Detection circuit of intelligent power module
By designing an intelligent power module detection circuit, which provides power and switches connection states, the problem of insufficient testing of high-power IPM modules under conventional experimental environments is solved, and effective testing under high temperature and high humidity conditions is achieved.
Patent Information
- Application Number
- CN202211656955.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-22
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2042-12-22
AI Technical Summary
High-power IPM modules cannot achieve the required testing results under normal experimental conditions, especially in simulating real working conditions under high temperature and high humidity, resulting in insufficient testing.
A smart power module detection circuit was designed, including a power supply unit, a detection unit, a control unit, and a conversion unit. By providing power, detecting electrical signals, and switching connection states, the circuit simulates the working state of the IPM and realizes high temperature and high humidity testing of the IPM.
It enables effective testing of high-power IPM modules under normal experimental conditions, simulating their real working state and ensuring that parameters do not change beyond specifications under high temperature and high humidity conditions.
Smart Images

Figure CN118244020B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of intelligent power modules, and more specifically, to a detection circuit for an intelligent power module. Background Technology
[0002] An IPM (Intelligent Power Module) contains drive circuitry and power devices, and can be used for driving three-phase synchronous motors and brushless DC motors. An IPM has three independent bridge arms, six forward-conducting power devices, and six reverse-conducting power devices. Different motors have different control algorithms and operating sequences. However, each power device operates in turn under its rated voltage and current conditions, so the test power of the entire system represents the power under normal operating conditions.
[0003] The IPM design process requires high-temperature and high-humidity testing. Under conditions of 85% ± 2% temperature and 85% ± 5% humidity, the IPM module is tested for 1000 hours, and the parameters before and after the test must not exceed the specifications. This test requires the IPM module to withstand reverse bias stress and the thermal effects generated by forward current conduction under operating conditions, i.e., rated load conditions.
[0004] However, for medium to high power IPM modules, the system operating power exceeds 1000W. Long-term operation at such power requires the motor to operate under load at its rated power for extended periods, necessitating a dynamometer or a large motor load simulator. This system requires significant space and equipment, and the long-term operation of the motor makes it difficult to meet safety requirements for the testing environment. Furthermore, IPM testing requires 22 modules per group, with at least one group tested simultaneously, necessitating the simultaneous operation of at least 22 sets of motor loads. This is generally impossible to achieve in typical experimental environments. Therefore, the common practice is to place 22 IPM modules in a testing temperature chamber while 22 motors run unloaded. In this unloaded state, the power devices on the IPM have very low conduction current, typically below 1A, which is insufficient to meet the normal rated conduction current of the power devices. Consequently, the tested IPM modules cannot truly withstand the testing conditions, failing to achieve the testing objective.
[0005] The information disclosed above in the background section is only intended to enhance the understanding of the background art of the art described herein. Therefore, the background art may contain certain information that does not constitute prior art known to those skilled in the art in this country. Summary of the Invention
[0006] The main objective of this application is to provide a detection circuit for an intelligent power module to solve the problem that high-power IPMs in the prior art cannot achieve the required testing results under normal experimental conditions.
[0007] According to one aspect of the present invention, a detection circuit for a smart power module is provided, comprising: a power supply unit for providing power to a plurality of smart power modules under test in a unit under test; and a detection unit for detecting electrical signals of the plurality of smart power modules under test in the unit under test under different connection states, wherein the connection states include a first connection state, a second connection state, and a third connection state, wherein the first connection state is a state in which the plurality of smart power modules under test in the unit under test are connected in parallel, the second connection state is a state in which the plurality of smart power modules under test in the unit under test are connected in series, and the third connection state is a state in which any two smart power modules under test in the unit under test are not connected. When the plurality of smart power modules under test in the unit under test are in the first connection state, the detection unit is used to detect... The test unit measures the current signal of each of the smart power modules under test. When multiple smart power modules under test in the test unit are in the second connection state, the detection unit detects the voltage signal of each smart power module under test. When multiple smart power modules under test in the test unit are in the third connection state, the detection unit detects the voltage signal of one smart power module under test. A control unit, electrically connected to the detection unit, generates a control signal based on the electrical signal. A conversion unit, electrically connected to both the power supply unit and the control unit, converts the initial connection state according to the control signal, changing the initial connection state to another connection state, which is one of the first connection state, the second connection state, and the third connection state.
[0008] Optionally, the detection circuit further includes: a power management unit, the power management unit having an output terminal, an input terminal, and a power supply terminal, the output terminal of the power management unit being electrically connected to the unit under test, the input terminal of the power management unit being electrically connected to the control unit, and the power supply terminal of the power management unit being electrically connected to the power supply unit. The power management unit is used to generate a switch control signal according to the control signal input by the control unit. The switch control signal is used to control the state of the switching devices of the intelligent power modules under test when the multiple intelligent power modules under test of the unit under test are in one of the connection states.
[0009] Optionally, when multiple smart power modules under test in the unit under test are in the first connection state, the power supply unit provides voltage to each smart power module under test, and the power management unit generates a first switch control signal and a second switch control signal. The first switch control signal controls the upper bridge arm of each smart power module under test to close and the lower bridge arm to open, and the second switch control signal controls the upper bridge arm of each smart power module under test to open and the lower bridge arm to close. Under the control of the first switch control signal, the detection unit detects the current signal of the switching device of the upper bridge arm of each smart power module under test. Under the control of the second switch control signal, the detection unit detects the current signal of the switching device of the lower bridge arm of each smart power module under test.
