An epoxy resin electronic potting adhesive, its preparation method and application

Abstract

The present invention relates to the technical field of potting adhesive materials, and specifically relates to an epoxy resin electronic potting adhesive, its preparation method and application; the specific formulation includes component A and component B; component A includes epoxy resin, defoamer, leveling agent, epoxy diluent, color powder and filler; component B includes aromatic amine curing agent, benzyl alcohol, furfuryl alcohol and salicylic acid; in the preparation process, component A and component B are prepared separately and mixed in a specific ratio to obtain the epoxy resin electronic potting adhesive. The specific formulation and preparation process of the present invention realize the optimization of the performance of the epoxy resin potting adhesive at the molecular level, prompting the formation of a firm and stable cross-linked network structure inside the potting adhesive. This structure can provide good thermal stability and chemical stability, as well as excellent electrical insulation performance, so that the finished product has higher mechanical strength, especially greatly enhancing the impact strength and tensile strength, meeting the requirements of high-end electronic packaging materials.

Description

Technical Field

[0001] The present invention belongs to the technical field of potting adhesive materials, and particularly relates to an epoxy resin electronic potting adhesive and its preparation method and application. Background Art

[0002] In modern electronic industry, electronic potting adhesives play a crucial role. It is a special material used for encapsulating electronic components. The potting adhesive is in a liquid state before curing and has fluidity. The viscosity of the glue liquid varies according to the material, performance, and production process of the product. The potting adhesive can only realize its use value after being completely cured. After curing, it can play the roles of waterproofing, moisture-proofing, dust-proofing, insulation, heat conduction, confidentiality, anti-corrosion, temperature resistance, and shock resistance. There are various types of electronic potting adhesives, including silicone potting adhesives, polyurethane potting adhesives, epoxy resin potting adhesives, etc. Each type has its unique properties and application fields.

[0003] Epoxy resin potting adhesives have received extensive attention due to their excellent adhesion, electrical insulation, and chemical stability. Its application in the field of electronic packaging is particularly prominent, and it can effectively protect electronic components and extend their service life. Epoxy resin potting adhesives can not only provide good protection, but also ensure the long-term stability and reliability of electronic components.

[0004] Although epoxy resin potting adhesives have many advantages, there are still some deficiencies in their mechanical strength at present. For example, their impact resistance and tensile resistance are relatively low, which may cause cracking or damage of the encapsulation material when facing severe vibration or mechanical shock, thereby affecting the normal operation of electronic components. In many high-end application scenarios, such as aerospace, military, and automotive electronics, the mechanical strength requirements for electronic components are extremely high. Therefore, it is particularly important to improve the mechanical strength of epoxy resin potting adhesives. Summary of the Invention

[0005] In order to overcome the above technical problems, protect electronic components from physical shock and vibration, and improve the mechanical strength and seismic resistance of epoxy resin electronic potting adhesives, the present invention discloses an epoxy resin electronic potting adhesive and its preparation method and application.

[0006] One of the purposes of the present invention is to provide an epoxy resin electronic potting adhesive, and its technical solution is as follows:

[0007] An epoxy resin electronic potting adhesive, comprising component A and component B; component A includes 250 - 350 parts of epoxy resin, 0.2 - 0.6 parts of defoaming agent, 0.1 - 0.3 parts of leveling agent, 80 - 120 parts of epoxy diluent, 1 - 5 parts of color powder, and 550 - 600 parts of filler; component B includes 50 - 60 parts of aromatic amine curing agent, a total of 35 - 50 parts of benzyl alcohol and furfuryl alcohol, and 1 - 5 parts of salicylic acid.

[0008] Furthermore, the component A includes 290 - 320 parts of epoxy resin, 0.3 - 0.5 parts of defoamer, 0.1 - 0.3 parts of leveling agent, 80 - 100 parts of epoxy diluent, 1 - 5 parts of color powder, and 580 - 600 parts of filler; the component B includes 50 - 55 parts of aromatic amine curing agent, 35 - 50 parts in total of benzyl alcohol and furfuryl alcohol, and 1 - 5 parts of salicylic acid.

