A power assembly

Abstract

The application discloses a power assembly, which comprises: a plurality of switching devices, which are divided into DC side switching devices and AC side switching devices according to the connection relationship with the DC side and the AC side of the power assembly; and a radiator, which is provided with a liquid inlet, a liquid outlet and a radiating flow channel; each DC side switching device is fixedly installed at the upper side position of the radiator, and each AC side switching device is fixedly installed at the lower side position of the radiator; the radiating flow channel comprises an upper flow channel and a lower flow channel; the upper flow channel is arranged at the upper side position of the radiator to correspond to the position of the DC side switching device, and the lower flow channel is arranged at the lower side position of the radiator to correspond to the position of the AC side switching device; the end of the upper flow channel is communicated with the start of the lower flow channel, the start of the upper flow channel is communicated with the liquid inlet, and the end of the lower flow channel is communicated with the liquid outlet. The power assembly can improve the balance of the radiating efficiency of the radiator on each switching device and reduce the influence on the current sharing performance of the switching device during operation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of converter, in particular to a power assembly. BACKGROUND

[0002] The converter is widely used in the fields of power system, rail transit, military industry, petroleum machinery, new energy vehicle, wind power generation, solar photovoltaic, etc. The converter is connected between the battery system and the power grid, and is used for realizing bidirectional conversion of electric energy, controlling the charging and discharging process of the storage battery, converting AC and DC, and directly supplying power to AC load in the case of no power grid. At the same time, the NPC (Neutral Point Clamp) or ANPC (Active Neutral Point Clamp) three-level topology can use low blocking voltage IGBT devices to increase the DC bus voltage, thereby improving the AC output voltage and expanding the system power level, so it is widely used in the converter.

[0003] Conventionally, the converter mainly includes a power assembly, which is used for realizing bidirectional conversion of DC and AC. The power assembly in the converter generally includes a DC module and a power module. The DC module mainly includes a DC capacitor bank and a capacitor busbar, and the power module mainly includes a power tube group and a heat sink. The power tube group is installed on the heat sink, and then connected with the DC busbar through an input bus. Specifically, referring to Figure 9 , which shows a circuit diagram of a three-level topology structure used by the power assembly. For the power assembly using the three-level topology structure, in a complete three-level topology structure, three IGBT modules are generally included as switching devices. Corresponding to Figure 9 , the switch 1 and the switch 2 are DC side switching devices, the switch 3 and the switch 4 are DC side switching devices, and the switch 5 and the switch 6 are AC side switching devices. The first end of the switch 1 is connected to the positive plate of the capacitor busbar, the first end of the switch 2 is connected to the neutral plate of the capacitor busbar, and the second ends of the switch 1 and the switch 2 are connected and then connected to the first end of the switch 5. The first end of the switch 3 is connected to the negative plate of the capacitor busbar, the first end of the switch 4 is connected to the neutral plate of the capacitor busbar, and the second ends of the switch 3 and the switch 4 are connected and then connected to the first end of the switch 6. The second ends of the switch 5 and the switch 6 are connected to the output bus. In this kind of circuit topology structure, the heat loss of the DC side switching device is higher than that of the AC side switching device.

[0004] In the design, the IGBT module is fixedly installed on the surface of the heat sink, and the heat sink can adopt an air-cooled heat sink or a liquid-cooled heat sink. In order to improve the heat dissipation efficiency, the liquid-cooled heat sink is generally adopted at present. In the liquid-cooled heat sink, a parallel flow channel design is generally adopted, that is, the cooling liquid enters the inside of the heat sink from one main flow channel, and is then divided into a plurality of parallel sub-flow channels, and finally is collected through another main flow channel and then flows out from the outlet. Due to the poor uniformity, when the heat loss of each IGBT is different, the heat dissipation efficiency of the IGBTs at the front end and the rear end of the flow channel is inconsistent, and then the operating temperature difference of each IGBT is too large, which affects the current sharing performance of the power module in use. SUMMARY

[0005] The purpose of the present application is to overcome the above-mentioned defects or problems existing in the background art, and to provide a power assembly which can improve the uniformity of the heat dissipation efficiency of the heat sink for each switching device and reduce the influence on the current sharing performance of the switching device in operation.

[0006] In order to achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] Technical solution one: a power assembly, comprising: a plurality of switching devices, which are divided into direct current side switching devices and alternating current side switching devices according to the connection relationship with the direct current side and the alternating current side of the power assembly; and a heat sink provided with a liquid inlet, a liquid outlet and a heat dissipation flow channel; each of the direct current side switching devices is fixedly installed at the upper side position of the heat sink, and each of the alternating current side switching devices is fixedly installed at the lower side position of the heat sink; the heat dissipation flow channel comprises an upper flow channel and a lower flow channel, the upper flow channel is arranged at the upper side position of the heat sink to correspond to the position of the direct current side switching device, and the lower flow channel is arranged at the lower side position of the heat sink to correspond to the position of the alternating current side switching device; the end of the upper flow channel is in communication with the beginning of the lower flow channel, the beginning of the upper flow channel is in communication with the liquid inlet, and the end of the lower flow channel is in communication with the liquid outlet.

[0008] Technical solution two based on technical solution one: in the switching devices, each of the direct current side switching devices is arranged in parallel along the left-right direction, and each of the alternating current side switching devices is arranged in parallel along the left-right direction; the upper flow channel extends along the left-right direction from the beginning to the end, and the lower flow channel extends along the left-right direction from the beginning to the end; the liquid inlet and the liquid outlet are located at the left end or the right end of the heat sink.

