Microdisplay panels and their forming methods, near-eye display devices

Abstract

A microdisplay panel and its forming method, as well as a near-eye display device, are disclosed. The forming method includes: providing a driving backplate having a first side and a second side; forming a microdisplay chip and a plurality of lead plates on the first side; performing a perforation process from the second side toward the first side of the driving backplate to form a plurality of lead through holes within the driving backplate; forming a plurality of connecting lines within each lead through hole and on the second side of the driving backplate, each connecting line being electrically connected to a corresponding lead plate; and forming connectors on the second side, each connector being electrically connected to a respective connecting line. By forming a plurality of lead through holes within the driving backplate and transferring the lead paths of the microdisplay panel to the second side of the driving backplate through the connecting lines within each lead through hole and on the second side, if the microdisplay panel also has other device structures (such as connectors), these can be fixed to the second side of the driving backplate. This satisfies the requirements of circuit design while effectively reducing the overall size of the microdisplay panel.

Description

Technical Field

[0001] This invention relates to the field of microdisplay technology, and more particularly to a microdisplay panel and its forming method, and a near-eye display device. Background Technology

[0002] Inorganic micropixel light-emitting diodes, also known as micro LEDs or μ-LEDs, have become increasingly important since their application in various fields, including self-emissive microdisplays, visible light communication, and optogenetics. Compared to traditional LEDs, Micro LEDs offer advantages such as better strain relaxation, higher light extraction efficiency, more uniform current diffusion, and higher output performance. Micro LEDs also boast improved thermal performance, faster response times, a wider operating temperature range, higher resolution, a broader color gamut, higher contrast, lower power consumption, and higher current density.

[0003] However, existing Micro LED microdisplay panels still have many problems. Summary of the Invention

[0004] The technical problem solved by the present invention is to provide a micro-display panel and a method for forming the same, as well as a near-eye display device, so as to reduce the size of the micro-display panel.

[0005] To address the aforementioned problems, the present invention provides a microdisplay panel, comprising: a driving backplate having a first side and a second side opposite to each other; a microdisplay chip and a plurality of lead plates located on the first side of the driving backplate, the microdisplay chip and the plurality of lead plates being electrically connected to the driving backplate respectively; a plurality of lead vias located within the driving backplate, each lead via extending from the second side of the driving backplate toward the first side of the driving backplate, and each lead via exposing a corresponding lead plate; a plurality of connecting lines located within each lead via and on the second side of the driving backplate, each connecting line being electrically connected to a corresponding lead plate; and a plurality of conductive bonding structures located on the second side of the driving backplate, each conductive bonding structure being connected to a corresponding connecting line.

[0006] Optionally, the driving backplane includes: a central region and an edge region surrounding the central region; a plurality of lead plates are located in the edge region of the driving backplane, and the microdisplay chip is located in the central region of the driving backplane.

[0007] Optionally, the thickness of the edge region of the drive backplate is within a preset perforation thickness range, and the thickness of the center region of the drive backplate is greater than the preset perforation thickness range.

[0008] Optionally, on the second side of the drive backplate, the sidewall of the central area is an inclined surface.

[0009] Optionally, the thickness of the edge area and the thickness of the center area of ​​the drive backplate are both within a preset perforation thickness range.

[0010] Optionally, some of the lead through holes are located in the edge region of the drive backplate.

[0011] Optionally, the material of the lead plate includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

[0012] Optionally, the material of the connecting wire includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0013] Optionally, each of the connecting lines includes a first end and a second end, the first end of the connecting line is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is connected to the second end of the corresponding connecting line.

[0014] Optionally, the conductive bonding structure includes: solder balls.

[0015] Optionally, it may also include an insulating layer located on the second side of the drive backplate, the insulating layer covering each of the connecting lines.

[0016] Optionally, it also includes: a glass plate located on a first side of the drive backplate, the glass plate covering the microdisplay chip and several of the lead plates.

[0017] Optionally, it also includes a connector located on the second side of the drive backplate, the connector being electrically connected to each of the conductive bonding structures.

[0018] Optionally, the lead via is formed using a through-silicon via (TSV) process.

