Plating equipment

Abstract

The present invention provides a potential sensor capable of confirming the flatness of the thickness of a plated film with high accuracy in a plating device. The plating device comprises: a plating tank for containing a plating solution; a substrate support for holding a substrate; an anode arranged in the plating tank in a manner opposite to the substrate held by the substrate support; a resistor arranged between the substrate held by the substrate support and the anode, and having a plurality of holes penetrating the anode side and the substrate side; and a potential sensor assembly configured to be arranged between the substrate held by the substrate support and the resistor to measure the potential of the plating solution, the potential sensor assembly comprising: a bottom plate; a plurality of potential sensors arranged in an array on the bottom plate; an electrical wiring formed on the bottom plate for extracting signals from the plurality of potential sensors; and a protective film for protecting the bottom plate and the electrical wiring.

Description

Technical Field

[0001] The present invention relates to a plating device, and more particularly to an improvement of a potential sensor used in a plating device for measuring the thickness of a plated film. Background Art

[0002] The plating device includes: a substrate holder for holding a substrate; a plating tank for containing a plating solution; and an anode arranged in the plating tank in a manner opposite to the substrate held by the substrate holder. In the plating device, an important issue is to improve the flatness of the film thickness of the plating formed on the substrate. In the past, a plating device having a potential sensor for measuring the thickness of the plated film is known (for example, see Patent Document 1).

[0003] Patent Document 1: Japanese Patent No. 7074937 Summary of the invention

[0004] It is desirable to provide a potential sensor that can confirm the flatness of the plating film thickness with high accuracy.

[0005] [Method 1] According to method 1, a plating device is provided, which comprises: a plating tank for containing a plating liquid; a substrate holder for holding a substrate; an anode arranged in the plating tank in a manner opposite to the substrate held by the substrate holder; a resistor arranged between the substrate held by the substrate holder and the anode, and having a plurality of holes penetrating the anode side and the substrate side; and a potential sensor assembly configured to be arranged between the substrate held by the substrate holder and the resistor, and to measure the potential of the plating liquid, the potential sensor assembly comprising: a base plate; a plurality of potential sensors arranged on the base plate; an electrical wiring formed on the base plate and used to extract signals from the plurality of potential sensors; and a protective film that protects the base plate and the electrical wiring.

[0006] [Mode 2] According to Mode 2, based on the plating device of Mode 1, the above-mentioned base plate is composed of a printed circuit board.

[0007] [Mode 3] According to Mode 3, based on the plating device of Mode 1, the above-mentioned base plate is configured as an elongated plate, and the above-mentioned multiple potential sensors are arranged along the length direction of the above-mentioned base plate.

[0008] [Method 4] According to method 4, based on the plating device of method 3, the plating device further includes a rotating mechanism for rotating the substrate holder, and the potential sensor assembly is arranged between the substrate and the resistor in a radial direction along the length direction of the base plate.

[0009] [Mode 5] According to Mode 5, in the plating device according to any one of Modes 1 to 4, the bottom plate includes a plurality of holes formed to be aligned with the plurality of holes of the resistor.

[0010] [Mode 6] According to Mode 6, based on the plating device of Mode 5, the plurality of holes of the bottom plate are respectively arranged at positions overlapping with any one of the plurality of holes of the resistor.

[0011] [Mode 7] According to Mode 7, based on the plating device of Mode 6, the above-mentioned multiple holes of the above-mentioned base plate are arranged to be opposite to all the above-mentioned holes of the above-mentioned resistor body that exist in the portion overlapping with the outer shape of the above-mentioned base plate.

[0012] [Mode 8] According to Mode 8, based on the plating device of Mode 5, the diameter of the above-mentioned hole of the above-mentioned base plate is larger than or equal to the diameter of the above-mentioned hole of the above-mentioned resistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view showing the overall structure of a plating device according to one embodiment.

[0014] Figure 2 It is a plan view showing the overall structure of a plating device according to one embodiment.

[0015] Figure 3 It is a longitudinal sectional view schematically showing the structure of a plating module according to one embodiment.

[0016] Figure 4 It is a plan view showing the structure of a potential sensor assembly according to one embodiment.

[0017] Figure 5 This is a schematic diagram showing the positional relationship between the potential sensor assembly and the substrate during plating.

