A Micro-LED chip flexible flying spike crystal device and control method

Abstract

The present invention discloses a flexible flying needle device for Micro-LED chips and a control method, comprising a micro-motion platform; the micro-motion platform comprising a micro-motion platform controller, a voice coil motor, a drive frame, piezoelectric ceramics, a bridge amplification mechanism, and a lever amplification mechanism; the micro-motion platform controller is electrically connected to the voice coil motor and the piezoelectric ceramics, respectively, and is used to control the voice coil motor to push the drive frame to drive the lateral movement of the needle, and to control the axial extension and contraction of the piezoelectric ceramics according to a preset operating frequency to cause the bridge amplification mechanism and the lever amplification mechanism to move longitudinally, thereby driving the needle to reciprocate longitudinally. In the present invention, the lateral displacement of the needle can be adjusted in real time to ensure the alignment accuracy between the needle and the Micro-LED chip. The bridge amplification mechanism and the lever amplification mechanism are combined with the piezoelectric ceramics to enable the needle to move longitudinally at a high rate. The present invention can achieve high-precision, high-speed, and high-efficiency chip packaging transfer.

Description

Technical Field

[0001] The present invention relates to the field of Micro-LED chip transfer packaging technology, and in particular to a Micro-LED chip flexible flying spike crystal device and a control method. Background Art

[0002] As chip miniaturization continues, the number of chips in devices is increasing and their distribution is becoming increasingly dense. Breaking through the current mainstream model of single-chip transfer and die bonding, and developing batch transfer and packaging equipment to achieve a quantum leap in chip transfer efficiency, presents a technical challenge in high-density device manufacturing. To meet the transfer and packaging needs of Mini LEDs / Micro-LEDs (micro-light-emitting diodes), a number of representative chip transfer and packaging technologies have been proposed, including vacuum nozzle transfer, electrostatic transfer, electromagnetic transfer, laser transfer, and mechanical die pricking.

[0003] Among them, the mechanical stinging method is a widely used transfer and packaging method. The chip and substrate are arranged vertically. A device equipped with a stinger on a flexible hinge, with the cooperation of a CCD, extracts the chip from the chip carrier and transfers it to the circuit substrate for transfer and packaging. At the same time, the laser transfer method also adopts a vertical layout during the chip transfer process, that is, the chip carrier and circuit substrate are respectively located on upper and lower motion platforms. When the above-mentioned mechanical stinging method and laser transfer method require precise alignment of the chip and circuit substrate, a motion platform is required to adjust the alignment. However, the jitter caused by the frequent start and stop of the motion platform greatly reduces the accuracy of chip transfer and packaging. In addition, the two-dimensional micro-motion platform inevitably produces coupling in the vertical and horizontal directions. When coupling occurs, the penetration accuracy of the flying stinging device is further reduced. In order to meet the high-precision and high-response requirements of the device, piezoelectric ceramics are usually used as the driver of the stinging action. Due to the small displacement generated by the piezoelectric ceramics, the displacement distance of the stinger is often insufficient during the flying stinging process, resulting in the chip being unable to penetrate the substrate smoothly. Summary of the Invention

[0004] The present invention provides a Micro-LED chip flexible flying crystal device and control method, which solves the technical problem that the existing crystal device is difficult to ensure the accuracy of chip transfer packaging.

[0005] The present invention provides a Micro-LED chip flexible flying thorn crystal device, comprising: a micro-motion platform; the micro-motion platform comprises: a micro-motion platform controller, a voice coil motor, a drive frame, piezoelectric ceramics, a bridge amplification mechanism and a lever amplification mechanism;

[0006] The driving shaft of the voice coil motor is drivingly connected to one side of the driving frame;

[0007] The piezoelectric ceramic is mounted in the driving frame, the output shaft of the piezoelectric ceramic is connected to a bridge amplifying mechanism, and the bridge amplifying mechanism and the lever amplifying mechanism are in contact with each other in the driving frame; the bridge amplifying mechanism and the lever amplifying mechanism are combined to form a composite amplifying mechanism for amplifying the output displacement of the piezoelectric ceramic;

[0008] The bottom of the lever amplification mechanism is provided with a needle for striking the Micro-LED chip;

[0009] The micro-motion platform controller is electrically connected to the voice coil motor and the piezoelectric ceramic, respectively, and is used to control the voice coil motor to drive the drive frame to drive the lateral movement of the needle, and control the axial extension and contraction of the piezoelectric ceramic according to a preset working frequency to make the bridge amplification mechanism and the lever amplification mechanism move longitudinally, thereby driving the needle to perform longitudinal reciprocating movement.

