A solder dotting device for semiconductor production

Abstract

The present invention discloses a solder dotting device for semiconductor production, including a soldering iron body, and further including: a grinding head is located on the right side of the soldering iron body; a connecting mechanism is located on the right side of the soldering iron body and is fixedly connected to the soldering iron body; a guiding mechanism is located on the right side of the connecting mechanism and is fixedly connected to the connecting mechanism; a pressing mechanism is located above the soldering iron body and is fixedly connected to the soldering iron body; a power storage mechanism is located on the right side of the connecting mechanism; a flipping mechanism is located on the left and right sides of the soldering iron body and is rotatably connected to the soldering iron body. By setting the first rotating plate and the second rotating plate, and with the action of the second spring, the user can connect the conductive plate and the conductive frame when pressing the first rotating plate and the second rotating plate, so that the first wire, the second wire, and the third wire are connected, achieving the effect of power supply for use. And when the user releases it, due to the action of the second spring, it can be directly powered off, effectively avoiding the state of continuous power-on use.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production, and particularly to a tin - dotting device for semiconductor production. Background Art

[0002] In semiconductor production, tin - dotting refers to the process of using tin to weld the connection parts of electronic components to achieve electrical connection and fix the components. Tin - dotting generally involves the following steps:

[0003] Surface treatment: In semiconductor manufacturing, the pins or connection points of electronic components need to be surface - treated in advance to improve the adhesion of tin. This may include methods such as using chemicals for cleaning, surface plating, etc.

[0004] Applying solder paste: At the positions where welding is required, a layer of solder paste is usually applied. Solder paste is a material containing fine - grained tin powder, flux, and other components. The role of solder paste is to provide sufficient tin, and at the same time, the flux helps to remove oxides and promote welding.

[0005] Positioning components: Semiconductor components are accurately positioned at the positions where solder paste is printed.

[0006] Heating for welding: Once the components are correctly positioned, the entire area of the components and the solder paste is heated. The heating method is usually through a reflow soldering furnace or other heating equipment. During the heating process, the solder paste melts to form liquid tin.

[0007] Cooling: Once the welding is completed, the heated area cools rapidly, causing the liquid tin to solidify into solder joints. In this way, the welding of the components is completed.

[0008] Inspection: After the welding is completed, inspection is usually carried out to ensure the quality of the welding. This may include visual inspection, electrical testing, etc.

[0009] However, during the above - mentioned welding heating process, the equipment used can be similar to an electric soldering iron, which uses the tip part for heating. But such equipment is directly plugged into the power supply for use. Every time it is used or after use, it is necessary to plug and unplug the power supply, and it is impossible to achieve a short - term stop, and it is very easy to cause accidents due to negligence in not unplugging the power supply. Summary of the Invention

[0010] The purpose of the present invention is to provide a tin - dotting device for semiconductor production to solve the above - mentioned technical problems.

[0011] To solve the above - mentioned technical problems, the present invention adopts the following technical solutions:

[0012] A tin - dotting device for semiconductor production includes an electric soldering iron body, and further includes:

[0013] A grinding head, which is located on the right side of the soldering iron body and is used to grind the tip of the soldering iron body.

[0014] A connecting mechanism, which is located on the right side of the soldering iron body and is fixedly connected to the soldering iron body. The connecting mechanism is used to supply power to the soldering iron body.

[0015] A guiding mechanism, which is located on the right side of the connecting mechanism and is fixedly connected to the connecting mechanism. The guiding mechanism is used to guide the gas generated when the soldering iron body works.

[0016] A pressing mechanism, which is located above the soldering iron body and is fixedly connected to the soldering iron body. The pressing mechanism is used to control the startup of the soldering iron body and the guiding mechanism.

[0017] A power storage mechanism, which is located on the right side of the connecting mechanism and is used to drive the grinding head to rotate.

[0018] A flipping mechanism, which is located on the left and right sides of the soldering iron body and is rotatably connected to the soldering iron body. The flipping mechanism is used to drive the grinding head to rotate.

