Cutting apparatus and method of manufacturing cut products

Abstract

A cutting device receives process water supplied from a water supply device outside the cutting device. The cutting device has a cutting section, a supply section, a detection section, a regulation section, and a control section. The cutting section cuts a cutting object. The supply section directly or indirectly supplies the process water supplied from the water supply device to at least one of the cutting object and the cutting section. The detection section detects a flow rate of the process water supplied by the supply section. The regulation section regulates the flow rate of the process water supplied by the supply section. The control section performs both feedforward control of the regulation section based on a disturbance factor before cutting of the cutting object and feedback control of the regulation section based on a detection result of the detection section to make the detection result close to a target value.

Description

Technical Field

[0001] This invention relates to a cutting device and a method for manufacturing a cut-up product. Background Technology

[0002] Japanese Patent Application Publication No. 2002-313753 (Patent Document 1) discloses a cutting apparatus. In this chip cutting apparatus, a workpiece is processed by a machining section, and cutting water is supplied to the machining section during workpiece processing. The amount of cutting water supplied to the machining section is regulated by a flow regulator. In this cutting apparatus, by using the detection signal of a flow sensor that detects the flow rate of the cutting water as a feedback signal to control the flow regulator, fluctuations in the flow rate of the cutting water can be suppressed (see Patent Document 1).

[0003] Existing technical documents

[0004] Patent Document 1: Japanese Patent Application Publication No. 2002-313753

[0005] In the cutting apparatus disclosed in Patent Document 1, the flow rate of the cutting water (an example of process water) supplied to the machining section is affected by interference factors (such as water pressure fluctuations in the water supply equipment that supplies the cutting water to the cutting apparatus). Due to these interference factors, the responsiveness of the cutting water flow control deteriorates, resulting in overshoot. Patent Document 1 does not disclose any means for solving this problem. Summary of the Invention

[0006] The present invention was made to solve this problem, and its purpose is to provide a cutting device and a method for manufacturing a cutting product that can suppress the deterioration of responsiveness and the generation of overshoot in the flow control of process water.

[0007] According to one aspect of the present invention, a cutting device receives process water supplied from a water supply device outside the cutting device. The cutting device includes a cutting section, a supply section, a detection section, a regulating section, and a control section. The cutting section cuts the object to be cut. The supply section supplies process water supplied from the water supply device directly or indirectly to at least one of the object to be cut and the cutting section. The detection section detects the flow rate of the process water supplied by the supply section. The regulating section regulates the flow rate of the process water supplied by the supply section. The control section performs both feedforward control of the regulating section based on interference factors and feedback control of the regulating section based on the detection results of the detection section to make the detection results approach a target value before cutting the object to be cut.

[0008] According to another aspect of the present invention, a method for manufacturing a cut-off article is a method for manufacturing a cut-off article using the above-described cutting device, including the step of cutting the object to be cut using the above-described cutting device.

[0009] Invention Effects

[0010] According to the present invention, a method for manufacturing a cutting device and a cutting product capable of suppressing responsiveness degradation and overshoot in process water flow control is provided. Attached Figure Description

[0011] Figure 1 It is a schematic top view of the cutting device.

[0012] Figure 2 It is a schematic diagram showing the flow path structure of process water in the cut-off device.

[0013] Figure 3 It is a diagram that schematically represents the hardware structure of a computer.

[0014] Figure 4 This is a diagram illustrating an example of the flow rate shift of cutting water in the supply section under feedback control.

[0015] Figure 5 This is a control block diagram related to the flow control of cutting water in the supply department.

[0016] Figure 6 This is a diagram showing an example of a table of correction values.

[0017] Figure 7 This diagram illustrates an example of the flow rate shift of cutting water in the supply section under both feedback control and feedforward control conditions.

[0018] Figure 8 This is a flowchart illustrating an example of a processing step in feedback control.

[0019] Figure 9 This is a flowchart illustrating an example of a processing step in feedforward control. Detailed Implementation

[0020] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail using the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same symbols, and their descriptions will not be repeated. Additionally, for ease of understanding, objects are appropriately omitted or exaggerated in the drawings, and the depictions are schematic.

[0021] [1. Structure]

[0022] <1-1. Overall Structure of the Cutting Device>

[0023] Figure 1This is a schematic top view of the cutting device 1 according to this embodiment. The cutting device 1 is configured to monolithize a packaging substrate (an example of a cut object) into multiple electronic components (packaging components (an example of a cut object)) by cutting the packaging substrate. In the packaging substrate, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin. In addition, the cut object is not necessarily a packaging substrate; for example, it may be a substrate that is not sealed with resin (including a wafer).

[0024] Examples of packaging substrates include BGA (Ball Grid Array) packaging substrates, LGA (Land Grid Array) packaging substrates, CSP (Chip Size Package) packaging substrates, LED (Light Emitting Diode) packaging substrates, and QFN (Quad Flat No-leaded) packaging substrates.

[0025] Furthermore, the cutting device 1 is configured to inspect each of the multiple monolithically assembled electronic components individually. In the cutting device 1, images of each electronic component are captured, and inspections are performed based on these images. Inspection data is generated from this inspection, classifying each electronic component as either "good" or "defective."

