Integrated chip special-shaped packaging frame
By introducing structures such as card slots, positioning blocks and positioning holes into the chip packaging frame, and combining positioning components and sealing glue, the problem of easy distortion and debonding between the upper and lower shells is solved, achieving higher packaging strength and stability.
Patent Information
- Application Number
- CN202410104155.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-24
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2044-01-24
AI Technical Summary
In the prior art, there is a lack of a limiting mechanism between the upper shell and the lower shell during chip packaging, resulting in poor packaging firmness, incomplete fixation of the colloid and the shell, a risk of debonding, and insufficient packaging strength.
An integrated chip special-shaped packaging frame is adopted. By setting structures such as card slots, positioning blocks, limit grooves and positioning holes on the base and upper cover, combined with positioning components and sealing glue, the upper and lower shells can be accurately positioned and sealed.
The chip package firmness and package strength are improved, ensuring that the colloid and the shell are completely fixed together, avoiding debonding, and enhancing the stability of the package.
Smart Images

Figure CN117954398B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip packaging, in particular to an integrated chip special-shaped packaging frame. Background Art
[0002] An integrated chip is a chip manufactured by first integrating transistors into specialized cores, which are then integrated into a single chip using semiconductor technology based on application requirements. A core is a prefabricated, functionally specific die (also known as a "chiplet") that can be combined and integrated. Its functions can include a general-purpose processor, memory, graphics processor, encryption engine, network interface, and more.
[0003] In conventional chip packaging, after the target chip is mounted on the lower shell, a colloid is applied directly to the lower shell. The upper shell is then placed on top of the lower shell, and the colloid solidifies to secure the upper and lower shells together. However, since there is no retaining mechanism between the upper and lower shells, the upper and lower shells are prone to deflection, resulting in reduced security. Furthermore, the colloid is not completely fixed to the shell, which can lead to debonding and poor packaging strength. Therefore, the present invention proposes an integrated chip special-shaped packaging frame to address the above-mentioned issues. Summary of the Invention
[0004] The purpose of the present invention is to provide an integrated chip special-shaped packaging frame to solve the problem that during the conventional chip packaging work proposed in the above background technology, after the target chip is installed in the lower shell, the colloid is directly applied to the lower shell, and then the upper shell is covered on the lower shell, and the colloid is solidified to fix the upper and lower shells together. Since there is no limiting mechanism between the conventional upper shell and the lower shell, it is easy to get stuck and cause reduced firmness. In addition, the colloid and the shell are not completely fixed together, there is a possibility of debonding, and the packaging strength is poor.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: an integrated chip special-shaped packaging frame, comprising:
[0006] A base, wherein symmetrical card slots are provided on the outer walls at both ends of the base, symmetrical positioning blocks are provided on the outer wall of the base close to the card slots, a plurality of positioning slots are provided on the upper outer wall of the positioning block, symmetrical limiting slots are provided on the inner walls on both sides of the positioning slot, and connected positioning holes are provided on the inner walls of the plurality of limiting slots, and a first through slot is provided on the outer walls of the two positioning blocks close to each other;
[0007] A chip body, the chip body being mounted on the upper outer wall of the base, with a plurality of pins mounted on both sides of the chip body;
[0008] An upper cover shell, wherein the upper end of the upper cover shell is provided with a glue injection hole, the outer walls of the upper cover shell at both ends close to the chip body are provided with sealing grooves, the upper cover shell is provided with fixing blocks at both ends close to the sealing grooves, the outer wall of the lower end of the fixing block is provided with a mounting groove, the inner wall of the mounting groove is provided with a plurality of fixing plates, the outer walls of both ends of each fixing plate are provided with symmetrical connecting rods, an insert is installed between the connecting rods, and a second through groove is provided on the outer wall of one side adjacent to the two mounting grooves;
[0009] The positioning assembly includes a mounting plate, a limiting plate, a fixing rod, and a clamping block. The two positioning assemblies are respectively mounted on the outer walls of the two fixing blocks.
[0010] Preferably, the two slots pass through the outer walls at both ends of the base, the cross-sections of the two slots are "T"-shaped, and the bottom outer walls of the two positioning blocks are fixedly connected to the upper outer wall of the base.
[0011] Preferably, both ends of the positioning hole pass through both ends of the fixing block and the fixing plate inside the installation groove at the same time, and the first through groove enables the positioning grooves to communicate with each other.
[0012] Preferably, the sealing groove and the outer wall of the base cooperate to clamp and fix the pins exposed at both ends of the chip body.
[0013] Preferably, the upper outer walls of the two fixing blocks are fixedly connected to the bottom outer wall of the upper cover, and the second through groove connects the mounting groove and the space outside the chip body.
