A bonding machine with positioning function for semiconductor processing

Abstract

The present invention discloses a bonding machine with a positioning function for semiconductor processing, which relates to the technical field of bonding machines. It includes a support base, on which a driving device is installed. The driving device is fixedly connected with an installation shell, and the installation shell is fixedly connected with a first electric slide rail. A sliding block is slidably connected to the first electric slide rail. The sliding block is fixedly connected with an electric push rod, and the telescopic end of the electric push rod is fixedly connected with a second electric slide rail. An electric slider is slidably connected to the second electric slide rail. The electric slider of the second electric slide rail is fixedly connected with a first micro motor, and the output shaft of the first micro motor is fixedly connected with a rotating piece. A bonding tool is rotatably connected to the installation shell, and the driving device is provided with a lead wire. By bending the lead wire, the present invention increases the extrusion amount of the bonding tool on the lead wire, expands the extension range of the lead wire on the circuit board after being extruded by the bonding tool, thereby improving the fixing effect between the lead wire and the circuit board.

Description

Technical Field

[0001] The invention discloses a bonding machine with a positioning function for semiconductor processing, which relates to the technical field of bonding machines. Background Art

[0002] A wire bonding machine is a special device for automated wire bonding technology, which is used to precisely connect fine wires to the pins of chips and circuit boards. The working mode of the wire bonding machine is mainly to thermally press the wires through the bonding tool on it, melt the wires and adhere them to the pins of the chips and circuit boards, so as to realize the connection between the chips and the circuit boards.

[0003] During the process of wire bonding of chips and circuit boards by the wire bonding machine, due to the wires being relatively fine, when the bonding tool cuts off the wire, the connection area between the wire and the circuit board is small, and there are potential connection hazards between the wire and the circuit board, that is, the connection between the wire and the circuit board may not be firm, resulting in the disconnection between the wire and the circuit board, causing the chips and the circuit boards to be unable to be used normally, thus affecting the quality and progress of semiconductor chip processing. Summary of the Invention

[0004] The invention provides a bonding machine with a positioning function for semiconductor processing, aiming to overcome the disadvantage that the connection between the wire and the circuit board is not firm, resulting in the disconnection between the wire and the circuit board.

[0005] The technical solution is: a bonding machine with a positioning function for semiconductor processing, including a support base, the support base is fixedly connected with a workbench, the support base is provided with a driving device, a mounting shell is fixedly connected to one side of the driving device close to the workbench, a first electric slide rail is fixedly connected to the mounting shell, a sliding block is slidably connected to the first electric slide rail, an electric push rod is fixedly connected to one side of the sliding block away from the first electric slide rail, a second electric slide rail is fixedly connected to the telescopic end of the electric push rod, an electric slider is slidably connected to the second electric slide rail, a first micro motor is fixedly connected to the electric slider of the second electric slide rail, a rotating piece is fixedly connected to the output shaft of the first micro motor, symmetrically arranged dial rods are fixedly connected to the rotating piece, a bonding tool is rotatably connected to the mounting shell, a heating wire is installed inside the bonding tool, symmetrically arranged electric clamps are arranged inside the mounting shell, a wire is arranged on the driving device, the bonding tool and the symmetrically arranged electric clamps are both matched with the wire, a laser emitter for positioning is arranged on the driving device, and a rotating component for rotating the bonding tool and a suction component for absorbing waste gas are arranged on the mounting shell.

[0006] Further preferred scheme is that the axis of the output shaft of the first micro motor is collinear with the axis of the adjacent dial rod, and the axes of the symmetrically arranged dial rods do not intersect with the axis of the bonding tool, so as to bend the wire by the symmetrically arranged dial rods.

[0007] Further preferably, the rotating assembly includes a second micro-motor fixedly connected to the mounting shell. A friction wheel is fixedly connected to the output shaft of the second micro-motor. A friction member cooperating with the friction wheel is fixedly connected to one side of the splitting knife close to the mounting shell.

