High-temperature-resistant phenolic epoxy industrial coating and preparation method thereof

Abstract

The present application relates to the field of phenolic epoxy industrial paint, especially to a kind of high-temperature-resistant phenolic epoxy industrial paint, component one and component two, wherein the weight ratio of component one and component two when proportioning is (8-10) ∶1.In the present application, when using the present phenolic epoxy industrial paint, the user can mix component one and component two to prepare, and then it can be brushed, so that the industrial equipment can be protected by phenolic epoxy industrial paint, the heat resistance of the paint can be improved by adding heat-resistant modifier, and the heat resistance is further improved by adding active curing agent, talcum powder and mica powder, so that various industrial equipment can be better protected.

Description

Technical Field

[0001] This invention relates to the field of phenolic epoxy industrial coatings, and more particularly to a high-temperature resistant phenolic epoxy industrial coating. Background Technology

[0002] Phenolic epoxy industrial coatings are high-performance coatings primarily used for corrosion protection and corrosion prevention in industrial applications. They are mainly composed of phenolic resin and epoxy resin. These resins cross-link and cure through a chemical reaction, forming a tough coating. Phenolic epoxy industrial coatings possess excellent weather resistance, corrosion resistance, abrasion resistance, and chemical resistance. They effectively protect equipment, pipelines, and other industrial facilities from corrosion, abrasion, and chemical damage. Phenolic epoxy industrial coatings are widely used in petroleum, chemical, power, shipbuilding, and pharmaceutical industries. They can be used for surface treatment of various equipment and facilities, such as pipelines, storage tanks, reaction vessels, and boilers.

[0003] The long-term heat resistance of phenolic epoxy industrial coatings generally does not exceed 200℃. At higher temperatures, they will gradually exhibit discoloration, chalking, and other phenomena, affecting their anti-corrosion and protective properties. Furthermore, phenolic epoxy industrial coatings are relatively brittle, prone to cracking, and have poor adaptability to substrate deformation, making them susceptible to cracking or peeling. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-temperature resistant phenolic epoxy industrial coating and its preparation method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-temperature resistant phenolic epoxy industrial coating comprises component one and component two, wherein the weight ratio of component one to component two in the formulation is (8-10):1; component one comprises the following components by weight: 20-30 parts of p-phenylphenolic resin, 20-30 parts of bisphenol A type epoxy resin E-51, 2-5 parts of solvent, 1-3 parts of iron oxide red, 15-25 parts of talc powder, 15-25 parts of mica powder, and 1-2 parts of carbon black; component two comprises the following components by weight: 50-100 parts of active curing agent, 20-30 parts of bisphenol A type epoxy resin E-51, 10-15 parts of diluent, 5-10 parts of heat-resistant modifier, 3-5 parts of VOK-XK-406C, 3-5 parts of polydimethylsiloxane, 2-5 parts of polyether modified polyurethane leveling agent, 5-10 parts of nano-rubber particles, and 5-10 parts of solvent.

[0007] Furthermore, preferably, the solvent is prepared from acetone and xylene, wherein the weight ratio of acetone to xylene is (1-3):1.

[0008] Furthermore, preferably, the diluent is prepared from propylene glycidyl ether and polyester modified acrylate, wherein the weight ratio of propylene glycidyl ether to polyester modified acrylate is (1-3):(2-4).

[0009] In addition, preferably, the heat-resistant modifier is prepared from nano-oxide, polymethyl methacrylate and graphene, wherein the weight ratio of nano-oxide, polymethyl methacrylate and graphene is (2-3):(2-3):7.

[0010] Furthermore, preferably, the active curing agent is prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride, wherein the weight ratio of phenol-formaldehyde amine and tetrahydrophthalic anhydride is 1:1.

[0011] A method for preparing a high-temperature resistant phenolic epoxy industrial coating includes the following steps:

[0012] S1: Preparation of component one:

[0013] a: Pour 20-30 parts of p-phenylphenolic resin and 20-30 parts of bisphenol A type epoxy resin E-51 into a heating and stirring furnace and heat and stir.