[0010] Furthermore, the micro-motion platform further includes: a fixing frame; the voice coil motor is fixedly arranged on the inner wall of the fixing frame; and the driving frame is arranged on the fixing frame via a flexible hinge.

[0011] Furthermore, the bridge amplification mechanism includes: an input arm, a connecting arm and an output arm;

[0012] The connecting arm is connected between the input arm and the output arm; the arms are hinged by a flexible hinge; the input arm is provided with a small hole allowing the output shaft of the piezoelectric ceramic to pass through;

[0013] The output arm includes a top output arm and a bottom output arm; the top output arm abuts against the inner side of the top of the driving frame, and the bottom output arm abuts against the top of the lever amplification mechanism.

[0014] Furthermore, the lever amplification mechanism includes: a first amplification rod, a second amplification rod, an output rod and a fixed rod;

[0015] The first amplifying rod is in contact with the bottom output arm; the first amplifying rod, the second amplifying rod and the output rod are hinged in sequence through a flexible hinge; the fixed rod and the second amplifying rod are hinged through a flexible hinge;

[0016] Reeds are provided on both sides of the output rod; one end of the reed is connected to the output rod, and the other end of the reed is connected to the driving frame; the needle is arranged at the bottom of the output rod.

[0017] Furthermore, the number of the second amplifying rods and the number of the fixing rods are preferably 2;

[0018] Two fixing rods are respectively located on both sides of the first amplifying rod, and one side of the fixing rod is welded to the inner wall of the driving frame;

[0019] Two second amplifying rods are arranged transversely below the first amplifying rod, with a gap left between the two second amplifying rods;

[0020] The output rod is located below the second amplifying rod.

[0021] Furthermore, it further comprises: a transmission platform; the transmission platform is located directly below the micro-motion platform;

[0022] The conveying platform includes: a first conveyor belt and a second conveyor belt; the first conveyor belt is used to carry and move the Micro-LED chip; the second conveyor belt is used to carry and move the circuit substrate.

[0023] Furthermore, it also includes: a CCD camera for detecting the relative position of each Micro-LED chip and the needle;

[0024] The micro-motion platform controller is electrically connected to the CCD camera, and is specifically used to control the voice coil motor to drive the drive frame to move laterally and then drive the laterally movement of the needle according to the relative position of each Micro-LED chip and the needle, so as to adjust the relative position of the Micro-LED chip and the needle.

[0025] Furthermore, the bridge-type amplifying mechanism and the lever-type amplifying mechanism are both axisymmetric structures.

[0026] Furthermore, the lever amplification mechanism is preferably a two-stage lever amplification mechanism.

[0027] The present invention also provides a control method for a Micro-LED chip flexible flying spike device, which is characterized by comprising:

[0028] Obtain the relative position of each Micro-LED chip and the needle in real time, and determine whether the relative position of the target Micro-LED chip within the preset position range meets the preset conditions;

[0029] If not, controlling the voice coil motor to drive the driving frame to drive the puncture needle to move laterally until the relative position of the target Micro-LED chip meets the preset condition;

[0030] If the conditions are met, the piezoelectric ceramic is controlled to extend axially to drive the needle to move longitudinally and collide with the target Micro-LED chip, so that the target Micro-LED chip is transferred to the circuit substrate.

