Display device protection component and display device

Abstract

The present application relates to a protective component for a display device and the display device. The display device includes a chip-on-film (COF) and a driver chip located on the COF, with wiring provided on the COF, the driver chip being electrically connected to the wiring, and a protective component disposed on the periphery of the driver chip and connected to the COF. The protective component includes: a housing having a first accommodating cavity and a second accommodating cavity arranged in a stacked manner, the driver chip being located in the first accommodating cavity, the second accommodating cavity being provided with an outlet; an airbag disposed in the second accommodating cavity; and protective adhesive disposed in the second accommodating cavity and located on the airbag; when the heat generated by the driver chip reaches a temperature threshold, the airbag expands due to the heat, pushing the protective adhesive to overflow from the outlet and cover the wiring, thereby isolating the wiring from external impurities and preventing the wiring from being corroded.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a protective component of a display device and a display device. Background Art

[0002] With the development of display technology, display components are widely used in our daily life. The chip-on-film in the display component helps to improve the lightweight and thin design of the display component.

[0003] The driver chip on the flip chip film generates a large amount of heat when working. This heat diffuses to the top of the wiring electrically connected to the driver chip, causing a hot and cold alternating zone to form above the wiring. The hot air merges with the cold air in this area to form condensation water, which corrodes the wiring and causes abnormal screen display. Summary of the Invention

[0004] The present application aims to provide a protective component for a display device and a display device, so as to solve the technical problem in the related art that due to the heat generated by the operation of the driver chip, there are hot and cold alternating zones around it, the gas liquefies to produce condensed water, and the condensed water corrodes the wiring, resulting in abnormal screen display.

[0005] In the first aspect, an embodiment of the present application proposes a protective component for a display device, wherein the display device includes a chip-on-chip film and a driver chip located on the chip-on-chip film, wiring is provided on the chip-on-chip film, the driver chip is electrically connected to the wiring, and the protective component is provided on the outer peripheral side of the driver chip and connected to the chip-on-chip film. The protective component includes: a housing having a first accommodating cavity and a second accommodating cavity arranged in a stacked manner, the driver chip is located in the first accommodating cavity, and the second accommodating cavity is provided with an outlet; an airbag, provided in the second accommodating cavity; and protective glue, provided in the second accommodating cavity and located on the airbag; when the heat generated by the driver chip reaches a temperature threshold, the airbag expands due to the heat, pushing the protective glue to overflow from the outlet and cover the wiring, so as to isolate the wiring from external impurities.

[0006] In a possible embodiment, the wall of the second accommodating cavity is further provided with a barrier film, which at least covers the outlet; a tip portion is provided at the outlet, which pierces the barrier film when the airbag inflates, so that the protective glue overflows from the outlet.

[0007] In a possible implementation, the outlet is further provided with transverse ribs, and the transverse ribs are used to slow down the speed at which the protective glue flows through the outlet.

[0008] In a possible implementation, a first thermally conductive colloid is further provided in the first accommodating cavity. The first thermally conductive colloid is located between the driver chip and the top of the first accommodating cavity and is used to transfer heat generated by the driver chip to the second accommodating cavity.

[0009] In a possible embodiment, the housing further has a third accommodating cavity, which is located between the first accommodating cavity and the second accommodating cavity. A second thermally conductive colloid is disposed in the third accommodating cavity, and the second thermally conductive colloid is used to transfer heat generated by the driver chip to the second accommodating cavity.

[0010] In a possible implementation, a first heat conducting member is further disposed in the third accommodating cavity, and the first heat conducting member is located between the first accommodating cavity and the second heat conducting colloid.

[0011] In a possible implementation, a second heat conducting member is further disposed in the third accommodating cavity, and the second heat conducting member is located between the second heat conducting colloid and the second accommodating cavity.

[0012] In a possible implementation, a plurality of protrusions are provided on a side of the first heat conducting member facing the second heat conducting colloid, a plurality of sub-cavities are formed between the plurality of protrusions and the second heat conducting member, and the second heat conducting colloid is located in the sub-cavities.

[0013] In a possible implementation, an antistatic coating is provided on the outside of the housing.

[0014] In a second aspect, an embodiment of the present application provides a display device, comprising the protective component of the display device as mentioned in the first aspect.

