A wire guide device

Abstract

The application discloses a guide piece equipment, which comprises a transfer device, a first feeding device, a first discharging device, a second feeding device, a second discharging device and a rack. In the working process, two groups of three columns of silicon wafers enter a track changing area along the X direction. The silicon wafers on the first conveying line are moved to the adjacent second conveying line by the track changing assembly. After passing through the track changing area, two first output groups and one second output group jointly output three groups of two columns of silicon wafers along the X direction. The three groups of two columns of silicon wafers are respectively output to three dry method baskets, so that the automatic transfer of the silicon wafers from the wet method basket to the dry method basket is realized, manual operation is not needed, the working hours required for the transfer can be shortened, the production efficiency is improved, the operation personnel can be prevented from contacting the silicon wafers, the silicon wafers can be prevented from being polluted, the silicon wafers can be prevented from falling due to unstable holding of the operation personnel, the yield rate can be ensured, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automatic production equipment of photovoltaic cells, and particularly relates to a wafer guiding device. BACKGROUND

[0002] In the production process of manufacturing solar cells, different processes are included, and different specifications of flower baskets may be required as carriers of silicon wafers in different processes. For example, a wet process such as etching and alkali throwing uses a wet flower basket to load silicon wafers, each layer of the wet flower basket can store three silicon wafers, while a dry process uses a dry flower basket to load silicon wafers, each layer of the dry flower basket can only store two silicon wafers. Therefore, after the wet process is completed, the silicon wafers need to be transferred to the dry flower basket to perform the subsequent dry process. If manual operation is used to realize the transfer of silicon wafers between different specifications of flower baskets, on the one hand, the manual operation requires a long working time, which will reduce the production efficiency, and on the other hand, the operator may contaminate the silicon wafers during the transfer process of the silicon wafers, and the silicon wafers may also fall off due to unstable hand holding, which will reduce the yield and increase the production cost. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a wafer guiding device which can realize the automatic transfer of silicon wafers from a wet flower basket to a dry flower basket, without manual operation, can shorten the working time required for transfer, improve production efficiency, and can avoid the operator from contacting the silicon wafers, thereby avoiding the contamination of the silicon wafers, and also avoiding the falling of the silicon wafers due to unstable hand holding, which is beneficial to ensure the yield and reduce the production cost.

[0004] The wafer guiding device provided by the embodiment of the present application is used to transfer silicon wafers from a wet flower basket to a dry flower basket, the wet flower basket can accommodate three columns of the silicon wafers, the dry flower basket can accommodate two columns of the silicon wafers, and the wafer guiding device comprises:

[0005] The transfer device has an input area, a track changing area and an output area arranged in sequence along an X direction, and comprises two track changing conveying mechanisms, each of which comprises a first conveying line, a second conveying line and a track changing assembly, the first conveying line and the second conveying line each extend along the X direction and are capable of placing and conveying single silicon wafers along the X direction, the first conveying line extends from the input area to the track changing area, the second conveying line extends from the track changing area to the output area, the first conveying line and the second conveying line are arranged staggered in a Y direction in the track changing area, the track changing assembly is located in the track changing area and is used to move silicon wafers from the first conveying line to the adjacent second conveying line, the transfer device further comprises four third conveying lines, each of which extends along the X direction and is capable of placing and conveying single silicon wafers along the X direction, the third conveying lines extend from the input area to the output area, in the input area, two third conveying lines and one first conveying line are arranged side by side in the Y direction to form an input group, and two input groups are arranged, in the output area, two third conveying lines are arranged side by side in the Y direction to form a first output group, and two first output groups are arranged, two second conveying lines are arranged side by side in the Y direction to form a second output group, and the two first output groups are arranged on two sides of the second output group in the Y direction, and the Y direction is perpendicular to the X direction.

[0006] A first feeding device is connected to one end of the input area away from the track changing area to supply the wet method baskets loaded with the silicon wafers to the transfer device.

[0007] A first discharging device is connected to one end of the input area away from the track changing area to output the empty wet method baskets.

[0008] A second feeding device is connected to one end of the output area away from the track changing area to supply the dry method baskets to the transfer device.

[0009] A second discharging device is connected to one end of the output area away from the track changing area to output the dry method baskets loaded with the silicon wafers.

[0010] A rack is provided, and the transfer device, the first feeding device, the first discharging device, the second feeding device and the second discharging device are all mounted on the rack.

[0011] The wafer guiding device provided by the embodiment of the present application has at least the following beneficial effects:

[0012] The wafer guiding device provided by the embodiment of the present application supplies two wet-process baskets loaded with wafers to the input area of the transfer device by the first feeding device, supplies three empty dry-process baskets to the output area of the transfer device by the second feeding device, and outputs the wafers in the two wet-process baskets to two input groups, respectively, and the wafers in the two groups of three columns enter the track-changing area along the X direction, wherein the wafers on the first conveying line are moved to the adjacent second conveying line by the track-changing assembly, and after passing through the track-changing area, the two first output groups and one second output group jointly output three groups of two columns of wafers along the X direction, and the three groups of two columns of wafers are output to three dry-process baskets, respectively, the first discharging device outputs the empty wet-process baskets, and the second discharging device outputs the dry-process baskets loaded with wafers, so as to realize the automatic transfer of the wafers from the wet-process baskets to the dry-process baskets without manual operation, shorten the working hours required for the transfer, improve the production efficiency, and avoid the contact of the workers with the wafers, so as to avoid the pollution of the wafers and the dropping of the wafers due to the unstable holding of the workers, thereby helping to ensure the yield rate and reduce the production cost.

[0013] In some embodiments of the present application, in the track-changing area, the first conveying line and the second conveying line are arranged side by side along the Y direction, and the track-changing assembly is used to move the wafers along the Y direction to move the wafers from the first conveying line to the second conveying line.

[0014] In some embodiments of the present application, the first conveying line includes two first belt conveying structures arranged along the X direction, the upper surfaces of the first belt conveying structures are used to carry the workpieces and convey the workpieces along the X direction, the first belt conveying structures have first conveying parts and first butt joints along the X direction, and a first interval is defined between the two first butt joints.

[0015] The second conveying line includes two second belt conveying structures arranged along the X direction, the upper surfaces of the second belt conveying structures are used to carry the workpieces and convey the workpieces along the X direction, the second belt conveying structures have second conveying parts and second butt joints along the X direction, a second interval is defined between the two second butt joints, and the first butt joints and the second butt joints are arranged in sequence along the Y direction.

[0016] The track-changing assembly includes a transverse sliding rail, a lifting driving member, and a carrying member, the transverse sliding rail is located below the first conveying line and the second conveying line, the lifting driving member is slidingly connected to the transverse sliding rail along the Y direction, the output end of the lifting driving member is connected to the carrying member to drive the carrying member to move along the vertical direction, the carrying member can pass through the first interval to move above or below the first conveying line, and the carrying member can pass through the second interval to move above or below the second conveying line.

[0017] The X direction, the Y direction and the vertical direction are perpendicular to each other;

[0018] The first docking portion has a first transverse movement interval, and the second docking portion has a second transverse movement interval, both of which extend along the Y direction, and the first transverse movement interval and the second transverse movement interval are arranged in sequence along the Y direction, and the lifting driving member can move in the first transverse movement interval and the second transverse movement interval along the Y direction;

[0019] Or, the first docking portion and the first conveying portion have a first transverse movement interval extending along the Y direction, and the first transverse movement interval and the side edge of the second docking portion away from the second conveying portion are arranged in sequence along the Y direction, and the lifting driving member can move in the first transverse movement interval and the side of the second docking portion away from the second conveying portion along the Y direction;

[0020] Or, the second docking portion and the second conveying portion have a second transverse movement interval extending along the Y direction, and the second transverse movement interval and the side edge of the first docking portion away from the first conveying portion are arranged in sequence along the Y direction, and the lifting driving member can move in the second transverse movement interval and the side of the first docking portion away from the first conveying portion along the Y direction.

[0021] In some embodiments of the present application, the wet basket includes two first end plates and a plurality of first support columns, the two first end plates are arranged at intervals, the two ends of the first support columns are connected to the two first end plates respectively, and the plurality of first support columns define three first accommodating cavities between the two first end plates, the first end plate has three clamping grooves, and each of the three clamping grooves of the first end plate corresponds to one of the three first accommodating cavities, three pressing rods are installed on the two first end plates before the wet basket is input into the first feeding device, the two ends of the pressing rod are clamped in the two clamping grooves corresponding to the same first accommodating cavity, and the pressing rod is used to prevent the silicon wafer from being taken out of the first accommodating cavity;

[0022] The first feeding device includes a pressing rod dismounting assembly and a pressing rod recycling assembly, the pressing rod dismounting assembly is used to dismount the pressing rod from the wet basket, and the pressing rod recycling assembly includes a recycling box used to accommodate the pressing rod.

[0023] In some embodiments of the present application, the clamping groove forms an opening at the edge of the first end plate, the clamping groove comprises an insertion section and a clamping section, the clamping section is located at the side of the insertion section away from the opening, the width of the insertion section is a, the width of the clamping section is b, and the length of the clamping section is c; the end of the pressing rod is provided with a clamping part, the width of the clamping part is w, the thickness of the clamping part is h, w > h, h < a < w, b > w, and c > w; before the wet-process basket is input into the first feeding device, the clamping part is accommodated in the clamping section.

[0024] The pressing rod dismounting assembly comprises a base and two dismounting mechanisms, the base is installed on the rack, the base has a placement area for placing the wet-process basket, the two dismounting mechanisms are separately arranged at the two sides of the placement area, the dismounting mechanism comprises a first support and three clamping parts, the first support is slidingly connected to the base in the horizontal direction, the clamping part is rotationally connected to the first support, the three clamping parts are sequentially and spacedly arranged, the clamping part has an insertion slot, when the wet-process basket is placed in the placement area, the wet-process basket is in a horizontal state, the pressing rod extends in the horizontal direction and the opening of the clamping groove faces upward, the first support of each dismounting mechanism can move towards the wet-process basket, so that the clamping parts at the two ends of each pressing rod are respectively inserted into the insertion slot, and the clamping part can rotate relative to the first support to drive the pressing rod to rotate.

[0025] In some embodiments of the present application, the first support is also movably connected to the base in the vertical direction, when the clamping part rotates relative to the first support so that the thickness direction of the clamping part is parallel to the width direction of the insertion section, the first support can move upward relative to the base to make the pressing rod exit the clamping groove.

[0026] In some embodiments of the present application, the first feeding device further comprises a mechanical arm, the mechanical arm is connected to the rack, the mechanical arm can place the wet-process basket loaded with a silicon wafer in the pressing rod dismounting assembly, and the mechanical arm can place the pressing rod in the recycling box.

[0027] In some embodiments of the present application, the recycling box comprises two opposite limiting walls and a side wall, the side wall is perpendicular to the limiting walls, the two ends of the side wall are connected to the two limiting walls, respectively, the two limiting walls each have three limiting slots extending in the vertical direction, and the limiting slots are used for accommodating the end of the pressing rod.