[0009] Technical solution three based on technical solution two: the upper flow channel comprises a plurality of upper sub-flow channels, each of which extends along the left-right direction and is arranged along the up-down direction, and the start end and the end end of each upper sub-flow channel jointly form the start end and the end end of the upper flow channel; the lower flow channel comprises a plurality of lower sub-flow channels, each of which extends along the left-right direction and is arranged along the up-down direction, and the start end and the end end of each lower sub-flow channel jointly form the start end and the end end of the lower flow channel.

[0010] Technical solution four based on technical solution three: the flow area of each upper sub-flow channel is the same, the flow area of each lower sub-flow channel is the same, and the flow area of the upper sub-flow channel is smaller than the flow area of the lower sub-flow channel.

[0011] Technical solution five based on technical solution four: the heat sink is provided with an inlet channel, a liquid passing channel and an outlet channel; the inlet channel is located between the start end of the upper flow channel and the liquid inlet, and is located at the end of the left-right direction of the heat sink, and simultaneously communicates with the start end of each upper sub-flow channel; the liquid passing channel is located between the end end of the upper flow channel and the start end of the lower flow channel, and is located at the end of the left-right direction of the heat sink, simultaneously communicates with the start end of each upper sub-flow channel, and simultaneously communicates with the end end of each lower sub-flow channel; the outlet channel is located between the end end of the lower flow channel and the liquid outlet, and is located at the end of the left-right direction of the heat sink, and simultaneously communicates with the end end of each lower sub-flow channel.

[0012] Technical solution six based on any one of technical solutions one to five: the heat sink has two mounting surfaces perpendicular to the front-rear direction and facing away from each other; among the switching devices, the direct current side switching devices are divided into two parts and are fixedly installed on the two mounting surfaces of the heat sink, and the alternating current side switching devices are fixedly installed on one of the mounting surfaces of the heat sink.

[0013] Technical solution seven based on any one of technical solutions one to five: the heat sink has two mounting surfaces perpendicular to the front-rear direction and facing away from each other; among the switching devices, the direct current side switching devices are divided into two parts and are fixedly installed on the two mounting surfaces of the heat sink, and the alternating current side switching devices are divided into two parts and are fixedly installed on the two mounting surfaces of the heat sink, and the positions of the alternating current side switching devices on the two mounting surfaces are staggered.

[0014] Technical solution eight based on technical solution six: the upper flow channel is provided with two groups, which are close to the two mounting surfaces of the heat sink, and the inlet channel and the liquid passing channel simultaneously communicate with the two groups of upper flow channels; the lower flow channel is provided with one group, which is close to the mounting surface of the heat sink on which the alternating current side switching devices are fixedly installed.

[0015] Based on the eighth aspect, the ninth aspect is that the upper flow channels are arranged in two groups, and are close to the two mounting surfaces of the heat sink; the inlet channel and the through channel are in communication with the two groups of upper flow channels; the lower flow channels are arranged in two groups, and are close to the two mounting surfaces of the heat sink; and the through channel and the outlet channel are in communication with the two groups of lower flow channels.

[0016] Based on the eighth or ninth aspect, the tenth aspect further comprises a capacitor module and a wiring component; the capacitor module comprises a direct-current capacitor bank formed by a plurality of capacitors and a capacitor bus connected with the direct-current capacitor bank, and the capacitor bus is connected with the direct-current side of the power assembly; the wiring component comprises a direct-current wiring row, a connecting row and an alternating-current wiring row; the direct-current wiring row is connected with the capacitor bus and a direct-current side switching device; the connecting row is connected with the direct-current side switching device and an alternating-current side switching device; and the alternating-current wiring row is connected with the alternating-current side switching device and the alternating-current side of the power assembly.

[0017] From the above description of the present application, the present application has the following beneficial effects compared with the prior art:

[0018] 1. In the power assembly, the switching devices are divided into direct-current side switching devices and alternating-current side switching devices, and in the operation process, the direct-current side switching devices have a higher heat generation, and the alternating-current side switching devices have a lower heat generation. Therefore, the direct-current side switching devices and the alternating-current side switching devices are separated, and the same type of switching devices are arranged in a centralized manner. In this layout, the heat dissipation flow channel is designed to comprise an upper flow channel and a lower flow channel, the upper flow channel corresponds to the arrangement of the direct-current side switching devices, and the lower flow channel corresponds to the arrangement of the alternating-current side switching devices. When the cooling liquid enters the heat sink from the inlet, the cooling liquid with a lower temperature can first enter the upper flow channel, and absorb the heat of the direct-current side switching devices with a higher heat generation. Then, the cooling liquid with a higher temperature reaches the lower flow channel, and the alternating-current side switching devices corresponding to the lower flow channel have a lower heat generation. Therefore, the cooling liquid with a higher temperature can still play a good role in absorbing the heat of the alternating-current side switching devices. Through the improvement of the layout of the switching devices and the cooperation between the heat dissipation flow channels, the balance of the heat dissipation efficiency of the heat sink for the switching devices can be effectively improved, and the influence on the current sharing performance of the switching devices can be reduced.

