Chip integrated optical buffer and method of operation thereof

Abstract

The application relates to the technical field of chip integrated optoelectronic devices, in particular to a chip integrated optical buffer and a working method thereof. The chip integrated optical buffer comprises an optical waveguide device for inputting and outputting optical signals; a micro-ring resonant cavity capable of resonating at a specified resonant frequency; and an optical loop, which is located in two different directions of the micro-ring resonant cavity and is coupled with the micro-ring resonant cavity. The chip integrated optical buffer and the working method thereof provided by the application realize the optical switch function through the regulation of the resonant frequency of the micro-ring resonant cavity, realize power exchange between the micro-ring resonant cavity and the optical loop by using the mode coupling principle, the two do not contact, the micro-ring resonant cavity does not need to be directly connected into the optical loop, the influence of the optical switch on the optical loop loss is greatly reduced, and the storage time of the chip integrated optical buffer is improved.

Description

Technical Field

[0001] This invention relates to the field of chip-integrated optoelectronic device technology, and in particular to a chip-integrated optical buffer and its working method. Background Technology

[0002] An optical buffer stores an input optical signal in an optical storage medium. After a period of storage, the signal can be output as needed. During storage and output, the information loaded onto the optical signal is preserved; this information typically pertains to the amplitude, phase, and polarization degrees of freedom of the light. Optical buffers have important applications in optical communication and optical networks and are also key functional units in optical quantum information technology.

[0003] There are two main technical approaches to implementing optical buffers: The first approach uses atomic or ionic ensembles as the optical storage medium. The optical buffer function is achieved through the interaction between light and these ensembles. The physical mechanisms underlying this approach include electromagnetic induction transparency, photon echo, non-resonant Faraday interaction, and Raman storage. However, these approaches often face challenges such as ultra-low temperature operation, narrow bandwidth, high storage loss, and strong interference from fluorescent or spontaneous Raman scattering photons. Currently, they are still in the basic research stage and difficult to apply practically. The second approach uses low-loss optical transmission channels as the optical storage medium. These channels are combined with optical switches to form a loop. The storage and retrieval of optical signals are achieved by controlling the state of the optical switches. Common optical transmission channels used in this approach include free-space optical paths and single-mode fibers. The principle is simple and direct, and the technology is relatively mature. However, it places very high demands on the performance of the optical transmission channel and the optical switch. The core issues in implementing this approach are twofold: first, how to effectively achieve low-loss storage and retrieval of optical signals from the optical loop; and second, how to reduce the loss of the optical loop. The challenge of chip integration using this technology lies in the limitation of on-chip waveguide losses in current integrated optical chips, which restricts the length of optical loops achievable on the chip. This limits the storage time of the optical buffer and places high demands on the speed of the optical switch. The physical process of storing and retrieving optical signals requires the single-turn optical delay provided by the optical loop to be much greater than the switching time of the optical switch, necessitating a sufficiently fast optical switch. However, in current optical switch technologies, high-speed optical switches often have significant insertion losses, introducing new losses into the optical loop and greatly impacting the performance of the optical buffer. Therefore, a new integration scheme for optical switches and optical loops is urgently needed to achieve higher-performance chip-integrated optical buffers. Summary of the Invention

[0004] This invention provides a chip-integrated optical buffer and its operating method to solve the problem of integrating high-speed, low-loss optical switches and ultra-low-loss optical loops, so as to realize a high-performance optical buffer based on the principle of the second type of technical route.

[0005] This invention provides a chip-integrated optical buffer, comprising:

[0006] Optical waveguide devices are used for inputting and outputting optical signals;

[0007] The microring resonator is capable of generating optical resonance at a specified resonant frequency. When the resonant frequency of the microring resonator does not coincide with the frequency of the input optical signal, the microring resonator is in a through state. When the resonant frequency of the microring resonator coincides with the frequency of the input optical signal, the microring resonator is in a cross state.

[0008] An optical loop and an optical waveguide device are located in two different directions of the micro-ring resonant cavity, and the optical loop and the optical waveguide device are coupled to the micro-ring resonant cavity.