[0028] The first feeding device further comprises a lifting assembly, the lifting assembly comprises a lifting support and a supporting piece, the lifting support is connected to the rack, the supporting piece is slidingly connected to the lifting support in the vertical direction, the supporting piece can extend into the interior of the recycling box between the two limiting walls, and the supporting piece is used for carrying the pressing rod.

[0029] In some embodiments of the present application, the first feeding device further comprises a turnover assembly, the turnover assembly is used for receiving the wet-process flower basket from which the pressing rod is detached and adjusting the posture of the wet-process flower basket so as to switch the wet-process flower basket to the upright state; the turnover assembly comprises a turnover support and a turnover clamp, the turnover support is installed on the rack, the turnover clamp is rotationally connected to the turnover support, the turnover clamp can be connected to the pressing rod detaching assembly to receive the wet-process flower basket from which the pressing rod is detached, and the turnover clamp can clamp the wet-process flower basket and drive the wet-process flower basket to rotate so as to switch the wet-process flower basket from the horizontal state to the upright state.

[0030] In some embodiments of the present application, the transfer device further comprises two first lifting assemblies and three second lifting assemblies, the two first lifting assemblies are respectively located on the sides of the two input groups away from the track changing area, the first lifting assembly comprises a first lifting support, a first receiving piece and a first pressing piece, the first lifting support is connected to the rack, the first receiving piece and the first pressing piece are slidingly connected to the first lifting support in the vertical direction, the first receiving piece is used for receiving the wet-process flower basket loaded with silicon wafers conveyed from the first feeding device, and the first pressing piece is used for pressing the wet-process flower basket to the first receiving piece, the first pressing piece and the first receiving piece can clamp the wet-process flower basket and drive the wet-process flower basket to move in the vertical direction so as to convey the silicon wafers in the wet-process flower basket to the input groups layer by layer.

[0031] The three second lifting assemblies are respectively located on the sides of the two first output groups and the second output group away from the track changing area, the second lifting assembly comprises a second lifting support, a second receiving piece and a second pressing piece, the second lifting support is connected to the rack, the second receiving piece and the second pressing piece are slidingly connected to the second lifting support in the vertical direction, the second receiving piece is used for receiving the empty dry-process flower basket conveyed from the second feeding device, and the second pressing piece is used for pressing the dry-process flower basket to the second receiving piece, the second pressing piece and the second receiving piece can clamp the dry-process flower basket and drive the dry-process flower basket to move in the vertical direction so as to insert the silicon wafers output from the two first output groups and the second output group into the dry-process flower basket layer by layer.

[0032] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the attendant drawings or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0033] The application will be further described with reference to the drawings and examples, in which:

[0034] Figure 1 A perspective view of a guide vane device provided for some embodiments of the application;

[0035] Figure 2 A perspective view of a guide vane device provided for some embodiments of the application; Figure 1 A perspective view of a guide vane device provided for some embodiments of the application;

[0036] Figure 3 A perspective view of a guide vane device provided for some embodiments of the application; Figure 1 A perspective view of a guide vane device provided for some embodiments of the application;

[0037] Figure 4 A perspective view of a guide vane device provided for some embodiments of the application; Figure 1 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application;

[0038] Figure 5 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application; Figure 4 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application;

[0039] Figure 6 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application; Figure 5 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application;

[0040] Figure 7 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application; Figure 5 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application;

[0041] Figure 8 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application; Figure 5

[0042] A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application; Figure 9

[0043] A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application; Figure 10 Figure 5 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application;

[0044] Figure 11 Figure 10 A layout view of a variable track conveying mechanism and a third conveying line of a transfer device of a guide vane device provided for some embodiments of the application;

[0045] ​​Figure 12 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0046] Figure 13 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0047] Figure 14 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0048] Figure 15 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0049] Figure 16 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0050] Figure 17 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 10 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0051] Figure 18 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 10 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0052] Figure 19 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 1 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0053] Figure 20 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 1 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0054] Figure 21 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 1 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0055] Figure 22 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 1 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0056] Figure 23 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 1 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0057] Figure 24 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments; Figure 1 Fig. 1 shows a layout diagram of a first conveying line and a second conveying line of a variable-gauge conveying mechanism of a transfer device according to some embodiments;

[0058] Figure 25 for Figure 1 A perspective schematic diagram of a pressure rod recovery assembly of a first feeding device of a guide blade device shown;

[0059] Figure 26 for Figure 1 A three-dimensional schematic diagram of a pressure rod disassembly assembly of a first feeding device of a guide blade device shown;

[0060] Figure 27 for Figure 26 Enlarged view of point G in the middle;

[0061] Figure 28 for Figure 27 a side view of the area shown;

[0062] Figure 29 for Figure 1 A three-dimensional schematic diagram of a flip support, a flip fixture and a first transverse track of a flip assembly of a first feeding device of a sheet guide device shown;

[0063] Figure 30 for Figure 1 The diagram shows a three-dimensional diagram of the rotating support, the rotating member and the second transverse track of the turning assembly of the first loading device of the guide device.

[0064] Reference numerals:

[0065] Reproduction device 100, input area A, track changing area B, output area C, input group D, first output group E, second output group F, track changing conveying mechanism 110, first conveying line 111, first belt conveying structure 1111, first conveying part 11111, first butt joint part 11112, first interval 11113, first transverse movement interval 11114, conveying belt 11115, driving wheel 11116, driven wheel 11117, fixing frame 11118, support 11119, second conveying line 112, second belt conveying structure 1121, second conveying part 11211, second butt joint part 11212, second interval 11213, second transverse movement interval 11214, track changing assembly 113, transverse movement slide rail 1131, lifting driving part 1132, bearing part 1133, suction port 11331, first bearing part 11332, second bearing part 11333, third conveying line 120, third belt conveying structure 121, first conveying section 1211, second conveying section 1212, third conveying section 1213, first lifting assembly 130, first lifting support 131, first receiving part 132, first pressing part 133, second lifting assembly 140, second lifting support 141, second receiving part 142, second pressing part 143, rejection assembly 150, rejection slide rail 151, suction part 152, first detection part 153, buffer assembly 160, buffer lifting support 161, buffer rack 162, buffer clamping tooth 163, buffer cavity 164, whole piece assembly 170, whole piece support 171, first whole piece part 172, first whole piece movable part 173, second whole piece part 174, second whole piece movable part 175;

[0066] First feeding device 200, press rod dismounting assembly 210, base 211, dismounting mechanism 212, first support 2121, clamping part 2122, insertion slot 2123, horizontal driving part 2124, lifting driving part 2125, positioning mechanism 213, second support 2131, positioning part 2132, first output line 214, press rod recycling assembly 220, recycling box 221, limiting wall 2211, side wall 2212, limiting slot 2213, recycling conveying line 222, transfer trolley 223, mechanical arm 230, flower basket clamp 231, press rod clamp 232, lifting assembly 240, lifting support 241, bearing part 242, movable part 243, overturning assembly 250, overturning support 251, overturning clamp 252, support part 2521, clamping part 2522, receiving line 2523, second output line 2524, first transverse movement rail 253, rotary transverse movement assembly 260, rotary support 261, rotary part 262, protruding part 2621, second transverse movement rail 263, second detection part 264, receiving output line 265;

[0067] The first unloading device 300, the empty basket unloading conveying line 310, the defective product unloading conveying line 320, the first transverse moving line 330, the lifting docking assembly 340, the defective product docking line 350, the empty basket docking line 360;

[0068] The second unloading device 500, the unloading conveying line 510, the third transverse moving line 520;

[0069] The second unloading device 500, the unloading conveying line 510, the third transverse moving line 520;

[0070] The rack 600;

[0071] The wet method basket 700, the first end plate 710, the clamping groove 711, the insertion section 7111, the clamping section 7112, the positioning hole 712, the first supporting column 720, the first clamping tooth 721, the pressing rod 730, the clamping part 731;

[0072] The dry method basket 800, the second end plate 810, the second supporting column 820, the second clamping tooth 821;

[0073] The silicon wafer 900. DETAILED DESCRIPTION

[0074] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0075] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0076] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood broadly, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0077] In the description of the application, the description of the terms "one embodiment", "some embodiments", and the like means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In this specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in one or more embodiments or examples.

[0078] The production process for manufacturing solar cell pieces includes a plurality of different processes, and different specifications of flower baskets may be required as carriers for silicon wafers in different processes. For example, a wet process flower basket is used to load silicon wafers in processes such as texturing and alkali etching, each layer of the wet process flower basket can store three silicon wafers, while a dry process flower basket is used to load silicon wafers in dry process, each layer of the dry process flower basket can only store two silicon wafers. Therefore, after the wet process is completed, the silicon wafers need to be transferred to the dry process flower basket to proceed with the subsequent dry process. If manual operation is used to realize the transfer of silicon wafers between flower baskets of different specifications, on the one hand, the manual operation requires a long working time, which will lead to a reduction in production efficiency, on the other hand, the operating personnel may contaminate the silicon wafers during the transfer process of the silicon wafers, and may also cause the silicon wafers to fall due to unstable hand holding, which will lead to a reduction in yield and high production cost.

[0079] Based on this, with reference to Figures 1 to 3 , the embodiment of the application provides a wafer guiding device for transferring silicon wafers 900 from a wet process flower basket 700 to a dry process flower basket 800, wherein the wet process flower basket 700 can place three rows of silicon wafers 900, that is, three silicon wafers 900 are placed in each layer; the dry process flower basket 800 places two rows of silicon wafers, that is, two silicon wafers 900 are placed in each layer. The wafer guiding device comprises a transfer device 100, a first feeding device 200, a first discharging device 300, a second feeding device 400, a second discharging device 500, and a rack 600, and the transfer device 100, the first feeding device 200, the first discharging device 300, the second feeding device 400, and the second discharging device 500 are all installed on the rack 600.

[0080] With reference to Figure 4 , the transfer device 100 has an input area A, a track changing area B, and an output area C arranged in sequence along the X direction, and the transfer device 100 comprises two track changing conveying mechanisms 110, with reference to Figures 5 to 16The track-changing conveying mechanism 110 comprises a first conveying line 111, a second conveying line 112 and a track-changing assembly 113. The first conveying line 111 and the second conveying line 112 both extend along the X direction and are capable of placing and conveying the single silicon wafer 900 along the X direction. The first conveying line 111 extends from the input area A to the track-changing area B. The second conveying line 112 extends from the track-changing area B to the output area C. In the track-changing area B, the first conveying line 111 and the second conveying line 112 are arranged staggered in the Y direction. The track-changing assembly 113 is located in the track-changing area B. The track-changing assembly 113 is used to move the silicon wafer 900 from the first conveying line 111 to the adjacent second conveying line 112. Refer to Figures 4 to 9 The transfer device 100 further comprises four third conveying lines 120. The third conveying lines 120 extend along the X direction and are capable of placing and conveying the single silicon wafer 900 along the X direction. Refer to Figure 4 The third conveying lines 120 extend from the input area A to the output area C. In the input area A, two third conveying lines 120 and one first conveying line 111 are arranged side by side in the Y direction to form an input group D. There are two input groups D. In the output area C, two third conveying lines 120 are arranged side by side in the Y direction to form a first output group E. There are two first output groups E. Two second conveying lines 112 are arranged side by side in the Y direction to form a second output group F. The two first output groups E are arranged on the two sides of the second output group F in the Y direction. The Y direction is perpendicular to the X direction.