[0031] It can be seen from the above technical solutions that the present invention has the following advantages:

[0032] The present invention provides a flexible flying thorn crystal device for Micro-LED chips and a control method, the device comprising: a micro-motion platform; the micro-motion platform comprising: a micro-motion platform controller, a voice coil motor, a drive frame, piezoelectric ceramics, a bridge amplifier mechanism and a lever amplifier mechanism; the drive shaft of the voice coil motor is connected to a side of the drive frame; the piezoelectric ceramic is installed in the drive frame, the output shaft of the piezoelectric ceramic is connected to the bridge amplifier mechanism, and the bridge amplifier mechanism and the lever amplifier mechanism are abutted against each other in the drive frame; the bridge amplifier mechanism and the lever amplifier mechanism are combined to form a composite amplifier mechanism for amplifying the output displacement of the piezoelectric ceramic; a needle is provided at the bottom of the lever amplifier mechanism for striking the Micro-LED chip; the micro-motion platform controller is electrically connected to the voice coil motor and the piezoelectric ceramic respectively, for controlling the voice coil motor to push the drive frame to drive the lateral movement of the needle, and controlling the axial extension and contraction of the piezoelectric ceramic according to a preset working frequency to make the bridge amplifier mechanism and the lever amplifier mechanism move longitudinally, thereby driving the needle to perform longitudinal reciprocating movement.

[0033] In the present invention, a bridge amplification mechanism and a lever amplification mechanism are combined to form a composite amplification mechanism, which is matched with piezoelectric ceramics to obtain a larger displacement amplification ratio and a good slow-release impact effect, so that the needle can move at a high speed in the longitudinal direction, effectively eliminating the longitudinal coupling error and balancing the internal stress of the mechanism, improving the accuracy of the device, and making the micro-motion platform reach the nanometer level of resolution; through the voice coil motor combined with the drive frame, the needle can move horizontally at high frequency and high precision, greatly improving the accuracy of the micro-motion platform; at the same time, the vertical and horizontal directions each have separate drivers, which can move independently or cooperate with each other, and can realize a variety of movement modes, thereby realizing vertical and horizontal decoupling and high-precision, high-speed and high-efficiency chip packaging transfer, solving the technical problem that the existing needle crystal device is difficult to ensure the accuracy of chip transfer packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 A schematic diagram of a flexible flying spike crystal device for a Micro-LED chip provided in this application;

[0036] Figure 2 A schematic diagram of the structure of the bridge amplification mechanism provided in this application;

[0037] Figure 3 A schematic diagram of the structure of the lever amplification mechanism provided in this application;

[0038] Among them, the figures are marked as: fixed frame 1, piezoelectric ceramic 2, drive frame 3, bridge amplifier mechanism 4, input arm 41, connecting arm 42, output arm 43, lever amplifier mechanism 5, first amplifier rod 51, second amplifier rod 52, output rod 53, fixed rod 54, reed 55, first conveyor belt 6, circuit substrate 7, Micro-LED chip 8, needle 9, voice coil motor 10, flexible hinge 11. DETAILED DESCRIPTION

[0039] The embodiments of the present invention provide a flexible flying spike crystal device and a control method for a Micro-LED chip, which are used to solve the technical problem that the existing spike crystal device is difficult to ensure the accuracy of chip transfer packaging.

[0040] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] Unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0043] See also Figure 1An embodiment of a flexible flying spike crystal device for a Micro-LED chip provided in the present application includes: a micro-motion platform; the micro-motion platform includes: a micro-motion platform controller, a voice coil motor 10, a driving frame 3, a piezoelectric ceramic 2, a bridge amplification mechanism 4, and a lever amplification mechanism 5;

[0044] The driving shaft of the voice coil motor 10 is drivingly connected to one side of the driving frame 3;

[0045] The piezoelectric ceramic 2 is mounted within the drive frame 3. The output shaft of the piezoelectric ceramic 2 is connected to a bridge amplifying mechanism 4. The bridge amplifying mechanism 4 and the lever amplifying mechanism 5 are abutted within the drive frame 3. The bridge amplifying mechanism 4 and the lever amplifying mechanism 5 combine to form a composite amplifying mechanism for amplifying the output displacement of the piezoelectric ceramic 2.

[0046] A needle 9 is provided at the bottom of the lever amplification mechanism 5 for striking the Micro-LED chip 8;

[0047] The micro-motion platform controller is electrically connected to the voice coil motor 10 and the piezoelectric ceramic 2 respectively, and is used to control the voice coil motor 10 to push the drive frame 3 to drive the lateral movement of the needle 9, and control the axial extension and contraction of the piezoelectric ceramic 2 according to the preset working frequency to make the bridge amplifier mechanism 4 and the lever amplifier mechanism 5 move longitudinally, thereby driving the needle 9 to move back and forth longitudinally.

