A dual-chip packaging structure and its packaging method

Abstract

The present invention belongs to the field of chip packaging technology, and discloses a dual-chip packaging structure, including a fixing frame, and also including a connecting component, which is arranged on the top of the fixing frame for limiting and fixing the dual chips; an adjusting component, which is connected to the four corners of the fixing frame to support it; a positioning component, which is sleeved on the bottom of the adjusting component and contacts the PCB board; a partitioning component, which is arranged on the four sides of the fixing frame to separate the dual-chip pins through the partitioning component; wherein the partitioning component is connected to the four sides of the fixing frame through a second fixing rod so that it corresponds to the four-side pins of the dual chip. The present invention fixes the chip to the bottom of the fixing frame, presses the fixing frame downward, and the second fixing rod, the partitioning plate and the spring telescopic rod move downward synchronously, one end of the partitioning plate contacts the PCB board, and rotates at the hinge, so that the chip pins are located between two adjacent racks at one end of the partitioning plate, and the chip pins can be separated by the partitioning plate, and the chip welding quality and assembly efficiency can be improved at the same time.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and specifically relates to a dual-chip packaging structure and a packaging method thereof. Background Art

[0002] Dual chips enable multiple chips to be integrated in one package, and communication and data transmission between chips are achieved through an interconnection structure. This technology can use different chip arrangement methods, such as stacking, side-by-side, or matrix arrangement, to achieve higher integration and smaller volume; the basic principle of dual-chip technology is to use two chips to handle different tasks respectively, so as to achieve the effect of improving performance. One chip is responsible for processing computing tasks, and the other chip is responsible for managing and controlling other functions of the system. Currently, when installing chips onto a PCB board, a soldering iron and solder paste are usually used to solder them onto the PCB board. Due to the small size of existing chips, the pin size is small. After the solder paste melts during the chip soldering process, it is easy for the solder paste to stick to multiple pins, thereby affecting the chip soldering quality. The technical requirements for operators are relatively high during the chip assembly process. Therefore, a dual-chip packaging structure and a packaging method thereof are proposed. Summary of the Invention

[0003] To solve the problems raised in the above background art, the present invention provides a dual-chip packaging structure and a packaging method thereof, which solve the problem that after the solder paste melts during the soldering process of existing chips, it is easy for the solder paste to stick to multiple pins, affecting the chip soldering quality.

[0004] To achieve the above object, the present invention provides the following technical solution: A dual-chip packaging structure includes a fixing frame, and further includes,

[0005] A connection component, which is arranged on the top of the fixing frame to limit and fix the dual chips;

[0006] An adjusting component, which is connected to the four corners of the fixing frame to support it;

[0007] A positioning component, which is sleeved at the bottom of the adjusting component and contacts the PCB board;

[0008] A separating component, which is arranged on the four sides of the fixing frame to separate the pins of the dual chips through the separating component;

[0009] Among them, the separating component is connected to the four sides of the fixing frame through a second fixing rod to correspond to the pins on the four sides of the dual chips. A separating plate made of stainless steel for separating the pins of the dual chips is hinged at the bottom of the second fixing rod. One end of the separating plate is in the shape of a rack, and the space between adjacent two racks is in an inverted trapezoid shape. The pins of the dual chips are located between adjacent two racks. A reset spring telescopic rod is connected between the separating plate and the top of the second fixing rod.

[0010] Preferably, by pressing the fixing frame, the partition plate contacts the PCB board, and the partition plate rotates around the hinge to place the chip pins between two adjacent racks.

[0011] Preferably, the connecting component includes a limiting frame fixedly installed on the top of the fixing frame, a connecting rod sleeved inside the limiting frame, a disc fixedly installed at the bottom of the connecting rod, and a limiting rod arranged outside the connecting rod;

[0012] Two inverted "L"-shaped grooves are formed outside the limiting frame, the limiting rod slides in the "L"-shaped groove, and a circular groove for the disc to slide is formed at the bottom of the fixing frame;

[0013] The connecting component further includes two limiting rings sleeved outside the connecting rod, a docking ring sleeved outside the connecting rod and located between the two limiting rings, a connecting rod hinged to the outside of the docking ring, a movable plate hinged to one end of the connecting rod, and a limiting plate connected to the bottom of the movable plate and passing through the fixing frame for chip limiting.