[0019] Accordingly, the present invention also provides a method for forming a micro-display panel, comprising: providing a driving backplate having a first side and a second side opposite to each other; forming a micro-display chip and a plurality of lead plates on the first side of the driving backplate, wherein the micro-display chip and the plurality of lead plates are electrically connected to the driving backplate respectively; performing a perforation process from the second side of the driving backplate to the first side of the driving backplate to form a plurality of lead through holes in the driving backplate, wherein each lead through hole exposes a corresponding lead plate; forming a plurality of connecting lines in each lead through hole and on the second side of the driving backplate, wherein each connecting line is electrically connected to a corresponding lead plate; and forming a plurality of conductive bonding structures on the second side of the driving backplate, wherein each conductive bonding structure is connected to a corresponding connecting line respectively.

[0020] Optionally, the driving backplane includes: a central region and an edge region surrounding the central region; a plurality of lead plates are formed in the edge region of the driving backplane, and the microdisplay chip is formed in the central region of the driving backplane.

[0021] Optionally, the thickness of both the edge region and the center region of the drive backplate is greater than the preset perforation thickness range.

[0022] Optionally, before performing the perforation process, the method further includes: thinning the edge region of the drive back plate from the second side of the drive back plate towards the first side of the drive back plate until the thickness of the edge region of the drive back plate reaches the preset perforation thickness range.

[0023] Optionally, after the thinning process, on the second side of the drive back plate, the sidewall of the central area is an inclined surface.

[0024] Optionally, the thickness of the edge area and the thickness of the center area of ​​the drive backplate are both within a preset perforation thickness range.

[0025] Optionally, the perforation process includes: perforating the edge region of the drive backplate from the second side to the first side of the drive backplate, forming a plurality of lead wire through holes in the edge region of the drive backplate.

[0026] Optionally, the perforation process includes through-silicon via (TSV) technology, which includes one or more combinations of laser perforation and wet perforation technologies.

[0027] Optionally, the process for forming several of the connecting lines includes one or more combinations of magnetron sputtering coating, electron beam evaporation, and electroplating.

[0028] Optionally, each of the connecting lines includes a first end and a second end, the first end of the connecting line is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is connected to the second end of the corresponding connecting line.

[0029] Optionally, the conductive bonding structure includes: solder balls.

[0030] Optionally, after forming the plurality of the connecting lines, the method further includes forming an insulating layer on a second side of the drive backplate, the insulating layer covering each of the connecting lines.

[0031] Optionally, after forming the microdisplay chip and the plurality of lead plates, the method further includes attaching a glass plate to a first side of the driving backplate, the glass plate covering the microdisplay chip and the plurality of lead plates.

[0032] Optionally, it further includes forming a connector on the second side of the drive backplate, the connector being electrically connected to each of the conductive bonding structures.

[0033] Accordingly, the present invention also provides a near-eye display device, comprising: a micro-display panel as described in any of the above technical solutions.

[0034] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0035] In the micro-display panel of the present invention, a plurality of lead through holes are formed in the driving back plate. By forming a plurality of connecting lines in each lead through hole and on the second side of the driving back plate, the lead path of the micro-display panel is transferred to the second side of the driving back plate. If the micro-display panel also has other device structures (such as connectors) that can be fixed on the second side of the driving back plate, it can not only meet the requirements of circuit design, but also effectively reduce the overall size of the micro-display panel.

[0036] Furthermore, it also includes an insulating layer located on the second side of the drive backplane, which covers each connecting wire. The insulating layer can cover and protect the exposed connecting wires.

[0037] Furthermore, it also includes a glass plate located on the first side of the drive backplane, the glass plate covering the microdisplay chip and several lead plates. The glass plate can cover and protect the microdisplay chip and several lead plates.

[0038] In the method for forming a micro-display panel according to the technical solution of the present invention, a plurality of lead through holes are formed in a driving back plate. By forming a plurality of connecting lines in each lead through hole and on the second side of the driving back plate, the lead path of the micro-display panel is transferred to the second side of the driving back plate. If the micro-display panel also has other device structures (such as connectors) that can be fixed on the second side of the driving back plate, it can not only meet the requirements of circuit design, but also effectively reduce the overall size of the micro-display panel.

