Wafer cleaning machine with alternate cleaning structure

Abstract

This invention relates to the field of wafer cleaning technology and includes an ultrasonic cleaning chamber with a cover on the upper outer surface and a control board near the bottom on the front outer surface. A cleaning chamber is formed on the upper outer surface of the ultrasonic cleaning chamber. The invention utilizes a cleaning frame, a cleaning component, and a rinsing component to allow for the alternating use of immersion, cleaning, and rinsing methods. After the contaminants on the wafer surface are fully integrated with the cleaning solution, limiting rollers on both sides of the wafer simultaneously separate and fix multiple wafers. Multiple cleaning brushes move between the two limiting rollers to perform targeted, thorough cleaning of each wafer surface, resulting in more complete contaminant removal.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more particularly to a wafer cleaning machine with an alternating cleaning structure. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer.

[0003] During the continuous processing and polishing of wafers, the wafer surface comes into contact with various organic substances, particles and metals, generating contaminants. In order to avoid the contaminants remaining on the wafer from adversely affecting subsequent processes, the wafer is cleaned between processing steps.

[0004] Common wafer cleaning equipment typically employs two methods for cleaning wafers. The first method involves immersing the wafers together and then using ultrasonic cleaning to perform a mixed cleaning process. The second method involves rinsing and cleaning each wafer individually. The first method involves cleaning a large number of wafers simultaneously, but dead zones may exist during the process of the wafers adhering to each other or to the cleaning frame. Contaminants in these dead zones cannot be thoroughly cleaned. While the latter method has a better contaminant removal effect, the individual cleaning method is less efficient. Therefore, there is an urgent need for a wafer cleaning machine that can simultaneously perform targeted cleaning on multiple groups of wafers and achieve a better contaminant removal effect. Summary of the Invention

[0005] The purpose of this invention is to solve the problems in the prior art by proposing a wafer cleaning machine with an alternating cleaning structure that can simultaneously perform targeted cleaning on multiple groups of wafers and has a good effect on removing contaminants.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wafer cleaning machine with an alternating cleaning structure, comprising an ultrasonic cleaning chamber, wherein a cover is provided on the upper outer surface of the ultrasonic cleaning chamber, and a control board is provided on the front outer surface of the ultrasonic cleaning chamber near the bottom, a cleaning chamber is opened on the upper outer surface of the ultrasonic cleaning chamber, and a drain pipe with a control valve mounted on its surface is provided on one side outer surface of the ultrasonic cleaning chamber near the bottom, the drain pipe being connected to the cleaning chamber;

[0007] The cleaning chamber is provided with a cleaning frame inside, and several sets of receiving slots are arranged at equal intervals inside the cleaning frame. An electric push rod is provided between the cleaning frame and the cleaning chamber, and one end of the electric push rod is fixedly connected to the cleaning chamber and the other end is fixedly connected to the cleaning frame. The cleaning frame is hollow.

[0008] The cleaning chamber is equipped with a limiting mechanism for clamping the wafers located above the cleaning frame side, and the limiting mechanism includes a rinsing component for cleaning the wafers. The cleaning chamber is also equipped with a cleaning component located above the limiting mechanism.

[0009] Furthermore, the limiting mechanism includes two sets of limiting rollers for fixing the wafer; the outer surfaces of both sets of limiting rollers are provided with U-shaped frames, the limiting rollers are provided with the interior of the U-shaped frames, and an electric push rod II is provided on one side of the outer surface of the U-shaped frame near the middle position, one end of the electric push rod II is fixedly connected to the U-shaped frame, and the other end is fixedly connected to the cleaning chamber.

[0010] Furthermore, the rinsing assembly includes a motor for driving the limiting roller to rotate. Waterproof boxes are provided on one outer surface of both sets of U-shaped frames, and the motor is located inside the waterproof box. The output end of the motor passes through the interior of the U-shaped frame and is fixedly connected to the limiting roller. A flow guiding cavity is provided inside the limiting roller. A connecting pipe is rotatably connected to the end of the limiting roller away from the motor. A connecting pipe is fixedly connected to the outer surface of the U-shaped frame at a position corresponding to the connecting pipe. The connecting pipe, the connecting pipe, and the flow guiding cavity are interconnected.

