PCBA board packaging device and PCBA board packaging method

Abstract

The application discloses a PCBA board packaging device and a PCBA board packaging method, wherein the PCBA board packaging device comprises an operation table for placing a PCBA board, a spraying device for spraying the PCBA board, the spraying device is provided with a plurality of discharge units which move together, at least one of the discharge units can independently spray, a feeding device which is connected with the spraying device and can feed raw materials to the spraying device, a driving device which is connected with the spraying device and can drive the spraying device to move, and a control device which is connected with the spraying device and the driving device and can control the spraying device to move and spray raw materials according to a predetermined track. The PCBA board packaging device and the PCBA board packaging method can realize accurate spraying and packaging of the PCBA board.

Description

[0001] This application is a divisional application of application No. "201810301516.8", with a filing date of "April 4, 2018", and an invention title of "PCBA board packaging equipment and PCBA board packaging method". TECHNICAL FIELD

[0002] The present application relates to the field of circuit board packaging, in particular to a PCBA board packaging equipment and a PCBA board packaging method. BACKGROUND

[0003] There are many packaging methods for PCBA (Printed Circuit Board+Assembly) boards, such as coating three-proof paint on the surface of the circuit board, potting, and low-pressure injection molding. Each of the above methods has its own advantages and disadvantages: directly spraying three-proof paint, although it is simple, convenient and easy to implement, it cannot provide real protection for the circuit board and cannot achieve waterproofing and shockproofing. Over time, the packaging may fail; potting is tedious, inefficient, costly and has poor reliability; low-pressure injection molding uses a low-pressure injection molding device to complete the packaging of the circuit board by using a special mold and adjusting the corresponding injection pressure and time. The mold design and production cost of this method is high, and the characteristics of the glue itself have a great impact on the packaging.

[0004] In the prior art, low-pressure injection molding is commonly used to package circuit boards to achieve waterproof sealing and insulation and flame retardation. However, due to the continuous improvement of technology, the specifications and sizes of the circuit boards to be encapsulated are becoming larger and the thickness of the products is becoming thinner. The existing injection molding method cannot meet the packaging requirements of such circuit boards.

[0005] At the same time, the existing PCBA boards use one spray head for multiple back-and-forth spraying encapsulation. This not only has poor precision control, but also brings unnecessary encapsulation to adjacent modules or components that do not require encapsulation, resulting in material waste and reduced encapsulation speed. In addition, due to the low selectivity, the lower part of the components may not be covered, and the lower end of the pins cannot be effectively filled and encapsulated.

[0006] In addition, in the process of encapsulating electronic circuit boards, chip modules differ from other components in that they have a certain height and relatively more exposed pins. If the encapsulation of chip modules can be effectively solved, the encapsulation requirements of other components can be fully met. Therefore, in the process of encapsulating electronic circuit boards, chip modules need to be encapsulated, and a large amount of glue is given to the chip part. However, due to the physical properties of the glue itself, it will flow irregularly, resulting in poor encapsulation effect. SUMMARY

[0007] In view of the above shortcomings of the prior art, the present application provides a PCBA board packaging equipment and a PCBA board packaging method to at least solve one of the above problems.

[0008] The technical solution adopted in this invention is as follows:

[0009] A PCBA board packaging device, comprising:

[0010] A workbench for placing PCBA boards;

[0011] A spraying device for spraying coating onto the PCBA board; the spraying device has multiple discharge units that move together; at least one of the discharge units is capable of spraying coating independently;

[0012] A feeding device connected to the spraying device, the feeding device being able to supply raw materials to the spraying device;

[0013] A drive device connected to the spraying device, which can drive the spraying device to move;

[0014] A control device connected to the spraying device and the driving device; the control device is capable of controlling the spraying device to move and spray material according to a predetermined trajectory.

[0015] Preferably, it also includes a curing device that moves together with the spraying device; the curing device can cure the adhesive sprayed by the spraying device on the PCBA board.

[0016] Preferably, the curing device cures the material simultaneously with the spraying device.

[0017] Preferably, the curing device is located on the side of the spraying device that is opposite to the direction of travel.

[0018] Preferably, the curing device includes a light source fixedly connected to the spraying device; the feeding device can supply photocurable resin to the spraying device.

[0019] Preferably, the irradiation direction of the curing device deviates from the spraying direction of the spraying device.

[0020] Preferably, the operating table is also provided with an anti-reflection part, which can prevent the light emitted by the light source from being reflected.

[0021] Preferably, the anti-reflective part includes a light-absorbing coating applied to the surface of the operating table.

[0022] Preferably, each of the discharge units is capable of independent spraying; at least two of the discharge units can discharge different adhesives.

[0023] Preferably, the multiple discharge units are arranged in an array.

[0024] Preferably, the discharge unit is equipped with an electromagnetic check valve for controlling the discharge; the electromagnetic check valve of each discharge unit is connected to the control device.

[0025] Preferably, the driving device includes a first motion mechanism for driving the spraying device to move along a first axis and a second motion mechanism for driving the spraying device to move along a second axis; the first axis and the second axis are perpendicular to each other and are both parallel to the operating table.

[0026] Preferably, the driving device further includes a third motion mechanism that drives the spraying device and / or the operating table to move along a third axis; the third axis is perpendicular to the first axis and the second axis; the control device can control the distance between the spraying device and the spraying surface of the PCBA board to remain constant through the driving device.

[0027] Preferably, the control device can determine the position of the spraying device based on the packaging surface coordinates of the packaging three-dimensional model of the PCBA board.

[0028] Preferably, it also includes a dispensing nozzle; the control device is capable of controlling the dispensing device to form a dam around a predetermined component on the PCBA board; the dam surrounds the predetermined component and its pins; the dispensing nozzle is capable of filling the dam.