[0009] According to the chip-integrated optical buffer provided in this application, the optical waveguide device, the micro-ring resonator and the optical loop are all in the same plane, and the optical loop and the optical waveguide device are coupled along different sides of the micro-ring resonator.

[0010] According to the chip-integrated optical buffer provided in this application, the optical waveguide device and the optical loop are both located in the same plane, and the optical waveguide device and the optical loop are coupled above or below the plane where the micro-ring resonator is located.

[0011] According to the chip-integrated optical buffer provided in this application, the optical waveguide device and the micro-ring resonator are both located in the same plane, and the optical waveguide device is coupled along one side of the micro-ring resonator, and the optical loop is coupled above or below the plane where the micro-ring resonator is located.

[0012] According to the chip-integrated optical buffer provided in this application, it further includes:

[0013] An electrode is disposed close to the microring resonant cavity and is used to change the resonant frequency of the microring resonant cavity.

[0014] According to the chip-integrated optical buffer provided in this application, it further includes:

[0015] A moving device, one end of which is connected to the micro-ring resonator and the other end of which is connected to the optical loop, is used to adjust the gap between the light guide edge of the micro-ring resonator and the optical loop, thereby adjusting the coupling strength between the micro-ring resonator and the optical loop.

[0016] According to the chip-integrated optical buffer provided in this application, the micro-ring resonant cavity includes: a ring structure formed by waveguides connected end to end;

[0017] The optical loop includes: a ring structure formed by connecting waveguides end to end, or the optical loop includes: a microdisk resonator.

[0018] According to the chip-integrated optical buffer provided in this application, the optical waveguide device includes any one of the following: thin-film lithium niobate waveguide, silicon waveguide, silicon nitride waveguide, silicon oxynitride waveguide, dimorphized silicon waveguide, tapered optical fiber, and D-shaped optical fiber.

[0019] According to the chip-integrated optical buffer provided in this application, the optical loop includes any one of the following: thin-film lithium niobate waveguide, silicon waveguide, silicon nitride waveguide, silicon oxynitride waveguide, dimorphized silicon waveguide, tapered optical fiber, and D-shaped optical fiber;

[0020] Alternatively, the optical loop may include any one of the following: a lithium niobate microdisk resonator, a magnesium fluoride microdisk resonator, a calcium fluoride microdisk resonator, and a silicon dioxide microdisk resonator.

[0021] The present invention also provides a method for operating a chip-integrated optical buffer, which is a method for operating a chip-integrated optical buffer according to an embodiment of the present invention, comprising:

[0022] The resonant frequency of the microring resonator is adjusted so that it does not coincide with the frequency of the optical signal to be input, and the microring resonator is in a direct-through state.

[0023] An optical signal is input through an optical waveguide device, and the resonant frequency of the micro-ring resonator is adjusted to be the same as the frequency of the input optical signal. The micro-ring resonator is in a crossover state, and the input optical signal enters the optical loop through the micro-ring resonator.

[0024] By adjusting the resonant frequency of the micro-ring resonator to not coincide with the frequency of the input optical signal, the micro-ring resonator is in a direct-through state, and the input optical signal circulates in the optical loop to store the optical signal.

[0025] The resonant frequency of the micro-ring resonator is adjusted to be the same as the frequency of the input optical signal. The micro-ring resonator is in a crossover state. The optical signal that is circulating in the optical loop enters the optical waveguide device through the micro-ring resonator and is output from the optical waveguide device.

[0026] This invention provides a chip-integrated optical buffer, comprising: an optical waveguide device, a microring resonant cavity, and an optical loop; the optical waveguide device is used for inputting and outputting optical signals; the microring resonant cavity is capable of oscillating at a specified resonant frequency, and when the resonant frequency of the microring resonant cavity does not coincide with the frequency of the input optical signal, the microring resonant cavity is in a through state; when the resonant frequency of the microring resonant cavity coincides with the frequency of the input optical signal, the microring resonant cavity is in a cross state; the optical loop and the optical waveguide device are located in two different directions of the microring resonant cavity, and the optical loop and the optical waveguide device are coupled to the microring resonant cavity respectively. This chip-integrated optical buffer achieves optical switching functionality by adjusting the resonant frequency of the microring resonant cavity. Power exchange is performed between the microring resonant cavity and the optical loop using mode coupling, without direct contact. Compared with existing optical switches based on Mach-Zehnder interferometers, the microring resonant cavity does not need to be directly connected to the optical loop, greatly reducing the impact of the optical switch on the optical loop loss and helping to improve the storage time of the chip-integrated optical buffer.