[0009] Preferably, the component A includes 300 parts of epoxy resin, 0.4 parts of defoamer, 0.2 parts of leveling agent, 100 parts of epoxy diluent, 2 parts of color powder, and 598 parts of filler; the component B includes 55 parts of aromatic amine curing agent, 22 parts of benzyl alcohol, 20 parts of furfuryl alcohol, and 3 parts of salicylic acid.

[0010] Preferably, the filler includes barium sulfate, silica powder, and modified heavy magnesium carbonate; the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 1:1.5 - 2:4.5 - 5. And the particle sizes of barium sulfate, silica powder, and modified heavy magnesium carbonate are all 400 mesh.

[0011] Preferably, the weight ratio of barium sulfate, silica powder, and heavy magnesium carbonate is 4:7:19.

[0012] Preferably, the modified heavy magnesium carbonate is divinylbenzene - modified heavy magnesium carbonate, and the modification step includes: mixing divinylbenzene with heavy magnesium carbonate, heating to 40 - 50 °C and stirring for 30 - 60 min until evenly mixed, then the modified heavy magnesium carbonate is obtained.

[0013] Preferably, in the modification step, the weight part of divinylbenzene is 0.2 - 0.3 times that of heavy magnesium carbonate.

[0014] The present invention uses divinylbenzene to modify heavy magnesium carbonate. After modification, the mechanical strength of the obtained finished product is greatly improved through detection. It is speculated that the modification step may involve improving the compatibility and interfacial adhesion between the filler and the resin matrix. And at the subsequent high temperature, the modified heavy magnesium carbonate is mixed with epoxy resin, which promotes better dispersion and uniform mixing of the filler in the entire epoxy resin system, thereby improving the mechanical strength of the material. Finally, an aromatic amine curing agent is added for mixing. The role of the curing agent is to chemically react with the epoxy resin and also to cross - link with divinylbenzene. These multiple cross - link reactions enable a stable three - dimensional cross - linked network structure to form inside the entire system, greatly improving the mechanical strength and heat resistance of the final product.

[0015] The addition of divinylbenzene as a modifier not only combines with the surface of heavy magnesium carbonate, but also participates in the reaction to increase the crosslinking density, thereby improving the mechanical properties of the material. After the heavy magnesium carbonate is modified, its surface properties may change, which improves the compatibility with epoxy resin, helps stress transfer, and further improves the strength and toughness of the material, thereby showing strong mechanical strength.

[0016] Preferably, the aromatic amine curing agent is 4,4′-diaminodiphenylmethane; the epoxy resin diluent is butyl glycidyl ether; the leveling agent is one of alkyl-modified organic siloxane, polydimethylsiloxane, and polyether-modified polyorganosiloxane; and the defoaming agent is an organic silicone defoaming agent.

[0017] In particular, the color powder of the present invention is mainly used to adjust the color of the potting compound. Different colors of color powders can be selected according to different requirements of customers, such as red, yellow, black, etc. The color powder of the present invention is mainly black, and carbon black is selected as the colorant of the black potting compound.

[0018] The second object of the present invention is to provide a method for preparing epoxy resin electronic potting glue, and its technical scheme is as follows:

[0019] A method for preparing epoxy resin electronic potting glue, wherein component A and component B are prepared separately, and specifically comprises the following steps:

[0020] Component A: Add epoxy resin, epoxy resin diluent and color powder in sequence, stir evenly at 60-80℃, then add defoamer in sequence according to the metered amount and stir evenly, then add barium sulfate and stir for 15 minutes, then add modified heavy magnesium carbonate and silicon powder and stir, after the material temperature rises to 80℃-90℃, pass through a 60-mesh sieve and perform vacuum treatment, keep the material temperature at 70℃ and vacuumize for 3 hours, then cool down to 40℃;

[0021] Component B: Heat the aromatic amine curing agent to 110°C to completely melt it, then add benzyl alcohol, furfuryl alcohol, and salicylic acid in sequence, stir thoroughly, mix evenly, and keep warm at 80°C for 2 hours;

[0022] The component A and the component B are mixed evenly to prepare the epoxy resin electronic potting adhesive.

[0023] It should be noted here that the present invention prepares component A and component B separately, and can store them separately after preparation. Component A is sealed and stored in iron products such as iron cans, and component B is sealed and stored in plastic products such as plastic pots. Component A and component B are mixed when used.