[0048] It can be understood that the micro-motion platform controller can apply a voltage signal to the piezoelectric ceramic 2, causing the piezoelectric ceramic 2 to extend or contract axially, and the piezoelectric ceramic 2 will produce a small displacement deformation; for example, when the piezoelectric ceramic 2 extends axially, the small displacement deformation of the piezoelectric ceramic 2 is combined with the composite amplification mechanism formed by the bridge amplification mechanism 4 and the lever amplification mechanism 5 to produce a larger displacement deformation to ensure that the needle 9 accurately pierces the Micro-LED chip 8; compared with the traditional crystal piercing device, this device uses the voice coil motor 10 to push the drive frame 3 in the horizontal direction to obtain a small displacement to adjust the horizontal position of the needle 9 in real time, thereby improving the crystal piercing process, making the insertion of the needle 9 more accurate and the crystal transfer efficiency better, thereby improving the chip transfer accuracy.

[0049] In this embodiment, the bridge amplification mechanism 4 and the lever amplification mechanism 5 are combined to form a composite amplification mechanism, which is matched with the piezoelectric ceramic 2 to obtain a larger displacement amplification ratio and a good impact release effect, so that the needle 9 can move at a high speed in the longitudinal direction (i.e., the Z-axis direction), which can effectively eliminate the longitudinal coupling error and balance the internal stress of the mechanism, improve the accuracy of the device, and enable the micro-motion platform to achieve a nanometer-level resolution; through the voice coil motor 10 combined with the drive frame 3, the needle 9 can move in the transverse direction (i.e., the X-axis direction) at high frequency and high precision, greatly improving the alignment accuracy of the micro-motion platform; at the same time, the vertical and horizontal directions each have separate drivers, which can move independently or cooperate with each other to achieve a variety of movement modes, thereby realizing decoupling of the vertical and horizontal directions and high-precision, high-speed and high-efficiency chip packaging transfer.

[0050] In a specific embodiment, in order to achieve the fixation of the micro-motion platform, the micro-motion platform further includes: a fixing frame 1; a voice coil motor 10 fixedly arranged on the inner wall of the fixing frame 1; and a driving frame 3 arranged on the fixing frame 1 through a flexible hinge 11.

[0051] It should be noted that the voice coil motor 10 can be fixed by bolts or screws. The drive frame 3 and the fixing frame 1 are both provided with a passage for allowing the needle 9 to pass through, so as to achieve unimpeded movement of the needle 9 in the longitudinal or lateral direction.

[0052] It should be noted that the use of the voice coil motor 10 can drive the driving frame 3 to undergo a tiny high-precision displacement, thereby achieving the alignment accuracy of the Micro-LED chip 8 and the needle 9, avoiding the problem that the jitter caused by the frequent start and stop of the traditional mechanical needle device will greatly reduce the accuracy of the transfer package; in addition, the setting of the flexible hinge 11 can not only support the driving frame 3, but also enable the driving frame 3 to return to its initial position after the voice coil motor 10 drives the driving frame 3 to move.

[0053] In a specific embodiment, see Figure 2 The bridge amplification mechanism 4 includes: an input arm 41, a connecting arm 42 and an output arm 43; the connecting arm 42 is connected between the input arm 41 and the output arm 43; the arms are hinged by a flexible hinge 11; the input arm 41 is provided with a small hole allowing the output shaft of the piezoelectric ceramic 2 to pass through; the output arm 43 includes a top output arm 43 and a bottom output arm 43; the top output arm 43 abuts against the top inner side of the driving frame 3, and the bottom output arm 43 abuts against the top of the lever amplification mechanism 5.

