a pipe and transport it to the discharge port of the material handling assembly.
[0007] As a further embodiment of the present invention: the material handling assembly includes a transverse conveying assembly and a longitudinal ejection assembly. The transverse conveying assembly is connected to the end port of the material vibrating disc. The transverse conveying assembly includes: an infeed adjusting block, infeed guide rods, an upper mounting plate, a lower mounting plate, a material pusher, a first guide rail connecting plate, a bottom support shaft, a guide rail unit, a second guide rail connecting plate, an infeed driving mechanism, an ejection guide block, a guide block ejection cylinder, a laser height detection sensor, a weight detection assembly, an ejection fixing block, an ejection guide shaft, an ejection cylinder, and a waste material chute. The four infeed guide rods are inserted into the material in a tangential manner to the cylindrical material. The feeding adjustment block is installed in the upper mounting plate and located below the end port of the material vibrating plate. The top of the feeding adjustment block is funnel-shaped to facilitate material feeding. The guide rail unit is installed behind the lower mounting plate. The first guide rail connecting plate is installed on the slider of the guide rail unit. The material pusher is installed on the first guide rail connecting plate and slides back and forth. The material pusher is installed below the feeding guide rod. A cylindrical support plate is installed at the rear of the material pusher to reduce friction when it blocks subsequent cylindrical materials during transportation. The bottom support shaft is embedded in the lower mounting plate. The material pusher block, secured by a connecting pressure plate, causes the cylindrical material falling into it to slide on the bottom support shaft. The feeding drive mechanism, composed of a stepper motor and a first synchronous pulley, drives the first synchronous belt to move back and forth. The material pusher block, fixed to the first synchronous belt by the connecting pressure plate, moves back and forth with it. The second guide rail connecting plate is mounted on the guide rail unit. The ejector guide block is mounted on the guide rail connecting plate. A guide block ejection cylinder drives the ejector guide block to move back and forth on the guide rail unit. The laser height detection sensor is installed at the detection station of the upper mounting plate. The weight detection component is installed on... The weight detection component, located below the lower mounting plate and at the material detection station, consists of a detection block, a support plate, and a detection instrument. The detection block is mounted on the lower mounting plate, and the support plate is mounted on the detection block with a slot on the support plate located on the bottom support shaft. The ejection fixing block is mounted on the upper mounting plate at the ejection station, and the ejection guide shaft is mounted on the ejection fixing block, with its distribution tangentially and evenly arranged with respect to the cylindrical material. The ejection cylinder is mounted on the ejection fixing block to clamp the ejected cylindrical material for storage purposes. The waste material chute is installed at the bottom of the lower mounting plate at the corresponding ejection station.
[0008] As a further embodiment of the present invention: the longitudinal ejection assembly includes: an ejection assembly mounting plate, a stepper motor, a timing belt assembly, an ejection linear guide assembly, an ejection mounting plate, and an ejection rod. The ejection assembly mounting plate is mounted on the base plate. The stepper motor is mounted on one end of the ejection assembly mounting plate. The timing belt assembly consists of a second timing pulley, a first bearing seat, and a second timing belt. One second timing pulley is mounted on the stepper motor, and the other second timing pulley is mounted in an adjustment groove at the other end of the ejection mounting plate via the first bearing seat. The ejection linear guide assembly is mounted on the ejection assembly mounting plate, and the ejection mounting plate is mounted on the slider of the ejection linear guide assembly. The second timing belt of the timing belt assembly is fixedly mounted to the ejection mounting plate via the connecting pressure plate.