[0029] Preferably, the feeding device includes a glue supply cartridge and a pressure supply cartridge; one end of the glue supply cartridge is connected to a glue supply pump via a first glue supply pipe, and the other end is connected to a spraying device via a second glue supply pipe; one end of the pressure supply cartridge is connected to a pneumatic pump via a first pressure supply pipe, and the other end is connected to the glue supply cartridge via a second pressure supply pipe.

[0030] A PCBA board packaging method using the PCBA board packaging equipment described above includes the following steps:

[0031] Place the PCBA board on the worktable;

[0032] Establish a three-dimensional packaging model of the PCBA board in a three-dimensional coordinate system;

[0033] The spraying device is controlled to spray the PCBA board according to the encapsulation 3D model of the PCBA board.

[0034] Preferably, establishing the packaged three-dimensional model of the PCBA board in a three-dimensional coordinate system includes:

[0035] A three-dimensional model of the PCBA board is created in a three-dimensional coordinate system by scanning the PCBA board on the operating table.

[0036] Preferably, controlling the spraying device to spray the PCBA board according to the three-dimensional packaging model of the PCBA board includes:

[0037] The position of the spraying device is determined based on the coordinates of the packaging surface of the 3D model of the PCBA board.

[0038] Preferably, controlling the spraying device to spray the PCBA board according to the three-dimensional packaging model of the PCBA board includes:

[0039] During the spraying process, the distance between the spraying device and the spraying surface of the PCBA board remains constant.

[0040] Preferably, controlling the spraying device to spray the PCBA board according to the three-dimensional packaging model of the PCBA board includes:

[0041] The encapsulation area of ​​the PCBA board is coated with multiple layers and cured layer by layer.

[0042] Preferably, controlling the spraying device to spray the PCBA board according to the three-dimensional packaging model of the PCBA board includes:

[0043] For the same location, the relative position of the spraying device remains unchanged during multiple spraying processes.

[0044] Preferably, controlling the spraying device to spray the PCBA board according to the three-dimensional packaging model of the PCBA board includes:

[0045] A dam is formed by spraying multiple times around a predetermined component on the PCBA board using a spraying device and a curing device; the coating formed by each spraying is cured at the same time.

[0046] Spray adhesive into the inside of the dam to fill it.

[0047] Beneficial effects:

[0048] The spraying device of the PCBA board packaging equipment provided by the present invention has multiple dispensing units, and at least one of the dispensing units can be sprayed independently. This allows the dispensing unit to have multiple independent dispensing ports, thereby enabling a larger spraying range. This not only improves spraying efficiency but also adapts to the spraying requirements of larger PCBA boards. Furthermore, since at least one dispensing unit can be sprayed independently, when the spraying device is spraying the corresponding area of ​​the PCBA board, only the dispensing unit corresponding to the area requiring packaging needs to be opened, while the dispensing units corresponding to areas that do not require spraying can be closed, thereby achieving precise spraying and packaging of the PCBA board.

[0049] In addition, even if the spraying range of the PCBA board packaging equipment is the same as that of the existing nozzles, the spraying device is equipped with multiple dispensing units. Each dispensing unit has a small spraying range, and at least one dispensing unit can spray independently, resulting in higher spraying accuracy. This can effectively avoid spraying problems that may occur to adjacent modules or components that do not require packaging. Furthermore, the spraying device can control the dispensing units to be sprayed in the packaging area as desired. By having two or more dispensing units that can spray independently, the spraying device can achieve further controllable spraying within the area covered by the spraying device, thus achieving the purpose of fine spraying.

[0050] Specific embodiments of the invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the invention can be employed. It should be understood that the embodiments of the invention are not therefore limited in scope. Within the spirit and scope of the appended claims, embodiments of the invention include many changes, modifications, and equivalents.

[0051] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0052] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a schematic diagram of a PCBA board packaging device provided in an embodiment of the present invention;

[0055] Figure 2 yes Figure 1 Side view of the spraying device and curing device in the diagram;

[0056] Figure 3 yes Figure 1 Schematic diagram of the connection structure between the spraying device and the feeding device;

[0057] Figure 4 yes Figure 3 A bottom view of the spraying device;

[0058] Figure 5 This is a top view of the chip module package;

[0059] Figure 6 This is a longitudinal sectional view of the chip module package;

[0060] Figure 7 This is a schematic diagram of the chip module packaging process;

[0061] Figure 8 This is a schematic diagram of a PCBA board packaging method provided in an embodiment of the present invention. Detailed Implementation

[0062] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0063] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0064] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0065] Please see Figures 1 to 4 This invention provides a PCBA board packaging device, comprising: an operating table 6 for placing PCBA boards; a spraying device 1 for spraying coating onto the PCBA boards; a feeding device connected to the spraying device 1, the feeding device being able to supply raw materials to the spraying device 1; a driving device connected to the spraying device 1, which is able to drive the spraying device 1 to move; and a control device connected to the spraying device 1 and the driving device; the control device being able to control the spraying device 1 to move and spray coating according to a predetermined trajectory.

[0066] This PCBA board packaging equipment can package PCBA boards, not just for applying conformal coating. It can also seal the PCBA boards with adhesive, providing waterproofing, thermal conductivity, or insulation. When using this PCBA board packaging equipment for spray coating and packaging, the PCBA board is placed on the operating table 6. Then, under the control of the control device, the drive device drives the spraying device 1 to spray and package the PCBA board. The control device controls the spraying device 1 to spray the PCBA board according to a preset path until the required packaging area is completed.

[0067] In this embodiment, the spraying device 1 sprays encapsulation onto the PCBA board. In a specific embodiment, the spraying device 1 may have multiple dispensing units 18 that move together; at least one of the dispensing units 18 can be sprayed independently. Correspondingly, each dispensing unit 18 may have one or more dispensing ports 19 through which the PCBA board is sprayed. At least one dispensing unit 18 can be sprayed independently, and the dispensing and spraying of this dispensing unit 18 can be controlled by a control device. Correspondingly, the dispensing of other dispensing units 18 can also be controlled by a control device.