[0011] Furthermore, the bottom of the cleaning chamber is provided with a first water pump whose output end is connected to two sets of connecting pipes, and the connecting pipes are flexible hoses. Several sets of arc-shaped grooves are equally spaced on the outer surface of the limiting roller, and three sets of nozzles are equally spaced on the inner surface of each set of arc-shaped grooves near the guide cavity.

[0012] Furthermore, the cleaning assembly includes a sliding plate that moves along the inside of the cleaning chamber. A threaded hole is provided on one side of the outer surface of the sliding plate near one end. A threaded rod is threaded into the inside of the threaded hole. Both ends of the threaded rod pass through to the outside of the sliding plate and are rotatably connected to the cleaning chamber. A second motor is provided on one side of the outer surface of the cleaning chamber at a position corresponding to the threaded rod. The output end of the second motor passes through to the inside of the cleaning chamber and is fixedly connected to the threaded rod. A guide rod is movably connected to the inside of the sliding plate on the side away from the threaded rod. Both ends of the guide rod pass through to the outside of the sliding plate and are fixedly connected to the cleaning chamber.

[0013] Furthermore, the lower outer surface of the slide plate is rotatably connected to several sets of connecting shafts at equal intervals, and one end of the connecting shaft extends through to the top of the slide plate and is fixedly connected to a drive wheel. The several sets of drive wheels are connected by a conveyor belt. The upper outer surface of one drive wheel is fixedly connected to a gear through a fixed shaft. The cleaning chamber is fixedly connected to a rack at a position corresponding to the gear, and the rack meshes with the gear. The bottom end of the connecting shaft is fixedly connected to a cleaning roller, and the outer surface of the cleaning roller is provided with a cleaning brush.

[0014] Furthermore, a movable plate is provided between several sets of cleaning rollers, and the movable plate has a movable hole at the position corresponding to the cleaning roller. Two sets of electric push rods are symmetrically arranged between the sliding plate and the movable plate. One end of the electric push rod is fixedly connected to the sliding plate and the other end is fixedly connected to the movable plate.

[0015] Furthermore, an annular brush that fits against the cleaning brush is detachably fixedly connected to the inside of the movable hole near the bottom end, and four sets of nozzles are fixedly connected at equal intervals inside the movable hole above the annular brush. The movable plate has a movable cavity inside, and the movable cavity communicates with the nozzles. The water outlet of the nozzles is tilted downward at 20 degrees. A second water pump is installed inside the cleaning cavity, and a guide pipe is installed between the output end of the second water pump and the movable cavity.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0017] 1. In this invention, by setting up a cleaning frame, a cleaning component, and a rinsing component to work together, the three methods of immersion, cleaning, and rinsing can be used alternately to improve the cleaning effect. After the contaminants on the wafer surface are fully fused with the cleaning liquid, the limiting rollers set on both sides of the wafer are used to separate and limit multiple wafers at the same time. Then, multiple sets of cleaning brushes move between the two sets of limiting rollers to perform targeted and thorough cleaning of each wafer surface at the same time, which can make the contaminants removed more thoroughly.

[0018] In addition, by using two nozzles located between two adjacent sets of wafers to perform targeted small-area rinsing of the wafers, the active cleaning of the cleaning brush can be assisted, allowing contaminants on the wafer surface to be quickly removed. Compared with the single cleaning method in the existing technology, the cleaning fluid can be fully mixed with the contaminants, improving the thoroughness of cleaning the contaminants attached to the wafer surface.

