Chip sorting and grabbing device and working method thereof

Abstract

The present invention belongs to the field of transportation technology, and specifically relates to a chip sorting and grasping equipment and a working method thereof, comprising: a suction device, which is suitable for sucking chips; a moving device, on which the suction device is arranged, and the moving device is suitable for driving the suction device to move so as to transport the sucked chips; a detection device, which is arranged on both sides of the moving device, and is suitable for detecting the suction situation of the suction device; the suction and transportation of chips is realized, and other surrounding chips can be pre-separated by airflow before the chips are sucked, and no air extraction is required during the transportation process, so as to avoid the chips falling during the transportation process due to fluctuations in the air source.

Description

Technical Field

[0001] The invention belongs to the field of transport technology, and in particular relates to a chip sorting and grabbing device and a working method thereof. Background Art

[0002] During the transportation process, the chip is sucked up by suction and then transported. During the transportation process, it is necessary to continue to suck the chip, but the air source of the vacuum will fluctuate. The air source fluctuation will cause the suction of the chip to be unstable, and the chip will fall during the transportation of the chip, causing damage and waste of the chip; and when the chip is sucked by vacuum, the force generated by the vacuum will suddenly peel the chip off the film, which can easily cause damage to the chip.

[0003] Therefore, based on the above technical problems, it is necessary to design a new chip sorting and grabbing device and its working method. Summary of the invention

[0004] The purpose of the present invention is to provide a chip sorting and grabbing device and a working method thereof.

[0005] In order to solve the above technical problems, the present invention provides a chip sorting and grabbing device, comprising:

[0006] A suction device, wherein the suction device is suitable for sucking the chip;

[0007] A moving device, the suction device is arranged on the moving device, and the moving device is suitable for driving the suction device to move so as to carry the sucked chip;

[0008] A detection device is arranged on both sides of the moving device, and the detection device is suitable for detecting the suction condition of the suction device.

[0009] Further, the suction device comprises: a guide sleeve, a guide rod and a suction nozzle mechanism;

[0010] The guide sleeve is arranged on the moving device;

[0011] The guide rod is inserted into the guide sleeve;

[0012] The top end of the guide rod extends out from the top surface of the guide sleeve;

[0013] The bottom end of the guide rod is connected to the suction nozzle assembly;

[0014] The suction nozzle assembly is partially located in the guide sleeve and partially extends out of the bottom end of the guide sleeve.

[0015] Further, the nozzle assembly includes: a conical head and a circular ring;

[0016] The conical head is connected to the bottom end of the guide rod, that is, the end of the conical head with a smaller cross-sectional area is connected to the bottom end of the guide rod;

[0017] The circular ring is sleeved on the outer wall of the conical head, and the circular ring is tilted, that is, the outer edge of the circular ring is lower than the inner edge of the circular ring;

[0018] The outer edge of the circular ring extends out of the bottom end of the guide sleeve;

[0019] The projection of the circular ring is wider than the projection of the guide sleeve.

[0020] Furthermore, a limiting ring is provided at the top end of the guide rod;

[0021] The guide rod is sleeved with a spring;

[0022] One end of the spring is connected to the bottom surface of the limiting ring, and the other end is connected to the top surface of the guide sleeve.

[0023] Furthermore, an air port is provided on the outer wall of the guide sleeve;

[0024] A gap exists between the guide rod and the inner wall of the guide sleeve.

[0025] Furthermore, a plurality of oblique grooves are provided on the top surface of the circular ring along the radial direction of the circular ring, and the depth of the oblique grooves is shallower as they are closer to the center of the circular ring.

[0026] Further, the moving device includes: a two-axis moving mechanism and a rotating mechanism;

[0027] The two-axis moving mechanism is arranged on the bracket;

[0028] The rotating mechanism is arranged on the two-axis moving mechanism;

[0029] The guide sleeve is arranged on the rotating mechanism.

[0030] Further, the rotating mechanism comprises: a connecting member and a rotating motor;

[0031] The rotating motor is arranged on the two-axis moving mechanism;

[0032] The connecting member is connected to the rotating motor;

[0033] The guide sleeve is arranged on the connecting member.

[0034] Further, the detection device includes: a pair of detection mechanisms;

[0035] The detection mechanism is arranged on both sides of the two-axis moving mechanism;

[0036] The detection mechanism is suitable for detecting the suction condition of the suction device.

[0037] Further, the detection mechanism includes: a first slide rail, a first slider and a first motor;

[0038] The first slide rail is arranged on the bracket;

[0039] The first sliding block is arranged on the first sliding rail;

[0040] The first motor is arranged on the henna, and the first motor is connected to the first sliding block.