[0024] Preferably, when the potting glue is used, the mixing ratio of component A to component B is 100:30-37.

[0025] The third object of the present invention is to provide an application of an epoxy resin electronic potting adhesive, which is mainly used for the encapsulation of electronic components, mainly for the insulation, moisture-proof potting of various capacitors and other electronic components, and for the shielding of confidentiality.

[0026] Beneficial effects:

[0027] The specific formula and preparation process of the present invention realize the optimization of the performance of the epoxy resin potting adhesive at the molecular level, prompting the formation of a firm and stable cross-linked network structure inside the potting adhesive. This structure can provide good thermal stability and chemical stability, as well as excellent electrical insulation performance, so that the finished product has higher mechanical strength, especially greatly enhancing the impact strength and tensile strength, meeting the requirements of high-end electronic packaging materials.

[0028] The present invention adopts the method of separately preparing component A and component B and storing them separately, separating the reaction substances and keeping them in a stable state respectively, effectively avoiding premature curing, prolonging the service life of the product; it will not be affected by environmental factors such as temperature changes, reducing the danger caused by accidental mixing, improving the safety of operation; and when using, only need to mix component A and component B according to the specified ratio, simplifying the operation process, without complex weighing and preparation work, increasing the flexibility of use and simplifying the operation process, making the use of the product more convenient and efficient. Specific embodiments

[0029] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0030] In the first aspect, the present invention provides an epoxy resin electronic potting adhesive, and its technical solution is as follows:

[0031] An epoxy resin electronic potting adhesive, comprising component A and component B; said component A comprises 250 - 350 parts of epoxy resin, 0.2 - 0.6 parts of defoamer, 0.1 - 0.3 parts of leveling agent, 80 - 120 parts of epoxy diluent, 1 - 5 parts of color powder, 550 - 600 parts of filler; said component B comprises 50 - 60 parts of aromatic amine curing agent, 35 - 50 parts in total of benzyl alcohol and furfuryl alcohol, 1 - 5 parts of salicylic acid.

[0032] Further, the component A includes 290 - 320 parts of epoxy resin, 0.3 - 0.5 parts of defoamer, 0.1 - 0.3 parts of leveling agent, 80 - 100 parts of epoxy diluent, 1 - 5 parts of color powder, and 580 - 600 parts of filler; the component B includes 50 - 55 parts of aromatic amine curing agent, 35 - 50 parts in total of benzyl alcohol and furfuryl alcohol, and 1 - 5 parts of salicylic acid.

[0033] In a preferred embodiment, the component A includes 300 parts of epoxy resin, 0.4 parts of defoamer, 0.2 parts of leveling agent, 100 parts of epoxy diluent, 2 parts of color powder, and 598 parts of filler; the component B includes 55 parts of aromatic amine curing agent, 22 parts of benzyl alcohol, 20 parts of furfuryl alcohol, and 3 parts of salicylic acid.

[0034] The filler includes barium sulfate, silica powder, and modified heavy magnesium carbonate; the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 1:1.5 - 2:4.5 - 5. And the particle size of the barium sulfate, silica powder, and modified heavy magnesium carbonate used in the embodiments of the present invention is 400 mesh. Further, the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate can be 1:1.5:4.5, 1:2:5, 1:1.5:5. In a specific example, the weight ratio of barium sulfate, silica powder, and heavy magnesium carbonate is 4:7:19.

[0035] The modified heavy magnesium carbonate is divinylbenzene - modified heavy magnesium carbonate, and the modification step includes: mixing divinylbenzene with heavy magnesium carbonate, heating to 40 - 50 °C and stirring for 30 - 60 min until evenly mixed, then the modified heavy magnesium carbonate is obtained.

[0036] In the modification step, the weight part of divinylbenzene is 0.2 - 0.3 times that of heavy magnesium carbonate. Further, the weight part of divinylbenzene can specifically be 0.2 times, 0.25 times, or 0.3 times that of heavy magnesium carbonate.

[0037] The aromatic amine curing agent is 4,4′ - diaminodiphenylmethane; the epoxy resin diluent is butyl glycidyl ether; the leveling agent is one of alkyl - modified silicone oxide, polydimethylsiloxane, and polyether - modified polysiloxane; the defoamer is silicone defoamer.