[0015] The embodiment of the present application provides a protective component for a display device and a display device, wherein the display device includes a chip-on-chip film and a driver chip located on the chip-on-chip film, wiring is provided on the chip-on-chip film, the driver chip is electrically connected to the wiring, the protective component is provided on the peripheral side of the driver chip and is connected to the chip-on-chip film, the protective component includes: a housing having a first accommodating chamber and a second accommodating chamber arranged in a stacked manner, the driver chip is located in the first accommodating chamber, and the second accommodating chamber is provided with an outlet; an airbag, provided in the second accommodating chamber; and protective glue, provided in the second accommodating chamber and located on the airbag; when the heat generated by the driver chip reaches a temperature threshold, the airbag expands due to the heat, pushing the protective glue to overflow from the outlet and cover the wiring, so as to isolate the wiring from external impurities. The present application arranges a protective component on the peripheral side of the driver chip, and when the heat emitted by the driver chip reaches a preset value, the protective glue in the protective component overflows and covers the wiring, so as to prevent the wiring from being corroded by condensed water formed by liquefying the surrounding water vapor due to the heat emitted by the driver chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings. In the drawings, identical components are denoted by the same reference numerals. The drawings are not drawn to scale and are intended only to illustrate relative positions. Layer thicknesses in certain locations are exaggerated for ease of understanding, and the layer thicknesses depicted in the drawings do not necessarily represent actual layer thickness proportions.

[0017] Figure 1A front view of a chip-on-film, a driver chip, and a protection component provided in the first embodiment of the present application is shown;

[0018] Figure 2 A schematic diagram showing the structure of the chip-on-film, the driver chip, and the protection component when the airbag provided by the first embodiment of the present application is not inflated;

[0019] Figure 3 A schematic diagram showing the structure of the chip-on-film, the driver chip, and the protection component after the airbag is inflated according to the first embodiment of the present application is shown;

[0020] Figure 4 A schematic structural diagram of a display device provided in the second embodiment of the present application is shown.

[0021] Reference numerals:

[0022] 100. Display device;

[0023] 10. Chip-on-chip film;

[0024] 20. Driver chip;

[0025] 30. Routing;

[0026] 40. Protective assembly; 41. Housing; 411. First accommodating chamber; 412. Second accommodating chamber; 413. Outlet; 414. Barrier film; 415. Tip; 416. Horizontal rib; 417. Third accommodating chamber;

[0027] 42. Airbag; 43. Protective glue; 44. First thermally conductive colloid; 45. Second thermally conductive colloid; 46. First thermally conductive member; 461. Protrusion; 462. Sub-chamber; 47. Second thermally conductive member. DETAILED DESCRIPTION

[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the well-known structures and techniques are not shown in order to avoid unnecessary ambiguity in the present application; and, for clarity, the sizes of regional structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0029] The driver chip on the flip chip film generates a large amount of heat when working. This heat diffuses to the top of the wiring electrically connected to the driver chip, causing a hot and cold alternating zone above the wiring. The hot air merges with the cold air in this area to form condensation water, which corrodes the wiring and causes abnormal screen display.

[0030] In view of this, an embodiment of the present application provides a protective component for a display device and a display device. By setting a protective component on the outer peripheral side of a driver chip, when the heat emitted by the driver chip reaches a preset value, the protective glue in the protective component overflows and covers the wiring to prevent the wiring from being corroded by condensed water formed by the heat emitted by the driver chip.

[0031] The following describes the protective components of the display device and the specific structure of the display device provided by each embodiment of the present application in conjunction with the accompanying drawings.

[0032] First embodiment

[0033] Figure 1 A front view of a COF 10 , a driver chip 20 , and a protection component 40 provided in the first embodiment of the present application is shown.

[0034] like Figure 1 As shown, the first embodiment of the present application provides a protection component 40 for a display device 100. The display device 100 includes a chip-on-film (COF) 10 and a driver chip 20 located on the COF 10. A trace 30 is provided on the COF 10. The driver chip 20 is electrically connected to the trace 30. The protection component 40 is provided on the outer periphery of the driver chip 20 and is connected to the COF 10. The protection component 40 includes:

[0035] The housing 41 has a first accommodating cavity 411 and a second accommodating cavity 412 arranged in a stacked manner. The driver chip 20 is located in the first accommodating cavity 411, and the second accommodating cavity 412 is provided with an outlet 413; the airbag 42 is arranged in the second accommodating cavity 412; and the protective glue 43 is arranged in the second accommodating cavity 412 and located on the airbag 42.