[0039] Furthermore, after forming several connecting lines, the process also includes forming an insulating layer on the second side of the drive backplate, the insulating layer covering each connecting line. The insulating layer can cover and protect the exposed connecting lines.

[0040] Furthermore, after forming the microdisplay chip and several lead plates, the process also includes attaching a glass plate to the first side of the driving backplane, the glass plate covering the microdisplay chip and several lead plates. The glass plate provides coverage and protection for the microdisplay chip and several lead plates. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the structure of a Micro LED microdisplay panel;

[0042] Figures 2 to 11 This is a schematic diagram of the steps in a method for forming a micro-display panel according to an embodiment of the present invention;

[0043] Figure 12 This is a schematic diagram of the structure of a micro-display panel according to another embodiment of the present invention. Detailed Implementation

[0044] As described in the background section, existing Micro LED microdisplay panels still have many problems. These will be explained in detail below with reference to the accompanying drawings.

[0045] Figure 1 This is a schematic diagram of the structure of a Micro LED microdisplay panel.

[0046] Please refer to Figure 1 A Micro LED microdisplay panel includes: a microdisplay chip 10, a driving backplate (not shown), an outer frame 11, an FPC flexible flat cable, and a connector 13. The microdisplay chip 10 is electrically connected to the driving backplate. The outer frame 11 surrounds the driving backplate and is disposed around the microdisplay chip 10. One end of the FPC flexible flat cable is electrically connected to the microdisplay chip 10, and the other end of the FPC flexible flat cable is electrically connected to the connector 13. The connector 13 is adapted to be electrically connected to external compatible devices.

[0047] The current micro-display panels use either chip-on-board (COB) or molding-on-board (MOC) packaging technology. Both packaging methods leave a section of FPC flexible flat cable and connector 13, which prevents the overall size of the micro-display panel from being further reduced.

[0048] Based on this, the present invention provides a micro-display panel and its forming method, and a near-eye display device. A plurality of lead through holes are formed in a driving back plate. By forming a plurality of connecting lines in each lead through hole and on the second side of the driving back plate, the lead path of the micro-display panel is transferred to the second side of the driving back plate. If the micro-display panel also has other device structures (such as connectors) that can be fixed on the second side of the driving back plate, it can not only meet the requirements of circuit design, but also effectively reduce the overall size of the micro-display panel.

[0049] To make the above-mentioned objectives, features, and advantages of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] In the description of this invention, it should be understood that the terms "upper," "lower," "top surface," "bottom surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order, or relative importance between these entities or operations.

[0051] Figures 2 to 11 This is a schematic diagram of the steps in a method for forming a micro-display panel according to an embodiment of the present invention.

[0052] Please refer to Figure 2 and Figure 3 , Figure 3 yes Figure 2 A cross-sectional view along line AA shows a drive backplate 200 having a first side 200a and a second side 200b opposite to each other.

[0053] In some embodiments, the driving backplane 200 may be an IC (Integrated Circuit) substrate or a TFT (Thin Film Transistor) substrate.

[0054] In this embodiment, the driving backplane 200 includes a central region I and an edge region II surrounding the central region I. The device structures and circuit structures in the driving backplane 200 are disposed in the central region I, while the edge region II of the driving backplane 200 contains no device structures or circuit structures.

[0055] In this embodiment, the thickness of the edge region II and the thickness of the center region I of the drive back plate 200 are both greater than the preset perforation thickness range.

[0056] It should be noted that in this embodiment, the first side 200a of the drive back plate 200 is the front side of the drive back plate 200, and the second side 200b of the drive back plate 200 is the back side of the drive back plate 200.

[0057] Please refer to Figure 4 and Figure 5 , Figure 5 yes Figure 4 A cross-sectional view along line BB shows that a microdisplay chip 201 and several lead plates 202 are formed on the first side 200a of the drive backplate 200. The microdisplay chip 201 and several lead plates 202 are electrically connected to the drive backplate 200.