[0068] Preferably, each of the dispensing units 18 is capable of independent spraying. The opening and closing of each dispensing unit 18 can be controlled by a control device. To achieve a better spraying range and facilitate fine spraying, multiple dispensing units 18 are arranged in an array. Each dispensing unit 18 in the array arrangement can be controlled by a control device to dispense material, so that the dispensing units 18 to be sprayed can be controlled as desired in the corresponding packaging area. By providing two or more independently sprayable dispensing units 18, the spraying device 1 enables further controllable spraying within the area covered by the spraying device 1, achieving the purpose of fine spraying.

[0069] In this embodiment, at least two of the discharge units can discharge different adhesive materials. The feeding device can simultaneously supply different adhesive materials to the discharge units. The ability of at least two discharge units to discharge different adhesive materials enables the simultaneous spraying of multiple encapsulation materials using a single spraying device.

[0070] Among them, multiple discharge units are arranged in parallel rows and columns. For example... Figure 4 As shown, the multiple discharge units 18 on the spraying device 1 are arranged in 6 columns and 5 rows. Specifically, each discharge unit 18 is equipped with a solenoid check valve to control the discharge. The solenoid check valve of each discharge unit 18 can be connected to the control device. The control device controls the discharge of the discharge unit 18 by controlling the opening and closing of the solenoid check valve.

[0071] The spraying device 1 of the PCBA board packaging equipment provided in this embodiment is equipped with multiple dispensing units 18, and at least one of the dispensing units 18 can be sprayed independently. This allows each dispensing unit 18 to have multiple independently dispensing outlets 19, thereby providing a larger spraying range. This not only improves spraying efficiency but also adapts to the spraying requirements of larger-sized PCBA boards. Furthermore, since at least one dispensing unit 18 can be sprayed independently, when spraying the corresponding area of ​​the PCBA board, only the dispensing unit 18 corresponding to the desired packaging area needs to be opened; the dispensing units 18 corresponding to areas that do not require spraying can be closed, thus achieving precise spraying and packaging.

[0072] In addition, even though the spraying range of the spraying device 1 of the PCBA board packaging equipment is the same as that of the existing spray head, the spraying device 1 is equipped with multiple discharge units 18. The spraying range corresponding to each discharge unit 18 is very small, and at least one discharge unit 18 can spray independently, so the spraying accuracy is high. This can effectively avoid spraying problems that may be caused to adjacent modules or components that do not require packaging.

[0073] In this embodiment, the operating table 6 is used to receive and place PCBA boards. The operating table 6 has a placement area, which corresponds to the three-dimensional coordinate system of the control device. When the PCBA board is placed in the placement area, the spraying and encapsulation operation begins. The placement area can be the receiving surface or space of the workbench, or it can be a part of the surface of the workbench. Its shape can be a rectangular area, a square area, or other regular shapes. Of course, irregular shapes are also applicable, and this application is not limited. The shape of the placement area can also match the shape of the PCBA board, so that the PCBA board fits perfectly when placed in the placement area, facilitating the spraying of adhesive by the nozzle. A single PCBA board or multiple PCBA boards can be placed in the same spraying area at one time. When multiple PCBA boards are placed simultaneously, they can be laid out flat in the placement area.

[0074] In this embodiment, a robotic arm or conveyor belt of a sealing equipment can be used to transfer PCBA boards. For example, the PCBA boards can be transported to a workbench via a conveyor belt in a production line manner, or the conveyor belt can carry the PCBA boards to a predetermined position for adhesive spraying (in this case, the conveyor belt also serves as a workbench). Of course, in this step, PCBA boards can also be placed manually into the placement area.

[0075] In one specific embodiment, to avoid the influence of irregular movement caused by the adhesive being sprayed onto the PCBA board, the PCBA board packaging equipment includes: an operating table 6 for placing the PCBA board; a spraying device 1 for spraying the adhesive onto the PCBA board; a feeding device connected to the spraying device 1, which supplies raw materials to the spraying device 1; a driving device connected to the spraying device 1, which drives the spraying device 1 to move; and a curing device 3 that moves together with the spraying device 1. The curing device 3 can cure the adhesive sprayed onto the PCBA board by the spraying device 1.

[0076] The curing device 3 can be fixed to the spraying device 1, so that it moves together with the spraying device 1. Specifically, the curing device 3 can be fixed together with the spraying device 1 via the connecting shaft 2. The curing device 3 cures the coating simultaneously with the spraying process of the spraying device 1. As the spraying device 1 moves past the sprayed surface of the PCBA board, a thin coating layer is formed on the sprayed surface. At the same time, the curing device 3 cures this thin coating layer, avoiding the influence of the coating layer flowing.

[0077] To ensure that the curing device 3 cures the adhesive (or conformal coating) sprayed from the spraying device 1, the curing device 3 is positioned on the side of the spraying device 1 facing away from the forward direction. That is, the curing device 3 is fixed to the rear of the spraying device 1. Correspondingly, the spraying device 1 sprays material from the front, and the curing device 3 moves behind to cure the adhesive on the PCBA board, preventing irregular flow from affecting the packaging quality.

[0078] In this embodiment, the curing device 3 may include a light source fixedly connected to the spraying device 1. The feeding device can supply UV-curable resin to the spraying device 1. The UV-curable resin may be a UV adhesive. The light source may be an ultraviolet light source, an infrared light source, etc., and the present invention is not limited thereto; the appropriate light source can be selected according to the UV adhesive used in the application.