[0014] Preferably, the bottom of the fixing frame contacts the top of the chip. Pull the connecting rod and the disc upward to form negative pressure between the circular groove and the chip, and the limiting rod slides and rotates in the "L"-shaped groove to fix it.

[0015] Preferably, the adjusting component includes connecting frames installed at the four corners of the fixing frame, first fixing rods sleeved inside the connecting frames, support rings fixedly installed outside the first fixing rods, first springs connected between the connecting frames and the support rings, stabilizing rings sleeved outside the first fixing rods, and suction cups installed at the bottoms of the stabilizing rings.

[0016] Preferably, the adjusting component further includes a limiting ring installed outside the first fixing rod and a fixing ring arranged on the top of the limiting ring;

[0017] An activity chamber for the limiting ring and the fixing ring to slide is formed at the upper end inside the stabilizing ring. The lower end inside the stabilizing ring is communicated with the limiting ring. The outer diameters of the limiting ring and the fixing ring are smaller than the inner diameter of the activity chamber, and a rubber ring is arranged at the bottom of the limiting ring;

[0018] The support ring is located on the top of the stabilizing ring, and the limiting ring and the fixing ring are located inside the stabilizing ring.

[0019] Preferably, the positioning component includes a sleeve pipe communicated with the inside of the stabilizing ring, a piston rod sleeved inside the sleeve pipe, and a docking rod connected between the piston rod and the connecting frame.

[0020] Preferably, the suction cup contacts the PCB board. The hand-held fixing bracket finely adjusts the chip so that its pins correspond to the solder joints. The limiting ring and the fixing ring slide in the movable chamber. Press the fixing bracket and the connecting bracket, and push the piston rod through the docking rod to evacuate the inside of the stabilizing ring to form a negative pressure state, thereby fixing the limiting ring.

[0021] Preferably, the adjusting assembly further includes a second spring fixedly installed inside the first fixing rod, and a convex block connected to one end of the second spring, and the top of one end of the convex block is arc-shaped;

[0022] The connecting bracket moves downward to squeeze the convex block, and the connecting bracket and the fixing bracket are fixed by the convex block.

[0023] The present invention also provides a packaging method for dual-chip packaging, including the following steps

[0024] S1. The bottom of the fixing bracket contacts the chip, and the connecting rod and the disc are pulled upward to adsorb the chip to the bottom of the fixing bracket. At the same time, during the process of pulling the connecting rod upward, the limiting rod slides in the "L"-shaped groove, and the limiting rod is rotated so that it is located at one end of the "L"-shaped groove to limit the disc and the connecting rod. Pulling the connecting rod upward drives the docking ring and the connecting rod, so that the two limiting plates move synchronously toward the middle to limit the dual chips at the bottom of the fixing bracket;

[0025] S2. Hold the fixing bracket by hand, drive the connecting bracket and the first fixing rod, so that the limiting ring and the fixing ring slide in the movable chamber, and finely adjust the position of the chip to ensure that the chip pins correspond to the welding of the PCB board;

[0026] S3. Press the fixing bracket downward, and the second fixing rod, the partition plate and the spring telescopic rod move downward synchronously. One end of the partition plate contacts the PCB board and rotates around the hinge point so that its bottom contacts the PCB board. At the same time, the chip pins are located between two adjacent racks at one end of the partition plate, and the chip pins can be separated by the partition plate;

[0027] S4. The downward movement of the fixing bracket drives the connecting bracket to slide outside the first fixing rod, and the docking rod pushes the piston rod to evacuate the inside of the stabilizing ring, so that the inside is in a negative pressure state, and thus the first fixing rod, the connecting bracket, the fixing bracket and the chip are positioned by the negative pressure at the lower end of the stabilizing ring.

