Film application device

Abstract

This application provides a film application apparatus, comprising: a worktable with a working area formed thereon; an auxiliary unit, a winding unit, a first winding unit, a second winding unit, and a pressing unit located between the winding unit and the first winding unit and above the working area, all disposed on the worktable; the auxiliary unit is disposed inside the worktable and includes a support mechanism for supporting the wafer lifting and lowering to enter and exit the working area, and an auxiliary mechanism for cleaning and leveling the upper surface of the wafer; the winding unit, the first winding unit, and the pressing unit are all capable of horizontal movement on the worktable to enter or leave the working area; a film peeling module and a film take-up module, both movable to approach or move away from the worktable surface, are respectively disposed on opposite sides of the winding unit and the first winding unit. The film application apparatus provided by this application can adapt to wafers of different thicknesses, avoid the film defect rate problem caused by wafer edge lifting, shorten the entire film application cycle, and has high film application efficiency.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment technology, and more specifically, relates to a film application device. Background Technology

[0002] In wafer fabrication, a protective film needs to be applied to the front side of the wafer before grinding. In related technologies, film application equipment typically includes a film unwinding device, a film rewinding device, and a film cutting device. Generally, only one of the film unwinding and rewinding devices in the film application equipment is movable. This results in some wastage of the film roll when the film rewinding device resets after film application. Simultaneously, during the film application process, slight variations in wafer thickness, dust adhesion during wafer transfer to the application area, and wafer edge lifting are unavoidable. These issues prevent the protective layer from adhering properly to the wafer surface and cause air bubbles, resulting in a low film application yield. Summary of the Invention

[0003] The purpose of this application is to provide a film application device to solve the technical problems of film roll waste and low film application yield in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application embodiment is to provide a film application device, which includes:

[0005] A workbench, on which a work area is formed;

[0006] An auxiliary unit, a winding and unwinding unit, a first winding and rewinding unit, a second winding and rewinding unit, and a pressing unit located between the winding and unwinding unit and the first winding and rewinding unit and above the working area are provided on the workbench.

[0007] The auxiliary unit is located inside the workbench and includes a support mechanism for lifting the wafer to enter and exit the work area and an auxiliary mechanism for cleaning and leveling the upper surface of the wafer.

[0008] The unwinding unit, the first winding unit, and the pressing unit are all capable of moving horizontally on the workbench to enter or leave the work area; on opposite sides of the unwinding unit and the first winding unit, there are respectively a film peeling module and a film taking module that are both capable of moving to approach or move away from the workbench surface.

[0009] The unwinding unit is used to release the adhesive film, the peeling end of the peeling module is used to peel off the adhesive layer and protective layer on the adhesive film, the second winding unit is used to wind up the protective layer, the pressing unit is used to press the adhesive layer onto the wafer, and the first winding unit is used to wind up the excess adhesive layer after pressing.

[0010] Optionally, the supporting mechanism includes several lifting drive devices arranged around the lifting axis and a supporting platform with adsorption function, and each of the lifting drive devices can operate independently to adjust the level of the supporting platform.

[0011] Optionally, the auxiliary mechanism includes a telescopic mechanism and a cleaning mechanism and a leveling mechanism disposed on the telescopic mechanism. The cleaning mechanism is disposed on one side of the leveling mechanism. The telescopic mechanism can extend and retract in multiple stages to move the cleaning mechanism and the leveling mechanism to above the support platform.

[0012] Optionally, the leveling mechanism is a pressure plate with an adsorption function, the shape of which is adapted to the shape of the support platform, and a buffer is provided on the side of the pressure plate that adsorbs the wafer; the cleaning mechanism includes an adsorption tank; and a retractable negative pressure pipe is provided in the telescopic mechanism to connect the adsorption tank and the pressure plate.

[0013] Optionally, the unwinding unit further includes an unwinding bracket that is horizontally slidably disposed on the worktable and an unwinding roller module that is fixedly disposed on the unwinding bracket, and the film peeling module is vertically slidably disposed on the unwinding bracket.

[0014] Optionally, the film peeling module includes a film peeling plate and several rollers disposed on the side of the film peeling plate away from the working area and respectively located on the upper and lower sides of the film peeling plate; one of the rollers is connected to a tension monitoring device.

[0015] Optionally, the first take-up unit further includes a take-up bracket that is horizontally slidably disposed on the worktable and a rotating frame that is rotatably disposed on the take-up bracket, wherein a take-up roller module and the take-up module that are eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame.