[0018] Figure 6 It is a plan view showing the structure of a potential sensor assembly according to another embodiment.

[0019] Figure 7 Yes Figure 6 A perspective view of a potential sensor assembly according to an embodiment of the present invention is shown together with a resistor.

[0020] Description of Reference Numerals

[0021] 1000…plating device; 100…loading port; 110…transport robot; 120…aligner; 200…prewetting module; 300…prepreg module; 400…plating module; 500…cleaning module; 600…spin dryer; 700…transport device; 800…control module; 412…inner tank; 420…diaphragm; 422…cathode area; 424…anode area; 426…anode mask; 430…anode; 440…substrate support; 442…lifting mechanism; 448…rotating mechanism; 450…resistor; 451…hole; 452…driving mechanism; 456…paddle; 470…potential sensor assembly; 470A…potential sensor assembly; 472…bottom plate; 473…bottom plate; 474…potential sensor; 476…electrical wiring; 477…solder pad; 478…protective film; 479…hole. DETAILED DESCRIPTION

[0022] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0023] Figure 1 is a perspective view showing the overall structure of a plating device according to one embodiment, Figure 2 is its top view. Figure 1 , 2 As shown, the plating device 1000 includes: a loading port 100, a conveying robot 110, an aligner 120, a pre-wetting module 200, a pre-preg module 300, a plating module 400, a cleaning module 500, a spin dryer 600, a conveying device 700 and a control module 800.

[0024] The loading port 100 is a module for carrying a substrate stored in a box such as a FOUP (not shown) into the plating device 1000, or carrying a substrate out of the plating device 1000 into the box. In the present embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The conveying robot 110 is a robot for conveying substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, and the conveying device 700. When the conveying robot 110 and the conveying device 700 transfer substrates, the substrates can be transferred via a temporary stage (not shown).

[0025] The aligner 120 is a module for aligning the position of the orientation flat, recess, etc. of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged in a horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 wets the plated surface of the substrate before the plating process with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wet module 200 is configured to implement a pre-wet process that is easy to supply the plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wet modules 200 are arranged in a vertical direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0026] The prepreg module 300 is configured to perform a prepreg treatment for cleaning or activating the surface of the plated substrate by etching away the oxide film with a relatively high resistance such as the surface of the seed layer formed on the plated surface of the substrate before the plating treatment, for example, using a treatment solution such as sulfuric acid or hydrochloric acid. In the present embodiment, two prepreg modules 300 are arranged in the vertical direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In the present embodiment, there are two groups of 12 plating modules 400, each of which has 3 arranged in the vertical direction and 4 arranged in the horizontal direction, and a total of 24 plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0027] The cleaning module 500 is configured to perform cleaning on the substrate in order to remove the plating liquid etc. remaining in the substrate after the plating treatment. In the present embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for rotating the substrate after the cleaning treatment at high speed to dry it. In the present embodiment, two spin dryers are arranged in the vertical direction, but the number and configuration of the spin dryers are arbitrary. The conveying device 700 is a device for conveying substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, for example, it can be composed of a general computer or a special computer having an input and output interface with an operator.

[0028] An example of a series of plating processes performed by the plating device 1000 is described. First, a substrate stored in a box is carried to the loading port 100. Next, the conveying robot 110 takes out the substrate from the box of the loading port 100 and conveys the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation plane, notch, etc. of the substrate in a predetermined direction. The conveying robot 110 delivers the substrate aligned by the aligner 120 to the conveying device 700.

[0029] The conveying device 700 conveys the substrate received from the conveying robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The conveying device 700 conveys the substrate subjected to the pre-wetting process to the pre-preg module 300. The pre-preg module 300 performs a pre-preg process on the substrate. The conveying device 700 conveys the substrate subjected to the pre-preg process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0030] The conveying device 700 conveys the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The conveying device 700 conveys the substrate subjected to the cleaning process to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The conveying device 700 delivers the substrate subjected to the drying process to the conveying robot 110. The conveying robot 110 conveys the substrate received from the conveying device 700 to the box of the loading port 100. Finally, the box containing the substrate is unloaded from the loading port 100.