[0028] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0029] In the present invention, the chip is fixed to the bottom of the fixing bracket, and the fixing bracket is pressed downward. The second fixing rod, the partition plate and the spring telescopic rod move downward synchronously. One end of the partition plate contacts the PCB board and rotates around the hinge point, so that the chip pins are located between two adjacent racks at one end of the partition plate. The chip pins can be separated by the partition plate, and at the same time, the welding quality and assembly efficiency of the chip can be improved;

[0030] In the present invention, the chip is fixed to the bottom of the fixing frame. The fixing frame is held by hand and the chip is placed on the PCB board. The suction cup adsorbs on the PCB board. By observing whether the chip pins correspond to the solder joints on the PCB board, and by holding the fixing frame and driving the connecting frame and the first fixing rod, the limiting ring and the fixing ring slide in the movable chamber to finely adjust the position of the chip, ensuring that the chip pins correspond to the soldering on the PCB board, thereby improving the accuracy of chip soldering.

[0031] In the present invention, when the fixing frame moves downward, it drives the connecting frame to slide outside the first fixing rod and compress the first spring. The docking rod pushes the piston rod to pump air inside the stabilizing ring, making its internal state negative pressure. Since the bottom of the limiting ring contacts the stabilizing ring, the negative pressure at the lower end of the stabilizing ring is used to position the first fixing rod, the connecting frame, the fixing frame and the chip, and at the same time improve the stability of the stabilizing ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic top view structure diagram of the present invention;

[0033] Figure 2 is a schematic external structure diagram of the present invention;

[0034] Figure 3 is a schematic cross-sectional structure diagram of the present invention;

[0035] Figure 4 is a schematic exploded structure diagram of the connecting component of the present invention;

[0036] Figure 5 is a schematic structure diagram of the cooperation between the adjusting component and the positioning component of the present invention;

[0037] Figure 6 is a schematic cross-sectional structure diagram of the positioning component of the present invention;

[0038] Figure 7 is a schematic internal structure diagram of the adjusting component of the present invention;

[0039] Figure 8 is a schematic exploded structure diagram of the separating component of the present invention.

[0040] In the figure: 100, fixing frame; 200, adjusting component; 201, connecting frame; 202, first fixing rod; 2021, second spring; 2022, convex block; 203, first spring; 204, supporting ring; 2041, limiting ring; 2042, fixing ring; 205, stabilizing ring; 206, suction cup; 300, connecting component; 301, limiting frame; 302, disc; 303, connecting rod; 304, limiting rod; 311, limiting ring; 312, docking ring; 313, connecting rod; 314, movable plate; 315, limiting plate; 400, positioning component; 401, sleeve; 402, piston rod; 403, docking rod; 500, separating component; 501, separating plate; 502, spring telescopic rod; 503, second fixing rod. Detailed implementation mode

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0042] As Figures 1 to 8 shown, the present invention provides a dual-chip packaging structure, including a fixing frame 100, and further including,

[0043] A connecting component 300, which is arranged on the top of the fixing frame 100 for limiting and fixing the dual chips;

[0044] An adjusting component 200, which is connected to the four corners of the fixing frame 100 to support it;

[0045] A positioning component 400, which is sleeved at the bottom of the adjusting component 200 and contacts the PCB board;

[0046] A separating component 500, which is arranged on the four sides of the fixing frame 100 to separate the pins of the dual chips through the separating component 500;

[0047] Among them, the separating component 500 is connected to the four sides of the fixing frame 100 through the second fixing rod 503 so as to correspond to the pins on the four sides of the dual chips. The bottom of the second fixing rod 503 is hinged with a separating plate 501 made of stainless steel for separating the pins of the dual chips. One end of the separating plate 501 is in the shape of a rack, and the space between adjacent two racks is in an inverted trapezoid shape. The pins of the dual chips are located between adjacent two racks. A reset spring telescopic rod 502 is connected between the separating plate 501 and the top of the second fixing rod 503.