[0019] In addition, the switching devices are separated and arranged in a centralized manner according to the type, which can facilitate the wiring of the switching devices. The wiring component connected with the switching devices can be located at the upper and lower positions of the heat sink, and the wiring of alternating current and direct current does not interfere with each other. The overall wiring is simple, and the influence of the heat generation of the wiring component on the switching devices can be reduced. Meanwhile, the heat dissipation flow channel is divided into two centralized regions of the upper flow channel and the lower flow channel, and the flow channel connection relationship between the upstream flow channel and the downstream flow channel can be easily formed. The heat dissipation flow channel does not need to be bent too much, and the processing difficulty is low and the cost is low.

[0020] 2. Both DC-side and AC-side switching devices are arranged side-by-side on the radiator in a left-right direction. Correspondingly, the upper and lower flow channels also extend in a left-right direction. In this way, the coolant flow direction is also in a left-right direction, which can completely cover all the switching devices. At the same time, the inlet and outlet are located at the ends of the radiator in the left and right directions, making the coolant input and output smoother and eliminating the need for bends, thus not affecting the smooth flow of coolant. Furthermore, this flow channel arrangement can avoid interference between the coolant delivery pipes connected to the inlet and outlet and the wiring components of the power components. The wiring components can be located at the top and bottom of the radiator, while the coolant delivery pipes can be located on the left or right side of the radiator, which can reduce installation difficulty and reduce safety hazards.

[0021] 3. The upper flow channel is divided into multiple upper sub-flow channels, and the lower flow channel is divided into multiple lower sub-flow channels. Each sub-flow channel can accommodate coolant flow. This design can reduce the impact of turbulence generated by the coolant flow on the cooling effect when a large area needs to be cooled by dividing the area to be cooled into multiple smaller areas. This improves the uniformity of heat dissipation in the area corresponding to each sub-flow channel in the vertical direction. If only one large flow channel is set, when a large flow of coolant is flowing, more obvious laminar flow will occur near the channel wall, which will affect the smooth flow of coolant, reduce heat dissipation efficiency, and affect the uniformity of heat dissipation.

[0022] 4. The same flow area in the sub-channels of the same region can ensure that the cooling effect in the same region is roughly the same. The flow area of ​​the upper sub-channel is smaller than that of the lower sub-channel. Under the condition of the same flow rate, the flow speed of the coolant in the lower sub-channel can be slowed down, thereby increasing the contact time between the coolant and the AC side switching devices, thus improving the heat dissipation efficiency of the coolant. With this setting, even if the temperature of the coolant entering the lower channel is high, it can still play a good heat dissipation role.

[0023] 5. The radiator is equipped with an inlet channel, a flow channel, and an outlet channel, which can simultaneously distribute the coolant from the inlet to multiple upper sub-channels, transport the coolant flowing from the upper sub-channels to the lower sub-channels, and collect the coolant flowing from the lower sub-channels and send it out through the outlet, making the flow of coolant in the heat dissipation channels smoother.

[0024] 6. The heat sink has two opposing mounting surfaces, and the DC-side switching devices are divided into two parts and fixed on the two mounting surfaces. This improved layout of the switching devices allows for the installation of more switching devices on a heat sink of the same volume, increasing the surface utilization of the heat sink. At the same time, this layout reduces the number of DC-side switching devices in the left-right direction, thereby shortening the length of the heat dissipation channel in the left-right direction. Since the heat dissipation channel extends in the left-right direction, the shortening of the length in the left-right direction can reduce the temperature difference between the beginning and end of the upper channel of the coolant, improving the temperature uniformity of the coolant in the upper channel. Furthermore, compared to the scheme of fixing the DC-side switching devices on the same mounting surface, the above layout makes it easier to set up an upper channel that dissipates heat from both parts of the DC-side switching devices simultaneously and has the same heat dissipation capacity.

[0025] 7. Both the DC-side and AC-side switching devices are fixed in two parts on two mounting surfaces. In addition to the effects mentioned above, setting the AC-side switching devices in two parts can offset the decrease in heat dissipation efficiency of the coolant in the lower flow channel due to the increase in temperature. At the same time, the positions of the AC-side switching devices on the two mounting surfaces are staggered, which can avoid the coolant in the same position needing to dissipate heat from both AC-side switching devices at the same time, further improving the heat dissipation efficiency.

[0026] 8. When the DC-side switching devices are distributed on two mounting surfaces and the AC-side switching devices are distributed on one mounting surface, the upper flow channel can be set into two groups, one close to the two mounting surfaces respectively. This allows the coolant to flow closer to the two mounting surfaces, improving cooling efficiency. Similarly, setting the lower flow channel close to the mounting surface where the AC-side switching devices are mounted can also improve heat dissipation efficiency.

[0027] 9. When both the DC-side and AC-side switching devices are distributed on two mounting surfaces, dividing the upper and lower flow channels into two groups allows the coolant to flow closer to the two mounting surfaces, thus improving cooling efficiency.