[0054] It can be understood that the piezoelectric ceramic 2 is installed in the driving frame 3, and a small hole is opened in the input arm 41 of the bridge amplifier mechanism 4. The output shaft of the piezoelectric ceramic 2 serving as a driver is connected to the input arm 41 through the small hole, thereby fixing the bridge amplifier mechanism 4; at the same time, a flexible hinge 11 is hinged between the input arm 41, the connecting arm 42 and the output arm 43 of the bridge amplifier mechanism 4. Therefore, when the piezoelectric ceramic 2 undergoes axial elongation (that is, when the piezoelectric ceramic 2 produces a small displacement in the X-axis direction), the bridge amplifier mechanism 4 will be caused to move vertically downward. Specifically, when the piezoelectric ceramic 2 undergoes axial elongation, the input arms 41 on both sides of the bridge amplifier mechanism 4 are driven to bulge outward along the direction of the piezoelectric ceramic 2. Since the arms are hinged by the flexible hinge 11, the connecting arm 42 near the upper side of the input arm 41 squeezes the top output arm to move upward, and at the same time, the connecting arm 42 near the lower side of the input arm 41 squeezes the bottom output arm to move toward the lever amplifier mechanism 5 below. Because the driving frame 3 will apply a reaction force to the top output arm abutting it, the displacement of the bottom output arm in the Z-axis direction will be further increased; when the piezoelectric ceramic 2 undergoes axial contraction, on the contrary, the bridge amplifier mechanism 4 returns to its original state.

[0055] Due to the close fit between the bridge amplifier mechanism 4 and the piezoelectric ceramic 2 , a small displacement deformation of the piezoelectric ceramic 2 in the X-axis direction can be converted into a displacement deformation of the output arm 43 of the bridge amplifier mechanism 4 in the Z-axis direction.

[0056] In a specific embodiment, in order to avoid the situation where the bridge amplification mechanism 4 and the lever amplification mechanism 5 are in direct contact with each other, the displacement transmission is insufficient. Figure 3 The lever amplification mechanism 5 includes: a first amplification rod 51, a second amplification rod 52, an output rod 53 and a fixed rod 54; the first amplification rod 51 is in contact with the bottom output arm; the first amplification rod 51, the second amplification rod 52 and the output rod 53 are hinged in sequence through a flexible hinge 11; the fixed rod 54 and the second amplification rod 52 are hinged through a flexible hinge 11; a reed 55 is provided on both sides of the output rod 53; one end of the reed 55 is connected to the output rod 53, and the other end of the reed 55 is connected to the drive frame 3; the needle 9 is arranged at the bottom of the output rod 53.

[0057] Furthermore, in order to ensure the effective performance of the displacement amplification function of the lever amplification mechanism 5, the number of the second amplification rod 52 and the fixed rod is preferably 2; the two fixed rods 54 are respectively located on both sides of the first amplification rod 51, and one side of the fixed rod 54 is welded to the inner wall of the driving frame 3; the two second amplification rods 52 are arranged horizontally below the first amplification rod 51, and a gap is left between the two second amplification rods 52; the output rod 53 is located below the second amplification rod 52.

[0058] It should be noted that the lever amplification mechanism 5 is arranged in the driving frame 3 by welding through the fixing rod 54. At the same time, the other end of the reed 55 is also connected to the driving frame 3. Therefore, the lever amplification mechanism 5 of the above structure adopted in this embodiment will produce longitudinal displacement amplification when the bridge amplification mechanism 4 moves vertically downward, that is, the lever amplification mechanism 5 further moves vertically downward, so that the needle 9 penetrates the Micro-LED chip 8. Specifically, when the bottom output arm of the bridge amplification mechanism 4 moves vertically downward, it will drive the first amplification rod 51, the second amplification rod 52 and the output rod 53 of the lever amplification mechanism 5 to also move vertically downward and amplify the vertical downward displacement. At the same time, the reed 55 matched with the output rod 53 will push the output rod 53 to further amplify the vertical downward displacement, thereby obtaining a larger displacement amplification ratio.

[0059] In a specific embodiment, in order to realize the transfer packaging of the Micro-LED chip 8, the device also includes: a conveying platform; the conveying platform is located directly below the micro-motion platform; the conveying platform includes: a first conveyor belt 6 and a second conveyor belt; the first conveyor belt 6 is used to carry and move the Micro-LED chip 8; the second conveyor belt is used to carry and move the circuit substrate 7.

[0060] It can be understood that the first conveyor belt 6 and the second conveyor belt maintain the same conveying speed, and the circuit substrate 7 is provided with a soldering area corresponding to each Micro-LED chip 8.

[0061] In a specific embodiment, it also includes: a CCD camera for detecting the relative position of each Micro-LED chip 8 and the needle 9; a micro-motion platform controller is electrically connected to the CCD camera, specifically for controlling the voice coil motor 10 to push the drive frame 3 to move laterally according to the relative position of each Micro-LED chip 8 and the needle 9, thereby driving the lateral movement of the needle 9 to adjust the relative position of the Micro-LED chip 8 and the needle 9.