[0048] By pressing the fixing frame 100, the separating plate 501 contacts the PCB board, and the separating plate 501 rotates around the hinge point, so that the chip pins are located between adjacent two racks.

[0049] It is fixed to the bottom of the fixing frame 100 through a chip and placed on the PCB board, corresponding to the solder joints of the PCB board. Press down the fixing frame 100, and the second fixing rod 503, the partition plate 501 and the spring telescopic rod 502 move downward synchronously. One end of the partition plate 501 contacts the PCB board and rotates around the hinge point so that its bottom contacts the PCB board. At the same time, the chip pins are located between two adjacent racks at one end of the partition plate 501. Thus, the chip pins can be separated by the partition plate 501. Since the partition plate 501 is made of stainless steel, it can prevent the solder paste from sticking to it. At the same time, the space between two adjacent racks is designed in an inverted trapezoid shape, which is convenient for removing the partition plate 501 after the soldering is solidified.

[0050] As Figures 1 - 4 shown, the connection component 300 includes a limit frame 301 fixedly installed on the top of the fixing frame 100, a connecting rod 303 sleeved inside the limit frame 301, a disc 302 fixedly installed at the bottom of the connecting rod 303, and a limit rod 304 arranged outside the connecting rod 303;

[0051] Two inverted "L"-shaped grooves are opened on the outside of the limit frame 301, and the limit rod 304 slides in the "L"-shaped groove. A circular groove for the disc 302 to slide is opened at the bottom of the fixing frame 100;

[0052] The connection component 300 further includes two limit rings 311 sleeved outside the connecting rod 303, a docking ring 312 sleeved outside the connecting rod 303 and located between the two limit rings 311, a connecting rod 313 hinged to the outside of the docking ring 312, a movable plate 314 hinged to one end of the connecting rod 313, and a limit plate 315 connected to the bottom of the movable plate 314 and passing through the fixing frame 100 for chip limiting.

[0053] The bottom of the fixing frame 100 contacts the top of the chip. Pull up the connecting rod 303 and the disc 302 to form a negative pressure between the circular groove and the chip, and the limit rod 304 slides and rotates in the "L"-shaped groove to fix it.

[0054] By contacting the bottom of the fixing frame 100 with the chip and pulling up the connecting rod 303 and the disc 302, a negative pressure is formed between the circular groove at the bottom of the fixing frame 100 and the chip, and the chip is adsorbed to the bottom of the fixing frame 100. At the same time, during the process of pulling up the connecting rod 303, the limit rod 304 slides in the "L"-shaped groove, and the limit rod 304 is rotated to be located at one end of the "L"-shaped groove to limit the disc 302 and the connecting rod 303. After the chip welding is completed, reverse-rotate the connecting rod 303, the limit rod 304 and the disc 302, and the chip can be detached from the connection with the fixing frame 100.

[0055] As Figure 2 , Figure 3 , Figure 5 ,Figure 6 and Figure 7 As shown in Figure 7 , the adjusting assembly 200 includes connecting brackets 201 installed at the four corners of the fixing bracket 100, a first fixing rod 202 sleeved inside the connecting brackets 201, a support ring 204 fixedly installed outside the first fixing rod 202, a first spring 203 connected between the connecting brackets 201 and the support ring 204, a stabilizing ring 205 sleeved outside the first fixing rod 202, and a suction cup 206 installed at the bottom of the stabilizing ring 205;

[0056] The adjusting assembly 200 further includes a limiting ring 2041 installed outside the first fixing rod 202, and a fixing ring 2042 arranged on the top of the limiting ring 2041;

[0057] An activity chamber for the limiting ring 2041 and the fixing ring 2042 to slide is formed at the upper end inside the stabilizing ring 205. The lower end inside the stabilizing ring 205 communicates with the limiting ring 2041. The outer diameter values of the limiting ring 2041 and the fixing ring 2042 are smaller than the inner diameter value of the activity chamber. A rubber ring is arranged at the bottom of the limiting ring 2041; The support ring 204 is located on the top of the stabilizing ring 205, and the limiting ring 2041 and the fixing ring 2042 are located inside the stabilizing ring 205.

