Welding quality detection device
By designing a welding quality detection device, using structures such as clamps, threaded rods and contact balls, the problem of poor fixation effect in semiconductor welding detection is solved, high accuracy detection of semiconductors of different sizes is achieved, and the reliability of the detection results is improved. and applicability.
Patent Information
- Application Number
- CN202311853230.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2043-12-29
AI Technical Summary
In the prior art, the fixing effect of the integrated circuit board during semiconductor welding detection is poor, test errors are prone to occur, and the adjustability of the tweezers clamping is insufficient, so it is impossible to effectively detect semiconductor welding quality of different sizes.
A welding quality detection device is designed, using structures such as clamping plates, threaded rods, contact balls and control rods. The clamping of the integrated circuit board is completed by the coordination of the clamping plates and threaded rods, and the clamping of the semiconductor is completed by multiple contact balls. Hold the fixing, and adjust the contact ball distance and position through the coordination of the control rod and the arc plate to achieve clamping fixation and mass detection of semiconductors of different sizes.
It realizes firm and reliable clamping and fixing of semiconductor welding, improves the accuracy of detection results, and can adapt to semiconductor welding detection of different sizes, with simple operation and good results.
Smart Images
Figure CN117990534B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor welding, and in particular to a welding quality detection device. Background Art
[0002] Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. At present, semiconductor devices are often installed on the corresponding integrated circuit board by welding. The overall operation is simple and the work efficiency is high. After the welding is completed, the entire device needs to be inspected to determine the overall firmness of the device. At present, tweezers are mainly used to clamp the solder joints. When they are gently pulled, whether there is any looseness, and when the solder joints are shaken, whether the solder on them falls off is judged accordingly. The overall operation is simple, but in the actual detection process, the fixing effect on the integrated circuit board is general, and test errors are prone to occur. At the same time, the use of tweezers for clamping has general adjustability and cannot complete the inspection operation of all semiconductors of different sizes. Therefore, a welding quality detection device is provided. Summary of the invention
[0003] The purpose of the present invention is to solve the shortcomings existing in the prior art, such as: in the actual detection process, the fixing effect of the integrated circuit board is general, and test errors are prone to occur. At the same time, the use of tweezers for clamping has general adjustability and cannot complete the detection operation of all semiconductor welding of different sizes. A welding quality detection device is proposed.
[0004] In order to achieve the above object, the present invention adopts the following technical solutions:
[0005] A welding quality inspection device comprises a base plate, wherein a return plate is fixedly connected to the upper side of the base plate, threaded holes are arranged on the left and right sides of the return plate, threaded rods are arranged in the threaded sleeves of the two threaded holes, the threaded rods are penetrated through the threaded holes, a clamping plate is rotatably connected to the side of the threaded rod close to the other side, a clamping groove is arranged on the side of the clamping plate close to the other side, the clamping groove is transparently arranged front and back, a control plate is arranged in the return plate, a plurality of rotating grooves are circumferentially arranged on the lower side of the control plate, a rotating rod is rotatably connected in the plurality of rotating grooves, a contact rod is fixedly connected to the lower side of the rotating rod, the contact rod penetrates the rotating groove, a contact ball is fixedly connected to the lower side of the contact rod, a control hole is arranged on the upper side of the control plate, and a clamping groove is arranged in the control hole The threaded sleeve is provided with a control rod, and the control rod is passed through the control hole. The lower side of the control rod is rotatably connected with a rotating plate. The outer rotating sleeve of the rotating plate is provided with multiple rotating rings. The multiple rotating rings are circumferentially arranged, and the multiple rotating rings and contact rods are matched and relatively arranged. The outer rotating sleeves of the multiple rotating rings are provided with a connecting rod, and the connecting rod and the contact rod are hinged. The left and right sides of the circular plate are provided with through grooves, and the two through grooves are transparently arranged on the left and right. There are movable plates in the two through grooves, and the movable plates are passed through the through grooves. The movable plate is provided with a movable groove near the outer side of the control plate, and the movable groove is transparently arranged front and back. The outer fixed sleeve of the control plate is provided with a fixed ring, and the fixed ring passes through the movable groove and is relatively arranged.
[0006] Preferably, positioning rods are fixedly connected in the two through grooves, and the positioning rods pass through the movable plate and are slidably connected to the movable plate up and down.
[0007] Preferably, a limit groove is provided at the bottom of the movable groove, a limit plate is slidably connected in the limit groove, the limit plate passes through the limit groove, the limit plate and the fixed ring are contacting and meshingly connected, and the limit plate is connected to the bottom of the limit groove through a spring.
[0008] Preferably, both upper and lower sides of the limiting plate are fixedly connected with limiting rods, and the limiting rods penetrate the limiting grooves and are arranged to match and oppose the limiting grooves.