[0016] Optionally, a lifting mechanism is connected between the take-up bracket and the rotating frame and located on one side of the rotating shaft. The lifting mechanism is used to push the rotating frame to rotate so that the take-up module moves closer to or away from the worktable.

[0017] Optionally, a braking mechanism is provided in either or both of the unwinding unit and the first winding unit. In the direction of adhesive layer winding, the braking mechanism is located before the film peeling module and / or after the film taking-up module. The braking mechanism includes a braking roller and a braking plate capable of abutting against the braking roller, and the adhesive film and / or the adhesive layer passes between the braking roller and the braking plate.

[0018] Optionally, the pressing unit includes a pressing frame that is horizontally slidably disposed on the worktable and a pressing roller that is vertically movably disposed on the pressing frame.

[0019] The film application device provided in this application embodiment has at least the following beneficial effects:

[0020] Before applying the protective film, the carrier mechanism can be raised and lowered to ensure that the upper surface of wafers of different thicknesses is flush with the upper surface of the worktable, thereby ensuring that the protective layer can be completely adhered to the wafer surface. The auxiliary mechanism can absorb dust on the wafer to avoid air bubbles during the application process. At the same time, it can also press and flatten the wafer onto the carrier mechanism to avoid defective products caused by wafer edges lifting during the application process.

[0021] During the film application process, both the unwinding unit and the first winding unit can move horizontally on the worktable to enter or leave the work area. Thus, after the laminating unit and the external cutting unit have completed the film application and cutting of the wafer, the adhesive tape required for the next film application cycle can be pulled out simultaneously during the resetting process of the first winding unit. This reduces the waste of adhesive tape and shortens the preparation time between two film application cycles, thereby improving work efficiency. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a perspective view of the film-applying device in some embodiments of this application;

[0024] Figure 2 This is a perspective view of the film-applying device in some embodiments of this application;

[0025] Figure 3 This is a front view of a portion of the film-applying device structure in some embodiments of this application;

[0026] Figure 4 This is a perspective view of the load-bearing mechanism in some embodiments of this application;

[0027] Figure 5 This is a perspective view of the auxiliary mechanism in some embodiments of this application;

[0028] Figure 6 This is a perspective view of the auxiliary mechanism in some embodiments of this application;

[0029] Figure 7 This is a schematic diagram of the adhesive film installation stage of the film-applying device in some embodiments of this application;

[0030] Figure 8This is a schematic diagram of the film-applying device bonding stage in some embodiments of this application;

[0031] Figure 9 This is a schematic diagram of the film cutting stage of the film-applying device in some embodiments of this application;

[0032] Figure 10 This is a schematic diagram of the residual film recovery stage of the film application device in some embodiments of this application;

[0033] Figure 11 This is a schematic diagram of the film-pulling stage of the film-applying device in some embodiments of this application. Detailed Implementation

[0034] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.

[0035] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0036] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or indirectly on that other component.

[0037] When a component is said to be "connected to" another component, it can be directly connected to the other component or indirectly connected to that other component.

[0038] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0040] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.

[0041] Please refer to the following: Figures 1 to 11 The film-applying device provided in the embodiments of this application will now be described.

[0042] It should be noted that the film-applying device described in this application is used to apply film layers to wafers. During the wafer film-applying process, the protective layer M1 and the adhesive layer M2 on the adhesive film M are first separated. The protective layer M1 of the adhesive film M is wound up and recycled. The adhesive layer M2 is cut after being bonded to the wafer. The remaining waste adhesive layer M2 after cutting is also recycled.

[0043] refer to Figures 1 to 3 The film application device described in this application includes a worktable and an auxiliary unit 800, a roll-up unit 100, a first roll-up unit 200, a second roll-up unit 300 disposed in the worktable, and a pressing unit 400 located between the roll-up unit 100 and the first roll-up unit 200 and above the work area A.

[0044] Specifically, a working area A for applying film to wafers is formed on the worktable. It is understood that working area A can accommodate at least one wafer, or an even number of wafers such as two or four. In a configuration that can accommodate an even number of wafers, the even number of wafers are placed side-by-side along the width of working area A. During film application, after the adhesive layer M2 is adhered to the surface of working area A, an external cutting unit separates the adhesive layer M2 tape adhered to the wafer from those not covering the wafer in working area A.