[0058] After fixing the chip to the bottom of the fixing bracket 100, hold the fixing bracket 100 and drive the chip to be placed on the PCB board. Adsorb it on the PCB board through the suction cup 206, observe whether the chip pins correspond to the solder joints on the PCB board. Hold the fixing bracket 100, drive the connecting bracket 201 and the first fixing rod 202, so that the limiting ring 2041 and the fixing ring 2042 slide in the activity chamber, and finely adjust the position of the chip to ensure that the chip pins correspond to the PCB board welding, which can improve the quality of chip welding.

[0059] such as Figures 5 - 7 As shown in Figures 5 - 7 , the positioning assembly 400 includes a sleeve 401 communicating with the inside of the stabilizing ring 205, a piston rod 402 sleeved inside the sleeve 401, and a docking rod 403 connected between the piston rod 402 and the connecting bracket 201;

[0060] The suction cup 206 contacts the PCB board. Hold the fixing bracket 100 to finely adjust the chip so that its pins correspond to the solder joints. The limiting ring 2041 and the fixing ring 2042 slide in the activity chamber. Press the fixing bracket 100 and the connecting bracket 201, and push the piston rod 402 through the docking rod 403 to pump air inside the stabilizing ring 205 to form a negative pressure state, and fix the limiting ring 2041;

[0061] The adjusting assembly 200 further includes a second spring 2021 fixedly installed inside the first fixing rod 202, and a convex block 2022 connected to one end of the second spring 2021. The top of one end of the convex block 2022 is arc-shaped;

[0062] The connecting frame 201 moves downward to press the bump 2022, and the connecting frame 201 and the fixing frame 100 are fixed by the bump 2022.

[0063] During the process of finely adjusting the chip by holding the fixing frame 100 by hand, the docking rod 403 rotates at both ends respectively to ensure that the fixing frame 100, the connecting frame 201 and the first fixing rod 202 can move normally. After the position of the chip is adjusted, the fixing frame 100 is pressed downward, and the piston rod 402 is pushed by the docking rod 403 to evacuate the lower end of the stabilizing ring 205, so that a negative pressure state is formed inside it. Since the bottom of the limiting ring 2041 is communicated with the lower end of the stabilizing ring 205, the limiting ring 2041 is adsorbed under the negative pressure state, and it is sealed by the rubber ring arranged at the bottom to fix the positions of the first fixing rod 202, the connecting frame 201 and the fixing frame 100. At the same time, since the lower end of the stabilizing ring 205 is in a negative pressure state, the connection stability between the stabilizing ring 205 and the PCB board can be improved;

[0064] At the same time, during the downward movement of the connecting frame 201, the bump 2022 is pushed to compress the second spring 2021, and it contracts into the first fixing rod 202, so that the connecting frame 201 is located at the bottom of the bump 2022, thereby limiting the connecting frame 201 by the bump 2022.

[0065] The present invention also provides a packaging method for dual-chip packaging, including the following steps:

[0066] S1. The bottom of the fixing frame 100 contacts the chip, and the connecting rod 303 and the disc 302 are pulled upward, so that a negative pressure is formed between the circular groove at the bottom of the fixing frame 100 and the chip, and the chip is adsorbed on the bottom of the fixing frame 100. At the same time, during the process of pulling the connecting rod 303 upward, the limiting rod 304 slides in the "L"-shaped groove, and the limiting rod 304 is rotated to be located at one end of the "L"-shaped groove to limit the disc 302 and the connecting rod 303. Pulling the connecting rod 303 upward drives the docking ring 312 and the connecting rod 313, so that the two limiting plates 315 move synchronously towards the middle to limit the dual chips at the bottom of the fixing frame 100;

