A PCB board pre-baking device

Abstract

The invention belongs to the technical field of PCB processing, and specifically is a PCB pre-baking device, comprising a baking box, a heater is fixedly connected to the inner wall of the back of the baking box, a cabinet door is hingedly connected to the front end of the baking box, multiple groups of cylindrical pins and support blocks are fixedly connected to the inner sides of the baking box, a placing plate is rotatably connected to the inner wall of the baking box through the cylindrical pins, a cylinder is fixedly connected to the side wall of the baking box close to the heater, a telescopic rod of the cylinder penetrates the side wall of the baking box and is fixedly connected to a nozzle, multiple groups of nozzles are fixedly connected to the side wall of the nozzle, and a pumping mechanism is arranged on the side of the nozzle away from the cylinder. By arranging the nozzle and the pumping mechanism, during the baking process, the pumping mechanism pumps gas into the nozzle, and the gas is sprayed from the nozzle to the PCB board, so as to promote the gas flow in the baking box, which is beneficial to uniform heating of the PCB board, and further beneficial to avoid deformation of the PCB board due to uneven heating.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB board processing, in particular to a PCB board pre-baking device. Background Art

[0002] Printed circuit board, which we often call PCB board, is a carrier used to connect the circuits of various electronic components.

[0003] If the circuit board is left for too long, it will easily become damp and affect the use of the integrated circuit board. The circuit board needs to be baked before assembling components to reduce the risk of residual moisture and explosion.

[0004] At present, during the process of baking PCB boards, the PCB boards are generally placed in a baking oven and taken out after the PCB boards are baked. However, during the process of baking the PCB boards in the baking oven, on the one hand, the hot air in the baking oven cannot flow, and the PCB boards are easily heated unevenly and deformed. On the other hand, after baking, the temperature of the PCB boards is relatively high, and they need to be taken out after they are naturally cooled to avoid scalding the operators, resulting in a large amount of time waste, which is not conducive to improving the processing efficiency of the PCB boards.

[0005] To this end, the present invention provides a PCB board pre-baking device. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a PCB board pre-baking device described in the present invention includes a baking box, a heater is fixedly connected to the inner wall of the back of the baking box, a cabinet door is hinged at the front end of the baking box, multiple groups of cylindrical pins and support blocks are fixedly connected to both sides of the interior of the baking box, the inner wall of the baking box is rotatably connected to a placement plate through the cylindrical pins, the end of the placement plate away from the cylindrical pins is overlapped on the support block, a cylinder is fixedly connected to the side wall of the baking box close to the heater, a telescopic rod of the cylinder penetrates the side wall of the baking box and is fixedly connected to a nozzle, multiple groups of nozzles are fixedly connected to the side wall of the nozzle, and an air pumping mechanism is provided on the side of the nozzle away from the cylinder, and the air pumping mechanism is used to pump air into the nozzle.

[0008] Preferably, the air pumping mechanism includes a transverse tube and a delivery tube 2, the delivery tube 2 is fixedly connected to the top of the baking oven, the transverse tube is slidably connected to the side wall of the baking oven, one end of the transverse tube placed inside the baking oven is fixedly connected to the nozzle, one end of the transverse tube placed outside the baking oven is fixedly connected to the delivery tube 3, one end of the delivery tube 3 away from the transverse tube is fixedly connected to the delivery tube 2, one end of the delivery tube 2 away from the delivery tube 3 is fixedly connected to an air pump, an air inlet pipe of the air pump is fixedly connected to an electromagnetic three-way valve, an input end 1 of the electromagnetic three-way valve is fixedly connected to the delivery tube 1, and one end of the delivery tube 1 away from the electromagnetic three-way valve is provided with a drying component, and the drying component is used to dry the gas in the baking oven.

[0009] Preferably, the drying assembly comprises a drying box, the bottom of which is hollow and communicated with the interior of the baking oven, and a desiccant is placed on the inner bottom surface of the drying box.

[0010] Preferably, a plurality of sets of fixing plates are fixedly connected inside the baking oven, a pressing plate is slidably connected to the bottom of the fixing plate, a memory metal is fixedly connected inside the fixing plate, and the bottom of the memory metal is fixedly connected to the top of the pressing plate.