[0010] Optionally, when multiple smart power modules under test in the unit under test are in the second connection state, the power supply unit provides a first current and a second current to each smart power module under test. The first current and the second current are equal in magnitude and opposite in direction. The power management unit generates a third switch control signal, a fourth switch control signal, and a fifth switch control signal. The third switch control signal is used to control the U-phase switching device of each smart power module under test to close and the V-phase and W-phase switching devices to open. The fourth switch control signal is used to control the V-phase switching device of each smart power module under test to close and the U-phase and W-phase switching devices to open. The fifth switch control signal is used to control the W-phase switching device of each smart power module under test to close and the U-phase and V-phase switching devices to open. Under the control of the third switch control signal, the power supply unit provides the first current to each smart power module under test. The detection unit detects the first voltage signal of the U-phase switching device of the smart power module under test. When the first voltage signal of the U-phase switching device reaches a first threshold, the power supply unit provides the first current to each smart power module under test. The power supply module provides the second current, and the detection unit is used to detect the second voltage signal of the U-phase switching device of the intelligent power module under test; under the control of the fourth switch control signal, the power supply unit provides the first current to each of the intelligent power modules under test, and the detection unit is used to detect the first voltage signal of the V-phase switching device of the intelligent power module under test. When the first voltage signal of the V-phase switching device reaches a second threshold, the power supply unit provides the second current to each of the intelligent power modules under test, and the detection unit is used to detect the second voltage signal of the V-phase switching device of the intelligent power module under test; under the control of the fifth switch control signal, the power supply unit provides the first current to each of the intelligent power modules under test, and the detection unit is used to detect the first voltage signal of the W-phase switching device of the intelligent power module under test. When the first voltage signal of the W-phase switching device reaches a second threshold, the power supply unit provides the second current to each of the intelligent power modules under test, and the detection unit is used to detect the second voltage signal of the W-phase switching device of the intelligent power module under test.
[0011] Optionally, when multiple smart power modules under test in the unit under test are in the second connection state, the power supply unit provides a third current and a fourth current to each smart power module under test. The third current and the fourth current are equal in magnitude and opposite in direction. The power management unit generates a third switch control signal, a fourth switch control signal, and a fifth switch control signal. The third switch control signal controls the U-phase switching devices of each smart power module under test to close and the V-phase and W-phase switching devices to open. The fourth switch control signal controls the V-phase switching devices of each smart power module under test to close and the U-phase and W-phase switching devices to open. The fifth switch control signal controls the W-phase switching devices of each smart power module under test to close and the U-phase and V-phase switching devices to open. Under the control of the third switch control signal, the detection unit detects the third voltage signal of the U-phase switching device of the smart power module under test. The power supply unit provides the third current to each smart power module under test. When the provision of the third current reaches a time threshold, the power supply unit... The intelligent power module under test provides the fourth current, and the detection unit is used to detect the fourth voltage signal of the U-phase switching device of the intelligent power module under test; under the control of the fourth switch control signal, the detection unit is used to detect the third voltage signal of the V-phase switching device of the intelligent power module under test, and the power supply unit provides the third current to each of the intelligent power modules under test. When the provision of the third current reaches a time threshold, the power supply unit provides the fourth current to each of the intelligent power modules under test, and the detection unit is used to detect the fourth voltage signal of the V-phase switching device of the intelligent power module under test; under the control of the fifth switch control signal, the detection unit is used to detect the third voltage signal of the W-phase switching device of the intelligent power module under test, and the power supply unit provides the third current to each of the intelligent power modules under test. When the provision of the third current reaches a time threshold, the power supply unit provides the fourth current to each of the intelligent power modules under test, and the detection unit is used to detect the fourth voltage signal of the W-phase switching device of the intelligent power module under test.
[0012] Optionally, when multiple smart power modules under test in the unit under test are in the third connection state, the power supply unit provides a fifth current to each smart power module under test, and the power management unit generates a sixth switch control signal, wherein the sixth switch control signal is used to control the forward switching device of each smart power module under test to open and the reverse switching device to close; under the control of the sixth switch control signal, the detection unit is used to detect the fifth voltage signal of the reverse switching device of each smart power module under test.
[0013] Optionally, the power management unit includes: a first microcontroller for processing the control signal and generating a first buffer signal and a second buffer signal based on the control signal output by the control unit; a first buffer module electrically connected to the first microcontroller, the first buffer module being used to generate a control signal for controlling the drive circuit of the conversion unit based on the first buffer signal; a signal generation module electrically connected to the first microcontroller, used to generate gate control signals for a plurality of the intelligent power modules under test based on the second buffer signal; and a second buffer module electrically connected to the signal generation module, the second buffer module being used to generate the switching control signal based on the gate control signal.
[0014] Optionally, the conversion unit includes multiple first conversion modules and second conversion modules. The first conversion module is connected to the power supply terminal of the smart power module under test and includes two diodes, two NMOSFETs, and an NMOSFET driving circuit. The second conversion module is connected to the ground terminal of the smart power module under test and includes two diodes, two NMOSFETs, and an NMOSFET driving circuit. The anodes of the two diodes are electrically connected, and the cathodes of the two diodes are respectively electrically connected to the smart power module under test. The control terminals of the two NMOSFETs are respectively connected to the NMOSFET driving circuit. The drains of the two NMOSFETs are connected, and the sources of the two NMOSFETs are respectively electrically connected to the power supply terminal or the ground terminal of the smart power module under test. When all NMOSFETs of the first conversion module and the second conversion module are closed, the conversion unit converts the connection state to the first connection state. When the NMOSFETs of the first conversion module and the second conversion module are closed alternately, the conversion unit converts the connection state to the second connection state. When two NMOSFETs of the first conversion module and the second conversion module are closed and open respectively, the conversion unit converts the connection state to the third connection state.
[0015] Optionally, the detection circuit further includes a protection unit, the two ends of which are respectively connected to the unit under test and the power supply unit. The protection unit is used to protect the detection circuit and includes at least one voltage divider device.
[0016] Optionally, the power supply unit includes: a first power supply module connected to the bus of the unit under test, used to provide bus voltage to the intelligent power module under test; and a second power supply module connected to each intelligent power module under test in the unit under test, used to provide power to the power drive circuit of each intelligent power module under test.