[0058] In this embodiment, a plurality of lead plates 202 are formed in the edge region II of the driving backplate 200, and the micro display chip 201 is formed in the center region I of the driving backplate 200.

[0059] In some embodiments, the material of the lead plate 202 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

[0060] Please refer to Figure 6 , Figure 6 and Figure 5 With the same viewing direction, a glass plate 203 is attached to the first side 200a of the drive backplate 200, and the glass plate 203 covers the micro display chip 201 and several lead plates 202.

[0061] In this embodiment, the method of attaching a glass plate 203 to the first side 200a of the driving backplate 200 includes: applying an adhesive layer 204 to the first side 200a of the driving backplate 200; and attaching the glass plate 203 to the adhesive layer 204. The glass plate 203 can cover and protect the microdisplay chip 201 and a plurality of leadboards 202.

[0062] Please refer to Figure 7 The edge region II of the drive back plate 200 is thinned from the second side 200b of the drive back plate 200 to the first side 200a of the drive back plate 200 until the thickness of the edge region II of the drive back plate 200 reaches the preset perforation thickness range.

[0063] In this embodiment, since the thickness of the edge area II and the center area I of the drive back plate 200 are both greater than the preset perforation thickness, the subsequent perforation process cannot be completed. Therefore, it is necessary to first thin the area to be perforated so that the thickness of the perforation area reaches the preset perforation thickness.

[0064] In this embodiment, after the thinning process, the sidewall of the central region I on the second side 200b of the drive back plate 200 is an inclined surface. This is because during the thinning process of the edge region II, the edge of the central region I is also damaged to a certain extent, which results in the sidewall of the central region I having an inclined surface shape.

[0065] Please refer to Figure 8 A perforation process is performed from the second side 200b of the drive backplate 200 to the first side 200a of the drive backplate 200 to form a plurality of lead wire through holes 205 in the drive backplate 200, and each lead wire through hole 205 exposes the corresponding lead wire plate 202.

[0066] In this embodiment, the perforation process includes: perforating the edge region II of the driving back plate 200 from the second side 200b of the driving back plate 200 to the first side 200a of the driving back plate 200, thereby forming a plurality of lead wire through holes 205 in the edge region II of the driving back plate 200.

[0067] In some embodiments, the perforation process includes through-silicon via (TSV) technology, which includes one or more combinations of laser perforation and wet perforation technologies.

[0068] It should be noted that in this embodiment, the fact that each lead through hole 205 exposes the corresponding lead plate 202 means that the number of lead through holes 205 is the same as the number of lead plates 202, and each lead through hole 205 exposes one lead plate 202.

[0069] In this embodiment, the diameter of the lead wire through hole 205 is less than 0.5 mm, and the depth of the lead wire through hole 205 is less than 0.75 mm.

[0070] Please refer to Figure 9 A plurality of connecting lines 206 are formed in each lead through hole 205 and on the second side 200b of the drive back plate 200, and each connecting line 206 is electrically connected to the corresponding lead plate 202.

[0071] In some embodiments, the process of forming a plurality of connection lines 206 includes one or more combinations of magnetron sputtering coating, electron beam evaporation, and electroplating.

[0072] In some embodiments, the material of the connecting wire 206 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0073] In this embodiment, each connecting line 206 includes a first end (not shown) and a second end (not shown), and the first end of the connecting line 206 is electrically connected to the corresponding lead plate 202.

[0074] It should be noted that, in this embodiment, the electrical connection between each connecting line 206 and the corresponding lead plate 202 means that the number of connecting lines 206 is the same as the number of lead plates 202, and each connecting line 206 is connected to one lead plate 202.

[0075] Please refer to Figure 10 After forming a number of connecting lines 206, an insulating layer 207 is formed on the second side 200b of the drive backplate 200, and the insulating layer 207 covers each connecting line 206.

[0076] In this embodiment, the insulating layer 207 can cover and protect the exposed connecting wire 206.

[0077] Please refer to Figure 11 A plurality of conductive bonding structures 209 are formed on the second side 200b of the drive backplate 200, and each conductive bonding structure 209 is connected to a corresponding connecting line 206.