[0045] The auxiliary unit 800 includes a support mechanism 810 for supporting the lifting and lowering of the wafer to enter and exit the work area A, and an auxiliary mechanism 820 for cleaning and leveling the upper surface of the wafer. Specifically, the worktable is provided with an opening that allows the support mechanism 810 to move up and down to enter and exit. The auxiliary unit 800 is located inside the worktable, and the support mechanism 810 therein can rise to a position where its upper surface is flush with or higher than the surface of the work area A, and the support mechanism 810 can also descend below the worktable surface.

[0046] When the support mechanism 810 descends below the worktable, the auxiliary mechanism 820 can move directly above the support mechanism 810 to level and clean the wafer on the support mechanism 810. In some embodiments, the leveling of the auxiliary mechanism 820 can be achieved by pressing components such as the pressure plate 823. During leveling, the support mechanism 810, carrying the wafer, rises to the upper surface of the wafer and is simultaneously compressed to eliminate warping at the edges of the wafer. The cleaning function of the auxiliary mechanism 820 can be achieved through electrostatic dust removal and / or negative pressure suction. It should be understood that in the actual operation process, the auxiliary mechanism 820 first levels the wafer and then cleans it to eliminate dust on the wafer surface to the greatest extent possible.

[0047] Specifically, the aforementioned unwinding unit 100 is used to release the adhesive film M, the second winding unit 300 is used to recover the protective layer M1, the pressing unit 400 is used to press the adhesive layer M2 tightly onto the wafer, and the first winding unit 200 is used to recover the waste film adhesive layer M2 remaining after cutting.

[0048] Specifically, refer to Figures 1 to 3 The following details the unwinding unit 100, the first winding unit 200, the second winding unit 300, and the pressing unit 400.

[0049] The unwinding unit 100 includes an unwinding bracket 120 and an unwinding roller module 130, a film peeling module 110 and a plurality of first guide rollers 141 disposed on the unwinding roller module 130 and the film peeling module 110, as well as a pressing roller 142, a film peeling power roller 143 and a second guide roller 144 disposed after the film peeling module 110.

[0050] The protective layer M1 roll is placed on the unwinding roller module 130, and the protective layer M1 strip passes through each of the first guide rollers 141 and the peeling module 110 in sequence. At the peeling module 110, the protective layer M1 strip and the adhesive layer M2 strip on the protective layer M1 strip are torn apart at a large angle. After being torn apart, the protective layer M1 strip passes through the pressing roller 142, the peeling power roller 143 and the second guide roller 144 in sequence, and is finally wound and recycled by the second winding unit 300. During this process, the unwinding roller module 130 is used to release the adhesive film M tape, and each first guide roller 141 guides and conveys the adhesive film M tape so that the adhesive film M tape can be smoothly wound to the peeling module 110 for peeling. The peeling power roller 143 is used to wind the protective layer M1 tape, and the pressing roller 142 is used to pull the protective layer M1 tape so that the protective layer M1 tape can be smoothly wound by the peeling power roller 143 to smoothly separate from the adhesive layer M2 tape. The second guide roller 144 also guides the protective layer M1 tape.

[0051] The lamination unit 400 is slidably mounted on the worktable. It can slide in the work area A to laminate the adhesive layer M2 tape onto the wafer in work area A. After the adhesive layer M2 tape is laminated, an external dicing unit cuts and separates the wafer from the adhesive layer M2 tape. After the wafer and adhesive layer M2 tape are cut, the wafer is transferred away from work area A by the transfer unit, leaving work area A with the remaining adhesive layer M2 tape.

[0052] The first take-up unit 200 includes a take-up bracket 220 and a take-up module 210, a take-up power roller 250, and a take-up roller module 240 disposed on the take-up bracket 220. The take-up roller module 240 is used to take up the remaining adhesive layer M2 tape after the film has been applied and cut. The adhesive layer M2 tape passes through the take-up module 210 and the take-up power roller 250 in sequence and is then wound onto the take-up roller module 240. It can be understood that the take-up roller module 240 is configured as a gravity roller. Specifically, a slide rail assembly is vertically arranged on the take-up bracket 220, and the take-up roller module 240 is disposed on the slide rail assembly. The take-up roller on the module abuts against the take-up power roller 250, which drives the module to rotate in order to achieve the winding and recovery of the remaining adhesive layer M2 tape.

[0053] The second winding unit 300 is used to wind and recycle the protective layer M1 tape.

[0054] Furthermore, both the unwinding unit 100 and the first winding unit 200 are horizontally movable on the worktable and are driven by a linear drive mechanism, which includes, but is not limited to, a lead screw mechanism and a linear slide 600 mechanism. In addition, the unwinding unit 100 and the first winding unit 200 are independently movable, so that the unwinding unit 100 and the first winding unit 200 can move independently to enter or leave the work area A.