[0011] Preferably, a heat conducting sheet is fixedly connected to the side wall of the fixing plate.

[0012] Preferably, a track frame is fixedly connected to one end of the inner top wall of the baking oven near the heater, a push frame is slidably connected inside the track frame, and a top holding piece is provided at one end of the push frame near the placement plate, and the top holding piece is used to push the placement plate upward.

[0013] Preferably, a plurality of groups of springs 1 are fixedly connected to the side wall of the push rack at one end away from the cylinder, and one end of the spring 1 away from the push rack is fixedly connected to the inner wall of the baking oven.

[0014] Preferably, the supporting member includes a slide groove and a supporting block, the supporting block is slidably connected in the supporting block, a guide groove is provided on the side of the supporting block close to the pushing frame, the slide groove is provided on the side of the supporting block close to the pushing frame, a push rod is slidably connected in the slide groove, one end of the push rod close to the pushing frame is fixedly connected to the pushing frame, and the end of the push rod away from the pushing frame is slidably connected in the guide groove.

[0015] Preferably, the guide groove includes an oblique groove and a straight groove, both of which are formed on the side wall of the supporting block, and the oblique groove and the straight groove are interconnected, and the push rod is slidably connected in the oblique groove.

[0016] Preferably, the bottom of one end of the placement plate close to the support block is rotatably connected to a second spring, and the end of the second spring away from the placement plate is rotatably connected to the side wall of the support block.

[0017] The beneficial effects of the present invention are as follows:

[0018] The PCB board pre-baking device described in the present invention is provided with a nozzle and an air pumping mechanism. During the baking process, the air pumping mechanism pumps air into the nozzle, and the air is sprayed from the nozzle to the PCB board, so as to promote the gas flow in the baking box, which is beneficial to uniform heating of the PCB board, and further beneficial to avoiding deformation of the PCB board due to uneven heating. After the PCB board is baked, the heater stops heating, the cabinet door is opened, and the air pumping mechanism pumps external air in, and the pumped air is discharged to the PCB board through the nozzle, which is beneficial to the rapid cooling treatment of the PCB board, and further beneficial to reducing the cooling time of the PCB board and improving the processing efficiency of the PCB board.

[0019] The PCB board pre-baking device of the present invention is provided with an air cylinder. When the air pump mechanism pumps air into the nozzle, the telescopic rod of the air cylinder pulls the nozzle back and forth to move, which is conducive to the reciprocating movement of the gas from the nozzle to the PCB board, which is conducive to further promoting the uniform heating of the PCB board and further avoiding the deformation of the PCB board due to uneven heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] Figure 1 is a first viewing angle schematic diagram of the present invention;

[0022] Figure 2 is a second viewing angle schematic diagram of the present invention;

[0023] Figure 3 It is a front view of the present invention;

[0024] Figure 4 It is a schematic diagram of the partial structure of the baking oven of the present invention;

[0025] Figure 5 It is a schematic diagram of the partial structure of the drying box of the present invention;

[0026] Figure 6 It is a schematic diagram of a push frame of the present invention;

[0027] Figure 7 It is a schematic diagram of a fixing plate and a placement plate of the present invention;

[0028] Figure 8 It is a schematic diagram of the local structure of the fixing plate of the present invention;

[0029] Fig. 9 It is a schematic diagram of the connection between the push frame and the support block of the present invention;

[0030] Fig.10 It is a schematic diagram of the connection between the top holding block and the supporting block of the present invention.

[0031] In the figure: 1. oven; 2. cabinet door; 3. heater; 4. cylindrical pin; 5. placement plate; 6. support block; 7. nozzle; 8. nozzle; 9. cylinder; 10. drying box; 11. desiccant; 12. delivery pipe 1; 13. electromagnetic three-way valve; 14. air pump; 15. delivery pipe 2; 16. delivery pipe 3; 17. horizontal pipe; 18. fixing plate; 19. memory metal; 20. pressure plate; 21. track frame; 22. push frame; 23. spring 1; 24. slide groove; 25. push rod; 26. top holding block; 27. inclined groove; 28. straight groove; 29. ​​spring 2; 30. heat conducting sheet. DETAILED DESCRIPTION