[0081] Refer to Figures 1 to 3 The first feeding device 200 is connected to one end of the input area A away from the track-changing area B to supply the wet-process baskets 700 loaded with the silicon wafers 900 to the transfer device 100. The first discharging device 300 is connected to one end of the input area A away from the track-changing area B to output the empty wet-process baskets 700. The second feeding device 400 is connected to one end of the output area C away from the track-changing area B to supply the dry-process baskets 800 loaded with the silicon wafers 900 to the transfer device 100. The second discharging device 500 is connected to one end of the output area C away from the track-changing area B to output the dry-process baskets 800 loaded with the silicon wafers 900.

[0082] Further, refer to Figures 4 to 9 In the track-changing area B, the first conveying line 111 and the second conveying line 112 are arranged side by side in the Y direction. The track-changing assembly 113 is used to move the silicon wafer 900 in the Y direction to move the silicon wafer 900 from the first conveying line 111 to the second conveying line 112. The track-changing assembly 113 only needs to move the silicon wafer 900 in one direction, which is beneficial to simplify the action logic of the track-changing assembly 113, reduce the control difficulty of the track-changing assembly 113, improve the efficiency of the track-changing assembly 113 in moving the silicon wafer 900, and thus improve the production efficiency.

[0083] Refer to Figures 17 to 23 , Figure 25The first conveying line 111 comprises two first belt conveying structures 1111 arranged along the X direction, the upper surfaces of the first belt conveying structures 1111 being used to carry the silicon wafers 900 and convey the silicon wafers 900 along the X direction, the first belt conveying structures 1111 having first conveying portions 11111 and first abutting portions 11112 along the X direction, and the first abutting portions 11112 defining a first interval 11113 therebetween;

[0084] With reference to Figures 17 to 23 The second conveying line 112 comprises two second belt conveying structures 1121 arranged along the X direction, the upper surfaces of the second belt conveying structures 1121 being used to carry the silicon wafers 900 and convey the silicon wafers 900 along the X direction, the second belt conveying structures 1121 having second conveying portions 11211 and second abutting portions 11212 along the X direction, and the second abutting portions 11212 defining a second interval 11213 therebetween, the first abutting portions 11112 and the second abutting portions 11212 being arranged along the Y direction in sequence;

[0085] With reference to Figure 17 and Figure 24 The rail-changing assembly 113 comprises a transverse sliding rail 1131, a lifting driving member 1132, and a carrying member 1133. The transverse sliding rail 1131 is located below the first conveying line 111 and the second conveying line 112. The lifting driving member 1132 is slidingly connected to the transverse sliding rail 1131 along the Y direction. The output end of the lifting driving member 1132 is connected to the carrying member 1133 to drive the carrying member 1133 to move along the vertical direction (i.e., the Z direction). The carrying member 1133 can pass through the first interval 11113 to move above or below the first conveying line 111, and can pass through the second interval 11213 to move above or below the second conveying line 112.

[0086] The X direction, the Y direction, and the vertical direction (i.e., the Z direction) are perpendicular to each other.

[0087] The first conveying line 111 and the second conveying line 112 need to be provided with spaces capable of allowing the lifting driving member 1132 and the carrying member 1133 to move along the Y direction. There are various specific forms of arrangement, exemplarily:

[0088] Embodiment 1

[0089] With reference to Figure 17 , Figure 18 , Figures 21 to 23The first docking portion 11112 has a first transverse movement interval 11114, and the second docking portion 11212 has a second transverse movement interval 11214. The first transverse movement interval 11114 and the second transverse movement interval 11214 extend along the Y direction. The first transverse movement interval 11114 and the second transverse movement interval 11214 are arranged along the Y direction in sequence. The lifting driving member 1132 is capable of moving in the first transverse movement interval 11114 and the second transverse movement interval 11214 along the Y direction.

[0090] The first conveying portion 11111 conveys the silicon wafer 900 along the X direction. When the silicon wafer 900 reaches the first docking portion 11112, the lifting driving member 1132 drives the carrier 1133 located below the first docking portion 11112 to rise and pass through the first interval 11113, and then the lifting driving member 1132 drives the carrier 1133 to move along the Y direction relative to the transverse movement slide rail 1131, from the first transverse movement interval 11114 to the second transverse movement interval 11214. When the carrier 1133 reaches above the second interval 11213, the lifting driving member 1132 drives the carrier 1133 to descend and pass through the second interval 11213 to reach below the second docking portion 11212, and then the carrier 1133 carries the silicon wafer 900 on the carrier 1133 to the second docking portion 11212. The second docking portion 11212 conveys the silicon wafer 900 to the second conveying portion 11211.

[0091] Embodiment 2

[0092] Referring to Figure 19 The first docking portion 11112 and the first conveying portion 11111 have the first transverse movement interval 11114 extending along the Y direction. The first transverse movement interval 11114 and the side edge of the second docking portion 11212 away from the second conveying portion 11211 are arranged along the Y direction in sequence. The lifting driving member 1132 is capable of moving along the Y direction in the first transverse movement interval 11114 and the side edge of the second docking portion 11212 away from the second conveying portion 11211. The difference from the previous embodiment is that, after the carrier 1133 lifts the silicon wafer 900 on the first docking portion 11112, the lifting driving member 1132 drives the carrier 1133 to move along the Y direction relative to the transverse movement slide rail 1131, from the first transverse movement interval 11114 to the side edge of the second docking portion 11212 away from the second conveying portion 11211.

[0093] Embodiment 3

[0094] Referring to Figure 20The second transverse interval 11214 extending along the Y direction is arranged between the second docking portion 11212 and the second conveying portion 11211, and the second transverse interval 11214 and the side edge of the first docking portion 11112 away from the first conveying portion 11111 are arranged along the Y direction in sequence, and the lifting driving member 1132 can move along the Y direction in the second transverse interval 11214 and the side of the first docking portion 11112 away from the first conveying portion 11111. The difference from the previous embodiment is that after the carrying member 1133 lifts the silicon wafer 900 on the first docking portion 11112, the lifting driving member 1132 drives the carrying member 1133 to move along the Y direction relative to the transverse sliding rail 1131, and moves from the side of the first docking portion 11112 away from the first conveying portion 11111 to the second transverse interval 11214.

[0095] The first conveying line 111 is used for conveying the silicon wafer 900 along the X direction, the lifting driving member 1132 in the variable track conveying mechanism 110 can drive the carrying member 1133 to move along the vertical direction (i.e. the Z direction), and can drive the carrying member 1133 to move along the Y direction. In actual use, the first conveying portion 11111 conveys the silicon wafer 900 along the X direction to the first docking portion 11112, the carrying member 1133 lifts the silicon wafer 900 placed on the first docking portion 11112 of the first conveying line 111, and then moves along the Y direction to the position above the second docking portion 11212, and then the carrying member 1133 is lowered until the silicon wafer 900 is placed on the second docking portion 11212, the second docking portion 11212 conveys the silicon wafer 900 along the X direction to the second conveying portion 11211, and the variable track conveying mechanism 110 is realized. Conveying the silicon wafer 900 between different tracks through the above structure can reduce the breakage position of the conveying line, simplify the winding mode of the conveying belt 11115, and thus simplify the structural layout of the variable track conveying mechanism 110, so as to facilitate debugging and maintenance.

[0096] In addition, compared with the solution in which a picking component is set above the first docking part 11112 and the second docking part 11212, the picking component descends from the top of the first docking part 11112, picks up the silicon wafer 900, and then rises and drives the silicon wafer 900 to move horizontally along the Y direction, and then descends after reaching the top of the second docking part 11212 to place the silicon wafer 900 on the second docking part 11212, in the track changing conveying mechanism provided by the embodiment of the present invention, by setting a first gap 11113 in the first docking part 11112, a second gap 11213 in the second docking part 11212, and a first horizontal movement gap 11114 and / or a second horizontal movement gap 11214, the silicon wafer 900 can be lifted, moved horizontally, and lowered, and the silicon wafer 900 will not be squeezed during the lifting and lowering actions, which is beneficial to reducing the possibility of cracks or even breakage of the silicon wafer 900 during the track changing conveying process, thereby helping to ensure the yield rate of the silicon wafer 900.

[0097] When the carrier 1133 drives the silicon wafer 900 to move, if the movement speed is too fast, relative movement may occur between the silicon wafer 900 and the carrier 1133. On the one hand, scratches may be generated on the surface of the silicon wafer 900, affecting the quality of the silicon wafer 900; on the other hand, the silicon wafer 900 may fall from the carrier 1133, making the silicon wafer 900 scrapped.

[0098] Based on this, refer to Figure 24 The carrier 1133 has a suction port 11331, which can generate negative pressure to absorb the silicon wafer 900. After the first conveying part 11111 transports the silicon wafer 900 to the first docking part 11112 along the X direction, the carrier 1133 rises and contacts the silicon wafer 900 located at the first docking part 11112. The suction port 11331 generates negative pressure, causing the silicon wafer 900 to be absorbed on the carrier 1133. Then, the carrier 1133 drives the silicon wafer 900 to move along the Y direction. The suction port 11331 continues to generate negative pressure until the carrier 1133 drives the silicon wafer 900 to reach the second docking part 11212 and descends until the silicon wafer 900 contacts or is about to contact the upper surface of the second docking part 11212. The suction port 11331 stops generating negative pressure.

[0099] An adsorption port 11331 capable of generating negative pressure is provided on the carrier 1133, so that the silicon wafer 900 can be stably adsorbed on the carrier 1133 during the transportation of the silicon wafer 900, reducing the possibility of the silicon wafer 900 moving relative to the carrier 1133, thereby reducing the possibility of the silicon wafer 900 being scratched or falling and scrapped during the transportation process, which is beneficial to ensuring the yield of the silicon wafer 900; in addition, it is also beneficial to increase the speed at which the carrier 1133 drives the silicon wafer 900 to move along the Y direction, so as to speed up the production rhythm and improve production efficiency.

[0100] On the basis of the above embodiment 1, further referring toFigure 24 The carrier 133 includes a first carrier portion 1332 and a second carrier portion 1333 connected in sequence along the X direction, and the first carrier portion 1332 and the second carrier portion 1333 are respectively located on both sides of the output end of the lifting driving member 1132 in the X direction. When the carrier 133 is located above the first conveying line 111 or the second conveying line 112, the first carrier portion 11332 and the second carrier portion 11333 can both carry the silicon wafer 900.