[0062] It should be noted that, in theory, the Micro-LED chips 8 under the flying needle crystal device move at a uniform speed on the conveyor belt. However, due to the disturbance of external factors, the position of each Micro-LED chip 8 is not strictly uniform. At this time, the CCD camera will detect the relative position of the needle 9 and each LED chip. In order to ensure the instant response characteristics of this device, the micro-motion platform controller drives the voice coil motor 10 to perform high-frequency movement according to the detection data of the CCD camera, so that the needle 9 can move with high precision in the X direction.

[0063] It should be noted that when the needle 9 is on the same vertical line as the center of mass of the Micro-LED chip 8 in the X-axis direction, the needle 9 moves in the Z-axis direction to hit the Micro-LED chip 8, so that it falls accurately on the power substrate. After the impact is completed, the needle 9 returns to its original position, and the process is repeated to realize the transfer and packaging of the chip; wherein, the working frequency of the needle 9 can be set according to the required chip crystallization rate, and the piezoelectric ceramic 2 drives the bridge amplifier mechanism 4 and the lever amplifier mechanism 5, so that the needle 9 performs high-frequency reciprocating motion along the z-axis, continuously transferring and packaging the Micro-LED chip 8 driven by the conveyor belt below.

[0064] In a specific embodiment, in order to enhance the structural stability of the device, the bridge amplification mechanism 4 and the lever amplification mechanism 5 are both axisymmetric structures.

[0065] It can be understood that both the bridge amplification mechanism 4 and the lever amplification mechanism 5 adopt an axisymmetric structure, which can greatly improve the stress concentration inside the device and reduce the processing difficulty of the entire mechanism.

[0066] In a specific embodiment, the lever amplification mechanism is preferably a two-stage lever amplification mechanism.

[0067] It should be noted that the level of the lever amplification mechanism can be determined based on the actual working requirements of the micro-motion platform. In this device, a two-stage lever amplification mechanism is preferred. Furthermore, the number of voice coil motors is preferably one. Compared to traditional chip transfer packaging processes, this embodiment uses a voice coil motor 10 as the power source for controlling the X-axis motion of the micro-motion platform. The voice coil motor 10 adopts a direct drive method, eliminating the need for intermediate transmission devices such as screws, gears, or reducers. Compared to traditional transmission systems, this largely avoids the problems of backlash, inertia, friction, and insufficient rigidity. Due to the use of direct drive technology, the errors introduced by the intermediate mechanical transmission system are greatly reduced, thereby improving the system's transmission accuracy. Furthermore, the repeatability of positioning can be controlled to the micron level, meeting the requirements of ultra-precision applications. Therefore, this embodiment, driven by the voice coil motor 10, has the advantages of high-frequency response, high precision, and smooth motion, meeting the requirements of high frequency and high precision while also ensuring the stability of the entire structure.

[0068] The working process of a Micro-LED chip flexible flying needle crystal device provided by this device is as follows: the first conveyor belt 6 carries the Micro-LED chip 8 to move at a uniform speed, and the CCD camera detects the displacement deviation of each Micro-LED chip 8 and the needle 9. The micro-motion platform controller controls the voice coil motor 10 to push the drive frame 3 to move along the X-axis at a high frequency according to the deviation, thereby finely adjusting the alignment of the needle 9, so that the Micro-LED chip 8 and the needle 9 are accurately aligned; at the same time, the micro-motion platform controller controls the piezoelectric ceramic 2 to axially extend and contract according to the set working frequency. Due to the presence of the flexible hinge 11, the bridge amplification mechanism 4 is displaced in the Z-axis direction, thereby pushing the lever amplification mechanism 5 to make the needle 9 obtain a greater displacement amplification effect in the Z-axis direction, so that the needle 9 responds more quickly when colliding with the Micro-LED chip 8 carried by the first conveyor belt 6 and the longitudinal displacement is greatly increased, which can enable the needle 9 to more accurately and smoothly knock down the Micro-LED chip 8 and transfer it to the designated circuit substrate 7. Therefore, driven by the above-mentioned motion mechanisms, the needle 9 is located on the same vertical line as the center of mass of the Micro-LED chip 8, and then hits the Micro-LED chip 8 to transfer it to the circuit substrate 7. The impact completes the return of the needle 9, and this process is repeated to achieve the packaging transfer of the Micro-LED chip 8.

