Method and apparatus for determining sub-chip of quantum chip, and electronic device

Abstract

The present disclosure provides a method and device for determining a sub-chip of a quantum chip and an electronic device, and relates to the technical field of computers, in particular to the technical field of quantum computing and chip characterization. According to a pre-characterization map of the quantum chip, a first number of quantum bits required to be used is determined. The pre-characterization map is a 45° diagonal square tiling map configuration of a rectangular contour, and the pre-characterization map includes first nodes corresponding to a plurality of quantum bits of the quantum chip. In response to the first number satisfying a preset condition, a target configuration composed of a plurality of node identifiers is determined. Based on the pre-characterization map, a plurality of candidate characterization maps corresponding to the target configuration are determined, and each candidate characterization map includes second nodes corresponding to part of the quantum bits of the quantum chip. The connectivity of a plurality of candidate sub-chips corresponding to the plurality of candidate characterization maps is determined. According to the connectivity, a target sub-chip is determined from the plurality of candidate sub-chips. According to the technology of the present disclosure, the best-performing sub-chip can be selected from the quantum chip.

Claims

1. A method for determining a sub-chip of a quantum chip, comprising: Based on the pre-detailed pattern of the quantum chip, the first number of qubits to be used is determined, wherein the pre-detailed pattern is a rectangular outline with a 45° oblique square tessellation configuration, and the pre-detailed pattern includes a plurality of first nodes corresponding one-to-one with a plurality of qubits of the quantum chip; In response to the first quantity satisfying a preset condition, a target configuration consisting of multiple node identifiers is determined; Based on the pre-characterized pattern, multiple candidate characterized patterns corresponding to the target configuration are determined, wherein each candidate characterized pattern includes multiple second nodes that correspond one-to-one with a portion of the qubits of the quantum chip; Based on the target configuration, determine the connectivity algorithm; Using the connectivity algorithm, the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated based on the qubits corresponding to the multiple second nodes on the characterization path of the multiple candidate characterization maps. Based on the connectivity, a target sub-chip is determined from the plurality of candidate sub-chips; The step of using the connectivity algorithm to calculate the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps includes: Based on the qubits corresponding to the multiple second nodes on the characterization path of the multiple candidate characterization patterns, determine the qubits located at both ends on the characterization path of the multiple candidate characterization patterns; Based on the distance weights between multiple qubits in the pre-etched pattern, the first distance weight between the qubits located at the two endpoints is determined; Using the connectivity algorithm, the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated based on the first distance weight.

2. The method according to claim 1, wherein, Based on the pre-deciphered pattern of the quantum chip, determine the initial number of qubits required, including: Based on the pre-detailed pattern of the quantum chip, the first row and column number information and the first angle parameter of the pre-detailed pattern are determined, wherein the first angle parameter is used to characterize the image shape of the target region of the pre-detailed pattern; Based on the first row and column number information and the first angle parameter, determine the first number of qubits to be used.

3. The method according to claim 1, wherein, In response to the first quantity satisfying a preset condition, a target configuration consisting of multiple node identifiers is determined, including: In response to the first quantity meeting a preset condition, the arrangement and connection method of multiple node identifiers are determined; Based on the arrangement and connection methods, at least one target configuration consisting of the plurality of node identifiers is determined.

4. The method according to claim 3, wherein, In response to the first quantity meeting a preset condition, the arrangement and connection method of multiple node identifiers are determined, including: Determine the target algorithm based on the computational task; In response to the first quantity satisfying a preset quantity and the target algorithm satisfying a preset algorithm, the arrangement and connection method of multiple node identifiers are determined; The preset algorithm is either a variable quantum algorithm or a quantum approximation optimization algorithm.

5. The method according to any one of claims 1 to 4, wherein, The target configuration is a circular or chain-like configuration.

6. The method according to claim 1, wherein, Based on the pre-characterized map, multiple candidate characterized maps corresponding to the target configuration are determined, including: Based on the first row and column number of the pre-etched pattern and the first number of qubits contained in the quantum chip, the traversal rules are determined; According to the traversal rules, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration.

7. The method according to claim 6, wherein, According to the traversal rules, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration, including: Based on the traversal rules, the starting first node, initial shape, and direction of each step of the traversal are determined according to the pre-characterized map. Based on the initial first node, the initial shape, and the direction of the single step, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration.

8. The method according to claim 7, wherein, Based on the initial first node, the initial shape, and the direction of the single step, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration, including: The pre-delineated map is traversed based on the initial first node, the initial shape, and the direction of the single step; The traversal ends when the number of multiple characterization maps corresponding to the target configuration obtained by the traversal meets the threshold, thus obtaining multiple candidate characterization maps corresponding to the target configuration.