[0014] b: Continue stirring in the heating and stirring furnace for 1 hour. After the heating and stirring are completed, remove the material and let it cool to room temperature.

[0015] c: After it cools to room temperature, pour it into a grinding mixer and add 15-25 parts of talc powder and 15-25 parts of mica powder and grind and mix for 1.5 hours;

[0016] d: After grinding and stirring are completed, take out the material and add 2-5 parts of solvent, 1-2 parts of carbon black and 1-3 parts of iron oxide red to the material and stir normally. After stirring evenly, the preparation of component one is complete.

[0017] S2: Preparation of component two;

[0018] a: Pour 20-30 parts of bisphenol A type epoxy resin E-51, 10-15 parts of diluent, 5-10 parts of heat-resistant modifier, 3-5 parts of VOK-XK-406C, 3-5 parts of polydimethylsiloxane, 2-5 parts of polyether modified polyurethane leveling agent, and 5-10 parts of nano-rubber particles into a vacuum mixer and mix for 30 minutes.

[0019] b: After mixing, remove the above materials and add 5-10 parts of solvent to them for mixing;

[0020] c: After mixing, add 50-100 parts of active curing agent, and heat and stir for 2 hours at a stirring rate of 100-120 r / min and a stirring temperature of 200-300℃;

[0021] d: After stirring, the preparation of component two is complete;

[0022] S3: Mix component one and component two together and it is ready to use.

[0023] Furthermore, preferably, when the p-phenylphenolic resin and bisphenol A type epoxy resin E-51 are stirred in a heating and stirring furnace, the stirring temperature is 50-60℃ and the stirring rate is 150-200 r / min.

[0024] Furthermore, preferably, a 300-500 mesh grinding device is used for grinding and stirring.

[0025] Furthermore, preferably, the temperature inside the vacuum mixer is 20-40°C, and the vacuum degree is -0.09MPa to -0.1MPa.

[0026] The beneficial effects of this invention are as follows: When using this phenolic epoxy industrial coating, the user can mix component one and component two to prepare the coating, and then brush it on. This allows the industrial equipment to be protected by the phenolic epoxy industrial coating. The heat-resistant modifier added to the coating can improve its heat resistance, and the addition of active curing agent, talc powder and mica powder further improves its heat resistance, making it less likely to peel off when heated, thus better protecting various industrial equipment. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0028] Example 1:

[0029] A high-temperature resistant phenolic epoxy industrial coating comprises component one and component two, wherein the weight ratio of component one to component two during mixing is 8:1. Component one comprises the following components by weight: 20 parts of p-phenylphenolic resin, 20 parts of bisphenol A type epoxy resin E-51, 2 parts of solvent, 1 part of iron oxide red, 15 parts of talc powder, 15 parts of mica powder, and 1 part of carbon black. Component two comprises the following components by weight: 50 parts of active curing agent, 20 parts of bisphenol A type epoxy resin E-51, 10 parts of diluent, 5 parts of heat-resistant modifier, 3 parts of VOK-XK-406C, 3 parts of polydimethylsiloxane, 2 parts of polyether-modified polyurethane leveling agent, 5 parts of nano-rubber particles, and 5 parts of solvent.

[0030] The solvent is prepared from acetone and xylene, with a weight ratio of acetone to xylene of 1:1. The solvent prepared from acetone and xylene can dissolve a variety of resins and polymers, which is beneficial for the formation and curing of the coating film.

[0031] The diluent is prepared from propylene glycidyl ether and polyester-modified acrylate, with a weight ratio of propylene glycidyl ether to polyester-modified acrylate of 1:2. The diluent prepared from propylene glycidyl ether and polyester-modified acrylate has good stability and a certain degree of environmental friendliness.

[0032] The heat-resistant modifier is prepared from nano-oxides, polymethyl methacrylate (PMMA), and graphene, with a weight ratio of 2:2:7. This heat-resistant modifier, composed of nano-oxides, PMMA, and graphene, improves the heat resistance of the phenolic epoxy coating in this technical solution, broadening its application scenarios and making it less prone to peeling off at high temperatures.