[0026] In this example, a packaging substrate P1 is used as the object to be cut, and the cutting device 1 monolithizes the packaging substrate P1 into multiple electronic components S1 (not shown). Hereinafter, the surface of the packaging substrate P1 that is sealed with resin is referred to as the molding surface, and the surface opposite to the molding surface is referred to as the ball / lead surface. In addition, when the object to be cut is a substrate that is not sealed with resin, the surface facing upward during cutting (the cutting surface) corresponds to the ball / lead surface in this embodiment, and the surface opposite to the cutting surface corresponds to the molding surface in this embodiment.

[0027] like Figure 1 As shown, the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as components. The cutting module A1 is configured to manufacture multiple electronic components S1 by cutting the packaging substrate P1. The inspection / storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable relative to the other components.

[0028] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting worktable 5, a spindle unit 6, and a conveying unit 7.

[0029] The substrate supply unit 3 supplies the packaging substrates P1 one by one to the positioning unit 4 by ejecting the packaging substrates P1 one by one from the cassette M1 that contains a plurality of packaging substrates P1. At this time, the packaging substrates P1 are configured with the ball / lead surface facing upward.

[0030] The positioning unit 4 positions the packaging substrate P1, which is pushed out from the substrate supply unit 3, on the track unit 4a. Afterward, the positioning unit 4 transports the positioned packaging substrate P1 to the cutting table 5.

[0031] The cutting stage 5 holds the packaged substrate P to be cut. In this example, a cutting device 1 with a double cutting stage structure having two cutting stages 5 is shown. The cutting stage 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the packaged substrate P1 by adsorbing it from below and conveying it by the positioning part 4. The rotating mechanism 5b is capable of rotating the holding member 5a in the θ1 direction shown in the figure. The moving mechanism 5c is capable of moving the holding member 5a along the Y-axis shown in the figure.

[0032] The spindle section 6 cuts through the packaging substrate P1, monolithically dividing the packaging substrate P1 into multiple electronic components S1. Here, a cutting device 1 with a dual-spindle structure having two spindle sections 6 is shown. The spindle sections 6 are movable along the X and Z axes shown in the figure. Alternatively, the cutting device 1 can also be a single-spindle structure having one spindle section 6.

[0033] The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a, through high-speed rotation, cuts the packaging substrate P1, monolithically dividing the packaging substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state where it is held by a first flange and a second flange (not shown). The first flange and the second flange are fixed to the rotating shaft 6c by fastening components (not shown), such as nuts. The first flange is also referred to as the inner flange, and the second flange is also referred to as the outer flange.

[0034] A water-cooling nozzle (supply section 100, 110) is provided on the spindle section 6. Figure 2 The system includes nozzles for cooling water (supply units 102, 112) and nozzles for waste rinsing water (supply units 120, 122). The cutting water nozzles spray cutting water onto the high-speed rotating blade 6a. The cooling water nozzles spray cooling water near the cutting portion of the packaging substrate P1. The waste rinsing water nozzles spray waste rinsing water to remove chips and other debris. Furthermore, cutting water, cooling water, and waste rinsing water are examples of process water.

[0035] After the cutting stage 5 picks up the packaging substrate P1, the first position confirmation camera 5d photographs the packaging substrate P1 to confirm its position. The confirmation performed using the first position confirmation camera 5d includes, for example, confirming the position of a mark provided on the packaging substrate P1. This mark, for example, indicates the cutting position of the packaging substrate P1.

[0036] Next, the cutting stage 5 moves along the Y-axis of the spindle portion 6 as shown in the figure. After the cutting stage 5 moves below the spindle portion 6, the packaging substrate P1 is cut by moving the cutting stage 5 and the spindle portion 6 relative to each other. Then, the packaging substrate P1 is photographed by the second position confirmation camera 6b provided in the spindle portion 6 as needed to confirm the position of the packaging substrate P1, etc. The confirmation performed using the second position confirmation camera 6b is, for example, the confirmation of the cutting position and cutting width of the packaging substrate P1.

[0037] After the cutting of the packaging substrate P1 is completed, the cutting stage 5 moves away from the mandrel portion 6 along the Y-axis in the figure, while adsorbing multiple monolithized electronic components S1. During this movement, the upper surface (ball / lead surface) of the electronic components S1 is cleaned and dried by the first cleaner 5e. This cleaning can be performed, for example, by directly spraying cleaning water onto the upper surface of the electronic components S1, or by supplying cleaning water to the upper surface of the electronic components S1 via a brush or the like. The cleaning water used in the first cleaner 5e is an example of process water. Furthermore, the cutting device 1 is provided with two first cleaners 5e arranged along the X-axis direction in the figure, but the number of first cleaners 5e is not limited to this.

