A packaging mechanism for LED patch bracket and packaging method thereof

Abstract

The present invention relates to the technical field of packaging equipment, and discloses a packaging mechanism for an LED patch bracket and a packaging method thereof, including a stand, a material lifting assembly including a support plate fixedly mounted on the stand, a first electric slide rail fixedly mounted on a side wall of the support plate, an adaptive first electric slider provided on the first electric slide rail, a second electric slide rail fixedly mounted on a side wall of the first electric slider, a second electric slider provided on the second electric slide rail, the first electric slide rail is used to drive the first electric block to move laterally, so that the first electric slider drives the second electric slide rail to move laterally synchronously, the second electric slider is used to drive the connecting frame to move up and down, the second electric slider is used to drive the suction cup on the square plate to move up and down synchronously, so that the suction cup contacts the LED patch, the suction cup adsorbs the LED patch and moves the LED patch to a storage plate for placement.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging equipment, and in particular to a packaging mechanism for an LED patch bracket and a packaging method thereof. Background Art

[0002] The LED bracket is the base of the LED lamp bead before packaging. On the basis of the LED bracket, the chip is fixed into it, the positive and negative electrodes are soldered, and then the packaging glue is used to encapsulate the LED chip bracket. The LED chip bracket packaging requires an injection molding machine for processing. In the existing technology, when packaging LED chip brackets, the packaging machine is often used for filling and packaging, which not only makes the workers easily fatigued, but also reduces the packaging efficiency.

[0003] In response to the above technical problems, patent number 202111016923.2 proposes a comprehensive packaging mechanism for an LED patch bracket and a packaging method thereof, which is provided with a group of placement blocks on the conveyor belt. The LED patch bracket to be packaged is placed in the first groove, and then transported by the conveyor belt. The LED patch bracket to be packaged is moved to directly under the glue nozzle, and then the glue is discharged and packaged through the glue discharge component of the packaging box. The packaged LED patch bracket is then moved through the conveyor belt and directly moved to the next processing position.

[0004] Traditional devices have some disadvantages during use. For example, the above-mentioned patent can reduce the workload of staff and improve packaging efficiency, but the LED patch is placed only above the conveyor belt, which is not convenient for positioning the LED patch. If the LED patch is offset during the transmission process, the spray liquid of the glue injection head will not be located in the flow channel, and the glue will be difficult to flow in an orderly manner due to the squeezing at the top, resulting in low packaging quality. Summary of the Invention

[0005] The object of the present invention is to provide a packaging mechanism for an LED patch bracket and a packaging method thereof, so as to solve the problem that the LED patch is only placed above a conveyor belt, which makes it inconvenient to position the LED patch.

[0006] The present invention provides the following technical solutions: a packaging mechanism for an LED patch bracket, comprising a stand,

[0007] An upper pressing assembly, the upper pressing assembly includes a fixing frame fixed to the upper end surface of the frame, a first cylinder is fixedly mounted on the fixing frame, a lifting frame is fixedly mounted on the piston end of the first cylinder, an upper mold is fixedly connected to the inner wall of the lifting frame, and a glue injection assembly is provided at the center of the upper mold;

[0008] A pressing assembly, comprising a bottom frame fixedly mounted at the center of the platform, a second cylinder fixedly mounted on the bottom frame, a storage plate for placing LED patches fixedly mounted on the piston end of the second cylinder, and conveying assemblies provided on both sides of the storage plate;

[0009] A material lifting assembly includes a support plate fixedly mounted on a platform, a first electric slide rail fixedly mounted on a side wall of the support plate, a first electric slider being provided with a matching electric slide rail, a second electric slide rail being fixedly mounted on a side wall of the first electric slider, a second electric slider being provided on the second electric slide rail, a connecting frame being fixedly mounted on a side wall of the second electric slider, a square plate being fixedly mounted on an end portion of the connecting frame, suction cups being provided at the four corners of the square plate, and a material storage assembly being provided under the plurality of suction cups.

[0010] As a preferred embodiment of the above technical solution, the glue injection assembly includes a glue injection head movably connected to the center of the upper mold, the top of the glue injection head is connected to a liquid guide tube, the other end of the liquid guide tube is connected to a liquid pump, the liquid pump is connected to a liquid storage tank through another section of the liquid guide tube, a heating rod is inserted at the center of the liquid storage tank, and the heating rod is connected to a controller through a wire.

[0011] As a preferred embodiment of the above technical solution, the material storage assembly includes a third cylinder fixedly mounted on the lower end surface of the platform, and a material storage plate for storing LED light sheets is fixedly mounted on the movable end of the third cylinder.