[0032] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0033] Combination Figure 1 , Figure 2 and Figure 3 As shown, a PCB board pre-baking device described in an embodiment of the present invention comprises a baking box 1, a heater 3 is fixedly connected to the inner wall of the back of the baking box 1, a cabinet door 2 is hingedly connected to the front end of the baking box 1, multiple groups of cylindrical pins 4 and support blocks 6 are fixedly connected to both sides of the inside of the baking box 1, a placement plate 5 is rotatably connected to the inner wall of the baking box 1 through the cylindrical pins 4, and the end of the placement plate 5 away from the cylindrical pins 4 is overlapped on the support block 6, a cylinder 9 is fixedly connected to the side wall of the baking box 1 close to the heater 3, and a telescopic rod of the cylinder 9 passes through the side wall of the baking box 1 and is fixedly connected to a nozzle 7, and multiple groups of nozzles 8 are fixedly connected to the side wall of the nozzle 7, and a pumping mechanism is provided on the side of the nozzle 7 away from the cylinder 9, and the pumping mechanism is used to pump air into the nozzle 7; when working, when the PCB board is baked, the PCB board is first placed on the placement plate 5, and then the cabinet door 2 is closed, and the baking box 1 is started, and the heater 3 heats the inside of the baking box 1, and the PCB board is heated. The PCB board is baked. During the baking process, the air pumping mechanism pumps air into the nozzle 7, and the gas is sprayed from the nozzle 8 to the PCB board, which promotes the gas flow in the baking box 1, which is beneficial to the uniform heating of the PCB board, and further helps to avoid the deformation of the PCB board due to uneven heating. During the process of the air pumping mechanism pumping air into the nozzle 7, the telescopic rod of the cylinder 9 pulls the nozzle 7 back and forth to move, which is beneficial to the reciprocating movement of the gas from the nozzle 8 to the PCB board, which is beneficial to further promote the uniform heating of the PCB board, and further avoid the deformation of the PCB board due to uneven heating. After the PCB board is baked, the heater 3 stops heating, the cabinet door 2 is opened, and the air pumping mechanism pumps external air in, and continues to pull the nozzle 7 back and forth through the telescopic rod of the cylinder 9 to move, and the pumped air is discharged to the PCB board through the nozzle 8, which is beneficial to the rapid cooling treatment of the PCB board, and further helps to reduce the cooling time of the PCB board and improve the processing efficiency of the PCB board.

[0034] Combination Figure 2 and Figure 4 As shown, the air pump mechanism includes a transverse tube 17 and a second delivery tube 15, the second delivery tube 15 is fixedly connected to the top of the baking oven 1, the transverse tube 17 is slidably connected to the side wall of the baking oven 1, one end of the transverse tube 17 placed inside the baking oven 1 is fixedly connected to the nozzle 7, and one end of the transverse tube 17 placed outside the baking oven 1 is fixedly connected to a third delivery tube 16, and one end of the third delivery tube 16 away from the transverse tube 17 is fixedly connected to the second delivery tube 15, and one end of the second delivery tube 15 away from the third delivery tube 16 is fixedly connected to an air pump 14, an air inlet pipe of the air pump 14 is fixedly connected to an electromagnetic three-way valve 13, an input end of the electromagnetic three-way valve 13 is fixedly connected to a delivery tube 12, and one end of the delivery tube 12 away from the electromagnetic three-way valve 13 is provided with a drying component, which is used to dry the gas in the baking oven 1 During operation, when the PCB board is baked, the heater 3 heats the baking oven 1. During the baking process of the PCB board, the input end 1 of the electromagnetic three-way valve 13 is controlled to be connected with the output end, so that the delivery pipe 12 is connected with the air pump 14. Then the air pump 14 is started to make the air in the baking oven 1 pass through the drying component and enter the delivery pipe 12. The air in the baking oven 1 passes through the drying component, which is conducive to the absorption and removal of water vapor in the air in the baking oven 1. The dried air then passes through the electromagnetic three-way valve 13, the air pump 14, the delivery pipe 2 15, the delivery pipe 3 16 and the cross pipe 17 in sequence and then enters the nozzle 7, and is sprayed to the PCB board through the nozzle 8, so as to promote the circulation of hot air in the baking oven 1, which is conducive to uniform heating of the PCB board.