[0041] Further, the first sliding block is provided with a second sliding rail, and the second sliding rail is vertically arranged;

[0042] The second slide rail is perpendicular to the first slide rail;

[0043] The second slide rail is provided with a second slide block;

[0044] The first sliding block is provided with a second motor;

[0045] The second motor is connected to the second slider;

[0046] The second sliding block is provided with a camera.

[0047] On the other hand, the present invention also provides a working method adopted by the above chip sorting and grabbing device, comprising:

[0048] The chip is sucked by a sucking device;

[0049] The moving device drives the suction device to move so as to carry the sucked chip;

[0050] The suction condition of the suction device is detected by the detection device.

[0051] The beneficial effect of the present invention is that the present invention is through a suction device, the suction device is suitable for sucking chips; a moving device, the suction device is arranged on the moving device, the moving device is suitable for driving the suction device to move so as to transport the sucked chips; the detection device, the detection device is arranged on both sides of the moving device, the detection device is suitable for detecting the suction situation of the suction device; the suction and transportation of chips is realized, and other surrounding chips can be pre-separated by airflow before the chip is sucked, and no air extraction is required during the transportation process, so as to avoid the chip falling during the transportation process due to fluctuations in the air source.

[0052] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0053] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0055] Figure 1 It is a structural schematic diagram of a chip sorting and grabbing device of the present invention;

[0056] Figure 2 It is a schematic structural diagram of the suction device of the present invention;

[0057] Figure 3 is a cross-sectional view of a schematic structural diagram of an aspiration device of the present invention;

[0058] Figure 4 is a cross-sectional view of a circular ring of the present invention;

[0059] Figure 5 It is a schematic diagram of the structure of the detection device of the present invention;

[0060] Figure 6 It is a schematic structural diagram of the mobile device of the present invention.

[0061] In the figure:

[0062] 1 suction device, 11 guide sleeve, 12 guide rod, 13 conical head, 14 circular ring, 15 limiting ring, 16 spring, 17 air port, 18 inclined groove;

[0063] 2 moving device, 21 two-axis moving mechanism, 22 connecting member, 23 rotating motor;

[0064] 3 detection device, 31 first slide rail, 32 first slider, 33 first motor, 34 second slide rail, 35 second slider, 36 second motor, 37 camera;

[0065] 4 brackets. DETAILED DESCRIPTION

[0066] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0067] Embodiment 1, as Figures 1 to 6 As shown, this embodiment 1 provides a chip sorting and grasping equipment, including: a suction device 1, wherein the suction device 1 is suitable for sucking chips; a moving device 2, wherein the suction device 1 is arranged on the moving device 2, and wherein the moving device 2 is suitable for driving the suction device 1 to move so as to transport the sucked chips; a detection device 3, wherein the detection device 3 is arranged on both sides of the moving device 2, and wherein the detection device 3 is suitable for detecting the suction status of the suction device 1; the suction and transportation of chips is realized, and other surrounding chips can be pre-separated by airflow before the chips are sucked, and no air extraction is required during the transportation process, so as to avoid the chips falling during the transportation process due to fluctuations in the air source.

[0068] In this embodiment, the suction device 1 includes: a guide sleeve 11, a guide rod 12 and a suction nozzle mechanism; the guide sleeve 11 is arranged on the moving device 2; the guide rod 12 is inserted into the guide sleeve 11; the top end of the guide rod 12 extends out from the top surface of the guide sleeve 11; the bottom end of the guide rod 12 is connected to the suction nozzle assembly; the suction nozzle assembly is partially located in the guide sleeve 11 and partially extends out of the bottom end of the guide sleeve 11; the guide sleeve 11 can limit the lifting direction of the guide rod 12 to prevent the guide rod 12 from being offset; the top surface of the guide sleeve 11 makes the size of the through hole through which the guide rod 12 passes match the size of the guide rod 12, and the guide rod 12 contacts the through hole while passing through the guide sleeve 11, so that the gas subsequently passed between the guide sleeve 11 and the guide rod 12 can only be blown out from the bottom surface of the guide sleeve 11; the suction nozzle assembly can suck the chip.

[0069] In this embodiment, the nozzle assembly includes: a conical head 13 and a circular ring 14; the conical head 13 is connected to the bottom end of the guide rod 12, that is, the end of the conical head 13 with a smaller cross-sectional area is connected to the bottom end of the guide rod 12; the circular ring 14 is sleeved on the outer wall of the conical head 13, and the circular ring 14 is tilted, that is, the outer edge of the circular ring 14 is lower than the inner edge of the circular ring 14; the outer edge of the circular ring 14 extends out of the bottom end of the guide sleeve 11; the projection of the circular ring 14 is wider than the projection of the guide sleeve 11; the circular ring 14 is made of elastic material; a limiting ring 15 is provided at the top end of the guide rod 12; a spring 16 is sleeved on the guide rod 12; one end of the spring 16 is connected to the bottom surface of the limiting ring 15, and the other end is connected to the top surface of the guide sleeve 11;