[0036] When the heat generated by the driver chip 20 reaches a temperature threshold, the airbag 42 expands due to the heat, pushing the protective glue 43 to overflow from the outlet 413 and cover the trace 30, thereby isolating the trace 30 from external impurities.

[0037] The protective component 40 is mounted on the outside of the driver chip, and the bottom of the protective component 40 is connected to the COF 10 using a connecting adhesive. The outer shell 41 can be made of rubber or plastic, such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, or polyethylene. The protective adhesive 43 can be a three-proof adhesive, an adhesive with multiple properties such as waterproof, moisture-proof, and dust-proof, and is commonly used to protect electronic components. When the protective adhesive 43 covers the trace 30, it forms a light and flexible film with a thickness of only 40μm to 60μm.

[0038] Specifically, when the heat emitted by the driver chip 20 does not reach the preset temperature threshold, the heat emitted is not enough to cause the airbag 42 to expand. Figure 2 As shown, Figure 2 The schematic diagram shows the structure of the COF 10, the driver chip 20, and the protective assembly 40 when the airbag 42 provided in the first embodiment of the present application is not inflated. The protective adhesive 43 is still in the second accommodating cavity 412 and has not flowed out of the outlet 413. When the heat emitted by the driver chip 20 reaches a preset temperature threshold, the heat emitted causes the airbag 42 to inflate, causing the liquid level of the protective adhesive 43 to rise and flow out of the outlet 413. Figure 3 As shown, Figure 3 A schematic structural diagram of the chip-on-film 10, the driver chip 20, and the protective component 40 after the airbag 42 provided in the first embodiment of the present application is expanded is shown. The protective glue 43 overflows from the outlet 413 and covers the traces 30 around the protective component 40, forming a protective film on the traces 30.

[0039] Because the driver chip 20 generates a large amount of heat during operation, this heat easily forms condensation near the driver chip 20, which in turn causes corrosion to the traces 30 near the driver chip 20. This application provides a protective component 40. When the heat emitted by the driver chip 20 exceeds a preset temperature, an airbag 42 pushes the protective glue 43 out, forming a protective film on the traces 30 near the driver chip 20. This prevents the traces 30 from being corroded by condensation generated during heat exchange. At the same time, the protective film also protects the traces 30 from being corroded by other impurities such as dust and oxygen.

[0040] In some embodiments, the height of the opening is flush with the liquid level of the protective glue 43 when the airbag 42 is not inflated. When the airbag 42 is inflated, the protective glue 43 flows out from the opening (this situation is not shown in the figure).

[0041] In other embodiments, a barrier film 414 is further provided on the wall of the second accommodating cavity 412, which at least covers the outlet 413; a tip portion 415 is provided at the outlet 413, and when the airbag 42 is inflated, the tip portion 415 pierces the barrier film 414 to allow the protective glue 43 to overflow from the outlet 413.

[0042] Compared with the above-mentioned setting in which the opening is flush with the surface of the protective glue 43, in this embodiment, a blocking film 414 is provided to block the outlet 413 to prevent the protective glue 43 from flowing out of the outlet 413 during transportation of the protective component 40, thereby reducing transportation requirements.

[0043] In some embodiments, the outlet 413 is further provided with a transverse rib 416 , which is used to slow down the flow of the protective glue 43 through the outlet 413 , thereby preventing the protective glue 43 from flowing through the outlet 413 too quickly and splashing when dripping onto the wiring 30 .

[0044] Specifically, the transverse rib 416 may be provided at the outlet 413, such as Figure 2 and Figure 3 As shown, the transverse ribs 416 can also be provided on the outside of the housing 41 (not shown). In this case, the transverse ribs 416 act as bosses, so that overflowing protective adhesive 43 first flows onto the transverse ribs 416 and then flows from the transverse ribs 416 onto the wiring 30, preventing the protective adhesive 43 from flowing directly from the outlet 413 onto the wiring 30 and slowing down the outflow of the protective adhesive 43. Furthermore, because the transverse ribs 416 are provided on the outside of the housing 41, the protective adhesive 43 flowing from the transverse ribs 416 onto the wiring 30 has a larger diffusion area, covering a larger area of ​​the wiring 30 and thus protecting a wider range of the wiring 30.

[0045] In some embodiments, a first thermally conductive adhesive 44 is further disposed in the first accommodating cavity 411 . The first thermally conductive adhesive 44 is located between the driver chip 20 and the top of the first accommodating cavity 411 and is used to transfer heat generated by the driver chip 20 to the second accommodating cavity 412 .

