Composite copper foil production equipment and production method

Abstract

The application relates to the technical field of composite copper foil, in particular to a composite copper foil production device and a production method. The composite copper foil production device comprises a vacuum container, a rotary winding assembly arranged in the vacuum container and a sputtering film coating assembly arranged in the vacuum container. The sputtering film coating assembly comprises a plurality of supporting mechanisms and a plurality of sputtering source mechanisms. The supporting mechanism comprises an arc-shaped fixing part and a telescopic adjusting part. The telescopic adjusting part is used for adjusting the distance between the sputtering source mechanism and the film coating roller. The plurality of sputtering source mechanisms comprise a plurality of first sputtering source mechanisms and a plurality of second sputtering source mechanisms. Through the above mode, the first sputtering source mechanism can be made to approach / leave the film coating winding mechanism and the second sputtering source mechanism can be made to leave / approach the film coating winding mechanism through the telescopic adjusting part. The magnetron sputtering of the activation layer and the copper layer can be sequentially carried out in the same vacuum container. The organic film does not need to be switched back and forth between different magnetron sputtering devices, and the production efficiency and the copper plating quality are improved.

Description

Technical Field

[0001] This application relates to the field of composite copper foil technology, and in particular to a composite copper foil production apparatus and production method. Background Technology

[0002] Currently, to improve battery safety, composite copper foil is used to prepare the negative electrode current collector. This composite copper foil consists of an organic thin film layer with heat-shrinkable properties and copper layers formed on both surfaces of the organic thin film layer. The organic thin film layer and the two copper layers form a sandwich structure. When the battery is subjected to impact deformation, a high temperature is instantly generated at the short-circuit point between the two electrodes. The organic thin film layer instantly contracts, pulling the electrode sheet back to achieve electrode separation. Composite copper foil is generally deposited on both sides of the organic thin film layer using vacuum sputtering. To improve the coating effect, the organic thin film layer needs pretreatment, and an activation layer is deposited on both surfaces of the organic thin film layer using magnetron sputtering. During the production of composite copper foil, because different sputtering sources are used for the two magnetron sputtering processes, it is necessary to switch back and forth between two magnetron sputtering coating devices, requiring the organic thin film layer to be reinstalled. Furthermore, this installation process cannot be carried out in a vacuum environment, which is detrimental to improving production efficiency and copper plating quality. Summary of the Invention

[0003] In view of the above problems, this application provides a composite copper foil production apparatus and production method to solve the above technical problems.

[0004] In a first aspect, embodiments of this application provide a composite copper foil production apparatus, including a vacuum container, a rotary winding assembly disposed within the vacuum container, and a sputtering coating assembly disposed within the vacuum container; wherein...

[0005] The rotary winding assembly includes a first take-up and unwinding mechanism, a coating winding mechanism, and a second take-up and unwinding mechanism, wherein the coating winding mechanism includes at least one coating roller.

[0006] The sputtering coating assembly includes multiple support mechanisms and multiple sputtering source mechanisms respectively disposed on the multiple support mechanisms; each support mechanism includes an arc-shaped fixing part for mounting the sputtering source mechanism and a telescopic adjustment part for supporting the arc-shaped fixing part, the telescopic adjustment part being used to adjust the distance between the sputtering source mechanism and the coating roller; the multiple sputtering source mechanisms include a plurality of first sputtering source mechanisms and a plurality of second sputtering source mechanisms arranged alternately along the outer periphery of the coating roller.

[0007] Optionally, the first winding and unwinding mechanism and the second winding and unwinding mechanism are arranged symmetrically at the center, and the coating winding mechanism includes a first coating roller and a second coating roller arranged symmetrically at the center.

[0008] Optionally, the telescopic adjustment part includes an adjustment cylinder disposed in the vacuum container and a fixing rod connected to the arc-shaped fixing part, the fixing rod being connected to the piston rod of the adjustment cylinder.

[0009] Optionally, the composite copper foil production apparatus further includes a first pulse sputtering power supply electrically connected to the first sputtering source mechanism and a second pulse sputtering power supply electrically connected to the second sputtering source mechanism.

[0010] Optionally, the composite copper foil production apparatus further includes a first gas flow controller and a second gas flow controller.

[0011] Optionally, the vacuum container includes a shell and a fixing plate covering the shell, the shell and the fixing plate forming a vacuum cavity, the rotary winding assembly further includes a fixing frame disposed on the fixing plate, the first winding and unwinding mechanism, the coating winding mechanism and the second winding and unwinding mechanism are respectively disposed on the fixing frame; the cylinder body of the adjusting cylinder is disposed at the bottom of the vacuum cavity.