[0028] 10. The power assembly includes a capacitor module and wiring components. The capacitor busbar in the capacitor module is connected to the AC side of the power assembly. The wiring components connect the switching devices and the capacitor busbar, and are also connected to the AC side of the power assembly. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments are briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1Structure diagram of power assembly provided for embodiment 1 of the present application Figure 1 ;

[0031] Figure 2 Structure diagram of power assembly provided for embodiment 1 of the present application Figure 2 ;

[0032] Figure 3 Structure diagram of power assembly provided for embodiment 1 of the present application Figure 3 ;

[0033] Figure 4 Structure diagram of radiator in embodiment 1 of the present application

[0034] Figure 5 Exploded view of radiator in embodiment 1 of the present application

[0035] Figure 6 Structure diagram of radiator body in embodiment 1 of the present application Figure 1 ;

[0036] Figure 7 Structure diagram of radiator body in embodiment 1 of the present application Figure 2 ;

[0037] Figure 8 Structure diagram of power assembly provided for embodiment 2 of the present application

[0038] Figure 9 Circuit diagram of three-level topology structure in the background art of the present application

[0039] Explanation of main reference signs:

[0040] DC side switching device 11; AC side switching device 12; radiator 20; radiator body 201; front cover plate 202; rear cover plate 203; liquid inlet 21; liquid outlet 22; radiating flow channel 23; upper flow channel 24; upper sub-flow channel 241; lower flow channel 25; lower sub-flow channel 251; mounting surface 26; liquid inlet passage 271; liquid passage 272; liquid outlet passage 273; through hole 28; DC capacitor cell 311; capacitor female bus 312; DC wiring bus 321; connecting bus 322; AC wiring bus 323. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are preferred embodiments of the present application, and should not be seen as excluding other embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0042] In the claims, the specification, and the drawings of the present application, terms such as "first", "second", and "third" are used merely to distinguish one element from another, and do not imply a particular order or sequence.

[0043] In the claims, the specification, and the drawings of the present application, terms such as "central", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise", and the like merely indicate or describe the orientation or position of the device or element as shown in the drawings, and are used only to facilitate the description of the application and the understanding of the drawings, and do not indicate or imply that the device or element must have a particular orientation or be constructed and operated in a particular orientation, so it cannot be understood as limiting the specific protection scope of the present application.

[0044] In the claims, the specification, and the drawings of the present application, unless otherwise expressly defined, the term "fixedly connected" or "fixedly connected" should be understood broadly, that is, any connection mode between the two without displacement relationship and relative rotation relationship, that is, it includes non-detachable fixed connection, detachable fixed connection, integration and fixed connection through other devices or elements.

[0045] In the claims, the specification, and the drawings of the present application, the terms "include", "have" and their variants are intended to mean "include but not limited to".

[0046] Example 1

[0047] The power assembly provided by the embodiment 1 of the present application includes a capacitor module and a power module, the capacitor module includes a direct current capacitor bank 311 and a capacitor busbar 312, and the power module includes a heat sink 20, a plurality of switching devices and a wiring component.

[0048] Referring to Figure 1The direct current capacitor cell 311 is formed by a plurality of capacitors, and the terminals of the capacitors are connected to the capacitor busbar 312 and fixed to the rear surface of the capacitor busbar 312. The capacitor busbar 312 includes three stacked polar plates, i.e., a positive polar plate, a neutral polar plate and a negative polar plate. The upper end of the capacitor busbar 312 is provided with terminals corresponding to the three polar plates, which can be connected to the direct current side of the power assembly. The power module is located at the front side of the capacitor busbar 312, and the switching devices are fixed to the heat sink 20 and connected to the capacitor busbar 312 through the wiring components. Among them, the switching devices are divided into direct current side switching devices 11 and alternating current side switching devices 12 according to the connection relationship with the direct current side and the alternating current side of the power assembly. The wiring components include a direct current wiring bar 321, a connecting bar 322 and an alternating current wiring bar 323. The direct current wiring bar 321 connects the direct current side switching devices 11 and the capacitor busbar 312. The connecting bar 322 connects the direct current side switching devices 11 and the alternating current side switching devices 12. The alternating current wiring bar 323 connects the alternating current side switching devices 12 and the alternating current side of the power assembly.

[0049] With reference to Figure 2 and Figure 3 The heat sink 20 is provided with a liquid inlet 21, a liquid outlet 22 and a heat dissipation flow channel 23.

[0050] Among them, each direct current side switching device 11 is fixedly installed at the upper side of the heat sink 20, and each alternating current side switching device 12 is fixedly installed at the lower side of the heat sink 20. The heat dissipation flow channel 23 includes an upper flow channel 24 and a lower flow channel 25. The upper flow channel 24 is arranged at the upper side of the heat sink 20 to correspond to the position of the direct current side switching device 11. The lower flow channel 25 is arranged at the lower side of the heat sink 20 to correspond to the position of the alternating current side switching device 12. The end of the upper flow channel 24 communicates with the start of the lower flow channel 25. The start of the upper flow channel 24 communicates with the liquid inlet 21, and the end of the lower flow channel 25 communicates with the liquid outlet 22.

[0051] In addition, among the switching devices, each direct current side switching device 11 is arranged in parallel along the left-right direction, and each alternating current side switching device 12 is arranged in parallel along the left-right direction. The upper flow channel 24 extends along the left-right direction from the start to the end, and the lower flow channel 25 extends along the left-right direction from the start to the end. The liquid inlet 21 and the liquid outlet 22 are located at the left end or the right end of the heat sink 20.

[0052] The heat sink 20 has two mounting surfaces 26 which are perpendicular to the front-rear direction and mutually opposite. Among the switching devices, the direct current side switching devices 11 are divided into two parts and fixed to the two mounting surfaces 26 of the heat sink 20 respectively, and the alternating current side switching devices 12 are divided into two parts and fixed to the two mounting surfaces 26 of the heat sink 20 respectively, and the positions of the alternating current side switching devices 12 on the two mounting surfaces 26 are staggered.