[0017] Optionally, the detection unit includes: a current detection module connected to each intelligent power module under test in the unit under test, for detecting the current signal of each intelligent power module under test; a current amplification module electrically connected to the current detection module, for amplifying the current signal; a voltage detection module connected to each intelligent power module under test in the unit under test, for detecting the voltage signal of each intelligent power module under test; and a voltage amplification module electrically connected to the voltage detection module, for amplifying the voltage signal.
[0018] Optionally, the control unit includes: an analog-to-digital conversion module electrically connected to the detection unit, used to convert the analog signal detected by the detection unit into a digital signal; and a second microcontroller electrically connected to the analog-to-digital conversion module, used to process the digital signal and generate the control signal based on the digital signal.
[0019] In this embodiment of the invention, the IPM is detected by a detection circuit consisting of a power supply unit, a detection unit, a control unit, and a conversion unit. First, the power supply unit provides the power required by the IPM. The detection unit can be used to detect IPMs in different connection states. The control unit inputs control signals to the conversion unit, which then realizes the conversion of the connection states between multiple IPMs. By simulating the working state of the IPM through control timing, IPMs in different connection states can be tested, thereby solving the technical problem that high-power IPMs cannot achieve the testing effect under conventional experimental environments in the prior art. Attached Figure Description
[0020] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:
[0021] Figure 1 A circuit diagram of the detection circuit of an intelligent power module according to an embodiment of this application is shown;
[0022] Figure 2A circuit diagram of a smart power module according to an embodiment of this application is shown;
[0023] Figure 3 A circuit diagram is shown for detecting parallel intelligent power modules according to an embodiment of this application;
[0024] Figure 4 A circuit diagram for detecting a series-connected smart power module is shown according to an embodiment of this application;
[0025] Figure 5 A circuit diagram for detecting a series-connected smart power module is shown according to another embodiment of this application;
[0026] Figure 6 A circuit diagram for detecting a smart power module according to an embodiment of this application is shown;
[0027] Figure 7 A circuit diagram of a power management unit according to an embodiment of this application is shown;
[0028] Figure 8 A circuit diagram of a signal generation module according to an embodiment of this application is shown;
[0029] Figure 9 A circuit diagram of a conversion unit according to an embodiment of this application is shown;
[0030] Figure 10 A circuit diagram of a conversion unit and a smart power module according to an embodiment of this application is shown;
[0031] Figure 11 A circuit diagram of a protection unit according to an embodiment of this application is shown;
[0032] Figure 12 A circuit diagram of a detection unit according to an embodiment of this application is shown;
[0033] Figure 13 A circuit diagram of a control unit according to an embodiment of this application is shown.
[0034] The above figures include the following reference numerals:
[0035] 10. Power supply unit; 20. Detection unit; 30. Control unit; 40. Conversion unit; 50. Intelligent power module under test; 51. First microcontroller; 52. First buffer module; 53. Signal generation module; 60. Positive power supply terminal; 70. Voltage divider device; 80. Negative power supply terminal; 90. Current detection module; 100. Current amplification module; 110. Voltage detection module; 120. Voltage amplification module; 130. Analog-to-digital conversion module; 140. Second microcontroller. Detailed Implementation
[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.
[0037] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.
[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0039] It should be understood that when an element (such as a layer, film, region, or substrate) is described as being "on" another element, the element may be directly on the other element, or there may be an intermediate element present. Furthermore, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element, or "connected" to the other element via a third element.
[0040] As mentioned in the background section, high-power IPMs in the prior art cannot achieve the required testing results under normal experimental conditions. In order to solve the above problem, a typical embodiment of this application provides a detection circuit for an intelligent power module.
[0041] According to an embodiment of this application, a detection circuit for an intelligent power module is provided.
[0042] Figure 1 This is a circuit diagram of the detection circuit of the intelligent power module according to an embodiment of this application. Figure 1 As shown, the circuit includes:
[0043] Power supply unit 10 is used to provide power to multiple smart power modules 50 under test in the unit under test;
[0044] In the above circuit, the intelligent power module is as follows: Figure 2 As shown, the power supply unit includes the internal drive circuitry of the module, a three-phase circuit (U, V, W), with each phase divided into an upper bridge arm and a lower bridge arm. Each bridge arm includes two switching devices: a forward switching device and a reverse switching device. The power supply unit can be a programmable power supply or any other power supply that ensures the normal operation of the IPM.
[0045] The detection unit 20 is used to detect the electrical signals of multiple smart power modules 50 under test in the test unit under different connection states. The connection states include a first connection state, a second connection state, and a third connection state. The first connection state is that the multiple smart power modules 50 under test in the test unit are connected in parallel. The second connection state is that the multiple smart power modules 50 under test in the test unit are connected in series. The third connection state is that any two smart power modules 50 under test in the test unit are not connected. When the multiple smart power modules 50 under test in the test unit are in the first connection state, the detection unit 20 is used to detect the current signal of each smart power module 50 under test. When the multiple smart power modules 50 under test in the test unit are in the second connection state, the detection unit 20 is used to detect the voltage signal of each smart power module 50 under test. When the multiple smart power modules 50 under test in the test unit are in the third connection state, the detection unit 20 detects the voltage signal of one smart power module 50 under test.
[0046] In the circuit described above, the detection unit can be an electronic circuit board. This unit is used to test IPMs in different connection states and can detect both voltage and current. The IPM testing process employs timing conversion. Power devices in each half-arm of each phase of each IPM under test undergo continuous forward and reverse bias withstand voltage tests, as well as forward and reverse conduction power current tests. The transitions between operating states are identical to those in actual IPM application environments, thus simulating the true operating state of the IPM.
[0047] The control unit 30 is electrically connected to the detection unit 20, and the control unit 30 is used to generate a control signal based on the electrical signal.