[0012] As a preferred embodiment of the above technical solution, the conveying assembly includes a fixed plate symmetrically fixed on the stand, a plurality of guide wheels are fixedly installed on the side walls of the two fixed plates, a conveyor belt for conveying LED patches is provided on the outer walls of the plurality of guide wheels, the conveyor belt is connected to the guide wheels for transmission, a drive motor is fixedly installed on the side wall of the fixed plate, and a transmission wheel for driving the conveyor belt is fixedly installed on the output end of the drive motor.

[0013] As a preferred embodiment of the above technical solution, sliding grooves are provided on opposite side walls of the fixing plate, two connecting members are slidably connected to the sliding grooves, and distance sensors are fixedly installed on the side walls of the two connecting members.

[0014] As a preferred embodiment of the above technical solution, a battery box for power supply is fixedly installed on the inner side of the stand.

[0015] As a preferred embodiment of the above technical solution, a control panel is fixedly mounted on the upper end surface of the platform.

[0016] As a preferred embodiment of the above technical solution, an opening for sensing by a signal sensing end of a distance sensor is provided at a corner of the storage plate.

[0017] A method for injection molding and packaging an LED chip bracket includes the following steps:

[0018] A plurality of LED patches to be processed are stored on a material storage board, and the LED patches are transported to a storage board by a provided material lifting component. The glue injection component is used to spray glue into the flow channel of the LED patches. The LED patches on the storage board are pressed by a provided upper pressing component, so that the glue is circulated to the surrounding channels by pressure, thereby completing the packaging. The mounted LED patches are moved downward by a provided second cylinder, so that the LED patches can fall onto a conveyor belt, so that the conveyor belt transports the LED patches to a later processing site.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] In the present invention, the glue is injected by the provided glue injection assembly. After the processing is completed, the first cylinder directly presses down to make the lower mold and the LED patch close to each other, thereby pressing the glue and causing the glue to flow to the surrounding channels through pressure, thereby completing the packaging process. While pressing, the glue injection head moves up and is flush with the lower end surface of the lower mold, so that the glue injection head will not affect the pressing of the lower mold and will not cause damage to the glue injection head. Due to gravity, the glue injection head will fall back and the mounted LED patch will be moved down by the provided second cylinder, so that the LED patch can fall on the conveyor belt, so that the conveyor belt can transport the LED patch to the later processing site. The setting of this structure can position the LED patch, so that the LED patch will not shift during the transportation process, so that the spray of the glue injection head is located in the circulation channel, and the glue can flow in an orderly manner due to the squeezing at the top, thereby improving the packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a packaging mechanism and packaging method for an LED patch bracket from a first-person perspective;

[0022] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 A schematic diagram of a second-view stereoscopic structure of a packaging mechanism for an LED patch bracket and a packaging method thereof;

[0024] Figure 4 It is a front view structural schematic diagram of a packaging mechanism for an LED patch bracket and a packaging method thereof;

[0025] Figure 5 Schematic diagram of the enlarged structure of the storage plate;

[0026] Figure 6This is a third-view structural schematic diagram of a packaging mechanism for an LED patch bracket and its packaging method.

[0027] In the figure: 10, stand; 11, fixed frame; 20, control panel; 30, support plate; 31, first electric slide; 32, first electric slider; 33, connecting frame; 34, square plate; 35, suction cup; 36, third cylinder; 361, storage plate; 37, second electric slide; 38, second electric slider; 40, connecting piece; 41, distance sensor; 50, first cylinder; 51, lifting frame; 52, upper mold; 53, injection head; 54, liquid guide tube; 55, liquid storage tank; 56, liquid pump; 57, heating rod; 58, controller; 60, fixed plate; 61, guide wheel; 62, conveyor belt; 63, slide; 64, drive motor; 65, transmission wheel; 70, bottom frame; 71, second cylinder; 72, storage plate; 721, opening; 80, battery box. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0029] Example 1