[0008] Further preferably, the air suction assembly includes symmetrically arranged gas collecting bottles, and the symmetrically arranged gas collecting bottles are both fixedly connected to the mounting shell. A flow guide pipe is communicated with one side of the gas collecting bottle close to the splitting knife. A one-way valve is arranged inside the flow guide pipe. The flow guide pipe penetrates through the mounting shell. An air suction pipe communicated with the symmetrically arranged flow guide pipes is rotatably connected inside the splitting knife. The air suction pipe is provided with uniformly arranged air suction holes. The air suction pipe and the ends of the symmetrically arranged flow guide pipes far from the gas collecting bottles are both fixedly connected. A piston plate is slidably connected inside the gas collecting bottle. A tension spring is fixedly connected between the piston plate and the adjacent gas collecting bottle. A traction assembly for moving the piston plate is arranged inside the gas collecting bottle.

[0009] Further preferably, the air suction pipe is circular ring-shaped, and the lead wire passes through the air suction pipe for enabling the air suction pipe to comprehensively absorb waste gas.

[0010] Further preferably, a connecting pipe is communicated with one side of the gas collecting bottle close to the splitting knife. A one-way valve is arranged inside the connecting pipe. A purification bottle is fixedly connected to the connecting pipe. The connecting pipe is communicated with the adjacent purification bottle. A blowing pipe is communicated with one side of the purification bottle far from the adjacent connecting pipe. Activated carbon is arranged inside the blowing pipe. A blowing member is fixedly connected to one end of the blowing pipe far from the adjacent purification bottle. The blowing member is provided with uniformly arranged blowing holes.

[0011] Further preferably, the uniformly arranged blowing holes on the blowing member incline in different directions for increasing the blowing area of the blowing member.

[0012] Further preferably, the traction assembly includes an iron block fixedly connected to one side of the adjacent gas collecting bottle far from the splitting knife. A lead wire cooperating with the iron block is wound around the iron block. Two ends of the lead wire are respectively electrically connected to the driving device and the heating wire. The iron block cooperates with the adjacent piston plate.

[0013] A further preferred solution is that it further includes a pressing assembly for pressing the lead. The pressing assembly is arranged on the splitting knife. The pressing assembly includes a fixing frame, and the fixing frame is fixedly connected between the symmetrically arranged air blowing pipes. The fixing frame is slidably connected to the splitting knife. The fixing frame is slidably connected with symmetrically arranged guide rods. Springs are fixedly connected between the guide rods and the fixing frame. A connecting plate is fixedly connected to one end of the guide rod away from the installation shell. A pressing ring is fixedly connected between the symmetrically arranged connecting plates. The pressing ring cooperates with the lead.

[0014] A further preferred solution is that the pressing ring is provided with circumferentially arranged protrusions on the side close to the fixing frame. The splitting knife is fixedly connected with circumferentially arranged ejector rods. The protrusions of the pressing ring cooperate with the adjacent ejector rods.

[0015] The beneficial effects are as follows: 1. In the present invention, the output shaft of the first micro motor drives the rotating piece to rotate, so that the rotating piece drives the symmetrically arranged dial rods to rotate. The symmetrically arranged dial rods bend the lead, increasing the extrusion amount of the splitting knife on the lead and expanding the extension range of the lead on the circuit board after being extruded by the splitting knife, thereby improving the fixing effect between the lead and the circuit board.

[0016] 2. The friction wheel drives the friction part to rotate, and the friction part drives the splitting knife to rotate, so that when a part of the lower end of the splitting knife is damaged, the rotating splitting knife can cut off the lead, thus ensuring the normal connection between the lead and the chip and the circuit board and ensuring the bonding quality and bonding effect of the chip.

[0017] 3. The wire is energized to form an electromagnet with the adjacent iron block and attract the adjacent piston plate. The gas collecting bottle stores the waste gas generated by melting the lead. Subsequently, the purified gas is blown out by the air blowing part, so that the purified gas cools the lead and speeds up the solidification speed of the lead, improving the stability of the lead. Description of the Drawings

[0018] Figure 1 It is a three-dimensional structure schematic diagram of the present invention;

[0019] Figure 2 It is a schematic diagram of the positional relationship among the installation shell, the first electric slide rail and other parts of the present invention;

[0020] Figure 3 It is a schematic diagram of the positional relationship among the rotating piece, the dial rod and other parts of the present invention;

[0021] Figure 4 It is a schematic diagram of the positional relationship among the splitting knife, the friction part and other parts of the present invention;