[0048] In the aforementioned circuit, the control unit can be an electronic circuit board. The control unit processes the input analog signals and then issues control commands to control the conversion unit. Simultaneously, it can also issue control commands to control the power supply unit, changing the power supply mode and state to supply power to the IPM. When the IPM or detection circuit malfunctions, various status indicators can be provided, enabling those skilled in the art to determine the operating status of the test circuit.
[0049] The conversion unit 40 is electrically connected to the power supply unit 10 and the control unit 30 respectively. The conversion unit 40 is used to convert the initial connection state according to the control signal, and to change the initial connection state to other connection states, which are one of the first connection state, the second connection state and the third connection state.
[0050] In the above circuit, the conversion unit can be an electronic circuit board. After receiving the control signal, the conversion unit can convert all the IPM modules under test into a parallel relationship, a series relationship, or a single module test state.
[0051] In this embodiment of the invention, the IPM is detected by a detection circuit consisting of a power supply unit, a detection unit, a control unit, and a conversion unit. First, the power supply unit provides the power required by the IPM. The detection unit can be used to detect IPMs in different connection states. The control unit inputs control signals to the conversion unit, which then realizes the conversion of the connection states between multiple IPMs. By simulating the working state of the IPM through control timing, IPMs in different connection states can be tested, thereby solving the technical problem that high-power IPMs cannot achieve the testing effect under conventional experimental environments in the prior art.
[0052] According to a specific embodiment of this application, the detection circuit further includes a power management unit, which has an output terminal, an input terminal, and a power supply terminal. The output terminal of the power management unit is electrically connected to the unit under test, the input terminal of the power management unit is electrically connected to the control unit, and the power supply terminal of the power management unit is electrically connected to the power supply unit. The power management unit is used to generate a switch control signal based on the control signal input from the control unit. The switch control signal is used to control the state of the switching devices of the intelligent power modules under test when multiple intelligent power modules under test are in one of the above-mentioned connection states. In the above circuit, the power management unit can receive the control signal from the control unit, output control information, and provide a switch signal for each IPM module under test.
[0053] To test each IPM in parallel operation, according to a specific embodiment of this application, when multiple IPMs in the unit under test are in the first connection state, the power supply unit provides voltage to each IPM, and the power management unit generates a first switch control signal and a second switch control signal. The first switch control signal controls the upper bridge arm of each IPM to close and the lower bridge arm to open, and the second switch control signal controls the upper bridge arm of each IPM to open and the lower bridge arm to close. Under the control of the first switch control signal, the detection unit detects the current signal of the switching device in the upper bridge arm of each IPM; under the control of the second switch control signal, the detection unit detects the current signal of the switching device in the lower bridge arm of each IPM. In the above circuit, as... Figure 3 As shown, the conversion module will convert all IPMs under test to a parallel state. When testing the withstand voltage of all upper arms in all IPMs, all lower arms are opened and the upper arms are closed. Then, the test high voltage is increased or decreased between the bus VCC and GND to subject all upper arms to forward bias and the reverse switching devices to reverse bias. When testing the withstand voltage of all lower arms in all IPMs, all upper arms are opened and the lower arms are closed. Then, the test high voltage is increased or decreased between the bus VCC and GND to subject all lower arms to forward bias and the reverse switching devices to reverse bias. After a certain period of time, the withstand voltage process is stopped.
[0054] To test each IPM in series, according to another specific embodiment of this application, when multiple IPMs in the unit under test are in the second connection state, the power supply unit provides a first current and a second current to each IPM. The first current and the second current are equal in magnitude and opposite in direction. The power management unit generates a third switch control signal, a fourth switch control signal, and a fifth switch control signal. The third switch control signal is used to control the U-phase switching devices of each IPM to close and the V-phase and W-phase switching devices to open. The aforementioned fourth switch control signal is used to control the V-phase switching devices of each of the aforementioned smart power modules under test to close and the U-phase and W-phase switching devices to open. The aforementioned fifth switch control signal is used to control the W-phase switching devices of each of the aforementioned smart power modules under test to close and the U-phase and V-phase switching devices to open. Under the control of the aforementioned third switch control signal, the aforementioned power supply unit provides the aforementioned first current to each of the aforementioned smart power modules under test. The aforementioned detection unit is used to detect the first voltage signal of the U-phase switching device of the aforementioned smart power module under test. When the first voltage signal of the U-phase switching device reaches the first threshold... At the same time, the power supply unit provides the second current to each of the aforementioned intelligent power modules under test, and the detection unit is used to detect the second voltage signal of the switching device of the U phase of the intelligent power module under test; under the control of the fourth switch control signal, the power supply unit provides the first current to each of the aforementioned intelligent power modules under test, and the detection unit is used to detect the first voltage signal of the switching device of the V phase of the intelligent power module under test; when the first voltage signal of the switching device of the V phase reaches the second threshold, the power supply unit provides the second current to each of the aforementioned intelligent power modules under test, and the detection unit... The detection unit is used to detect the second voltage signal of the switching device of the V phase of the aforementioned intelligent power module under test; under the control of the aforementioned fifth switch control signal, the power supply unit provides the aforementioned first current to each of the aforementioned intelligent power modules under test, the detection unit is used to detect the first voltage signal of the switching device of the W phase of the aforementioned intelligent power module under test, and when the first voltage signal of the switching device of the W phase reaches the second threshold, the power supply unit provides the aforementioned second current to each of the aforementioned intelligent power modules under test, and the detection unit is used to detect the second voltage signal of the switching device of the W phase of the aforementioned intelligent power module under test. In the above circuit, as shown... Figure 4As shown, the conversion unit converts the IPM's connection state to a series state. First, the U phase is tested. A constant first current is applied to the power supply, and all upper and lower bridge arms of the U phase of the tested IPM module are turned on, while the V and W phases are turned off. All current flows through the U phase, with all odd-numbered U phases having forward current flow and all even-numbered IPM modules having reverse U phase conduction. The detection unit monitors the conduction voltage of the upper and lower bridge power transistors of the U phase, processes this voltage, and sends it to the main control board for analog-to-digital conversion to obtain a digital voltage. Then, it controls the power supply to output a second current opposite to the first current, thus ensuring that the U phases of odd-numbered IPM modules conduct in reverse while those of even-numbered IPM modules conduct in forward current. Voltage is also collected. When the voltage reaches a target value, the current is stopped; this target value represents that the internal junction temperature of the device has reached the required level. Then, the V and W phases are tested using the same method.