[0030] like Figure 1-6As shown, the present invention provides a technical solution: a packaging mechanism for an LED patch bracket, comprising a stand 10, an upper pressing assembly, the upper pressing assembly comprising a fixing frame 11 fixed to the upper end surface of the stand 10, a first cylinder 50 fixedly mounted on the fixing frame 11, a lifting frame 51 fixedly mounted on the piston end of the first cylinder 50, an upper mold 52 fixedly connected to the inner wall of the lifting frame 51, and a glue injection assembly provided at the center of the upper mold 52; a lower pressing assembly, the lower pressing assembly comprising a bottom frame 70 fixedly mounted at the center of the stand 10, a second cylinder 71 fixedly mounted on the bottom frame 70, a placement plate 72 for placing LED patches fixedly mounted on the piston end of the second cylinder 71, and conveying assemblies provided on both sides of the placement plate 72;The material lifting assembly includes a support plate 30 fixedly mounted on the platform 10, a first electric slide rail 31 fixedly mounted on the side wall of the support plate 30, an adapted first electric slider 32 is provided on the first electric slide rail 31, a second electric slide rail 37 is fixedly mounted on the side wall of the first electric slider 32, a second electric slide rail 37 is provided on the second electric slider 38, a connecting frame 33 is fixedly mounted on the side wall of the second electric slider 38, a square plate 34 is fixedly mounted on the end of the connecting frame 33, and suction cups 35 are provided at the four corners of the square plate 34, and a material storage assembly is provided below the multiple suction cups 35. During specific use, the LED patches are first stored through the provided storage component to avoid manual removal of the LED patches. The storage component can lift the stored materials to meet the lifting range of the lifting component. The first electric slide 31 is provided to drive the first electric block to move horizontally, so that the first electric slide 32 drives the second electric slide 37 to move horizontally synchronously. The second electric slide 38 is provided to drive the connecting frame 33 to move up and down, and the second electric slide 38 is provided to drive the suction cup 35 on the square plate 34 to move up and down synchronously. , so that the suction cup 35 contacts the LED patch, the suction cup 35 adsorbs the LED patch and moves the LED patch to the storage plate 72 for placement, and then the lifting frame 51 is driven up and down by the first cylinder 50, and then the glue injection component is used to inject glue. After the processing is completed, the first cylinder 50 directly presses down to make the lower mold and the LED patch close to press the glue, so that the glue flows to the surrounding channels through pressure, thereby completing the packaging process, and while pressing, the glue injection head 53 moves up and is flush with the lower end surface of the lower mold. The glue injection head 53 does not affect the pressing of the lower mold and does not cause damage to the glue injection head 53. Due to gravity, the glue injection head 53 will fall back, and the second cylinder 71 will move the mounted LED patch downward, so that the LED patch can fall onto the conveyor belt 62, so that the conveyor belt 62 can transport the LED patch to the post-processing site. This structural setting can position the LED patch so that the LED patch will not shift during the transportation process. The liquid sprayed by the glue injection head 53 is located in the flow channel, and the glue can flow in an orderly manner due to the squeezing at the top, resulting in improved packaging quality.

[0031] As an implementation method in this embodiment, Figure 1As shown, the glue injection assembly includes a glue injection head 53 movably connected to the center of the upper mold 52, the top of the glue injection head 53 is connected to a liquid guide tube 54, the other end of the liquid guide tube 54 is connected to a liquid pump 56, the liquid pump 56 is connected to a liquid storage tank 55 through another section of the liquid guide tube 54, and a heating rod 57 is inserted at the center of the liquid storage tank 55, and the heating rod 57 is connected to a controller 58 through a wire. During specific use, the glue in the liquid storage tank 55 is sucked by the provided liquid pump 56, and then the glue is introduced into the glue injection head 53 through the provided liquid guide tube 54 for spraying. Since the liquid storage tank 55 is located outside, it is easily affected by the external temperature. However, if the glue temperature is too low, it may cause solidification. Therefore, the glue is heated in real time by the provided heating rod 57 to prevent the glue from solidifying. The above-mentioned glue injection process and glue injection amount can be controlled by a computer program to perform automatic glue feeding and packaging. Its specific working principle is not the main content of this embodiment and will not be described here. Reference can be made to the prior art.

[0032] As an implementation method in this embodiment, Figure 4 As shown, the material storage component includes a third cylinder 36 fixedly mounted on the lower end surface of the stand 10, and the movable end of the third cylinder 36 is fixedly mounted with a material storage plate 361 for storing LED light sheets. The LED patches are stored by the set material storage plate 361, and then the material storage plate 361 is driven to move upward by the three cylinders 36, so as to meet the material lifting range of the material lifting component. There is no need for manual picking up from time to time, which reduces the labor intensity of workers to a certain extent.