[0019] Preferably, the connecting mechanism includes:

[0020] A first insulating box, which is fixedly connected to the soldering iron body.

[0021] A conductive plate, which is located inside the first insulating box and is slidably connected to the first insulating box.

[0022] A conductive frame, which is located on the right side of the conductive plate.

[0023] A second insulating box, which is located inside the conductive frame and is fixedly connected to the conductive frame. The second insulating box is fixedly connected to the first insulating box and is used to fix the conductive frame.

[0024] A conductive rack, which is located on the right side of the conductive plate and is fixedly connected to the conductive plate. The conductive rack is inserted into the conductive frame and is used to connect the conductive plate and the conductive frame.

[0025] Preferably, a first wire, which is installed on the soldering iron body, and one end of the first wire far from the soldering iron body is fixedly connected to the conductive plate.

[0026] A second wire, which is located below the conductive frame and is fixedly connected to the second wire frame. The bottom end of the second wire extends outside the first insulating box and is fixedly connected to the first insulating box.

[0027] A limiting plate, which is fixedly installed on the second wire.

[0028] A limiting frame, which is located on the right side of the conductive plate and fixedly connected to the conductive plate. The limiting frame is paired with a limiting plate to limit the pulling of the second wire.

[0029] Preferably, the pressing mechanism includes:

[0030] A fixed box, which is located above the soldering iron body and fixedly connected to the soldering iron body.

[0031] A first slider, which is located inside the fixed box and slidably connected to the fixed box. A rotating groove is formed on the first slider.

[0032] A first rotating plate, the bottom end of which is located inside the rotating groove on the first slider, and the first rotating plate is rotatably connected to the first slider.

[0033] A second slider, which is located inside the fixed box and slidably connected to the fixed box. A rotating groove is formed on the second slider.

[0034] A second rotating plate, the bottom end of which is located inside the rotating groove on the second slider, and the second rotating plate is rotatably connected to the second slider. The second rotating plate is rotatably connected to the first rotating plate.

[0035] A second sliding rod, which penetrates through the second rotating plate and is fixedly connected to the fixed box.

[0036] A second spring, which is sleeved on the second sliding rod, and both ends of the second spring are respectively connected to the second slider and the fixed box. The second spring drives the first rotating plate and the second rotating plate to rotate.

[0037] An insulating rod, which is fixedly connected to the second slider, extends into the first insulating box and is fixedly connected to the conductive plate, and the insulating rod is slidably connected to the first insulating box.

[0038] Preferably, the guiding mechanism includes:

[0039] A fixed ring, which is located on the right side of the first insulating box.

[0040] A support column, which is located between the first insulating box and the fixed ring, and the support column is used to connect the first insulating box and the fixed ring.

[0041] An installation frame, which is located on the inner wall of the second insulating box and fixedly connected to the second insulating box.

[0042] A motor, which is located inside the second insulating box and fixedly connected to the installation frame. The motor is connected to the conductive frame through a third wire.

[0043] The third rotating shaft is located on the right side of the mounting frame, and the third rotating shaft is fixedly connected to the power output shaft of the motor.

[0044] The second gear is fixedly mounted on the third rotating shaft.

[0045] A first gear is located above the second gear and meshes with the second gear.

[0046] The second rotating shaft is fixedly mounted on the first gear and is rotatably connected to the support column.

[0047] The rotating ring is located inside the fixed ring and is rotatably connected with the fixed ring.

[0048] The latch teeth are located inside the rotating ring and are fixedly connected to the rotating ring, and the latch teeth are meshed with the first gear.

[0049] The fan blades are located inside the rotating ring, the fan blades are fixedly connected to the third rotating shaft, and the fan blades are used to accelerate the air flow.

[0050] Preferably, a filter plate is located inside the rotating ring and fixedly connected to the rotating ring, and the filter plate is an activated carbon filter plate, and the filter plate is used to remove harmful gases.