[0031] also, Figure 1 , Figure 2 The structure of the plating device 1000 described in the above is merely an example, and the structure of the plating device 1000 is not limited to Figure 1 , Figure 2 structure.

[0032] Next, the structure of the plating module 400 will be described. In the present embodiment, the 24 plating modules 400 have the same structure, and therefore only one plating module 400 will be described. Figure 3 1 is a longitudinal sectional view schematically showing the structure of a plating module 400 according to an embodiment. The plating module 400 is provided with a plating tank for accommodating a plating solution. The plating tank is configured to include a cylindrical inner tank 412 with an opening on the upper surface, and an outer tank (not shown) provided around the inner tank 412 in a manner to store the plating solution overflowing from the upper edge of the inner tank 412.

[0033] The plating module 400 includes a substrate holder 440 for holding the substrate Wf in a state where the plated surface Wf-a faces downward. In addition, the substrate holder 440 includes a power supply contact for supplying power to the substrate Wf from a power source not shown. The plating module 400 includes a lifting mechanism 442 for lifting and lowering the substrate holder 440. In addition, in one embodiment, the plating module 400 includes a rotating mechanism 448 for rotating the substrate holder 440 around a vertical axis. The lifting mechanism 442 and the rotating mechanism 448 can be implemented by a well-known mechanism such as a motor, for example.

[0034] The plating module 400 includes a diaphragm 420 that separates the interior of the inner tank 412 in the up-down direction. The interior of the inner tank 412 is divided into a cathode region 422 and an anode region 424 by the diaphragm 420. The cathode region 422 and the anode region 424 are filled with plating liquid, respectively. In addition, in the present embodiment, an example of providing the diaphragm 420 is shown, but the diaphragm 420 may not be provided.

[0035] The anode 430 is provided on the bottom surface of the inner groove 412 of the anode region 424. In addition, an anode shield 426 for adjusting the electric field between the anode 430 and the substrate Wf is arranged in the anode region 424. The anode shield 426 is a substantially plate-shaped member made of a dielectric material, for example, and is provided in front of the anode 430 (at Figure 3 The anode shield 426 has an opening for the current flowing between the anode 430 and the substrate Wf to pass through. The anode shield 426 can also be configured to be able to change the opening size, and the opening size is adjusted by the control module 800. The opening size means the diameter when the opening is circular, and means the length of one side or the longest opening width when the opening is polygonal. The change of the opening size of the anode shield 426 can adopt a known mechanism. In this embodiment, an example of setting the anode shield 426 is shown, but the anode shield 426 may not be set. In addition, the above-mentioned diaphragm 420 may also be set at the opening of the anode shield 426.

[0036] A resistor 450 is disposed in the cathode region 422 so as to face the diaphragm 420. The resistor 450 is a component for achieving uniform plating treatment on the plated surface Wf-a of the substrate Wf, and has a through hole on the anode 430 side ( Figure 3 The lower side of the substrate Wf ( Figure 3 In one embodiment, the resistor 450 is configured to be movable in the vertical direction in the plating tank by the driving mechanism 452, and the position of the resistor 450 is adjusted by the control module 800. The specific material of the resistor 450 is not particularly limited, but as an example, a resin such as polyetheretherketone can be used.

[0037] A paddle 456 for stirring the plating solution is provided near the surface of the substrate Wf in the cathode region 422. The paddle 456 is made of, for example, titanium (Ti) or resin. The paddle 456 stirs the plating solution by reciprocating in parallel with the surface of the substrate Wf so that sufficient metal ions are uniformly supplied to the surface of the substrate Wf during the plating of the substrate Wf. However, the present invention is not limited to such an example, and the paddle 456 may also be configured to move perpendicularly to the surface of the substrate Wf, for example. In addition, the plating module 400 may not have the paddle 456.

[0038] A potential sensor assembly 470 is provided between the substrate Wf and the resistor 450 in the cathode region 422. The potential sensor assembly 470 includes a plurality of potential sensors 474 for detecting the potential of the plating solution near the plated surface Wf-a of the substrate Wf. The detection signal of the potential measured by each potential sensor 474 is input to the control module 800. In the case where the plating module 400 has a paddle 456, the potential sensor assembly 470 is arranged at a position that does not interfere with the paddle 456. For example, Figure 3 As shown, the potential sensor assembly 470 can be disposed between the paddle 456 and the resistor 450. The potential sensor assembly 470 can also be disposed in contact with the surface of the resistor 450.