[0055] In some specific embodiments, linear slides 600 are provided on both sides of the worktable along its length.

[0056] For the unwinding unit 100, the unwinding unit 100 is slidably disposed on the linear slide table 600, and a first drive source is disposed on the worktable. The first drive source can be a linear motor. The movable end of the first drive source is connected to the unwinding bracket 120. Meanwhile, the bottom of the unwinding bracket 120 is slidably disposed on the linear slide table 600.

[0057] For the first take-up unit 200, its bottom sides are slidably disposed on two linear slides 600 respectively, and the first take-up unit 200 is driven by one of the linear slides 600 to move horizontally in a straight line.

[0058] For the pressing unit 400, its bottom sides are also slidably disposed on two linear slides 600 respectively, and the pressing unit 400 is driven by one of the linear slides 600 to move horizontally in a straight line.

[0059] By setting linear slides 600 on both sides of the worktable and driving the first winding unit 200 and the pressing unit 400 by different linear slides 600, the film application device of this application has a compact structure and each unit occupies less space.

[0060] Furthermore, the aforementioned film peeling module 110 and film take-up module 210 are movably configured, both of which can move closer to or further away from the worktable surface. The movable configuration of the film peeling module 110 and film take-up module 210 can be either vertical linear movement or oscillation around a pivot axis, and is not limited to these specific methods. By movably configuring the film peeling module 110 and film take-up module 210, the vertical distance between the film peeling module 110 and film take-up module 210 and the worktable surface can be increased when the unwinding unit 100 and / or the first take-up unit 200 moves. This avoids motion interference between the film peeling module 110 and film take-up module 210 and the worktable surface, ultimately increasing the travel distance of the unwinding unit 100 and the first take-up unit 200 on the worktable surface, thereby improving operational efficiency.

[0061] Specifically, refer to Figures 7 to 11 The following details the operation process of the film-applying device according to an embodiment of this application.

[0062] refer to Figure 7 The next step is the installation of the adhesive film M. In this step, the protective layer M1 roll is manually placed on the unwinding roller module 130. The protective layer M1 is pulled out and passes sequentially through the first guide rollers 141 and the peeling module 110. At the peeling module 110, the protective layer M1 and the adhesive layer M2 are torn off. The torn adhesive layer M2 passes through the take-up module 210 and the gap between the take-up power roller 250 and the take-up roller module 240 and is held by the take-up power roller 250 and the take-up roller module 240 for subsequent winding and recycling. The torn protective layer M1 passes sequentially through the pressing roller 142, the peeling power roller 143 and the second guide roller 144 and is then wound around the second take-up unit 300.

[0063] Preparation for film application stage. The first take-up unit 200 and the pressing unit 400 are both moved to their initial positions away from the unwinding unit 100, with the pressing unit 400 adjacent to the first take-up unit 200. At the same time, the take-up module 210 presses against the adhesive layer M2 tape to make it adhere tightly to the surface of the work area A. The unwinding unit 100 is also moved horizontally to its initial position away from the pressing unit 400. At the same time, the peeling module 110 is also moved to its initial position away from the worktable surface. The distance between the front end of the peeling module 110 (i.e., where the protective layer M1 tape separates from the adhesive layer M2 tape) and the pressing unit 400 is greater than the maximum length of the bonding area, and the adhesive layer M2 tape forms a certain angle with the surface of the work area A.

[0064] Wafer leveling and cleaning stage. The carrier mechanism 810 lowers the wafer below the platform, and the auxiliary mechanism 820 moves to directly above the wafer. The carrier mechanism 810 rises, causing the upper surface of the wafer on it to slowly approach the pressing component on the auxiliary mechanism 820 until they abut against each other. Then, it continues to rise slowly, so that the upper surface of the wafer is fully compressed and leveled by the pressing component, thereby achieving wafer leveling. After the wafer leveling is completed, the carrier mechanism 810 lowers slightly, causing the upper surface of the wafer to leave the pressing component, and the auxiliary mechanism 820 cleans the wafer surface.

[0065] refer to Figure 8 In the bonding stage, the pressing unit 400 moves towards the side closer to the unwinding unit 100. During this movement, it presses the adhesive layer M2 tape tightly against the wafer surface. Simultaneously, the stripping module 110 also descends towards the worktable to ensure that the protective layer M1 tape on the unwinding unit 100 maintains consistent tension during the bonding process. This continues until the stripping module 110 descends to a position flush with the worktable. Once the pressing unit 400 has completely covered the work area A, the bonding operation is complete.