[0014] Preferably, the upper outer walls of several of the fixing plates are fixedly connected to the inner wall of the mounting groove, and the outer walls of one end of the two connecting rods close to the fixing plate are fixedly connected to a fixed shaft rotatably connected to the inner wall of the fixing plate.
[0015] Preferably, the outer wall between the two connecting rods is fixedly connected with a connecting block
[0016] Preferably, the outer walls on both sides of the insert block are fixedly connected with limit blocks that are slidably connected to the inner wall of the limit groove, the outer wall of the upper end of the insert block is provided with a symmetrical rotation groove, the inner wall of the rotation groove is fixedly connected with a rotating shaft that is rotatably connected to the inner wall of one end of the connecting rod away from the fixed plate, and the outer wall of one end of the connecting rod is rotatably connected to the inner wall of the rotation groove.
[0017] Preferably, the upper outer wall of the mounting plate is fixedly connected to the outer wall of one end of the limiting plate, the lower outer wall of the mounting plate is fixedly connected to the upper outer wall of the block, and the outer wall of the block is slidably connected to the inner wall of the slot.
[0018] Preferably, one end of the fixing rod is fixedly connected to an outer wall of the mounting plate close to the limiting plate, and the fixing rod passes through the fixing block, the positioning block and the fixing plate inside the mounting groove in sequence.
[0019] Compared with the prior art, the present invention has the following beneficial effects:
[0020] Place the chip body on the base, then align each insert block on the upper cover with the positioning groove and insert it downward to install it, so that the upper cover moves obliquely downward until the inner wall of the installation groove rests against the upper outer wall of the positioning block, and insert the positioning assembly as a whole into the slot through the card block. At the same time, the fixing rod passes through the fixing block, the positioning block and the fixing plate inside the installation groove in sequence to fix each fixing plate. At the same time, the limit plate on the installation plate limits the external position of the upper cover, and then the sealing glue is injected into the cavity between the base and the upper cover through the glue injection hole to plastic-seal the chip body. The sealing glue is injected into the positioning groove through the second through groove and the first through groove to seal and fix the fixing assembly therein, thereby further improving the packaging strength of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0022] Figure 2 It is an exploded view of the overall structure of the present invention;
[0023] Figure 3 It is an exploded cross-sectional view of the overall structure of the present invention;
[0024] Figure 4 It is a half-section diagram of the overall structure of the present invention;
[0025] Figure 5 A top view of the overall structure of the present invention is a half-section view;
[0026] Figure 6 For the present invention Figure 3 A magnified view of the structure of the middle A area;
[0027] Figure 7 For the present invention Figure 3 A magnified view of the structure of the middle B region;
[0028] Figure 8 For the present invention Figure 4 A magnified view of the structure of the middle C region;
[0029] Figure 9 For the present invention Figure 5 A magnified view of the structure of the middle D region;
[0030] Figure 10 For the present invention Figure 6 A magnified view of the structure of region E in the middle.
[0031] In the figure: base 1, card slot 11, positioning block 12, positioning slot 13, limiting slot 131, positioning hole 14, first through slot 15, upper cover 2, sealing groove 21, fixing block 22, mounting slot 221, fixing plate 23, connecting rod 24, connecting block 241, inserting block 25, rotating slot 251, limiting block 252, second through slot 26, glue injection hole 27, positioning assembly 3, mounting plate 31, limiting plate 32, fixing rod 33, card block 34, chip body 4, pin 41. DETAILED DESCRIPTION
[0032] In order to clearly and completely describe the objectives and technical solutions of the present invention and make the advantages more clearly understood, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0033] In the description of the present invention, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," "horizontal," and the like, indicating positions or location relationships, are based on the positions or location relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, the terms "one," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0034] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.
[0035] For the purpose of simplicity and illustration, the principles of the embodiments are described primarily with reference to examples. In the following description, many specific details are provided to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these embodiments may not be limited to these specific details in practice. In some instances, well-known methods and structures are not described in detail to avoid unnecessarily obscuring the understanding of these embodiments. In addition, all embodiments may be used in combination with each other.
[0036] See also Figures 1 to 10 The present invention provides a technical solution: an integrated chip special-shaped packaging frame, comprising:
[0037] The base 1 has symmetrical card slots 11 on the outer walls at both ends of the base 1, and a shallow groove is provided on the upper surface of the base 1 for the installation of the chip body 4. The outer wall of the base 1 on one side close to the card slot 11 is provided with a symmetrical positioning block 12 to provide a fixed position for the upper cover 2 installed laterally. The upper outer wall of the positioning block 12 is provided with a plurality of positioning grooves 13, and the positioning grooves 13 are fixed with the fixing components on the upper cover 2. The inner walls on both sides of the positioning groove 13 are provided with symmetrical limiting grooves 131, and the inner walls of the plurality of limiting grooves 131 are provided with connected positioning holes 14. A first through groove 15 is provided on the outer wall of one side of each positioning block 12 close to each other, and the two card slots 11 pass through the outer walls at both ends of the base 1. The cross-section of the two card slots 11 is "T"-shaped, which is used to limit the positioning component 3 installed subsequently. The bottom outer wall of the two positioning blocks 12 is fixedly connected to the upper outer wall of the base 1, and the two ends of the positioning hole 14 pass through the two ends of the fixing block 22 and the fixing plate 23 inside the installation groove 221 at the same time to realize the subsequent plug-in fixation of the fixing rod 33. The first through groove 15 connects the positioning grooves 13, which facilitates the subsequent injection of sealing glue to flow into the positioning groove 13.