[0038] The conveying unit 7 picks up the electronic component S1 held by the cutting worktable 5 from above and transports the electronic component S1 to the inspection worktable 11 of the inspection / storage module B1. During this transport process, the lower surface (molded surface) of the electronic component S1 is cleaned and dried using the second cleaner 7a. This cleaning can be performed, for example, by directly spraying cleaning water onto the lower surface of the electronic component S1, or by supplying cleaning water to the lower surface of the electronic component S1 via a brush or the like. Furthermore, the cleaning water used in the second cleaner 7a is, for example, process water.

[0039] The inspection / storage module B1 mainly includes an inspection workbench 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. Alternatively, the first optical inspection camera 12 can also be installed in the cutting module A1.

[0040] The inspection table 11 holds the electronic component S1 for optical inspection. The inspection table 11 is movable along the X-axis shown in the figure. Furthermore, the inspection table 11 is tiltable. The inspection table 11 is equipped with a holding member that holds the electronic component S1 by adsorbing it.

[0041] The first optical inspection camera 12 and the second optical inspection camera 13 photograph both sides (ball / pin side and molded side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively configured to take images from above near the inspection worktable 11.

[0042] The first optical inspection camera 12 captures the molded surface of the electronic component S1, which is conveyed from the transport unit 7 to the inspection table 11. Then, the transport unit 7 places the electronic component S1 onto the holding member of the inspection table 11. After the holding member holds the electronic component S1, the inspection table 11 flips up and down. The inspection table 11 moves upwards towards the second optical inspection camera 13, which captures the ball / pin surface of the electronic component S1.

[0043] The inspected electronic component S1 is placed in the placement unit 14. The placement unit 14 is movable along the Y-axis shown in the figure. The inspection worktable 11 places the inspected electronic component S1 in the placement unit 14.

[0044] The extraction unit 15 transfers the electronic components S1 disposed in the placement unit 14 to the tray. The electronic components S1 are classified as "good" or "defective" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the classification results, the extraction unit 15 transfers each electronic component S1 to either a good product tray 15a or a defective product tray 15b. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. Each good product tray 15a and defective product tray 15b is replaced with a new tray when it is full of electronic components S1.

[0045] The cutting device 1 also includes a computer 50 and a monitor 20. The monitor 20 is configured to display images. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

[0046] Computer 50 controls the operation of various parts of, for example, the cutting module A1 and the inspection / collection module B1. Computer 50 controls, for example, the operation of the substrate supply unit 3, positioning unit 4, cutting worktable 5, spindle unit 6, transport unit 7, inspection worktable 11, first optical inspection camera 12, second optical inspection camera 13, placement unit 14, extraction unit 15, and monitor 20. The structure of computer 50 will be described in detail later.

[0047] <1-2. Flow path structure of process water>

[0048] As described above, in the cutting device 1, process water is used in the spindle section 6, the first cleaner 5e, and the second cleaner 7a, respectively. The process water is supplied from a water supply device 400 outside the cutting device 1. Figure 2 ) to supply to each part of the cutting device 1.

[0049] Figure 2 This is a schematic diagram illustrating the flow path structure of the process water in the cutoff device 1. For example... Figure 2 As shown, supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140 are connected to the water supply equipment 400 via a common pipe PL1. Pipe PL1 branches at branch point PO1, and any one of the supply units is connected to each branch end. Supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140 are configured to directly or indirectly supply process water supplied from the water supply equipment 400 to at least one of the object to be cut (including the packaging substrate P1 and the electronic component S1) and the blade 6a.

[0050] Supply units 100 and 102 are each mounted on a spindle unit 6. Supply unit 100 is composed of a cutting water nozzle, and supply unit 102 is composed of a cooling water nozzle. Supply unit 102 includes a first nozzle 104 and a second nozzle 106. The first nozzle 104 is also called a standard nozzle and is used to spray cooling water onto a standard-sized cutting object. The second nozzle 106 is also called a fork nozzle and is used to spray cooling water onto a cutting object smaller than the standard size. The size of the supply port in the second nozzle 106 is smaller than the size of the supply port in the first nozzle 104.

[0051] Supply units 110 and 112 are respectively mounted on another spindle unit 6. Supply unit 110 is composed of a cutting water nozzle, and supply unit 112 is composed of a cooling water nozzle. Supply unit 112 includes a first nozzle 114 and a second nozzle 116. The first nozzle 114 is also called a standard nozzle and is used to spray cooling water onto a standard-sized cutting object. The second nozzle 116 is also called a fork nozzle and is used to spray cooling water onto a cutting object smaller than the standard size. The size of the supply port in the second nozzle 116 is smaller than the size of the supply port in the first nozzle 114.

[0052] Supply units 120 and 122 are each composed of nozzles for rinsing waste water. Supply unit 120 is mounted on one spindle unit 6, and supply unit 122 is mounted on another spindle unit 6. Supply units 130, 132, and 140 are each composed of nozzles for cleaning water. Supply unit 130 is mounted on one first cleaner 5e, and supply unit 132 is mounted on another first cleaner 5e. Supply unit 140 is mounted on a second cleaner 7a.