9. The method according to claim 1, wherein, Determining the first distance weight between the qubits located at the two endpoints based on the distance weight between multiple qubits in the pre-defined pattern includes: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; The first distance weight between the qubits located at the two ends is determined based on the second distance weight.

10. The method according to claim 1, wherein, Determining the first distance weight between the qubits located at the two endpoints based on the distance weight between multiple qubits in the pre-defined pattern includes: Based on the distance weights between multiple qubits in the pre-characterized pattern, a third distance weight is determined between every two adjacent qubits on the characterization path of the multiple candidate characterization patterns. The first distance weight between the qubits located at the two ends is determined based on the third distance weight.

11. The method according to claim 1, wherein, Using the connectivity algorithm, based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps, the connectivity of the multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated, further comprising: Based on the distance weights between multiple qubits in the pre-characterized pattern, a third distance weight is determined between every two adjacent qubits on the characterization path of the multiple candidate characterization patterns. The average distance weight is determined based on the third distance weight. Using the connectivity algorithm, the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated based on the average distance weight.

12. The method according to claim 11, wherein, Based on the distance weights between multiple qubits in the pre-delineated pattern, a third distance weight is determined between every two adjacent qubits on the marking path of the multiple candidate marking patterns, including: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; Based on the second distance weight, a third distance weight is determined between each pair of adjacent qubits on the characterization path of the plurality of candidate characterization maps.

13. The method according to any one of claims 1 to 4, 6 to 12, further comprising: Based on the chip information of the quantum chip, the number of qubits and the quantum gate information of the quantum chip are determined, wherein the quantum gate information characterizes the communication relationship between each qubit of the quantum chip; Based on the quantity information and the quantum gate information, a first topological structure diagram of the quantum chip is determined, wherein the first topological structure diagram is composed of a plurality of first nodes representing each quantum bit and edges representing the communication relationship between every two directly adjacent quantum bits of the quantum chip; Based on the quantum gate information, determine the distance weights between each qubit; and Based on the distance weights and the first topological structure diagram, a pre-detailed pattern of the quantum chip is obtained.

14. The method according to claim 13, wherein, Based on the quantum gate information, the distance weights between each qubit are determined, including: Based on the quantum gate information, determine every two directly adjacent qubits in the quantum chip; Based on the chip information, determine the fidelity of the two-qubit gate between every two directly adjacent qubits; Based on the fidelity, the distance weights between each quantum bit are determined.

15. The method according to claim 13, wherein, Based on the quantity information and the quantum gate information, the first topological structure diagram of the quantum chip is determined, including: Based on the quantity information and the quantum gate information, the target drawing function is determined; Based on the target drawing function, a first topological structure diagram is used to determine the target structural shape of the quantum chip.

16. A device for determining a sub-chip of a quantum chip, comprising: The first determining module is used to determine the first number of qubits to be used based on the pre-detailed pattern of the quantum chip, wherein the pre-detailed pattern is a 45° oblique square tessellation configuration with a rectangular outline, and the pre-detailed pattern includes a plurality of first nodes corresponding one-to-one with a plurality of qubits of the quantum chip; The second determining module is used to determine a target configuration consisting of multiple node identifiers in response to the first quantity satisfying a preset condition. The third determining module is used to determine multiple candidate characterization patterns corresponding to the target configuration based on the pre-characterization pattern, wherein each candidate characterization pattern includes multiple second nodes that correspond one-to-one with a portion of the qubits of the quantum chip; The fourth determining module includes a fourth determining submodule and a calculation submodule, wherein the fourth determining submodule is used to determine a connectivity algorithm based on the target configuration; the calculation submodule is used to use the connectivity algorithm to calculate the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps; The fifth determining module is used to determine the target sub-chip from the plurality of candidate sub-chips based on the connectivity. The computing submodule includes: The second determining unit is used to determine the qubits located at both ends of the characterization path of the multiple candidate characterization patterns based on the qubits corresponding to the multiple second nodes on the characterization path of the multiple candidate characterization patterns. The third determining unit is used to determine the first distance weight between the qubits located at the two endpoints based on the distance weight between the multiple qubits of the pre-etched pattern; The first computing unit is used to calculate the connectivity of the multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the first distance weight using the connectivity algorithm.

17. The apparatus according to claim 16, wherein, The first determining module is used for: Based on the pre-detailed pattern of the quantum chip, the first row and column number information and the first angle parameter of the pre-detailed pattern are determined, wherein the first angle parameter is used to characterize the image shape of the target region of the pre-detailed pattern; Based on the first row and column number information and the first angle parameter, determine the first number of qubits to be used.