[0027] Furthermore, the chip-integrated optical buffer operation method provided by the present invention is based on the chip-integrated optical buffer operation method provided in the embodiments of the present invention, and therefore has the same advantages as above. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a top view of the chip-integrated optical buffer provided in Embodiment 1 of the present invention;

[0030] Figure 2 This is a schematic cross-sectional view of the chip-integrated optical buffer provided in Embodiment 1 of the present invention;

[0031] Figure 3 This is a top view of the chip-integrated optical buffer provided in Embodiment 2 of the present invention;

[0032] Figure 4 This is a schematic cross-sectional view of the chip-integrated optical buffer provided in Embodiment 2 of the present invention;

[0033] Figure 5 This is a top view of the chip-integrated optical buffer provided in Embodiment 3 of the present invention.

[0034] Figure 6This is a cross-sectional structural diagram of the chip-integrated optical buffer provided in Embodiment 3 of the present invention.

[0035] Figure label:

[0036] 1. Optical waveguide device; 2. Micro-ring resonator; 3. Optical loop; 4. Electrode; 5. Input terminal; 6. Output terminal. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0038] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0040] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0042] The following is combined with Figures 1-6 This invention describes a chip-integrated optical buffer. The chip-integrated optical buffer includes: an optical waveguide device 1, a micro-ring resonator 2, and an optical loop 3.

[0043] The optical waveguide device 1 is used for inputting and outputting optical signals. Specifically, the optical waveguide device 1 has an input terminal 5 and an output terminal 6. The input terminal 5 is used to input optical signals, and the output terminal 6 is used to output optical signals. The optical signal can be an optical pulse or a single-photon wave packet.

[0044] The micro-ring resonator 2 can undergo optical resonance at a specified resonant frequency. When the resonant frequency of the micro-ring resonator 2 does not coincide with the frequency of the input optical signal, the micro-ring resonator 2 is in a direct-through state. When the resonant frequency of the micro-ring resonator 2 coincides with the frequency of the input optical signal, the micro-ring resonator 2 is in a crossover state. Specifically, when the micro-ring resonator 2 is in a direct-through state (i.e., when the resonant frequency of the micro-ring resonator 2 does not coincide with the frequency of the input optical signal), the input optical signal cannot enter the micro-ring resonator 2. When the micro-ring resonator 2 is in a crossover state (i.e., when the resonant frequency of the micro-ring resonator 2 coincides with the frequency of the input optical signal), the input optical signal enters the micro-ring resonator 2 from the input terminal 5 and enters the optical loop 3 through the micro-ring resonator 2. Alternatively, the optical signal circulating in the optical loop 3 enters the optical waveguide device 1 through the micro-ring resonator 2 and is output from the output terminal 6. Furthermore, the resonant frequency of the micro-ring resonator 2 can be adjusted by applying a specified voltage to the micro-ring resonator 2, thereby causing the micro-ring resonator 2 to undergo optical resonance at a specified resonant frequency. It can be understood that the micro-ring resonator 2 has the structural function of an optical switch, and by adjusting its resonant frequency, it can achieve the function of allowing light to pass through and blocking light from passing through.

[0045] Optical loop 3 and optical waveguide device 1 are located in two different directions of micro-ring resonator 2, and are coupled to micro-ring resonator 2. Specifically, when an optical signal enters optical loop 3 and micro-ring resonator 2 is in a straight-through state, the optical signal will circulate in optical loop 3 to achieve the storage function. When micro-ring resonator 2 is in a crossover state, the optical signal circulating in optical loop 3 passes through micro-ring resonator 2 and enters optical waveguide device 1, and is finally output from output terminal 6.