[0079] Furthermore, the irradiation direction of the curing device 3 deviates from the spraying direction of the spraying device 1. For example... Figure 1 , Figure 2 As shown, the spraying device 1 and curing device 3 connected to both ends of the connecting shaft 2 are at a certain tilt angle. The curing device 3 (can be slightly) tilted in the vertical direction so that ultraviolet light (or other curing light) cannot irradiate the spraying device 1, thus preventing the adhesive from being cured at the outlet 19 of the spraying device 1. In this embodiment, the curing device 3 can also (can be slightly) lower than the spraying device 1 to reduce the diffusion of curing light near the spraying device 1, which also serves to protect the spraying device 1 and ensure smooth material discharge.

[0080] In this embodiment, to prevent reflected light from curing the adhesive in the spraying device 1 and to solve the problem of reflected light preventing the spraying device 1 from dispensing smoothly, the operating table 6 can also be provided with an anti-reflection part. This anti-reflection part prevents the light emitted from the light source from being reflected. The anti-reflection part includes a light-absorbing coating on the surface of the operating table 6. By minimizing the amount of reflected light through the light-absorbing coating, the amount of reflected light is reduced to the greatest extent possible to prevent the spraying device 1 from being blocked by the cured adhesive, ensuring smooth spraying.

[0081] Please continue reading. Figure 1 In this embodiment, the driving device drives the spraying device 1 to operate according to the control of the control device. Specifically, the driving device includes a first motion mechanism 5 that drives the spraying device 1 to move along a first axis and a second motion mechanism 4 that drives the spraying device 1 to move along a second axis; the first axis and the second axis are perpendicular to each other and both are parallel to the operating table 6. The first axis can be considered as the X-axis and the second axis as the Y-axis, that is, the first motion mechanism 5 and the second motion mechanism 4 enable the spraying device 1 to move in a direction parallel to the horizontal plane (the operating table 6 is generally parallel to the horizontal plane).

[0082] Specifically, the first motion mechanism 5 can be placed on the second motion mechanism 4. The first motion mechanism 5 can drive the spraying device 1 and the curing device 3, and the second motion mechanism 4 can move freely in the second axis direction according to the spraying requirements. The first motion mechanism 5 and the second motion mechanism 4 can be equipped with corresponding X-axis guide rails and Y-axis guide rails to realize corresponding axial movements.

[0083] Furthermore, the driving device also includes a third motion mechanism (not shown) that drives the spraying device 1 and / or the operating table 6 to move along a third axis; the third axis is perpendicular to the first axis and the second axis. The control device can control the distance between the spraying device 1 and the sprayed surface of the PCBA board to remain constant through the driving device.

[0084] In this embodiment, the third axis can be vertical, and the spraying device 1 can be moved vertically by the third motion mechanism. The third motion mechanism can have a guide rail mechanism, which can drive the operating table 6 to move up and down, thereby causing the PCBA board to move up and down relative to the spraying device 1, or it can directly act on the spraying device 1, causing the spraying device 1 to move up and down relative to the PCBA board.

[0085] In this embodiment, a control device (not shown) can control the movement path of the spraying device 1 via a drive device, thereby spraying and encapsulating the desired packaging area on the PCBA board. The control device can be hardware, such as a CPU, controller, microcontroller, PLC, programmable circuit board, etc., or a combination of software and hardware; this application does not impose any limitations. The control device can control the movement speed of the spraying device 1. To improve spraying efficiency, the movement speed of the spraying device differs between working and non-working modes. Specifically, the control device can control the movement speed of the spraying device 1 during spraying to be lower than its movement speed when not spraying. For example, when the spraying device 1 resets after spraying, it can be reset and retracted at a faster speed.

[0086] In this embodiment, the control device can import the geometric and physical parameter model (specifically, a three-dimensional package model) of the object to be sprayed (PCBA board), and can control the spraying device 1 to spray the object according to predetermined spraying parameters based on the model. The spraying parameters may include at least one of spraying speed, spraying direction, adhesive supply pressure, and moving speed.

[0087] The control device constructs a three-dimensional coordinate system that is mapped to the operating table 6, and establishes a three-dimensional packaged model of the PCBA board in the three-dimensional coordinate system. The control device can determine the position of the spraying device 1 based on the coordinates of the packaged surface of the PCBA board's three-dimensional packaged model.

[0088] In this embodiment, a packaging area or surface can be selected or specified based on the 3D model of the PCBA board, corresponding to the actual packaging area of ​​the PCBA board in the real coordinate system on the operating table 6. The spraying device 1 has mapped coordinates in the 3D coordinate system according to the above mapping relationship, and the position of the spraying device 1 is determined based on the positional relationship between these mapped coordinates and the coordinates of the packaging surface of the 3D model. Furthermore, to achieve refined spraying, each dispensing unit 18 can also have corresponding mapped coordinates in the 3D coordinate system, thereby controlling the dispensing of each dispensing unit 18 according to the spraying situation at the corresponding coordinate points.

[0089] like Figure 5 , Figure 6 , Figure 7 As shown, the chip module 13 and other surface-mount components on the PCBA board 14 have a large area, and these surface-mount components have a certain height difference from other components and have a large number of exposed pins 13b distributed around them. In order to effectively encapsulate and protect the chip module 13 and other predetermined components, a dam 15 is built to surround them, and then the dam is filled in to complete the effective encapsulation. The dam 15 encloses the predetermined components and their pins 13b within it.

[0090] Considering the large amount of adhesive required for encapsulating the chip module 13 and other predetermined components, and to avoid excessive irregular flow caused by applying adhesive in one go, a method of first constructing a dam 15 and then filling it in is adopted to prevent irregular flow caused by the physical properties of the adhesive itself. The dam 15 can adapt to the shape of the components.

[0091] The construction and filling of the dam 15 around predetermined components such as chip module 13 can be achieved using the aforementioned spraying device 1. In another embodiment, the PCBA board packaging equipment may further include a dispensing nozzle (not shown). The control device can control the spraying device 1 to form the dam 15 around the predetermined components on the PCBA board 14. The dispensing nozzle can fill the dam 15. The dispensing nozzle may have a single outlet 19, which is aligned with the inner area 17 of the dam 15 and dispenses adhesive until it is filled, resulting in a packaging effect formed by the adhesive 16 after filling. Figure 6 As shown.