[0046] Specifically, the first thermally conductive colloid 44 fills the gap between the driver chip 20 and the top of the first accommodating cavity 411. The first thermally conductive colloid 44 absorbs heat dissipated by the driver chip 20 and transfers the heat to the airbag 42 in the second accommodating cavity 412, thereby accurately detecting whether the heat dissipated by the driver chip 20 exceeds a preset temperature threshold. The first thermally conductive colloid 44 may be thermally conductive silicone grease.

[0047] In some embodiments, the housing 41 further has a third accommodating cavity 417, which is located between the first accommodating cavity 411 and the second accommodating cavity 412. A second thermal conductive colloid 45 is disposed in the third accommodating cavity 417, and the second thermal conductive colloid 45 is used to transfer the heat generated by the driving chip 20 to the second accommodating cavity 412.

[0048] By providing the third accommodating cavity 417 and placing the second thermally conductive colloid 45 therein, the heat dissipated by the driver chip 20 can be fully absorbed and transferred to the airbag 42 in the second accommodating cavity 412. This effectively and accurately detects the heat dissipated by the driver chip 20. When the heat dissipated by the driver chip 20 reaches a preset value, the traces 30 are promptly protected. Furthermore, the third accommodating cavity 417 filled with the second thermally conductive colloid 45 can enhance the rigidity of the protective assembly 40. The second thermally conductive colloid 45 can be thermally conductive silicone grease.

[0049] In some embodiments, a first heat conducting member 46 is further disposed within the third accommodating cavity 417 and is located between the first accommodating cavity 411 and the second thermally conductive adhesive 45. This further absorbs heat dissipated by the driver chip 20 and enhances the rigidity of the protective assembly 40. The first heat conducting member 46 is made of metal, preferably copper foil.

[0050] In some embodiments, a second heat conducting member 47 is further disposed in the third accommodating cavity 417 . The second heat conducting member 47 is located between the second heat conducting colloid 45 and the second accommodating cavity 412 .

[0051] The second heat-conducting member 47 not only enhances the rigidity of the protective assembly 40 but also fully transfers heat absorbed by the second thermally conductive adhesive 45 to the airbag 42 in the second accommodating cavity 412. This ensures that when the heat dissipated by the driver chip 20 reaches a preset temperature threshold, the airbag 42 expands, allowing the protective adhesive 43 to overflow. The second heat-conducting member 47 is made of metal, preferably copper foil.

[0052] In some embodiments, a plurality of protrusions 461 are provided on a side of the first heat conducting member 46 facing the second heat conducting adhesive 45 . A plurality of sub-cavities 462 are formed between the plurality of protrusions 461 and the second heat conducting member 47 . The second heat conducting adhesive 45 is located in the sub-cavities 462 .

[0053] A protrusion 461 is provided on the side of the first heat-conducting member 46 facing the second heat-conducting colloid 45, so that the second heat-conducting colloid 45 is arranged in a plurality of sub-cavities 462, and two adjacent second heat-conducting colloids 45 are connected by the protrusion 461, and the material of the protrusion 461 is the same as that of the second heat-conducting member 47. On the one hand, as Figure 1-Figure 3As shown, the middle portion of the second thermally conductive gel 45 is closer to the driver chip 20. Therefore, the middle portion of the second thermally conductive gel 45 absorbs more heat than the end portions. As a result, when the second thermally conductive gel 45 transfers heat to the airbag 42, the middle portion of the airbag 42 receives more heat, while the end portions receive less heat. Heat diffuses from the middle to the ends within the airbag 42, prolonging the time it takes for the protective gel 43 to overflow. In this embodiment, protrusions 461 made of the same material as the second thermally conductive member 47 are provided between the second thermally conductive gels 45 to quickly transfer heat between the second thermally conductive gels 45 in different sub-chambers 462. This prevents the temperature of the second thermally conductive gel 45 in the middle region from being higher than that in the surrounding regions. This ensures uniform heating of the airbag 42, shortens the time it takes for the airbag 42 to expand, and allows the protective gel 43 to overflow promptly, thus protecting the traces 30. Furthermore, the provision of protrusions 461 also increases the rigidity of the first thermally conductive member 46, thereby enhancing the rigidity of the protective assembly 40.

[0054] In some embodiments, an antistatic coating (not shown) is provided on the outside of the housing 41. By providing the antistatic coating on the outside of the housing 41, electrostatic protection is provided for the driver chip 20 to avoid electrostatic damage. The antistatic coating can be a metal coating.