[0022] Figure 5 It is a schematic diagram of the lead bending process of the present invention;

[0023] Figure 6 Schematic diagram of the positional relationship of parts such as the gas collecting bottle and the diversion pipe of the present invention;

[0024] Figure 7 Schematic three-dimensional structure diagram of parts such as the piston plate and the iron block of the present invention;

[0025] Figure 8 Schematic diagram of the positional relationship of parts such as the diversion pipe and the air suction pipe of the present invention;

[0026] Figure 9 Schematic diagram of the positional relationship of the blowing pipe and the blowing member of the present invention;

[0027] Figure 10 Schematic three-dimensional structure diagram of parts such as the pressing ring and the ejector rod of the present invention.

[0028] Reference numerals: 101, support base; 102, workbench; 103, driving device; 104, mounting shell; 105, first electric slide rail; 106, sliding block; 107, electric push rod; 108, second electric slide rail; 109, first micro motor; 110, rotating piece; 111, lever; 112, splitting knife; 113, heating wire; 114, electric clamp; 115, lead wire; 201, second micro motor; 202, friction wheel; 203, friction member; 301, gas collecting bottle; 302, diversion pipe; 303, air suction pipe; 304, piston plate; 305, communicating pipe; 306, purification bottle; 307, blowing pipe; 308, blowing member; 401, iron block; 402, wire; 501, fixing frame; 502, guide rod; 503, connecting plate; 504, pressing ring; 505, ejector rod. Detailed implementation manners

[0029] Reference to an embodiment herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0030] Embodiment 1: A bonding machine with a positioning function for semiconductor processing, as Figures 1 - 5As shown in the figure, it includes a support base 101. The support base 101 is fixedly connected with a workbench 102 for placing a circuit board and a semiconductor chip. The support base 101 is equipped with a driving device 103. The driving device 103 is an existing device. The driving device 103 drives the installation shell 104 to move freely in three dimensions. The lower side of the driving device 103 is fixedly connected with an installation shell 104. The upper part of the installation shell 104 is fixedly connected with an annular first electric slide rail 105. The first electric slide rail 105 is slidably connected with a sliding block 106. The lower side of the sliding block 106 is fixedly connected with an electric push rod 107. The telescopic end of the electric push rod 107 faces downward. The telescopic end of the electric push rod 107 is fixedly connected with a second electric slide rail 108. The second electric slide rail 108 is slidably connected with an electric slider. The electric slider of the second electric slide rail 108 is fixedly connected with a first micro motor 109. The axis of the output shaft of the first micro motor 109 is perpendicular to but does not intersect with the axis of the installation shell 104. The output shaft of the first micro motor 109 is fixedly connected with a rotating plate 110. The axis of the output shaft of the first micro motor 109 is located above the center point of the rotating plate 110. The rotating plate 110 is fixedly connected with two symmetrically arranged toggle levers 111. The axis of the upper toggle lever 111 coincides with the axis of the output shaft of the first micro motor 109. The axes of the two symmetrically arranged toggle levers 111 do not intersect with the axis of the split knife 112, and are used to bend the lead 115 by the symmetrically arranged toggle levers 111. The lower end of the installation shell 104 is rotatably connected with a split knife 112. A heating wire 113 for heating the split knife 112 is installed inside the split knife 112. The heated split knife 112 performs hot pressing on the lead 115 to melt the lead 115. Two symmetrically arranged electric clamps 114 are arranged at the lower part inside the installation shell 104. The driving device 103 is provided with a lead 115. The lower end of the lead 115 is heated into a spherical shape by the heating wire 113 inside the split knife 112. Both the split knife 112 and the symmetrically arranged electric clamps 114 cooperate with the lead 115. The two electric clamps 114 clamp the lead 115. The split knife 112 performs hot pressing on the lead 115 to deform and disconnect the lead 115. The driving device 103 is provided with a laser emitter for positioning the welding point. The installation shell 104 is provided with a rotating component for rotating the split knife 112 and a suction component for sucking the waste gas generated when the lead 115 melts.