[0033] The active curing agent is prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride, with a weight ratio of phenol-formaldehyde amine to tetrahydrophthalic anhydride of 1:1. The active curing agent prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride exhibits high stability and good curing effect, thus facilitating brush coating by users.

[0034] A method for preparing a high-temperature resistant phenolic epoxy industrial coating includes the following steps:

[0035] S1: Preparation of component one:

[0036] a: Pour 20 parts of p-phenylphenolic resin and 20 parts of bisphenol A type epoxy resin E-51 into a heating and stirring furnace and heat and stir.

[0037] b: Continue stirring in the heating and stirring furnace for 1 hour. After the heating and stirring are completed, remove the material and let it cool to room temperature.

[0038] c: After it cools to room temperature, pour it into a grinding mixer and add 15 parts talc powder and 15 parts mica powder and grind and mix for 1.5 hours;

[0039] d: After grinding and stirring are completed, take out the material and add 2 parts solvent, 1 part carbon black and 1 part iron oxide red to the material and stir normally. After stirring evenly, the preparation of component one is complete.

[0040] S2: Preparation of component two;

[0041] a: Pour 20 parts of bisphenol A type epoxy resin E-51, 10 parts of diluent, 5 parts of heat-resistant modifier, 3 parts of VOK-XK-406C, 3 parts of polydimethylsiloxane, 2 parts of polyether modified polyurethane leveling agent and 5 parts of nano-rubber particles into a vacuum mixer and mix for 30 minutes.

[0042] b: After mixing, remove the above materials and add 5 parts of solvent to them for mixing;

[0043] c: After mixing, add 50 parts of active curing agent and heat and stir for 2 hours at a stirring rate of 100 r / min and a stirring temperature of 200℃.

[0044] d: After stirring, the preparation of component two is complete;

[0045] S3: Mix component one and component two together and it is ready to use.

[0046] When p-phenylphenolic resin and bisphenol A type epoxy resin E-51 are stirred in a heating and stirring furnace, the stirring temperature is 50℃ and the stirring rate is 150r / min.

[0047] A 300-mesh grinding device is used for grinding and mixing.

[0048] The temperature inside the vacuum mixer is 20℃, and the vacuum level is -0.09MPa.

[0049] Example 2:

[0050] A high-temperature resistant phenolic epoxy industrial coating comprises component one and component two, wherein the weight ratio of component one to component two during formulation is 9:1. Component one comprises the following components by weight: 25 parts of p-phenylphenolic resin, 25 parts of bisphenol A type epoxy resin E-51, 3 parts of solvent, 2 parts of iron oxide red, 20 parts of talc powder, 20 parts of mica powder, and 1 part of carbon black. Component two comprises the following components by weight: 75 parts of active curing agent, 25 parts of bisphenol A type epoxy resin E-51, 12 parts of diluent, 7 parts of heat-resistant modifier, 4 parts of VOK-XK-406C, 4 parts of polydimethylsiloxane, 3 parts of polyether-modified polyurethane leveling agent, 7 parts of nano-rubber particles, and 7 parts of solvent.

[0051] The solvent is prepared from acetone and xylene, with a weight ratio of acetone to xylene of 2:1. The solvent prepared from acetone and xylene can dissolve a variety of resins and polymers, which is beneficial for the formation and curing of the coating film.

[0052] The diluent is prepared from propylene glycidyl ether and polyester-modified acrylate, with a weight ratio of propylene glycidyl ether to polyester-modified acrylate of 2:3. The diluent prepared from propylene glycidyl ether and polyester-modified acrylate has good stability and a certain degree of environmental friendliness.

[0053] The heat-resistant modifier is prepared from nano-oxides, polymethyl methacrylate (PMMA), and graphene, with a weight ratio of 2:2:7. This heat-resistant modifier, composed of nano-oxides, PMMA, and graphene, improves the heat resistance of the phenolic epoxy coating in this technical solution, broadening its application scenarios and making it less prone to peeling off at high temperatures.

[0054] The active curing agent is prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride, with a weight ratio of phenol-formaldehyde amine to tetrahydrophthalic anhydride of 1:1. The active curing agent prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride exhibits high stability and good curing effect, thus facilitating brush coating by users.