[0067] S2. After the chip is fixed, hold the fixing frame 100 and place the chip on the PCB board, and adsorb it on the PCB board through the suction cup 206. Observe whether the chip pins correspond to the solder joints on the PCB board, and hold the fixing frame 100, drive the connecting frame 201 and the first fixing rod 202, so that the limiting ring 2041 and the fixing ring 2042 slide in the movable chamber to finely adjust the position of the chip to ensure that the chip pins correspond to the PCB board welding;

[0068] S3. Press down the fixing frame 100. The second fixing rod 503, the partition plate 501 and the spring telescopic rod 502 move downward synchronously. One end of the partition plate 501 contacts the PCB board and rotates around the hinge point so that its bottom contacts the PCB board. At the same time, the chip pins are located between two adjacent racks at one end of the partition plate 501, and thus the chip pins can be separated by the partition plate 501.

[0069] S4. At the same time, the downward movement of the fixing frame 100 drives the connecting frame 201 to slide outside the first fixing rod 202 and compress the first spring 203. At the same time, the piston rod 402 is pushed by the docking rod 403 to pump air inside the stabilizing ring 205, making its interior in a negative pressure state. Since the bottom of the limiting ring 2041 contacts the stabilizing ring 205, the first fixing rod 202, the connecting frame 201, the fixing frame 100 and the chip are positioned by the negative pressure at the lower end of the stabilizing ring 205. At the same time, during the downward movement of the connecting frame 201, it passes through the bump 2022, and the connecting frame 201 and the fixing frame 100 are fixed by the bump 2022.

[0070] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0071] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dual-chip packaging structure, comprising a fixing frame (100), characterized in that: Also includes, A connecting component (300) is arranged on the top of the fixing frame (100) and is used to limit and fix the dual chips; An adjustment assembly (200) connected to four corners of the fixing frame (100) for supporting the fixing frame (100); A positioning component (400) is sleeved on the bottom of the adjustment component (200) and contacts the PCB board; A separation component (500) is arranged on four sides of the fixing frame (100) to separate the pins of the double chip through the separation component (500); The partition assembly (500) is connected to the four sides of the fixing frame (100) via a second fixing rod (503) so as to correspond to the four-side pins of the dual chip; a partition plate (501) made of stainless steel and used for separating the dual chip pins is hinged at the bottom of the second fixing rod (503); one end of the partition plate (501) is in the shape of a rack, and the space between two adjacent racks is in an inverted trapezoidal shape; the dual chip pins are located between two adjacent racks; a return spring telescopic rod (502) is connected to the partition plate (501) and the top of the second fixing rod (503); By pressing the fixing frame (100), the partition plate (501) contacts the PCB board, and the partition plate (501) rotates at the hinge so that the dual chip pins are located between two adjacent racks; The connection assembly (300) comprises a limiting frame (301) fixedly mounted on the top of the fixing frame (100), a connecting rod (303) sleeved inside the limiting frame (301), a disc (302) fixedly mounted on the bottom of the connecting rod (303), and a limiting rod (304) arranged outside the connecting rod (303); The limiting frame (301) has two inverted "L"-shaped grooves on its exterior, the limiting rod (304) slides in the "L"-shaped grooves, and the bottom of the fixing frame (100) has a circular groove for the disc (302) to slide. The connection assembly (300) further comprises two limiting rings (311) sleeved on the outside of the connection rod (303), a docking ring (312) sleeved on the outside of the connection rod (303) and located between the two limiting rings (311), a connection rod (313) hinged on the outside of the docking ring (312), a movable plate (314) hinged on one end of the connection rod (313), and a limiting plate (315) for limiting the chip, which is connected to the bottom of the movable plate (314) and passes through the fixing frame (100); The bottom of the fixing frame (100) contacts the top of the chip, pulling the connecting rod (303) and the disc (302) upward, so that negative pressure is formed between the circular groove and the chip, and the limiting rod (304) slides in the "L"-shaped groove and rotates to fix it; The adjustment assembly (200) comprises a connecting frame (201) mounted on four corners of the fixing frame (100), a first fixing rod (202) sleeved inside the connecting frame (201), a support ring (204) fixed to the outside of the first fixing rod (202), a first spring (203) connected between the connecting frame (201) and the support ring (204), a stabilizing ring (205) sleeved outside the first fixing rod (202), and a suction cup (206) mounted on the bottom of the stabilizing ring (205); The adjustment assembly (200) further comprises a limiting ring (2041) mounted on the outside of the first fixing rod (202), and a fixing ring (2042) arranged on the top of the limiting ring (2041); The upper end of the interior of the stabilizing ring (205) is provided with a movable chamber for sliding the limiting ring (2041) and the fixing ring (2042); the lower end of the interior of the stabilizing ring (205) is in communication with the limiting ring (2041); the outer diameters of the limiting ring (2041) and the fixing ring (2042) are smaller than the inner diameter of the movable chamber; and a rubber ring is provided at the bottom of the limiting ring (2041); The support ring (204) is located at the top of the stabilizing ring (205), and the limiting ring (2041) and the fixing ring (2042) are located inside the stabilizing ring (205); The positioning assembly (400) comprises a sleeve (401) connected to the interior of the stabilizing ring (205), a piston rod (402) sleeved inside the sleeve (401), and a docking rod (403) connected between the piston rod (402) and the connecting frame (201); The suction cup (206) contacts the PCB board, the holding fixing frame (100) is used to fine-tune the chip so that its pins correspond to the soldering points, the limiting ring (2041) and the fixing ring (2042) slide in the movable chamber, the fixing frame (100) and the connecting frame (201) are pressed, and the piston rod (402) is pushed through the docking rod (403) to evacuate the inside of the stabilizing ring (205) to form a negative pressure state, thereby fixing the limiting ring (2041); The adjustment assembly (200) further comprises a second spring (2021) fixedly mounted inside the first fixing rod (202), and a protrusion (2022) connected to one end of the second spring (2021), wherein the top of one end of the protrusion (2022) is in an arc shape; The connecting frame (201) moves downward to squeeze the protrusion (2022), and the connecting frame (201) and the fixing frame (100) are fixed via the protrusion (2022).