[0101] Compared with the case where the carrier 133 is arranged only on one side of the output end of the lifting driving member 1132 in the X direction, the arrangement of the first carrier portion 11332 and the second carrier portion 1333 on both sides of the output end of the lifting driving member 1132 in the X direction can make the stress on the output end of the lifting driving member 1132 more balanced. Further, the first carrier portion 11332 and the second carrier portion 1333 are symmetrically arranged on both sides of the output end of the lifting driving member 1132 in the X direction, which can further make the stress on the output end of the lifting driving member 1132 more balanced. In addition, the first carrier portion 11332 and the second carrier portion 1333 can simultaneously carry a silicon wafer 900 with a large size in the X direction, so as to improve the reliability of the silicon wafer 900 in track changing. Alternatively, the first carrier portion 11332 and the second carrier portion 1333 can respectively carry different silicon wafers 900, so as to simultaneously change the tracks of multiple silicon wafers 900 and improve the efficiency of the silicon wafers 900 in track changing.

[0102] Further, referring to Figure 24 The first carrier portion 11332 and the second carrier portion 1333 each have a suction port 11331 capable of generating negative pressure to adsorb the silicon wafer 900. When the first carrier portion 11332 and the second carrier portion 1333 simultaneously carry a silicon wafer 900 with a large size in the X direction, multiple positions of the silicon wafer 900 can be subjected to suction force. When the first carrier portion 11332 and the second carrier portion 1333 respectively carry different silicon wafers 900, the silicon wafers 900 on the first carrier portion 11332 and the second carrier portion 1333 can both be subjected to suction force, which can improve the reliability of the silicon wafers 900 in track changing.

[0103] Further, referring to Figure 24 The first carrier portion 11332 and the second carrier portion 1333 each have multiple suction ports 11331 capable of collectively providing suction force for adsorbing the silicon wafer 900, so as to further improve the reliability of the carrier 133 in adsorbing the silicon wafer 900, thereby further improving the reliability of the silicon wafer 900 in track changing.

[0104] Further, in some embodiments, referring to Figure 22, the first abutting part 11112 is arranged at a side of the first conveying part 11111 away from the second conveying part 11211, and the second abutting part 11212 is arranged at a side of the second conveying part 11211 away from the first conveying part 11111, the length of the first abutting part 11112 at a side of the first transverse interval 11114 close to the first conveying part 11111 is L1, the length of the second abutting part 11212 at a side of the second transverse interval 11214 away from the second conveying part 11211 is L2, and L1=L2, that is, the lengths of the conveying belt 11115 in the first abutting part 11112 at a side of the first transverse interval 11114 close to the first conveying part 11111 and in the second abutting part 11212 at a side of the second transverse interval 11214 away from the second conveying part 11211 are the same, which facilitates the control of the conveying speed and is beneficial to improving the consistency of the conveying speed of the silicon wafer 900 on the first abutting part 11112 and the second abutting part 11212 and making the action pace of the rail-changing conveying mechanism 100 more stable.

[0105] In some embodiments, with reference to Figure 19 , the first abutting part 11112 is arranged at a side of the first conveying part 11111 close to the second conveying part 11211, and the second abutting part 11212 is arranged at a side of the second conveying part 11211 close to the first conveying part 11111, the length of the first abutting part 11112 at a side of the first transverse interval 11114 away from the first conveying part 11111 is L3, the length of the second abutting part 11212 at a side of the second transverse interval 11214 close to the second conveying part 11211 is L4, and L3=L4, that is, the lengths of the conveying belt 11115 in the first abutting part 11112 at a side of the first transverse interval 11114 away from the first conveying part 11111 and in the second abutting part 11212 at a side of the second transverse interval 11214 close to the second conveying part 11211 are the same, which facilitates the control of the conveying speed and is beneficial to improving the consistency of the conveying speed of the silicon wafer 900 on the first abutting part 11112 and the second abutting part 11212 and making the action pace of the rail-changing conveying mechanism 110 more stable.

[0106] In some embodiments, with reference to Figure 23 , the first abutting part 11112 is arranged at a side of the first conveying part 11111 close to the second conveying part 11211, and the second abutting part 11212 is arranged at a side of the second conveying part 11211 close to the first conveying part 11111, L1=L2 and L3=L4, which can more greatly improve the consistency of the conveying speed of the silicon wafer 900 on the first abutting part 11112 and the second abutting part 11212 and make the action pace of the rail-changing conveying mechanism 110 more stable.

[0107] Further, with reference to Figure 25The first belt conveying structure 1111 and the second belt conveying structure 1121 each include a conveying belt 11115, a driving wheel 11116, a driven wheel 11117, a fixed frame 11118 and a support 11119, the driving wheel 11116 and the driven wheel 11117 are rotationally connected to the fixed frame 11118, the support 11119 is connected to the fixed frame 11118, the conveying belt 11115 is arranged around the driving wheel 11116 and the driven wheel 11117, and the support 11119 is arranged below the conveying belt 11115 in the first docking portion 11112 and the second docking portion 11212. When the silicon wafer 900 is lifted or lowered from the conveying belt 11115, the amplitude of the vibration of the conveying belt 11115 is small under the support of the support 11119 to the conveying belt 11115 in the first docking portion 11112 and the second docking portion 11212, the possibility of the friction between the silicon wafer 900 and the conveying belt 11115 caused by the vibration of the conveying belt 11115 can be reduced, the possibility of the scratch on the surface of the silicon wafer 900 can be reduced, and the yield of the silicon wafer 900 can be improved.

[0108] With reference to Figures 5 to 9 The third conveying line 120 includes two third belt conveying structures 121, the third belt conveying structures 121 are arranged along the X direction, and the upper surfaces of the third belt conveying structures 121 are used for carrying the silicon wafers 900 and conveying the silicon wafers 900 along the X direction. The plurality of silicon wafers 900 are first placed on the third conveying line 120 and the first conveying line 111, the third conveying line 120 and the first conveying line 111 convey the silicon wafers 900 along the X direction, until the silicon wafers 900 on the first conveying line 111 reach the first docking portion 11112, the silicon wafers 900 on the first docking portion 11112 are moved to the second docking portion 11212 by the rail changing assembly 113, so that part of the silicon wafers 900 are transferred to the second conveying line 112 for continuous conveying along the X direction, and the rail changing conveying of the plurality of silicon wafers 900 is realized.

[0109] With reference to Figures 5 to 9 The rail changing conveying mechanism 110 is provided with two, and the combination of the two rail changing conveying mechanisms 110 is provided with two third conveying lines 120 on both sides in the Y direction, and the two first conveying lines 111 and the four third conveying lines 120 are arranged into two groups of three columns on one side of the first docking portion 11112 and the second docking portion 11212 in the X direction, and the two second conveying lines 112 and the four third conveying lines 120 are arranged into three groups of two columns on the other side of the first docking portion 11112 and the second docking portion 11212, so that the silicon wafers 900 can be re-grouped.

[0110] The action process of the retransfer device 100 will be described below by taking the first belt conveying structure 1111 and the second belt conveying structure 1121 as examples. Figure 7 Figure 8 The action process of the retransfer device 100 will be described below by taking the first belt conveying structure 1111 and the second belt conveying structure 1121 as examples.

[0111] ​The wafer guiding device provided by the embodiment of the present application can realize automatic transfer of the silicon wafers from the wet-process flower baskets to the dry-process flower baskets, and the manual operation is not needed, the working hours required for the transfer can be shortened, the production efficiency can be improved, the operator can be prevented from contacting the silicon wafers, the silicon wafers can be prevented from being contaminated, the silicon wafers can be prevented from falling due to unstable holding of the operator, the yield rate can be ensured, and the production cost can be reduced. Figure 7 The silicon wafers 900 in each wet-process flower basket 700 are output to an input group D layer by layer, three columns of the silicon wafers 900 are simultaneously conveyed on the two third conveying lines 120 and the first conveying line 111 of the same output group D, and the two groups of three columns of the silicon wafers 900 enter the track changing area B along the X direction. Figure 8 In the track changing area B, when the silicon wafers 900 on the first conveying line 111 reach the first butt joint part 11112, the lifting driving part 1132 drives the bearing part 1133 located below the first butt joint part 11112 to rise, so that the bearing part 1133 lifts up the silicon wafers 900 on the first butt joint part 11112, and then the lifting driving part 1132 drives the bearing part 1133 to move to the upper side of the second butt joint part 11212 along the Y direction, and the lifting driving part 1132 drives the bearing part 1133 to descend, so that the silicon wafers 900 are placed on the second butt joint part 11212, and the second butt joint part 11212 continues to convey the silicon wafers 900 along the X direction, so that two columns of the silicon wafers 900 are simultaneously conveyed on the two second conveying lines 112 in the second output group F, and at the same time, two columns of the silicon wafers 900 are simultaneously conveyed by the two third conveying lines 120 in the two first output groups E on the two sides of the two second conveying lines 112 in the Y direction, so that the two groups of three columns of the silicon wafers 900 are transferred to three groups of two columns of the silicon wafers 900, and the three groups of two columns of the silicon wafers 900 are output to the three dry-process flower baskets 800, the empty wet-process flower baskets 700 are output by the first unloading device 300, and the dry-process flower baskets 800 loaded with the silicon wafers 900 are output by the second unloading device 500, so as to realize automatic transfer of the silicon wafers 900 from the wet-process flower baskets 700 to the dry-process flower baskets 800, without manual operation, the working hours required for the transfer can be shortened, the production efficiency can be improved, the operator can be prevented from contacting the silicon wafers 900, the silicon wafers 900 can be prevented from being contaminated, the silicon wafers 900 can be prevented from falling due to unstable holding of the operator, the yield rate can be ensured, and the production cost can be reduced.

[0112] Further, referring to Figures 5 to 9 , the third belt conveying structure 121 has the first conveying section 1211, the second conveying section 1212 and the third conveying section 1213 which are separated from each other along the X direction.

[0113] In some embodiments, referring to Figures 5 to 8, the first abutting part 11112 has a first transverse moving interval 11114, the second abutting part 11212 has a second transverse moving interval 11214, the first transverse moving interval 11114 and the second transverse moving interval 11214 extend along the Y direction, the first transverse moving interval 11114 and the second transverse moving interval 11214 are arranged in sequence along the Y direction, the lifting driving part 1132 can move in the first transverse moving interval 11114 and the second transverse moving interval 11214 along the Y direction, the size of the first abutting part 11112 along the X direction at the part of the first transverse moving interval 11114 away from the first conveying part 11111 is L3, the size of the second conveying section 1212 along the X direction is L5, L3=L5, the part of the first abutting part 11112 away from the first conveying part 11111 at the first transverse moving interval 11114 is arranged side by side along the Y direction with the second conveying section 1212 and coaxially driven, the length of the conveying belt 11115 in the part of the first abutting part 11112 away from the first conveying part 11111 at the first transverse moving interval 11114 and the second conveying section 1212 along the X direction is the same, and they are coaxially driven, which facilitates the control of the conveying speed and is beneficial to improving the consistency of the conveying speed of the silicon wafer 900 on the first abutting part 11112 and the third conveying line 120.