[0038] The epoxy resin used in the present invention is epoxy resin E51, the defoamer used in the embodiment of the present invention can be a silicone defoamer, the leveling agent used can be an alkyl-modified organosiloxane, polydimethylsiloxane, or polyether-modified polyorganosiloxane, and the leveling agent and the silicone defoamer can be purchased from BASF of Germany or BYK of Germany. The color powder of the present invention is mainly used to adjust the color of the potting compound, and different colors of color powder can be selected according to different requirements of customers, such as red, yellow, black, etc. The color powder of the present invention is mainly black, and carbon black from Mitsubishi Chemical of Japan is selected as the colorant of the black potting compound.

[0039] In a second aspect, the present invention provides a method for preparing an epoxy resin electronic potting adhesive, and the technical scheme thereof is as follows:

[0040] A method for preparing epoxy resin electronic potting glue, wherein component A and component B are prepared separately, and specifically comprises the following steps:

[0041] Component A: Add epoxy resin, epoxy resin diluent and color powder in sequence, stir evenly at 60-80℃, then add defoamer in sequence according to the metered amount and stir evenly, then add barium sulfate and stir for 15 minutes, then add modified heavy magnesium carbonate and silicon powder and stir, after the material temperature rises to 80℃-90℃, pass through a 60-mesh sieve and perform vacuum treatment, keep the material temperature at 70℃ and vacuumize for 3 hours, then cool down to 40℃;

[0042] Component B: Heat the aromatic amine curing agent to 110°C to completely melt it, then add benzyl alcohol, furfuryl alcohol, and salicylic acid in sequence, stir thoroughly, mix evenly, and keep warm at 80°C for 2 hours;

[0043] The component A and the component B are mixed evenly to prepare the epoxy resin electronic potting adhesive.

[0044] When the potting glue is used, the mixing ratio of component A and component B is 100:30-37. In some specific embodiments, the mixing ratio of component A and component B can be 100:30, 100:31, 100:32, 100:33, 100:34, 100:35, 100:36, 100:37. The curing time is 100°C x 3 hours or 110°C x 2 hours.

[0045] In a third aspect, the present invention provides an application of an epoxy resin electronic potting adhesive, which is mainly used in the packaging of electronic components, mainly for the insulation, moisture-proof potting and confidentiality sealing of various capacitors and other electronic components.

[0046] The present invention is further described in detail below in conjunction with specific examples. The raw materials used in the following preparation examples and examples are all commercially available products unless otherwise specified.

[0047] The present invention first pre-prepares component B and then stores it for standby use.

[0048] The preparation process of component B is as follows:

[0049] Heat 4,4′-diaminodiphenylmethane to 110°C to completely melt it, then add benzyl alcohol, furfuryl alcohol, and salicylic acid in sequence, stir thoroughly, mix evenly, keep warm at 80°C for 2 hours, and then package and store in a plastic bottle. The specific amount of each component is as follows:

[0050] Preparation Example b1: Component B is selected from 50 parts of 4,4′-diaminodiphenylmethane, 20 parts of benzyl alcohol, 18 parts of furfuryl alcohol and 1 part of salicylic acid.

[0051] Preparation Example b2: Component B is selected from 53 parts of 4,4′-diaminodiphenylmethane, 26 parts of benzyl alcohol, 19 parts of furfuryl alcohol, and 5 parts of salicylic acid.

[0052] Preparation Example b3: Component B is selected from 55 parts of 4,4′-diaminodiphenylmethane, 22 parts of benzyl alcohol, 20 parts of furfuryl alcohol, and 3 parts of salicylic acid.

[0053] The preparation example of component A is as follows:

[0054] Preparation Example a1

[0055] Component A uses 250 parts of epoxy resin E51, 0.2 parts of defoamer, 0.1 parts of leveling agent, 80 parts of butyl glycidyl ether, 1 part of color powder, and 550 parts of filler. The weight ratio of barium sulfate, silicon micropowder, and modified heavy magnesium carbonate in the filler is 1:1.5:4.5, which are 78.6 parts of barium sulfate, 117.9 parts of silicon micropowder, and 353.6 parts of heavy magnesium carbonate.