[0092] Please continue reading. Figure 1 In this embodiment, the feeding device can continuously supply adhesive (or conformal coating material and ink) to the spraying device in real time. The feeding device includes an adhesive supply cartridge 8 and a pressure supply cartridge 11. One end of the adhesive supply cartridge 8 is connected to the adhesive supply pump 7 via a first adhesive supply pipe, and the other end is connected to the spraying device 1 via a second adhesive supply pipe 9b. One end of the pressure supply cartridge 11 is connected to the air pressure pump 10 via a first pressure supply pipe 12a, and the other end is connected to the adhesive supply cartridge 8 via a second pressure supply pipe 12b.

[0093] The glue supply pump 7 supplies raw materials (UV glue, conformal paint, etc.) to the glue supply cartridge 8 through the glue supply pipe, and the air pressure pump 10 supplies air pressure to the pressure supply cartridge 11 through the pressure supply pipe. The pressure supply cartridge 11 then transmits the air pressure to the glue supply cartridge 8 through the pressure supply pipe, and squeezes the raw materials in the glue supply cartridge 8 into the discharge unit 18 of the spraying device 1 through the glue supply pipe, thus providing the raw materials required for spraying to the discharge unit 18 of the spraying device 1.

[0094] In the spraying device 1, multiple dispensing units 18 can share the same dispensing port 19, and independent dispensing of each dispensing unit 18 is achieved by controlling the opening and closing of the aforementioned electromagnetic check valve. Alternatively, each of the multiple dispensing units 18 can be connected to the glue supply cartridge 8 via a glue supply pipe. The feeding device achieves independent dispensing of each dispensing unit 18 by controlling the opening and closing of the glue supply pipe. This feeding device can be connected to the control device to achieve feeding control of the feeding device.

[0095] like Figure 8 As shown, and see also Figure 5 , Figure 6 , Figure 7This application also provides a PCBA board packaging method, which can use, but is not limited to, the PCBA board packaging equipment described in the above embodiments. Specifically, the PCBA board packaging method includes the following steps:

[0096] S1. Place PCBA board 14 on the workbench 6;

[0097] In step S1, the operating table 6 is used to receive and place the PCBA board 14. The operating table 6 has a placement area, which corresponds to the three-dimensional coordinate system of the control device. When the PCBA board 14 is located in the placement area, the spraying and encapsulation operation begins. The placement area can be the receiving surface or space of the workbench, or it can be a part of the surface of the workbench. Its shape can be a rectangular area, a square area, or other regular shapes. Of course, irregular shapes are also applicable, and this application does not impose any limitations. The shape of the placement area can also match the shape of the PCBA board 14, so that when the PCBA board 14 is placed in the placement area, it fits perfectly and engages, facilitating the spraying of adhesive by the nozzle. A single PCBA board 14 or multiple PCBA boards 14 can be placed in the same spraying area at one time. When multiple PCBA boards 14 are placed simultaneously, they can be laid out flat in the placement area.

[0098] In this embodiment, a robotic arm or conveyor belt of a sealing equipment can be used to transfer the PCBA board 14. For example, the PCBA board 14 can be transported to the workbench via a conveyor belt in the form of a production line, or the conveyor belt can carry the PCBA board 14 to a predetermined position for adhesive spraying (in this case, the conveyor belt also serves as the workbench). Of course, in this step, the PCBA board 14 can also be placed manually into the placement area.

[0099] S2. Establish a three-dimensional packaging model of the PCBA board 14 in a three-dimensional coordinate system;

[0100] The sealing equipment itself can have a virtual three-dimensional coordinate system, which corresponds to the real coordinate system (also called the real coordinate system) where the spraying device 1 is located. The spraying device 1 has corresponding mapped coordinates in the three-dimensional coordinate system. By moving and adjusting the position of the spraying device 1 through the mapped coordinates and the correspondence between the three-dimensional coordinate system and the real coordinate system, the PCBA board 14 can be sprayed according to the preset trajectory.

[0101] The spraying device 1 sprays adhesive onto the PCBA board 14 according to a predetermined spraying route (preset trajectory). The predetermined spraying route can be an "S" or "N" shaped route, or it can be a circular trajectory spraying along the center of the PCBA board 14 with the radius of the circular trajectory gradually increasing. Alternatively, it can be a zigzag trajectory. It can be seen that the predetermined spraying route can have various forms, as long as it can complete the sealing process in this embodiment. Of course, to improve encapsulation efficiency, the spraying device 1 can select the optimal spraying path based on the principle of minimizing time.

[0102] In step S2, a three-dimensional packaged model of the PCBA board 14 is established in a three-dimensional coordinate system by scanning the PCBA board 14 on the operating table 6.

[0103] The PCBA board packaging equipment can also be equipped with a scanning camera or other scanning devices to obtain a 3D packaging model of the PCBA board 14 by scanning the PCBA board 14. The packaging surfaces (packaging areas) of this 3D packaging model have their own coordinates in a three-dimensional coordinate system and corresponding real-world mapping coordinates in the real coordinate system. In step S2, the 3D packaging model can also be created through 3D software drawing input, etc.

[0104] The PCBA board packaging method references a 3D packaging model, rather than a planar model program, when packaging the PCBA board 14. Using the 3D packaging model of the PCBA board 14, electronic components with 3D structures on the 3D PCBA board 14 are correspondingly mapped to complete the coating packaging.

[0105] S3. Control the spraying device 1 to spray the PCBA board 14 according to the encapsulation three-dimensional model of the PCBA board 14.