[0051] A connecting column is located on the right side of the filter plate and is fixedly connected to the filter plate.

[0052] Preferably, the power storage mechanism comprises:

[0053] A power storage box is located on the right side of the filter plate and is provided with a mounting groove.

[0054] A fourth rotating shaft, wherein a slot is provided on the fourth rotating shaft, the fourth rotating shaft passes through the energy storage box and is rotatably connected with the energy storage box, the slot is plugged into the connecting column, and the fourth rotating shaft is fixedly connected with the grinding head.

[0055] A coil spring is installed inside the energy storage box and connected to the fourth rotating shaft.

[0056] Preferably, a ratchet ring is inserted into the mounting groove.

[0057] A toggle plate is located inside the ratchet ring and is fixedly connected to the fourth rotating shaft.

[0058] Preferably, the flipping mechanism comprises:

[0059] The first rotating shaft, the two first rotating shafts are respectively located at the left and right sides of the electric soldering iron body, and the first rotating shaft is rotatably connected to the electric soldering iron body.

[0060] A sliding sleeve, which is fixedly installed on the first rotating shaft.

[0061] A first sliding rod, which is located inside the sliding sleeve and is slidably connected to the sliding sleeve.

[0062] A connecting frame, one end of which is fixedly connected to the first sliding rod, and the other end of which is rotatably connected to the energy storage box.

[0063] A first spring, which is sleeved on the first sliding rod, and both ends of the first spring are respectively connected to the sliding sleeve and the connecting frame.

[0064] The beneficial effects of the present invention are:

[0065] 1. By setting the first rotating plate and the second rotating plate, and with the help of the second spring, when the user presses the first rotating plate and the second rotating plate, the conductive plate and the conductive frame can be connected, so that the first wire, the second wire and the third wire are connected, achieving the effect of power supply. And when the user releases it, due to the action of the second spring, it can be directly powered off, effectively avoiding the state of continuous power supply and reducing the occurrence of accidents.

[0066] 2. During the use of the present invention, the motor will drive the fan blade to rotate. With the help of the fan blade, the air flow around the soldering iron body can be accelerated. In this way, the harmful gases generated during the use of the soldering iron will be absorbed, and these gases will directly act on the activated carbon adsorption plate, achieving an effective filtering effect, avoiding the user from inhaling a large amount of harmful gases and being harmless to the body. Moreover, by accelerating the air flow with the help of the fan blade, the heat dissipation effect can also be accelerated, enabling the welded part to solidify faster.

[0067] 3. Through the flipping mechanism, the energy storage mechanism and the motor can interact with each other. In this way, during the normal operation of the soldering iron body, power can be stored in the spiral spring, and the spiral spring is also limited and will not be used randomly. And with the help of the flipping mechanism, the grinding head can be sleeved on the tip of the soldering iron body. With the power of the spiral spring, it can rotate quickly to grind the tip of the soldering iron body, so that the residues on its surface can be cleaned, avoiding excessive residues at the tip of the soldering iron body from affecting the use. Description of the Drawings

[0068] Figure 1 is a schematic structural diagram of the present invention;

[0069] Figure 2 is Figure 1 an enlarged schematic view of part A of

[0070] Figure 3 is a schematic structural diagram of the pressing mechanism of the present invention;

[0071] Figure 4It is a structural schematic diagram of the connection mechanism of the present invention;

[0072] Figure 5 It is a schematic diagram of the guiding mechanism of the present invention;

[0073] Figure 6 for Figure 5 A magnified schematic diagram of part B;

[0074] Figure 7 It is a schematic diagram of the connection between the ratchet ring and the power storage box of the present invention;

[0075] Figure 8 It is a schematic structural diagram of the grinding head of the present invention;

[0076] Figure 9 It is a structural schematic diagram of the power storage box of the present invention;

[0077] Figure 10 It is a schematic diagram of the connection between the coil spring and the energy storage box of the present invention.

