Adsorptive pad with high adsorption for polishing blind hole of TFT and preparation process thereof

Abstract

The application discloses a high-adsorption adsorption pad for TFT blind hole polishing and a preparation process thereof, and belongs to the technical field of adsorption pads. The high-adsorption adsorption pad for TFT blind hole polishing comprises, from bottom to top, a substrate layer, a connecting layer and an adsorption layer which are sequentially connected, wherein the adsorption layer comprises a compact layer, a first foaming layer, a first netting layer, a second foaming layer, a second netting layer and a third foaming layer, and the first netting layer and the second netting layer are both made of a net-shaped structure of a nitrogenated graphite material. The application solves the problem of large local deformation of the existing adsorption pad. The high-adsorption adsorption pad for TFT blind hole polishing and the preparation process thereof are provided, the overall hardness of the first netting layer and the second netting layer is improved, so that when the TFT blind hole is polished, the local position of the adsorption pad is pressed, and the local deformation of the adsorption pad is not caused, and the adsorbed TFT screen is protected from falling off.

Description

Technical Field

[0001] The present invention relates to the technical field of adsorption pads, in particular to a high-adsorption adsorption pad for polishing TFT blind holes and a preparation process thereof. Background Art

[0002] Before grinding the TFT display screen, it is necessary to place the TFT display screen on the adsorption pad surface of the grinding machine table, place the TFT display screen into the grinding device, and grind the TFT display screen.

[0003] Chinese patent publication number CN106903596B discloses an adsorption pad for TFT thinning and polishing. This pad increases the adsorption force and addresses the short service life issue of the prior art. However, after the TFT blind vias are created, they require individual grinding, specifically localized grinding of the blind vias. During uniform grinding, the TFT display is unevenly compressed, resulting in high compression rates in certain areas of the pad. This localized grinding can push against the pad, causing severe concavity and overall poor overall strength. This can easily cause the TFT display to fall off the pad or shift position, leading to grinding accidents. Summary of the Invention

[0004] The purpose of the present invention is to provide a highly adsorbent adsorption pad for polishing TFT blind holes and a preparation process thereof. By setting a first meshing layer and a second meshing layer support layer, when polishing the TFT blind hole, pressure is applied to a local position of the adsorption pad without causing large local deformation of the adsorption pad, thereby protecting the adsorbed TFT screen from falling off, and solving the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A highly adsorbent adsorption pad for TFT blind hole polishing includes a base layer, a connecting layer, and an adsorption layer connected in sequence from bottom to top. The adsorption layer includes a dense layer, a first foaming layer, a first reticulation layer, a second foaming layer, a second reticulation layer, and a third foaming layer. The first reticulation layer and the second reticulation layer are both made of nitrided graphite material into a mesh structure.

[0007] Preferably, the dense layer, the first foaming layer, the second foaming layer and the third foaming layer are connected in sequence from top to bottom, the first reticulation layer is placed at the connection between the first foaming layer and the second foaming layer, the second reticulation layer is placed at the connection between the second foaming layer and the third foaming layer, the first reticulation layer is a reticulated hole structure formed by 200um circular or hexagonal micron holes, and the second reticulation layer is a reticulated hole structure formed by 250um circular or hexagonal micron holes.

[0008] Preferably, the preparation method of the first netting layer and the second netting layer is as follows:

[0009] Graphite powder, alumina, zirconia and epoxy resin are mixed and pressed into the desired shape and size in a forming machine. The graphite powder is pressed into a block product, i.e., a green body. The block green body is sliced ​​and punched to form a network green body structure, which is then calcined in a high-temperature furnace to produce a graphite network structure.

[0010] Prepare a silicon nitride solution, preheat the silicon nitride solution, and then evenly spray it onto the heated graphite network structure for 4-5 times. The silicon nitride solution reacts with the graphite, and the solution is cooled to room temperature to form a first network layer and a second network layer.

[0011] Preferably, the ratio of the graphite powder, alumina, zirconium oxide and epoxy resin material is 1:0.2:0.1:1.

[0012] Preferably, the preparation method of the silicon nitride solution is as follows: silicon nitride powder is mixed with deionized water, then aminosilane is added, and stirred evenly to obtain a silicon nitride solution, the average particle size of the silicon nitride powder is 0.1-0.5um, the mass ratio of silicon nitride powder to deionized water is 1:3-5, and the preheating temperature of the silicon nitride solution is 60℃-75℃.