[0053] With reference to Figure 2 andFigure 3 The heat sink 20 is a plate-shaped liquid-cooled heat sink 20, which has a length greater than a height in the left-right direction and a certain thickness in the up-down direction, as shown in the direction indicated by the arrow in Figure 1 The front and rear surfaces of the heat sink 20 are formed as mounting surfaces 26, and the switching devices can be mounted on the two mounting surfaces 26.

[0054] In the present embodiment, two DC-side switching devices 11 and one AC-side switching device 12 cooperate to form a switching module. In the power module, there are nine switching modules, three of which correspond to one phase of the three-phase AC power, so the AC-side switching devices 12 in the three switching modules are connected to the same AC bus bar 323, and eighteen DC-side switching devices 11 in the nine switching modules are connected to the same DC bus bar 321, and the bus bar 322 is connected to six DC-side switching devices 11 and the AC-side switching device 12 in the same phase. Specifically, referring to Figure 2 and Figure 3 The eighteen DC-side switching devices 11 are evenly divided into two parts and are respectively mounted and fixed to the upper side of the front and rear mounting surfaces 26 of the heat sink 20, and the DC-side switching devices 11 are arranged side by side in the left-right direction on the respective heat dissipation surfaces. It should be noted that the switching device is an IGBT module, which is generally cuboid, so when arranged side by side on the heat sink 20, the length direction of the IGBT module is taken as the arrangement reference, and the length direction of the IGBT module is arranged parallel to the vertical direction. This arrangement can effectively improve the surface utilization rate of the heat sink 20. Moreover, the two DC-side switching devices 11 in the same switching module are respectively arranged on the two mounting surfaces 26, and when connected to the capacitor bus bar 312 through the DC bus bar 321, the front DC-side switching device 11 can be connected to two pole plates in the DC bus bar 321, and the rear DC-side switching device 11 can be connected to another two pole plates in the DC bus bar 321, or directly connected to the capacitor bus bar 312 using a terminal post. That is, this layout can effectively improve the efficiency of the connection of the wiring components to the DC-side switching devices 11 and the capacitor bus bar 312, and can shorten the current commutation length of the entire power module and reduce the generation of stray inductance.

[0055] Referring to Figure 2 and Figure 3The AC side switching devices 12 are also arranged in a side-by-side manner in the left-right direction on the lower side of the two mounting surfaces 26 of the heat sink 20, and in particular, the positions of the AC side switching devices 12 on the two mounting surfaces 26 are staggered, that is, the AC side switching device 12 on the front side is not fixedly arranged with another AC side switching device 12 on the corresponding position of the rear mounting surface 26, thereby forming a staggered arrangement structure. In this way, the heat dissipation efficiency of the heat sink 20 on the AC side switching devices 12 can be improved.

[0056] With reference to Figure 4 A through hole 28 extending in the left-right direction is arranged in the middle of the heat sink 20, which can be used for the connection of the connection row 322 to pass through to connect the DC side switching devices 11 and the AC side switching devices 12 on different mounting surfaces 26.

[0057] With reference to Figure 5 The heat sink 20 includes a heat dissipation main body 201, a front cover plate 202 and a rear cover plate 203, and the split design can facilitate the manufacturing of the heat sink 20. The heat sink 20 is internally provided with a heat dissipation flow channel 23, which includes an upper flow channel 24 and a lower flow channel 25. The upper flow channel 24 is located on the upper side of the heat sink 20 and corresponds to the position of the DC side switching device 11, and the lower flow channel 25 is located on the lower side of the heat sink 20 and corresponds to the position of the DC side switching device 11. The liquid inlet 21 and the liquid outlet 22 are arranged on the heat dissipation main body 201 and located at the right end of the heat dissipation main body 201, and the liquid inlet 21 is located on the upper side and the liquid outlet 22 is located on the lower side, so as to correspond to the positions of the upper flow channel 24 and the lower flow channel 25, respectively. In this embodiment, the right end of the upper flow channel 24, that is, the end close to the liquid inlet 21, is the start end of the upper flow channel 24, and the left end of the upper flow channel 24 is the end end of the upper flow channel 24. Correspondingly, the right end of the lower flow channel 25, that is, the end close to the liquid outlet 22, is the end end of the lower flow channel 25, and the left end of the lower flow channel 25 is the start end of the lower flow channel 25. The start end of the upper flow channel 24 is in communication with the liquid inlet 21, the end end of the upper flow channel 24 is in communication with the start end of the lower flow channel 25, and the end end of the lower flow channel 25 is in communication with the liquid outlet 22, thereby forming a complete and smooth cooling liquid flow channel.

[0058] Since the DC side switching device 11 and the AC side switching device 12 are arranged side by side in the left-right direction on the heat sink 20, the corresponding upper flow channel 24 and the lower flow channel 25 also extend in the left-right direction, so that the flow direction of the cooling liquid is also in the left-right direction, which can completely cover all the switching devices; at the same time, the liquid inlet 21 and the liquid outlet 22 are arranged at the end positions of the heat sink 20 in the left-right direction, so that the input and output of the cooling liquid is more smooth, and does not need to be turned again, which will not affect the smooth flow of the cooling liquid; and this kind of flow channel arrangement can avoid the interference between the cooling liquid conveying pipeline connected with the liquid inlet 21 and the liquid outlet 22 and the wiring components of the power assembly, the wiring components can be arranged at the upper and lower positions of the heat sink 20, and the cooling liquid conveying pipeline can be arranged at the left side or the right side of the heat sink 20, which can reduce the installation difficulty and also reduce the safety hidden danger.