[0078] Reference numerals: 1, electric soldering iron body; 2, fixing box; 3, first spring; 4, first slide bar; 5, connecting frame; 6, first insulating box; 7, fixing ring; 8, power storage box; 9, grinding head; 10, first rotating shaft; 11, sliding sleeve; 12, first slide bar; 13, first rotating plate; 14, second rotating plate; 15, second slide bar; 16, second slide bar; 17, second spring; 18, insulating rod; 19, conductive plate; 20, conductive frame; 21, conductive frame; 22. Second insulating box; 23. First wire; 24. Limit plate; 25. Limit frame; 26. Second wire; 27. First gear; 28. Second rotating shaft; 29. ​​Rotating ring; 30. Fan blade; 31. Filter plate; 32. Connecting column; 33. Clamping tooth; 34. Third rotating shaft; 35. Second gear; 36. Motor; 37. Mounting frame; 38. Paddle plate; 39. Ratchet ring; 40. Fourth rotating shaft; 41. Mounting slot; 42. Coil spring; 43. Support column. DETAILED DESCRIPTION

[0079] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0080] The specific embodiments of the present invention are described below with reference to the accompanying drawings.

[0081] Embodiment 1:

[0082] like Figure 1-10As shown in the figure, a tin - dotting device for semiconductor production includes a soldering iron body 1, and further includes:

[0083] The grinding head 9 is located on the right side of the soldering iron body 1, and the grinding head 9 is used to grind the tip of the soldering iron body 1.

[0084] The connecting mechanism is located on the right side of the soldering iron body 1 and is fixedly connected to the soldering iron body 1. The connecting mechanism is used to supply power to the soldering iron body 1.

[0085] The guiding mechanism is located on the right side of the connecting mechanism and is fixedly connected to the connecting mechanism. The guiding mechanism is used to guide the gas generated when the soldering iron body 1 works.

[0086] The pressing mechanism is located above the soldering iron body 1 and is fixedly connected to the soldering iron body 1. The pressing mechanism is used to control the start of the soldering iron body 1 and the guiding mechanism.

[0087] The energy - storing mechanism is located on the right side of the connecting mechanism. The energy - storing mechanism is used to drive the grinding head 9 to rotate.

[0088] The flipping mechanism is located on the left and right sides of the soldering iron body 1 and is rotatably connected to the soldering iron body 1. The flipping mechanism is used to drive the grinding head 9 to rotate.

[0089] The connecting mechanism includes:

[0090] The first insulating box 6 is fixedly connected to the soldering iron body 1.

[0091] The conductive plate 19 is located inside the first insulating box 6 and is slidably connected to the first insulating box 6.

[0092] The conductive frame 21 is located on the right side of the conductive plate 19.

[0093] The second insulating box 22 is located inside the conductive frame 21 and is fixedly connected to the conductive frame 21. The second insulating box 22 is fixedly connected to the first insulating box 6. The second insulating box 22 is used to fix the conductive frame 21.

[0094] The conductive frame 20 is located on the right side of the conductive plate 19 and is fixedly connected to the conductive plate 19. The conductive frame 20 is inserted into the conductive frame 21. The conductive frame 20 is used for the connection between the conductive plate 19 and the conductive frame 21.

[0095] The first wire 23 is installed on the soldering iron body 1. One end of the first wire away from the soldering iron body 1 is fixedly connected to the conductive plate 19.

[0096] The second wire 26 is located below the conductive frame 21 and is fixedly connected to the second wire 26 frame. The bottom end of the second wire 26 extends to the outside of the first insulating box 6 and is fixedly connected to the first insulating box 6.

[0097] The limiting plate 24 is fixedly installed on the second wire 26.

[0098] The limiting frame 25 is located on the right side of the conductive plate 19 and is fixedly connected to the conductive plate 19. The limiting frame 25 and the limiting plate 24 are used to limit the pulling of the second wire 26.

[0099] The pressing mechanism includes:

[0100] The fixed box 2 is located above the soldering iron body 1 and is fixedly connected to the soldering iron body 1.