[0055] To test each IPM in series, according to another specific embodiment of this application, when multiple IPMs in the unit under test are in the second connection state, the power supply unit provides a third current and a fourth current to each IPM. The third current and the fourth current are equal in magnitude and opposite in direction. The power management unit generates a third switch control signal, a fourth switch control signal, and a fifth switch control signal. The third switch control signal is used to control the closing of the U-phase switching device and the switching devices of the V-phase and W-phase of each IPM. When the device is disconnected, the fourth switch control signal is used to control the V-phase switching device of each of the above-mentioned intelligent power modules under test to close and the U-phase and W-phase switching devices to open. The fifth switch control signal is used to control the W-phase switching device of each of the above-mentioned intelligent power modules under test to close and the U-phase and V-phase switching devices to open. Under the control of the third switch control signal, the detection unit is used to detect the third voltage signal of the U-phase switching device of the intelligent power module under test. The power supply unit provides the third current to each of the above-mentioned intelligent power modules under test. When the third current is provided reaches a time threshold... In the following situation, the power supply unit provides the fourth current to each of the aforementioned smart power modules under test, and the detection unit is used to detect the fourth voltage signal of the U-phase switching device of the smart power module under test; under the control of the fourth switching control signal, the detection unit is used to detect the third voltage signal of the V-phase switching device of the smart power module under test, and the power supply unit provides the third current to each of the aforementioned smart power modules under test; when the provision of the third current reaches a time threshold, the power supply unit provides the fourth current to each of the aforementioned smart power modules under test. The detection unit is used to detect the fourth voltage signal of the switching device of the V phase of the aforementioned intelligent power module under test; under the control of the aforementioned fifth switching control signal, the detection unit is used to detect the third voltage signal of the switching device of the W phase of the aforementioned intelligent power module under test, and the power supply unit provides the aforementioned third current to each of the aforementioned intelligent power modules under test. When the provision of the aforementioned third current reaches a time threshold, the power supply unit provides the aforementioned fourth current to each of the aforementioned intelligent power modules under test, and the detection unit is used to detect the fourth voltage signal of the switching device of the W phase of the aforementioned intelligent power module under test. In the above circuit, as... Figure 5As shown, the conversion unit converts the IPM connection state to a series state. First, the U phase is tested. A constant third current is added to the power supply, turning on all upper and lower bridge arms of the U phase of the tested IPM module, while turning off the V and W phases. All current flows through the U phase, with all odd-numbered U phases having forward current and all even-numbered IPM modules having reverse U phase current. The detection unit monitors the conduction voltage of the upper and lower bridge power transistors of the U phase, processes this voltage, and sends it to the main control board for analog-to-digital conversion to obtain a digital voltage. Then, it controls the power supply to output a second current opposite to the first current, thus turning on the U phase of odd-numbered IPM modules in reverse and the U phase of even-numbered IPM modules in forward current. Voltage is also collected. A timed current loading method is used; when the forward current reaches the target value, the current is turned off at a set time. This target value represents the internal junction temperature of the device reaching the required level. Then, the V and W phases are tested using the same method.
[0056] To test an IPM, according to another specific embodiment of this application, when multiple IPMs in the unit under test are in the third connection state, the power supply unit provides a fifth current to each IPM, and the power management unit generates a sixth switch control signal. This sixth switch control signal controls the forward switching device of each IPM to open and the reverse switching device to close. Under the control of the sixth switch control signal, the detection unit detects the fifth voltage signal of the reverse switching device of each IPM. In the above circuit, as... Figure 6 As shown, when the conversion unit switches the IPM connection state to the single IPM state, the control power supply provides the fifth current to test the reverse switching device. After a period of time, this state is stopped, the switching state is changed, and the junction temperature of the internal power device of each IPM reaches a target value.
[0057] According to another specific embodiment of this application, the above-mentioned power management unit, such as Figure 7As shown, the circuit includes: a first microcontroller 51, used to process the control signals and generate a first buffer signal and a second buffer signal based on the control signals output by the control unit; a first buffer module 52, electrically connected to the first microcontroller 51, used to generate control signals for controlling the drive circuit of the conversion unit based on the first buffer signal; a signal generation module 53, electrically connected to the first microcontroller 51, used to generate gate control signals for multiple smart power modules under test based on the second buffer signal; and a second buffer module, electrically connected to the signal generation module, used to generate the switch control signal based on the gate control signal. In this circuit, the first microcontroller can process the control signals and generate the first and second buffer signals based on the control signals output by the control unit. The first buffer module can generate control signals for the drive circuit of the conversion unit, and the second buffer module can generate switch control signals. The signal generation module is as follows: Figure 8 As shown, the signal generation module can generate multiple gate control signals for the aforementioned intelligent power module under test. This method allows the switching control signals input to the IPM to be grounded independently.