[0059] With reference to Figure 6 The upper flow channel 24 includes a plurality of upper sub-flow channels 241, each of which extends in the left-right direction and is arranged in the up-down direction, and the initial end and the terminal end of each upper sub-flow channel 241 jointly form the initial end and the terminal end of the upper flow channel 24; the lower flow channel 25 includes a plurality of lower sub-flow channels 251, each of which extends in the left-right direction and is arranged in the up-down direction, and the initial end and the terminal end of each lower sub-flow channel 251 jointly form the initial end and the terminal end of the lower flow channel 25. The upper flow channel 24 is divided into a plurality of upper sub-flow channels 241, and the lower flow channel 25 is divided into a plurality of lower sub-flow channels 251, and each sub-flow channel can flow cooling liquid. This design can reduce the influence of the turbulence generated by the cooling liquid itself when flowing on the cooling effect of the cooling liquid when a larger area needs to be cooled by dividing the cooling area into a plurality of smaller areas, thereby improving the uniformity of the heat dissipation effect of each sub-flow channel in the up-down direction. If only one large flow channel is provided, when a large flow of cooling liquid flows, a more obvious laminar flow will occur near the wall of the flow channel, thereby affecting the smooth flow of the cooling liquid, reducing the heat dissipation efficiency, and affecting the heat dissipation uniformity.

[0060] In addition, the heat sink 20 is provided with a liquid inlet passage 271, a liquid passage 272 and a liquid outlet passage 273; the liquid inlet passage 271 is located between the initial end of the upper flow channel 24 and the liquid inlet 21 and at the end of the heat sink 20 in the left-right direction, and simultaneously communicates with the initial ends of each upper sub-flow channel 241; the liquid passage 272 is located between the terminal end of the upper flow channel 24 and the initial end of the lower flow channel 25 and at the end of the heat sink 20 in the left-right direction, and simultaneously communicates with the initial ends of each upper sub-flow channel 241 and the terminal ends of each lower sub-flow channel 251; the liquid outlet passage 273 is located between the terminal end of the lower flow channel 25 and the liquid outlet 22 and at the end of the heat sink 20 in the left-right direction, and simultaneously communicates with the terminal ends of each lower sub-flow channel 251.

[0061] Specifically, the upper flow channel 24 is taken as an example, which includes a plurality of upper sub-flow channels 241. In fact, the upper flow channel 24 is formed by a plurality of groove-like structures arranged on the heat dissipation main body 201 and cooperated with the front cover plate 202 or the rear cover plate 203. The front cover plate 202 or the rear cover plate 203 covers the openings of the groove-like structures on the heat dissipation main body 201, thereby forming the upper sub-flow channels 241 for the cooling liquid to flow through. Each of the upper sub-flow channels 241 extends along the left-right direction and is arranged along the up-down direction. Thus, the entrances of the plurality of upper sub-flow channels 241 are formed at the beginning end of the upper flow channel 24, and the exits of the plurality of upper sub-flow channels 241 are formed at the ending end of the upper flow channel 24. The liquid inlet passage 271 is arranged between the beginning end of the upper flow channel 24 and the liquid inlet 21. The liquid inlet passage 271 is a vertically extending strip-like structure, the right end of which is communicated with the liquid inlet 21, and the left end of which is communicated with the beginning end of the upper flow channel 24, i.e. the entrances of the plurality of upper sub-flow channels 241. Thus, the cooling liquid is distributed from the small-sized liquid inlet 21 to the plurality of upper sub-flow channels 241. At the ending end of the upper flow channel 24, the liquid passing passage 272 is arranged, which vertically extends and is communicated with the ending end of the upper flow channel 24 and the beginning end of the lower flow channel 25. The liquid passing passage 272 can collect and transport the cooling liquid flowing out of the upper sub-flow channels 241 to the entrances of the lower sub-flow channels 251. After being transported through the lower sub-flow channels 251, the cooling liquid reaches the liquid outlet passage 273, the left end of which is connected with the exits of the plurality of lower sub-flow channels 251, and the right end of which is connected with the liquid outlet 22. The cooling liquid flowing out of the plurality of lower sub-flow channels 251 is collected to the liquid outlet 22 and then discharged. The arrangement of the liquid inlet passage 271, the liquid passing passage 272 and the liquid outlet passage 273 in the radiator 20 can simultaneously distribute the cooling liquid from the liquid inlet 21 to the plurality of upper sub-flow channels 241, transport the cooling liquid flowing out of the upper sub-flow channels 241 to the lower sub-flow channels 251, and collect the cooling liquid flowing out of the lower sub-flow channels 251 and then discharge the cooling liquid through the liquid outlet 22, so that the flow of the cooling liquid in the heat dissipation flow channel 23 is smoother.

[0062] In particular, in the heat dissipation flow channel 23, the flow areas of the upper sub-flow channels 241 are the same, the flow areas of the lower sub-flow channels 251 are the same, and the flow area of the upper sub-flow channels 241 is smaller than the flow area of the lower sub-flow channels 251. The same flow area of the sub-flow channels in the same region can ensure that the cooling effect in the same region is substantially the same. The flow area of the upper sub-flow channels 241 is smaller than the flow area of the lower sub-flow channels 251, which can slow down the flow speed of the cooling liquid in the lower sub-flow channels 251 under the condition of the same flow rate, thereby increasing the contact time of the cooling liquid with the alternating current side switching devices 12, and improving the heat dissipation efficiency of the cooling liquid. Even if the temperature of the cooling liquid entering the lower flow channel 25 is higher, the cooling liquid can also be effectively cooled.