[0019] 2. In this invention, by setting an annular brush to move up and down to clean the surface of the cleaning brush, the cleaning brush can be kept clean while cleaning the wafer, thereby improving the cleaning effect on the wafer. In addition, the filtered cleaning solution is used to rinse both the annular brush and the cleaning brush at the same time during the cleaning process, so as to avoid some highly adhesive contaminants from adhering to the surface of the cleaning brush and the annular brush for a long time due to their inability to be removed, or even causing cross-contamination of the cleaning solution. This improves the cleaning effect while ensuring cleaning safety. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a three-dimensional structural diagram of the cleaning component of the present invention;

[0022] Figure 3 For the present invention Figure 2 Enlarged view of region A;

[0023] Figure 4 This is a combined view of the limiting mechanism and the cleaning component of the present invention;

[0024] Figure 5 This is a combined view of the cleaning roller and the movable plate of the present invention;

[0025] Figure 6 This is a combined view of the annular brush and cleaning brush of the present invention;

[0026] Figure 7 This is a schematic diagram of the flushing assembly structure of the present invention;

[0027] Figure 8 This is a combined view of the arc-shaped groove and the limiting roller of the present invention.

[0028] Attached reference numerals: 1. Ultrasonic cleaning box; 2. Box cover; 3. Control panel; 4. Cleaning chamber; 5. Cleaning frame; 6. Electric push rod one; 7. Limiting mechanism; 701. Limiting roller; 702. U-shaped frame; 703. Electric push rod two; 8. Flushing assembly; 801. Motor one; 802. Connecting pipe one; 803. Connecting pipe two; 804. Guide chamber; 805. Arc groove; 806. Nozzle one; 9. Cleaning assembly; 901. Slide plate; 902. Threaded rod; 904. Motor II; 905. Guide rod; 906. Connecting shaft; 907. Drive wheel; 908. Conveyor belt; 909. Gear; 910. Rack; 911. Cleaning roller; 912. Cleaning brush; 913. Movable hole; 914. Movable plate; 915. Electric push rod III; 916. Annular brush; 917. Movable cavity; 918. Nozzle II; 10. Receiving groove. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1: As Figure 1 and Figure 5 As shown, the wafer cleaning machine with an alternating cleaning structure proposed in this invention includes an ultrasonic cleaning box 1, a box cover 2 is provided on the upper outer surface of the ultrasonic cleaning box 1, and a control plate 3 is provided on the front outer surface of the ultrasonic cleaning box 1 near the bottom. A cleaning chamber 4 is opened on the upper outer surface of the ultrasonic cleaning box 1.

[0031] The cleaning chamber 4 is equipped with a cleaning frame 5, and the cleaning frame 5 is equipped with several sets of receiving slots 10 at equal intervals. Before cleaning, the wafers are placed into the receiving slots 10 one by one, and the wafers fit into the receiving slots 10. Then the cover 2 is closed.

[0032] A drain pipe with a control valve is installed on the bottom of one side of the outer surface of the ultrasonic cleaning chamber 1. An inlet pipe is located near the top of one side of the ultrasonic cleaning chamber 1. Both the inlet and drain pipes are connected to the cleaning chamber 4. When the ultrasonic cleaning chamber 1 is running, primary cleaning solution is injected into the cleaning chamber 4 through the inlet pipe until it covers the top of the wafer, immersing the wafer in the solution. Simultaneously, the ultrasonic cleaning chamber 1 uses ultrasound to perform preliminary cleaning of the wafer, removing some contaminants adhering to the wafer surface. The material is fully dissolved. An electric push rod 6 is provided between the cleaning frame 5 and the cleaning chamber 4. One end of the electric push rod 6 is fixedly connected to the cleaning chamber 4, and the other end is fixedly connected to the cleaning frame 5. The cleaning frame 5 is hollow, and the wafer is fully immersed in the cleaning solution. After immersion for a period of time, the electric push rod 6 pushes the cleaning frame 5 to move upward. A limiting mechanism 7 for clamping the wafer is provided inside the cleaning chamber 4 at a position above the side of the cleaning frame 5 until the middle of the wafer corresponds to the limiting mechanism 7, and the limiting mechanism 7 fixes the wafer.