[0013] Preferably, the volume ratio of the deionized water to the aminosilane is 60:1, and the concentration of the aminosilane is 2 wt % to 6 wt %.

[0014] Preferably, the dense layer, the first foaming layer, the second foaming layer and the third foaming layer are all made of fluorine-containing polyurethane resin materials, wherein the first foaming layer and the second foaming layer are both teardrop-shaped porous structures, the teardrop-shaped pores of the second foaming layer are larger than the teardrop-shaped pores of the first foaming layer, and the third foaming layer is an elliptical porous structure with an average pore diameter of 200-400um, and a protective film is provided on the surface of the dense layer.

[0015] Preferably, the connection layer is prepared from one of TPU hot melt adhesive, EVA hot melt adhesive, PO hot melt adhesive, PU hot melt adhesive, epoxy structural adhesive or polyurethane glue.

[0016] Preferably, the base layer includes release paper, double-sided tape and PET film arranged in sequence from bottom to top.

[0017] Another technical problem to be solved by the present invention is to provide a preparation process of a highly absorbent adsorption pad for TFT blind hole polishing, comprising the following steps:

[0018] S1: preparing a first netting layer and a second netting layer, and coating the upper and lower surfaces of the first netting layer with a fluorine-containing polyurethane resin material, and solidifying them in a coagulation bath containing an organic solvent and water to obtain a first foaming layer and a second foaming layer having a multi-layer porous structure formed therein, and then coating the surfaces of the first foaming layer and the second foaming layer with a fluorine-containing polyurethane resin material, and solidifying them in a coagulation bath containing an organic solvent and water to form a dense layer and a third foaming layer, thereby preparing an adsorption layer structure;

[0019] S2: Paste the PET film to the bottom of the adsorption layer through the connecting layer, place the adsorption layer in a roller hot press, and hot press the top of the adsorption layer, place the hot-pressed adsorption layer in a heating device and heat it for 10-15 seconds, heat the protective film, and hot press the protective film for 20-40 seconds, and hot press the protective film to the top of the fluorine-containing polyurethane porous membrane, cut it into a certain size, paste the release paper on the lower surface of the PET film with double-sided tape, cut the edges, and remove the excess part to obtain an adsorption pad.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention proposes a highly adsorbent adsorption pad for polishing TFT blind holes and a preparation process thereof. A first network layer and a second network layer made of nitrided graphite material are arranged between the first foaming layer, the second foaming layer and the third foaming layer. Silicon nitride solution reacts with carbon atoms on the graphite surface to form a high-hardness protective layer on the surface of the graphite network structure, thereby enhancing the strength of the graphite network structure and improving the overall hardness of the first network layer and the second network layer. Therefore, when polishing the TFT blind hole, applying pressure to a local position of the adsorption pad will not cause large local deformation of the adsorption pad, thereby protecting the adsorbed TFT screen from falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic structural diagram of a highly absorbent adsorption pad for polishing TFT blind holes according to the present invention.

[0023] In the figure: 1, base layer; 2, connecting layer; 3, adsorption layer; 31, dense layer; 32, first foaming layer; 33, first reticulating layer; 34, second foaming layer; 35, second reticulating layer; 36, third foaming layer. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] In order to solve the problem that the existing adsorption pad has a high local compression rate, the local grinding pushes the adsorption pad, resulting in severe local depression, low overall strength, and the TFT display screen is prone to fall off or shift position from the adsorption pad, causing grinding accidents, please refer to Figure 1 , this embodiment provides the following technical solutions:

[0026] A highly adsorbent adsorption pad for polishing TFT blind holes includes a base layer 1, a connecting layer 2, and an adsorption layer 3 connected in sequence from bottom to top. The adsorption layer 3 includes a dense layer 31, a first foaming layer 32, a first reticulation layer 33, a second foaming layer 34, a second reticulation layer 35, and a third foaming layer 36. The first reticulation layer 33 and the second reticulation layer 35 are both made of a nitrided graphite material to form a mesh structure.