[0056] The modified heavy magnesium carbonate is divinylbenzene-modified heavy magnesium carbonate, the weight portion of divinylbenzene used is 0.2 times that of the heavy magnesium carbonate, and the modification step includes: mixing divinylbenzene and heavy magnesium carbonate, heating to 40-50°C and stirring for 30-60 minutes until the mixture is uniform, thereby obtaining the modified heavy magnesium carbonate.

[0057] The preparation process of component A is as follows:

[0058] Epoxy resin E51, butyl glycidyl ether and color powder were added in sequence, stirred evenly at 60-80°C, and then the organosilicon defoamer was added in sequence according to the metered amount and stirred evenly, and then barium sulfate was added and stirred for 15 minutes, and then modified heavy magnesium carbonate and silicon powder were added and stirred. After the material temperature rose to 80°C-90°C, it was passed through a 60-mesh sieve and vacuum treated. The material temperature was maintained at 70°C and vacuumed for 3 hours, and then the temperature was lowered to 40°C to obtain component A of Preparation Example a1.

[0059] Preparation Example a2

[0060] Component A uses 350 parts of epoxy resin E51, 0.6 part of defoamer, 0.3 part of leveling agent, 120 parts of butyl glycidyl ether, 5 parts of color powder, and a total of 580 parts of filler. In the filler, the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 1:1.5:4.5, which are 82.9 parts of barium sulfate, 124.3 parts of silica powder, and 372.9 parts of heavy magnesium carbonate respectively.

[0061] Among them, the modified heavy magnesium carbonate is divinylbenzene-modified heavy magnesium carbonate, and the weight part of divinylbenzene used is 0.2 times that of heavy magnesium carbonate. The modification steps include: mixing divinylbenzene and heavy magnesium carbonate, heating to 40 - 50 °C and stirring for 30 - 60 min until evenly mixed, then the modified heavy magnesium carbonate is obtained.

[0062] The preparation process of Component A is as follows:

[0063] Epoxy resin E51, butyl glycidyl ether, and color powder are added in sequence, stirred evenly under the condition of 60 - 80 °C, then the silicone defoamer is added in sequence according to the measurement and stirred evenly, then barium sulfate is added and stirred for 15 minutes, then the modified heavy magnesium carbonate and silica powder are added and stirred. After the material temperature rises to 80 °C - 90 °C, it is passed through a 60 - mesh sieve and then vacuum-treated. Keep the material temperature at 70 °C and vacuum for 3 hours, then cool down to 40 °C, and Component A of Preparation Example a1 is prepared.

[0064] Preparation Example a3

[0065] Component A uses 300 parts of epoxy resin E51, 0.4 part of defoamer, 0.2 part of leveling agent, 100 parts of butyl glycidyl ether, 2 parts of color powder, and a total of 598 parts of filler. In the filler, the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 1:1.5:4.5, which are 85.4 parts of barium sulfate, 128.1 parts of silica powder, and 384.4 parts of heavy magnesium carbonate respectively.

[0066] Among them, the modified heavy magnesium carbonate is divinylbenzene-modified heavy magnesium carbonate, and the weight part of divinylbenzene used is 0.2 times that of heavy magnesium carbonate. The modification steps include: mixing divinylbenzene and heavy magnesium carbonate, heating to 40 - 50 °C and stirring for 30 - 60 min until evenly mixed, then the modified heavy magnesium carbonate is obtained.

[0067] The preparation process of Component A is as follows:

[0068] Epoxy resin E51, butyl glycidyl ether and color powder were added in sequence, stirred evenly at 60 - 80 °C, then the silicone defoamer was added in sequence according to the dosage and stirred evenly, and then barium sulfate was added and stirred for 15 minutes. After that, modified heavy magnesium carbonate and silica powder were added and stirred. After the material temperature rose to 80 °C - 90 °C, it was passed through a 60-mesh sieve and then subjected to vacuum treatment. The material temperature was maintained at 70 °C and vacuumed for 3 hours, and then cooled to 40 °C to obtain Component A of Preparation Example a1.

[0069] Preparation Example a4

[0070] The difference between this preparation example and Preparation Example a3 is that in this preparation example, the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 1:2:5, which are 74.75 parts of barium sulfate, 149.5 parts of silica powder, and 373.75 parts of heavy magnesium carbonate respectively.