[0069] A flexible flying sting device for a Micro-LED chip provided in this embodiment controls the voice coil motor and piezoelectric ceramics respectively through a micro-motion platform controller, so that the stinger is accurately aligned with the Micro-LED chip, and the composite amplification mechanism formed by the combination of the bridge amplification mechanism and the lever amplification mechanism produces a larger longitudinal displacement, so that the stinger hits the Micro-LED chip at a high rate and allows it to fall accurately into the circuit substrate. The present invention uses a micro-motion platform as a basis, and has the characteristics of high frequency, high precision, high repeatability, smooth movement and instant response, which can better achieve the requirements of high-speed and precise movement and smooth trajectory in the process of flying sting of the Micro-LED chip. In addition, since the vertical and horizontal directions each have separate drivers, they can move independently or cooperate with each other to realize a variety of movement modes, realize the decoupling of the vertical and horizontal directions, and high-precision, high-speed and high-efficiency chip packaging transfer.

[0070] The present application also provides a method for controlling a flexible flying spike device of a Micro-LED chip, including:

[0071] In step 101 , the relative position of each Micro-LED chip and the needle is obtained in real time, and it is determined whether the relative position of the target Micro-LED chip within the preset position range meets the preset conditions.

[0072] It should be noted that the preset position range is specifically a preset position range on the first conveying platform with the needle as the axis. The preset position range can be set according to actual needs. For example, the preset position range can be a position range on the first conveying platform with the needle as the axis and having the same width as the channel for allowing the needle to pass through the fixed frame;

[0073] Among them, the Micro-LED chip that enters the preset position range is used as the target Micro-LED chip; the preset conditions specifically include that the relative position of the Micro-LED chip that enters the preset position range satisfies the preset alignment error area; it can be understood that the alignment error area needs to be set according to the transmission speed of the transmission belt, the longitudinal movement rate of the needle, etc.

[0074] Step 102: If the conditions are not met, the voice coil motor is controlled to push the drive frame to drive the needle to move laterally until the relative position of the target Micro-LED chip meets the preset conditions.

[0075] For example, if the relative position of the Micro-LED chip within the preset position range is biased to the right, it indicates that the relative position of the Micro-LED chip within the preset position range does not meet the preset alignment error area. At this time, the position of the needle needs to be slightly adjusted. Specifically, the voice coil motor is controlled to push the drive frame to obtain a lateral displacement so that the position of the needle also obtains a corresponding lateral displacement, so that the relative position of the target Micro-LED chip meets the preset conditions.

[0076] Step 103 : If the conditions are met, the piezoelectric ceramic is controlled to extend axially to drive the needle to move longitudinally and collide with the target Micro-LED chip, so that the target Micro-LED chip is transferred to the circuit substrate.

[0077] It should be noted that when the relative position of the target Micro-LED chip within the preset position range meets the preset conditions, it indicates that the alignment operation between the target Micro-LED chip and the needle has been completed. The piezoelectric ceramic can be controlled to axially extend to drive the longitudinal movement of the needle and quickly collide with the target Micro-LED chip, thereby completing the packaging transfer of the target Micro-LED chip.

[0078] The control method of a flexible flying spike device for a Micro-LED chip provided in this embodiment can complete the Micro-LED chip packaging and transfer operation with a large stroke, high precision, high speed, and high efficiency.

[0079] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A Micro-LED chip flexible flying spike crystal device, characterized in that: include: Micro-motion platform; The micro-motion platform includes: a micro-motion platform controller, a voice coil motor, a drive frame, piezoelectric ceramics, a bridge amplification mechanism and a lever amplification mechanism; The driving shaft of the voice coil motor is drivingly connected to one side of the driving frame; The piezoelectric ceramic is mounted in the driving frame, the output shaft of the piezoelectric ceramic is connected to a bridge amplifying mechanism, and the bridge amplifying mechanism and the lever amplifying mechanism are in contact with each other in the driving frame; the bridge amplifying mechanism and the lever amplifying mechanism are combined to form a composite amplifying mechanism for amplifying the output displacement of the piezoelectric ceramic; The bottom of the lever amplification mechanism is provided with a needle for striking the Micro-LED chip; The micro-motion platform controller is electrically connected to the voice coil motor and the piezoelectric ceramic, respectively, and is used to control the voice coil motor to push the drive frame to drive the lateral movement of the needle, and control the axial extension and contraction of the piezoelectric ceramic according to a preset working frequency to make the bridge amplification mechanism and the lever amplification mechanism move longitudinally, thereby driving the needle to perform longitudinal reciprocating movement.