[0009] As a further embodiment of the present invention: the feeding assembly includes: a longitudinal axis moving assembly, a transverse axis assembly mounting plate, a transverse axis moving assembly, a longitudinal axis support slide rail, a first mounting plate, a lifting cylinder, a magazine mounting block, a magazine guide post, a second mounting plate, a support cylinder, and a clamping cylinder. The longitudinal axis moving assembly consists of a first servo motor, a lead screw, a second bearing seat, and a first linear guide rail. The longitudinal axis moving assembly is mounted on the left side of the platform, and the longitudinal axis support slide rail is located on the right side of the platform, with both maintaining the same top height. The transverse axis assembly mounting plate is mounted between the longitudinal axis moving assembly and the longitudinal axis support slide rail. The transverse axis moving assembly consists of a second servo motor, a second linear guide rail, and a third synchronous wheel. The second mounting plate is mounted on the linear guide rail of the transverse axis moving assembly. The lifting cylinder is mounted on the first mounting plate. The magazine guide posts are evenly distributed circumferentially on the magazine mounting block, and are arranged circumferentially to the diameter of the cylindrical material. The support cylinder is mounted on the lower part of the magazine mounting block, and the clamping cylinder is mounted on the magazine mounting block, located above the support cylinder.
[0010] As a further embodiment of the present invention: the dust treatment component includes: a dust collection box, a dust collection drawer, a filter element pressure plate, a plate filter element, a dust scraper, a negative pressure fan, and a dust suction pipe assembly; the dust collection box is installed below the material handling assembly, the dust collection box is divided into upper and lower layers, the dust collection drawer is installed below the dust collection box, the plate filter elements are installed on the upper left and right sides of the dust collection box, the filter element pressure plate seals and presses the plate filter elements onto the upper part of the dust collection box, and the dust scraper is installed in the middle of the plate filter element and its shape matches the pleats of the plate filter element.
[0011] As a further embodiment of the present invention: the ejector assembly mounting plate is mounted on the base plate via a connecting mechanism. The connecting mechanism includes a connecting groove, which is formed on the outer wall of the ejector assembly mounting plate. A connecting seat is fixedly connected to the top of the base plate. A locking block extending from the connecting seat is slidably connected inside the connecting seat. A connecting spring is connected between the locking block and the connecting seat. A T-shaped block extending above the connecting seat is slidably connected inside the connecting seat. The T-shaped block passes through the locking block. A vertical groove passing through the locking block is formed on the outer wall of the locking block. A locking slot is formed at one end of the vertical groove.
[0012] As a further embodiment of the present invention: the card block is C-shaped, and a first inclined surface and a second inclined surface are respectively provided at both ends of the card block, and the T-shaped block is located above the second inclined surface.
[0013] As a further embodiment of the present invention: the inner wall of the vertical groove is fitted with the top outer wall of the T-shaped block, and the inner wall of the slot is fitted with the bottom outer wall of the T-shaped block.
[0014] Compared with the prior art, the beneficial effects of the present invention are:
[0015] The cylindrical materials are fed by an automatic feeding hopper and a vibratory feeder. Then, a special stepping feeding mechanism is used to transport the materials and detect their height and weight. The material is then pushed from the bottom storage hopper into the hopper of the feeding robot by an ejection mechanism. The robot then feeds the materials one by one. The height of the cylindrical materials is detected by a laser sensor and the weight of the materials is detected by a precision weight sensor. The robot has the function of rejecting materials that do not meet the requirements. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of the present invention;
[0017] Figure 2 This is a schematic diagram of the structure of the equipment rack assembly of the present invention;
[0018] Figure 3 This is a schematic diagram of the feeding assembly of the present invention;
[0019] Figure 4 , Figure 5 This is a schematic diagram of the material handling assembly of the present invention;
[0020] Figure 6 This is a schematic diagram of the longitudinal ejection assembly of the present invention;
[0021] Figure 7 , Figure 8 This is a schematic diagram of the feeding component structure of the present invention;
[0022] Figure 9 , Figure 10 This is a schematic diagram of the dust treatment component of the present invention;
[0023] Figure 11 This is a cross-sectional view of the connector of the present invention;
[0024] Figure 12 This is a schematic diagram of the card block structure of the present invention.