[0033] Example 2: Figure 1 , Figure 4 and Figure 8 As shown, the difference between this embodiment and embodiment 1 is that the limiting mechanism 7 includes two sets of limiting rollers 701 for fixing the wafers; the outer surfaces of both sets of limiting rollers 701 are provided with U-shaped frames 702, the limiting rollers 701 are provided with the interior of the U-shaped frames 702, and an electric push rod 703 is provided near the middle of one side of the outer surface of the U-shaped frame 702. One end of the electric push rod 703 is fixedly connected to the U-shaped frame 702, and the other end is fixedly connected to the cleaning chamber 4. The motor 904 pushes the U-shaped frame 702 to move towards the wafers. Therefore, the limiting rollers 701 simultaneously separate and fix multiple sets of wafers.

[0034] Example 3: Figure 1-6 As shown, the difference between this embodiment and Embodiments 1 and 2 is that the cleaning component 9 includes a sliding plate 901 that moves along the inside of the cleaning chamber 4. A threaded hole is provided on one side of the outer surface of the sliding plate 901 near one end. A threaded rod 902 is threadedly connected inside the threaded hole. Both ends of the threaded rod 902 pass through to the outside of the sliding plate 901 and are rotatably connected to the cleaning chamber 4.

[0035] Furthermore, a second motor 904 is installed on one outer surface of the cleaning tank at a position corresponding to the threaded rod 902. The output end of the second motor 904 extends into the interior of the cleaning chamber 4 and is fixedly connected to the threaded rod 902. The output end of the second motor 904 drives the threaded rod 902 to rotate in both directions, thereby driving the cleaning brush 912 to move between the two sets of limiting rollers 701. A guide rod 905 is movably connected to the side of the slide plate 901 away from the threaded rod 902, and both ends of the guide rod 905 extend into the exterior of the slide plate 901 and are fixedly connected to the cleaning chamber 4.

[0036] A plurality of connecting shafts 906 are rotatably connected at equal intervals to the lower outer surface of the slide plate 901. One end of each connecting shaft 906 extends through to the top of the slide plate 901 and is fixedly connected to a drive wheel 907. A conveyor belt 908 is connected between the plurality of drive wheels 907. A cleaning roller 911 is fixedly connected to the bottom end of the connecting shaft 906. The cleaning roller 911 is offset from the receiving groove 10 and is located on one side of the corresponding wafer. A cleaning brush 912 is provided on the outer surface of the cleaning roller 911. The wafer is cleaned by the movement of the movable plate 914; a gear 909 is fixedly connected to the upper outer surface of the drive wheel 907 located at one end via a fixed shaft; a rack 910 is fixedly connected to the inside of the cleaning chamber 4 at the position corresponding to the gear 909, and the rack 910 meshes with the gear 909. During the movement of the cleaning brush 912, several sets of cleaning rollers 911 simultaneously drive the corresponding cleaning brush 912 to rotate and clean the wafer under the combined action of the conveyor belt 908 and the gear 909.

[0037] Example 4: Figure 4 and Figure 7 As shown, the difference between this embodiment and embodiments 1, 2, and 3 is that the rinsing assembly 8 includes a motor 801 for driving the limiting roller 701 to rotate. A waterproof box is provided on one side of the outer surface of both sets of U-shaped frames 702, and the motor 801 is located inside the waterproof box. The output end of the motor 801 passes through the interior of the U-shaped frame 702 and is fixedly connected to the limiting roller 701. A flow guiding cavity 804 is provided inside the limiting roller 701. A connecting pipe 802 is rotatably connected to the end of the limiting roller 701 away from the motor 801. A connecting pipe 803 is fixedly connected to the outer surface of the U-shaped frame 702 at the position corresponding to the connecting pipe 802. The connecting pipe 802, the connecting pipe 803, and the flow guiding cavity 804 are connected to each other.