[0031] As Figure 3 and Figure 4 shown in the figure, the rotating component includes a second micro motor 201. The second micro motor 201 is fixedly connected to the lower part of the installation shell 104. The output shaft of the second micro motor 201 faces downward. The output shaft of the second micro motor 201 is fixedly connected with a friction wheel 202. The lower part of the split knife 112 is fixedly connected with a friction member 203 that cooperates with the friction wheel 202. The friction wheel 202 drives the friction member 203 to rotate.

[0032] As Figure 2 、 Figure 3 and Figures 6 - 9As shown, the air intake assembly includes two symmetrically arranged gas collecting bottles 301, both of which are fixedly connected to the middle and lower part of the mounting shell 104. A flow guide pipe 302 is connected to the lower side of each of the two gas collecting bottles 301. A one-way valve is arranged inside the flow guide pipe 302. The one-way valve of the flow guide pipe 302 is a micro one-way valve, which is an existing device and will not be further described. The micro one-way valve of the flow guide pipe 302 allows waste gas to enter the adjacent gas collecting bottle 301 through the flow guide pipe 302. The flow guide pipe 302 penetrates through the mounting shell 104. An air suction pipe 303 connected to the two flow guide pipes 302 is rotatably connected to the lower part inside the splitting knife 112. Air suction holes are evenly arranged on the lower side of the air suction pipe 303. The air suction holes of the air suction pipe 303 are used to suck away the waste gas generated when the lead wire 115 melts. The upper side of the air suction pipe 303 is fixedly connected to the lower ends of the two flow guide pipes 302. The air suction pipe 303 is circular, so that the air suction holes of the air suction pipe 303 are evenly arranged above the sphere of the lead wire 115. The lead wire 115 passes through the air suction pipe 303, which is used to enable the air suction pipe 303 to comprehensively absorb the waste gas. A piston plate 304 is hermetically and slidably connected to the lower part inside the gas collecting bottle 301. A tension spring for resetting the piston plate 304 is fixedly connected between the piston plate 304 and the adjacent gas collecting bottle 301. A connecting pipe 305 is connected to the lower side of the gas collecting bottle 301. A one-way valve is arranged inside the connecting pipe 305. The one-way valve of the connecting pipe 305 is a micro one-way valve. The micro one-way valve of the connecting pipe 305 allows the gas inside the gas collecting bottle 301 to enter the adjacent purification bottle 306 through the connecting pipe 305. The lower end of the connecting pipe 305 is fixedly connected to the purification bottle 306. The connecting pipe 305 is connected to the adjacent purification bottle 306. A blowing pipe 307 is connected to the lower side of the purification bottle 306. Activated carbon for purifying the waste gas is arranged inside the blowing pipe 307. A blowing member 308 is fixedly connected to the lower end of the blowing pipe 307. Blowing holes are evenly arranged on the blowing member 308. The blowing holes of the blowing member 308 face the lower end of the lead wire 115. The blowing holes evenly arranged on the blowing member 308 are inclined in different directions, which is used to increase the blowing area of the blowing member 308. No matter where the lead wire 115 is located, the wind blown out by the blowing member 308 can cool the lead wire 115 to improve the cooling speed of the lead wire 115. A traction assembly for moving the piston plate 304 is arranged inside the gas collecting bottle 301.

[0033] As Figure 6 and Figure 7As shown in the figure, the traction assembly includes an iron block 401. The iron block 401 is fixedly connected to the upper side of the adjacent gas collecting cylinder 301. A wire 402 that cooperates with it is wound around the iron block 401. The wire 402 has a surplus length, which is used to enable the bonding tool 112 and the mounting shell 104 to rotate normally. When the wire 402 is energized, the wire 402 and the adjacent iron block 401 form an electromagnet and generate magnetic force. The two ends of the wire 402 are respectively electrically connected to the driving device 103 and the heating wire 113. The current passing through the wire 402 enters the heating wire 113 and causes the heating wire 113 to start heating. The iron block 401 cooperates with the adjacent piston plate 304. When the wire 402 is energized and causes the adjacent iron block 401 to generate magnetic force, the iron block 401 attracts the adjacent piston plate 304, causing the piston plate 304 to move upward.