[0078] In this embodiment, each conductive bonding structure 209 is connected to the second end of the corresponding connecting line 206.

[0079] In this embodiment, the conductive bonding structure 209 uses solder balls.

[0080] In this embodiment, a connector 208 is formed on the second side 200b of the drive backplate 200, and the connector 208 is electrically connected to each conductive bonding structure 209. The connector 208 is used for electrical connection to external compatible devices.

[0081] In other embodiments, a connector may not be required, and the microdisplay panel with conductive bonding structure can be directly attached to an external compatible device to achieve electrical connection.

[0082] A plurality of lead through holes 205 are formed in the driving back plate 200. By forming a plurality of connecting lines 206 in each lead through hole 205 and the second side 200b of the driving back plate 200, the lead path of the micro display panel is transferred to the second side 200b of the driving back plate 200. If the micro display panel has other device structures (such as connector 208), they can be fixed on the second side 200b of the driving back plate 200. This can not only meet the requirements of circuit design, but also effectively reduce the overall size of the micro display panel.

[0083] In this embodiment, the micro-display panel is a Micro LED micro-display panel.

[0084] The aforementioned microdisplay panel has a very small volume, with length and width dimensions ranging from 500 μm to 50,000 μm. The light-emitting area of ​​the microdisplay panel is extremely small, for example, 1 mm × 1 mm, 2.64 mm × 2.02 mm, or 3 mm × 5 mm. The light-emitting area of ​​the microdisplay panel comprises multiple micro-LED pixels arranged in an array, with specific pixel arrangements including 320 × 240, 640 × 480, 1600 × 1200, 1920 × 1080, and 2560 × 1440. The size of a single micro-LED pixel is between 100 nm and 100 micrometers.

[0085] In some implementations, the size of a single microLED pixel is between 150 nm and 15 micrometers.

[0086] In some implementations, the size of a single micro-LED pixel can be less than 10 micrometers.

[0087] A driving backplate 200 is disposed on the back of the micro-LED pixel array. The driving backplate 200 is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplate 200 can acquire signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not emit light. For example, the driving backplate 200 of the micro-display panel described above integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscale levels. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently, or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation of this application.

[0088] Accordingly, this invention also provides a micro-display panel, please refer to the following embodiments. Figure 11 The backplane includes: a driving backplane 200 having a first side 200a and a second side 200b; a microdisplay chip 201 and a plurality of lead plates 202 located on the first side 200a of the driving backplane 200, the microdisplay chip 201 and the plurality of lead plates 202 being electrically connected to the driving backplane 200; and a plurality of lead through holes 205 located within the driving backplane 200, each lead through hole 205 extending from the second side 200b of the driving backplane 200 toward the driving backplane. The first side 200a of the backplate 200 extends, and each lead through hole 205 exposes a corresponding lead plate 202; a plurality of connecting lines 206 are located in each lead through hole 205 and the second side 200b of the driving backplate 200, and each connecting line 206 is electrically connected to the corresponding lead plate 202; a plurality of conductive bonding structures 209 are located on the second side 200b of the driving backplate 200, and each conductive bonding structure 209 is connected to the corresponding connecting line 206.

[0089] A plurality of lead through holes 205 are formed in the driving back plate 200. By forming a plurality of connecting lines 206 in each lead through hole 205 and the second side 200b of the driving back plate 200, the lead path of the micro display panel is transferred to the second side 200b of the driving back plate 200. If the micro display panel has other device structures (such as connector 208), they can be fixed on the second side 200b of the driving back plate 200. This can not only meet the requirements of circuit design, but also effectively reduce the overall size of the micro display panel.

[0090] In this embodiment, the driving backplane 200 includes a central region I and an edge region II surrounding the central region I; a plurality of lead plates 202 are located in the edge region II of the driving backplane 200, and the micro display chip 201 is located in the central region I of the driving backplane 200.

[0091] In this embodiment, the thickness of the edge region II of the drive back plate 200 is within the preset perforation thickness range, and the thickness of the center region I of the drive back plate 200 is greater than the preset perforation thickness range.