[0071] Preparation Example a5

[0072] The difference between this preparation example and Preparation Example a3 is that in this preparation example, the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 1:1.5:5, which are 79.7 parts of barium sulfate, 119.6 parts of silica powder, and 398.7 parts of heavy magnesium carbonate respectively.

[0073] Preparation Example a6

[0074] The difference between this preparation example and Preparation Example a3 is that in this preparation example, the weight ratio of barium sulfate, silica powder, and modified heavy magnesium carbonate is 4:7:19, which are 80 parts of barium sulfate, 140 parts of silica powder, and 378 parts of heavy magnesium carbonate respectively.

[0075] Preparation Example a7

[0076] The difference between this preparation example and Preparation Example a6 is that in this preparation example, the weight of divinylbenzene used in the modified heavy magnesium carbonate is 0.25 times that of the heavy magnesium carbonate.

[0077] Preparation Example a8

[0078] The difference between this preparation example and Preparation Example a6 is that in this preparation example, the weight of divinylbenzene used in the modified heavy magnesium carbonate is 0.3 times that of the heavy magnesium carbonate.

[0079] After testing, the properties of Component A: Preparation Examples a1 - a8 and Component B: Preparation Examples b1 - b3 are as follows:

[0080] Component A Component B Color Black Transparent light yellow Viscosity at 40°C / CPS 3000-6500 20-100 Specific gravity g / ml 1.6±0.1 1.0±0.05 Shelf life / month ＞6 ＞6 Flash point / °C ＞165 ＞150

[0081] In the examples of the present invention, Component B was prepared using Preparation Example b3.

[0082] Examples 1 - 8

[0083] Examples 1-8 were prepared by mixing Preparation Examples a1-a8 of Component A and Preparation Example b3 of Component B in a weight ratio of 100:30 respectively.

[0084] Example 9

[0085] Example 9 was prepared by mixing Preparation Example a6 and Preparation Example b3 of Component B in a weight ratio of 100:34.

[0086] Example 10

[0087] Example 9 was prepared by mixing Preparation Example a6 and Preparation Example b3 of Component B in a weight ratio of 100:37.

[0088] Comparative Example 1

[0089] Commercially available epoxy resin potting adhesive.

[0090] Comparative Example 2

[0091] Different from Example 9, the heavy magnesium carbonate in this comparative example was not modified.

[0092] Comparative Example 3

[0093] Different from Example 9, the weight fraction of divinylbenzene used in the modification process of the modified heavy magnesium carbonate in this comparative example was 0.1 times that of the heavy magnesium carbonate.

[0094] Comparative Example 4

[0095] Different from Example 9, the weight fraction of divinylbenzene used in the modification process of the modified heavy magnesium carbonate in this comparative example was 0.35 times that of the heavy magnesium carbonate.

[0096] Comparative Example 5

[0097] Different from Example 9, in this comparative example, Component A and Component B were prepared separately and then mixed and stored. After testing, the effective use period of Comparative Example 5 was 1 week. After more than one week, the potting adhesive showed an increase in viscosity, or had already undergone cross-linking or partial cross-linking, with poor fluidity and could not be used for potting electronic components.

[0098] The epoxy resin potting adhesives prepared in Examples 1-10 were first subjected to conventional performance tests, and the test data are as

[0099] shown in Table 1:

[0100]

[0101] Table 1: Conventional Performance Tests of Examples 1-10

[0102] And since the purpose of the present invention is to improve the mechanical strength of the epoxy resin potting adhesive, in addition to the ordinary use performance of the measured product meeting the requirements of the potting adhesive, further mechanical property tests were conducted on the epoxy resin potting adhesives prepared in Examples 1-10 and the epoxy resin potting adhesives of Comparative Examples 1-4. The test data are shown in Table 2:

[0103]

[0104]

[0105] Table 2: Mechanical Property Tests of Epoxy Resin Potting Adhesives in Examples 1-10 and Comparative Examples 1-4

[0106] After testing, the epoxy resin potting adhesives prepared in Examples 1-10 can be cured in only 3 hours in an environment of 100 °C. If the temperature is increased to 110 °C, complete curing can be achieved in 2 hours, showing a relatively fast curing rate. Moreover, the surface of the product after curing is smooth and flawless, with high hardness. And the cured product has effective flame retardant properties, excellent resistance to acids and alkalis, and also performs well in terms of moisture-proof, waterproof, oil-proof and dust-proof, and can withstand humid environments and long-term atmospheric exposure. The cured product also exhibits excellent electrical and physical properties such as insulation performance, compressive strength and high adhesiveness.