[0066] refer to Figure 9 The film cutting stage. After the bonding operation is completed, the external cutting unit cuts the adhesive layer M2 tape bonded to the wafer surface, so as to separate the adhesive layer M2 bonded to the wafer surface from the adhesive layer M2 tape located above the work area A that is not bonded to the wafer surface.

[0067] refer to Figure 10 The remaining film recycling stage. The position of the unwinding unit 100 remains unchanged, and the first winding unit 200 moves toward the unwinding unit 100 to wind up the remaining adhesive layer M2 on the working area A. When the first winding unit 200 moves to the edge of the working area A near the unwinding unit 100, the remaining film recycling operation is completed.

[0068] refer to Figure 11 In the film pulling stage, the take-up module 210 moves away from the worktable, and the take-up roller module 240 and the take-up power roller 250 remain stationary to hold the adhesive layer M2 tape. Then, the first take-up unit 200 moves away from the unwinding unit 100 to reset. During this process, the unwinding roller module 130 releases the protective layer M1 tape. At the same time, the peeling module 110 also moves away from the worktable to avoid the adhesive layer M2 from contacting the worktable during the pulling process.

[0069] By configuring the film application device of this application in such a way, especially by movably configuring the unwinding unit 100 and the first winding unit 200, and movably configuring the film peeling module 110 and the film winding module 210 thereon, the first winding unit 200 can simultaneously pull out the adhesive layer M2 tape required for the next work cycle while resetting, without contacting the worktable surface. This avoids the waste of adhesive layer M2 tape caused by the first winding unit 200 resetting, thereby increasing the number of wafers bonded by a single roll of protective layer M1 tape.

[0070] refer to Figure 4 In some embodiments, the support mechanism 810 includes a plurality of lifting drive devices 811 arranged around the lifting axis and a support platform 812 with adsorption function. Each lifting drive device 811 can operate independently to adjust the level of the support platform 812.

[0071] refer to Figure 4 It is understood that a number of adsorption holes 8121 are provided on the top surface of the support stage 812, and vacuum channels communicating with each adsorption hole 8121 are provided in the support stage 812. Specifically, the adsorption holes 8121 are arranged in a ring array on the support stage 812. By arranging the adsorption holes 8121 in this way, various parts of the wafer (especially those near its edges) can be well adsorbed. In particular, after the adsorption disk on the auxiliary mechanism 820 levels the wafer, the wafer can be completely adsorbed on the support stage 812 without edge lifting.

[0072] refer to Figure 4 It is understood that the lifting drive device 811 includes four linear motion devices symmetrically arranged around the center of the support mechanism 810 and capable of independent operation. By symmetrically arranging four linear motion devices, each linear motion device can synchronously or separately drive the support mechanism 810 to lift and lower. When each drive device drives independently, it can adjust its driving stroke according to the levelness of the support mechanism 810, thereby ensuring that the upper surface of the wafer remains level with the surface of the working area A, thus improving the success rate of film application.

[0073] Specifically, the linear motion device can be a slide rail assembly and a linear motor. The drive end of the linear motor is connected to the bearing mechanism 810, which is mounted on the slide rail assembly and driven by the linear motor.

[0074] refer to Figure 5 and Figure 6 In some embodiments, the auxiliary mechanism 820 includes a telescopic mechanism 821 and a cleaning mechanism and a leveling mechanism disposed on the telescopic mechanism 821. The telescopic mechanism 821 can extend and retract in multiple stages to move the cleaning mechanism and the leveling mechanism above the support platform 812.

[0075] Specifically, the telescopic mechanism 821 includes several stages of carriages 8211 and slide rail assemblies and cylinders 8212 connecting adjacent carriages 8211. Adjacent carriages 8211 can be slidably embedded to save space, and the cylinders 8212 are used to pull the adjacent carriages 8211 to extend or retract. In this embodiment, the carriages 8211 are provided with three stages, corresponding to two sets of slide rail assemblies and two sets of cylinders 8212. The leveling mechanism is provided at the free end of the carriages 8211 to move closer to or further away from the support platform 812. By configuring the telescopic mechanism 821 in this way, the telescopic mechanism 821 has a simple structure and occupies less space. At the same time, its movement stability is also better, and it can remain stable without shaking during the wafer leveling stage.