[0012] Optionally, the vacuum container further includes a first slider mechanism disposed at the bottom of the fixed plate and a second slider mechanism disposed at the bottom of the housing;

[0013] The composite copper foil production apparatus also includes a guide rail assembly, wherein the first slider mechanism and the second slider mechanism are respectively slidably engaged with the guide rail assembly.

[0014] Optionally, the vacuum container further includes a sealing mechanism, which includes a first magnetic attraction portion disposed on the fixed plate, a first sealing portion disposed on the first magnetic attraction portion, a second magnetic attraction portion disposed on the housing, and a second sealing portion disposed on the second magnetic attraction portion.

[0015] Secondly, embodiments of this application provide a method for producing composite copper foil, applied to the aforementioned composite copper foil production apparatus, the method comprising:

[0016] The first sputtering source mechanism is brought closer to the coating roller by the corresponding telescopic adjustment part, and the second sputtering source mechanism is moved away from the coating roller.

[0017] The first pulse sputtering power supply is turned on, and inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. Oxygen is introduced into the vacuum container at a second flow rate through the second gas flow controller. The organic film is output from the first take-up and unwinding mechanism. The first sputtering source mechanism performs magnetron sputtering coating on the organic film when it passes through the coating winding mechanism to form an activation layer on the organic film. The organic film is then wound up to the second take-up and unwinding mechanism.

[0018] The corresponding telescopic adjustment part brings each of the second sputtering source mechanisms closer to the coating roller, and moves each of the first sputtering source mechanisms away from the coating roller;

[0019] The second pulse sputtering power supply is turned on, and inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. The organic thin film is output from the second take-up and unwinding mechanism. The second sputtering source mechanism performs magnetron sputtering coating on the organic thin film when it passes through the coating winding mechanism to form a copper layer on the activated layer of the organic thin film, thereby obtaining a composite copper foil. The composite copper foil is then wound into the first take-up and unwinding mechanism.

[0020] Optionally, the inert gas is argon, the first flow rate is 100-200 sccm, the second flow rate is 5.0-7.0 sccm, and the pulse frequency of the first pulse sputtering power supply is 200-320 kHz.

[0021] The composite copper foil production apparatus provided in this application includes a vacuum container, a rotary winding assembly disposed within the vacuum container, and a sputtering coating assembly disposed within the vacuum container. The rotary winding assembly includes a first take-up / unwinding mechanism, a coating winding mechanism, and a second take-up / unwinding mechanism, wherein the first and second take-up / unwinding mechanisms are centrally symmetrically arranged, and the coating winding mechanism includes at least one coating roller. The sputtering coating assembly includes multiple support mechanisms and multiple sputtering source mechanisms respectively disposed on the multiple support mechanisms. The support mechanisms include an arc-shaped fixing part for mounting the sputtering source mechanisms and... A telescopic adjustment section is used to support the arc-shaped fixing part and to adjust the distance between the sputtering source mechanism and the coating roller. The plurality of sputtering source mechanisms include a plurality of first sputtering source mechanisms and a plurality of second sputtering source mechanisms arranged alternately along the outer periphery of the coating roller. In this way, the telescopic adjustment section can make the first sputtering source mechanism move closer to / away from the coating winding mechanism and the second sputtering source mechanism move away from / closer to the coating winding mechanism, so as to realize the magnetron sputtering of the activation layer and the copper layer in the same vacuum container in sequence, without the need to switch the organic thin film back and forth between different magnetron sputtering devices, which is beneficial to improving production efficiency and copper plating quality.

[0022] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0023] Figure 1 A schematic diagram of the composite copper foil production apparatus provided in an embodiment of this application is shown.

[0024] Figure 2 A schematic diagram of the sputtering coating component in the composite copper foil production apparatus provided in this application embodiment is shown.

[0025] Figure 3 A schematic diagram of the composite copper foil production apparatus provided in an embodiment of this application is shown.

[0026] Figure 4 A schematic diagram of the sputtering coating component in the composite copper foil production apparatus provided in this application embodiment is shown.

[0027] Figure 5 A schematic diagram of the composite copper foil production apparatus provided in an embodiment of this application is shown.

[0028] Figure 6 A schematic diagram of the composite copper foil production apparatus provided in an embodiment of this application is shown. Detailed Implementation

[0029] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0030] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0032] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0033] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.

[0034] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0035] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.

[0036] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0037] One embodiment of this application provides a composite copper foil production apparatus. Please refer to [link / reference]. Figure 1 and Figure 2 As shown, the composite copper foil production apparatus 100 includes a vacuum container 10, a rotary winding assembly, and a sputtering coating assembly, with the rotary winding assembly and the sputtering coating assembly respectively disposed inside the vacuum container 10.

[0038] The rotary winding assembly includes a first take-up and unwinding mechanism 21, a second take-up and unwinding mechanism 22, and a coating winding mechanism 23, wherein the coating winding mechanism 23 includes at least one coating roller.