[0038] The bottom of the cleaning chamber 4 is equipped with a first water pump whose output end is connected to two sets of connecting pipes 803. The connecting pipes 803 are flexible hoses that can accommodate several sets of arc-shaped grooves 805 that are equidistantly opened on the outer surface of the limiting roller 701. The arc-shaped grooves 805 correspond to the cleaning brush 912 and are therefore misaligned with the wafer, thus preventing the wafer from getting stuck inside the arc-shaped grooves 805 and causing dead corners during the cleaning process of the cleaning brush 912. Three sets of nozzles 806 are equidistantly arranged on the inner surface of each set of arc-shaped grooves 805 near the guide cavity 804. The filtered cleaning liquid inside the cleaning chamber is sprayed onto the surface of the wafer through the nozzles 806 under the action of the first water pump, which helps to quickly separate the cleaned contaminants from the wafer.

[0039] Example 5: Figure 1-6 As shown, the difference between this embodiment and embodiments 1, 2, 3, and 4 is that a movable plate 914 is provided between several sets of cleaning rollers 911. The movable plate 914 has a movable hole 913 at the position corresponding to the cleaning roller 911. Two sets of electric push rods 915 are symmetrically arranged between the sliding plate 901 and the movable plate 914. One end of the electric push rod 915 is fixedly connected to the sliding plate 901 and the other end is fixedly connected to the movable plate 914. An annular brush 916 that fits against the cleaning brush 912 is detachably fixedly connected to the inside of the movable hole 913 near the bottom. The electric push rod 915 pushes and pulls the movable plate 914 up and down twice, and the annular brush 916 cleans the contaminants attached to the surface of the cleaning brush 912.

[0040] Four sets of nozzles 918 are fixedly connected at equal intervals inside the movable hole 913, located above the annular brush 916. The movable plate 914 has a movable cavity 917 inside, which is connected to the nozzles 918. The filtered primary cleaning solution is sprayed onto the surfaces of the cleaning brush 912 and the annular brush 916 through the nozzles 918 under the action of the second water pump, rinsing the contaminants attached to the surfaces of both. The water outlet of the nozzles 918 is tilted downward at 20 degrees, so that the nozzles 918 can rinse the annular brush 916 and the cleaning brush 912 at the same time. The cleaning cavity 4 is equipped with a second water pump, and a guide pipe is provided between the output end of the second water pump and the movable cavity 917.

[0041] The working process and principle of this invention are as follows:

[0042] Step 1: Before cleaning, place the wafers one by one into the receiving tank 10, then close the lid 2. Control the operation of the ultrasonic cleaning tank 1 by selecting the control keys on the surface of the control panel 3. The primary cleaning solution is injected into the cleaning chamber 4 through the water inlet pipe on one side of the ultrasonic cleaning tank 1 until the primary cleaning solution covers the top of the wafers and immerses the wafers. At the same time, the ultrasonic cleaning tank 1 performs preliminary cleaning of the wafers with ultrasonic waves, so that some of the contaminants attached to the surface of the wafers are fully dissolved.

[0043] Step 2: After soaking for a period of time, the electric push rod 6 pushes the cleaning frame 5 upward until the middle of the wafer corresponds to the limiting roller 701. At this time, the motor 904 pushes the U-shaped frame 702 to move closer to the wafer. The arc groove 805 is misaligned with the wafer, so the outer surface of the limiting roller 701 is in contact with the wafer. Then, the cleaning frame 5 is separated from the wafer under the pull of the electric push rod 6. The bottom end of the wafer is located above the cleaning roller 911, and the wafer is located on one side of the corresponding cleaning roller 911.

[0044] Step 3: At this time, motor 2 904 and the first water pump run simultaneously. The output end of motor 2 904 drives the threaded rod 902 to rotate in both directions, thereby driving the cleaning brush 912 to move between the two sets of limiting rollers 701 and remove the firmly adhered contaminants on the wafer surface. Since gear 909 meshes with rack 910 and several sets of drive wheels 907 are connected by conveyor belt 908, the cleaning roller 911 drives the cleaning brush 912 to rotate as the cleaning brush 912 moves with the movable plate 914, thereby improving the cleaning effect. During this process, the filtered cleaning liquid inside the cleaning box is sprayed onto the wafer surface through nozzle 806 under the action of the first water pump, which helps the cleaned contaminants to quickly separate from the wafer.