[0033] As an implementation method in this embodiment, Figure 1 As shown, the conveying assembly includes a fixed plate 60 symmetrically fixed on the stand 10, and a plurality of guide wheels 61 are fixedly installed on the side walls of the two fixed plates 60. The outer walls of the plurality of guide wheels 61 are provided with a conveyor belt 62 for conveying LED patches, and the conveyor belt 62 is transmission-connected to the guide wheels 61. A driving motor 64 is fixedly installed on the side wall of the fixed plate 60, and a transmission wheel 65 for driving the conveyor belt 62 is fixedly installed on the output end of the driving motor 64. During specific use, the transmission wheel 65 is mobilized to rotate by the set driving motor 64, so that the conveyor belt 62 can be transmission-connected on the guide wheel 61, and the LED patches after processing are lifted and lowered by the second cylinder 71, so that the LED patches fall at the corners of the conveyor belt, thereby completing the transmission of the LED patches and sending the LED patches to the next processing area.

[0034] As an implementation method in this embodiment, Figure 1 and 2As shown, a slide groove 63 is provided on the opposite side walls of the fixed plate 60, and two connecting members 40 are slidably connected to the slide groove 63. Distance sensors 41 are fixedly installed on the side walls of the two connecting members 40. During specific use, two distance sensors 41 are provided, one is located below the placement plate 72, and is used to sense whether an LED patch is placed on the placement plate 72, and the other is provided at the end of the conveyor belt 62, and is used to monitor the transmission progress of the LED patch.

[0035] As an implementation method in this embodiment, Figure 1 As shown, a power storage box 80 for power supply is fixedly installed inside the stand 10. The power storage box 80 is set as a backup and can cope with emergencies. In addition, the electrical appliances of the device can be connected to an external power source when the power storage box 80 is not in use.

[0036] As an implementation method in this embodiment, Figure 1 As shown, a control panel 20 is fixedly mounted on the upper end surface of the stand 10 , and the control panel 20 can control the operation of the electrical appliance through a computer program.

[0037] As an implementation method in this embodiment, Figure 5 As shown, an opening 721 for sensing by the signal sensing end of the distance sensor 41 is opened at the corner of the storage plate 72. The opening 721 is provided so that the signal sensor can sense the LED patch through the opening 721.

[0038] Example 2

[0039] like Figure 1-6 As shown, based on the same concept as the above embodiment 1, this embodiment also proposes a packaging method for an LED patch bracket, comprising the following steps:

[0040] A plurality of LED patches to be processed are stored on the storage plate 361, and the LED patches are transported to the storage plate 72 by the provided material lifting component. The glue is sprayed into the circulation channel of the LED patches by the provided glue injection component, and the LED patches on the storage plate 72 are pressed by the provided upper pressing component, so that the glue is circulated to the surrounding channels by pressure, thereby completing the packaging. The mounted LED patches are moved downward by the provided second cylinder 71, so that the LED patches can fall onto the conveyor belt 62, so that the conveyor belt 62 transports the LED patches to the later processing site.

[0041] Working principle: first, the LED patches are stored by the material storage plate 361, and then the material storage plate 361 is driven to move upward by the three cylinders 36, so as to meet the material lifting range of the material lifting component, and there is no need to manually pick up the materials from time to time, which reduces the labor intensity of the workers to a certain extent. The material storage component can lift the materials to meet the material lifting range of the material lifting component, and the first electric slide 31 is driven by the first electric block to move horizontally, so that the first electric slide 32 drives the second electric slide 37 to move horizontally synchronously, and the second electric slide is set. The block 38 drives the connecting frame 33 to move up and down, and the second electric slider 38 drives the suction cup 35 on the square plate 34 to move up and down synchronously, so that the suction cup 35 contacts the LED patch, and the suction cup 35 adsorbs the LED patch and moves the LED patch to the storage plate 72 for placement. The lifting frame 51 is driven up and down by the first cylinder 50, and then the glue injection component is used to inject glue, and the glue in the liquid storage tank 55 is sucked by the liquid pump 56, and then the glue is injected through the liquid guide tube 54. The glue is introduced into the glue injection head 53 for injection, and because the liquid storage tank 55 is located outside, it is easily affected by the external temperature. However, if the glue temperature is too low, it may solidify. Therefore, the glue is heated in real time by the provided heating rod 57 to prevent the glue from solidifying. After the treatment is completed, the first cylinder 50 directly presses down to make the lower mold and the LED patch close together, thereby pressing the glue so that the glue flows to the surrounding channels through pressure, thereby completing the packaging process. At the same time, the glue injection head 53 moves up and is flush with the lower end surface of the lower mold, so that the glue injection head 53 does not It will affect the pressing of the lower mold and will not cause damage to the glue injection head 53. Due to gravity, the glue injection head 53 will fall back, and the mounted LED patch will be moved down by the second cylinder 71, so that the LED patch can fall on the conveyor belt 62, so that the conveyor belt 62 can transport the LED patch to the later processing site. The setting of this structure can position the LED patch, so that the LED patch will not shift during the transportation process, so that the spray of the glue injection head 53 is located in the circulation channel, and the glue can flow in an orderly manner due to the extrusion at the top, resulting in improved packaging quality.