[0025] In the diagram: 1. Equipment frame assembly; 12. Upper profile frame assembly; 13. Lower welded frame assembly; 14. Platform; 15. Bottom plate; 16. Touch screen assembly; 2. Feeding assembly; 21. Material bin; 22. Partition; 23. Bin cover; 24. Bin vibrating feeder; 25. Material vibrating plate; 26. Feed detection sensor; 3. Material handling assembly; 31. Lateral conveyor assembly; 311. Feed adjusting block; 312. Feed guide rod; 313. Upper mounting plate; 314. Lower mounting plate; 315. Material pusher; 316. First guide rail connecting plate; 31 7. Bottom support shaft; 318. Guide rail unit; 319. Second guide rail connecting plate; 320. Feeding drive mechanism; 321. Ejection guide block; 322. Guide block ejection cylinder; 323. Laser height detection sensor; 324. Weight detection component; 325. Ejection fixing block; 326. Ejection guide shaft; 327. Ejection cylinder; 328. Waste material chute; 329. Stepper motor; 330. First synchronous pulley; 331. First synchronous belt; 332. Connecting pressure plate; 34. Connecting mechanism; 341. Connecting groove; 342. Connecting seat; 343. Locking block; 44. Connecting spring; 345. T-block; 346. Vertical groove; 347. Slot; 35. Longitudinal ejection assembly; 351. Ejection assembly mounting plate; 352. Stepper motor; 353. Synchronous belt assembly; 354. Ejection linear guide assembly; 355. Ejection mounting plate; 356. Ejection rod; 357. Second synchronous pulley; 358. First bearing seat; 359. Second synchronous belt; 4. Feeding assembly; 41. Longitudinal axis moving assembly; 42. Horizontal axis assembly mounting plate; 43. Horizontal axis moving assembly; 44. Longitudinal axis support slide rail; 45. First mounting plate; 46. Lifting... 47. Lowering cylinder; 48. Magazine mounting block; 49. Magazine guide post; 40. Second mounting plate; 410. Support cylinder; 411. Clamping cylinder; 412. First servo motor; 413. Lead screw; 414. Second bearing seat; 415. First linear guide rail; 431. Second servo motor; 432. Second linear guide rail; 433. Third synchronous pulley; 5. Dust handling assembly; 51. Dust collection box; 52. Dust collection drawer; 53. Filter element pressure plate; 54. Plate filter element; 55. Dust scraper; 56. Negative pressure fan; 57. Dust suction pipeline assembly; 6. Base plate. Detailed Implementation
[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0027] Please see Figures 1-7 In this embodiment of the invention, an automatic semiconductor cylindrical material loading machine includes a frame assembly 1. The frame assembly 1 is composed of an upper profile frame assembly 12, a lower welding frame assembly 13, a platform 14, a bottom plate 15, and a touch screen assembly 16. The platform 14 is installed above the lower welding frame assembly 13. The upper profile frame assembly 12 is assembled from profiles and installed above the platform 14. The bottom plate 15 is installed at the bottom of the lower welding frame assembly 13. The touch screen assembly 16 is installed at the front of the lower welding frame assembly 13. A feeding assembly 2 is installed on the rear side of the platform 14, and a material handling assembly 3 is installed at the rear of the lower welding frame assembly 13. A bottom plate 6 is provided inside the frame assembly 1, and the material handling assembly 3 is installed on the bottom plate 6. Above, a feeding assembly 4 is installed on the platform 14, and a dust treatment assembly 5 is installed below the feeding assembly 2. The feeding assembly 2 includes: a material bin 21, a partition 22, a bin cover 23, a bin vibrating feeder 24, a material vibrating plate 25, and an infeed detection sensor 26. The material bin 21 is installed above the platform 14, the bin cover 23 is installed on the upper part of the material bin 21 by a hinge, the partition 22 is installed in the middle of the material bin 21, and the bin vibrating feeder 24 is installed below the material bin 21. The bin vibrating feeder 24 can vibrate the material and drop it into the material vibrating plate 25. The material vibrating plate 25 is installed on the bottom plate 15 below the material bin 21. The material vibrating plate 25 can axially change the direction of the cylindrical material through the pipe and transport it to the discharge port of the material handling assembly 3.
[0028] In this embodiment: the feed detection sensor 26 is installed at the end of the outlet pipe to detect the product discharge. When in use, the cylindrical material is poured into the material bin 21, the partition 22 is closed and the cylindrical material is added again. After the cylindrical material below the material bin 21 has been transported by the material vibration plate 25, the partition 22 can be opened for secondary feeding. It is worth noting that the weight of the cylindrical material is 2.5kg.