[0045] Step 4: After the cleaning roller 911 moves back and forth between the two sets of limiting rollers 701 three times, the cleaning frame 5 is pushed by the electric push rod to fit the wafer again, the wafer enters the inside of the receiving groove 10, the limiting roller 701 returns to its original position, and the cleaning frame 5 moves down until the wafer separates from the cleaning brush 912.

[0046] Step 5: Then, the electric push rod 3 915 repeatedly pushes and pulls the movable plate 914 up and down twice. The annular brush 916 cleans the contaminants attached to the surface of the cleaning brush 912, thereby ensuring that the cleaning brush 912 is in a clean state and improving the cleaning effect on the wafer. During this process, the filtered primary cleaning solution is sprayed onto the surface of the cleaning brush 912 and the annular brush 916 through the nozzle 2 918 under the action of the second water pump, rinsing the contaminants attached to both surfaces.

[0047] Step 6: After cleaning the cleaning brush 912, clean the wafer again according to the above steps. After cleaning twice, drain the first cleaning solution through the drain pipe, and then inject pure water to rinse the wafer, ultrasonic cleaning box 1 and its internal components. At the same time, the electric push rod 6 pushes the cleaning frame 5 upward to align the wafer with the limiting roller 701. Then, the motor 801 and the first water pump are turned on at the same time. Pure water rinses the wafer through the nozzle 806, and the motor 801 drives the limiting roller 701 to rotate slightly in both directions to expand the rinsing range.

[0048] Step 7: After rinsing, inject secondary cleaning solution into the ultrasonic cleaning chamber 1, and continue cleaning the wafers according to the above steps until all the necessary cleaning solutions are used. The primary and secondary cleaning solutions have different compositions, which can dissolve different contaminants on the wafer surface. Pure water is placed between the two sets of cleaning solutions to rinse the inside of the ultrasonic cleaning chamber 1, which can avoid cross-contamination between the two cleaning solutions and ensure cleaning safety. In addition, during this process, the surface is cleaned alternately by immersion and cleaning with cleaning brush 912. Compared with the single cleaning method in the prior art, the cleaning solution can fully mix with the contaminants and improve the thoroughness of contaminant removal.

[0049] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer cleaning machine with an alternating cleaning structure, comprising an ultrasonic cleaning chamber (1), wherein a cover (2) is provided on the upper outer surface of the ultrasonic cleaning chamber (1), and a control board (3) is provided on the front outer surface of the ultrasonic cleaning chamber (1) near the bottom, characterized in that, The ultrasonic cleaning box (1) has a cleaning chamber (4) on its upper outer surface, and a drain pipe with a control valve installed on its surface is provided on one side of the outer surface of the ultrasonic cleaning box (1) near the bottom. The drain pipe is connected to the cleaning chamber (4). The cleaning chamber (4) is provided with a cleaning frame (5), and the cleaning frame (5) is provided with several sets of receiving slots (10) at equal intervals. An electric push rod (6) is provided between the cleaning frame (5) and the cleaning chamber (4), and one end of the electric push rod (6) is fixedly connected to the cleaning chamber (4), and the other end is fixedly connected to the cleaning frame (5). The cleaning frame (5) is hollow. The cleaning chamber (4) is provided with a limiting mechanism (7) for clamping the wafer inside the cleaning frame (5) and the limiting mechanism (7) includes a rinsing component (8) for cleaning the wafer. The cleaning chamber (4) is provided with a cleaning component (9) above the limiting mechanism (7). The limiting mechanism (7) includes two sets of limiting rollers (701) for fixing the wafer; the outer surfaces of the two sets of limiting rollers (701) are provided with U-shaped frames (702), the limiting rollers (701) are provided with the interior of the U-shaped frames (702), and an electric push rod (703) is provided on one side of the outer surface of the U-shaped frame (702) near the middle. One end of the electric push rod (703) is fixedly connected to the U-shaped frame (702), and the other end is fixedly connected to the cleaning chamber (4); The rinsing assembly (8) includes a motor (801) for driving the limiting roller (701) to rotate. Waterproof boxes are provided on one side of the outer surface of both sets of U-shaped frames (702), and the motor (801) is located inside the waterproof box. The output end of the motor (801) passes through the interior of the U-shaped frame (702) and is fixedly connected to the limiting roller (701). A flow guide cavity (804) is opened inside the limiting roller (701). A connecting pipe (802) is rotatably connected to the end of the limiting roller (701) away from the motor (801). A connecting pipe (803) is fixedly connected to the outer surface of the U-shaped frame (702) at the position corresponding to the connecting pipe (802). The connecting pipe (802), the connecting pipe (803), and the flow guide cavity (804) are connected to each other. The bottom of the cleaning chamber (4) is provided with a first water pump whose output end is connected to two sets of connecting pipes (803), and the connecting pipes (803) are flexible hoses. The outer surface of the limiting roller (701) is provided with several sets of arc grooves (805) at equal intervals. Each set of arc grooves (805) has three sets of nozzles (806) at equal intervals on the inner surface of the inner surface of each set of arc grooves (805) near the guide chamber (804). The limiting rollers (701) are set on both sides of the wafer to simultaneously separate and limit multiple sets of wafers. Then, the cleaning component (9) moves between the two sets of limiting rollers (701) to perform targeted cleaning of the surface of each wafer without dead angles.