[0053] A flow sensor SE10 and a pressure gauge 410 are installed in the flow path from the water supply equipment 400 to the branch point PO1. The flow sensor SE10 is configured to detect the amount (water volume) of process water supplied from the water supply equipment 400 to the shut-off device 1. The pressure gauge 410 is configured to detect the pressure (water pressure) of the process water supplied from the water supply equipment 400 to the shut-off device 1.

[0054] In the flow path from branch point PO1 to supply unit 100, a solenoid valve 300, a proportional control valve 200, and a flow sensor SE1 are sequentially arranged. The solenoid valve 300 is configured to open and close according to control from the computer 50. The proportional control valve 200 is configured to adjust its opening degree according to control from the computer 50. By adjusting the opening degree of the proportional control valve 200, the flow rate of process water (cutting water) supplied to supply unit 100 can be controlled. The flow sensor SE1 is configured to detect the flow rate of process water supplied to supply unit 100.

[0055] In addition, along the flow path from branch point PO1 to supply unit 102, besides the aforementioned solenoid valve 300, a proportional control valve 202, a flow sensor SE2, and a three-way solenoid valve 302 are sequentially arranged. The proportional control valve 202 is configured to adjust its opening degree according to control from the computer 50. By adjusting the opening degree of the proportional control valve 202, the flow rate of process water (cooling water) supplied to supply unit 102 can be controlled. The flow sensor SE2 is configured to detect the flow rate of process water supplied to supply unit 102. The three-way solenoid valve 302 is configured to switch between supplying process water to either the first nozzle 104 or the second nozzle 106 according to control from the computer 50.

[0056] Along the flow path from branch point PO1 to supply unit 110, a solenoid valve 310, a proportional control valve 210, and a flow sensor SE3 are sequentially arranged. The solenoid valve 310 is configured to open and close under control from the computer 50. The proportional control valve 210 is configured to adjust its opening degree under control from the computer 50. By adjusting the opening degree of the proportional control valve 210, the flow rate of process water (cutting water) supplied to supply unit 110 can be controlled. The flow sensor SE3 is configured to detect the flow rate of process water supplied to supply unit 110.

[0057] In addition, along the flow path from branch point PO1 to supply unit 112, besides the aforementioned solenoid valve 310, a proportional control valve 212, a flow sensor SE4, and a three-way solenoid valve 312 are sequentially arranged. The proportional control valve 212 is configured to adjust its opening degree according to control from computer 50. By adjusting the opening degree of the proportional control valve 212, the flow rate of process water (cooling water) supplied to supply unit 112 can be controlled. The flow sensor SE4 is configured to detect the flow rate of process water supplied to supply unit 112. The three-way solenoid valve 312 is configured to switch between supplying process water to either the first nozzle 114 or the second nozzle 116 according to control from computer 50.

[0058] Along the flow path from branch point PO1 to supply unit 120, a solenoid valve 320, a flow sensor SE5, and a needle-type adjustable throttle valve 322 are sequentially arranged. The solenoid valve 320 is configured to open and close according to control from the computer 50. The flow sensor SE5 is configured to detect the flow rate of process water (waste flushing water) supplied to supply unit 120. The needle-type adjustable throttle valve 322 is configured to receive manual adjustment instructions from the operator regarding the flow rate of the process water. The flow rate of the process water supplied to supply unit 120 is adjusted by the operator's operation of the needle-type adjustable throttle valve 322.

[0059] Along the flow path from branch point PO1 to supply unit 122, a solenoid valve 330, a flow sensor SE6, and a needle-type adjustable throttle valve 332 are sequentially arranged. The solenoid valve 330 is configured to open and close under control from the computer 50. The flow sensor SE6 is configured to detect the flow rate of process water (waste flushing water) supplied to supply unit 122. The needle-type adjustable throttle valve 332 is configured to receive manual adjustment instructions from the operator regarding the flow rate of the process water. The flow rate of the process water supplied to supply unit 122 is adjusted by the operator's operation of the needle-type adjustable throttle valve 332.

[0060] Along the flow path from branch point PO1 to supply unit 130, a solenoid valve 340, a flow sensor SE7, and a needle-type adjustable throttle valve 342 are sequentially arranged. The solenoid valve 340 is configured to open and close under control from the computer 50. The flow sensor SE7 is configured to detect the flow rate of the process water (cleaning water) supplied to supply unit 130. The needle-type adjustable throttle valve 342 is configured to receive manual adjustment instructions from the operator regarding the flow rate of the process water. The flow rate of the process water supplied to supply unit 130 is adjusted by the operator's operation of the needle-type adjustable throttle valve 342.

[0061] Along the flow path from branch point PO1 to supply unit 132, a solenoid valve 350, a flow sensor SE8, and a needle-type adjustable throttle valve 352 are sequentially arranged. The solenoid valve 350 is configured to open and close under control from the computer 50. The flow sensor SE8 is configured to detect the flow rate of the process water (cleaning water) supplied to supply unit 132. The needle-type adjustable throttle valve 352 is configured to receive manual adjustment instructions from the operator regarding the flow rate of the process water. The flow rate of the process water supplied to supply unit 132 is adjusted by the operator's operation of the needle-type adjustable throttle valve 352.