[0035] Combination Figure 4 and Figure 5 As shown, the drying assembly includes a drying box 10, the bottom of the drying box 10 is hollow and connected to the inside of the baking oven 1, and a desiccant 11 is placed on the inner bottom surface of the drying box 10; when working, after the air pump 14 is started, there is an air pressure difference between the delivery pipe 2 15 and the delivery pipe 1 12, so that the air in the baking oven 1 enters the drying box 10 and flows to the delivery pipe 1 12. In the process of the air in the baking oven 1 passing through the drying box 10, the desiccant 11 dries the air in the baking oven 1, which is beneficial to prevent the evaporated water vapor from being sprayed from the nozzle 8 to the PCB board again, thereby improving the drying effect of the PCB board.

[0036] Combination Figures 3 to 8 As shown, a plurality of sets of fixing plates 18 are fixedly connected to the inside of the baking oven 1, and a pressing plate 20 is slidably connected to the bottom of the fixing plate 18. A memory metal 19 is placed inside the fixing plate 18, and the bottom of the memory metal 19 is fixedly connected to the top of the pressing plate 20. When working, during the baking process of the PCB board, the fixing plate 18 is heated, so that the memory metal 19 extends, and the memory metal 19 pushes the pressing plate 20, which is beneficial to pressing and fixing the PCB board and preventing the PCB board from being deformed due to uneven heating.

[0037] Combination Figure 7 and Figure 8 As shown, a heat conductive sheet 30 is fixedly connected to the side wall of the fixed plate 18; during operation, through the setting of the heat conductive sheet 30, during the heating of the heater 3 and the baking of the PCB board, the heat conductive sheet 30 is conducive to quickly conducting heat to the inside of the fixed plate 18, which is conducive to promoting the rapid extension of the memory metal 19, and then the pressing plate 20 quickly fixes and presses the PCB board.

[0038] After the PCB board is baked, the air from the nozzle 8 is conducive to the heat conductive sheet 30 to take away the heat on the fixing plate 18, which is conducive to the recovery of the memory metal 19, thereby allowing the pressing plate 20 to quickly release the fixation of the PCB board.

[0039] Combination Figure 3 , Figure 4 and Figure 6 As shown, a track frame 21 is fixedly connected to one end of the inner top wall of the baking oven 1 near the heater 3, a push frame 22 is slidably connected inside the track frame 21, and a top holding piece is provided at one end of the push frame 22 near the placement plate 5, and the top holding piece is used to push the placement plate 5 upward; when working, after the PCB board is baked, the cabinet door 2 is opened, and the input end 2 of the electromagnetic three-way valve 13 is controlled to be connected with the air pump 14, and the air pump 14 pumps the external air into the delivery pipe 2 15 through the electromagnetic three-way valve 13, and then passes through the delivery pipe 3 16, the horizontal pipe 17, the nozzle 7 and The nozzle 8 sprays toward the PCB board to promote the cooling of the PCB board. During the heating and cooling process of the PCB board, the telescopic rod of the cylinder 9 drives the nozzle 7 to move back and forth between the push racks 22. After the PCB board is cooled, the cylinder 9 is controlled to increase the extension of the telescopic rod of the cylinder 9, so that the nozzle 8 contacts the push rack 22 and pushes the push rack 22 to move. During the movement of the push rack 22, the supporting member is driven to push the placement plate 5 upward, so that the placement plate 5 is tilted, which is conducive to the PCB board on the placement plate 5 to slide off and promote the PCB board to be taken out of the baking oven 1.

[0040] Combination Figure 3 , Figure 4 and Figure 6 As shown, a plurality of sets of springs 23 are fixedly connected to the side wall of the end of the push rack 22 away from the cylinder 9, and the end of the spring 23 away from the push rack 22 is fixedly connected to the inner wall of the baking oven 1; during operation, through the setting of the push rack 22, after the nozzle 8 stops contacting with the push rack 22, the push rack 22 is convenient to return to its initial state.