[0101] The first slider 12 is located inside the fixed box 2 and is slidably connected to the fixed box 2. A rotating groove is provided on the first slider 12.

[0102] The bottom end of the first rotating plate 13 is located inside the rotating groove on the first slider 12. The first rotating plate 13 is rotatably connected to the first slider 12.

[0103] The second slider 16 is located inside the fixed box 2 and is slidably connected to the fixed box 2. A rotating groove is provided on the second slider 16.

[0104] The bottom end of the second rotating plate 14 is located inside the rotating groove on the second slider 16. The second rotating plate 14 is rotatably connected to the second slider 16, and the second rotating plate 14 is rotatably connected to the first rotating plate 13.

[0105] The second sliding rod 15 passes through the second rotating plate 14 and is fixedly connected to the fixed box 2.

[0106] The second spring 17 is sleeved on the second sliding rod 15. The two ends of the second spring 17 are respectively connected to the second slider 16 and the fixed box 2. The second spring 17 drives the first rotating plate 13 and the second rotating plate 14 to rotate.

[0107] The insulating rod 18 is fixedly connected to the second slider 16. The insulating rod 18 extends into the first insulating box 6 and is fixedly connected to the conductive plate 19. The insulating rod 18 is slidably connected to the first insulating box 6.

[0108] When in need of use.

[0109] By pressing the connection part of the first rotating plate 13 and the second rotating plate 14, the first rotating plate 13 and the second rotating plate 14 move downward. In this way, the second slider 16 will squeeze the second spring 17 to move. The second slider 16 will also drive the insulating rod 18 to move, so that the insulating rod 18 drives the conductive plate 19 to move. The conductive plate 19 drives the conductive frame 20 to move, and the conductive frame 20 will be connected to the conductive frame 21. Thus, the first wire 23, the second wire 26, and the third wire are connected.

[0110] In this way, when the second wire 26 is connected to the power supply, the soldering iron body 1 can be used.

[0111] When the user releases the connection between the first rotating plate 13 and the second rotating plate 14, the second spring 17 will act in the opposite direction to restore its original state. In this way, both the conductive plate 19 and the conductive frame 20 will return to their original positions, directly cutting off the power supply, and the soldering iron body 1 will stop working, thus effectively avoiding accidents.

[0112] Embodiment 2:

[0113] As Figure 1-10 shown, in the case where other parts are the same as those in Embodiment 1, the difference between this embodiment and Embodiment 1 lies in that the guiding mechanism includes:

[0114] The fixed ring 7 is located on the right side of the first insulating box 6.

[0115] The support column 43 is located between the first insulating box 6 and the fixed ring 7, and the support column 43 is used to connect the first insulating box 6 and the fixed ring 7.

[0116] The mounting bracket 37 is located on the inner wall of the second insulating box 22 and is fixedly connected to the second insulating box 22.

[0117] The motor 36 is located inside the second insulating box 22 and is fixedly connected to the mounting bracket 37. The motor 36 is connected to the conductive frame 20 through a third wire.

[0118] The third rotating shaft 34 is located on the right side of the mounting bracket 37, and the third rotating shaft 34 is fixedly connected to the power output shaft of the motor 36.

[0119] The second gear 35 is fixedly installed on the third rotating shaft 34.

[0120] The first gear 27 is located above the second gear 35 and meshes with the second gear 35.

[0121] The second rotating shaft 28 is fixedly installed on the first gear 27, and the second rotating shaft 28 is rotatably connected to the support column 43.

[0122] The rotating ring 29 is located inside the fixed ring 7 and is rotatably connected to the fixed ring 7.

[0123] A plurality of teeth 33 are located inside the rotating ring 29 and are fixedly connected to the rotating ring 29. The teeth 33 mesh with the first gear 27.

[0124] The fan blade 30 is located inside the rotating ring 29, and the fan blade 30 is fixedly connected to the third rotating shaft 34. The fan blade 30 is used to accelerate the air flow.