[0062] Along the flow path from branch point PO1 to supply unit 140, a solenoid valve 360, a needle valve 362, and a flow sensor SE9 are sequentially arranged. The solenoid valve 360 ​​is configured to open and close under control from the computer 50. The needle valve 362 is configured to receive manual adjustment instructions from the operator regarding the flow rate of the process water. Compared to using adjustable needle valves (e.g., adjustable needle valves 322, 332, 342, 352), the flow rate of the process water can be adjusted with greater precision using the needle valve 362. The flow rate of the process water supplied to supply unit 140 is adjusted by the operator's operation of the needle valve 362. The flow sensor SE9 is configured to detect the flow rate of the process water (cleaning water) supplied to supply unit 140. Thus, in the shut-off device 1, process water is supplied from the shared water supply equipment 400 to each supply unit.

[0063] <1-3. Computer Hardware Structure>

[0064] Figure 3 This is a schematic diagram representing the hardware structure of computer 50. For example... Figure 3 As shown, the computer 50 includes a control unit 70, an input / output (I / F) interface 90, a receiving unit 95, and a storage unit 80, all of which are electrically connected via a bus.

[0065] The control unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read Only Memory) 76, etc. The control unit 70 is configured to control the various components within the computer 50 and the various components within the cutting device 1 in response to information processing.

[0066] The input / output (I / F) 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The I / F 90 is used to send data from the computer 50 to each component within the cutting device 1 and to receive data sent from each component within the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive instructions from the user (operator). The receiving unit 95 may consist of, for example, part or all of a touch panel, keyboard, mouse, and microphone.

[0067] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The storage unit 80 is configured, for example, as a storage control program 81. The control program 81 is executed by the control unit 70, thereby implementing various operations in the disconnection device 1. When the control unit 70 executes the control program 81, the control program 81 is expanded in the RAM 74. Then, the control unit 70 controls each component by having the CPU 72 interpret and execute the control program 81 expanded in the RAM 74.

[0068] [2. Suppressing the influence of interference factors on process water flow control]

[0069] As described above, for example, when cutting the packaging substrate P1, cutting water and cooling water (an example of process water) are sprayed onto the packaging substrate P1. The flow rate of the process water (hereinafter also referred to as "cutting water, etc.") sprayed onto the packaging substrate P1 when cutting it affects the quality of the manufactured electronic component S1. In order to suppress the degradation of the quality of the electronic component S1, it is important to control the flow rate of the cutting water, etc. Since cutting water and cooling water can be said to be the same, the following explanation focuses on cutting water.

[0070] For example, in order to maintain the flow rate of the cutting water at a specified setpoint (target value), feedback control is considered. For example, when the supply unit 100 ( Figure 2 In the feedback control of the cutting water supply to approach the target value, the opening of the proportional control valve 200 is adjusted according to the detection result of the flow sensor SE1 so that the detection result of the flow sensor SE1 approaches the target value.

[0071] Figure 4 This is a diagram illustrating an example of the shift in the cutter water supply under feedback control. (See reference...) Figure 4The horizontal axis represents time, and the vertical axis represents the amount of cutting water supplied.

[0072] For example, if the supply unit 100 is not affected by any interference factors (in the flow path from the water supply equipment 400 to the supply unit 100) Figure 2 When the process water supplied in the supply section 100 is at the same flow rate as expected, the amount of cutting water supplied in the supply section 100 changes with the shift L1 (theoretical value). In terms of the amount of cutting water supplied in the supply section 100, the interfering factor is the factor that affects the amount of process water supplied from the water supply equipment 400 to the flow path of the supply section 100.

[0073] As examples of interfering factors, the water pressure in the water supply equipment 400, the amount of process water supplied from the water supply equipment 400, the water supply status of the water supply equipment 400 to devices other than the shut-off device 1 (not shown), the type of nozzles used in the supply sections 102 and 112 (standard nozzles or fork nozzles), and the number of supply sections that simultaneously supply process water in the set including supply sections 100, 102, 110, 112, 120, 122, 130, 132, and 140 are listed. For example, when the number of supply sections that simultaneously supply process water increases, the amount of process water supplied to the flow path from the water supply equipment 400 to the supply section 100 is affected because competition arises between the supply sections that supply process water flowing through the piping PL1.

[0074] In the case of feedback control, for example, when the supply unit 100 is affected by disturbances and only process water with a flow rate lower than expected is supplied in the flow path from the water supply equipment 400 to the supply unit 100, the supply amount of cutting water in the supply unit 100 changes with the passage L2. That is, the responsiveness of the cutting water flow control deteriorates, and the time until the supply amount of cutting water reaches the target value becomes longer.

[0075] On the other hand, in the case of feedback control, for example, when the supply unit 100 is affected by a disturbance and the flow path from the water supply equipment 400 to the supply unit 100 supplies more process water than expected, the supply amount of cutting water in the supply unit 100 shifts with the passage L3. That is, an overshoot occurs in the flow control of the cutting water, and a situation arises where the supply amount of cutting water temporarily exceeds the target value.