[0009] Preferably, the outer thread sleeve of the positioning rod is provided with two nuts, and the two nuts are located at the upper and lower sides of the moving plate and are in contact with the moving plate.
[0010] Preferably, a telescopic sleeve is rotatably connected to the upper inner side of the circular plate, a curved plate is fixedly connected to the lower side of the telescopic sleeve, the upper side of the control rod is conically arranged, the control rod passes through the curved plate and the curved plates are matched and arranged relative to each other.
[0011] Preferably, a clamping rod is fixedly connected to the lower side of the clamping plate, and a plurality of rollers are fixedly connected to the lower side of the clamping rod, and the plurality of rollers are matched and contact-connected with the base.
[0012] Preferably, the outer fixing sleeve of the contact ball is provided with a rubber sleeve.
[0013] Compared with the prior art, the beneficial effects of the present invention are: the clamping and fixing operation of the integrated circuit board is completed by cooperating between the two clamping plates and the threaded rod, and then the clamping and fixing operation of the welded semiconductor is completed by cooperating between the multiple contact balls. The multiple contact balls cooperate with each other, and the clamping and fixing operation of the welded semiconductor can be completed well. It is firm and reliable, and the distance between the multiple contact balls can be greatly adjusted according to the actual working conditions, so as to complete the clamping and fixing operation of semiconductors of different sizes. The fixing effect is good, and then under the action of the control rod and the arc plate, when the control board as a whole is shaken back and forth, it is only necessary to observe the relative position between the control rod and the arc plate, which further improves the accuracy of the detection result. The overall operation is simple and the practical effect is good. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a structural schematic diagram of a welding quality detection device proposed by the present invention;
[0015] Figure 2 for Figure 1 A magnified view of the structure at center A;
[0016] Figure 3 This is a top view connection schematic diagram of a movable plate in a welding quality detection device proposed by the present invention;
[0017] Figure 4 for Figure 1 A magnified view of the structure at B in the middle;
[0018] Figure 5 The present invention provides a bottom-up connection diagram of a control panel in a welding quality inspection device.
[0019] In the figure: 1 bottom plate, 2 return plate, 3 threaded hole, 4 threaded rod, 5 clamping plate, 6 clamping groove, 7 clamping rod, 8 roller, 9 control plate, 10 rotating groove, 11 rotating rod, 12 control rod, 13 telescopic sleeve, 14 arc plate, 15 through groove, 16 positioning rod, 17 moving plate, 18 moving groove, 19 fixing ring, 20 limiting groove, 21 limiting plate, 22 limiting rod, 23 spring, 24 rotating plate, 25 rotating ring, 26 contact rod, 27 connecting rod, 28 contact ball, 29 control hole, 30 nut. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0021] Reference Figure 1-5, a welding quality detection device, including a bottom plate 1, a back-type plate 2 is fixedly connected on the upper side of the bottom plate 1, threaded holes 3 are provided on the left and right sides of the back-type plate 2, threaded rods 4 are provided in the two threaded holes 3, and the threaded rods 4 are provided in the threaded holes 3. The threaded rods 4 are provided, and the side of the threaded rods 4 close to each other is rotatably connected with a clamping plate 5, and the side of the clamping plate 5 close to each other is provided with a clamping groove 6, and the clamping groove 6 is transparently set in the front and back, and the lower side of the clamping plate 5 is fixedly connected with a clamping rod 7, and the lower side of the clamping rod 7 is fixedly connected with a plurality of rollers 8, and the plurality of rollers 8 are matched with the base and contacted and connected to complete the restriction of the movement trajectory of the clamping plate 5 and the fixing operation, so that the two clamping plates 5 can always move relative to each other, and the clamping groove 6 can be used to complete the corresponding clamping and fixing operation of the integrated circuit board, the back-type plate 2 A control plate 9 is provided inside, and a plurality of rotating grooves 10 are circumferentially provided on the lower side of the control plate 9. A rotating rod 11 is rotatably connected in the plurality of rotating grooves 10. A contact rod 26 is fixedly connected to the lower side of the rotating rod 11. The contact rod 26 penetrates the rotating groove 10. A contact ball 28 is fixedly connected to the lower side of the contact rod 26. A rubber sleeve is provided on the outer fixed sleeve of the contact ball 28 to make the connection between the contact ball 28 and the semiconductor tighter. A control hole 29 is provided on the upper side of the control plate 9. A control rod 12 is provided on the inner thread sleeve of the control hole 29. The control rod 12 penetrates the control hole 29. A rotating plate 24 is rotatably connected to the lower side of the control rod 12. A plurality of rotating rings 25 are rotatably provided on the outer rotating sleeve of the rotating plate 24. The plurality of rotating rings 25 are circumferentially arranged, and the plurality of rotating rings 29 are provided. 