[0106] As described above, the spraying device 1 has corresponding mapped coordinates in the three-dimensional coordinate system. By using the mapped coordinates and the correspondence between the three-dimensional coordinate system and the real coordinate system, the position of the spraying device 1 can be adjusted by moving it, and then the PCBA board 14 can be sprayed according to the preset trajectory.

[0107] In step S3, the position of the spraying device 1 is determined based on the coordinates of the packaging surface of the 3D packaging model of the PCBA board 14. During the spraying process, the distance between the spraying device 1 and the spraying surface of the PCBA board 14 remains constant. For example, if two adjacent surface mount components on the PCBA board 14 have different heights, the distance between the spraying device 1 and the top surface of these two surface mount components remains constant during spraying, thereby achieving a better spraying and packaging effect.

[0108] In step S3, each spray coating process resets to the same starting point, and then the target coordinate point is located. The reset point can be the origin of the imported 3D packaging model, or it can be the starting point. Simultaneously, the position and angle of the spraying device 1 change depending on the electronic components being packaged. Considering that the packaging material requires a certain thickness to achieve a better packaging effect, and that achieving the required thickness of adhesive in one go can easily lead to irregular flow and poor packaging results, in step S3, the spraying device 1 performs multiple sprays on the same location; curing occurs simultaneously with each spray.

[0109] To enable the spraying device 1 to perform multiple coatings on the same location, it can travel multiple times along a preset path within the encapsulation area. Each time it travels along the preset path, the spraying device 1 completes one coating of the encapsulation area, applying one layer of encapsulation, which is then cured. Then, the spraying device 1 travels along the preset path again, completing a second coating of the encapsulation area, applying two layers of encapsulation, which are then cured, until the target thickness of the encapsulation is achieved. This not only prevents irregular flow of the adhesive from causing poor encapsulation results but also allows for precise control of the coating thickness, ensuring the target encapsulation effect. In step S3, multiple layers of coating are applied to the encapsulation area of ​​the PCBA board 14, and each layer is cured sequentially.

[0110] Considering the relatively small overall thickness of the encapsulation, only the required encapsulation thickness needs to be achieved. Therefore, in step S3, the relative position of the spraying device 1 remains unchanged for the same location during multiple spraying processes. That is, the mapping coordinates of the spraying device 1 do not change for the same location during multiple spraying processes. The height of the encapsulation surface at the same location can change during multiple coating processes. For example, after each layer of coating is sprayed, the height of the spraying device 1 can be increased for the next spraying, and the increased height can be the height of one coating layer.

[0111] In one feasible embodiment, the PCBA board packaging method provided in this application includes the following steps: spraying multiple times around predetermined components on the PCBA board 14 using a spraying device 1 and a curing device 3 to form a dam 15; curing the coating formed by each spraying at the same time; and then spraying adhesive into the dam 15 to fill it.

[0112] In this embodiment, adhesive can be sprayed into the interior 17 of the dam 15 using the spraying device 1 to fill the gap, or it can be filled by dispensing adhesive using a dispensing nozzle. Alternatively, during the filling process, multiple layers can be sprayed onto the interior 17 of the dam 15 for filling, and the curing device 3 described above can be used for curing simultaneously with the spraying.

[0113] The following detailed description of the dam 15 and the filling operation using a specific embodiment of the chip module 13 packaging method will help to better understand this application:

[0114] (1) The electronic circuit board 14 (i.e. PCBA board 14) is placed at room temperature. The packaging three-dimensional model is imported through the control device (such as the host computer). The control device controls the spraying device 1 to complete the movement of the spraying route under the coordinated action of the second axis motion mechanism and the first axis motion mechanism according to the spraying needs.

[0115] like Figure 3 Figure 3 As shown, a first layer of UV adhesive is sprayed around the chip module 13 on the PCBA board 14 (also known as the electronic circuit board 14) to form a dam 15 pattern. During the spraying process, the curing device 3 is in the open state, meaning that the sprayed layer is cured immediately to prevent the UV adhesive from flowing irregularly. The spraying height of each layer is approximately 0.008m, and the spraying width is adjustable and not fixed according to the size and shape of the packaged components to meet the arbitrariness of the chip 13a. Because spraying and curing are carried out simultaneously, the spraying time plus the curing time for each layer is controlled between 10s and 50s depending on the complexity of the required package pattern. The height of the dam 15 is not lower than the height of the chip 13a itself, and is generally slightly higher than the chip by 0.5mm-1mm.

[0116] (2) After the first layer of spraying and curing is completed, the third motion mechanism can be used to accurately lower the molding layer by a thickness of about 0.008 mm.

[0117] (3) Following the method in step (1), on the basis of the cured first layer of UV adhesive dam 15 pattern, spray the second layer of UV adhesive dam 15 pattern. During the spraying process, the curing device 3 is still in the open state, so that the cured second layer of UV adhesive dam 15 pattern is firmly attached and stacked on the previous layer.

[0118] (3) Repeat steps (1) to (3) in this way, spraying and curing layer by layer. Each new layer of dam 15 pattern is attached and stacked onto the previous layer until a three-dimensional solid encapsulation dam 15 with a height slightly higher than the chip 13a is sprayed around the chip module 13 to be encapsulated, encapsulating all chip pins 13b and chip 13a. Then turn off the curing device 3 and stop the formation of the dam 15.

[0119] (4) After the dam 15 is completed, turn off the UV curing device 3 and spray the inside of the UV glue dam 15 again. Utilize the fluidity of the uncured UV glue material to effectively fill the space between the chip module 13 and the dam 15, and completely immerse the chip 13a and chip pin 13b in the uncured UV glue.

[0120] (5) After step (4) is completed, turn on the UV curing device 3 and cure the PCBA board 14 and the chip module 13 filled on it again under the curing device 3. The curing time is about 0.5s-3s.

[0121] In steps (1) to (3) above, the UV curing device 3 is normally open; in step (4), the curing device 3 can be normally closed; in the above process, both the chip module 13 and the PCBA board 14 can be at room temperature.