[0125] The filter plate 31 is located inside the rotating ring 29 and is fixedly connected to the rotating ring 29. The filter plate 31 is an activated carbon filter plate 31, and the filter plate 31 is used to filter harmful gases.

[0126] The connecting column 32 is located on the right side of the filter plate 31 and is fixedly connected to the filter plate 31.

[0127] When the power is turned on, the motor 36 will also work, and the motor 36 will drive the third shaft 34 to rotate, and the third shaft 34 will drive the fan blades 30 to rotate, so that the fan blades 30 can accelerate the air flow around the electric soldering iron body 1, so that the harmful gases generated by the electric soldering iron body 1 during use will be absorbed, and these gases will directly act on the activated carbon adsorption plate, which can play an effective filtering effect, avoiding the user from inhaling a large amount of harmful gases, which is harmless to the body. Not only that, with the help of the fan blades 30 to accelerate the air flow, it can also accelerate its heat dissipation effect, so that the welding point can solidify faster.

[0128] Embodiment 3:

[0129] like Figure 1-10 As shown, when other parts are the same as those in Example 1, the difference between this embodiment and Example 1 is that the power storage mechanism includes:

[0130] The energy storage box 8 is located on the right side of the filter plate 31 , and a mounting groove 41 is provided on the energy storage box 8 .

[0131] A slot is provided on the fourth rotating shaft 40 , the fourth rotating shaft 40 passes through the energy storage box 8 and is rotatably connected to the energy storage box 8 , the slot is plugged into the connecting column 32 , and the fourth rotating shaft 40 is fixedly connected to the grinding head 9 .

[0132] The coil spring 42 is installed inside the energy storage box 8 and connected to the fourth rotating shaft 40 .

[0133] The ratchet ring 39 is inserted into the mounting groove 41 .

[0134] The shifting piece 38 is located inside the ratchet ring 39 and is fixedly connected to the fourth rotating shaft 40 .

[0135] The flip mechanism includes:

[0136] The two first rotating shafts 10 are respectively located at the left and right sides of the electric soldering iron body 1 , and the first rotating shafts 10 are rotatably connected to the electric soldering iron body 1 .

[0137] The sliding sleeve 11 is fixedly mounted on the first rotating shaft 10 .

[0138] The first sliding rod 4 is located inside the sliding sleeve 11 and is slidably connected to the sliding sleeve 11 .

[0139] One end of the connecting frame 5 is fixedly connected to the first sliding rod 4 , and the other end of the connecting frame 5 is rotatably connected to the power storage box 8 .

[0140] The first spring 3 is sleeved on the first sliding rod 4 , and two ends of the first spring 3 are connected to the sliding sleeve 11 and the connecting frame 5 respectively.

[0141] The third rotating shaft 34 will also drive the second gear 35 to rotate, the second gear 35 will drive the first gear 27 to rotate, the first gear 27 will drive the rotating ring 29 to rotate through the locking tooth 33, the rotating ring 29 will drive the connecting column 32 to rotate through the filter plate 31, and since the connecting column 32 is plugged into the fourth rotating shaft 40, the fourth rotating shaft 40 will rotate to act on the coil spring 42 to store force.

[0142] When grinding is required, the power storage box 8 can be pulled to separate the connecting column 32 from the fourth rotating shaft 40, and then the sliding sleeve 11 is rotated 180 degrees to make the grinding head 9 located at the tip of the electric soldering iron.

[0143] Subsequently, the power storage box 8 is rotated to align the grinding head 9 with the tip of the electric soldering iron, and then the first spring 3 is used to directly cover the tip of the electric soldering iron.

[0144] Due to the action of the toggle piece 38 and the ratchet ring, the rotation of the fourth rotating shaft 40 is limited. When grinding is required, the ratchet ring 39 is removed to release the fourth rotating shaft 40, so that under the action of the coil spring 42, the grinding head 9 can continuously rotate to perform grinding.