[0076] Furthermore, the cleaning mechanism is located on one side of the leveling mechanism; more specifically, it is located on the side of the leveling mechanism away from the telescopic mechanism 821. Thus, after the leveling mechanism and the support platform 812 have jointly completed the leveling of the wafer, when the telescopic mechanism 821 drives the leveling mechanism and the cleaning mechanism to retract, the cleaning mechanism can simultaneously clean the wafer as it passes directly above it, thereby improving operational efficiency.

[0077] Furthermore, the leveling mechanism is a pressure plate 823 with adsorption function. The pressure plate 823 is provided with a number of adsorption holes 8121, and each adsorption hole 8121 can be arranged in a ring array. At the same time, the shape of the pressure plate 823 is adapted to the shape of the support stage 812. When the support stage 812 can accommodate multiple wafers, the pressure plate 823 is also set to be able to adsorb and press multiple wafers at the same time.

[0078] Furthermore, a buffer 8231 is provided on the side of the pressure plate 823 where the wafer is adsorbed. In this embodiment, the buffer 8231 is an annular rubber ring. Specifically, at least one annular mounting groove, such as two or more, is provided on the adsorption surface of the pressure plate 823. The mounting groove is used to hold the rubber ring in place. When the support stage 812 and the pressure plate 823 jointly press the wafer, the upper surface of the wafer abuts against the rubber ring, thereby preventing damage to the upper surface of the wafer due to compression.

[0079] The cleaning mechanism includes an adsorption tank 822, and a retractable negative pressure pipe 824 connecting the adsorption tank 822 and the pressure plate 823 is provided in the telescopic mechanism 821. One end of the negative pressure pipe 824 is connected to an external generating device, which can be a vacuum generator, and the other end of the negative pressure pipe 824 is used to provide negative pressure to the pressure plate 823 and the cleaning mechanism. Specifically, the negative pressure pipe 824 is composed of several interlocking pipes, and a sealing component is connected between two interlocking pipes. By configuring the negative pressure pipe 824 in this way, when the carriage 8211 extends and retracts, the negative pressure flow of the negative pressure pipe 824 is larger and less prone to tangling compared to the configuration of a negative pressure hose, which can effectively meet the needs of wafer leveling and vacuum cleaning.

[0080] Understandably, reference Figures 1 to 3 In some embodiments, where the aforementioned film-peeling module 110 is movably configured, the unwinding unit 100 further includes an unwinding bracket 120 horizontally slidably disposed on the worktable and an unwinding roller module 130 fixedly disposed on the unwinding bracket 120, with the film-peeling module 110 vertically slidably disposed on the unwinding bracket 120. Specifically, a peeling drive device is provided on the unwinding bracket 120. The peeling drive device can be a vertically disposed linear drive device, such as a linear motor or cylinder, and is used to push the entire film-peeling module 110 to move vertically closer to or further away from the worktable surface.

[0081] Specifically, the film peeling module 110 includes a film peeling plate 111 and a plurality of rollers disposed on the side of the film peeling plate 111 away from the working area A and respectively located on the upper and lower sides of the film peeling plate 111. These rollers are also part of the first guide rollers 141 described in the aforementioned embodiments. The film peeling plate 111 extends towards the first take-up unit 200. The width of the film peeling plate 111 is adapted to or slightly smaller than the width of the working area A, and a guide slope is provided on its top surface facing the first take-up unit 200. The aforementioned protective layer M1 strip is separated into an adhesive layer M2 strip and a protective layer M1 strip at the edge of the guide slope on the film peeling plate 111.

[0082] Furthermore, one of the first guide rollers 141 is connected to a tension monitoring device 112. Even further, the tension monitoring device 112 includes a force-measuring bracket, a slide rail assembly, and a force sensor. The slide rail assembly connects the force-measuring bracket and the peeling bracket 113, and the force sensor is also connected to the force-measuring bracket and the peeling bracket 113. The first guide roller 141 is rotatably mounted on the force-measuring bracket. During the film application process, changes in the tension of the protective layer M1 can pull the force-measuring bracket to slide on the slide rail assembly, causing the force sensor to detect the change. This, in turn, causes the first take-up unit 200 or the unwinding roller module 130 to adjust its movement / unwinding speed according to the tension change, so that the tension of the protective layer M1 is maintained within the target range.