[0029] Please refer to this carefully. Figure 4 and Figure 5The material handling assembly 3 includes: a transverse conveying assembly 31 and a longitudinal ejection assembly 35. The transverse conveying assembly 31 is connected to the end port of the material vibrating plate 25. The transverse conveying assembly 31 includes: an infeed adjusting block 311, an infeed guide rod 312, an upper mounting plate 313, a lower mounting plate 314, a material pusher block 315, a first guide rail connecting plate 316, a bottom support shaft 317, a guide rail unit 318, a second guide rail connecting plate 319, an infeed driving mechanism 320, an ejection guide block 321, a guide block ejection cylinder 322, a laser height detection sensor 323, a weight detection assembly 324, an ejection fixing block 325, an ejection guide shaft 326, an ejection cylinder 327, and a waste chute 328. Four infeed components are included. The guide rod 312 is inserted into the mounting groove of the feed adjustment block 311 in a tangential manner to the cylindrical material. The feed adjustment block 311 is mounted on the upper mounting plate 313 and located below the end port of the material vibrating plate 25. The top of the feed adjustment block 311 is funnel-shaped to facilitate material feeding. The guide rail unit 318 is mounted behind the lower mounting plate 314. The first guide rail connecting plate 316 is mounted on the slider of the guide rail unit 318. The material pusher 315 is mounted on the first guide rail connecting plate 316 and slides back and forth. The material pusher 315 is mounted below the feed guide rod 312. A cylindrical support plate is installed at the rear of the material pusher 315 to reduce friction when it blocks subsequent cylindrical materials during transportation. The bottom support shaft 317 is embedded in the lower layer. Mounting plate 314 is fixed by connecting pressure plate 332. Material pusher 315 drives cylindrical material falling into it to slide on bottom support shaft 317. Feeding drive mechanism 320 consists of stepper motor 329 and first synchronous pulley 330, which drives first synchronous belt 331 to move back and forth. Material pusher 315 is fixed on first synchronous belt 331 by connecting pressure plate 332 and moves back and forth. Second guide rail connecting plate 319 is installed on guide rail unit 318. Ejector guide block 321 is installed on guide rail connecting plate. Guide block ejection cylinder 322 drives ejector guide block 321 to move back and forth on guide rail unit 318. Laser height detection sensor 323 is installed at detection station of upper mounting plate 313. The weight detection component 324 is installed below the lower mounting plate 314 and located at the material detection station. The weight detection component 324 consists of a detection block, a support plate, and a detection instrument. The detection block is installed on the lower mounting plate 314, and the support plate is installed on the detection block with a slot on the support plate located on the bottom support shaft 317. The ejection fixing block 325 is installed at the ejection station on the upper mounting plate 313, and the ejection guide shaft 326 is installed on the ejection fixing block 325. Their distribution is tangential and evenly arranged with the cylindrical material. The ejection cylinder 327 is installed on the ejection fixing block 325 to clamp the ejected cylindrical material to achieve the purpose of material storage. The waste material chute 328 is installed at the bottom of the lower mounting plate 314 at the corresponding ejection station.
[0030] In this embodiment: when the columnar material falls into the feed adjustment block 311 and into the material pusher block 315, the sensor receives a signal, and the feed drive mechanism 320 drives the material to the next detection station for weight and height detection. At the same time, the rear of the material pusher block 315 blocks the free fall of subsequent materials. After the detection is completed, the material pusher block 315 drives the material to the ejection station and onto the ejection rod 356. Then the material pusher block 315 retracts to transport the next columnar material. Subsequently, the guide block ejection cylinder 322 drives the ejection guide block 321 to the ejection station to provide a guide track for the subsequent material ejection. The longitudinal ejection component 35 pushes the material into the ejection guide shaft 326. When the bottom height of the material is higher than the ejection cylinder 327, the ejection cylinder 327 holds the material for storage. When a certain quantity is reached, the longitudinal ejection component 35 pushes the entire quantity of material into the magazine of the feeding component 4.