[0122] In summary,

[0123] 1. The dam-filling encapsulation method in the PCBA board encapsulation method provided in this application effectively encapsulates the chip 13a and pin 13b inside the UV adhesive, effectively solving the problem that the lower part of the components is not covered and the lower end of the pin 13b cannot be effectively encapsulated and exposed during conformal coating spraying; at the same time, it is printed and stacked tightly layer by layer, overcoming the defects such as air being easily trapped during conformal coating spraying encapsulation, causing bubbles and uneven thickness inside the encapsulation.

[0124] This embodiment has good packaging consistency, clear packaging interfaces, and distinct packaging layers. It effectively solves the problems of material waste and poor packaging effect caused by the low selectivity and precision due to the irregular spraying of conformal coating in the three-conformal coating method, thereby reducing production costs and improving product quality.

[0125] 2. The PCBA board encapsulation method provided in this application uses UV adhesive for encapsulation, which has a fast curing speed and overcomes the characteristics of the cumbersome curing process and slow curing of conformal coating materials, thereby further improving encapsulation efficiency and shortening the encapsulation cycle.

[0126] 3. In the PCBA board packaging method provided in this application, the method of spraying and stacking layers according to the packaging three-dimensional model in the dam 15 step of the packaging results in clear interfaces of the dam 15, good line consistency, and the advantage of printing and curing at the same time. After the bottom layer is printed, it is cured and firmly bonded to the substrate. This overcomes the disadvantage of the existing dam 15 bottom layer being easily trapped with air during the bonding process with the circuit board substrate, resulting in low bonding strength.

[0127] The method of simultaneous spraying and curing can effectively avoid the shortcomings of glue overflow, dispensing interruption, and stringing that occur during the glue damming process 15. Furthermore, after the filling step is completed, the curing device 3 connected to the nozzle is opened, and the final curing and encapsulation can be completed on the encapsulation platform. This method is superior to the existing damming method, which requires the chip module 13 to be placed in a special curing oven after the filling step is completed. This reduces equipment investment costs, shortens the production cycle, and improves production quality.

[0128] 4. The packaging method of this embodiment is superior to the existing chip module 13 packaging method. The packaging process has no special temperature requirements and does not require repeated temperature changes during the process. It has the advantage of not requiring cooling and heating devices, reducing equipment investment costs and increasing efficiency.

[0129] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or a process variable (e.g., temperature, pressure, time, etc.) is described as ranging from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, it is intended to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1, etc. These are merely examples intended for explicit expression, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are similarly explicitly stated in this specification.

[0130] Unless otherwise stated, all ranges include the endpoints and all numbers between them. The terms "approximately" or "about" used with ranges apply to both endpoints of the range. Thus, "approximately 20 to 30" is intended to cover "approximately 20 to approximately 30," including at least the specified endpoints.

[0131] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified elements, components, parts, or steps, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute included by “may” is optional.

[0132] Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The use of "a" or "an" to describe an element, component, part, or step does not imply the exclusion of other elements, components, parts, or steps.

[0133] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined by reference to the above description, but rather by reference to the appended claims and the full scope of their equivalents. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended as a waiver of that subject matter, nor should it be construed as an indication that the inventors have not considered that subject matter as part of the disclosed inventive subject matter.

Claims

1. A PCBA board packaging apparatus, characterized by, The application relates to a PCBA board spraying device. The operation table is a conveying belt. The conveying belt carries the PCBA board to a predetermined position for glue spraying. The glue spraying device has a plurality of discharge units moving together; each discharge unit can independently spray; the discharge units are arranged in an array. A feeding device connected with the glue spraying device can supply UV glue to the glue spraying device. A curing device moving together with the glue spraying device can cure the glue sprayed on the PCBA board by the glue spraying device. A driving device connected with the glue spraying device can drive the glue spraying device to move; the driving device comprises a first movement mechanism driving the glue spraying device to move along a first axis and a second movement mechanism driving the glue spraying device to move along a second axis; the first axis and the second axis are perpendicular to each other and parallel to the operation table. A control device connected with the glue spraying device and the driving device can control the glue spraying device to move and spray glue to the packaging area of the PCBA board. The control device can control the glue spraying device to spray glue around the predetermined elements of the PCBA board to form a dam and fill the inside of the dam.

2. The PCBA board packaging apparatus of claim 1, wherein, The control device can control the distance between the glue spraying device and the spraying surface of the PCBA board to be constant or control the relative position or mapping coordinates of the glue spraying device in multiple spraying processes.

3. The PCBA board packaging apparatus of claim 1, wherein, The control device can control the glue spraying device to spray glue around the predetermined elements of the PCBA board multiple times to form a dam and control the curing device to cure the coating formed by each spraying at the same time.

4. The PCBA board packaging apparatus of claim 2, wherein, The curing device cures at the same time when the glue spraying device sprays; the glue spraying device sprays multiple times at the same position.

5. The PCBA board packaging apparatus of claim 1, wherein, The control device can control the glue spraying device to form a dam around the predetermined elements of the PCBA board. The application relates to a PCBA board spraying device.

6. A PCBA board packaging apparatus, characterized by, The operation table is a conveying belt. The conveying belt carries the PCBA board to a predetermined position for glue spraying. The glue spraying device has a plurality of discharge units moving together; each discharge unit can independently spray; the discharge units are arranged in an array. A feeding device connected with the glue spraying device can supply UV glue to the glue spraying device. A curing device moving together with the glue spraying device can cure the glue sprayed on the PCBA board by the glue spraying device. A driving device connected with the glue spraying device can drive the glue spraying device to move; the driving device comprises a first movement mechanism driving the glue spraying device to move along a first axis and a second movement mechanism driving the glue spraying device to move along a second axis; the first axis and the second axis are perpendicular to each other and parallel to the operation table. ​ ​ A control device connected with the material spraying device and the driving device; the control device can control the material spraying device to spray the packaging area of the PCBA board in multiple layers and solidify layer by layer.