[0038] The chip body 4 is mounted on the upper outer wall of the base 1 and is packaged by sealing glue and the upper cover 2. A number of pins 41 are installed on both sides of the chip body 4;
[0039] The upper cover shell 2 has a glue injection hole 27 at the upper end of the upper cover shell 2, and the chip body 4 inside is sealed with glue through the glue injection hole 27, so that the outside of the chip body 4 is plastic-sealed with the sealing glue. The upper cover shell 2 is provided with a sealing groove 21 on the outer wall at both ends near the chip body 4, and the upper cover shell 2 is provided with a fixing block 22 at both ends near the sealing groove 21. The outer wall of the lower end of the fixing block 22 is provided with a mounting groove 221, and the inner wall of the mounting groove 221 is provided with a plurality of fixing plates 23. The outer walls of both ends of each fixing plate 23 are provided with symmetrical connecting rods 24, and an insert block 25 is installed between the connecting rods 24. The outer wall of the insert block 25 is plugged into the inner wall of the positioning groove 13 to achieve the fixation of the upper cover shell 2 above the fixing plate 23. The outer wall of the side adjacent to the two mounting grooves 221 is provided with a second through groove 26 to facilitate the sealing glue to flow into the mounting groove 221. The sealing groove 21 and the outer wall of the base 1 cooperate to clamp and fix the pins exposed at both ends of the chip body 4 The upper outer walls of the two fixing blocks 22 are fixedly connected to the lower outer wall of the upper cover shell 2, and the second through groove 26 connects the mounting groove 221 with the space outside the chip body 4. The upper outer walls of several fixing plates 23 are fixedly connected to the inner wall of the mounting groove 221. The outer wall of one end of the two connecting rods 24 close to the fixing plate 23 is fixedly connected to a fixed shaft rotatably connected to the inner wall of the fixing plate 23. The outer wall between the two connecting rods 24 is fixedly connected to a connecting block 241 to achieve synchronous rotation of the two separated connecting rods 24. The outer walls of both sides of the insert block 25 are fixedly connected to limit blocks 252 slidably connected to the inner wall of the limit groove 131 to limit the position of the insert block 25. The upper outer wall of the insert block 25 is provided with a symmetrical rotating groove 251. The inner wall of the rotating groove 251 is fixedly connected to a rotating shaft rotatably connected to the inner wall of one end of the connecting rod 24 away from the fixing plate 23. The outer wall of one end of the connecting rod 24 is rotatably connected to the inner wall of the rotating groove 251;
[0040] The positioning assembly 3 includes a mounting plate 31, a limiting plate 32, a fixing rod 33, and a clamping block 34. The two positioning assemblies 3 are respectively mounted on the outer walls of the two fixing blocks 22. The upper outer wall of the mounting plate 31 is fixedly connected to the outer wall of one end of the limiting plate 32. The lower outer wall of the mounting plate 31 is fixedly connected to the upper outer wall of the clamping block 34. The outer wall of the clamping block 34 is slidably connected to the inner wall of the clamping groove 11. The position of the mounting plate 31 is limited by the clamping block 34. At the same time, the limiting plate 32 on the outside of the fixing block 22 limits the upper cover shell 2 from tilting upward. One end of the fixing rod 33 is fixedly connected to the outer wall of one side of the mounting plate 31 close to the limiting plate 32. The fixing rod 33 passes through the fixing block 22 and the positioning block 12 and the fixing plate 23 inside the mounting groove 221 in turn to limit and fix each fixing plate 23, thereby further improving the sealing strength.
[0041] When the device is working, the chip body 4 is placed on the base 1, and then each insertion block 25 on the upper cover shell 2 is aligned with the positioning groove 13 and inserted downward for installation. After it is fully inserted, the connecting rod 24 is continued to be pressed down to rotate, so that the upper cover shell 2 moves obliquely downward until the inner wall of the installation groove 221 is against the upper outer wall of the positioning block 12, and the positioning assembly 3 is inserted into the slot 11 as a whole through the card block 34. At the same time, the fixing rod 33 passes through the fixing block 22 and the positioning block 12 and the fixing plate 23 inside the installation groove 221 in sequence, fixing each fixing plate 23. At the same time, the limit plate 32 on the mounting plate 31 limits the external position of the upper cover shell 2, and then the sealing glue is injected into the cavity between the base 1 and the upper cover shell 2 through the glue injection hole 27 to plastic-seal the chip body. The sealing glue is injected into the positioning groove 13 through the second through groove 26 and the first through groove 15 to seal and fix the fixing assembly therein, thereby further improving the packaging strength of the chip.