[0092] In this embodiment, on the second side 200b of the drive backplate 200, the sidewall of the central region I is an inclined surface.

[0093] In this embodiment, a plurality of lead-through holes 205 are located in the edge region II of the drive backplate 200.

[0094] In some embodiments, the material of the lead plate 202 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

[0095] In some embodiments, the material of the connecting wire 206 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0096] In this embodiment, each connecting line 206 includes a first end and a second end. The first end of the connecting line 206 is electrically connected to the corresponding lead plate 202, and each conductive bonding structure 206 is connected to the second end of the corresponding connecting line 206.

[0097] In this embodiment, the conductive bonding structure 209 uses solder balls.

[0098] In this embodiment, an insulating layer 207 is also included, located on the second side 200b of the drive backplate 200, which covers each connecting wire 206. The insulating layer 207 can cover and protect the exposed connecting wires 206.

[0099] In this embodiment, the system further includes a glass plate 203 located on the first side 200a of the driving backplate 200, which covers the microdisplay chip 201 and several lead plates 202. The glass plate 203 can cover and protect the microdisplay chip 201 and the several lead plates 202.

[0100] In this embodiment, a connector 208 is located on the second side 200b of the drive backplate 200, and the connector 208 is electrically connected to each conductive bonding structure 209. The connector 208 is used to electrically connect to external compatible devices.

[0101] In other embodiments, a connector may not be required, and the microdisplay panel with conductive bonding structure can be directly attached to an external compatible device to achieve electrical connection.

[0102] In this embodiment, the lead via 205 is formed using a through-silicon via (TSV) process.

[0103] Figure 12 This is a schematic diagram of the structure of a micro-display panel according to another embodiment of the present invention.

[0104] This embodiment continues to describe the method of forming the micro-display panel based on the above embodiments. The rest is the same as the above embodiments, except that the thickness of the edge region II and the thickness of the center region I of the driving backplate 200 are both within the preset perforation thickness range. A detailed description will follow.

[0105] Please refer to Figure 12 The thickness of the edge area II and the thickness of the center area I of the drive back plate 200 are both within the preset perforation thickness range.

[0106] In this embodiment, since the thickness of the edge region II and the thickness of the center region I of the drive back plate 200 are both within the preset perforation thickness range, there is no need to thin the drive back plate 200 before perforation.

[0107] In this embodiment, the structure and fabrication process of the remaining devices are the same as in the embodiments described above. For details, please refer to [link / reference needed]. Figures 2 to 11 The relevant explanations will not be repeated here.

[0108] Accordingly, this invention also provides a micro-display panel, please refer to the following embodiments. Figure 12 The rest of the structure is the same as the micro display panel described in the above embodiment, except that the thickness of the edge area II and the thickness of the center area I of the driving back plate 200 are both within the preset perforation thickness range.

[0109] Accordingly, the present invention also provides a near-eye display device, comprising: a micro-display panel as described in any of the above embodiments.

[0110] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A microdisplay panel, characterized by, The application relates to a driving backboard, comprising: a driving backboard having opposite first and second sides; a micro display chip and a plurality of lead plates on the first side of the driving backboard, the micro display chip and the plurality of lead plates being electrically connected to the driving backboard respectively; a plurality of lead through holes in the driving backboard, each of the lead through holes extending from the second side of the driving backboard to the first side of the driving backboard, and each of the lead through holes exposing a corresponding lead plate; a plurality of connecting lines in each of the lead through holes and on the second side of the driving backboard, each of the connecting lines being electrically connected to a corresponding lead plate; a plurality of conductive bonding structures on the second side of the driving backboard, each of the conductive bonding structures being connected to a corresponding connecting line; wherein the driving backboard comprises a central region and an edge region surrounding the central region; the plurality of lead plates are located in the edge region of the driving backboard, and the micro display chip is located in the central region of the driving backboard; the thickness of the edge region of the driving backboard is within a preset through hole thickness range, and the thickness of the central region of the driving backboard is greater than the preset through hole thickness range; on the second side of the driving backboard, the sidewall of the central region is an inclined surface.