2. The flexible flying spike crystal device of Micro-LED chip according to claim 1, characterized in that: The micro-motion platform further includes: a fixing frame; the voice coil motor is fixedly arranged on the inner wall of the fixing frame; and the driving frame is arranged on the fixing frame through a flexible hinge.

3. The flexible flying spike device for Micro-LED chips according to claim 1, characterized in that: The bridge amplifying mechanism comprises: an input arm, a connecting arm and an output arm; The connecting arm is connected between the input arm and the output arm; the arms are hinged by a flexible hinge; the input arm is provided with a small hole allowing the output shaft of the piezoelectric ceramic to pass through; The output arm includes a top output arm and a bottom output arm; the top output arm abuts against the inner side of the top of the driving frame, and the bottom output arm abuts against the top of the lever amplification mechanism.

4. The flexible flying spike device for Micro-LED chips according to claim 3, characterized in that: The lever amplification mechanism includes: a first amplification rod, a second amplification rod, an output rod and a fixed rod; The first amplifying rod is in contact with the bottom output arm; the first amplifying rod, the second amplifying rod and the output rod are hinged in sequence through a flexible hinge; the fixed rod and the second amplifying rod are hinged through a flexible hinge; Reeds are provided on both sides of the output rod; one end of the reed is connected to the output rod, and the other end of the reed is connected to the driving frame; the needle is arranged at the bottom of the output rod.

5. The flexible flying spike crystal device of Micro-LED chip according to claim 4, characterized in that: The number of the second amplifying rods and the number of the fixing rods are both 2; Two fixing rods are respectively located on both sides of the first amplifying rod, and one side of the fixing rod is welded to the inner wall of the driving frame; Two second amplifying rods are arranged transversely below the first amplifying rod, with a gap left between the two second amplifying rods; The output rod is located below the second amplifying rod.

6. The flexible flying spike crystal device of Micro-LED chip according to claim 1, characterized in that: Also includes: Transmission platform; The conveying platform is located directly below the micro-motion platform; The conveying platform includes: a first conveyor belt and a second conveyor belt; the first conveyor belt is used to carry and move the Micro-LED chip; the second conveyor belt is used to carry and move the circuit substrate.

7. The flexible flying spike crystal device of Micro-LED chip according to claim 6, characterized in that: Also includes: A CCD camera is used to detect the relative position of each Micro-LED chip and the needle; The micro-motion platform controller is electrically connected to the CCD camera, and is specifically used to control the voice coil motor to drive the drive frame to move laterally and then drive the laterally movement of the needle according to the relative position of each Micro-LED chip and the needle, so as to adjust the relative position of the Micro-LED chip and the needle.

8. The flexible flying spike crystal device of Micro-LED chip according to claim 1, characterized in that: The bridge-type amplifying mechanism and the lever amplifying mechanism are both axisymmetric structures.

9. The flexible flying spike crystal device of Micro-LED chip according to claim 1, characterized in that: The lever amplification mechanism is a two-stage lever amplification mechanism.

10. A control method for a Micro-LED chip flexible flying spike device, characterized in that: The control method is used to control the Micro-LED chip flexible flying spike crystal device according to any one of claims 1 to 9, comprising: Obtain the relative position of each Micro-LED chip and the needle in real time, and determine whether the relative position of the target Micro-LED chip within the preset position range meets the preset conditions; If not, controlling the voice coil motor to drive the driving frame to drive the puncture needle to move laterally until the relative position of the target Micro-LED chip meets the preset condition; If the conditions are met, the piezoelectric ceramic is controlled to extend axially to drive the needle to move longitudinally and collide with the target Micro-LED chip, so that the target Micro-LED chip is transferred to the circuit substrate.

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