[0058] According to another specific embodiment of this application, the conversion unit includes multiple first conversion modules and second conversion modules. The first conversion module is connected to the power supply terminal of the smart power module under test and includes two diodes, two NMOSFETs, and an NMOSFET driving circuit. The second conversion module is connected to the ground terminal of the smart power module under test and includes two diodes, two NMOSFETs, and an NMOSFET driving circuit. The positive terminals of the two diodes are electrically connected, and the negative terminals of the two diodes are respectively electrically connected to the smart power module under test. The control terminals of the two NMOSFETs are respectively connected to the NMOSFET driving circuit. The drains of the two NMOSFETs are connected, and the sources of the two NMOSFETs are respectively electrically connected to the power supply terminal or the ground terminal of the smart power module under test. When all NMOSFETs of the first conversion module and the second conversion module are closed, the conversion unit converts the connection state to the first connection state. When the NMOSFETs of the first conversion module and the second conversion module are closed alternately, the conversion unit converts the connection state to the second connection state. When two NMOSFETs of the first conversion module and the second conversion module are closed and open respectively, the conversion unit converts the connection state to the third connection state. In the above circuit, Figure 9The conversion unit shown includes MOSFETs and diodes. After receiving the control state from the power management unit, the conversion unit can adjust the switching state of the IPM switching devices to connect all the IPM modules under test in parallel, in series, or in a single-module test state. For example, when all the MOSFETs connected to the bus terminals of the conversion unit are turned on, the buses of all the IPMs under test will be connected together. When all the MOSFETs connected to the ground terminals are turned on, all the IPM modules under test are connected to the ground terminals. This allows all the IPM modules to be connected in parallel. When the bus terminal switching MOSFETs and GND terminal switching MOSFETs on the power adapter board are turned on alternately (i.e., the odd-numbered IPM bus terminal MOSFETs are closed and the even-numbered IPM ground terminal MOSFETs are open, or the odd-numbered IPM bus terminal MOSFETs are open and the even-numbered IPM ground terminal MOSFETs are closed), all the IPM modules can be connected in series in the order of VCC-VCC-GND-GND-VCC-VCC. When all power devices on the left half of the VCC terminal of the conversion unit are turned on, and the MOSFET on the right half of the ground GND terminal of the corresponding IPM module under test is turned on, the power adapter board becomes a test state for a single IPM. Figure 10 This is a schematic diagram showing the connection between the conversion unit and the intelligent power module. For example... Figure 10 As shown, the intelligent power module includes multiple pins. Pin 2 is the high-side auxiliary power supply for the U-phase IGBT driver, pin 3 is the high-side auxiliary power supply for the V-phase IGBT driver, pin 4 is the high-side auxiliary power supply for the W-phase IGBT driver, pin 5 is the high-side U-phase signal input, pin 6 is the high-side V-phase signal input, pin 7 is the high-side W-phase signal input, pin 8 is the high-side common auxiliary power supply, pin 9 is common ground 1, pin 10 is the low-side U-phase signal input, pin 11 is the low-side V-phase signal input, pin 12 is the low-side W-phase signal input, pin 13 is the low-side common auxiliary power supply, pin 14 is the fault output, pin 15 is the short-circuit current detection input capacitor, pin 16 is common ground 2, pin 17 is the voltage output, pin 18 is the DC negative terminal of the W-phase, pin 19 is the DC negative terminal of the V-phase, pin 20 is the DC negative terminal of the U-phase, pin 21 is the W-phase output, pin 22 is the V-phase output, pin 23 is the U-phase output, pin 24 is the DC input positive terminal, and pin 25 is the DC negative terminal. The pin meanings and connection methods of the aforementioned intelligent power module are the same as those of existing intelligent power modules, and will not be repeated here. The MOSFETs in the aforementioned conversion unit can adopt a common-gate configuration, and all switching MOSFETs are 100V low-voltage MOSFETs with a maximum operating current greater than or equal to the operating current of the IPM module. The MOSFET drive circuit can be mounted on the same board, reducing interference from other units. The power supply for the MOSFET drive circuit can be provided by the power management unit.
[0059] To further protect the detection circuit, according to another specific embodiment of this application, the detection circuit further includes a protection unit, the two ends of which are respectively connected to the unit under test and the power supply unit. The protection unit is used to protect the detection circuit, and includes at least one voltage divider device. In the above circuit, the protection unit is as follows: Figure 11 As shown, the two ends of IPM50 are connected to the positive terminal 60 of the power supply and the voltage divider 70, respectively, and the other end of the voltage divider 70 is connected to the negative terminal 80 of the power supply. When a short circuit occurs in an IPM module during voltage testing, the voltage divider can be used to divide the voltage, and this protection unit can protect the power supply from damage. The voltage divider in the above circuit can be one or multiple.
[0060] According to another specific embodiment of this application, the power supply unit includes: a first power supply module connected to the bus of the unit under test, used to provide bus voltage to the intelligent power module under test; in the circuit, the first power supply module provides the bus voltage required for IPM operation, the voltage range being the voltage and current range that the power devices withstand during the DH1000 evaluation process; the power supply can operate in constant current mode, and has remote control function and interface, the interface being RS232 or RS485, which can communicate with a remote programmable computer or PC. A second power supply module connected to each intelligent power module under test in the unit under test, used to provide power to the power drive circuit of each intelligent power module under test. In the circuit, the second power supply can enable the drive circuits of all IPM modules under test to be in working state.
[0061] To further refine the composition of the detection unit, according to another specific embodiment of this application, such as... Figure 12 As shown, the detection unit includes: a current detection module 90, connected to each intelligent power module under test in the unit under test, for detecting the current signal of each intelligent power module under test; a current amplification module 100, electrically connected to the current detection module, for amplifying the current signal; a voltage detection module 110, connected to each intelligent power module under test in the unit under test, for detecting the voltage signal of each intelligent power module under test; and a voltage amplification module 120, electrically connected to the voltage detection module, for amplifying the voltage signal. In the circuit described above, the voltage detection module can detect the voltage of the upper and lower arms of each bridge arm in each IPM, and the current detection module can detect the current in each current test loop. The collected signals are then amplified and input to the control system for further processing.