[0055] In this embodiment, by providing a protective component 40, when the heat emitted by the driver chip 20 is greater than a preset temperature, the airbag 42 pushes the protective glue 43 to flow out, forming a protective film on the wiring 30 near the driver chip 20, thereby preventing the wiring 30 from being corroded by condensed water generated during the heat exchange. At the same time, the protective film can also protect the wiring 30 from being corroded by other impurities such as dust and oxygen. By providing a waterproof film to seal the opening, the protective glue 43 is prevented from flowing out of the opening during the transportation of the protective component; a first thermally conductive colloid 44, a second thermally conductive colloid 45, a first thermally conductive member 46, and a second thermally conductive member 47 are provided so that the heat emitted by the driver chip 20 is promptly and efficiently transferred to the airbag 42, so that the protective glue 43 flows out in time to protect the wiring 30; and an electrostatic coating is provided on the outside of the housing 41 to provide electrostatic protection for the driver chip 20 and avoid electrostatic damage.

[0056] Second embodiment

[0057] Figure 4 FIG. 1 is a schematic structural diagram of a display device 100 provided in a second embodiment of the present application.

[0058] like Figure 4 As shown, the second embodiment of the present application provides a display device 100 , including the protection component 40 of the display device 100 mentioned in the first embodiment.

[0059] It should be readily understood that “on,” “above,” and “over” in this application should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes the meaning of “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0060] As used herein, the term "layer" may refer to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have an extent smaller than the extent of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure whose thickness is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pairs of lateral planes at the top and bottom surfaces. A layer may extend laterally, vertically, and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above, and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (within which contacts, interconnects, and / or vias are formed) and one or more dielectric layers.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A protection assembly for a display device, the display device comprising a chip-on-film (COF) and a driver chip located on the COF, wherein wiring is provided on the COF, and the driver chip is electrically connected to the wiring, wherein: The protection component is disposed on the outer periphery of the driver chip and connected to the flip chip film, and the protection component includes: The housing has a first accommodating cavity and a second accommodating cavity that are stacked, the driving chip is located in the first accommodating cavity, and the second accommodating cavity is provided with an outlet; an airbag, disposed in the second accommodating cavity; and A protective adhesive is disposed in the second accommodating cavity and is located on the airbag; When the heat generated by the driver chip reaches a temperature threshold, the airbag expands due to the heat, pushing the protective glue to overflow from the outlet and cover the wiring, so as to isolate the wiring from external impurities.

2. The protection assembly according to claim 1, characterized in that The wall of the second accommodating cavity is further provided with a barrier film, which at least covers the outlet; a tip portion is provided at the outlet, which pierces the barrier film when the airbag is inflated, so that the protective glue overflows from the outlet.

3. The protection assembly according to claim 2, characterized in that: The outlet is further provided with transverse ribs, and the transverse ribs are used to slow down the speed of the protective glue flowing through the outlet.

4. The protection assembly according to claim 1, characterized in that A first heat-conducting colloid is further provided in the first accommodating cavity. The first heat-conducting colloid is located between the driver chip and the top of the first accommodating cavity and is used to transfer heat generated by the driver chip to the second accommodating cavity.

5. The protection assembly according to claim 1, characterized in that: The housing further has a third accommodating cavity, which is located between the first accommodating cavity and the second accommodating cavity. A second thermally conductive colloid is disposed in the third accommodating cavity, and the second thermally conductive colloid is used to transfer heat generated by the driver chip to the second accommodating cavity.

6. The protection assembly according to claim 5, characterized in that: A first heat conducting member is further provided in the third accommodating cavity, and the first heat conducting member is located between the first accommodating cavity and the second heat conducting colloid.

7. The protection assembly according to claim 6, characterized in that A second heat conducting member is further provided in the third accommodating cavity, and the second heat conducting member is located between the second heat conducting colloid and the second accommodating cavity.

8. The protection assembly according to claim 7, characterized in that: A plurality of protrusions are provided on a side of the first heat-conducting member facing the second heat-conducting colloid. A plurality of sub-cavities are formed between the plurality of protrusions and the second heat-conducting member. The second heat-conducting colloid is located in the sub-cavities.

9. The protection assembly according to claim 1, characterized in that: The exterior of the housing is provided with an antistatic coating.

10. A display device, characterized in that: The protective component of the display device comprises the protective component of any one of claims 1 to 9.

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