[0145] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A solder-dotting device for semiconductor production, comprising a soldering iron body (1), characterized in that, Also includes: a grinding head (9), the grinding head (9) being located on the right side of the electric soldering iron body (1), and the grinding head (9) being used for grinding the tip of the electric soldering iron body (1); a connecting mechanism, the connecting mechanism being located on the right side of the electric soldering iron body (1) and being fixedly connected to the electric soldering iron body (1), the connecting mechanism being used to energize the electric soldering iron body (1); a guiding mechanism, the guiding mechanism being located on the right side of the connecting mechanism and fixedly connected to the connecting mechanism, the guiding mechanism being used to guide the gas generated when the electric soldering iron body (1) is working; A pressing mechanism, the pressing mechanism being located above the electric soldering iron body (1) and fixedly connected to the electric soldering iron body (1), the pressing mechanism being used to control the electric soldering iron body (1) and to start the guiding mechanism; A power storage mechanism, the power storage mechanism being located on the right side of the connecting mechanism and being used to drive the grinding head (9) to rotate; A turning mechanism, the turning mechanism being located on the left and right sides of the electric soldering iron body (1) and being rotatably connected to the electric soldering iron body (1), the turning mechanism being used to drive the grinding head (9) to rotate; The power storage mechanism comprises: A power storage box (8), wherein a mounting groove (41) is provided on the power storage box (8); a fourth rotating shaft (40), wherein a slot is provided on the fourth rotating shaft (40), the fourth rotating shaft (40) passes through the power storage box (8) and is rotatably connected to the power storage box (8), the slot is plugged into the connecting column (32), and the fourth rotating shaft (40) is fixedly connected to the grinding head (9); A coil spring (42), the coil spring (42) being installed inside the power storage box (8) and connected to the fourth rotating shaft (40); A ratchet ring (39), wherein the ratchet ring (39) is inserted into the mounting groove (41); A toggle plate (38), the toggle plate (38) being located inside the ratchet ring (39) and fixedly connected to the fourth rotating shaft (40); The turning mechanism comprises: A first rotating shaft (10), wherein the two first rotating shafts (10) are respectively located on the left and right sides of the electric soldering iron body (1), and the first rotating shafts (10) are rotatably connected to the electric soldering iron body (1); A sliding sleeve (11), wherein the sliding sleeve (11) is fixedly mounted on the first rotating shaft (10); A first sliding rod (4), the first sliding rod (4) being located inside the sliding sleeve (11) and being slidably connected to the sliding sleeve (11); A connecting frame (5), one end of the connecting frame (5) is fixedly connected to the first sliding rod (4), and the other end of the connecting frame (5) is rotatably connected to the power storage box (8); A first spring (3), wherein the first spring (3) is sleeved on the first sliding rod (4), and two ends of the first spring (3) are respectively connected to the sliding sleeve (11) and the connecting frame (5).

2. The solder dotting device for semiconductor production according to claim 1, wherein: The connecting mechanism comprises: A first insulating box (6), the first insulating box (6) being fixedly connected to the electric soldering iron body (1); A conductive plate (19), the conductive plate (19) being located inside the first insulating box (6) and being slidably connected to the first insulating box (6); A conductive frame (21), the conductive frame (21) being located on the right side of the conductive plate (19); The second insulating box (22) is located inside the conductive frame (21) and fixedly connected to the conductive frame (21). The second insulating box (22) is fixedly connected to the first insulating box (6) and is used to fix the conductive frame (21). The conductive frame (20) is located on the right side of the conductive plate (19) and fixedly connected to the conductive plate (19). The conductive frame (20) is inserted into the conductive frame (21) and is used for connecting the conductive plate (19) and the conductive frame (21).