2. The microdisplay panel of claim 1, wherein, the plurality of lead through holes are located in the edge region of the driving backboard.

3. The microdisplay panel of claim 1, wherein, the material of the lead plate comprises one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

4. The microdisplay panel of claim 1, wherein, the material of the connecting line comprises one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

5. The microdisplay panel of claim 1, wherein, each of the connecting lines comprises opposite first and second ends, the first end of the connecting line being electrically connected to a corresponding lead plate, and each of the conductive bonding structures being connected to the second end of a corresponding connecting line.

6. The microdisplay panel of claim 1, wherein, the conductive bonding structure comprises a solder ball.

7. The microdisplay panel of claim 1, wherein, The application further comprises: an insulating layer on the second side of the driving backboard, the insulating layer covering each of the connecting lines.

8. The microdisplay panel of claim 1, wherein, The application further comprises: a glass plate on the first side of the driving backboard, the glass plate covering the micro display chip and the plurality of lead plates.

9. The microdisplay panel of claim 1, wherein, The application further comprises: a connector on the second side of the driving backboard, the connector being electrically connected to each of the conductive bonding structures respectively.

10. The microdisplay panel of claim 1, wherein, the lead through hole is formed by a through silicon via process.

11. A method of forming a microdisplay panel, comprising: The application relates to a driving backboard, comprising: providing a driving backboard having opposite first and second sides; forming a micro display chip and a plurality of lead plates on the first side of the driving backboard, the micro display chip and the plurality of lead plates being electrically connected to the driving backboard respectively; performing a through hole treatment from the second side of the driving backboard to the first side of the driving backboard to form a plurality of lead through holes in the driving backboard, each of the lead through holes exposing a corresponding lead plate; forming a plurality of connecting lines in each of the lead through holes and on the second side of the driving backboard, each of the connecting lines being electrically connected to a corresponding lead plate; forming a plurality of conductive bonding structures on the second side of the driving backboard, each of the conductive bonding structures being connected to a corresponding connecting line; wherein the driving backboard comprises a central region and an edge region surrounding the central region; The plurality of lead plates are located at edge regions of the drive backplane, and the micro display chip is located at a central region of the drive backplane; a thickness of the edge regions of the drive backplane is within a preset through-hole thickness range, and a thickness of the central region of the drive backplane is greater than the preset through-hole thickness range. A sidewall of the central region on the second side of the drive backplane is an inclined surface.

12. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The method further comprises, before the through-hole processing, thinning the edge regions of the drive backplane from the second side of the drive backplane to the first side of the drive backplane until the thickness of the edge regions of the drive backplane reaches the preset through-hole thickness range.

13. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The method of the through-hole processing comprises, from the second side of the drive backplane to the first side of the drive backplane, perforating the edge regions of the drive backplane to form the plurality of lead through-holes in the edge regions of the drive backplane.

14. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The through-hole processing comprises a through-hole processing technology, and the through-hole processing technology comprises one or more combinations of a laser perforation technology and a wet perforation technology.

15. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The method of forming the plurality of connection lines comprises one or more combinations of a magnetron sputtering coating technology, an electron beam evaporation technology, and an electroplating technology.

16. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: Each of the connection lines comprises opposite first and second ends, the first end of the connection line is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is connected to the second end of the corresponding connection line.

17. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The conductive bonding structure comprises a solder ball.

18. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The method further comprises, after forming the plurality of connection lines, forming an insulating layer on the second side of the drive backplane, the insulating layer covering each of the connection lines. ​ 19. The method of claim 11, wherein the microdisplay panel is formed by a process comprising: The method further comprises, after forming the micro display chip and the plurality of lead plates, attaching a glass plate on the first side of the drive backplane, the glass plate covering the micro display chip and the plurality of lead plates.

20. The method of claim 11, wherein: The method further comprises: forming a connector on the second side of the drive backplane, the connector being electrically connected to each of the conductive bonding structures.

21. A near-eye display device, comprising: The micro display panel comprises: The micro display panel according to any one of claims 1 to 10.

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