[0046] This invention provides a chip-integrated optical buffer, comprising: an optical waveguide device 1, a micro-ring resonant cavity 2, and an optical loop 3; the optical waveguide device 1 is used for inputting and outputting optical signals; the micro-ring resonant cavity 2 is capable of optical resonance at a specified resonant frequency, and when the resonant frequency of the micro-ring resonant cavity 2 does not coincide with the frequency of the input optical signal, the micro-ring resonant cavity 2 is in a through state, and when the resonant frequency of the micro-ring resonant cavity 2 coincides with the frequency of the input optical signal, the micro-ring resonant cavity 2 is in a cross state; the optical loop 3 and the optical waveguide device 1 are respectively located in two different directions of the micro-ring resonant cavity 2, and the optical loop 3 and the optical waveguide device 1 are respectively coupled to the micro-ring resonant cavity 2. This invention provides a chip-integrated optical buffer that achieves optical switching functionality by adjusting the resonant frequency of a micro-ring resonator 2. Power exchange is achieved between the micro-ring resonator 2 and the optical loop 3 using mode coupling, without physical contact. Compared to existing optical switches based on Mach-Zehnder interferometers, the micro-ring resonator 2 does not need to be directly connected to the optical loop 3, greatly reducing the impact of the optical switch on the loss of the optical loop 3 and helping to improve the storage time of the chip-integrated optical buffer.

[0047] In one embodiment of the present invention, namely as Figure 1 and Figure 2 As shown, the optical waveguide device 1, the micro-ring resonator 2, and the optical loop 3 are all located in the same plane, and the optical loop 3 and the optical waveguide device 1 are coupled along different sides of the micro-ring resonator 2. In this embodiment, the optical loop 3 and the optical waveguide device 1 are respectively arranged at the gaps between two opposite sides of the micro-ring resonator 2, as shown. Figure 1 and Figure 2 As shown, preferably, the optical loop 3 and the optical waveguide device 1 are respectively set in the gaps on the left and right sides of the micro-ring resonant cavity 2, thereby realizing the lateral coupling of the optical loop 3 and the optical waveguide device 1 in the micro-ring resonant cavity 2.

[0048] In one embodiment of the present invention, namely as Figure 3 and Figure 4As shown, both the optical waveguide device 1 and the optical loop 3 are located in the same plane, and both are coupled above or below the plane containing the micro-ring resonator 2. In this embodiment, the optical loop 3 and the optical waveguide device 1 are positioned with a gap above or below the plane containing the micro-ring resonator 2, as shown. Figure 3 and Figure 4 As shown, preferably, the optical loop 3 and the optical waveguide device 1 are both located above the plane where the micro-ring resonator 2 is located, and the coupling method between the micro-ring resonator 2 and the optical loop 3 and the optical waveguide device 1 is vertical coupling.

[0049] In one embodiment of the present invention, namely as Figure 5 and Figure 6 As shown, the optical waveguide device 1 and the micro-ring resonator 2 are both located in the same plane, with the optical waveguide device 1 coupled along one side of the micro-ring resonator 2, and the optical loop 3 coupled either above or below the plane of the micro-ring resonator 2. In this embodiment, the optical waveguide device 1 and the micro-ring resonator 2 are coupled laterally, and the optical loop 3 and the micro-ring resonator 2 are coupled vertically. Furthermore, the optical loop 3 can be arranged parallel to or perpendicular to the micro-ring resonator 2.

[0050] In one embodiment of the present invention, the chip-integrated optical buffer further includes an electrode 4, which is disposed near the micro-ring resonant cavity 2 and used to change the resonant frequency of the micro-ring resonant cavity 2. In this embodiment, by applying different voltages to the micro-ring resonant cavity 2, the resonant frequency of the micro-ring resonant cavity 2 is adjusted. For example, when the voltage of the electrode 4 is adjusted to V1, the resonant frequency of the micro-ring resonant cavity 2 does not coincide with the frequency of the input optical signal, thereby ensuring that the micro-ring resonant cavity 2 is in a direct-through state; when the voltage of the electrode 4 is adjusted to V2, the resonant frequency of the micro-ring resonant cavity 2 coincides with the frequency of the input optical signal, thereby ensuring that the micro-ring resonant cavity 2 is in a crossover state. In this embodiment, the applied control voltage change only needs to adjust the resonant frequency of the micro-ring resonant cavity 2 to be consistent with or different from the frequency of the input optical signal. Compared with existing optical switches based on Mach-Zehnder interferometers, the required applied voltage is greatly reduced, making it easier to implement.