[0083] refer to Figures 1 to 3In some embodiments, the first take-up unit 200 further includes a take-up bracket 220 horizontally slidably disposed on the worktable and a rotating frame 230 rotatably disposed on the take-up bracket 220. A take-up roller module 240 and a take-up film module 210 eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame 230. By setting the rotating frame 230 and simultaneously placing the take-up roller module 240 and the take-up film module 210 on the rotating frame 230, when the first take-up unit 200 needs to be reset after the previous wafer lamination operation is completed and the remaining film is recovered, the rotating frame 230 can be rotated as a whole to move the take-up film module 210 to the side away from the worktable surface. This avoids the waste caused by the take-up film module 210 being too close to the worktable surface during the reset process of the first take-up unit 200, which would result in the pulled-out bonding layer M2 contacting the worktable surface too early.

[0084] Understandably, the rotating frame 230 can be driven by a rotating motor or pushed by a cylinder to achieve the swing.

[0085] Specifically, refer to Figures 1 to 3 In some embodiments, a lifting mechanism 260 is connected between the take-up bracket 220 and the rotating frame 230, located on one side of the rotating shaft. The lifting mechanism 260 is used to push the rotating frame 230 to rotate so that the take-up module 210 moves closer to or away from the worktable. The lifting mechanism 260 can be a linear motor or a cylinder.

[0086] refer to Figures 1 to 3 In some embodiments, a braking mechanism is provided in either or both of the unwinding unit 100 and the first winding unit 200. The braking mechanism includes a brake roller 520 and a brake plate 510 capable of pressing against the brake roller 520. The adhesive film M and / or adhesive layer M2 are disposed between the brake roller 520 and the brake plate 510.

[0087] In a specific embodiment, both the unwinding unit 100 and the first winding unit 200 are equipped with braking mechanisms.

[0088] Specifically, in the unwinding unit 100, the braking mechanism is disposed on the peeling bracket 113 and located before the peeling plate, more specifically, it is disposed before the tension monitoring device 112. The braking mechanism includes a brake cylinder and a brake plate 510. The brake cylinder is used to push the brake plate 510 to abut against one of the first guide rollers 141, so as to press the protective layer M1 tape against the corresponding first guide roller 141 and stop the protective layer M1 tape.

[0089] In the first take-up unit 200, the braking mechanism is mounted on the rotating frame 230 and located in the take-up module 210. The braking mechanism also includes a brake cylinder and a brake plate 510. Specifically, the take-up module 210 includes a guide roller 211, a tension cylinder, a tension roller 212, a brake roller 520, a brake cylinder, and a brake plate 510. The tension roller 212 is located behind the guide roller 211, and the brake roller 520 is located behind the guide roller 211. The adhesive tape layer passes through the gap between the guide roller 211 and the tension roller 212 after passing around the guide roller 211, then around the brake roller 520, and then around the take-up power roller 250 before being wound into the take-up roller module 240.

[0090] A tension cylinder is connected to a tension roller 212, which is used to push the tension roller 212 closer to or further away from the guide roller 211 to adjust the tension of the adhesive layer M2 tape in the first take-up unit 200. A brake cylinder is connected to a brake plate 510 to push the brake plate 510 against the brake roller 520, thereby clamping and fixing the adhesive layer M2 tape.

[0091] The braking mechanism in the unwinding unit 100 is used to adjust the tension of the protective layer M1 tape during the film application stage. Specifically, the braking cylinder pushes the braking plate 510 closer to the first guide roller 141 to increase the friction between the protective layer M1 tape and the first guide roller 211 and the braking plate 510, thereby causing the protective layer M1 tape to be in different tension states.

[0092] The braking mechanism in the first take-up unit 200 is used during the film stretching stage to clamp and pull the adhesive layer M2 tape away from the unwinding unit 100. Specifically, while the unwinding roller module 130 releases the adhesive film M tape, the braking mechanism clamps the adhesive layer M2 tape, and at the same time, the first unwinding unit 100 moves in the working area A to clamp the adhesive layer M2 tape and pull it to the initial position.

[0093] By providing a braking mechanism in either or both of the unwinding unit 100 and the first winding unit 200, the pulling or tension control of the protective layer M1 tape or the adhesive layer M2 tape can be made more precise, which is beneficial to improving the film application accuracy.

[0094] refer to Figures 1 to 3 In some embodiments, the pressing unit 400 includes a pressing frame 410 slidably disposed horizontally on the worktable and a pressing roller 420 movably disposed vertically on the pressing frame 410. For example, a linear slide 600 may be provided on the worktable, and the pressing frame 410 is disposed on the linear slide 600, the travel of the linear slide 600 being greater than the length of the working area A. Furthermore, a pressing cylinder for pushing the pressing roller closer to or away from the worktable surface is also provided on the pressing frame 410, so that the pressing roller can leave the worktable surface to smoothly reset during the resetting process after the pressing unit 400 completes pressing.