[0039] In one embodiment, a grounded reference potential sensor (not shown) may be provided at a location where the potential change in the plating tank is relatively small, and the difference between the detection potential measured by the reference potential sensor and the detection potential measured by the potential sensor 474 may be obtained. Since the change in the potential measured by the potential sensor 474 is very small, it is easily affected by noise. By using the difference between the detection potential measured by the grounded reference potential sensor and the detection potential measured by the potential sensor 474, noise can be reduced.

[0040] The control module 800 can estimate the thickness of the plated film formed on the substrate Wf based on the detection value of the potential measured by the potential sensor 474 (or the difference between the detection potentials measured by the potential sensor 474 and the reference potential sensor). As an example, the control module 800 can estimate the distribution of the plating current in the substrate surface during the plating process based on the detection signal from the potential sensor 474, and estimate the film thickness distribution of the plated film on the substrate based on the estimated distribution of the plating current.

[0041] In addition, the control module 800 can detect the end point of the plating process based on the detection value of the potential sensor 474 (or the difference between the detection potential measured by the potential sensor 474 and the reference potential sensor), and can also predict the time until the end point of the plating process. As an example, the control module 800 can end the plating process when the film thickness of the plated film inferred based on the detection value of the potential sensor 474 becomes the desired thickness. In addition, as an example, the control module 800 can also calculate the film thickness increase rate based on the film thickness of the plated film inferred based on the detection value of the potential sensor 474, and predict the time until the plated film becomes the desired thickness, that is, the time until the end point of the plating process based on the obtained film thickness increase rate.

[0042] The plating process of the plating module 400 is described. The substrate Wf is immersed in the plating solution of the cathode region 422 using the lifting mechanism 442, thereby the substrate Wf is exposed to the plating solution. In this state, the plating module 400 applies a voltage between the anode 430 and the substrate Wf, thereby being able to perform a plating process on the plated surface Wf-a of the substrate Wf. In addition, in one embodiment, the plating process is performed while the substrate holder 440 is rotated using the rotating mechanism 448. Through the plating process, a conductive film (plating film) is precipitated on the plated surface Wf-a of the substrate Wf. During the plating process, the potential is measured by the potential sensor 474 on the potential sensor assembly 470. By measuring with the potential sensor 474 accompanied by the rotation of the substrate holder 440 (substrate Wf), the potential can be measured for multiple locations on the circumference of the substrate Wf, or throughout the entire circumference. Then, the control module 800 infers the film thickness of the plated film based on the detection value of the potential measured by the potential sensor 474. Thereby, the change in the film thickness of the plated film formed on the plated surface Wf-a of the substrate Wf during the plating process can be grasped in real time.

[0043] Figure 4 It is a plan view showing the structure of a potential sensor module 470 according to one embodiment. Figure 4 The direction perpendicular to the resistor 450 (eg Figure 3 The potential sensor assembly 470 is configured to have a plurality of potential sensors 474 mounted on a bottom plate 472. The bottom plate 472 is a thin plate-shaped member. For example, the thickness of the bottom plate 472 (i.e., Figure 4 The dimension in the direction perpendicular to the paper surface) can be several mm or less, and more preferably 1 mm or less. The material of the bottom plate 472 is not particularly limited, and is preferably a dielectric such as resin. As an example, the bottom plate 472 can be composed of a commonly available printed circuit board.

[0044] A plurality of electrical wirings 476 and pads 477 are formed on the bottom plate 472, and a potential sensor 474 is mounted on each pad 477. The potential sensor 474 is electrically connected to the pad 477, and a potential detection signal from each potential sensor 474 is sent to the control module 800 via the electrical wiring 476. A protective film 478 is further provided on the bottom plate 472 to cover the bottom plate 472 and the electrical wiring 476. The protective film 478 is preferably made of a material resistant to the plating solution, for example.