[0051] In one embodiment of the present invention, the chip-integrated optical buffer further includes a moving device, one end of which is connected to the micro-ring resonator 2 and the other end of which is connected to the optical loop 3. The moving device is used to adjust the gap between the light-guiding edge of the micro-ring resonator 2 and the optical loop 3, thereby adjusting the coupling strength between the micro-ring resonator 2 and the optical loop 3. In this embodiment, the moving device adjusts the gap between the light-guiding edge of the micro-ring resonator 2 and the optical loop 3, thereby adjusting the coupling strength between the micro-ring resonator 2 and the optical loop 3. Alternatively, the moving device can be positioned between the light-guiding edge of the micro-ring resonator 2 and the optical waveguide device 1 to adjust the coupling strength between the micro-ring resonator 2 and the optical waveguide device 1.

[0052] In one embodiment of the present invention, the microring resonant cavity 2 includes a ring structure formed by connecting waveguides end to end; the optical loop 3 includes a ring structure formed by connecting waveguides end to end, or the optical loop 3 includes a microdisk resonator. Specifically, as... Figure 1 and Figure 3 The micro-ring resonator 2 is a racetrack-shaped structure formed by connecting waveguides end to end, and the optical loop 3 is a racetrack-shaped structure formed by connecting waveguides end to end, or, as... Figure 5 As shown, optical loop 3 adopts the form of a microdisk resonator, preferably a high-quality dielectric microdisk resonator.

[0053] In one embodiment of the present invention, the optical waveguide device 1 includes any one of the following: thin-film lithium niobate waveguide, silicon waveguide, silicon nitride waveguide, silicon oxynitride waveguide, silicon dioxide waveguide, tapered optical fiber, and D-shaped optical fiber. It should be understood that the optical waveguide device 1 can also be made of other media capable of transmitting optical signals, and the present invention is not limited to optical waveguide devices 1 made of the aforementioned media.

[0054] In one embodiment of the present invention, when the optical loop 3 is constructed in the form of a waveguide, the optical loop 3 includes any one of the following: thin-film lithium niobate waveguide, silicon waveguide, silicon nitride waveguide, silicon oxynitride waveguide, silicon dioxide waveguide, tapered optical fiber, and D-shaped optical fiber; or, when the optical loop 3 is constructed using a microdisk resonator, the optical loop 3 includes any one of the following: lithium niobate microdisk resonator, magnesium fluoride microdisk resonator, calcium fluoride microdisk resonator, and silicon dioxide microdisk resonator.

[0055] The present invention provides the following three specific embodiments:

[0056] Example 1:

[0057] A top view schematic diagram of Embodiment 1 of the present invention is shown below. Figure 1As shown, the device includes an optical waveguide device 1, a microring resonator 2, and an optical loop 3. The microring resonator 2 is coupled to the optical waveguide device 1, and to the optical loop 3. The optical waveguide device 1, microring resonator 2, and optical loop 3 are all fabricated on the same lithium niobate thin-film substrate on an insulator. The optical waveguide device 1 is a thin-film lithium niobate waveguide. The microring resonator 2 is a microring resonator formed by connecting the two ends of a thin-film lithium niobate waveguide; electrodes 4 are fabricated on the waveguide side to change the resonant frequency of the microring resonator 2. The optical loop 3 is implemented by connecting long thin-film lithium niobate waveguides end to end. Figure 2 As shown, the optical waveguide device 1, the micro-ring resonator 2, and the optical loop 3 are all located in the same plane. The coupling between the micro-ring resonator 2 and the optical waveguide device 1 and the optical loop 3 is lateral coupling.