[0042] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.
Claims
1. An integrated chip special-shaped packaging frame, characterized by: include: A base (1), wherein symmetrical slots (11) are provided on the outer walls at both ends of the base (1), a symmetrical positioning block (12) is provided on the outer wall of the base (1) on one side close to the slot (11), a plurality of positioning slots (13) are provided on the upper outer wall of the positioning block (12), symmetrical limiting slots (131) are provided on the inner walls on both sides of the positioning slot (13), and communicating positioning holes (14) are provided on the inner walls of the plurality of limiting slots (131), and a first through slot (15) is provided on the outer walls of the two positioning blocks (12) on one side close to each other; A chip body (4), the chip body (4) being mounted on the upper outer wall of the base (1), and a plurality of pins (41) being mounted on both sides of the chip body (4); An upper cover shell (2), wherein a glue injection hole (27) is provided at the upper end of the upper cover shell (2), a sealing groove (21) is provided on the outer wall of both ends of the upper cover shell (2) close to the chip body (4), a fixing block (22) is provided on both ends of the upper cover shell (2) close to the sealing groove (21), a mounting groove (221) is provided on the outer wall of the lower end of the fixing block (22), a plurality of fixing plates (23) are provided on the inner wall of the mounting groove (221), symmetrical connecting rods (24) are provided on the outer wall of both ends of each fixing plate (23), an insert block (25) is installed between the connecting rods (24), the insert block (25) is plugged into the positioning groove (13), and a second through groove (26) is provided on the outer wall of one side adjacent to the two mounting grooves (221); A positioning assembly (3), the positioning assembly (3) comprising a mounting plate (31), a limiting plate (32), a fixing rod (33), and a clamping block (34), wherein two positioning assemblies (3) are respectively mounted on the outer walls of two fixing blocks (22); The sealing groove (21) and the outer wall of the base (1) cooperate to clamp and fix the pins exposed at both ends of the chip body (4); the upper outer walls of the two fixing blocks (22) are fixedly connected to the bottom outer wall of the upper cover (2), and the second through groove (26) connects the installation groove (221) and the space outside the chip body (4); the upper outer wall of the installation plate (31) is fixedly connected to the outer wall of one end of the limiting plate (32), the bottom outer wall of the installation plate (31) is fixedly connected to the upper outer wall of the clamping block (34), and the outer wall of the clamping block (34) is slidably connected to the inner wall of the clamping groove (11); one end of the fixing rod (33) is fixedly connected to the outer wall of one side of the installation plate (31) close to the limiting plate (32), and the fixing rod (33) passes through the fixing block (22), the positioning block (12) and the fixing plate (23) inside the installation groove (221) in sequence.
2. The integrated chip special-shaped packaging frame according to claim 1, characterized in that: The two card slots (11) pass through the outer walls at both ends of the base (1), and the cross-sections of the two card slots (11) are "T"-shaped. The bottom outer walls of the two positioning blocks (12) are fixedly connected to the upper outer wall of the base (1).
3. The integrated chip special-shaped packaging frame according to claim 2, characterized in that: Both ends of the positioning hole (14) pass through both ends of the fixing block (22) and the fixing plate (23) inside the mounting groove (221), and the first through groove (15) enables communication between the positioning grooves (13).
4. The integrated chip special-shaped packaging frame according to claim 1, characterized in that: The upper outer walls of the plurality of fixed plates (23) are fixedly connected to the inner wall of the mounting groove (221), and the outer walls of one end of the two connecting rods (24) close to the fixed plate (23) are fixedly connected to a fixed shaft rotatably connected to the inner wall of the fixed plate (23).
5. The integrated chip special-shaped packaging frame according to claim 4, characterized in that: A connecting block (241) is fixedly connected to the outer wall between the two connecting rods (24).
6. The integrated chip special-shaped packaging frame according to claim 5, characterized in that: The outer walls on both sides of the insert block (25) are fixedly connected with limit blocks (252) that are slidably connected to the inner wall of the limit groove (131). The outer wall of the upper end of the insert block (25) is provided with a symmetrical rotation groove (251). The inner wall of the rotation groove (251) is fixedly connected with a rotating shaft that is rotatably connected to the inner wall of one end of the connecting rod (24) away from the fixed plate (23). The outer wall of one end of the connecting rod (24) is rotatably connected to the inner wall of the rotation groove (251).
Citation Information
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CN108321125A
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