[0042] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same.

Claims

1. A packaging mechanism for an LED patch bracket, comprising a stand (10), characterized in that: An upper pressing assembly, the upper pressing assembly includes a fixing frame (11) fixed to the upper end surface of the frame (10), a first cylinder (50) is fixedly mounted on the fixing frame (11), a lifting frame (51) is fixedly mounted on the piston end of the first cylinder (50), an upper mold (52) is fixedly connected to the inner wall of the lifting frame (51), and a glue injection assembly is provided at the center of the upper mold (52); A pressing assembly, the pressing assembly comprising a bottom frame (70) fixedly mounted at the center of the stand (10), a second cylinder (71) fixedly mounted on the bottom frame (70), a placement plate (72) for placing LED patches fixedly mounted on the piston end of the second cylinder (71), and conveying assemblies provided on both sides of the placement plate (72); A material lifting assembly, the material lifting assembly includes a support plate (30) fixedly mounted on a stand (10), a first electric slide rail (31) fixedly mounted on a side wall of the support plate (30), an adapted first electric slider (32) provided on the first electric slide rail (31), a second electric slide rail (37) fixedly mounted on a side wall of the first electric slider (32), a second electric slider (38) provided on the second electric slide rail (37), a connecting frame (33) fixedly mounted on a side wall of the second electric slider (38), a square plate (34) fixedly mounted on an end of the connecting frame (33), suction cups (35) provided at four corners of the square plate (34), and a material storage assembly provided below the plurality of suction cups (35); The conveying assembly comprises a fixed plate (60) symmetrically fixed on the stand (10), a plurality of guide wheels (61) are fixedly mounted on the side walls of the two fixed plates (60), a conveyor belt (62) for conveying LED patches is sleeved on the outer walls of the plurality of guide wheels (61), the conveyor belt (62) is connected to the guide wheels (61) in a transmission manner, a driving motor (64) is fixedly mounted on the side wall of the fixed plate (60), and a driving wheel (65) for driving the conveyor belt (62) is fixedly mounted on the output end of the driving motor (64); The opposite side walls of the fixed plate (60) are each provided with a sliding groove (63), two connecting members (40) are slidably connected to the sliding groove (63), and distance sensors (41) are fixedly mounted on the side walls of the two connecting members (40).

2. The packaging mechanism for an LED patch bracket according to claim 1, characterized in that: The glue injection assembly includes a glue injection head (53) movably connected to the center of the upper mold (52), the top end of the glue injection head (53) is connected to a liquid guide tube (54), the other end of the liquid guide tube (54) is connected to a liquid pump (56), the liquid pump (56) is connected to a liquid storage tank (55) through another section of the liquid guide tube (54), a heating rod (57) is inserted at the center of the liquid storage tank (55), and the heating rod (57) is connected to a controller (58) through a wire.

3. The packaging mechanism for an LED patch bracket according to claim 1, characterized in that: The material storage assembly comprises a third cylinder (36) fixedly mounted on the lower end surface of the stand (10), and a material storage plate (361) for storing LED light sheets is fixedly mounted on the movable end of the third cylinder (36).

4. The packaging mechanism for an LED patch bracket according to claim 1, characterized in that: An electricity storage box (80) for power supply is fixedly installed on the inner side of the stand (10).

5. The packaging mechanism for an LED patch bracket according to claim 1, characterized in that: A control panel (20) is fixedly mounted on the upper end surface of the stand (10).

6. The packaging mechanism for an LED patch bracket according to claim 5, characterized in that: An opening (721) for sensing by the signal sensing end of the distance sensor (41) is provided at a corner of the storage plate (72).

7. A packaging method for an LED chip bracket, characterized in that: The packaging mechanism for an LED patch bracket according to any one of claims 1 to 6 comprises the following steps: A plurality of LED patches to be processed are stored on a storage plate (392), and the LED patches are transported to a storage plate (72) by a provided lifting assembly. Glue is sprayed into a circulation channel of the LED patches by a provided glue injection assembly, and the LED patches on the storage plate (72) are pressed by a provided upper pressing assembly, so that the glue is circulated to the surrounding channels by pressure, thereby completing the packaging. The mounted LED patches are moved downward by a provided second cylinder (71), so that the LED patches can fall onto a conveyor belt (62), so that the conveyor belt (62) conveys the LED patches to a later processing site.

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