[0027] In this embodiment, the dense layer 31, the first foaming layer 32, the second foaming layer 34 and the third foaming layer 36 are connected in sequence from top to bottom, the first reticulation layer 33 is placed at the connection between the first foaming layer 32 and the second foaming layer 34, and the bubbles of the first foaming layer 32 and the second foaming layer 34 pass through the mesh of the first reticulation layer 33 in an interlaced manner, the second reticulation layer 35 is placed at the connection between the second foaming layer 34 and the third foaming layer 36, and the bubbles of the second foaming layer 34 and the third foaming layer 36 pass through the mesh of the second reticulation layer 35, and the first reticulation layer 33 and the second reticulation layer 35 are placed at the connection between the first foaming layer 32, the second foaming layer 34 and the third foaming layer The junction of the third foam layer 36 forms a certain supporting force. During polishing, local pressure acts on the first mesh layer 33, causing the first mesh layer 33 to sink as a whole, and acts on the second foam layer 34 and the third foam layer 36 as a whole. The first mesh layer 33 shares the local pressure, and the second mesh layer 35 plays a role in further sharing the pressure to prevent the second foam layer 34 and the third foam layer 36 from local depression. The first mesh layer 33 is a mesh hole structure formed by 200um circular or hexagonal micron holes, and the second mesh layer 35 is a mesh hole structure formed by 250um circular or hexagonal micron holes.

[0028] In this embodiment, the dense layer 31, the first foaming layer 32, the second foaming layer 34 and the third foaming layer 36 are all made of fluorine-containing polyurethane resin material, wherein the first foaming layer 32 and the second foaming layer 34 are both teardrop-shaped porous structures, the teardrop-shaped holes of the second foaming layer 34 are larger than the teardrop-shaped holes of the first foaming layer 32, and the third foaming layer 36 is an elliptical porous structure with an average pore diameter of 200-400um. A protective film is provided on the surface of the dense layer 31.

[0029] In this embodiment, the connection layer 2 is made of a material selected from the group consisting of TPU hot melt adhesive, EVA hot melt adhesive, PO hot melt adhesive, PU hot melt adhesive, epoxy structural adhesive, and polyurethane adhesive.

[0030] The base layer 1 includes release paper, double-sided tape and PET film arranged in sequence from bottom to top.

[0031] Example 1:

[0032] Graphite powder, alumina, zirconia and epoxy resin are mixed in a ratio of 1:0.2:0.1:1. The mixed materials are pressed into the desired shape and size in a forming machine. The graphite powder is pressed into a block product, i.e., a green body. The block green body is sliced ​​and punched to form a network green body structure. The green body is then sintered in a high-temperature furnace to produce a graphite network structure.

[0033] In this embodiment, a silicon nitride solution is prepared, and after preheating, the silicon nitride solution is evenly sprayed onto the heated graphite network structure. The heating temperature of the graphite network structure is 700°C, and the solution is sprayed four times. The silicon nitride solution reacts with the graphite. The silicon nitride solution reacts with the carbon atoms on the surface of the graphite. The silicon atoms in the silicon nitride form bonds with the carbon atoms on the graphite, replacing the carbon atoms to form short chains or short sheets of silicon nitride, and then gradually forming larger fragments of silicon nitride, and finally forming a silicon nitride layer, forming a protective layer with high hardness on the surface of the graphite network structure to enhance the strength of the graphite network structure. Spraying in batches can improve the uniformity of the distribution of the silicon nitride layer. After cooling to room temperature, the first network layer 33 and the second network layer 35 are formed.

[0034] In this embodiment, the preparation method of the silicon nitride solution is as follows: silicon nitride powder is mixed with deionized water, and then aminosilane is added and stirred evenly to obtain a silicon nitride solution. The average particle size of the silicon nitride powder is 0.3 μm, the mass ratio of silicon nitride powder to deionized water is 1:3, the preheating temperature of the silicon nitride solution is 60°C, the volume ratio of deionized water to aminosilane is 60:1, and the concentration of aminosilane is 2 wt%.