[0063] In the present embodiment, the DC side switching device 11 and the AC side switching device 12 are each divided into two parts and fixed on the two mounting surfaces 26. This improvement in the layout of the switching devices can fix more switching devices on the same volume of the heat sink 20, improving the surface utilization rate of the heat sink 20. At the same time, this layout can reduce the number of DC side switching devices 11 in the left-right direction, thereby shortening the length of the heat dissipation flow channel 23 in the left-right direction. Since the heat dissipation flow channel 23 extends in the left-right direction, the shortening of the length in the left-right direction can reduce the temperature difference of the cooling liquid at the beginning and end of the upper flow channel 24, improving the uniform temperature performance of the cooling liquid in the upper flow channel 24. For this purpose, with reference to Figure 6 and Figure 7 In the present embodiment, the upper flow channel 24 is provided with two groups, respectively close to the two mounting surfaces 26 of the heat sink 20, and the liquid inlet channel 271 and the liquid passing channel 272 are in communication with the two groups of upper flow channels 24 at the same time. The lower flow channel 25 is provided with two groups, respectively close to the two mounting surfaces 26 of the heat sink 20, and the liquid passing channel 272 and the liquid outlet channel 273 are in communication with the two groups of lower flow channels 25 at the same time. In this way, the cooling liquid flows more concentratedly and closer to the two mounting surfaces 26, improving the cooling efficiency of the switching devices.

[0064] The power assembly provided by the embodiment divides the switching devices into DC side switching devices 11 and AC side switching devices 12. In the operation process, the DC side switching devices 11 have a higher heat generation, and the AC side switching devices 12 have a lower heat generation. Therefore, the DC side switching devices 11 and the AC side switching devices 12 are separated and the switching devices of the same type are arranged in a centralized manner. In this arrangement, the heat dissipation flow channel 23 is designed to include an upper flow channel 24 and a lower flow channel 25. The upper flow channel 24 is arranged corresponding to the DC side switching devices 11, and the lower flow channel 25 is arranged corresponding to the AC side switching devices 12. When the cooling liquid enters the heat sink 20 from the liquid inlet 21, the cooling liquid with a lower temperature can first enter the upper flow channel 24 and absorb the heat of the DC side switching devices 11 with a higher heat generation. Then, the cooling liquid with a higher temperature reaches the lower flow channel 25. The AC side switching devices 12 corresponding to the lower flow channel 25 have a lower heat generation. Therefore, the cooling liquid with a higher temperature can still play a good role in absorbing the heat of the AC side switching devices 12. Through the improvement of the arrangement of the switching devices and the cooperation between the heat dissipation flow channels 23, the balance of the heat dissipation efficiency of the heat sink 20 on the switching devices can be effectively improved, and the influence on the current sharing performance of the switching devices can be reduced. In addition, the switching devices are separated according to the type and arranged in a centralized manner. This can facilitate the wiring of the switching devices. The wiring components connected with the switching devices can be located at the upper and lower positions of the heat sink 20. The wiring of the AC and DC is not interfered with each other. The overall wiring is simple, and the influence of the heat generation of the wiring components on the switching devices can be reduced. Meanwhile, the heat dissipation flow channel 23 is divided into two centralized regions of the upper flow channel 24 and the lower flow channel 25. The flow channel connection relationship between the upstream flow channel and the downstream flow channel can be easily formed. The heat dissipation flow channel 23 does not need to be excessively bent, and the processing difficulty is low and the cost is low.

[0065] Embodiment 2

[0066] The embodiment 2 of the present application provides a power assembly which is based on the above-mentioned embodiment 1. However, in the embodiment, the arrangement of the AC side switching devices 12 on the heat sink 20 is different from that of the embodiment 1.

[0067] Specifically, referring to Figure 8The DC side switching devices 11 are divided into two parts and fixedly installed on the two installation surfaces 26 of the heat sink 20, and the AC side switching devices 12 are fixedly installed on one of the installation surfaces 26 of the heat sink 20. In this embodiment, nine DC side switching devices 11 are fixed on one installation surface 26, and nine AC side switching devices 12 are fixed on the lower side of the front installation surface 26. The improvement of the layout of the switching devices can fix more switching devices on the same volume of the heat sink 20, and improve the surface utilization rate of the heat sink 20. At the same time, this layout can reduce the number of DC side switching devices 11 in the left-right direction, thereby shortening the length of the heat dissipation flow channel 23 in the left-right direction. Since the heat dissipation flow channel 23 extends in the left-right direction, the shortening of the length in the left-right direction can reduce the temperature difference of the cooling liquid at the beginning and end of the upper flow channel 24, and improve the uniform temperature performance of the cooling liquid in the upper flow channel 24.

[0068] The above description and embodiment of the specification are used to explain the protection scope of the present application, but do not constitute a limitation on the protection scope of the present application. Through the inspiration of the present application or the above-mentioned embodiment, those skilled in the art can obtain the modification, equivalent replacement or other improvement of the embodiment of the present application or one part of the technical features by combining the common knowledge, the ordinary technical knowledge in the art and / or the prior art, through logical analysis, reasoning or limited test, which should be included in the protection scope of the present application.