[0070] In this embodiment, an air port 17 is provided on the outer wall of the guide sleeve 11; there is a gap between the guide rod 12 and the inner wall of the guide sleeve 11; in the initial state, the ring 14 is in contact with the bottom surface of the lifting sleeve by the spring 16 to prevent impurities from entering the inside of the lifting sleeve. When it is necessary to absorb the chip, air is ventilated into the lifting sleeve through the air port 17, and the conical head 13 and the ring 14 are blown out of the lifting sleeve by the gas. At this time, a gap appears between the ring 14 and the bottom surface of the lifting sleeve, and the gas can be blown out from the gap. Since the outer wall of the conical head 13 and the ring 14 are The direction of the gas blown out from the bottom of the lifting sleeve is also inclined. When the ring 14 moves to the top of the corresponding chip, the gas blown out from the bottom of the lifting sleeve will blow to other chips around the chip, and the oblique airflow will blow to the bottom of the surrounding chips, blowing the glue between the chip and the film, assisting the chip to separate from the film, and realizing the pre-separation of the chip. When sucking the chip, other surrounding chips are pre-separated from the film, so as to facilitate the subsequent suction of other chips, avoid the chip and the film from being too firmly adhered to make it difficult to remove the chip, and avoid damage to the chip when removing the chip; two-axis moving machine The structure 21 gradually drives the rotating mechanism to descend, and the ring 14 contacts the chip surface. The originally inclined ring 14 gradually becomes horizontal with the chip surface after contacting the chip surface. The final state of the descent is that the bottom surface of the ring 14 and the side with a larger cross-sectional area of ​​the conical head 13 are in close contact with the chip surface, and the chip is sucked. An airway can be set in the guide rod 12, and the airway is connected to the side with a larger cross-sectional area of ​​the conical head 13. After the bottom surface of the ring 14 and the side with a larger cross-sectional area of ​​the conical head 13 are in close contact with the chip surface, air can be pumped through the airway to ensure that the bottom surface of the ring 14 and the cross-sectional area of ​​the conical head 13 are in close contact with the chip surface. A negative pressure is formed between the larger side and the chip surface, which can absorb the chip. The gas in the airway is briefly extracted and then the extraction is stopped. At this time, because the bottom surface of the ring 14 and the side with a larger cross-sectional area of ​​the conical head 13 are in contact with the chip surface, a negative pressure is maintained, and the chip is absorbed. The two-axis moving mechanism 21 and the rotating mechanism can move and transport the absorbed chip. During the movement of the chip, air is not ventilated into the guide sleeve 11 through the air port 17; after the chip is transported to the preset position, the negative pressure can be released into the airway, and the adsorbed chip can be put down. After putting down the chip, the next chip can be absorbed.

[0071] In this embodiment, a plurality of inclined grooves 18 are provided on the top surface of the circular ring 14 along the radial direction of the circular ring 14, and the depth of the inclined grooves 18 is shallower as they are closer to the center of the circular ring 14; when the bottom surface of the circular ring 14 and the side with a larger cross-sectional area of ​​the conical head 13 are in close contact with the chip surface, air is still ventilated into the guide sleeve 11, and at this time, the gas can be blown obliquely toward the bottom surface of the surrounding chips through the inclined grooves 18.

[0072] In this embodiment, the moving device 2 includes: a two-axis moving mechanism 21 and a rotating mechanism; the two-axis moving mechanism 21 is arranged on the bracket 4; the rotating mechanism is arranged on the two-axis moving mechanism 21; the guide sleeve 11 is arranged on the rotating mechanism; the two-axis moving mechanism 21 can drive the rotating mechanism to move, and the suction nozzle assembly on the rotating mechanism can suck the chip.

[0073] In this embodiment, the rotating mechanism includes: a connecting member 22 and a rotating motor 23; the rotating motor 23 is arranged on the two-axis moving mechanism 21; the connecting member 22 is connected to the rotating motor 23; the guide sleeve 11 is arranged on the connecting member 22; the rotating motor 23 can drive the connecting member 22 to rotate, and the nozzle assembly on the connecting member 22 sucks the chip and then transports the sucked chip through the rotating motor 23 and the rotation of the connecting member 22.

[0074] In this embodiment, the detection device 3 includes: a pair of detection mechanisms; the detection mechanisms are arranged on both sides of the two-axis moving mechanism 21; the detection mechanisms are suitable for detecting the suction condition of the suction device 1; and the suction condition of the chip can be detected from two directions.