[0114] In some other embodiments, with reference to Figure 9 , the first abutting part 11112 and the first conveying part 11111 have a first transverse moving interval 11114 extending along the Y direction, the first transverse moving interval 11114 and the side edge of the second abutting part 11212 away from the second conveying part 11211 are arranged in sequence along the Y direction, the lifting driving part 1132 can move in the first transverse moving interval 11114 and the side of the second abutting part 11212 away from the second conveying part 11211 along the Y direction, the size of the first abutting part 11112 along the X direction is L6, the size of the second conveying section 1212 along the X direction is L5, L6=L5, the first abutting part 11112 and the second conveying section 1212 are arranged side by side along the Y direction and coaxially driven. The length of the conveying belt 11115 in the first abutting part 11112 and the second conveying section 1212 along the X direction is the same, and they are coaxially driven, which facilitates the control of the conveying speed and is beneficial to improving the consistency of the conveying speed of the silicon wafer 900 on the first abutting part 11112 and the third conveying line 120.

[0115] Further, with reference to Figure 1 , the transfer device 100 further comprises two first lifting assemblies 130, which are respectively located at the side of the two input groups D away from the rail changing area B, with reference to Figure 19The first lifting assembly 130 comprises a first lifting support 131, a first receiving member 132 and a first pressing member 133. The first lifting support 131 is connected to the rack 600. The first receiving member 132 and the first pressing member 133 are both slidingly connected to the first lifting support 131 along the vertical direction (i.e. the Z direction). The first receiving member 132 is configured to receive the wet process basket 700 loaded with the silicon wafers 900 delivered from the first feeding device 200. The first pressing member 133 is configured to press the wet process basket 700 against the first receiving member 132. The first pressing member 133 and the first receiving member 132 are capable of clamping the wet process basket 700 and moving the wet process basket 700 along the vertical direction so as to deliver the silicon wafers 900 in the wet process basket 700 to the input group D layer by layer.

[0116] Further, referring to Figure 1 The reprinting device 100 further comprises three second lifting assemblies 140. The three second lifting assemblies 140 are respectively located on the side away from the rail changing area B of the two first output groups E and the second output group F. Referring to Figure 20 The second lifting assembly 140 comprises a second lifting support 141, a second receiving member 142 and a second pressing member 143. The second lifting support 141 is connected to the rack 600. The second receiving member 142 and the second pressing member 143 are both slidingly connected to the second lifting support 141 along the vertical direction (i.e. the Z direction). The second receiving member 142 is configured to receive the empty dry process basket 800 delivered from the second feeding device 400. The second pressing member 143 is configured to press the dry process basket 800 against the second receiving member 142. The second pressing member 143 and the second receiving member 142 are capable of clamping the dry process basket 800 and moving the dry process basket 800 along the vertical direction so as to insert the silicon wafers 900 output from the two first output groups E and the second output group F into the dry process basket 800 layer by layer.

[0117] Referring to Figure 20 The dry process basket 800 comprises two second end plates 810 and a plurality of second support columns 820. The two second end plates 810 are arranged at intervals. The two ends of each second support column 820 are connected to the two second end plates 810. The plurality of second support columns 820 define two first receiving cavities between the two second end plates 810. Further, the side of each second support column 820 close to the second receiving cavity is connected to a plurality of second clamping teeth 821. The plurality of second clamping teeth 821 are arranged in sequence along the extension direction of the second support column 820. The edge of the silicon wafer 900 can be accommodated between two adjacent second clamping teeth 821. The silicon wafers 900 can be arranged at intervals in sequence in the second receiving cavity.

[0118] Further, referring to Figure 2 The reprinting device 100 further comprises a rejection assembly 150. Referring to Figure 21The rejection assembly 150 includes a rejection slide rail 151, a suction accessory 152, and a first detection member 153. The rejection slide rail 151 is located above the first output group E and the second output group F and extends along the Y direction. The suction accessory 152 is slidingly connected to the rejection slide rail 151 along the Y direction and can move vertically relative to the rejection slide rail 151. Each of the first output group E and the second output group F is provided with a first detection member 153. The first detection member 153 is used to detect whether the silicon wafer 900 transported by the first output group E and the second output group F has a defect. If the first detection member 153 detects that the silicon wafer 900 has a defect, the suction accessory 152 moves to the position of the silicon wafer 900 with the defect, lowers and sucks the silicon wafer 900 with the defect, and then rises and moves along the Y direction to reject the silicon wafer 900 with the defect from the first output group E or the second output group F. Further, the rejection assembly 150 also includes a stacker. The stacker is located below the rejection slide rail 151, and the suction accessory 152 can place the silicon wafer 900 with the defect in the stacker.

[0119] The rejection assembly 150 can timely detect the quality of the silicon wafer 900 and timely reject the silicon wafer 900 with the defect from the first output group E and the second output group F, so as to reduce the possibility of the silicon wafer 900 with the defect being transferred to the dry method basket 800, thereby improving the yield.

[0120] Further, referring to Figure 2 The transfer device 100 also includes a buffer assembly 160. Referring to Figure 22 The buffer assembly 160 includes a buffer lifting bracket 161 and a buffer rack 162. The buffer rack 162 has two buffer cavities 164 arranged in sequence along the Y direction. The buffer rack 162 is connected with a plurality of buffer clamping teeth 163 extending into the buffer cavities 164. The plurality of buffer clamping teeth 163 in the same group are arranged in sequence and spaced apart along the vertical direction (i.e., the Z direction). The edge of the silicon wafer 900 can be accommodated between two adjacent second clamping teeth 821, and the silicon wafers 900 can be arranged in sequence and spaced apart in the buffer cavities 164. The first output group E and the second output group F are each provided with the buffer assembly 160. In the first output group E, two third conveying lines 120 pass through the two buffer cavities 164 along the X direction. In the second output group F, two second conveying lines 112 pass through the two buffer cavities 164 along the X direction.

[0121] When the silicon wafer 900 does not need to be buffered, the silicon wafer 900 can pass through the buffer cavity 164 into the dry method basket 800; in the case that the empty dry method basket 800 is not timely supplied or the dry method basket 800 loaded with the silicon wafer 900 is not timely output, every time a pair of silicon wafers 900 enter the two buffer cavities 164 respectively, the buffer frame 162 is raised by a certain height relative to the buffer lifting support 161, so that the next pair of silicon wafers 900 can be inserted below the previous pair of silicon wafers 900 to repeat the above-mentioned action, and the silicon wafers 900 are temporarily stored in the buffer cavity 164; in the case that the silicon wafer 900 is not timely input, the buffer frame 162 is lowered relative to the buffer lifting support 161, so that a pair of silicon wafers 900 are placed on the first output group E or the second output group F; after the pair of silicon wafers 900 are conveyed away, the buffer frame 162 is lowered by a certain height relative to the buffer lifting support 161, so that the next pair of silicon wafers 900 are placed on the first output group E or the second output group F and are conveyed away.

[0122] The buffer assembly 160 is arranged to realize automatic buffering and automatic debuffering of the silicon wafer 900, which is conducive to reducing the possibility of accumulation or falling of the silicon wafer 900, thereby reducing the failure rate of the wafer guide device.

[0123] Further, referring to Figure 2 , the wafer transfer device 100 further comprises a whole wafer assembly 170, referring to Figure 23 , the whole wafer assembly 170 comprises a whole wafer support 171, a first whole wafer piece 172, a first whole wafer movable piece 173, a second whole wafer piece 174 and a second whole wafer movable piece 175, the first output group E and the second output group F are both provided with the whole wafer assembly 170, the whole wafer support 171 is located above the first output group E or the second output group F, the first whole wafer movable piece 173 and the second whole wafer movable piece 175 are both movably connected to the whole wafer support 171 along the Y direction, the lower surface of the first whole wafer movable piece 173 is connected with a plurality of first whole wafer pieces 172, and the plurality of first whole wafer pieces 172 are separately arranged on both sides of the first whole wafer movable piece 173 in the Y direction; the lower surface of the second whole wafer movable piece 175 is connected with a plurality of second whole wafer pieces 174, and the plurality of second whole wafer pieces 174 are separately arranged on both sides of the second whole wafer movable piece 175 in the Y direction; in the X direction, the first whole wafer piece 172 and the second whole wafer piece 174 are arranged staggered.

[0124] In the wafer assembly 170 arranged in the first output group E, one of the third conveying lines 120 passes between the two groups of first wafer members 172 arranged on the two sides of the first wafer movable member 173 in the Y direction in the X direction, and the other third conveying line 120 passes between the two groups of second wafer members 174 arranged on the two sides of the second wafer movable member 175 in the Y direction in the X direction; in the wafer assembly 170 arranged in the second output group F, one of the second conveying lines 112 passes between the two groups of first wafer members 172 arranged on the two sides of the first wafer movable member 173 in the Y direction in the X direction, and the other second conveying line 112 passes between the two groups of second wafer members 174 arranged on the two sides of the second wafer movable member 175 in the Y direction in the X direction.

[0125] The first wafer movable member 173 and the second wafer movable member 175 can approach or move away from each other. For the convenience of description, in the Y direction, the side where the first wafer movable member 173 is located is the left side, and the side where the second wafer movable member 175 is located is the right side. The following describes the action of the wafer assembly 170 by taking the wafer assembly 170 arranged in the first output group E as an example:

[0126] When a pair of silicon wafers 900 passes through the wafer assembly 170, the first wafer movable member 173 and the second wafer movable member 175 first approach each other. The second wafer member 174 on the left side of the second wafer movable member 175 and the first wafer member 172 on the left side of the first wafer movable member 173 approach each other and respectively contact the silicon wafers 900 conveyed on the opposite sides in the Y direction on one of the third conveying lines 120. The second wafer member 174 on the right side of the second wafer movable member 175 and the first wafer member 172 on the right side of the first wafer movable member 173 approach each other and respectively contact the silicon wafers 900 conveyed on the opposite sides in the Y direction on the other third conveying line 120, thereby achieving the correction of the angle of the pair of parallel silicon wafers 900. Then, the first wafer movable member 173 and the second wafer movable member 175 move away from each other, so that the second wafer member 174 on the left side of the second wafer movable member 175 and the first wafer member 172 on the left side of the first wafer movable member 173 move away from each other, and the second wafer member 174 on the right side of the second wafer movable member 175 and the first wafer member 172 on the right side of the first wafer movable member 173 move away from each other, so that the pair of parallel silicon wafers 900 can smoothly pass through the wafer assembly 170. By repeating the above action, the arrangement of each pair of parallel silicon wafers 900 before reaching the dry method basket 800 can be achieved, so that the silicon wafers 900 enter the dry method basket 800 at a suitable angle, reduce the possibility of collision between the silicon wafers 900 and the dry method basket 800, and ensure the yield rate.

[0127] Referring to Figure 26The wet process basket 700 includes two first end plates 710 and a plurality of first support columns 720. The two first end plates 710 are spaced apart, and the two ends of the first support columns 720 are connected to the two first end plates 710, respectively. The plurality of first support columns 720 define three first accommodating cavities between the two first end plates 710. The first end plate 710 has three clamping grooves 711, and each of the three clamping grooves 711 of the first end plate 710 corresponds to one of the three first accommodating cavities. Further, the first support column 720 is connected to a plurality of first clamping teeth 721 on the side close to the first accommodating cavity. The plurality of first clamping teeth 721 are arranged in sequence along the extension direction of the first support column 720. The edge of the silicon wafer 900 can be accommodated between two adjacent first clamping teeth 721, and the silicon wafers 900 can be arranged in sequence and spaced apart in the first accommodating cavity. In the wet process, in order to avoid the silicon wafer 900 from being separated from the wet process basket 700, three pressing rods 730 are installed on the two first end plates 710. The two ends of the pressing rod 730 are clamped to the two clamping grooves 711 corresponding to the same first accommodating cavity, respectively. The pressing rod 730 is used to prevent the silicon wafer 900 from being separated from the first accommodating cavity. Therefore, before the wet process basket 700 is input into the first feeding device 200, the pressing rod 730 is installed on the wet process basket 700.