[0076] In the cutting device 1 according to Embodiment 1, efforts are made to suppress these problems. Specifically, in the cutting device 1, in addition to feedback control, feedforward control is performed in the flow control of the cutting water, etc. In the feedforward control, the regulating unit (e.g., proportional control valve 200) is controlled based on interference factors before the object to be cut is cut. Since the same control is performed in the supply units 100, 102, 110, and 112, the flow control of the cutting water in the supply unit 100 will be described representatively below.

[0077] Figure 5 This is a control block diagram related to the flow control of the cutting water in the supply unit 100. For example... Figure 5 As shown, the control unit 70 includes a subtraction unit 710, a feedback control unit 720, a multiplication unit 730, and a feedforward control unit 740.

[0078] The flow sensor SE1 detects the amount of cutting water supplied by the supply unit 100. The subtraction calculation unit 710 calculates the difference between the detected value represented by the flow sensor SE1 and the target value of the amount of cutting water supplied by the supply unit 100. Information representing this target value (target value information) is stored, for example, in the storage unit 80. Figure 3 In this process, the feedback control unit 720 generates a command value indicating the opening degree of the proportional control valve 200 based on the calculation result of the subtraction unit 710, so that the detection result of the flow sensor SE1 is close to the target value, and outputs the generated command value. For example, the opening degree of the proportional control valve 200 is controlled according to the voltage applied to the proportional control valve 200, and the command value generated by the feedback control unit 720 represents the voltage value.

[0079] The feedforward control unit 740 acquires information about the aforementioned interference factors (interference factor information). For example, the feedforward control unit 740 acquires information related to the respective on / off states of solenoid valves 300, 310, 320, 330, 340, 350, and 360, as well as information related to the connection states of three-way solenoid valves 302 and 312. Based on this, the feedforward control unit 740 determines the operating state of each supply unit. For example, based on the operating state of each supply unit, the feedforward control unit 740 generates correction values ​​to correct the command values ​​generated by the feedback control unit 720.

[0080] Figure 6 This is a diagram illustrating an example of a correction value table 500. The correction value table 500 is, for example, stored in the storage unit 80. Figure 6As shown, in the calibration value table 500, a provisional calibration value is established for each combination of the on / off states of the solenoid valves 300, 310, 320, 330, 340, 350, and 360, and the types of nozzles used in each of the supply units 102 and 112. That is, in the calibration value table 500, a provisional calibration value is established for each combination of supply units that simultaneously supply process water from the set including supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140.

[0081] Refer again Figure 6 The feedforward control unit 740 determines a provisional correction value corresponding to the combination of usage states of each supply unit by referring to the correction value table 500. The feedforward control unit 740 corrects the provisional correction value based, for example, on other interfering factors (e.g., water pressure of the water supply equipment 400, the amount of process water supplied from the water supply equipment 400, and the supply status of water from the water supply equipment 400 to devices other than the shut-off device 1), and outputs the corrected correction value. For example, if the water pressure of the water supply equipment 400 is lower than expected, the provisional correction value is corrected by increasing the opening degree of the proportional control valve 200.

[0082] The multiplication unit 730 multiplies the command value output by the feedback control unit 720 by the correction value output by the feedforward control unit 740. The calculation result (corrected command value) of the multiplication unit 730 is output to the proportional control valve 200 to adjust the opening of the proportional control valve 200.

[0083] Figure 7 This diagram illustrates an example of the flow rate shift of the cutting water in the supply unit 100 under both feedback control and feedforward control conditions. (See reference...) Figure 7 The horizontal axis represents time, and the vertical axis represents the supply amount of cutting water. With both feedback control and feedforward control in place, the supply amount of cutting water in the supply unit 100 changes with the shift L4. Thus, by implementing both feedback control and feedforward control, it is possible to suppress the deterioration of responsiveness and the generation of overshoot in the flow control of the cutting water (process water).

[0084] [3. Action]

[0085] As described above, the control unit 70 performs both feedback control and feedforward control. In the shut-off device 1, the process water flow rates in each of the supply units 100, 102, 110, and 112 are controlled in the same way (feedback control and feedforward control). Hereinafter, the flow rate control of the process water in the supply unit 100 will be described as representative.

[0086] Figure 8This is a flowchart illustrating an example of a processing step in feedback control. The processing shown in this flowchart is repeatedly executed by the feedback control unit 720 of the control unit 70 in the process water supply of the supply unit 100.

[0087] refer to Figure 8 The feedback control unit 720 determines whether the detection result of the flow sensor SE1 is the target value (step S100). When it is determined that the detection result of the flow sensor SE1 is not the target value ("No" in step S100), the feedback control unit 720 regenerates the command value to make the flow rate of the cutting water close to the target value (step S110).

[0088] For example, if the detection result of the flow sensor SE1 does not reach the target value, a command value is generated to make the opening degree of the proportional control valve 200 larger; on the other hand, if the detection result of the flow sensor SE1 exceeds the target value, a command value is generated to make the opening degree of the proportional control valve 200 smaller.

[0089] On the other hand, in step S100, when it is determined that the detection result of the flow sensor SE1 is the target value ("Yes" in step S100), the feedback control unit 720 maintains the command value (step S120). The feedback control unit 720 outputs the command value generated in step S110 or the command value maintained in step S120 (step S130).