[0058] Example 2:

[0059] A top view schematic diagram of Embodiment 2 of the present invention is shown below. Figure 3 As shown, the system includes an optical waveguide device 1, a microring resonator 2, and an optical loop 3. The microring resonator 2 is coupled to the optical waveguide device 1 and to the optical loop 3. The microring resonator 2 is fabricated on a lithium niobate-on-insulator thin-film substrate and is formed by connecting the end-to-end thin-film lithium niobate waveguides. Electrodes 4 are fabricated on the waveguide side to change the resonant frequency of the microring resonator 2. The optical waveguide device 1 is a low-loss silicon nitride waveguide. The optical loop 3 is implemented by connecting the end-to-end long silicon nitride waveguides. Figure 4 As shown, the optical waveguide device 1 and the optical loop 3 are in the same plane and are located above the plane where the micro-ring resonator 2 is located. The coupling between the micro-ring resonator 2 and the optical waveguide device 1 and the optical loop 3 is vertical coupling.

[0060] Example 3:

[0061] A top view schematic diagram of Embodiment 3 of the present invention is shown below. Figure 5 As shown, the system includes an optical waveguide device 1, a microring resonator 2, and an optical loop 3. The microring resonator 2 is coupled to the optical waveguide device 1, and the microring resonator 2 is coupled to the optical loop 3. The optical waveguide device 1 and the microring resonator 2 are fabricated on a lithium niobate-on-insulator thin-film substrate. The optical waveguide device 1 is a thin-film lithium niobate waveguide. The microring resonator 2 is a microring resonator formed by connecting the two thin-film lithium niobate waveguides end-to-end. Electrodes 4 are fabricated on the waveguide side to change the resonant frequency of the microring resonator 2. The optical loop 3 is realized by a side-polished lithium niobate microdisk cavity, fabricated on a different substrate than the optical waveguide device 1 and the microring resonator 2, and is spatially separated from them. Figure 6As shown, the optical waveguide device 1 and the microring resonator 2 are on the same plane. The optical loop 3 is located above the microring resonator 2 and can be positioned parallel to or perpendicular to the microring resonator 2. A precision spatial displacement device is used to adjust the proximity or distance between the light-guiding edge of the lithium niobate microdisk cavity of the optical loop 3 and the waveguide of the microring resonator 2. The microring resonator 2 and the optical waveguide device 1 form a lateral coupling, while the microring resonator 2 and the optical loop 3 form a vertical coupling. The coupling strength between the microring resonator 2 and the optical loop 3 is controlled by adjusting the gap between them.

[0062] The present invention also provides a method for operating a chip-integrated optical buffer, which is a method for operating the chip-integrated optical buffer according to the above embodiments of the present invention, and the method includes the following steps:

[0063] S1. Preparation: Adjust the resonant frequency of the micro-ring resonator 2 so that it does not coincide with the frequency of the optical signal to be input, so that the micro-ring resonator 2 is in a direct-through state. At this time, the optical signal to be input cannot pass through the micro-ring resonator 2.

[0064] S2, Writing Operation: An optical signal is input through the input terminal 5 of the optical waveguide device 1, and the resonant frequency of the micro-ring resonator 2 is adjusted to be the same as the frequency of the input optical signal. The micro-ring resonator 2 is in a crossover state, and the input optical signal enters the optical loop 3 through the micro-ring resonator 2.

[0065] S3. Storage Operation: Adjust the resonant frequency of the micro-ring resonator 2 to be different from the frequency of the input optical signal. The micro-ring resonator 2 is in a direct-through state, and the input optical signal circulates in the optical loop 3 to store the optical signal.

[0066] S4. Readout Operation: Adjust the resonant frequency of the micro-ring resonator 2 to be the same as the frequency of the input optical signal. The micro-ring resonator 2 is in a crossover state. The optical signal that is circulating in the optical loop 3 enters the optical waveguide device 1 through the micro-ring resonator 2 and is output from the output terminal 6 of the optical waveguide device 1.

[0067] The present invention provides a method for operating a chip-integrated optical buffer, which is based on a method for operating a chip-integrated optical buffer provided in the embodiments of the present invention, and therefore has the same advantages as above.