[0128] Based on this, before the wet process basket 700 reaches the transfer device 100, the pressing rod 730 needs to be removed from the wet process basket 700, so that the silicon wafer 900 in the wet process basket 700 can be smoothly output to the transfer device 100. Referring to Figures 1 to 3 The first feeding device 200 includes a pressing rod removing assembly 210 and a pressing rod recycling assembly 220. The pressing rod removing assembly 210 is used to remove the pressing rod 730 from the wet process basket 700. The pressing rod recycling assembly 220 includes a recycling box 221, which is used to accommodate the pressing rod 730 removed from the wet process basket 700.

[0129] Further, referring to Figure 27 and Figure 28The clamping groove 711 forms an opening at the edge of the first end plate 710, the clamping groove 711 comprises an insertion section 7111 and a clamping section 7112, the clamping section 7112 is located at the side of the insertion section 7111 away from the opening, the width of the insertion section 7111 is a, the width of the clamping section 7112 is b, the length of the clamping section 7112 is c; the end of the pressing rod 730 is provided with a clamping part 731, the width of the clamping part 731 is w, the thickness of the clamping part 731 is h, w > h, h < a < w, b > w, c > w. When the pressing rod 730 needs to be installed on the wet flower basket 700, the thickness direction of the clamping part 731 can be parallel or approximately parallel to the width direction of the insertion section 7111, and the clamping part 731 can pass through the insertion section 7111 and enter the clamping section 7112; then the pressing rod 730 is rotated, the width direction of the clamping part 731 is parallel or approximately parallel to the width direction of the clamping section 7112, because the width w of the clamping part 731 is greater than the width a of the insertion section 7111, the clamping part 731 will not come out of the clamping section 7112 without rotating the pressing rod 730, so that the installation between the pressing rod 730 and the wet flower basket 700 can be realized.

[0130] Before the wet flower basket 700 enters the first feeding device 200, the clamping part 731 is contained in the clamping section 7112, referring to Figure 26 The pressing rod dismounting assembly 210 comprises a base 211 and two dismounting mechanisms 212, the base 211 is installed on the rack 600, the base 211 has a placing area for placing the wet flower basket 700, and the two dismounting mechanisms 212 are separately arranged on the two sides of the placing area. The dismounting mechanism 212 comprises a first support 2121 and three clamping pieces 2122, the first support 2121 is movably connected to the base 211 in the horizontal direction, in some specific embodiments, the first support 2121 is movably connected to the base 211 through a horizontal driving piece 2124, the output end of the horizontal driving piece 2124 is connected to the first support 2121 to drive the first support 2121 to move in the horizontal direction; the clamping piece 2122 is rotatably connected to the side of the first support 2121 close to the placing area, the three clamping pieces 2122 are arranged in sequence and at intervals, in some specific embodiments, a synchronous belt is wound around the three clamping pieces 2122 of at least one dismounting mechanism 212, and the rotation of one of the clamping pieces 2122 of the dismounting mechanism 212 can drive the other two clamping pieces 2122 to rotate synchronously; the clamping piece 2122 has a plug-in groove 2123.

[0131] When the wet flower basket 700 is placed in the placement area, the wet flower basket 700 is in a horizontal state, the pressing rods 730 extend along the horizontal direction and the openings of the clamping grooves 711 face upward, and the first supports 2121 of the two dismounting mechanisms 212 are both moved toward the wet flower basket 700, so that the clamping portions 731 at both ends of each pressing rod 730 are respectively inserted into a corresponding insertion groove 2123, and the clamping piece 2122 can rotate relative to the first support 2121 to drive the pressing rod 731 to rotate, so that the thickness direction of the clamping portion 731 is parallel or approximately parallel to the width direction of the insertion section 7111, and the pressing rod 731 can be taken out of the clamping groove 711.

[0132] Further, the first support 2121 is movably connected to the base 211 along the vertical direction (i.e., the Z direction), and in some specific embodiments, a lifting driving piece 2125 is installed on the base 211, and the output end of the lifting driving piece 2125 is connected to the combination of the horizontal driving piece 2124 and the first support 2121. When the clamping piece 2122 drives the pressing rod 730 to rotate to the state that the thickness direction of the clamping portion 731 is parallel or approximately parallel to the width direction of the insertion section 7111, the lifting driving piece 2125 drives the first support 2121 to rise, so that the clamping piece 2122 drives the pressing rod 730 to disengage from the wet flower basket 700.

[0133] Further, referring to Figure 26 , the first end plate 710 further has a positioning hole 712, and the pressing rod dismounting assembly 210 further includes two positioning mechanisms 213, which are arranged on the two sides of the placement area. The positioning mechanism 213 includes a second support 2131 and a positioning piece 2132. The second support 2131 is movably connected to the base 211 along the horizontal direction, and the positioning piece 2132 is connected to the side of the second support 2131 close to the placement area. When the wet flower basket 700 is placed in the placement area, the second supports 2131 of the two positioning mechanisms 213 are both moved toward the wet flower basket 700 until the positioning piece 2132 is embedded in the positioning hole 712, and then the first supports 2121 of the two dismounting mechanisms 212 are both moved toward the wet flower basket 700, so that the clamping portions 731 at both ends of each pressing rod 730 are respectively inserted into a corresponding insertion groove 2123. The positioning mechanism 213 can position the wet flower basket 700 before the dismounting mechanism 212 operates, so that the clamping portion 731 is aligned with the insertion groove 2123, which reduces the possibility that the clamping portion 731 interferes with the clamping piece 2122 due to the inaccurate position of the wet flower basket 700, thereby improving the smoothness of operation and reducing the failure rate.

[0134] Further, referring to Figures 1 to 3, the first feeding device 200 further comprises a mechanical arm 230 connected to the rack 600, the mechanical arm 230 can place the wet method basket 700 loaded with the silicon wafer 900 in the pressing rod dismounting assembly 210, and the mechanical arm 230 can place the pressing rod 730 in the recycling box 221. In some specific embodiments, referring to Figures 1 to 3 , the mechanical arm 230 is provided with a basket clamp 231 and a pressing rod clamp 232, in actual use, the mechanical arm 230 drives the basket clamp 231 to clamp the wet method basket 700 loaded with the silicon wafer 900 and carries the wet method basket 700 to the placement area of the pressing rod dismounting assembly 210, after the two dismounting mechanisms 212 dismount the pressing rod 730 from the wet method basket 700, the mechanical arm 230 drives the pressing rod clamp 232 to grab the pressing rod 730 and places the pressing rod 730 in the recycling box 221.

[0135] Further, referring to Figure 25 , the recycling box 221 comprises two opposite limiting walls 2211 and a side wall 2212, the side wall 2212 is perpendicular to the limiting walls 2211, both ends of the side wall 2212 are connected to the two limiting walls 2211 respectively, both the limiting walls 2211 have three limiting grooves 2213 extending in the vertical direction (i.e. Z direction), the limiting grooves 2213 are used for accommodating the end of the pressing rod 730, the pressing rods 730 can be arranged in three columns in the recycling box 221, three pressing rods 730 are placed in each layer, after the recycling box 221 is filled with the pressing rods 730, the recycling box 221 can be directly transported as a whole before the wet method process, the equipment before the wet method process can conveniently take three pressing rods 730 in one layer at a time and install them on the wet method basket 700, which is beneficial to improve the efficiency of the installation of the pressing rods 730.

[0136] Referring to Figure 1 and Figure 2 , the first feeding device 200 further comprises a lifting assembly 240, referring to Figure 24The lifting assembly 240 comprises a lifting support 241 connected to the rack 600 and a supporting member 242 slidingly connected to the lifting support 241 in the vertical direction (i.e. the Z direction), the supporting member 242 can extend into the interior of the recycling box 221 between the two limiting walls 2211, the supporting member 242 extends in the horizontal direction and is used to carry the pressing rods 730. When the recycling box 221 does not carry the pressing rods 730, the supporting member 242 extends into the interior of the recycling box 221, and in the vertical direction (i.e. the Z direction), the top of the supporting member 242 and the top of the limiting wall 2211 have a space capable of accommodating one pressing rod 730; when the three pressing rods 730 installed on the same wet method basket 700 are placed on the supporting member 242 by the mechanical arm 230, the supporting member 242 moves downward by a distance of the diameter of one pressing rod 730, so that the three pressing rods 730 installed on the next wet method basket 700 can continue to be placed into the recycling box 221, and the above process is repeated until the recycling box 221 is full of the pressing rods 730, then the recycling box 221 is output and an empty recycling box 221 is input, and the above steps are continuously repeated to recycle the pressing rods 730.

[0137] The supporting member 242 can gradually descend with the loading of the pressing rods 730, so that each group of pressing rods 730 can be stably supported, which is beneficial to avoid the free falling of the pressing rods 730 in the vertical direction during the recycling process, thereby avoiding the damage of the pressing rods 730 and / or the recycling box 221 caused by the collision between the pressing rods 730 and the recycling box 221.

[0138] Further, referring to Figure 24 , the supporting member 242 is provided in plurality, and the lifting assembly 240 further comprises a movable member 243, the plurality of supporting members 242 are connected to the movable member 243 and are arranged in the horizontal direction, the movable member 243 is slidingly connected to the lifting support 241 in the vertical direction (i.e. the Z direction), the movable member 243 can drive the plurality of supporting members 242 to move synchronously in the vertical direction (i.e. the Z direction), and the plurality of supporting members 242 can jointly support the pressing rods 730, which is beneficial to reduce the stress on a single supporting member 242.

[0139] Further, referring to Figures 1 to 3 and Figure 25 , the pressing rod recycling assembly 220 further comprises a recycling conveying line 222 and a transfer trolley 223, the transfer trolley 223 is used to carry the recycling box 221, the transfer trolley 223 can drive the recycling box 221 loaded with the pressing rods 730 to move to the equipment before the wet process, and can also drive the empty recycling box 221 to enter the pressing rod recycling assembly 220; one lifting assembly 240 corresponds to two recycling conveying lines 222, the two recycling conveying lines 222 arranged in parallel and in the horizontal direction are used to jointly carry and convey one recycling box 221, and the lifting assembly 240 is located between the two recycling conveying lines 222 in the horizontal direction.