[0090] Figure 9 This is a flowchart illustrating an example of a processing step in feedforward control. The processing shown in this flowchart is repeatedly executed by the feedforward control unit 740 of the control unit 70 in the process water supply of the supply unit 100.

[0091] Reference Figure 9 The feedforward control unit 740 determines whether an interference factor affecting the amount of process water supplied in the flow path from the water supply equipment 400 to the supply unit 100 has been detected (step S200). If it is determined that no interference factor has been detected ("No" in step S200), the process is transferred to return.

[0092] On the other hand, when it is determined that an interference factor has been detected ("Yes" in step S200), the feedforward control unit 740 generates a correction value corresponding to the detected interference factor (step S210). The feedforward control unit 740 outputs the generated correction value (step S220).

[0093] As described above, in the control unit 70, a corrected command value is calculated by multiplying the command value generated by the feedback control unit 720 by a correction value generated by the feedforward control unit 740. Based on the corrected command value, the control unit 70 controls the proportional control valve 200, thereby adjusting the flow rate of the cutting water in the supply unit 100.

[0094] [4. Characteristics]

[0095] As described above, in the cutting device 1 of this embodiment, the control unit 70 performs feedforward control and feedback control. The feedforward control controls the adjustment unit (e.g., proportional control valve 200) based on interference factors before the object to be cut is cut, and the feedback control unit controls the adjustment unit based on the detection result of the detection unit (e.g., flow sensor SE1) to make the detection result close to the target value. According to the cutting device 1, since the adjustment unit is adjusted in response to interference factors, the deterioration of responsiveness and the generation of overshoot in the flow control of cutting water (process water) can be suppressed.

[0096] Furthermore, the cutting device 1 is an example of a "cutting device" in this invention. The water supply device 400 is an example of a "water supply device" in this invention. The blade 6a is an example of a "cutting section" in this invention. The encapsulation substrate P1 is an example of a "cutting object" in this invention. The supply sections 100, 102, 110, and 112 are examples of "supply sections" in this invention. The flow sensors SE1, SE2, SE3, and SE4 are examples of "detection sections" in this invention. The proportional control valves 200, 202, 210, and 212 are examples of "adjustment sections" in this invention. The control section 70 is an example of a "control section" in this invention. The supply sections 120, 122, 130, 132, and 140 are examples of at least a portion of "a plurality of other supply sections" in this invention. The storage section 80 is an example of a "storage section" in this invention.

[0097] [5. Other Implementation Methods]

[0098] The ideas behind the above embodiments are not limited to those described above. Hereinafter, an example of another embodiment to which the ideas of the above embodiments can be applied will be described.

[0099] <5-1>

[0100] In the above embodiment, examples of interfering factors include the water pressure in the water supply equipment 400, the amount of process water supplied from the water supply equipment 400, the water supply status of the water supply equipment 400 to devices other than the shut-off device 1, the type of nozzles used in the supply sections 102 and 112, and the number of supply sections that simultaneously supply process water in the set including supply sections 100, 102, 110, 112, 120, 122, 130, 132, and 140. Furthermore, a modified correction value is generated by correcting a provisional correction value determined in response to the combination of usage states of each supply section based on other interfering factors (e.g., the water pressure of the water supply equipment 400, the amount of process water supplied from the water supply equipment 400, and the water supply status of the water supply equipment 400 to devices other than the shut-off device 1). However, the method for generating the correction value is not limited to this.

[0101] For example, provisional correction values ​​managed by correction value table 500 can also be used directly as correction values. In addition, correction values ​​can be generated based on, for example, only the water pressure of water supply equipment 400, the amount of process water supplied from water supply equipment 400, the supply status of water supply equipment 400 to devices other than shut-off device 1, the type of nozzles used in supply units 102 and 112, and at least a portion of the number of supply units that simultaneously supply process water in the set including supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140.

[0102] <5-2>

[0103] Furthermore, the flow rate of process water in each of the supply sections 120, 122, 130, 132, and 140 can be adjusted using proportional control valves, rather than using needle-type adjustable throttle valves or needle-type regulating valves. In this case, the opening degree of each proportional control valve, like proportional control valve 200, can also be adjusted through both feedback control and feedforward control.

[0104] <5-3>

[0105] Furthermore, in the above embodiment, the shut-off device 1 includes nine supply units, but the number of supply units included in the shut-off device 1 is not limited to this. The shut-off device 1 only needs to include at least one supply unit that regulates the process water flow rate through a proportional control valve.

[0106] <5-4>

[0107] Furthermore, in the above embodiment, the control unit 70 may, for example, update the provisional correction value managed in the correction value table 500 based on the detection result of the flow sensor (e.g., flow sensor SE1) after feedforward control using the provisional correction value managed in the correction value table 500. That is, the control unit 70 may, for example, update the correction value corresponding to the combination of the supply unit that simultaneously supplies process water based on the detection result of the flow sensor. As a result, the accuracy of the correction value managed in the correction value table 500 can be further improved.