[0055] A method for preparing a high-temperature resistant phenolic epoxy industrial coating includes the following steps:

[0056] S1: Preparation of component one:

[0057] a: Pour 25 parts of p-phenylphenolic resin and 25 parts of bisphenol A type epoxy resin E-51 into a heating and stirring furnace and heat and stir.

[0058] b: Continue stirring in the heating and stirring furnace for 1 hour. After the heating and stirring are completed, remove the material and let it cool to room temperature.

[0059] c: After it cools to room temperature, pour it into a grinding mixer and add 20 parts talc powder and 20 parts mica powder and grind and mix for 1.5 hours;

[0060] d: After grinding and stirring are completed, take out the material and add 3 parts solvent, 1 part carbon black and 2 parts iron oxide red to the material and stir normally. After stirring evenly, the preparation of component one is complete.

[0061] S2: Preparation of component two;

[0062] a: Pour 25 parts of bisphenol A type epoxy resin E-51, 12 parts of diluent, 7 parts of heat-resistant modifier, 4 parts of VOK-XK-406C, 4 parts of polydimethylsiloxane, 3 parts of polyether modified polyurethane leveling agent and 7 parts of nano-rubber particles into a vacuum mixer and mix for 30 minutes.

[0063] b: After mixing, remove the above materials and add 7 parts of solvent to them for mixing;

[0064] c: After mixing, add 75 parts of active curing agent and heat and stir for 2 hours at a stirring rate of 110 r / min and a stirring temperature of 250℃.

[0065] d: After stirring, the preparation of component two is complete;

[0066] S3: Mix component one and component two together and it is ready to use.

[0067] When p-phenylphenolic resin and bisphenol A type epoxy resin E-51 are stirred in a heating and stirring furnace, the stirring temperature is 55℃ and the stirring rate is 175r / min.

[0068] Among them, a 400-mesh grinding device is used for grinding and stirring.

[0069] The temperature inside the vacuum mixer is 30℃, and the vacuum level is -0.095MPa.

[0070] Example 3:

[0071] A high-temperature resistant phenolic epoxy industrial coating comprises component one and component two, wherein the weight ratio of component one to component two during formulation is 10:1. Component one comprises the following components by weight: 30 parts of p-phenylphenolic resin, 30 parts of bisphenol A type epoxy resin E-51, 5 parts of solvent, 3 parts of iron oxide red, 25 parts of talc powder, 25 parts of mica powder, and 2 parts of carbon black. Component two comprises the following components by weight: 100 parts of active curing agent, 30 parts of bisphenol A type epoxy resin E-51, 15 parts of diluent, 10 parts of heat-resistant modifier, 5 parts of VOK-XK-406C, 5 parts of polydimethylsiloxane, 5 parts of polyether-modified polyurethane leveling agent, 10 parts of nano-rubber particles, and 10 parts of solvent.

[0072] The solvent is prepared from acetone and xylene, with a weight ratio of 3:1. The solvent prepared from acetone and xylene can dissolve a variety of resins and polymers, which is beneficial for the formation and curing of the coating film.

[0073] The diluent is prepared from propylene glycidyl ether and polyester-modified acrylate, with a weight ratio of propylene glycidyl ether to polyester-modified acrylate of 3:4. The diluent prepared from propylene glycidyl ether and polyester-modified acrylate has good stability and a certain degree of environmental friendliness.

[0074] The heat-resistant modifier is prepared from nano-oxides, polymethyl methacrylate (PMMA), and graphene, with a weight ratio of 3:3:7. This heat-resistant modifier, composed of nano-oxides, PMMA, and graphene, improves the heat resistance of the phenolic epoxy coating in this technical solution, broadening its application scenarios and making it less prone to peeling off at high temperatures.

[0075] The active curing agent is prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride, with a weight ratio of phenol-formaldehyde amine to tetrahydrophthalic anhydride of 1:1. The active curing agent prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride exhibits high stability and good curing effect, thus facilitating brush coating by users.