[0041] Combination Figure 3 , Fig. 9 and Fig.10As shown, the top holding member includes a slide groove 24 and a top holding block 26. The top holding block 26 is slidably connected in the support block 6. A guide groove is provided on the side of the top holding block 26 close to the push frame 22. The slide groove 24 is provided on the side of the support block 6 close to the push frame 22. A push rod 25 is slidably connected in the slide groove 24. One end of the push rod 25 close to the push frame 22 is fixedly connected to the push frame 22, and the end of the push rod 25 away from the push frame 22 is slidably connected in the guide groove. During operation, during the movement of the push frame 22, the push frame 22 drives the push rod 25 to slide in the slide groove 24. During the sliding of the push rod 25, the top holding block 26 is pushed upward through the guide groove, so that the top holding block 26 lifts the placement board 5, which is convenient for taking out the PCB board.

[0042] Combination Fig. 9 and Fig.10 As shown, the guide groove includes an inclined groove 27 and a straight groove 28, both of which are opened on the side wall of the supporting block 26, and the inclined groove 27 and the straight groove 28 are connected to each other, and the push rod 25 is slidably connected in the inclined groove 27; during operation, during the movement of the push frame 22, the push frame 22 drives the push rod 25 to slide in the inclined groove 27, so that the supporting block 26 moves upward to lift the placement plate 5, and when the push rod 25 slides into the straight groove 28, the supporting block 26 no longer moves upward.

[0043] Combination Figure 3 and Figure 7 As shown, the bottom of one end of the placement plate 5 close to the support block 6 is rotatably connected to a spring 29, and the end of the spring 29 away from the placement plate 5 is rotatably connected to the side wall of the support block 6; during operation, through the setting of the spring 29, after the PCB board is taken out from the placement plate 5, it is helpful to pull the placement plate 5 back to its initial state.

[0044] Working principle: When the PCB board is baked, the heater 3 heats the inside of the baking box 1, controls the input end 1 of the electromagnetic three-way valve 13 to be connected with the output end, so that the delivery pipe 12 is connected with the air pump 14.

[0045] Then, the air pump 14 is started, so that the air in the baking oven 1 passes through the drying box 10 and then enters the delivery pipe 12. During the process of the air in the baking oven 1 passing through the drying box 10, the desiccant 11 dries the air in the baking oven 1, which is beneficial to absorb and remove the water vapor in the air in the baking oven 1, and is beneficial to prevent the evaporated water vapor from being sprayed from the nozzle 8 to the PCB board again.

[0046] The dried air then passes through the electromagnetic three-way valve 13, the air pump 14, the second delivery pipe 15, the third delivery pipe 16 and the horizontal pipe 17 in sequence, enters the nozzle 7, and is sprayed toward the PCB board through the nozzle 8, thereby promoting the circulation of hot air in the baking oven 1 and facilitating uniform heating of the PCB board.

[0047] During the baking process of the PCB board, the telescopic rod of the cylinder 9 pulls the nozzle 7 back and forth to move, which is conducive to the reciprocating movement of the gas from the nozzle 8 to the PCB board, which is conducive to further promoting uniform heating of the PCB board and avoiding deformation of the PCB board due to uneven heating.

[0048] After the PCB board is baked, the cabinet door 2 is opened, and the input end 2 of the electromagnetic three-way valve 13 is controlled to be connected with the air pump 14. The air pump 14 pumps the external air into the delivery pipe 2 15 through the electromagnetic three-way valve 13, and then passes through the delivery pipe 3 16, the horizontal pipe 17, the nozzle 7 and the nozzle 8 in sequence to spray to the PCB board, so as to promote the cooling of the PCB board. The nozzle 7 is driven by the telescopic rod of the cylinder 9 to move back and forth between the push racks 22, which is conducive to promoting the cooling of the PCB board.

[0049] After the PCB board is cooled down, the cylinder 9 is controlled so that the telescopic rod of the cylinder 9 increases its extension, so that the nozzle 8 contacts the push frame 22 and pushes the push frame 22 to move. The push frame 22 drives the push rod 25 to slide in the inclined groove 27, so that the supporting block 26 moves upward, and the placement plate 5 is lifted up, so that the placement plate 5 is tilted, which is conducive to the PCB board on the placement plate 5 to slide down, and promotes the PCB board to be taken out of the baking oven 1.