[0062] According to another specific embodiment of this application, the control unit includes: an analog-to-digital conversion module 130, electrically connected to the detection unit, for converting the analog signal detected by the detection unit into a digital signal; and a second microcontroller 140, electrically connected to the analog-to-digital conversion module, for processing the digital signal and generating the control signal based on the digital signal. In the above circuit, the control unit is composed as follows: Figure 13 As shown, in the control unit, the main control circuit is an MCU (Microcontroller Unit). This MCU processes the analog signals input from the detection unit and then issues control commands to control the conversion unit to operate. It can also issue control commands to control the power supply unit, changing the power supply mode and state to supply power to the IPM (Integrated Power Module). When the IPM or detection circuit malfunctions, it can provide various status indicators, enabling those skilled in the art to determine the operating status of the test circuit.
[0063] It is obvious to those skilled in the art that the modules or steps of the present invention described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those described herein, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present invention is not limited to any particular combination of hardware and software.
[0064] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0065] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.
[0066] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.
[0067] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.
[0068] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.
[0069] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.
[0070] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.
[0071] In the above embodiments of the present invention, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0072] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units described above can be a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.
[0073] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0074] As can be seen from the above description, the embodiments of this application achieve the following technical effects:
[0075] The detection circuit for the intelligent power module of this application includes a power supply unit for providing power to multiple intelligent power modules under test in a test unit; a detection unit for detecting electrical signals of the multiple intelligent power modules under test in different connection states, including a first connection state, a second connection state, and a third connection state; a control unit electrically connected to the detection unit, which generates control signals based on the electrical signals; and a conversion unit electrically connected to both the power supply unit and the control unit, which converts the initial connection state to other connection states based on the control signals. By detecting the IPM through the detection circuit composed of the power supply unit, detection unit, control unit, and conversion unit, the power supply unit first provides the power required by the IPM. The detection unit can detect IPMs in different connection states. The control unit inputs control signals to the conversion unit, which then converts the connection states between multiple IPMs. By simulating the working state of the IPM through control timing, IPMs in different connection states can be tested, thus solving the technical problem in the prior art that high-power IPMs cannot achieve the required testing results under conventional experimental environments.
[0076] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A detection circuit for an intelligent power module, characterized in that, include: The power supply unit is used to provide power to multiple smart power modules under test in the unit under test. A detection unit is used to detect the electrical signals of multiple smart power modules under test in the test unit under different connection states. The connection states include a first connection state, a second connection state, and a third connection state. The first connection state is a parallel connection of multiple smart power modules in the test unit; the second connection state is a series connection of multiple smart power modules in the test unit; and the third connection state is a non-connection state between any two smart power modules in the test unit. When multiple smart power modules in the test unit are in the first connection state, the detection unit detects the current signal of each smart power module. When multiple smart power modules in the test unit are in the second connection state, the detection unit detects the voltage signal of each smart power module. When multiple smart power modules in the test unit are in the third connection state, the detection unit detects the voltage signal of one smart power module. A control unit is electrically connected to the detection unit, and the control unit is used to generate a control signal based on the electrical signal; A conversion unit is electrically connected to both the power supply unit and the control unit. The conversion unit is used to convert the initial connection state to another connection state based on the control signal. The initial connection state is one of the first connection state, the second connection state, and the third connection state. The conversion unit includes multiple first conversion modules and second conversion modules. The first conversion module is connected to the power supply terminal of the smart power module under test and includes two NMOSFETs. The second conversion module is connected to the ground terminal of the smart power module under test and includes two NMOSFETs. The drains of the two NMOSFETs are connected, and the sources of the two NMOSFETs are electrically connected to the power supply terminal or the ground terminal of the smart power module under test, respectively. When all NMOSFETs of the first conversion module and the second conversion module are closed, the conversion unit will switch the connection state to the first connection state; When the NMOSFETs of the first conversion module and the second conversion module are closed, the conversion unit will switch the connection state to the second connection state; When the two NMOSFETs of the first conversion module and the second conversion module are closed and open respectively, the conversion unit converts the connection state to the third connection state.
2. The detection circuit according to claim 1, characterized in that, The detection circuit further includes: A power management unit has an output terminal, an input terminal, and a power supply terminal. The output terminal of the power management unit is electrically connected to the unit under test (UUT), the input terminal of the power management unit is electrically connected to the control unit, and the power supply terminal of the power management unit is electrically connected to the power supply unit. The power management unit is used to generate a switch control signal based on the control signal input by the control unit. The switch control signal is used to control the state of the switching devices of the UUT when multiple UUT smart power modules of the UUT are in one of the connection states.
3. The detection circuit according to claim 2, characterized in that, When the multiple smart power modules under test in the unit under test are in the first connection state, the power supply unit provides voltage to each smart power module under test, and the power management unit generates a first switch control signal and a second switch control signal. The first switch control signal is used to control the upper bridge arm of each smart power module under test to close and the lower bridge arm to open, and the second switch control signal is used to control the upper bridge arm of each smart power module under test to open and the lower bridge arm to close. Under the control of the first switch control signal, the detection unit is used to detect the current signal of the switching device of the upper bridge arm of each of the smart power modules under test. Under the control of the second switch control signal, the detection unit is used to detect the current signal of the switching device of the lower bridge arm of each of the smart power modules under test.