[0076] A method for preparing a high-temperature resistant phenolic epoxy industrial coating includes the following steps:

[0077] S1: Preparation of component one:

[0078] a: Pour 30 parts of p-phenylphenolic resin and 30 parts of bisphenol A type epoxy resin E-51 into a heating and stirring furnace and heat and stir.

[0079] b: Continue stirring in the heating and stirring furnace for 1 hour. After the heating and stirring are completed, remove the material and let it cool to room temperature.

[0080] c: After it cools to room temperature, pour it into a grinding mixer and add 25 parts talc powder and 25 parts mica powder and grind and mix for 1.5 hours;

[0081] d: After grinding and stirring are completed, take out the material and add 5 parts solvent, 2 parts carbon black and 3 parts iron oxide red to the material and stir normally. After stirring evenly, the preparation of component one is complete.

[0082] S2: Preparation of component two;

[0083] a: Pour 30 parts of bisphenol A type epoxy resin E-51, 15 parts of diluent, 10 parts of heat-resistant modifier, 5 parts of VOK-XK-406C, 5 parts of polydimethylsiloxane, 5 parts of polyether modified polyurethane leveling agent and 10 parts of nano-rubber particles into a vacuum mixer and mix for 30 minutes.

[0084] b: After mixing, remove the above materials and add 10 parts of solvent to them for mixing;

[0085] c: After mixing, add 100 parts of active curing agent and heat and stir for 2 hours at a stirring rate of 120 r / min and a stirring temperature of 300℃.

[0086] d: After stirring, the preparation of component two is complete;

[0087] S3: Mix component one and component two together and it is ready to use.

[0088] When p-phenylphenolic resin and bisphenol A type epoxy resin E-51 are stirred in a heating and stirring furnace, the stirring temperature is 60℃ and the stirring rate is 200r / min.

[0089] A 500-mesh grinding device is used for grinding and mixing.

[0090] The temperature inside the vacuum mixer is 40℃, and the vacuum level is -0.1MPa.

[0091] In this invention, the solvent prepared from acetone and xylene can dissolve a variety of resins and polymers, which is beneficial for the formation and curing of the coating film.

[0092] Furthermore, diluents prepared from propylene-based glycidyl ether and polyester-modified acrylates exhibit good stability and a certain degree of environmental friendliness.

[0093] Furthermore, the heat-resistant modifier prepared from nano-oxides, polymethyl methacrylate, and graphene can improve the heat resistance of the phenolic epoxy coating in this technical solution, thereby broadening its application scenarios and making it less prone to peeling off at high temperatures. The active curing agent prepared from phenol-formaldehyde-amine and tetrahydrophthalic anhydride has high stability and good curing effect, thus facilitating brush application by users.

[0094] Furthermore, in Component 1, the phenylphenolic resin and bisphenol A type epoxy resin E-51 can be mixed together using a heated stirring furnace, and the fineness of the filler can be increased during mixing using a grinding mixer. In Component 2, the vacuum stirrer allows for thorough mixing of bisphenol A type epoxy resin E-51 with various modifying agents, thereby improving the various properties of bisphenol A type epoxy resin E-51.

[0095] In this invention, when using this phenolic epoxy industrial coating, the user can mix component one and component two to prepare the coating, and then brush it on. This allows the industrial equipment to be protected by the phenolic epoxy industrial coating. The heat-resistant modifier added to the coating can improve its heat resistance, and the addition of active curing agent, talc powder and mica powder further improves its heat resistance, making it less prone to peeling off when heated, thus better protecting various industrial equipment.

[0096] Three phenolic epoxy industrial coatings from Examples 1-3 were selected for coating tests. The surfaces of industrial equipment were used as the coating surfaces. The experiments were conducted indoors, ensuring ventilation of the coating surfaces. The three coatings were spaced 1.2-1.5m apart, and rainwater was prevented from directly entering the room. Direct sunlight was avoided on the coating surfaces. The experimental temperature was maintained at 20℃-25℃. The final test results are shown in the table below (where surfaces A, B, and C are the phenolic epoxy industrial coatings used in this example, and surface D is a commonly available phenolic epoxy industrial coating):

[0097] The table below is a comparison table of paint surface performance.