[0045] exist Figure 4 In the exemplary potential sensor assembly 470, the bottom plate 472 is configured to be elongated in one direction, and a plurality of potential sensors 474 are arranged in a row along the length direction of the elongated bottom plate 472. For example, the length of the bottom plate 472 in the length direction (i.e. Figure 4The left-right dimension in the figure can be the same as the radius of the substrate Wf to be plated. In addition, the width of the bottom plate 472 (i.e. Figure 4 The dimension in the up-down direction in the figure may be a size that can ensure sufficient space for mounting the potential sensor 474 and can ensure sufficient mechanical strength of the slender bottom plate 472 (for example, approximately 10 to 20 mm).

[0046] Figure 5 Yes means Figure 4 Schematic diagram of the positional relationship between the potential sensor assembly 470 and the substrate Wf during the plating process. Figure 5 As shown, the potential sensor assembly 470 is arranged opposite to the substrate Wf in such a manner that its length direction is along the radial direction of the substrate Wf and the front end of the potential sensor assembly 470 reaches the vicinity of the center of the substrate Wf. With such an arrangement, the multiple potential sensors 474 of the potential sensor assembly 470 can detect the potential at multiple locations arranged along the radial direction of the substrate Wf from the vicinity of the center of the substrate Wf to the edge of the substrate Wf. In addition, when the plating process is performed while the substrate holder 440 is rotated using the rotating mechanism 448, the multiple potential sensors 474 of the potential sensor assembly 470 can detect the potential at multiple locations across the entire surface of the substrate Wf by moving the potential sensor 474 relative to the substrate Wf.

[0047] Thus, since the potential sensor assembly 470 of one embodiment is thin, it can be arranged between the substrate Wf and the resistor 450 without any problem even in the plating module 400 in which the interval between the substrate Wf and the resistor 450 is not too large, and interference with the paddle 456 can be avoided (see Figure 3 ). In addition, Figure 4 As shown, since the potential sensor assembly 470 of one embodiment is slender, it is possible to suppress the influence of the electric field near the plated surface Wf-a of the substrate Wf, and is configured to reach near the center of the substrate Wf. Thus, the potential can be measured at multiple locations within a wide range of the substrate Wf.

[0048] Figure 6 The potential sensor assembly 470 (hereinafter, for the purpose of Figure 4 Differentiate between the implementation methods Figure 6 A top view of the structure of a potential sensor assembly according to an embodiment of the present invention is denoted by reference numeral 470A). Figure 6 The direction perpendicular to the resistor 450 (eg Figure 3 Observe the condition of the potential sensor assembly 470A) on the upper side. Figure 6 The potentiometric sensor assembly 470A of the embodiment is used with Figure 4 The potential sensor assembly 470 of the embodiment is composed of a bottom plate 472 and a bottom plate 473 of a different shape. The structure of the potential sensor assembly 470A except the bottom plate 473 is the same as that of the potential sensor assembly 470, and repeated description is omitted. Figure 6 For the sake of convenience, only a plurality of potential sensors 474 mounted on the base plate 473 are shown, and the electrical wiring 476, the pad 477 and the protective film 478 are omitted from the illustration.

[0049] like Figure 6 As shown, a plurality of holes 479 are formed in the bottom plate 473. The holes 479 are Figure 6 The hole 479 of the bottom plate 473 penetrates the bottom plate 473 in a direction perpendicular to the paper surface. Therefore, the hole 479 of the bottom plate 473 allows the resistor 450 side of the potential sensor unit 470A arranged in the plating tank 412 to communicate with the substrate Wf side through fluid.

[0050] Figure 7 The resistor 450 is disposed between the resistor 450 and the substrate Wf in the plating tank 412. Figure 6 The potential sensor assembly 470A of the embodiment is shown in a three-dimensional view together with the resistor 450. In addition, for ease of observation, Figure 7 The middle substrate Wf and the substrate support 440 are omitted in the figure. Figure 3 As described in the above, the resistor 450 has a through-hole on the anode 430 side ( Figure 7 The lower side of the substrate Wf ( Figure 7 In the present embodiment, the shape and layout of the holes 451 of the resistor 450 are not particularly limited, but as an example, the shape and layout of the holes 451 of the resistor 450 can be adopted. Figure 4 Such a structure is disclosed in .