[0031] Please refer to this carefully. Figure 6 The longitudinal ejection assembly 35 includes: an ejection assembly mounting plate 351, a stepper motor 352, a timing belt assembly 353, an ejection linear guide assembly 354, an ejection mounting plate 355, and an ejection rod 356. The ejection assembly mounting plate 351 is mounted on the base plate 6. The stepper motor 352 is mounted on one end of the ejection assembly mounting plate 351. The timing belt assembly 353 consists of a second timing pulley 357, a first bearing seat 358, and a second timing belt 359. One second timing pulley 357 is mounted on the stepper motor 352, and the other second timing pulley 357 is mounted in the adjustment groove at the other end of the ejection mounting plate 355 through the first bearing seat 358. The ejection linear guide assembly 354 is mounted on the ejection assembly mounting plate 351, and the ejection mounting plate 355 is mounted on the slider of the ejection linear guide assembly 354. The second timing belt 359 of the timing belt assembly 353 is fixedly mounted to the ejection mounting plate 355 through a connecting pressure plate 332.
[0032] In this embodiment: the ejector rod 356 is fixedly installed on the ejector mounting plate 355, and the ejector rod 356 can move up and down under the drive of the stepper motor 352 to eject the cylindrical material.
[0033] Please refer to this carefully. Figure 7 and Figure 8The feeding assembly 4 includes: a longitudinal axis moving assembly 41, a transverse axis assembly mounting plate 42, a transverse axis moving assembly 43, a longitudinal axis support slide rail 44, a first mounting plate 45, a lifting cylinder 46, a magazine mounting block 47, a magazine guide post 48, a second mounting plate 49, a support cylinder 410, and a clamping cylinder 411. The longitudinal axis moving assembly 41 is composed of a first servo motor 412, a lead screw 413, a second bearing seat 414, and a first linear guide rail 415. The longitudinal axis moving assembly 41 is mounted on the left side of the platform 14, and the longitudinal axis support slide rail 44 is located on the right side of the platform 14, with both maintaining the same top height. The transverse axis assembly... Mounting plate 42 is installed between longitudinal axis moving assembly 41 and longitudinal axis support slide rail 44; transverse axis moving assembly 43 is composed of second servo motor 431, second linear guide rail 432 and third synchronous wheel 433; second mounting plate 49 is installed on linear guide rail of transverse axis moving assembly 43; lifting cylinder 46 is installed on first mounting plate 45; magazine guide post 48 is evenly distributed on magazine mounting block 47 around its circumference and is arranged circumferentially to the diameter of cylindrical material; support cylinder 410 is installed at the lower part of magazine mounting block 47; clamping cylinder 411 is installed on magazine mounting block 47 and is located above support cylinder 410.
[0034] In this embodiment: the cylindrical material ejected by the longitudinal ejection component 35 enters the magazine guide post 48. At this time, the support cylinder 410 extends to support the cylindrical material. When the magazine assembly needs to feed material, the support cylinder 410 clamps the second cylindrical material from the bottom up. The support cylinder 410 retracts and cancels the support state. At this time, the first cylindrical material will fall. Then the support cylinder 410 extends, the clamping cylinder 411 releases the clamped cylindrical material, and the falling cylindrical material is supported by the support cylinder 410 again. This cycle can be repeated to feed cylindrical materials one by one. The magazine assembly is fixedly installed on the horizontal axis moving component 43. Driven by the horizontal axis moving component 43 and the vertical axis moving component 41, cylindrical materials can be fed at any position within the movement range on the platform 14.
[0035] Please refer to this carefully. Figure 9 and Figure 10 The dust handling assembly 5 includes: a dust collection box 51, a dust collection drawer 52, a filter element pressure plate 53, a plate filter element 54, a dust scraper 55, a negative pressure fan 56, and a dust suction pipe assembly 57. The dust collection box 51 is installed below the material handling assembly 3. The dust collection box 51 is divided into upper and lower layers. The dust collection drawer 52 is installed below the dust collection box 51. The plate filter element 54 is installed on the upper left and right sides of the dust collection box 51. The filter element pressure plate 53 seals and presses the plate filter element 54 onto the upper part of the dust collection box 51. The dust scraper 55 is installed in the middle of the plate filter element 54 and its shape matches the pleats of the plate filter element 54.