7. The PCBA board packaging apparatus of claim 1 or 6, wherein, The control device controls the material spraying device to perform multiple spraying at the same position, and the material spraying device walks along the preset path multiple times in the packaging area. Each time the material spraying device walks along the preset path, it completes one spraying of the packaging area, corresponding to one layer of packaging, and solidification of the layer. Then, the control device controls the material spraying device to walk along the preset path again, and the material spraying device completes two spraying of the packaging area, corresponding to two layers of packaging, and solidification of the layer, until the packaging with the target thickness is obtained.

8. The PCBA board packaging apparatus of claim 7, wherein, The driving device further includes a third movement mechanism for driving the material spraying device and / or the operation table to move along a third axis; the third axis is perpendicular to the first axis and the second axis.

9. The PCBA board packaging apparatus of claim 7, wherein, The control device can control the distance between the material spraying device and the spraying surface of the PCBA board to remain constant through the driving device.

10. The PCBA board packaging apparatus of claim 7, wherein, It also includes a dispensing nozzle; the control device can control the material spraying device to form a dam around the predetermined components of the PCBA board; the dam encloses the predetermined components and their pins; The dispensing nozzle can fill the dam flat.

11. A method for packaging a PCBA board using the PCBA board packaging apparatus of claim 1 or 6, wherein, The steps include: Place the PCBA board on the operation table. Control the material spraying device to spray the PCBA board; Use the material spraying device to spray multiple times around the predetermined components of the PCBA board to form a dam; Control the material spraying device to spray glue into the dam to fill it flat.

12. The PCBA board packaging method of claim 11, wherein, The PCBA board packaging equipment has a curing device that moves with the material spraying device; the PCBA board packaging method includes: solidifying the coating formed by each spraying of the dam at the same time.

13. The PCBA board packaging method of claim 11, wherein, Each new layer of dam pattern is attached and stacked on the previous layer, until a three-dimensional dam of packaging glue is formed around the predetermined components of the required packaging, with a height slightly higher than the predetermined components.

14. The PCBA board packaging method of claim 11, wherein, In the PCBA board packaging method, the packaging area of the PCBA board is sprayed in multiple layers and solidified layer by layer.

15. The PCBA board packaging method of claim 11, wherein, The step of spraying the dam includes: spraying a first layer of UV glue dam pattern around the predetermined components of the PCBA board; during the spraying of the first layer of UV glue dam pattern, the curing device is in an open state.

16. The PCBA board packaging method of claim 11, wherein, The height of the dam is not less than the height of the predetermined components.

17. The PCBA board packaging method of claim 11, wherein, The height of the dam is slightly higher than the predetermined components by 0.5-1mm; the spraying time of each layer plus the solidification time is 10-50s.

18. The PCBA board packaging method of claim 11, wherein, After the spraying of the dam is completed, the UV curing device is turned off, and the UV glue dam is sprayed again; during the step of filling the dam, the curing device is in a normally closed state.

19. The PCBA board packaging method of claim 11, wherein, After filling the dam, the UV curing device is turned on, and the PCBA board and the predetermined components on it are cured again under the curing device, with a curing time of 0.5-3s.

20. The PCBA board packaging method of claim 11, wherein, The above spraying, curing and filling steps of the PCBA board are performed at room temperature.

21. A method for packaging a PCBA board using the PCBA board packaging apparatus of claim 1 or 6, wherein, The steps include: Place the PCBA board on the operation table. Control the material spraying device to spray the PCBA board; Use the material spraying device to spray multiple times around the predetermined components of the PCBA board to form a dam; Control the material spraying device to spray glue into the dam to fill it flat. The material spraying device sprays the PCBA board; During the spraying process, the distance between the material spraying device and the spraying surface of the PCBA board is kept constant.

22. The PCBA board packaging method of claim 21, wherein, The distance between the material spraying device and the spraying surface of the PCBA board is kept constant, which includes that the height of the packaging surface at the same position changes during the process of multiple spraying coating.

23. The PCBA board packaging method of claim 21, wherein, The distance between the material spraying device and the spraying surface of the PCBA board is kept constant, which includes that the height of the material spraying device is raised after each layer of spraying coating is completed, and the raised height is the height of one layer of coating.

24. The PCBA board encapsulation method of claim 21, wherein the maintaining the constant distance between the dispensing device and the spray surface of the PCBA board comprises: The distance between the material spraying device and the top surface of the two height different patch elements is kept constant.

25. A method for packaging a PCBA board using the PCBA board packaging apparatus of claim 1 or 6, wherein, The method comprises the following steps: The PCBA board is placed on the operation table; The material spraying device sprays the PCBA board; for the same position, the relative position of the material spraying device during multiple spraying processes is unchanged, or for the same position, the mapping coordinates of the material spraying device during multiple spraying processes do not change.

26. The PCBA board packaging method of claim 25, wherein, The material spraying device walks along the preset path multiple times in the packaging area of the PCBA board, and each time the material spraying device walks along the preset path, it completes one spraying of the packaging area, and accordingly performs one layer of packaging and curing of the layer of packaging.

27. The PCBA board packaging method of claim 25, wherein, The PCBA board packaging method further comprises: controlling the material spraying device to spray the PCBA board; and using the material spraying device to spray multiple times around the predetermined elements of the PCBA board to form a dam; and spraying glue into the dam and filling it up.

28. The PCBA board packaging method of claim 25, wherein, The coating formed by each spraying of the dam is cured at the same time.

29. The PCBA board packaging method of claim 25, wherein, Each newly formed layer of dam pattern is attached and stacked to the previous layer until a packaging three-dimensional physical dam with a height slightly higher than the predetermined elements is formed around the predetermined elements to be packaged.

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