[0035] In order to better illustrate the preparation process of a highly absorbent adsorption pad for TFT blind hole polishing, this embodiment now proposes a preparation process of a highly absorbent adsorption pad for TFT blind hole polishing, including the following steps:

[0036] Step 1: Prepare the first netting layer 33 and the second netting layer 35, and coat the upper and lower surfaces of the first netting layer 33 with a fluorine-containing polyurethane resin material, and solidify them in a coagulation bath containing an organic solvent and water to obtain a first foaming layer 32 and a second foaming layer 34 with a multi-layer porous structure formed therein. Then, coat the surfaces of the first foaming layer 32 and the second foaming layer 34 with a fluorine-containing polyurethane resin material, and solidify them in a coagulation bath containing an organic solvent and water to form a dense layer 31 and a third foaming layer 36, thereby forming the adsorption layer 3 structure;

[0037] The preparation method of the fluorine-containing polyurethane resin material is as follows: 8.000 g of a fluorine-containing polyester polyurethane (hardness 95A) with a fluorine content of 1% and 68.775 g of a polyether polyurethane (hardness 85A) are dissolved in 307.100 g of N,N-dimethylformamide (DMF) at room temperature to prepare a polyurethane solution with a concentration of 20%, followed by the addition of 2.400 g of carbon black, 0.200 g of acryloyl diquaternary ammonium salt, 0.005 g of benzoyl peroxide, 0.500 g of a hydrophilic surfactant, 0.120 g of a leveling agent, and 612.9 g of DMF. The solution of the composition is then ground at 50° C. for 1.2 hours, and the resulting solution is degassed to obtain a fluorine-containing polyurethane resin composition with a concentration of 8.00% and a viscosity of 500 centipoise.

[0038] Step 2: Paste the PET film under the adsorption layer 3 through the connecting layer 2, place the adsorption layer 3 in a roller hot press, and hot press the top of the adsorption layer 3, place the hot-pressed adsorption layer 3 in a heating device and heat it for 10 seconds, heat the protective film, and hot press the protective film for 20 seconds, and hot press the protective film to the top of the fluorine-containing polyurethane porous membrane, cut it into a certain size, paste the release paper on the lower surface of the PET film with double-sided tape, cut the edges, and remove the excess part to obtain the adsorption pad.

[0039] Example 2:

[0040] Graphite powder, alumina, zirconia and epoxy resin are mixed in a ratio of 1:0.2:0.1:1. The mixed materials are pressed into the desired shape and size in a forming machine. The graphite powder is pressed into a block product, i.e., a green body. The block green body is sliced ​​and punched to form a network green body structure. The green body is then sintered in a high-temperature furnace to produce a graphite network structure.

[0041] Prepare a silicon nitride solution, preheat the silicon nitride solution, and then evenly spray it onto the heated graphite mesh structure. The heating temperature of the graphite mesh structure is 700°C, and the solution is sprayed five times. The silicon nitride solution reacts with the graphite and is cooled to room temperature to form the first mesh layer 33 and the second mesh layer 35.

[0042] The preparation method of silicon nitride solution is as follows: silicon nitride powder is mixed with deionized water, and then aminosilane is added and stirred evenly to obtain silicon nitride solution. The average particle size of silicon nitride powder is 0.3um, the mass ratio of silicon nitride powder to deionized water is 1:3, the preheating temperature of silicon nitride solution is 60°C, the volume ratio of deionized water to aminosilane is 60:1, and the concentration of aminosilane is 2wt%.

[0043] The adsorption pad was prepared using the same method as in Example 1.

[0044] Example 3:

[0045] Graphite powder, alumina, zirconia and epoxy resin are mixed in a ratio of 1:0.2:0.1:1. The mixed materials are pressed into the desired shape and size in a forming machine. The graphite powder is pressed into a block product, i.e., a green body. The block green body is sliced ​​and punched to form a network green body structure. The green body is then sintered in a high-temperature furnace to produce a graphite network structure.

[0046] Prepare a silicon nitride solution, preheat the silicon nitride solution, and then evenly spray it onto the heated graphite mesh structure. The heating temperature of the graphite mesh structure is 700°C, and the solution is sprayed four times. The silicon nitride solution reacts with the graphite and is cooled to room temperature to form the first mesh layer 33 and the second mesh layer 35.

[0047] The preparation method of silicon nitride solution is as follows: silicon nitride powder is mixed with deionized water, and then aminosilane is added and stirred evenly to obtain silicon nitride solution. The average particle size of silicon nitride powder is 0.3um, the mass ratio of silicon nitride powder to deionized water is 1:3, the preheating temperature of silicon nitride solution is 60°C, the volume ratio of deionized water to aminosilane is 60:1, and the concentration of aminosilane is 6wt%.