[0036] In this embodiment: repeatedly pulling the external handle of the dust scraper 55 outside the box can scrape off the dust adhering to the plate filter element 54 inside the box. The negative pressure fan 56 is located at the front of the bottom plate 15, and its exhaust port is connected to the top of the dust collection box 51. The exhaust port is exhausted through the exhaust port on the lower welded frame assembly 13. The dust suction pipe assembly 57 is connected at one end to the lower part of the dust collection box 51 and at the other end to the material vibration plate 25 assembly and the feeding position of the material handling assembly 3 to suck up the dust.
[0037] Please refer to this carefully. Figures 11-12 The ejector mounting plate 351 is mounted on the base plate 6 via a connecting mechanism 34. The connecting mechanism 34 includes a connecting groove 341, which is formed on the outer wall of the ejector mounting plate 351. A connecting seat 342 is fixedly connected to the top of the base plate 6. A locking block 343 extending out of the connecting seat 342 is slidably connected inside the connecting seat 342. A connecting spring 344 is connected between the locking block 343 and the connecting seat 342. An extension extending above the connecting seat 342 is slidably connected inside the connecting seat 342. T-shaped block 345 passes through the locking block 343. The outer wall of the locking block 343 has a vertical groove 346 that passes through the locking block 343. One end of the vertical groove 346 has a locking groove 347. The locking block 343 is C-shaped. The two ends of the locking block 343 are respectively provided with a first inclined surface and a second inclined surface. The T-shaped block 345 is located above the second inclined surface. The inner wall of the vertical groove 346 is in contact with the top outer wall of the T-shaped block 345, and the inner wall of the locking groove 347 is in contact with the bottom outer wall of the T-shaped block 345.
[0038] In this embodiment: when the ejector assembly mounting plate 351 is installed on the base plate 6, the connecting seat 342 is inserted into the connecting groove 341 until the locking block 343 passes through the connecting groove 341. The locking block 343 moves under the elastic force of the connecting spring 344 and contacts the outer wall of the ejector assembly mounting plate 351 to fix the ejector assembly mounting plate 351. At the same time, the T-shaped block 345 moves upward and engages into the locking groove 347, thereby fixing the locking block 343.
[0039] When removing the ejector assembly mounting plate 351, push the T-shaped block 345 downwards. The T-shaped block 345 moves out of the slot 347 and releases the fixation of the locking block 343. Continue pushing the T-shaped block 345 until it contacts the second inclined surface, pushing the locking block 343 into the connecting seat 342 and releasing the fixation of the ejector assembly mounting plate 351, thereby removing the ejector assembly mounting plate 351. This facilitates the quick installation and removal of the ejector assembly mounting plate 351.
[0040] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. A machine for automatic loading of semiconductor cylindrical material, comprising a device frame assembly (1), characterized in that, The equipment rack assembly (1) is composed of an upper profile rack assembly (12), a lower welded rack assembly (13), a table plate (14), a bottom plate (15), and a touch screen assembly (16). The table plate (14) is installed above the lower welded rack assembly (13), the upper profile rack assembly (12) is spliced from profiles and installed above the table plate (14), the bottom plate (15) is installed at the bottom of the lower welded rack assembly (13), and the touch screen assembly (16) is installed at the front of the lower welded rack assembly (13). A feeding assembly (2) is installed at the back of the table plate (14), a material arranging assembly (3) is installed at the back of the lower welded rack assembly (13), a bottom plate (6) is arranged inside the equipment rack assembly (1), the material arranging assembly (3) is installed on the bottom plate (6), a feeding assembly (4) is installed on the table plate (14), and a dust treatment assembly (5) is installed below the feeding assembly (2). The feeding assembly (2) comprises a material bin (21), a partition plate (22), a bin cover (23), a bin vibrating feeder (24), a material vibrating disc (25), and an inlet detecting sensor (26). The material bin (21) is installed above the table plate (14), the bin cover (23) is hingedly installed on the upper part of the material bin (21), the partition plate (22) is installed in the middle part of the material bin (21), and the bin vibrating feeder (24) is installed below the material bin (21). The bin vibrating feeder (24) can make the material vibrate and fall into the material vibrating disc (25), and the material vibrating disc (25) is installed on the bottom plate (15) below the material bin (21). The material vibrating disc (25) can change the direction of the cylindrical material and axially convey the material to the inlet of the material arranging