[0050] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A PCB board pre-baking device, characterized in that: The invention comprises a baking oven (1), wherein a heater (3) is fixedly connected to the inner wall at the back of the baking oven (1), a cabinet door (2) is hingedly connected to the front end of the baking oven (1), multiple groups of cylindrical pins (4) and support blocks (6) are fixedly connected to both sides of the interior of the baking oven (1), a placement plate (5) is rotatably connected to the inner wall of the baking oven (1) through the cylindrical pins (4), an end of the placement plate (5) away from the cylindrical pins (4) is overlapped on the support block (6), a cylinder (9) is fixedly connected to the side wall of the baking oven (1) close to the heater (3), a telescopic rod of the cylinder (9) passes through the side wall of the baking oven (1) and is fixedly connected to a nozzle (7), multiple groups of nozzles (8) are fixedly connected to the side wall of the nozzle (7), and a pumping mechanism is provided on the side of the nozzle (7) away from the cylinder (9), and the pumping mechanism is used to pump air into the nozzle (7); A track frame (21) is fixedly connected to one end of the inner top wall of the baking oven (1) close to the heater (3), a push frame (22) is slidably connected inside the track frame (21), and a supporting member is provided at one end of the push frame (22) close to the placement plate (5), and the supporting member is used to push the placement plate (5) upward; A plurality of groups of springs (23) are fixedly connected to the side wall of the push frame (22) at one end away from the cylinder (9); and an end of the spring (23) away from the push frame (22) is fixedly connected to the inner wall of the baking box (1); The supporting member comprises a slide groove (24) and a supporting block (26), the supporting block (26) being slidably connected in the support block (6), a guide groove being provided on a side of the supporting block (26) close to the push frame (22), the slide groove (24) being provided on a side of the support block (6) close to the push frame (22), a push rod (25) being slidably connected in the slide groove (24), one end of the push rod (25) close to the push frame (22) being fixedly connected to the push frame (22), and one end of the push rod (25) away from the push frame (22) being slidably connected in the guide groove; The guide groove comprises an inclined groove (27) and a straight groove (28), both of which are formed on the side wall of the supporting block (26), and the inclined groove (27) and the straight groove (28) are interconnected, and the push rod (25) is slidably connected in the inclined groove (27).

2. A PCB board pre-baking device according to claim 1, characterized in that: The gas pump mechanism comprises a transverse tube (17) and a second delivery tube (15), wherein the second delivery tube (15) is fixedly connected to the top of the baking oven (1), the transverse tube (17) is slidably connected to the side wall of the baking oven (1), one end of the transverse tube (17) disposed inside the baking oven (1) is fixedly connected to the nozzle (7), one end of the transverse tube (17) disposed outside the baking oven (1) is fixedly connected to a third delivery tube (16), one end of the third delivery tube (16) away from the transverse tube (17) is fixedly connected to the second delivery tube (15), one end of the second delivery tube (15) away from the third delivery tube (16) is fixedly connected to an air pump (14), an air inlet pipe of the air pump (14) is fixedly connected to an electromagnetic three-way valve (13), an input end of the electromagnetic three-way valve (13) is fixedly connected to the first delivery tube (12), and one end of the first delivery tube (12) away from the electromagnetic three-way valve (13) is provided with a drying component, the drying component being used to dry the gas in the baking oven (1).

3. A PCB board pre-baking device according to claim 2, characterized in that: The drying assembly comprises a drying box (10), the bottom of the drying box (10) is hollow and communicates with the interior of the baking oven (1), and a desiccant (11) is placed on the inner bottom surface of the drying box (10).

4. A PCB board pre-baking device according to claim 1, characterized in that: A plurality of sets of fixed plates (18) are fixedly connected to the interior of the baking oven (1), a pressing plate (20) is slidably connected to the bottom of the fixed plate (18), a memory metal (19) is fixedly connected inside the fixed plate (18), and the bottom of the memory metal (19) is fixedly connected to the top of the pressing plate (20).

5. A PCB board pre-baking device according to claim 4, characterized in that: A heat conducting sheet (30) is fixedly connected to the side wall of the fixing plate (18).

6. A PCB board pre-baking device according to claim 1, characterized in that: The bottom of one end of the placement plate (5) close to the support block (6) is rotatably connected to a second spring (29), and the end of the second spring (29) away from the placement plate (5) is rotatably connected to the side wall of the support block (6).

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