[0051] like Figure 7As shown, the potential sensor assembly 470A is arranged near the upper surface (i.e., the surface facing the substrate Wf side) of the resistor 450, or is arranged to contact the upper surface. The holes 479 formed in the bottom plate 473 of the potential sensor assembly 470A are neatly arranged with the holes 451 of the resistor 450. That is, when the potential sensor assembly 470A is observed from a direction perpendicular to the resistor 450, each hole 479 of the bottom plate 473 is formed at a position overlapping with the hole 451 of the resistor 450. In other words, each hole 479 of the bottom plate 473 is set to be opposite to the hole 451 of the resistor 450. Preferably, the bottom plate 473 has holes 479 at positions corresponding to all the holes 451 of the resistor 450 in the portion overlapping with the elongated shape of the bottom plate 473 in a manner not to block the holes 451 of the resistor 450. From the viewpoint of not blocking the hole 451 of the resistor 450 , the diameter of the hole 479 of the bottom plate 473 is preferably the same as or larger than the diameter of the hole 451 of the resistor 450 .

[0052] Thus, the potential sensor assembly 470A has the hole 479 aligned with the hole 451 of the resistor 450, and thus can reduce the influence on the electric field formed in the plating solution between the resistor 450 and the substrate Wf. Therefore, by using the potential sensor assembly 470A of this embodiment, the potential near the plated surface Wf-a of the substrate Wf can be measured with high accuracy.

[0053] In addition, the potential sensor assembly 470A has the same structure as the above-mentioned potential sensor assembly 470 except for the hole 479 of the bottom plate 473, and therefore has the same effect as the potential sensor assembly 470. That is, since the potential sensor assembly 470A is thin, it can be arranged between the substrate Wf and the resistor 450 without any problem even in the plating module 400 with a structure in which the interval between the substrate Wf and the resistor 450 is not too large, and interference with the paddle 456 can be avoided. In addition, the potential sensor assembly 470A of this embodiment is slender and has a hole 479 that does not block the hole 451 of the resistor 450, so that the influence on the electric field near the plated surface Wf-a of the substrate Wf can be suppressed to a minimum, and it is arranged to reach near the center of the substrate Wf. As a result, the potential can be measured at multiple locations within a wide range of the substrate Wf with high accuracy.

[0054] The embodiments of the present invention are described above based on several examples, but the embodiments of the invention described above are used to facilitate understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and the present invention certainly includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problems that can be solved or within the scope of at least a part of the effects that can be achieved, any combination or omission of the constituent elements described in the claims and the specification can be performed.

Claims

1. A plating device, characterized in that: have: A plating tank, the plating tank is used to contain a plating solution; A substrate support, the substrate support is used to hold the substrate; an anode, the anode being arranged in the plating tank so as to face the substrate held by the substrate holder; a resistor, the resistor being disposed between the substrate held by the substrate holder and the anode and having a plurality of holes penetrating the anode side and the substrate side; as well as a potential sensor assembly configured to be disposed between the substrate held by the substrate holder and the resistor, and to measure the potential of the plating solution; The potential sensor assembly comprises: Base plate; A plurality of potential sensors, wherein the plurality of potential sensors are arranged on the bottom plate; an electrical wiring formed on the bottom plate and used to extract signals from the plurality of potential sensors; as well as a protective film, the protective film protecting the base plate and the electrical wiring, The bottom plate includes a plurality of holes formed to be aligned with the plurality of holes of the resistor.

2. The plating device according to claim 1, characterized in that: The bottom plate is composed of a printed circuit board.

3. The plating device according to claim 1, characterized in that: The bottom plate is configured as an elongated plate. The plurality of potential sensors are arranged along the length direction of the bottom plate.

4. The plating device according to claim 3, characterized in that: The plating device further includes a rotating mechanism for rotating the substrate holder. The potential sensor assembly is disposed between the substrate and the resistor such that the length direction of the bottom plate is along the radial direction of the rotation.

5. The plating device according to claim 1, characterized in that: The plurality of holes of the bottom plate are respectively arranged at positions overlapping with any one of the plurality of holes of the resistor.

6. The plating device according to claim 5, characterized in that: The plurality of holes of the bottom plate are provided so as to face all of the holes of the resistor that exist in a portion overlapping with the outer shape of the bottom plate.

7. The plating device according to claim 1, characterized in that: The diameter of the hole of the bottom plate is larger than or equal to the diameter of the hole of the resistor.

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