[0075] In this embodiment, the detection mechanism includes: a first slide rail 31, a first slider 32 and a first motor 33; the first slide rail 31 is arranged on the bracket 4; the first slider 32 is arranged on the first slide rail 31; the first motor 33 is arranged on the henna, and the first motor 33 is connected to the first slider 32; a second slide rail 34 is arranged on the first slider 32, and the second slide rail 34 is arranged vertically; the second slide rail 34 is perpendicular to the first slide rail 31; a second slider 35 is arranged on the second slide rail; a second motor 36 is arranged on the first slider 32; the second motor 36 is connected to the second slider 35; a camera 37 is arranged on the second slider 35; the camera 37 can be moved to adapt to the detection of chips of different sizes during the suction process.

[0076] Embodiment 2, based on Embodiment 1, this embodiment 2 also provides a working method adopted by the chip sorting and grasping equipment in Embodiment 1, including: sucking the chip by means of the suction device 1; driving the suction device 1 to move by means of the moving device 2 to transport the sucked chip; detecting the suction condition of the suction device 1 by means of the detection device 3; the specific working method has been described in detail in Embodiment 1 and will not be repeated here.

[0077] In summary, the present invention is provided with a suction device 1, which is suitable for sucking chips; a moving device 2, on which the suction device 1 is arranged, and the moving device 2 is suitable for driving the suction device 1 to move so as to transport the sucked chips; a detection device 3, which is arranged on both sides of the moving device 2, and is suitable for detecting the suction status of the suction device 1; the suction and transportation of chips is realized, and other surrounding chips can be pre-separated by airflow before the chips are sucked, and no air extraction is required during the transportation process, so as to avoid the chips falling during the transportation process due to fluctuations in the air source.

[0078] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0079] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0080] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0081] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0082] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0083] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0084] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A working method adopted by a chip sorting and grabbing device, characterized in that: include: The chip is sucked by a sucking device; The moving device drives the suction device to move so as to carry the sucked chip; The suction condition of the suction device is detected by the detection device; in The suction device is arranged on the moving device, The detection device is arranged on both sides of the mobile device. The suction device comprises: a guide sleeve, a guide rod and a suction nozzle mechanism; The guide sleeve is arranged on the moving device; The guide rod is inserted into the guide sleeve; The top end of the guide rod extends out from the top surface of the guide sleeve; The bottom end of the guide rod is connected to the suction nozzle mechanism; The nozzle mechanism is partially located in the guide sleeve and partially extends out of the bottom end of the guide sleeve; The nozzle mechanism comprises: a conical head and a circular ring; The conical head is connected to the bottom end of the guide rod, that is, the end of the conical head with a smaller cross-sectional area is connected to the bottom end of the guide rod; The circular ring is sleeved on the outer wall of the conical head, and the circular ring is tilted, that is, the outer edge of the circular ring is lower than the inner edge of the circular ring; The outer edge of the circular ring extends out of the bottom end of the guide sleeve; The projection of the circular ring is wider than the projection of the guide sleeve; A limiting ring is provided at the top end of the guide rod; The guide rod is sleeved with a spring; One end of the spring is connected to the bottom surface of the limiting ring, and the other end is connected to the top surface of the guide sleeve; An air port is provided on the outer wall of the guide sleeve; There is a gap between the guide rod and the inner wall of the guide sleeve; A plurality of oblique grooves are provided on the top surface of the circular ring along the radial direction of the circular ring, and the depth of the oblique grooves is shallower as they are closer to the center of the circular ring.

2. The working method according to claim 1, characterized in that: The moving device comprises: a two-axis moving mechanism and a rotating mechanism; The two-axis moving mechanism is arranged on the bracket; The rotating mechanism is arranged on the two-axis moving mechanism; The guide sleeve is arranged on the rotating mechanism.

3. The working method according to claim 2, characterized in that: The rotating mechanism comprises: a connecting member and a rotating motor; The rotating motor is arranged on the two-axis moving mechanism; The connecting member is connected to the rotating motor; The guide sleeve is arranged on the connecting member.

4. The working method according to claim 3, characterized in that: The detection device comprises: a pair of detection mechanisms; The detection mechanism is arranged on both sides of the two-axis moving mechanism; The detection mechanism is suitable for detecting the suction condition of the suction device.

5. The working method according to claim 4, characterized in that: The detection mechanism comprises: a first slide rail, a first slider and a first motor; The first slide rail is arranged on the bracket; The first sliding block is arranged on the first sliding rail; The first motor is arranged on the henna, and the first motor is connected to the first sliding block.

6. The working method according to claim 5, characterized in that: The first sliding block is provided with a second sliding rail, and the second sliding rail is vertically arranged; The second slide rail is perpendicular to the first slide rail; A second sliding block is provided on the second sliding rail; The first sliding block is provided with a second motor; The second motor is connected to the second slider; The second sliding block is provided with a camera.

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