5 and the contact rod 26 are matched and arranged relatively, the outer rotating sleeves of the plurality of rotating rings 25 are provided with connecting rods 27, the connecting rods 27 and the contact rods 26 are hingedly arranged, the control rod 12 is rotated, the control rod 12 drives the rotating plate 24 to move upward, the rotating plate 24 drives the contact rods 26 to move away from each other through the rotating ring 25 and the connecting rod 27, the contact rods 26 drive the contact balls 28 to move away from each other, thereby expanding the distance between the contact balls 28, completing the clamping and fixing operation between the contact balls 28 and the semiconductor, the left and right sides of the return plate 2 are provided with through grooves 15, the two through grooves 15 are transparently arranged on the left and right, and the two through grooves 15 are provided with moving plates 17, the moving plates 17 are arranged to penetrate the through grooves 15, and the moving plates 17 are arranged near the outer side of the control plate 9. There is a moving groove 18, and the moving groove 18 is transparently arranged front and back. A fixing ring 19 is arranged on the outer fixed sleeve of the control plate 9. The fixing ring 19 runs through the moving groove 18 and is arranged opposite to the moving groove 18. A positioning rod 16 is fixedly connected in the two through grooves 15. The positioning rod 16 runs through the moving plate 17 and the moving plate 17 is connected and arranged to slide up and down to complete the restriction of the movement trajectory of the moving plate 17 and determine the operation. A limiting groove 20 is provided at the bottom of the moving groove 18, and a limiting plate 21 is slidably connected in the limiting groove 20. The limiting plate 21 runs through the limiting groove 20, and the limiting plate 21 and the fixing ring 19 are contacted and meshed. The limiting plate 21 is connected and arranged with the bottom of the limiting groove 20 through a spring 23. The limiting plate 21 is used to complete the clamping and fixing operation of the fixing ring 19.Then the clamping and fixing operation of the control plate 9 as a whole is completed. The upper and lower sides of the limit plate 21 are fixedly connected with limit rods 22. The limit rods 22 penetrate the limit grooves 20 and are matched with the limit grooves 20 to complete the movement control operation of the limit plate 21. The outer thread sleeve of the positioning rod 16 is provided with two nuts 30. The two nuts 30 are located at the upper and lower sides of the moving plate 17 and are connected and contacted with the moving plate 17. The nuts 30 are used to complete the fixing operation of the position of the moving plate 17, thereby completing the restriction operation of the control plate 9 as a whole. The upper side of the return plate 2 is rotatably connected with a telescopic sleeve 13, and the lower side of the telescopic sleeve 13 is fixedly connected with an arc plate 14. The upper side of the control rod 12 is conical. The control rod 12 penetrates the arc plate 14 and is matched with the arc plate 14. The control rod 12 and the arc plate 14 cooperate with each other. If the control rod 12 moves relative to the arc plate 14, it means that the quality of semiconductor welding is average or unqualified.
[0022] In the present invention, when it is necessary to perform a detection operation on semiconductor welding, the specific operation is as follows: place the corresponding integrated circuit board between the two clamping plates 5, and make the integrated circuit board and the clamping groove 6 relative to each other, rotate the threaded rod 4, and the threaded rod 4 drives the clamping plate 5 to move the rod in the direction close to each other until the integrated circuit board and the bottom of the clamping groove 6 are tightly contacted and connected together. At this time, the semiconductor that needs to be detected is just located at the lower side of the control board 9, first rotate the control rod 12, the control rod 12 drives the rotating plate 24 to move upward, the rotating plate 24 drives the contact rod 26 to move away from the other side through the rotating ring 25 and the connecting rod 27, and the contact rod 26 drives the contact ball 28 to move away from the other side, thereby expanding the distance between the contact balls 28, and moving the control board 9 as a whole downward until the contact ball 28 is located on the outside of the semiconductor, and rotating the control rod 12 again. The control rod 12 drives the rotating plate 24 to move downward, and the rotating plate 24 drives the contact rod 26 to move toward each other through the rotating ring 25 and the connecting rod 27, and the contact rod 26 drives the contact ball 28 to move toward each other until the contact ball 28 and the semiconductor are in close contact and connected together, and the limit rod 22 is moved in the direction away from the control board 9, and the limit rod 22 drives the limit plate 21 to move, and the limit plate 21 compresses the spring 23, and shakes the control board 9 back and forth and left and right. If there is looseness between the semiconductor and the integrated circuit board, the control rod 12 will move left and right relative to the arc plate 14. If there is no looseness between the semiconductor and the integrated circuit board, the control rod 12 will not move left and right relative to the arc plate 14, thereby completing the detection operation of the welding quality. After the detection operation is completed, the device is restored to its original state for the next detection operation.