[0048] The adsorption pad was prepared using the same method as in Example 1.

[0049] Comparative Example 1:

[0050] Graphite powder, alumina, zirconia and epoxy resin material are mixed in a ratio of 1:0.2:0.1:1, and the mixed material is pressed into the desired shape and size in a setting machine. After pressing, the graphite powder becomes a block product, i.e., a green body. The block green body is sliced ​​and punched to form a network green body structure, and then sintered in a high-temperature furnace to produce a graphite network structure, which is the first network layer 33 and the second network layer 35. Fluorine-containing polyurethane resin material is coated on the upper and lower surfaces of the first network layer 33, and solidified in a coagulation bath containing an organic solvent and water to obtain a first foaming layer 32 and a second foaming layer 34 with a multi-layer porous structure formed therein. Fluorine-containing polyurethane resin material is then coated on the surfaces of the first foaming layer 32 and the second foaming layer 34, and solidified in a coagulation bath containing an organic solvent and water to form a dense layer 31 and a third foaming layer 36, thereby forming an adsorption layer 3 structure. The remaining steps are the same as in Example 1. In this comparative example, silicon nitride solution is not used to nitride the graphite network structure.

[0051] Comparative Example 2:

[0052] In this comparative example, the first netting layer 33 and the second netting layer 35 are not provided, and other preparation methods are the same as those in Example 1.

[0053] The adsorption pads prepared in the above examples and comparative examples were tested for performance, and the following data were obtained:

[0054] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Thickness (mm) 1.4 1.4 1.4 1.4 1.4 Adsorption rate (N) 12 12 12 12 12 Overall compression ratio (%) 41 40 40 45 51 Local compression rate (%) 15 13 12 29 35

[0055] The overall compression rate is the compression rate obtained by applying force to the entire adsorption pad, and the local compression rate is the compression rate obtained by applying pressure to a local area of ​​the adsorption pad, where the local area is the area of ​​the blind hole.

[0056] It can be concluded from the above table that the overall compression rate of the adsorption pads obtained in Examples 1 to 3 is about 40%, and the local compression rate is much lower than the overall compression rate, indicating that when local pressure is applied to the adsorption pad, the local deformation of the adsorption pad will not be too large, thereby ensuring that the firmness of the adsorption remains unchanged. However, in the comparative example, the overall compression rate and the local compression rate are higher than those in the examples to varying degrees. The graphite material in comparative example 1 that has not been nitrided has an overall hardness that is not as good as the graphite material after nitriding. Therefore, its local compression rate is higher. In comparative example 2, without the support of the first meshing layer 33 and the second meshing layer 35, the overall compression rate of the dense layer 31, the first foaming layer 32, the second foaming layer 34 and the third foaming layer 36 is higher, and the local compression rate is larger.

[0057] In summary, the present invention proposes a highly adsorbent adsorption pad for polishing TFT blind holes and a preparation process thereof. A first network layer 33 and a second network layer 35 made of nitrided graphite material are arranged between the first foaming layer 32, the second foaming layer 34 and the third foaming layer 36. The silicon nitride solution reacts with the carbon atoms on the graphite surface to form a protective layer with high hardness on the surface of the graphite network structure, thereby enhancing the strength of the graphite network structure and improving the overall hardness of the first network layer 33 and the second network layer 35. Therefore, when polishing the TFT blind hole, applying pressure to a local position of the adsorption pad will not cause large local deformation of the adsorption pad, thereby protecting the adsorbed TFT screen from falling off.

[0058] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0059] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. A highly absorbent adsorption pad for TFT blind hole polishing, comprising a base layer (1), a connecting layer (2), and an adsorption layer (3) connected sequentially from bottom to top, characterized in that: The adsorption layer (3) comprises a dense layer (31), a first foaming layer (32), a first reticulation layer (33), a second foaming layer (34), a second reticulation layer (35) and a third foaming layer (36); the first reticulation layer (33) and the second reticulation layer (35) are both made of nitrided graphite material and have a reticulated structure.

2. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 1, characterized in that: The dense layer (31), the first foaming layer (32), the second foaming layer (34) and the third foaming layer (36) are connected in sequence from top to bottom. The first reticulation layer (33) is placed at the connection between the first foaming layer (32) and the second foaming layer (34), and the second reticulation layer (35) is placed at the connection between the second foaming layer (34) and the third foaming layer (36). The first reticulation layer (33) is a reticulated pore structure formed by 200 μm circular or hexagonal micrometer pores, and the second reticulation layer (35) is a reticulated pore structure formed by 250 μm circular or hexagonal micrometer pores.

3. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 2, characterized in that: The preparation method of the first netting layer (33) and the second netting layer (35) is as follows: Graphite powder, alumina, zirconia and epoxy resin are mixed and pressed into the desired shape and size in a forming machine. The graphite powder is pressed into a block product, which is then sliced ​​and punched to form a network green structure. The green structure is then sintered in a high-temperature furnace to produce a graphite network structure. A silicon nitride solution is prepared, preheated, and then evenly sprayed onto the heated graphite mesh structure for 4-5 times. The silicon nitride solution reacts with the graphite and is cooled to room temperature to form a first mesh layer (33) and a second mesh layer (35).

4. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 3, characterized in that: The ratio of the graphite powder, alumina, zirconium oxide and epoxy resin material is 1:0.2:0.1:

1.

5. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 4, characterized in that: The preparation method of the silicon nitride solution is as follows: silicon nitride powder is mixed with deionized water, aminosilane is added, and the mixture is stirred evenly to obtain a silicon nitride solution. The average particle size of the silicon nitride powder is 0.1-0.5 μm, the mass ratio of the silicon nitride powder to the deionized water is 1:3-5, and the preheating temperature of the silicon nitride solution is 60°C-75°C.

6. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 5, characterized in that: The volume ratio of the deionized water to the aminosilane is 60:1, and the concentration of the aminosilane is 2 wt % to 6 wt %.

7. The high-adsorbability adsorption pad for TFT blind hole polishing according to claim 6, characterized in that: The dense layer (31), the first foaming layer (32), the second foaming layer (34) and the third foaming layer (36) are all made of fluorine-containing polyurethane resin material, wherein the first foaming layer (32) and the second foaming layer (34) are both teardrop-shaped porous structures, the teardrop-shaped pores of the second foaming layer (34) are larger than the teardrop-shaped pores of the first foaming layer (32), and the third foaming layer (36) is an elliptical porous structure with an average pore diameter of 200-400 μm. A protective film is provided on the surface of the dense layer (31).

8. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 7, characterized in that: The connection layer (2) is prepared from a material selected from the group consisting of TPU hot melt adhesive, EVA hot melt adhesive, PO hot melt adhesive, PU hot melt adhesive, epoxy structural adhesive, and polyurethane adhesive.

9. The highly absorbent adsorption pad for TFT blind hole polishing according to claim 8, characterized in that: The base layer (1) comprises release paper, double-sided adhesive and PET film arranged in sequence from bottom to top.

10. A process for preparing a highly absorbent adsorption pad for TFT blind hole polishing according to claim 9, characterized in that: The following steps are involved: S1: preparing a first netting layer (33) and a second netting layer (35), and coating the upper and lower surfaces of the first netting layer (33) with a fluorine-containing polyurethane resin material, and solidifying them in a solidification bath containing an organic solvent and water to obtain a first foaming layer (32) and a second foaming layer (34) with a multi-layer porous structure formed therein, and then coating the surfaces of the first foaming layer (32) and the second foaming layer (34) with a fluorine-containing polyurethane resin material, and solidifying them in a solidification bath containing an organic solvent and water to form a dense layer (31) and a third foaming layer (36), thereby manufacturing an adsorption layer (3) structure; S2: The PET film is pasted on the bottom of the adsorption layer (3) through the connecting layer (2), the adsorption layer (3) is placed in a roller hot press, and the top of the adsorption layer (3) is hot pressed, the hot pressed adsorption layer (3) is placed in a heating device and heated for 10-15 seconds, the protective film is heated, and the protective film is hot pressed for 20-40 seconds, and the protective film is hot pressed to the top of the fluorine-containing polyurethane porous membrane, and it is cut into a certain size, and the release paper is pasted on the lower surface of the PET film with double-sided tape, the edges are cut, and the excess part is removed to obtain an adsorption pad.

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