18. The apparatus according to claim 16, wherein, The second determining module includes: The first determining submodule is used to determine the arrangement and connection method of multiple node identifiers in response to the first quantity meeting a preset condition. The second determining submodule is used to determine at least one target configuration composed of the plurality of node identifiers based on the arrangement and the connection method.

19. The apparatus according to claim 18, wherein, The first determining submodule is used for: Determine the target algorithm based on the computational task; In response to the first quantity satisfying a preset quantity and the target algorithm satisfying a preset algorithm, the arrangement and connection method of multiple node identifiers are determined; The preset algorithm is either a variable quantum algorithm or a quantum approximation optimization algorithm.

20. The apparatus according to any one of claims 16 to 19, wherein, The target configuration is a circular or chain-like configuration.

21. The apparatus according to claim 16, wherein, The third determining module includes: The third determining submodule is used to determine the traversal rules based on the first row and column number of the pre-etched pattern and the first number of qubits contained in the quantum chip; The traversal submodule is used to traverse the pre-characterized map according to the traversal rules to obtain multiple candidate characterized maps corresponding to the target configuration.

22. The apparatus according to claim 21, wherein, The traversal submodule includes: The first determining unit is configured to determine the starting first node, the initial shape, and the direction of the single step of traversal based on the pre-characterized map according to the traversal rules. The traversal unit traverses the pre-characterized map based on the initial first node, the initial shape, and the direction of the single step to obtain multiple candidate characterized maps corresponding to the target configuration.

23. The apparatus according to claim 22, wherein, The traversal unit is used for: The pre-delineated map is traversed based on the initial first node, the initial shape, and the direction of the single step; The traversal ends when the number of multiple characterization maps corresponding to the target configuration obtained by the traversal meets the threshold, thus obtaining multiple candidate characterization maps corresponding to the target configuration.

24. The apparatus according to claim 16, wherein, The third determining unit is further configured to: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; The first distance weight between the qubits located at the two ends is determined based on the second distance weight.

25. The apparatus according to claim 16, wherein, The third determining unit is further configured to: Based on the distance weights between multiple qubits in the pre-characterized pattern, a third distance weight is determined between every two adjacent qubits on the characterization path of the multiple candidate characterization patterns. The first distance weight between the qubits located at the two ends is determined based on the third distance weight.

26. The apparatus according to claim 16, wherein, The computing submodule further includes: The fourth determining unit is used to determine the third distance weight between each pair of adjacent qubits on the marking path of the plurality of candidate marking patterns based on the distance weight between the plurality of qubits in the pre-marking pattern. The fifth determining unit is used to determine the average distance weight based on the third distance weight; The second calculation unit is used to calculate the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the average distance weight using the connectivity algorithm.

27. The apparatus according to claim 26, wherein, The fourth determining unit is used for: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; Based on the second distance weight, a third distance weight is determined between each pair of adjacent qubits on the characterization path of the plurality of candidate characterization maps.

28. The apparatus according to any one of claims 16 to 19, 21 to 27, further comprising: The sixth determining module is used to determine the number of qubits and the quantum gate information of the quantum chip based on the chip information of the quantum chip, wherein the quantum gate information characterizes the communication relationship between each qubit of the quantum chip; The seventh determining module is used to determine a first topological structure diagram of the quantum chip based on the quantity information and the quantum gate information, wherein the first topological structure diagram is composed of a plurality of first nodes representing each quantum bit and edges representing the communication relationship between every two directly adjacent quantum bits of the quantum chip; The eighth determining module is used to determine the distance weights between the qubits based on the quantum gate information; and The ninth determining module is used to obtain a pre-detailed pattern of the quantum chip based on the distance weight and the first topological structure diagram.

29. The apparatus according to claim 28, wherein, The eighth determining module is used for: Based on the quantum gate information, determine every two directly adjacent qubits in the quantum chip; Based on the chip information, determine the fidelity of the two-qubit gate between every two directly adjacent qubits; Based on the fidelity, the distance weights between each quantum bit are determined.

30. The apparatus according to claim 28, wherein, The seventh determining module is used for: Based on the quantity information and the quantum gate information, the target drawing function is determined; Based on the target drawing function, a first topological structure diagram is used to determine the target structural shape of the quantum chip.

31. An electronic device, comprising: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1 to 15.

32. A non-transitory computer-readable storage medium storing computer instructions, wherein, The computer instructions are used to cause the computer to perform the method according to any one of claims 1 to 15.

33. A computer program product comprising a computer program that, when executed by a processor, implements the method according to any one of claims 1 to 15.

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