[0034] When the semiconductor chip needs to be wire-bonded, the operator places the circuit board and the chip on the workbench 102. Subsequently, the operator turns on the driving device 103. The laser emitter on the driving device 103 is turned on and positions the first welding point of the chip. After the positioning is completed, the driving device 103 drives the mounting shell 104 to move downward. The mounting shell 104 drives the wire 115 to move downward and approach the chip through two electric clamps 114. The mounting shell 104 drives the bonding tool 112 to move downward and approach the chip. At this time, the wire 402 is energized and supplies current to the heating wire 113, causing the heating wire 113 to heat the bottom of the bonding tool 112. When the wire 115 contacts the first welding point of the chip, the wire 115 is blocked by the chip and stops moving downward. At this time, the heated bonding tool 112 presses the sphere at the lower end of the wire 115, causing the sphere at the lower end of the wire 115 to deform under the simultaneous action of extrusion and heating. When the lower end of the wire 115 is fixed on the chip, the two electric clamps 114 release the wire 115. The driving device 103 drives the mounting shell 104 to move upward. At this time, the wire 402 is powered off, the heating wire 113 stops heating, and the mounting shell 104 drives the bonding tool 112 to move upward, and the bonding tool 112 disengages from the lower end of the wire 115.

[0035] During the energization of the wire 402, the iron block 401 and the adjacent wire 402 form an electromagnet and generate a magnetic force to attract the adjacent piston plate 304, causing the piston plate 304 to move upward and approach the adjacent iron block 401. The tension spring on the piston plate 304 is stretched. During the upward movement of the piston plate 304, the suction pipe 303 sucks away the waste gas generated by heating the lower sphere of the lead wire 115 through the suction holes thereon, avoiding the pollution of the external environment by the waste gas. The waste gas is sucked into the diversion pipe 302 and enters the adjacent gas collecting bottle 301. During the time when the wire 402 is energized, the piston plate 304 moves upward but does not contact the adjacent iron block 401. When the wire 402 is de-energized, the iron block 401 and the adjacent wire 402 no longer form an electromagnet. At this time, the piston plate 304 is no longer attracted by the magnetic force. Under the action of the tension of the spring on the piston plate 304, the piston plate 304 moves downward and presses the waste gas in the adjacent gas collecting bottle 301 into the adjacent purification bottle 306 through the adjacent connecting pipe 305. The activated carbon in the purification bottle 306 purifies the waste gas, enabling the purified gas to enter the adjacent blowing pipe 307. The gas in the blowing pipe 307 blows out from the blowing holes of the adjacent blowing member 308. The wind blown by the blowing member 308 cools the lower end of the heating wire 113, enabling the lower end of the lead wire 115 to solidify quickly, improving the fixing effect between the lead wire 115 and the chip. When the diversion pipe 302 resets, the blowing member 308 stops blowing.

[0036] After the driving device 103 drives the mounting shell 104 to move upward to the position where the lead 115 needs to be bent, the two electric clamps 114 clamp the lead 115, and the driving device 103 drives the mounting shell 104 to move horizontally, causing the lead 115 to bend. At this time, the first electric slide rail 105, the electric push rod 107, and the second electric slide rail 108 are activated. The sliding block 106 drives the electric push rod 107 to move along the first electric slide rail 105. When the axis of the lever 111 is perpendicular to the vertical plane of the horizontal movement of the mounting shell 104, the first electric slide rail 105 is closed, and the sliding block 106 stops moving. The telescopic end of the electric push rod 107 drives the second electric slide rail 108 to move downward. When the lead 115 is located between the axes of the two levers 111, the electric push rod 107 is closed. The second electric slide rail 108 drives the first micro motor 109 to approach the lead 115 through the electric slider thereon. When the output shaft of the first micro motor 109 drives the two levers 111 to approach the lead 115 through the rotating plate 110, and when the two levers 111 hold the lead 115 in the middle, the second electric slide rail 108 is closed, and the first micro motor 109 is turned on. The output shaft of the first micro motor 109 drives the rotating plate 110 to rotate, causing the rotating plate 110 to drive the lower lever 111 to move upward, and the lower lever 111 bends the lead 115. When the output shaft of the first micro motor 109 drives the rotating plate 110 to rotate 180°, the first micro motor 109 is turned off. When the laser emitter locates the second welding point on the circuit board, then the driving device 103 no longer drives the mounting shell 104 to move horizontally. The driving device 103 drives the mounting shell 104 to move downward, and the two electric clamps 114 drive the lead 115 to move downward and approach the second welding point of the circuit board. At this time, the second electric slide rail 108 is activated. The second electric slide rail 108 drives the first micro motor 109 to move away from the lead 115 through the electric slider thereon, so that the two levers 111 move away from the lead 115 and no longer clamp the lead 115 in the middle. The electric slider of the second electric slide rail 108 drives the first micro motor 109 to reset.