3. The soldering device for semiconductor production according to claim 2, wherein: The first wire (23) is installed on the soldering iron body (1), and one end of the first conductor away from the soldering iron body (1) is fixedly connected to the conductive plate (19). The second wire (26) is located below the conductive frame (21) and fixedly connected to the second wire (26) frame. The bottom end of the second wire (26) extends to the outside of the first insulating box (6) and is fixedly connected to the first insulating box (6). The limiting plate (24) is fixedly installed on the second wire (26). The limiting frame (25) is located on the right side of the conductive plate (19) and fixedly connected to the conductive plate (19). The limiting frame (25) and the limiting plate (24) are used to limit the pulling of the second wire (26).

4. The soldering device for semiconductor production according to claim 2, characterized in that: The pressing mechanism includes: The fixed box (2) is located above the soldering iron body (1) and fixedly connected to the soldering iron body (1). The first slider (12) is located inside the fixed box (2) and slidably connected to the fixed box (2). A rotating groove is provided on the first slider (12). The bottom end of the first rotating plate (13) is located inside the rotating groove on the first slider (12), and the first rotating plate (13) is rotatably connected to the first slider (12). The second slider (16) is located inside the fixed box (2) and slidably connected to the fixed box (2). A rotating groove is provided on the second slider (16). The bottom end of the second rotating plate (14) is located inside the rotating groove on the second slider (16). The second rotating plate (14) is rotatably connected to the second slider (16), and the second rotating plate (14) is rotatably connected to the first rotating plate (13). The second sliding rod (15) passes through the second rotating plate (14) and is fixedly connected to the fixed box (2). The second spring (17) is sleeved on the second sliding rod (15). The two ends of the second spring (17) are respectively connected to the second slider (16) and the fixed box (2), and the second spring (17) drives the first rotating plate (13) and the second rotating plate (14) to rotate. Insulating rod (18), the insulating rod (18) is fixedly connected to the second slider (16), the insulating rod (18) extends into the first insulating box (6) and is fixedly connected to the conductive plate (19), and the insulating rod (18) is slidably connected to the first insulating box (6).

5. The solder dotting device for semiconductor production according to claim 3, characterized in that: The guiding mechanism includes: Fixed ring (7), the fixed ring (7) is located on the right side of the first insulating box (6); Support column (43), the support column (43) is located between the first insulating box (6) and the fixed ring (7), and the support column is used to connect the first insulating box (6) and the fixed ring (7); Mounting frame (37), the mounting frame (37) is located on the inner wall of the second insulating box (22) and is fixedly connected to the second insulating box (22); Motor (36), the motor (36) is located inside the second insulating box (22) and is fixedly connected to the mounting frame (37), and the motor (36) is connected to the conductive frame (20) through the third wire; Third rotating shaft (34), the third rotating shaft (34) is located on the right side of the mounting frame (37), and the third rotating shaft (34) is fixedly connected to the power output shaft of the motor (36); Second gear (35), the second gear (35) is fixedly installed on the third rotating shaft (34); First gear (27), the first gear (27) is located above the second gear (35) and meshes with the second gear (35); Second rotating shaft (28), the second rotating shaft (28) is fixedly installed on the first gear (27), and the second rotating shaft (28) is rotatably connected to the support column (43); Rotating ring (29), the rotating ring (29) is located inside the fixed ring (7) and is rotatably connected to the fixed ring (7); Tooth (33), a plurality of the teeth (33) are located inside the rotating ring (29) and are fixedly connected to the rotating ring (29), and the teeth (33) mesh with the first gear (27); Fan blade (30), the fan blade (30) is located inside the rotating ring (29), the fan blade (30) is fixedly connected to the third rotating shaft (34), and the fan blade (30) is used to accelerate air flow.

6. The soldering device for semiconductor production according to claim 5, characterized in that: Filter plate (31), the filter plate (31) is located inside the rotating ring (29) and is fixedly connected to the rotating ring (29), the filter plate (31) is an activated carbon filter plate (31), and the filter plate (31) is used to filter harmful gases; Connecting column (32), the connecting column (32) is located on the right side of the filter plate (31) and is fixedly connected to the filter plate (31); The energy storage box (8) is located on the right side of the filter plate (31).

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