assembly (3) through a pipeline. The material sorting assembly (3) comprises a transverse conveying assembly (31) and a longitudinal ejection assembly (35), the transverse conveying assembly (31) is connected to the end nozzle of the material vibrating disc (25), the transverse conveying assembly (31) comprises a material inlet adjusting block (311), a material inlet guide rod (312), an upper mounting plate (313), a lower mounting plate (314), a material pushing block (315), a first guide rail connecting plate (316), a bottom supporting shaft (317), a guide rail unit (318), a second guide rail connecting plate (319), a material inlet driving mechanism (320), an ejection guide block (321), a guide block pushing cylinder (322), a laser height detection sensor (323), a weight detection assembly (324), an ejection fixing block (325), an ejection guide shaft (326), an ejection cylinder (327) and a waste slide (328), four material inlet guide rods (312) are inserted into the installation groove of the material inlet adjusting block (311) in the form of tangency of cylindrical materials, the material inlet adjusting block (311) is mounted on the upper mounting plate (313) and located below the end nozzle of the material vibrating disc (25), the top of the material inlet adjusting block (311) is in the form of a horn to facilitate material inlet; the guide rail unit (318) is installed at the back of the lower mounting plate (314), the first guide rail connecting plate (316) is installed on the sliding block one of the guide rail unit (318), the material pushing block (315) is installed on the first guide rail connecting plate (316) and slides forward and backward, the material pushing block (315) is installed below the material inlet guide rod (312), a cylindrical supporting plate is installed at the rear of the material pushing block (315) to ensure that the friction is reduced when blocking the subsequent cylindrical materials during carrying; the bottom supporting shaft (317) is embedded in the lower mounting plate (314) and fixed by a connecting pressing plate (332), the material pushing block (315) drives the cylindrical materials falling thereinto to slide on the bottom supporting shaft (317); the material inlet driving mechanism (320) is composed of a stepping motor (329) and a first synchronous wheel (330), which drives the first synchronous belt (331) to move forward and backward, the material pushing block (315) is fixed on the first synchronous belt (331) by the connecting pressing plate (332) and moves forward and backward, the second guide rail connecting plate (319) is installed on the guide rail unit (318), the ejection guide block (321) is installed on the guide rail connecting plate, the guide block pushing cylinder (322) drives the ejection guide block (321) to move back and forth on the guide rail unit (318), and the laser height detection sensor (323) is installed at the detection station of the upper mounting plate (313).The weight detection assembly (324) is installed below the lower mounting plate (314) and located on the material detection station, the weight detection assembly (324) is composed of a detection block, a support plate and a detection instrument, the detection block is installed on the lower mounting plate (314), the support plate is installed on the detection block and a notch is formed in the support plate and located on the bottom supporting shaft (317), the ejection fixed block (325) is installed at the ejection station on the upper mounting plate (313), the ejection guide shaft (326) is installed on the ejection fixed block (325), and the distribution is uniformly arranged tangentially to the cylindrical material; the ejection cylinder (327) is installed on the ejection fixed block (325) to clamp the ejected cylindrical material to achieve the purpose of storage, and the waste slide (328) is installed at the corresponding ejection station on the bottom of the lower mounting plate (314).
2. The automatic semiconductor cylinder material loading machine according to claim 1, wherein The longitudinal ejection assembly (35) contains: ejection assembly mounting plate (351), stepper motor (352), synchronous belt assembly (353), ejection linear guide assembly (354), ejection mounting plate (355) and ejection rod (356), the ejection assembly mounting plate (351) is installed on the bottom plate (6), the stepper motor (352) is installed on one end of the ejection assembly mounting plate (351), the synchronous belt assembly (353) is composed of second synchronous wheel (357), first bearing seat (358), second synchronous belt (359), one second synchronous wheel (357) is installed on the stepper motor (352), another second synchronous wheel (357) is installed in the adjusting groove of the other end of the ejection mounting plate (355) through the first bearing seat (358), the ejection linear guide assembly (354) is installed on the ejection assembly mounting plate (351), the ejection mounting plate (355) is installed on the slider of the ejection linear guide assembly (354), the second synchronous belt (359) of the synchronous belt assembly (353) is fixedly installed with the ejection mounting plate (355) through the connecting pressing plate (332).