[0095] Furthermore, a heating module is provided in the pressure roller 420, and a temperature sensor is also provided in the pressure roller 420 accordingly. In this way, when the pressure roller 420 presses the adhesive layer M2 of the working area A onto the wafer, it can simultaneously heat the adhesive layer M2 to soften the adhesive layer on it, thereby achieving a better pressing effect.

[0096] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A film-coating device for bonding a film layer to a wafer, characterized in that, include: A workbench, on which a work area is formed; An auxiliary unit, a winding and unwinding unit, a first winding and rewinding unit, a second winding and rewinding unit, and a pressing unit located between the winding and unwinding unit and the first winding and rewinding unit and above the working area are provided on the workbench. The auxiliary unit is located inside the workbench and includes a support mechanism for lifting the wafer to enter and exit the work area and an auxiliary mechanism for cleaning and leveling the upper surface of the wafer. The unwinding unit, the first winding unit, and the pressing unit are all capable of moving horizontally on the workbench to enter or leave the work area; on opposite sides of the unwinding unit and the first winding unit, there are respectively a film peeling module and a film taking module that are both capable of moving to approach or move away from the workbench surface. The unwinding unit is used to release the adhesive film, the peeling end of the peeling module is used to peel off the adhesive layer and protective layer on the adhesive film, the second winding unit is used to wind up the protective layer, the pressing unit is used to press the adhesive layer onto the wafer, and the first winding unit is used to wind up the excess adhesive layer after pressing.

2. The film-applying device as described in claim 1, characterized in that: The supporting mechanism includes several lifting drive devices arranged around the lifting axis and a supporting platform with adsorption function. Each of the lifting drive devices can operate independently to adjust the level of the supporting platform.

3. The film-applying device as described in claim 2, characterized in that: The auxiliary mechanism includes a telescopic mechanism and a cleaning mechanism and a leveling mechanism disposed on the telescopic mechanism. The cleaning mechanism is disposed on one side of the leveling mechanism. The telescopic mechanism can extend and retract in multiple stages to move the cleaning mechanism and the leveling mechanism to the top of the support platform.

4. The film-applying device as described in claim 3, characterized in that: The leveling mechanism is a pressure plate with adsorption function. The shape of the pressure plate is adapted to the shape of the support platform. A buffer is provided on the side of the pressure plate that adsorbs the wafer. The cleaning mechanism includes an adsorption tank. A retractable negative pressure tube connecting the adsorption tank and the pressure plate is provided in the telescopic mechanism.

5. The film application device as described in any one of claims 1 to 4, characterized in that: The unwinding unit further includes an unwinding bracket that is horizontally slidably disposed on the worktable and an unwinding roller module that is fixedly disposed on the unwinding bracket, and the film peeling module is vertically slidably disposed on the unwinding bracket.

6. The film-applying device as described in claim 5, characterized in that: The film peeling module includes a film peeling plate and several rollers disposed on the side of the film peeling plate away from the working area and respectively located on the upper and lower sides of the film peeling plate; one of the rollers is connected to a tension monitoring device.

7. The film application device as described in any one of claims 1 to 4, characterized in that: The first take-up unit further includes a take-up bracket that is horizontally slidably disposed on the worktable and a rotating frame that is rotatably disposed on the take-up bracket. A take-up roller module and the take-up module that are eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame.

8. The film-applying device as described in claim 7, characterized in that: A lifting mechanism is connected between the take-up bracket and the rotating frame, and located on one side of the rotating shaft. The lifting mechanism is used to push the rotating frame to rotate so that the take-up module moves closer to or away from the worktable.

9. The film application device as described in any one of claims 1 to 4, characterized in that: A braking mechanism is provided in either or both of the unwinding unit and the first winding unit. In the direction of the adhesive layer winding, the braking mechanism is located before the film peeling module and / or after the film taking module. The braking mechanism includes a braking roller and a braking plate that can abut against the braking roller. The adhesive film and / or the adhesive layer passes between the braking roller and the braking plate.

10. The film application device according to any one of claims 1 to 4, characterized in that: The pressing unit includes a pressing frame that is horizontally slidably disposed on the worktable and a pressing roller that is vertically movably disposed on the pressing frame.

Images