[0140] In actual use, the transfer trolley 223 drives the empty recycling box 221 to move between the two recycling conveying lines 222, and the two sides of the empty recycling box 221 are respectively in contact with the two recycling conveying lines 222. The two recycling conveying lines 222 can convey the recycling box 221 from the transfer trolley 223 to the lifting assembly 240, so that the supporting member 242 extends into the empty recycling box 221. After the recycling box 221 is filled with the pressing rods 730, the two recycling conveying lines 222 convey the recycling box 221 filled with the pressing rods 730 from the lifting assembly 240 to the transfer trolley 223, and then the transfer trolley 223 conveys the recycling box 221 to the equipment before the wet process. It should be noted that during the process of gradually filling the recycling box 221 with the pressing rods 730, the transfer trolley 223 does not need to be parked between the two recycling conveying lines 222 all the time. The transfer trolley 223 only needs to be parked between the two recycling conveying lines 222 when it is needed to receive the recycling box 221 filled with the pressing rods 730 and when it is needed to provide the empty recycling box 221.

[0141] After the pressing rods 730 are disassembled, the wet process basket 700 is in a horizontal state, and in the transfer device 100, it is needed to make the wet process basket 700 in a vertical state, so as to output the silicon wafer 900 to the input area A. Based on this, referring to Figure 3 , the first feeding device 200 further comprises a turnover assembly 250. The turnover assembly 250 is located downstream of the pressing rod disassembling assembly 210, specifically, the turnover assembly 250 is located on the side of the pressing rod disassembling assembly 210 close to the transfer device 100 in the X direction. The turnover assembly 250 is used to receive the wet process basket 700 with the disassembled pressing rods 730, and adjust the posture of the wet process basket 700 to switch the wet process basket 700 to the vertical state. Referring to Figure 29 , the turnover assembly 250 comprises a turnover support 251 and a turnover clamp 252. The turnover support 251 is installed on the rack 600, and the turnover clamp 252 is rotationally connected to the turnover support 251. The turnover clamp 252 can be connected to the pressing rod disassembling assembly 210 to receive the wet process basket 700 with the disassembled pressing rods 730. The turnover clamp 252 can clamp the wet process basket 700 and drive the wet process basket 700 to rotate, so as to switch the wet process basket 700 from the horizontal state to the vertical state, to facilitate the subsequent transfer of the silicon wafer 900.

[0142] Further, referring to Figure 26 , the pressing rod disassembling assembly 210 further comprises a first output line 214. The first output line 214 is installed on the base 211 and extends in the X direction. Referring to Figure 29The turnover clamp 252 comprises a support part 2521, clamping parts 2522, a receiving line 2523 and a second output line 2524. The clamping parts 2522 are provided in two and at least one of them is movably connected to the support part 2521. The two clamping parts 2522 are used for abutting against the two first end plates 710 of the wet process basket 700 respectively to clamp the wet process basket 700. The receiving line 2523 is installed on the support part 2521 and extends along the X direction. The receiving line 2523 is used for being connected with the first output line 214. The second output line 2524 is installed on the clamping part 2522 located below after the turnover and extends along the X direction. The second output line 2524 is used for outputting the wet process basket 700 after the turnover along the X direction.

[0143] After the wet process basket 700 is dismounted from the pressing rod 730, the first output line 214 and the receiving line 2523 are simultaneously actuated. After the wet process basket 700 dismounted from the pressing rod 730 is conveyed from the base 211 to the support part 2521, the clamping parts 2522 clamp the wet process basket 700. Then, the turnover clamp 252 is rotated as a whole relative to the turnover support 251. After the wet process basket 700 is switched from the horizontal state to the vertical state, the second output line 2524 is actuated to output the wet process basket 700 along the X direction.

[0144] Further, referring to Figure 29 The turnover assembly 250 further comprises a first horizontal moving track 253 extending along the Y direction. The first horizontal moving track 253 is installed on the rack 600. The turnover support 251 is slidably connected to the first horizontal moving track 253 along the Y direction. The combination of the turnover support 251 and the turnover clamp 252 can move along the Y direction to realize the connection of the turnover clamp 252 with upstream and downstream components. For example, in some specific embodiments, a plurality of pressing rod dismounting assemblies 210 are provided. The combination of the turnover support 251 and the turnover clamp 252 can move along the Y direction to realize the connection of the turnover clamp 252 with different pressing rod dismounting assemblies 210, so as to turn the wet process basket 700 output by the different pressing rod dismounting assemblies 210.

[0145] Further, referring to Figure 3 The first feeding device 200 further comprises a rotating horizontal moving assembly 260. Referring to Figure 30 The rotating horizontal moving assembly 260 comprises a rotating support 261, a rotating part 262, a second horizontal moving track 263 and a receiving output line 265. The rotating support 261 is slidably connected to the second horizontal moving track 263. The rotating part 262 is rotatably connected to the rotating support 261 and can move along the vertical direction relative to the rotating support 261. The receiving output line 265 is installed on the rotating support 261.

[0146] After the turnover assembly 250 switches the wet flower basket 700 to the upright state, the side of the wet flower basket 700 through which the silicon wafer 900 enters and exits faces the side in the Y direction, the receiving output line 265 is connected to the second output line 2524 of the turnover assembly 250 to receive the wet flower basket 700 in the upright state, the rotating piece 262 rises and is clamped with the wet flower basket 700 and drives the wet flower basket 700 to rotate, so that the side of the wet flower basket 700 through which the silicon wafer 900 enters and exits faces the side in the X direction close to the transfer device 100, and then the rotating piece 262 descends and is separated from the wet flower basket 700, the rotating support piece 261 drives the wet flower basket 700 to move along the Y direction to be connected to the first receiving piece 132 of the first lifting assembly 130, and then the receiving output line 265 and the first receiving piece 132 jointly drive the wet flower basket 700 to move from the receiving output line 265 to the first receiving piece 132.

[0147] Further, referring to Figure 30 , the upper surface of the rotating piece 262 is provided with a plurality of protruding parts 2621, and the plurality of protruding parts 2621 can be clamped to the first end plate 710 of the wet flower basket 700 when the rotating piece 262 rises, so as to realize the synchronous rotation of the rotating piece 262 and the wet flower basket 700.

[0148] Further, referring to Figure 1 and Figure 3 , the rotating and moving assembly 260 further comprises a second detection piece 264, the second detection piece 264 is located on the side of the second moving track 263 close to the transfer device 100 in the X direction, the rotating support piece 261 can drive the wet flower basket 700 to move along the Y direction so that the wet flower basket 700 is aligned with the second detection piece 264, the second detection piece 264 can detect the silicon wafer 900 in the wet flower basket 700, so as to judge whether the silicon wafer 900 is qualified by the processor, if the silicon wafer 900 in the wet flower basket 700 is qualified, the rotating support piece 261 drives the wet flower basket 700 to move along the Y direction to be connected to the first receiving piece 132 of the first lifting assembly 130, so that the wet flower basket 700 carrying the qualified silicon wafer 900 is conveyed to the first receiving piece 132 to transfer the silicon wafer 900; if the silicon wafer 900 in the wet flower basket 700 is unqualified, the rotating support piece 261 drives the wet flower basket 700 to move along the Y direction to the output position, so as to output the wet flower basket 700 carrying the unqualified silicon wafer 900 to the outside of the wafer guiding equipment for subsequent rework.

[0149] Referring to Figures 1 to 3The first discharging device 300 comprises an empty basket discharging conveying line 310 and a defective product discharging conveying line 320. The defective product discharging conveying line 320 is located above the empty basket discharging conveying line 310. Both the empty basket discharging conveying line 310 and the defective product discharging conveying line 320 extend along the X direction and are staggered with the transfer device 100 in the Y direction. The first lifting assembly 130 can convey the wet-process basket 700, which has output the silicon wafer 900 to the input area A, to the empty basket discharging conveying line 310, so that the empty basket discharging conveying line 310 outputs the empty wet-process basket 700 outward. The rotary horizontal moving assembly 260 can output the wet-process basket 700, which carries the unqualified silicon wafer 900, to the defective product discharging conveying line 320, so that the defective product discharging conveying line 320 outputs the wet-process basket 700, which carries the unqualified silicon wafer 900, outward.

[0150] Further, referring to Figures 1 to 3 The first discharging device 300 further comprises a first horizontal moving line 330, a lifting docking assembly 340, a defective product docking line 350 and an empty basket docking line 360. The first horizontal moving line 330 is located on the side of the empty basket discharging conveying line 310 close to the rotary horizontal moving assembly 260 in the X direction, and extends along the Y direction. The lifting docking assembly 340 is located between the first horizontal moving line 330 and the empty basket discharging conveying line 310 in the X direction. The lifting docking assembly 340 can drive the wet-process basket 700 to move along the vertical direction (i.e. the Z direction) to dock with the empty basket discharging conveying line 310 or the defective product discharging conveying line 320, so that the wet-process basket 700 is conveyed to the corresponding conveying line. The defective product docking line 350 is located between the output position of the rotary horizontal moving assembly 260 and the first horizontal moving line 330 in the X direction, and is used to convey the wet-process basket 700, which carries the unqualified silicon wafer 900 and is output by the rotary horizontal moving assembly 260, from the output position to the first horizontal moving line 330. The empty basket docking line 360 is located between the first lifting assembly 130 and the first horizontal moving line 330 in the X direction, and is used to convey the empty wet-process basket 700 from the first lifting assembly 130 to the first horizontal moving line 330. The rotary horizontal moving assembly 260, the empty basket discharging conveying line 310, the first horizontal moving line 330, the defective product docking line 350 and the empty basket docking line 360 are located at the same height. In the vertical direction, the transfer device 100 and the defective product discharging conveying line 320 are located above the rotary horizontal moving assembly 260, the empty basket discharging conveying line 310, the first horizontal moving line 330, the defective product docking line 350 and the empty basket docking line 360.

[0151] When the second detection member 264 detects that the silicon wafer 900 in the wet method basket 700 is qualified, the rotating support member 261 drives the wet method basket 700 carrying the qualified silicon wafer 900 (hereinafter referred to as the qualified wet method basket 700) to move along the Y direction to the first receiving member 132 of the first lifting assembly 130 to make the qualified wet method basket 700 transported to the first receiving member 132, the first lifting assembly 130 drives the qualified wet method basket 700 to move upwards first to make the silicon wafer 900 at the lowermost layer of the qualified wet method basket 700 abut against the input area A, and then drives the qualified wet method basket 700 to move downwards layer by layer until all the silicon wafers 900 in the qualified wet method basket 700 are output to the input area A; after the output is completed, the first lifting assembly 130 drives the empty wet method basket 700 to move downwards to abut against the empty basket abutment line 360, and outputs the empty wet method basket 700 to the empty basket abutment line 360, which then outputs the empty wet method basket 700 to the first horizontal movement line 330, and the first horizontal movement line 330 drives the empty wet method basket 700 to move along the Y direction to abut against the lifting abutment assembly 340 at the lower layer, which then drives the empty wet method basket 700 to be transported to the empty basket unloading conveying line 310.

[0152] When the second detection member 264 detects that the silicon wafer 900 in the wet method basket 700 is unqualified, the rotating support member 261 drives the wet method basket 700 carrying the unqualified silicon wafer 900 (hereinafter referred to as the unqualified wet method basket 700) to move along the Y direction to the output position and abut against the defective product abutment line 350, so as to make the unqualified wet method basket 700 transported to the defective product abutment line 350, which then outputs the unqualified wet method basket 700 to the first horizontal movement line 330, and the first horizontal movement line 330 drives the unqualified wet method basket 700 to abut against the lifting abutment assembly 340 at the lower layer, which then drives the unqualified wet method basket 700 to move upwards to abut against the defective product unloading conveying line 320, and drives the unqualified wet method basket 700 to be transported to the defective product unloading conveying line 320.