2. The wafer cleaning machine with an alternating cleaning structure according to claim 1, characterized in that, The cleaning assembly (9) includes a slide plate (901) that moves along the inside of the cleaning chamber (4). A threaded hole is provided on one side of the outer surface of the slide plate (901) near one end. A threaded rod (902) is threadedly connected inside the threaded hole. Both ends of the threaded rod (902) pass through the outside of the slide plate (901) and are rotatably connected to the cleaning chamber (4). A motor (904) is provided on one side of the outer surface of the ultrasonic cleaning box (1) at a position corresponding to the threaded rod (902). The output end of the motor (904) passes through the inside of the cleaning chamber (4) and is fixedly connected to the threaded rod (902). A guide rod (905) is movably connected to the side of the slide plate (901) away from the threaded rod (902). Both ends of the guide rod (905) pass through the outside of the slide plate (901) and are fixedly connected to the cleaning chamber (4).

3. The wafer cleaning machine with an alternating cleaning structure according to claim 2, characterized in that, The lower outer surface of the slide plate (901) is rotatably connected to several sets of connecting shafts (906) at equal distances. One end of the connecting shaft (906) extends through the upper part of the slide plate (901) and is fixedly connected to a drive wheel (907). The several sets of drive wheels (907) are connected by a conveyor belt (908). The upper outer surface of the drive wheel (907) located at one end is fixedly connected to a gear (909) through a fixed shaft. The cleaning chamber (4) is fixedly connected to a rack (910) at a position corresponding to the gear (909), and the rack (910) meshes with the gear (909). The bottom end of the connecting shaft (906) is fixedly connected to a cleaning roller (911), and the outer surface of the cleaning roller (911) is provided with a cleaning brush (912).

4. The wafer cleaning machine with an alternating cleaning structure according to claim 3, characterized in that, A movable plate (914) is provided between several sets of cleaning rollers (911). The movable plate (914) is provided with a movable hole (913) at the position corresponding to the cleaning roller (911). Two sets of electric push rods (915) are symmetrically arranged between the slide plate (901) and the movable plate (914). One end of the electric push rod (915) is fixedly connected to the slide plate (901) and the other end is fixedly connected to the movable plate (914).

5. The wafer cleaning machine with an alternating cleaning structure according to claim 4, characterized in that, The movable hole (913) is detachably fixed to a ring brush (916) that fits against the cleaning brush (912) near the bottom. Four sets of nozzles (918) are fixedly connected at equal distances inside the movable hole (913) above the ring brush (916). The movable plate (914) has a movable cavity (917) inside, and the movable cavity (917) communicates with the nozzles (918). The water outlet of the nozzles (918) is tilted downward at 20 degrees. The cleaning chamber (4) is equipped with a second water pump. A guide pipe is provided between the output end of the second water pump and the movable cavity (917).

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