2. A packaging method for a dual-chip package, using the dual-chip packaging structure as claimed in claim 1, characterized in that: The following steps are included: S1, contacting the chip through the bottom of the fixing frame (100), pulling the connecting rod (303) and the disc (302) upwards, and adsorbing the chip to the bottom of the fixing frame (100); while pulling the connecting rod (303) upwards, the limiting rod (304) slides in the "L"-shaped groove, and the limiting rod (304) is rotated so that one end of the limiting rod (304) located in the "L"-shaped groove limits the disc (302) and the connecting rod (303); pulling the connecting rod (303) upwards drives the docking ring (312) and the connecting rod (313), so that the two limiting plates (315) move synchronously toward the middle to limit the double chips at the bottom of the fixing frame (100); S2, by holding the fixing frame (100), driving the connecting frame (201) and the first fixing rod (202), so that the limiting ring (2041) and the fixing ring (2042) slide in the movable chamber, and fine-adjusting the position of the chip to ensure that the chip pins correspond to the PCB board during welding; S3, pressing the fixing frame (100) downward, the second fixing rod (503), the partition plate (501) and the spring telescopic rod (502) move downward synchronously, one end of the partition plate (501) contacts the PCB board, and rotates at the hinge so that the bottom contacts the PCB board, and at the same time, the chip pins are located between two adjacent racks at one end of the partition plate (501), so that the chip pins can be separated by the partition plate (501); S4, the fixing frame (100) moves downward to drive the connecting frame (201) to slide outside the first fixing rod (202), and the docking rod (403) pushes the piston rod (402) to evacuate the inside of the stabilizing ring (205), so that the inside is in a negative pressure state, thereby positioning the first fixing rod (202), the connecting frame (201), the fixing frame (100) and the chip through the negative pressure at the lower end of the stabilizing ring (205).

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