[0153] Referring to Figures 2 to 3The second feeding device 400 comprises a feeding conveying line 410 and a second transverse line 420, and the second discharging device 500 comprises a discharging conveying line 510 and a third transverse line 520. The feeding conveying line 410 is located above the discharging conveying line 510, and is used for feeding empty dry process baskets 800 to the three second lifting assemblies 140. The second transverse line 420 is located between the feeding conveying line 410 and the second lifting assemblies 140, extends along the Y direction, can receive the empty dry process baskets 800 conveyed by the feeding conveying line 410, and feed the empty dry process baskets 800 to the second lifting assemblies 140 which do not carry the dry process baskets 800. The discharging conveying line 510 is used for receiving the dry process baskets 800 loaded with silicon wafers 900 output by the three second lifting assemblies 140. The third transverse line 520 is located between the discharging conveying line 510 and the second lifting assemblies 140, extends along the Y direction, can receive the dry process baskets 800 loaded with silicon wafers 900 output by the second lifting assemblies 140, and convey the dry process baskets 800 loaded with silicon wafers 900 to the discharging conveying line 510.

[0154] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application. Furthermore, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A blade guiding apparatus for transferring silicon wafers from a wet boat to a dry boat, said wet boat being capable of holding three columns of said silicon wafers, said dry boat being capable of holding two columns of said silicon wafers, characterized in that, The guide piece device comprises: The transfer device comprises two rail changing conveying mechanisms, the first conveying line and the second conveying line each extend along the X direction and are capable of placing and conveying single silicon wafers along the X direction, the first conveying line extends from the input area to the rail changing area, the second conveying line extends from the rail changing area to the output area, in the rail changing area, the first conveying line and the second conveying line are staggered in the Y direction, the rail changing assembly is located in the rail changing area, and the rail changing assembly is used to move the silicon wafers from the first conveying line to the adjacent second conveying line; the transfer device further comprises four third conveying lines, the third conveying lines extend along the X direction and are capable of placing and conveying single silicon wafers along the X direction, the third conveying lines extend from the input area to the output area, in the input area, two third conveying lines and one first conveying line are arranged side by side in the Y direction to form an input group, and two input groups are arranged; in the output area, two third conveying lines are arranged side by side in the Y direction to form a first output group, two first output groups are arranged on two sides of the second output group in the Y direction, and two second conveying lines are arranged side by side in the Y direction to form a second output group; the Y direction is perpendicular to the X direction; The first feeding device is connected to one end of the input area away from the rail changing area to supply the wet method basket loaded with the silicon wafers to the transfer device; The first discharging device is connected to one end of the input area away from the rail changing area to output the empty wet method basket; The second feeding device is connected to one end of the output area away from the rail changing area to supply the dry method basket loaded with the silicon wafers to the transfer device; The second discharging device is connected to one end of the output area away from the rail changing area to output the dry method basket loaded with the silicon wafers; The transfer device, the first feeding device, the first discharging device, the second feeding device, and the second discharging device are all mounted on the rack; The first conveying line comprises two first belt conveying structures, the first belt conveying structures are arranged along the X direction, the upper surfaces of the first belt conveying structures are used to carry workpieces and convey the workpieces along the X direction, the first belt conveying structures have first conveying portions and first connecting portions along the X direction, and a first interval is defined between the two first connecting portions; The second conveying line comprises two second belt conveying structures, the second belt conveying structures are arranged along the X direction, the upper surfaces of the second belt conveying structures are used to carry workpieces and convey the workpieces along the X direction, the second belt conveying structures have second conveying portions and second connecting portions along the X direction, a second interval is defined between the two second connecting portions, and the first connecting portions and the second connecting portions are arranged in the Y direction in sequence; The rail changing assembly comprises a transverse sliding rail, a lifting drive and a carrier, the transverse sliding rail is located below the first conveying line and the second conveying line, the lifting drive is slidably connected to the transverse sliding rail along the Y direction, the output end of the lifting drive is connected to the carrier to drive the carrier to move along the vertical direction, the carrier can pass through the first interval to move above or below the first conveying line, and the carrier can pass through the second interval to move above or below the second conveying line. The X direction, the Y direction and the vertical direction are perpendicular to each other. The first docking part has a first transverse interval, the second docking part has a second transverse interval, the first transverse interval and the second transverse interval extend along the Y direction, and the first transverse interval and the second transverse interval are sequentially arranged along the Y direction, and the lifting drive can move in the first transverse interval and the second transverse interval along the Y direction. Alternatively, the first docking part and the first conveying part have a first transverse interval extending along the Y direction, the first transverse interval and the side edge of the second docking part away from the second conveying part are sequentially arranged along the Y direction, and the lifting drive can move in the first transverse interval and the side of the second docking part away from the second conveying part along the Y direction. Alternatively, the second docking part and the second conveying part have a second transverse interval extending along the Y direction, the second transverse interval and the side edge of the first docking part away from the first conveying part are sequentially arranged along the Y direction, and the lifting drive can move in the second transverse interval and the side of the first docking part away from the first conveying part along the Y direction.

2. The strapping apparatus of claim 1 wherein, In the rail changing area, the first conveying line and the second conveying line are arranged side by side along the Y direction, and the rail changing assembly is used for moving the silicon wafer along the Y direction to move the silicon wafer from the first conveying line to the second conveying line.

3. The strapping apparatus of claim 1 wherein, The wet basket comprises two first end plates and a plurality of first support columns, the two first end plates are arranged at intervals, the two ends of the first support columns are connected to the two first end plates respectively, and the plurality of first support columns define three first accommodating cavities between the two first end plates, the first end plates have three clamping grooves, and each of the three clamping grooves of each first end plate corresponds to one of the three first accommodating cavities, three pressing rods are mounted on the two first end plates before the wet basket is input into the first feeding device, the two ends of the pressing rod are clamped in the two clamping grooves corresponding to the same first accommodating cavity, and the pressing rod is used to prevent the silicon wafer from being taken out of the first accommodating cavity. The first feeding device comprises a pressing rod dismounting assembly and a pressing rod recycling assembly, the pressing rod dismounting assembly is used to dismount the pressing rod from the wet basket, and the pressing rod recycling assembly comprises a recycling box used to accommodate the pressing rod.

4. The strapping device of claim 3, wherein, The clamping groove forms an opening at the edge of the first end plate, the clamping groove comprises an insertion section and a clamping section, the clamping section is located at the side of the insertion section away from the opening, the width of the insertion section is a, the width of the clamping section is b, and the length of the clamping section is c; the end of the pressing rod is provided with a clamping part, the width of the clamping part is w, the thickness of the clamping part is h, w>h, h The pressing rod dismounting assembly comprises a base and two dismounting mechanisms, the base is installed on the rack, the base has a placing area for placing the wet-process flower basket, and the two dismounting mechanisms are arranged on the two sides of the placing area, the dismounting mechanism comprises a first support and three clamping pieces, the first support is slidingly connected to the base in the horizontal direction, the clamping pieces are rotationally connected to the first support, the three clamping pieces are arranged in sequence and at intervals, and the clamping piece has an insertion slot; when the wet-process flower basket is placed in the placing area, the wet-process flower basket is in a horizontal state, the pressing rod extends in the horizontal direction, and the opening of the clamping groove faces upward; the first supports of the two dismounting mechanisms can move toward the wet-process flower basket, so that the clamping parts at the two ends of each pressing rod are respectively inserted into a corresponding insertion slot, and the clamping pieces can be rotated relative to the first support to drive the pressing rod to rotate.

5. The strapping device of claim 4, wherein, The first support is also movably connected to the base in the vertical direction, and when the clamping part is parallel to the insertion section in the thickness direction, the first support can move upward relative to the base to make the pressing rod exit the clamping groove.

6. The guide plate apparatus of claim 3, wherein The first feeding device further comprises a mechanical arm, the mechanical arm is connected to the rack, the mechanical arm can place the wet-process flower basket loaded with a silicon wafer in the pressing rod dismounting assembly, and the mechanical arm can place the pressing rod in the recycling box.

7. The strake apparatus of claim 3, wherein, The recycling box comprises two opposite limiting walls and a side wall, the side wall is perpendicular to the limiting walls, the two ends of the side wall are connected to the two limiting walls, and the two limiting walls each have three limiting slots extending in the vertical direction, the limiting slots are used for accommodating the end of the pressing rod. The first feeding device further comprises a lifting assembly, the lifting assembly comprises a lifting support and a supporting piece, the lifting support is connected to the rack, and the supporting piece is slidingly connected to the lifting support in the vertical direction; the supporting piece can extend into the interior of the recycling box between the two limiting walls, and the supporting piece is used for carrying the pressing rod.

8. The strake apparatus of claim 3, wherein, The first feeding device further comprises a turnover assembly for receiving the wet-process flower basket from which the pressing rod is detached and adjusting the posture of the wet-process flower basket so as to switch the wet-process flower basket to an upright state; the turnover assembly comprises a turnover support and a turnover clamp, the turnover support is installed on the rack, and the turnover clamp is rotationally connected to the turnover support; the turnover clamp can be connected to the pressing rod detaching assembly to receive the wet-process flower basket from which the pressing rod is detached; the turnover clamp can clamp the wet-process flower basket and drive the wet-process flower basket to rotate so as to switch the wet-process flower basket from a horizontal state to an upright state.

9. The strapping device of claim 1, wherein, The transfer device further comprises two first lifting assemblies and three second lifting assemblies, the two first lifting assemblies are respectively located on the sides of the two input groups away from the track changing area, the first lifting assembly comprises a first lifting support, a first receiving member and a first pressing member, the first lifting support is connected to the rack, the first receiving member and the first pressing member are both slidingly connected to the first lifting support in the vertical direction, the first receiving member is used for receiving the wet-process flower basket loaded with silicon wafers conveyed from the first feeding device, and the first pressing member is used for pressing the wet-process flower basket to the first receiving member; the first pressing member and the first receiving member can clamp the wet-process flower basket and drive the wet-process flower basket to move in the vertical direction so as to convey the silicon wafers in the wet-process flower basket to the input groups layer by layer; The three second lifting assemblies are respectively located on the sides of the two first output groups and the second output group away from the track changing area, the second lifting assembly comprises a second lifting support, a second receiving member and a second pressing member, the second lifting support is connected to the rack, the second receiving member and the second pressing member are both slidingly connected to the second lifting support in the vertical direction, the second receiving member is used for receiving the dry-process flower basket conveyed from the second feeding device, and the second pressing member is used for pressing the dry-process flower basket to the second receiving member; the second pressing member and the second receiving member can clamp the dry-process flower basket and drive the dry-process flower basket to move in the vertical direction so as to insert the silicon wafers output from the two first output groups and the second output group into the dry-process flower basket layer by layer.

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