[0068] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip integrated optical buffer, characterized by, The chip integrated optical buffer comprises: a light waveguide device (1) for inputting and outputting optical signals; a micro-ring resonant cavity (2) capable of optical resonance at a specified resonant frequency, and when the resonant frequency of the micro-ring resonant cavity (2) does not coincide with the frequency of the input optical signal, the micro-ring resonant cavity (2) is in a straight-through state, and when the resonant frequency of the micro-ring resonant cavity (2) coincides with the frequency of the input optical signal, the micro-ring resonant cavity (2) is in a cross state; a light loop (3) and the light waveguide device (1) are respectively located in two different directions of the micro-ring resonant cavity (2), and the light loop (3) and the light waveguide device (1) are respectively coupled with the micro-ring resonant cavity (2); an electrode (4) arranged close to the micro-ring resonant cavity (2) for changing the resonant frequency of the micro-ring resonant cavity (2).

2. The chip-integrated optical buffer according to claim 1, wherein, The light waveguide device (1), the micro-ring resonant cavity (2) and the light loop (3) are all in the same plane, and the light loop (3) and the light waveguide device (1) are respectively coupled along different sides of the micro-ring resonant cavity (2).

3. The chip-integrated optical buffer of claim 1, wherein, The light waveguide device (1) and the light loop (3) are all in the same plane, and the light waveguide device (1) and the light loop (3) are all coupled above or below the plane of the micro-ring resonant cavity (2).

4. The chip-integrated optical buffer of claim 1, wherein, The light waveguide device (1) and the micro-ring resonant cavity (2) are all in the same plane, and the light waveguide device (1) is coupled along one side of the micro-ring resonant cavity (2), and the light loop (3) is coupled above or below the plane of the micro-ring resonant cavity (2).

5. The chip-integrated optical buffer according to claim 4, wherein, Further comprising: a moving device, one end of the moving device is connected with the micro-ring resonant cavity (2), and the other end is connected with the light loop (3), for adjusting the gap between the light guiding edge of the micro-ring resonant cavity (2) and the light loop (3), so as to adjust the coupling strength between the micro-ring resonant cavity (2) and the light loop (3).

6. The chip integrated optical buffer according to any one of claims 1 to 5, wherein the micro-ring resonant cavity (2) comprises a ring structure formed by connecting waveguides end to end; the light loop (3) comprises a ring structure formed by connecting waveguides end to end, or the light loop (3) comprises a micro-disk resonator.

7. The chip integrated optical buffer according to any one of claims 1 to 5, wherein the light waveguide device (1) comprises any one of a thin film lithium niobate waveguide, a silicon waveguide, a silicon nitride waveguide, a silicon oxynitride waveguide, a silicon dioxide waveguide, a tapered optical fiber and a D-shaped optical fiber.

8. The chip integrated optical buffer according to any one of claims 1 to 4, wherein the light loop (3) comprises any one of a thin film lithium niobate waveguide, a silicon waveguide, a silicon nitride waveguide, a silicon oxynitride waveguide, a silicon dioxide waveguide, a tapered optical fiber and a D-shaped optical fiber. Or, the optical loop (3) comprises any one of a lithium niobate micro-disk resonator, a magnesium fluoride micro-disk resonator, a calcium fluoride micro-disk resonator and a silicon dioxide micro-disk resonator.

9. A method of operating a chip-integrated optical buffer, characterized by, The working method of the chip integrated optical buffer according to any one of claims 1 to 8 comprises: Adjusting the resonant frequency of the micro-ring resonant cavity (2) to be different from the frequency of the input optical signal, and the micro-ring resonant cavity (2) is in a pass-through state; Inputting the optical signal through the optical waveguide device (1), and adjusting the resonant frequency of the micro-ring resonant cavity (2) to be the same as the frequency of the input optical signal, and the micro-ring resonant cavity (2) is in a cross state, and the input optical signal enters the optical loop (3) through the micro-ring resonant cavity (2); Adjusting the resonant frequency of the micro-ring resonant cavity (2) to be different from the frequency of the input optical signal, and the micro-ring resonant cavity (2) is in a pass-through state, and the input optical signal circulates in the optical loop (3) to store the optical signal; Adjusting the resonant frequency of the micro-ring resonant cavity (2) to be the same as the frequency of the input optical signal, and the micro-ring resonant cavity (2) is in a cross state, and the optical signal circulating in the optical loop (3) enters the optical waveguide device (1) through the micro-ring resonant cavity (2), and is output from the optical waveguide device (1).

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