[0107] Through the unique formulation design of the present invention, the synergistic effect between components and the elaborate process coordination, the prepared epoxy resin potting adhesive has excellent impact resistance and tensile strength, and can meet the stringent requirements of high-end electronic component packaging.

[0108] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0109] The above-described embodiments merely represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims, and the specification can be used to explain the content of the claims.

Claims

1. An epoxy resin electronic potting adhesive, characterized in that: The invention comprises component A and component B; the component A comprises 250-350 parts of epoxy resin, 0.2-0.6 parts of defoamer, 0.1-0.3 parts of leveling agent, 80-120 parts of epoxy diluent, 1-5 parts of color powder, and 550-600 parts of filler; the component B comprises 50-60 parts of aromatic amine curing agent, 35-50 parts of benzyl alcohol and furfuryl alcohol, and 1-5 parts of salicylic acid; wherein the filler comprises barium sulfate, silicon powder, and modified heavy magnesium carbonate; the sulfur The weight ratio of barium sulfate, silicon powder and modified heavy magnesium carbonate is 1:1.5-2:4.5-5; the modified heavy magnesium carbonate is divinylbenzene modified heavy magnesium carbonate, and the modification step comprises: mixing divinylbenzene and heavy magnesium carbonate, heating to 40-50°C and stirring for 30-60min until the mixture is uniform, so as to obtain modified heavy magnesium carbonate; wherein, in the modification step, the weight ratio of divinylbenzene is 0.2-0.3 times that of the heavy magnesium carbonate.

2. The epoxy resin electronic potting adhesive according to claim 1, characterized in that: The component A comprises 300 parts of epoxy resin, 0.4 parts of defoamer, 0.2 parts of leveling agent, 100 parts of epoxy diluent, 2 parts of color powder, and 598 parts of filler; the component B comprises 55 parts of aromatic amine curing agent, 22 parts of benzyl alcohol, 20 parts of furfuryl alcohol, and 3 parts of salicylic acid.

3. The epoxy resin electronic potting adhesive according to claim 1, characterized in that: The weight ratio of the barium sulfate, silicon micropowder and heavy magnesium carbonate is 4:7:

19.

4. The epoxy resin electronic potting adhesive according to claim 1, characterized in that: The aromatic amine curing agent is 4,4'-diaminodiphenylmethane; the epoxy diluent is butyl glycidyl ether; the leveling agent is one of alkyl-modified organic siloxane, polydimethylsiloxane and polyether-modified polyorganosiloxane; and the defoaming agent is an organic silicon defoaming agent.

5. A method for preparing an epoxy resin electronic potting adhesive according to any one of claims 1 to 4, characterized in that: Component A and component B are prepared separately, specifically comprising the following steps: Component A: Add epoxy resin, epoxy resin diluent and color powder in sequence, stir evenly at 60-80℃, then add defoamer in sequence according to the metered amount and stir evenly, then add barium sulfate and stir for 15 minutes, then add modified heavy magnesium carbonate and silicon powder and stir, after the material temperature rises to 80℃-90℃, pass through a 60-mesh sieve and perform vacuum treatment, keep the material temperature at 70℃ and vacuumize for 3 hours, then cool down to 40℃; Component B: Heat the aromatic amine curing agent to 110°C to completely melt it, then add benzyl alcohol, furfuryl alcohol, and salicylic acid in sequence, stir thoroughly, mix evenly, and keep warm at 80°C for 2 hours; The component A and the component B are mixed evenly to prepare the epoxy resin electronic potting adhesive.

6. The method for preparing an epoxy resin electronic potting adhesive according to claim 5, characterized in that: The mixing ratio of component A to component B is 100:30-37.

7. Use of the epoxy resin electronic potting adhesive as claimed in any one of claims 1 to 4 in electronic parts packaging.

Images