Claims

1. A power component, characterized in that, include: Multiple switching devices, which are divided into DC-side switching devices (11) and AC-side switching devices (12) according to their connection relationship with the DC and AC sides of the power component; and The radiator (20) is provided with an inlet (21), an outlet (22) and a heat dissipation channel (23). Each of the DC-side switching devices (11) is fixedly installed on the upper side of the heat sink (20), and each of the AC-side switching devices (12) is fixedly installed on the lower side of the heat sink (20). The heat dissipation channel (23) includes an upper channel (24) and a lower channel (25). The upper channel (24) is located on the upper side of the heat sink (20) to correspond to the position of the DC-side switching device (11). The lower channel (25) is located on the lower side of the heat sink (20) to correspond to the position of the AC-side switching device (12). The end of the upper channel (24) is connected to the beginning of the lower channel (25). The beginning of the upper channel (24) is connected to the liquid inlet (21), and the end of the lower channel (25) is connected to the liquid outlet (22).

2. A power component as described in claim 1, characterized in that, In the switching devices, each DC-side switching device (11) is arranged side by side in the left-right direction, and each AC-side switching device (12) is arranged side by side in the left-right direction; the upper flow channel (24) extends from its beginning to its end in the left-right direction, and the lower flow channel (25) extends from its beginning to its end in the left-right direction; the liquid inlet (21) and liquid outlet (22) are located at the left or right end of the radiator (20).

3. A power component as described in claim 2, characterized in that, The upper flow channel (24) includes multiple upper sub-flow channels (241), each of which extends in the left-right direction and is arranged in the up-down direction. The beginning and end of each upper sub-flow channel (241) together form the beginning and end of the upper flow channel (24); the lower flow channel (25) includes multiple lower sub-flow channels (251), each of which extends in the left-right direction and is arranged in the up-down direction. The beginning and end of each lower sub-flow channel (251) together form the beginning and end of the lower flow channel (25).

4. A power component as described in claim 3, characterized in that, The upper sub-channels (241) have the same flow area, the lower sub-channels (251) have the same flow area, and the flow area of ​​the upper sub-channels (241) is smaller than that of the lower sub-channels (251).

5. A power component as described in claim 4, characterized in that, The radiator (20) is provided with an inlet channel (271), a flow channel (272), and an outlet channel (273). The inlet channel (271) is located between the beginning of the upper flow channel (24) and the inlet (21) and at the end of the radiator (20) in the left-right direction. It is connected to the beginning of each upper sub-flow channel (241). The flow channel (272) is located between the end of the upper flow channel (24) and the beginning of the lower flow channel (25) and at the end of the radiator (20) in the left-right direction. It is connected to the end of each upper sub-flow channel (241) and at the beginning of each lower sub-flow channel (251). The outlet channel (273) is located between the end of the lower flow channel (25) and the outlet (22) and at the end of the radiator (20) in the left-right direction. It is connected to the end of each lower sub-flow channel (251).

6. A power component as described in claim 5, characterized in that, The heat sink (20) has two mounting surfaces (26) perpendicular to the front and back directions and opposite to each other; among the switching devices, the DC side switching device (11) is divided into two parts and is fixedly installed on the two mounting surfaces (26) of the heat sink (20) respectively, and the AC side switching device (12) is fixedly installed on one of the mounting surfaces (26) of the heat sink (20).

7. A power component as described in claim 5, characterized in that, The heat sink (20) has two mounting surfaces (26) perpendicular to the front and back directions and opposite to each other; among the switching devices, the DC side switching device (11) is divided into two parts and fixed to the two mounting surfaces (26) of the heat sink (20) respectively, and the AC side switching device (12) is divided into two parts and fixed to the two mounting surfaces (26) of the heat sink (20) respectively, and the positions of the AC side switching devices (12) on the two mounting surfaces (26) are staggered.

8. A power component as described in claim 6, characterized in that, The upper flow channel (24) is provided in two sets, which are respectively close to the two mounting surfaces (26) on the heat sink (20) where the DC side switching device (11) is fixedly installed. The liquid inlet channel (271) and the liquid outlet channel (272) are simultaneously connected to the two sets of upper flow channels (24). The lower flow channel (25) is provided in one set, which is close to the mounting surface (26) on the heat sink (20) where the AC side switching device (12) is fixedly installed.

9. A power component as described in claim 7, characterized in that, The upper flow channel (24) is provided in two sets, which are respectively close to the two mounting surfaces (26) on the heat sink (20) where the DC side switching device (11) is fixedly installed. The liquid inlet channel (271) and the liquid outlet channel (272) are simultaneously connected to the two sets of upper flow channels (24). The lower flow channel (25) is provided in two sets, which are respectively close to the two mounting surfaces (26) on the heat sink (20) where the AC side switching device (12) is fixedly installed. The liquid outlet channel (272) and the liquid outlet channel (273) are simultaneously connected to the two sets of lower flow channels (25).

10. A power component as described in claim 8 or 9, characterized in that, It also includes a capacitor module and wiring components; the capacitor module includes a DC capacitor bank (311) formed by a plurality of capacitors and a capacitor busbar (312) connected to the DC capacitor bank (311), the capacitor busbar (312) being connected to the DC side of the power component; the wiring components include a DC terminal block (321), a connection block (322) and an AC terminal block (323); the DC terminal block (321) is connected to the capacitor busbar (312) and the DC side switching device (11); the connection block (322) is connected to the DC side switching device (11) and the AC side switching device (12); the AC terminal block (323) is connected to the AC side switching device (12) and the AC side of the power component.

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