[0023] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A welding quality detection device, comprising a base plate (1), characterized in that: A return plate (2) is fixedly connected to the upper side of the bottom plate (1), and threaded holes (3) are provided on both sides of the return plate (2). Threaded rods (4) are provided in the inner threads of the two threaded holes (3), and the threaded rods (4) are arranged to penetrate the threaded holes (3). A clamping plate (5) is rotatably connected to the side of the threaded rod (4) close to the other side, and a clamping groove (6) is provided on the side of the clamping plate (5) close to the other side. The clamping groove (6) is transparently arranged in front and back. A control panel (9) is provided in the return plate (2), and the A plurality of rotation grooves (10) are circumferentially provided on the lower side of the control plate (9), a plurality of rotation grooves (10) are rotationally connected with rotation rods (11), a contact rod (26) is fixedly connected to the lower side of the rotation rod (11), the contact rod (26) penetrates the rotation groove (10), a contact ball (28) is fixedly connected to the lower side of the contact rod (26), a control hole (29) is provided on the upper side of the control plate (9), a control rod (12) is threadedly sleeved in the control hole (29), and the control rod (26) is fixedly threaded with the control rod (12) 12) is provided through the control hole (29), the lower side of the control rod (12) is rotatably connected to a rotating plate (24), the outer rotating sleeve of the rotating plate (24) is provided with a plurality of rotating rings (25), the plurality of rotating rings (25) are circumferentially arranged, and the plurality of rotating rings (25) and the contact rod (26) are matched and arranged relative to each other, the outer rotating sleeves of the plurality of rotating rings (25) are provided with connecting rods (27), the connecting rods (27) and the contact rods (26) are hingedly arranged, and the left and right sides of the return plate (2) are connected to each other. Through grooves (15) are provided on both sides, the two through grooves (15) are transparently arranged on the left and right, a movable plate (17) is provided in the two through grooves (15), the movable plate (17) is arranged to penetrate the through grooves (15), a movable groove (18) is provided on the outer side of the movable plate (17) close to the control plate (9), the movable groove (18) is transparently arranged front and back, and a fixing ring (19) is provided on the outer fixing sleeve of the control plate (9), the fixing ring (19) penetrates the movable groove (18) and is arranged opposite to the movable groove (18); A positioning rod (16) is fixedly connected in the two through grooves (15), and the positioning rod (16) passes through the movable plate (17) and is connected to the movable plate (17) in an upward and downward sliding manner; A limiting groove (20) is provided at the bottom of the movable groove (18), a limiting plate (21) is slidably connected in the limiting groove (20), the limiting plate (21) is arranged to penetrate the limiting groove (20), the limiting plate (21) and the fixing ring (19) are arranged to be in contact and meshing connection, and the limiting plate (21) is connected to the bottom of the limiting groove (20) via a spring (23); The upper and lower sides of the limit plate (21) are both fixedly connected with limit rods (22), and the limit rods (22) penetrate the limit groove (20) and are arranged in a matching manner with the limit groove (20); A telescopic sleeve (13) is rotatably connected to the upper inner side of the circular plate (2), a curved plate (14) is fixedly connected to the lower side of the telescopic sleeve (13), the upper side of the control rod (12) is conically arranged, the control rod (12) passes through the curved plate (14) and is arranged to match and oppose the curved plate (14); The control rod (12) is rotated so that the control rod (12) drives the rotating plate (24) to move downward, and the rotating plate (24) drives the contact rod (26) to move in a direction close to each other through the rotating ring (25) and the connecting rod (27), and the contact rod (26) drives the contact ball (28) to move in a direction close to each other until the contact ball (28) and the semiconductor are in close contact, and the limit rod (22) is moved in a direction away from the control plate (9), and the limit rod (22) drives the limit plate (21) to move, and the limit plate (21) compresses the spring (23), and the control plate (9) is shaken back and forth and left and right. If there is looseness between the semiconductor and the integrated circuit board, the control rod (12) moves left and right relative to the arc plate (14), and if there is no looseness between the semiconductor and the integrated circuit board, the control rod (12) does not move left and right relative to the arc plate (14).
2. A welding quality detection device according to claim 1, characterized in that: Two nuts (30) are provided on the outer thread sleeve of the positioning rod (16), and the two nuts (30) are located on the upper and lower sides of the moving plate (17) and are in contact with and connected to the moving plate (17).
3. A welding quality detection device according to claim 1, characterized in that: A clamping rod (7) is fixedly connected to the lower side of the clamping plate (5), and a plurality of rollers (8) are fixedly connected to the lower side of the clamping rod (7). The plurality of rollers (8) are matched and contact-connected with the base.
4. A welding quality detection device according to claim 1, characterized in that: The outer fixing sleeve of the contact ball (28) is provided with a rubber sleeve.
Citation Information
Patent Citations
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