[0037] After the electric slider of the second electric slide rail 108 drives the first micro-motor 109 to reset, the wire 402 is electrified, causing the heating wire 113 to be electrified and heated. The gas collecting bottle 301 starts to pump air. The heating wire 113 heats the bottom of the splitting knife 112. When the lead wire 115 contacts the second welding point, the heated splitting knife 112 squeezes the lead wire 115, causing the lead wire 115 to deform under the dual action of pressure and heating. The waste gas generated by the heating and melting of the lead wire 115 is pumped away by the gas collecting bottle 301. The lead wire 115 adheres near the second welding point of the circuit board. After the lead wire 115 is bent by the above-mentioned lever 111, the squeezing amount of the lead wire 115 by the splitting knife 112 increases, and the diffusion area of the lead wire 115 on the circuit board when being squeezed by the splitting knife 112 increases. When the splitting knife 112 contacts the circuit board, the splitting knife 112 cuts off the lead wire 115, and the driving device 103 no longer drives the splitting knife 112 to move downward. Subsequently, the second micro-motor 201 starts. The output shaft of the second micro-motor 201 drives the friction wheel 202 to rotate. The friction wheel 202 drives the friction member 203 to rotate. The friction member 203 drives the splitting knife 112 to rotate by 10°. Since the wire 402 has a surplus, the wire 402 does not obstruct the rotation of the splitting knife 112 at this time. Subsequently, the output shaft of the second micro-motor 201 reverses and resets, causing the friction member 203 to reset. During the rotation of the splitting knife 112, the splitting knife 112 cuts the lead wire 115 to prevent the lead wire 115 from not being cut off by the splitting knife 112 and resulting in the lead wire 115 being unable to adhere to the circuit board. After the output shaft of the second micro-motor 201 resets, the driving device 103 drives the splitting knife 112 to move upward. At this time, the wire 402 is powered off, and the blowing member 308 blows air onto the lead wire 115 on the circuit board, causing the lead wire 115 to solidify quickly, avoiding the lead wire 115 from detaching from the circuit board and resulting in the failure of semiconductor chip bonding.

[0038] When the driving device 103 drives the splitting knife 112 to move upward to the set position, the wire 402 is electrified again. At this time, the heating wire 113 heats the splitting knife 112 again. The heated splitting knife 112 transfers the heat to the lower end of the lead wire 115, causing the lower end of the lead wire 115 to melt and form a sphere. During this process, the waste gas generated by the lead wire 115 is stored in the gas collecting bottle 301. Subsequently, the wire 402 is powered off, and the blowing member 308 blows air and cools the sphere at the lower end of the lead wire 115, causing it to solidify quickly and ensuring the stability of the sphere at the lower end of the lead wire 115. Repeat all the above operations to continuously bond the semiconductor chips. When all the semiconductor chips are bonded, the operator turns off the driving device 103, the first electric slide rail 105, the electric push rod 107, the second electric slide rail 108, the first micro-motor 109, the electric clamp 114, and the second micro-motor 201.