4. The detection circuit according to claim 2, characterized in that, When multiple smart power modules under test in the unit under test are in the second connection state, the power supply unit provides a first current and a second current to each smart power module under test. The first current and the second current are equal in magnitude and opposite in direction. The power management unit generates a third switch control signal, a fourth switch control signal, and a fifth switch control signal. The third switch control signal is used to control the U-phase switching device of each smart power module under test to close and the V-phase and W-phase switching devices to open. The fourth switch control signal is used to control the V-phase switching device of each smart power module under test to close and the U-phase and W-phase switching devices to open. The fifth switch control signal is used to control the W-phase switching device of each smart power module under test to close and the U-phase and V-phase switching devices to open. Under the control of the third switch control signal, the power supply unit provides the first current to each of the intelligent power modules under test, and the detection unit is used to detect the first voltage signal of the U-phase switching device of the intelligent power module under test. When the first voltage signal of the U-phase switching device reaches the first threshold, the power supply unit provides the second current to each of the intelligent power modules under test, and the detection unit is used to detect the second voltage signal of the U-phase switching device of the intelligent power module under test. Under the control of the fourth switch control signal, the power supply unit provides the first current to each of the intelligent power modules under test, and the detection unit is used to detect the first voltage signal of the switching device of the V phase of the intelligent power module under test. When the first voltage signal of the switching device of the V phase reaches the second threshold, the power supply unit provides the second current to each of the intelligent power modules under test, and the detection unit is used to detect the second voltage signal of the switching device of the V phase of the intelligent power module under test. Under the control of the fifth switch control signal, the power supply unit provides the first current to each of the smart power modules under test, and the detection unit is used to detect the first voltage signal of the switching device of the W phase of the smart power module under test. When the first voltage signal of the switching device of the W phase reaches the second threshold, the power supply unit provides the second current to each of the smart power modules under test, and the detection unit is used to detect the second voltage signal of the switching device of the W phase of the smart power module under test.
5. The detection circuit according to claim 2, characterized in that, When the multiple smart power modules under test in the unit under test are in the second connection state, the power supply unit provides a third current and a fourth current to each smart power module under test. The third current and the fourth current are equal in magnitude and opposite in direction. The power management unit generates a third switch control signal, a fourth switch control signal, and a fifth switch control signal. The third switch control signal is used to control the U-phase switching device of each smart power module under test to close and the V-phase and W-phase switching devices to open. The fourth switch control signal is used to control the V-phase switching device of each smart power module under test to close and the U-phase and W-phase switching devices to open. The fifth switch control signal is used to control the W-phase switching device of each smart power module under test to close and the U-phase and V-phase switching devices to open. Under the control of the third switch control signal, the detection unit is used to detect the third voltage signal of the switching device of the U phase of the intelligent power module under test. The power supply unit provides the third current to each intelligent power module under test. When the third current reaches a time threshold, the power supply unit provides the fourth current to each intelligent power module under test. The detection unit is used to detect the fourth voltage signal of the switching device of the U phase of the intelligent power module under test. Under the control of the fourth switch control signal, the detection unit is used to detect the third voltage signal of the switching device of the V phase of the intelligent power module under test. The power supply unit provides the third current to each intelligent power module under test. When the third current reaches a time threshold, the power supply unit provides the fourth current to each intelligent power module under test. The detection unit is used to detect the fourth voltage signal of the switching device of the V phase of the intelligent power module under test. Under the control of the fifth switch control signal, the detection unit detects the third voltage signal of the switching device of the W phase of the intelligent power module under test. The power supply unit provides the third current to each intelligent power module under test. When the third current reaches a time threshold, the power supply unit provides the fourth current to each intelligent power module under test. The detection unit detects the fourth voltage signal of the switching device of the W phase of the intelligent power module under test.
6. The detection circuit according to claim 2, characterized in that, When multiple smart power modules under test in the unit under test are in the third connection state, the power supply unit provides a fifth current to each smart power module under test, and the power management unit generates a sixth switch control signal, wherein the sixth switch control signal is used to control the forward switching device of each smart power module under test to open and the reverse switching device to close: Under the control of the sixth switch control signal, the detection unit is used to detect the fifth voltage signal of the reverse switching device of each of the smart power modules under test.
7. The detection circuit according to claim 2, characterized in that, The power management unit includes: The first microcontroller is used to process the control signal and generate a first buffer signal and a second buffer signal according to the control signal output by the control unit. The first buffer module is electrically connected to the first microcontroller. The first buffer module is used to generate a control signal for controlling the drive circuit of the conversion unit based on the first buffer signal. The signal generation module is electrically connected to the first microcontroller and is used to generate gate control signals for multiple smart power modules under test based on the second buffer signal. The second buffer module is electrically connected to the signal generation module, and the second buffer module is used to generate the switch control signal according to the gate control signal.
8. The detection circuit according to claim 1, characterized in that, The first conversion module further includes two diodes and an NMOSFET driving circuit, and the second conversion module further includes two diodes and an NMOSFET driving circuit. The positive terminals of the two diodes are electrically connected, the negative terminals of the two diodes are electrically connected to the smart power module under test, and the control terminals of the two NMOSFETs are connected to the NMOSFET driving circuit.
9. The detection circuit according to claim 1, characterized in that, The detection circuit further includes: A protection unit is provided, with its two ends connected to the unit under test and the power supply unit, respectively. The protection unit is used to protect the detection circuit and includes at least one voltage divider device.
10. The detection circuit according to claim 1, characterized in that, The power supply unit includes: The first power supply module is connected to the bus of the unit under test and is used to provide bus voltage to the intelligent power module under test. The second power supply module is connected to each of the smart power modules under test in the unit under test, and is used to provide power to the power drive circuit of each smart power module under test.
11. The detection circuit according to claim 1, characterized in that, The detection unit includes: A current detection module is connected to each of the smart power modules under test in the unit under test, and is used to detect the current signal of each of the smart power modules under test; A current amplification module, electrically connected to the current detection module, is used to amplify the current signal; A voltage detection module is connected to each of the smart power modules under test in the unit under test, and is used to detect the voltage signal of each of the smart power modules under test; A voltage amplification module, electrically connected to the voltage detection module, is used to amplify the voltage signal.
12. The detection circuit according to claim 1, characterized in that, The control unit includes: An analog-to-digital converter module, electrically connected to the detection unit, is used to convert the analog signal detected by the detection unit into a digital signal; The second microcontroller is electrically connected to the analog-to-digital converter module and is used to process the digital signal and generate the control signal based on the digital signal.
Citation Information
Patent Citations
Device and method for measuring dynamic characteristics of wide bandgap power semiconductor field effect transistor
CN114720769A
Method and system for detecting switch adhesion of output end of power module
WO2019019082A1