[0098]

[0099]

[0100] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-temperature resistant phenolic epoxy industrial coating, comprising component one and component two, wherein the weight ratio of component one and component two in the formulation is (8-10):1; The first component comprises the following components by weight: 20-30 parts of p-phenylphenolic resin, 20-30 parts of bisphenol A type epoxy resin E-51, 2-5 parts of solvent, 1-3 parts of iron oxide red, 15-25 parts of talc powder, 15-25 parts of mica powder, and 1-2 parts of carbon black. Component two comprises the following proportions by weight: 50-100 parts of active curing agent, 20-30 parts of bisphenol A type epoxy resin E-51, 10-15 parts of diluent, 5-10 parts of heat-resistant modifier, 3-5 parts of VOK-XK-406C, 3-5 parts of polydimethylsiloxane, 2-5 parts of polyether modified polyurethane leveling agent, 5-10 parts of nano rubber particles, and 5-10 parts of solvent; The heat-resistant modifier is prepared from nano-oxide, polymethyl methacrylate and graphene, wherein the weight ratio of nano-oxide, polymethyl methacrylate and graphene is (2-3):(2-3):7; The active curing agent is prepared from phenol-formaldehyde amine and tetrahydrophthalic anhydride, wherein the weight ratio of phenol-formaldehyde amine to tetrahydrophthalic anhydride is 1:1; The diluent is prepared from propylene glycidyl ether and polyester modified acrylate, wherein the weight ratio of propylene glycidyl ether to polyester modified acrylate is (1-3):(2-4).

2. The high-temperature resistant phenolic epoxy industrial coating according to claim 1, characterized in that, The solvent is prepared from acetone and xylene, wherein the weight ratio of acetone to xylene is (1-3):

1.

3. A method for preparing a high-temperature resistant phenolic epoxy industrial coating according to any one of claims 1-2, comprising the following steps: S1: Preparation of component one: a: Pour 20-30 parts of p-phenylphenolic resin and 20-30 parts of bisphenol A type epoxy resin E-51 into a heating and stirring furnace and heat and stir. b: Stir continuously in the heating and stirring furnace for 1 hour. After heating and stirring are completed, remove the material and let it cool to room temperature. c: After it cools to room temperature, pour it into a grinding mixer and add 15-25 parts of talc powder and 15-25 parts of mica powder and grind and mix for 1.5 hours; d: After grinding and stirring are completed, take out the material and add 2-5 parts of solvent, 1-2 parts of carbon black and 1-3 parts of iron oxide red to the material and stir normally. After stirring evenly, the preparation of component one is complete. S2: Preparation of component two; a: Pour 20-30 parts of bisphenol A type epoxy resin E-51, 10-15 parts of diluent, 5-10 parts of heat-resistant modifier, 3-5 parts of VOKXK-406C, 3-5 parts of polydimethylsiloxane, 2-5 parts of polyether modified polyurethane leveling agent and 5-10 parts of nano rubber particles into a vacuum mixer and mix for 30 minutes; b: After mixing, remove the above materials and add 5-10 parts of solvent to them for mixing; c: After mixing, add 50-100 parts of active curing agent, and heat and stir for 2 hours at a stirring rate of 100-120 r / min and a stirring temperature of 200-300℃; d: After stirring, the preparation of component two is complete; S3: Mix component one and component two together and it is ready to use.

4. The method for preparing a high-temperature resistant phenolic epoxy industrial coating according to claim 3, characterized in that, When the p-phenylphenolic resin and bisphenol A type epoxy resin E-51 are stirred in a heating and stirring furnace, the stirring temperature is 50-60℃ and the stirring rate is 150-200r / min.

5. The method for preparing a high-temperature resistant phenolic epoxy industrial coating according to claim 3, characterized in that, The grinding and stirring process uses a 300-500 mesh grinding device.

6. The method for preparing a high-temperature resistant phenolic epoxy industrial coating according to claim 3, characterized in that, The temperature inside the vacuum mixer is 20-40℃, and the vacuum degree is -0.09MPa to -0.1MPa.

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