[0039] Embodiment 2: On the basis of Embodiment 1, as Figure 6 、 Figure 8 and Figure 10As shown, it further includes a pressing component for pressing the lead 115. The pressing component is arranged below the splitting blade 112. The pressing component includes a fixing frame 501. The fixing frame 501 is fixedly connected between two symmetrically arranged air blowing pipes 307. The fixing frame 501 is slidably connected to the lower part of the splitting blade 112. Two symmetrically arranged guide rods 502 are slidably connected to the fixing frame 501. A spring for resetting the fixing frame 501 is fixedly connected between the guide rods 502 and the fixing frame 501. The lower ends of the two guide rods 502 are both fixedly connected with connecting plates 503. A pressing ring 504 is fixedly connected between the two symmetrically arranged connecting plates 503. The pressing ring 504 is located at the lower end of the splitting blade 112. The pressing ring 504 cooperates with the lead 115. The pressing ring 504 presses the lead 115 to deform the lead 115 and increase the contact area between the lead 115 and the circuit board, thereby improving the fixing effect between the lead 115 and the circuit board. A circumferentially arranged protrusion is provided on the upper side of the pressing ring 504. A circumferentially arranged ejector rod 505 is fixedly connected to the lower part of the splitting blade 112. The protrusion of the pressing ring 504 cooperates with the adjacent ejector rod 505. When the ejector rod 505 presses the adjacent protrusion on the pressing ring 504, the pressing ring 504 moves downward and presses the lead 115.

[0040] During the process of the friction wheel 202 driving the friction member 203 to rotate, the friction member 203 drives the splitting blade 112 to rotate, and the splitting blade 112 drives the circumferentially arranged ejector rod 505 to rotate. When the ejector rod 505 contacts the adjacent protrusion on the pressing ring 504, the ejector rod 505 presses the adjacent protrusion on the pressing ring 504, causing the pressing ring 504 to move downward. The pressing ring 504 drives the symmetrically arranged connecting plates 503 to move downward, causing the connecting plates 503 to drive the adjacent guide rods 502 to move downward. The spring on the guide rod 502 is compressed. The pressing ring 504 approaches the lead 115 on the circuit board. When the pressing ring 504 contacts the lead 115 on the circuit board, the lead 115 on the circuit board is pressed by the pressing ring 504 and further deformed, making the diffusion range of the lead 115 on the circuit board larger, increasing the contact area between the lead 115 and the circuit board, thereby improving the fixing effect of the lead 115 and the circuit board, improving the stability of the lead 115 on the circuit board, ensuring the bonding quality and production quality of the semiconductor chip. When the friction wheel 202 reverses and resets, under the action of the spring force on the guide rod 502, the guide rod 502 drives the pressing ring 504 to move upward and reset through the connecting plate 503, and the pressing ring 504 loses contact with the lead 115.

[0041] Although the present disclosure has been shown and described with reference to specific exemplary embodiments thereof, those skilled in the art should understand that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents. Accordingly, the scope of the present disclosure should not be limited to the above-described embodiments, but should be determined not only by the appended claims but also by the equivalents of the appended claims.

Claims

1. A bonding machine with a positioning function for semiconductor processing, characterized in that: The invention comprises a support base (101), the support base (101) being fixedly connected to a workbench (102), the support base (101) being installed with a driving device (103), the driving device (103) being fixedly connected to a mounting shell (104) on a side close to the workbench (102), the mounting shell (104) being fixedly connected to a first electric slide rail (105), the first electric slide rail (105) being slidably connected to a sliding block (106), the sliding block (106) being fixedly connected to an electric push rod (107) on a side away from the first electric slide rail (105), the telescopic end of the electric push rod (107) being fixedly connected to a second electric slide rail (108), the second electric slide rail (108) being slidably connected to an electric slider, the electric slider of the second electric slide rail (108) being fixedly connected to a first micro-electric The first micro-motor (109) comprises a first micro-motor (109), an output shaft of the first micro-motor (109) is fixedly connected to a rotating plate (110), the rotating plate (110) is fixedly connected to a symmetrically arranged shifting rod (111), the mounting shell (104) is rotatably connected to a splitting knife (112), a heating wire (113) is installed inside the splitting knife (112), a symmetrically arranged electric clamp (114) is arranged inside the mounting shell (104), the driving device (103) is provided with a lead wire (115), the splitting knife (112) and the symmetrically arranged electric clamp (114) are both matched with the lead wire (115), the driving device (103) is provided with a laser transmitter for positioning, and the mounting shell (104) is provided with a rotating component for rotating the splitting knife (112) and an air intake component for absorbing exhaust gas; The axis of the output shaft of the first micromotor (109) is colinear with the axis of the adjacent lever (111), and the axes of the symmetrically arranged levers (111) do not intersect with the axis of the chopper (112), so that the symmetrically arranged levers (111) can bend the lead wire (115).