[0108] <5-5>

[0109] Furthermore, in the above embodiment, in addition to process water, both process water and air can be supplied from each supply unit. By ejecting air along with the process water, the ejection pressure of the process water can be increased.

[0110] The embodiments of the present invention have been described above by way of example. That is, the detailed description and drawings have been disclosed for illustrative purposes. Therefore, the constituent elements described in the detailed description and drawings may include those that are not essential for solving the problem. Therefore, these non-essential constituent elements should not be assumed to be essential simply because they are described in the detailed description and drawings.

[0111] Furthermore, the above-described embodiments are merely examples of the present invention in all respects. Various modifications and alterations can be made to the above-described embodiments within the scope of the present invention. That is, when implementing the present invention, specific structures can be appropriately adopted according to the embodiments.

[0112] Explanation of reference numerals in the attached figures

[0113] 1. Cutting device; 3. Substrate supply unit; 4. Positioning unit; 4a. Track unit; 5. Cutting worktable; 5a. Holding component; 5b. Rotating mechanism; 5c. Moving mechanism; 5d. First position confirmation camera; 5e. First cleaner; 6. Spindle unit; 6a. Blade; 6b. Second position confirmation camera; 6c. Rotating shaft; 7. Conveying unit; 7a. Second cleaner; 11. Inspection worktable; 12. First optical inspection camera; 13. Second optical inspection camera; 14. Placement unit; 15. Extraction unit; 15a. Good product tray; 15b. Defective product tray; 20. Monitor; 50. Computer; 70. Control unit; 72. CPU; 74. RAM; 76. ROM; 80. Storage unit; 81. Control program; 90. Input / output (I / F); 100; 102; 110; 112; 120; 122; 130; 132; 14 0 Supply Unit, 104, 114 First Nozzle, 106, 116 Second Nozzle, 200, 202, 210, 212 Proportional Control Valve, 300, 310, 320, 330, 340, 350, 360 Solenoid Valve, 302, 312 Three-Way Solenoid Valve, 322, 332, 342, 352 Needle Adjustable Throttle Valve, 362 Needle Regulating Valve, 400 Water Supply Equipment, 410 Pressure Gauge, 500 Calibration Value Table, 710 Subtraction Unit, 720 Feedback Control Unit, 730 Multiplication Unit, 740 Feedforward Control Unit, A1 Cut-off Module, B1 Inspection / Storage Module, B1 Inspection / Storage Module, L1-L4 Push, M1 Material Box, P1 Packaging Substrate, PL1 Piping, POS Branch Point, S1 Electronic Components, SE1-SE10 Flow Sensors.

Claims

1. A shut-off device that receives process water supplied from a water supply device outside the shut-off device, comprising: The cutting section cuts the object to be cut. The supply unit directly or indirectly supplies process water from the water supply equipment to at least one of the object to be cut off and the cutting unit. The detection unit detects the flow rate of the process water supplied by the supply unit. The regulating unit regulates the flow rate of the process water supplied by the supply unit; and The control unit includes a feedforward control unit that performs feedforward control and a feedback control unit that performs feedback control. The feedforward control controls the adjustment unit based on interference factors before the object to be cut is cut, and the feedback control controls the adjustment unit based on the detection results of the detection unit to make the detection results close to the target value. Based on the detection result, the feedback control unit generates an instruction value to instruct the detection result to approach the target value. Before the object to be cut is cut, the feedforward control unit acquires information related to the interference factors, and based on the acquired information related to the interference factors, generates a correction value for correcting the command value. The control unit uses the generated correction value to correct the command value, and controls the adjustment unit based on the corrected command value.

2. The cutting device according to claim 1, wherein, The interfering factors include at least a portion of the water pressure in the water supply equipment, the amount of process water supplied from the water supply equipment, and the water supply status of the water supply equipment to devices other than the cut-off device.

3. The cutting device according to claim 1 or 2, wherein, In the supply section, the size of the process water supply port can be changed. The interfering factors include the size of the supply port used for process water supply.

4. The cutting device according to claim 1 or 2, wherein, The cutting device also includes a plurality of other supply units, each different from the supply unit. The plurality of other supply sections respectively supply process water directly or indirectly to at least one of the object to be cut and the cutting section. The supply unit and the plurality of other supply units are configured to receive process water supplied from the shared water supply equipment.

5. The cutting device according to claim 4, wherein, At least a portion of the other supply units clean the object to be cut by directly or indirectly supplying process water to it.

6. The cutting device according to claim 4, wherein, The interfering factors include the number of supply units that simultaneously supply process water in a set that includes the supply unit and the plurality of other supply units.

7. The cutting device according to claim 4, wherein, The cutting device further includes a storage unit that stores provisional correction values ​​for each combination of supply units that simultaneously supply process water in a set including the supply unit and the plurality of other supply units. The control unit performs the feedforward control using the correction value generated based on the provisional correction value corresponding to the combination.

8. A method for manufacturing a cut article, the method using the cutting device according to any one of claims 1 to 7, comprising: The step of using the cutting device to cut the object to be cut.

Images