3. The automatic semiconductor cylinder material loading machine according to claim 2, wherein The feeding assembly (4) comprises: longitudinal axis moving assembly (41), horizontal axis assembly mounting plate (42), horizontal axis moving assembly (43), longitudinal axis support slide rail (44), first mounting plate (45), lifting cylinder (46), clip mounting block (47), clip guide column (48), second mounting plate (49), support cylinder (410) and clamping cylinder (411), the longitudinal axis moving assembly (41) is composed of first servo motor (412), lead screw (413), second bearing seat (414) and first linear guide rail (415), the longitudinal axis moving assembly (41) is installed on the left side of the table plate (14), the longitudinal axis support slide rail (44) is located on the right side of the table plate (14), both keep the top height consistent, the horizontal axis assembly mounting plate (42) is installed between the longitudinal axis moving assembly (41) and the longitudinal axis support slide rail (44); the horizontal axis moving assembly (43) is composed of second servo motor (431), second linear guide rail (432) and third synchronous wheel (433), the second mounting plate (49) is installed on the linear guide rail of the horizontal axis moving assembly (43), the lifting cylinder (46) is installed on the first mounting plate (45), the clip guide columns (48) are evenly distributed on the clip mounting block (47), which is arranged outside the cylindrical material diameter, the support cylinder (410) is installed on the lower part of the clip mounting block (47), the clamping cylinder (411) is installed on the clip mounting block (47) and located above the support cylinder (410).
4. The automatic semiconductor cylinder material loading machine according to claim 3, wherein The dust processing assembly (5) comprises a dust collecting box (51), a dust collecting drawer (52), a filter core pressing plate (53), a plate filter core (54), a dust scraping plate (55), a negative pressure fan (56) and a dust suction pipeline assembly (57); the dust collecting box (51) is installed below the material processing assembly (3), the dust collecting box (51) is divided into two layers, the dust collecting drawer (52) is installed below the dust collecting box (51), the plate filter core (54) is installed on the left and right sides above the dust collecting box (51), the filter core pressing plate (53) seals and covers the plate filter core (54) on the upper part of the dust collecting box (51), and the dust scraping plate (55) is installed in the middle of the plate filter core (54) and matches the folds of the plate filter core (54).
5. The automatic semiconductor cylinder material loading machine according to claim 4, wherein The ejecting assembly mounting plate (351) is installed on the bottom plate (6) through a connecting mechanism (34), the connecting mechanism (34) comprises a connecting groove (341), the connecting groove (341) is arranged on the outer wall of the ejecting assembly mounting plate (351), the top end of the bottom plate (6) is fixedly connected with a connecting seat (342), the connecting seat (342) is slidably connected with a clamping block (343) extending out of the connecting seat (342), the clamping block (343) and the connecting seat (342) are connected with a connecting spring (344), the connecting seat (342) is slidably connected with a T-shaped block (345) extending above the connecting seat (342), the T-shaped block (345) penetrates through the clamping block (343), the outer wall of the clamping block (343) is provided with a vertical groove (346) penetrating through the clamping block (343), and one end of the vertical groove (346) is provided with a clamping groove (347).
6. The automatic semiconductor cylinder material loading machine according to claim 5, wherein The clamping block (343) is in a C-shaped structure, the two ends of the clamping block (343) are respectively provided with a first inclined surface and a second inclined surface, and the T-shaped block (345) is located above the second inclined surface.
7. The automatic semiconductor cylinder material loading machine according to claim 5, wherein The inner wall of the vertical groove (346) is attached to the top outer wall of the T-shaped block (345), and the inner wall of the clamping groove (347) is attached to the bottom outer wall of the T-shaped block (345).
Citation Information
Patent Citations
Feeding cake mechanism in semiconductor packaging equipment
CN213678664U