2. A bonding machine with positioning function for semiconductor processing according to claim 1, characterized in that: The rotating assembly comprises a second micro motor (201), the second micro motor (201) is fixedly connected to the mounting shell (104), the output shaft of the second micro motor (201) is fixedly connected to a friction wheel (202), and a friction member (203) cooperating with the friction wheel (202) is fixedly connected to a side of the chopper (112) close to the mounting shell (104).

3. A bonding machine with positioning function for semiconductor processing according to claim 2, characterized in that: The air intake assembly comprises symmetrically arranged gas collecting bottles (301), the symmetrically arranged gas collecting bottles (301) are all fixedly connected to the mounting shell (104), a side of the gas collecting bottle (301) close to the splitting knife (112) is connected to a flow guide pipe (302), a one-way valve is arranged inside the flow guide pipe (302), the flow guide pipe (302) passes through the mounting shell (104), and the inside of the splitting knife (112) is rotatably connected to an air intake pipe connected to the symmetrically arranged flow guide pipe (302). (303), the air intake pipe (303) is provided with evenly arranged air intake holes, the air intake pipe (303) is fixedly connected to one end of the symmetrically arranged flow guide pipe (302) away from the gas collecting bottle (301), the interior of the gas collecting bottle (301) is slidably connected with a piston plate (304), a tension spring is fixedly connected between the piston plate (304) and the adjacent gas collecting bottle (301), and a traction component for moving the piston plate (304) is provided inside the gas collecting bottle (301).

4. A bonding machine with positioning function for semiconductor processing according to claim 3, characterized in that: The air intake pipe (303) is in the shape of a ring, and the lead wire (115) passes through the air intake pipe (303) so as to enable the air intake pipe (303) to fully absorb the exhaust gas.

5. A bonding machine with positioning function for semiconductor processing according to claim 3, characterized in that: A connecting pipe (305) is connected to the side of the gas collecting bottle (301) close to the splitting knife (112), a one-way valve is arranged inside the connecting pipe (305), a purification bottle (306) is fixedly connected to the connecting pipe (305), the connecting pipe (305) is connected to an adjacent purification bottle (306), a side of the purification bottle (306) away from the adjacent connecting pipe (305) is connected to an air blowing pipe (307), activated carbon is arranged inside the air blowing pipe (307), and an end of the air blowing pipe (307) away from the adjacent purification bottle (306) is fixedly connected to a blowing member (308), the blowing member (308) is provided with evenly arranged blowing holes.

6. A bonding machine with positioning function for semiconductor processing according to claim 5, characterized in that: The evenly arranged blowing holes on the blowing member (308) are inclined in different directions, so as to increase the blowing area of ​​the blowing member (308).

7. A bonding machine with positioning function for semiconductor processing according to claim 5, characterized in that: The traction assembly comprises an iron block (401), the iron block (401) being fixedly connected to a side of the adjacent gas collecting bottle (301) away from the splitting knife (112), the iron block (401) being wound with a matching wire (402), the two ends of the wire (402) being electrically connected to the driving device (103) and the heating wire (113) respectively, and the iron block (401) being matched with the adjacent piston plate (304).

8. A bonding machine with positioning function for semiconductor processing according to claim 5, characterized in that: The invention also comprises a pressing component for pressing the lead wire (115), the pressing component being arranged on the chopping knife (112), the pressing component comprising a fixing frame (501), the fixing frame (501) being fixedly connected between the symmetrically arranged air blowing pipes (307), the fixing frame (501) being slidably connected to the chopping knife (112), the fixing frame (501) being slidably connected to a symmetrically arranged guide rod (502), a spring being fixedly connected between the guide rod (502) and the fixing frame (501), a connecting plate (503) being fixedly connected to one end of the guide rod (502) away from the mounting shell (104), a pressing ring (504) being fixedly connected between the symmetrically arranged connecting plates (503), the pressing ring (504) being matched with the lead wire (115).

9. A bonding machine with positioning function for semiconductor processing according to claim 8, characterized in that: The pressing ring (504) is provided with circumferentially arranged protrusions on one side close to the fixing frame (501), the riving knife (112) is fixedly connected with circumferentially arranged push rods (505), and the protrusions of the pressing ring (504) cooperate with the adjacent push rods (505).

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