[0039] The sputtering coating assembly includes multiple support mechanisms 31 and multiple sputtering source mechanisms 32 respectively disposed on the support mechanisms 31. Each support mechanism 31 includes an arc-shaped fixing part 311 for mounting the sputtering source mechanism 32 and a telescopic adjustment part 312 for supporting the arc-shaped fixing part 311. The telescopic adjustment part 312 is used to adjust the distance between the sputtering source mechanism 32 and the coating roller 23. When the telescopic adjustment part 312 extends, the corresponding sputtering source mechanism 32 moves closer to the coating roller 23; when the telescopic adjustment part 312 shortens, the corresponding sputtering source mechanism 32 moves away from the coating roller 23.

[0040] The plurality of sputtering source mechanisms 32 include a plurality of first sputtering source mechanisms 321 and a plurality of second sputtering source mechanisms 322 arranged alternately along the outer periphery of the coating roller 23. The first sputtering source mechanisms 321 are used to deposit an activation layer on the surface of the organic thin film 200, and the second sputtering source mechanisms 322 are used to deposit a copper layer on the surface of the activation layer. (See also...) Figure 2 As shown, the first sputtering source mechanism 321 includes a first back tube 3211, a first fixed magnetic rod 3212 disposed inside the first back tube 3211, and an activated metal target 3213 sleeved outside the first back tube 3211. The second sputtering source mechanism 322 includes a second back tube 3221, a second fixed magnetic rod 3222 disposed inside the second back tube 3221, and a copper target 3223 sleeved outside the second back tube 3221.

[0041] During magnetron sputtering to form the activation layer, each first sputtering source mechanism 321 is brought close to the coating roller 23 and each second sputtering source mechanism 322 is moved away from the coating roller 23. A mixture of inert gas and oxygen is introduced into the vacuum container, and a pulsed direct current is applied to each first sputtering source mechanism 321. The organic thin film 200 is output from the first take-up and unwinding mechanism 21. The first sputtering source mechanism 321 performs magnetron sputtering coating on the organic thin film 200 as it passes through the coating winding mechanism 23 to form an activation layer on the organic thin film, and then winds the organic thin film 200 into the second take-up and unwinding mechanism 22. The activation layer includes an activated metal oxide, or an activated metal and an activated metal oxide. During the magnetron sputtering process, the activated metal target is sputtered in a mixed atmosphere of oxygen and inert gas, and at least part of the activated metal is oxidized. Exemplarily, the activated metal can be at least one of titanium, niobium, nickel, molybdenum, chromium, zirconium, aluminum, and silver. Exemplarily, the inert gas can be argon.

[0042] During the formation of the copper layer by magnetron sputtering, each second sputtering source mechanism 322 is brought close to the coating roller 23 while each first sputtering source mechanism 321 is moved away from the coating roller 23. Inert gas is introduced into the vacuum container 10, and pulsed DC current is applied to each second sputtering source mechanism 322. The organic thin film 200 is output from the second take-up and unwinding mechanism 22. The second sputtering source mechanism 322 performs magnetron sputtering coating on the organic thin film 200 as it passes through the coating winding mechanism 23 to form a copper layer on the activated layer of the organic thin film, and then winds the organic thin film 200 into the first take-up and unwinding mechanism 21.

[0043] In this embodiment, the telescopic adjustment unit can move the first sputtering source mechanism closer to / away from the coating winding mechanism and the second sputtering source mechanism further away from / closer to the coating winding mechanism, so as to realize the magnetron sputtering of the activation layer and the copper layer in the same vacuum container in sequence, without having to switch the organic thin film back and forth between different magnetron sputtering devices, which is beneficial to improving production efficiency and copper plating quality.

[0044] As one implementation method, please refer to Figure 3 As shown, the first winding and unwinding mechanism 21 and the second winding and unwinding mechanism 22 are arranged symmetrically at the center, and the coating winding mechanism 23 includes a first coating roller 231 and a second coating roller 232 arranged symmetrically at the center.

[0045] In this embodiment, when the activation layer is formed by magnetron sputtering, the organic thin film 200 is output from the first take-up and unwinding mechanism 21; the first sputtering source mechanism 321 performs magnetron sputtering deposition on the first surface of the organic thin film 200 when the organic thin film 200 passes through the first coating roller 231 to form an activation layer on the first surface of the organic thin film; the first sputtering source mechanism 321 performs magnetron sputtering deposition on the second surface of the organic thin film 200 when the organic thin film 200 passes through the second coating roller 232 to form an activation layer on the second surface of the organic thin film; and the organic thin film 200 is wound up by the second take-up and unwinding mechanism 22. When forming a copper layer by magnetron sputtering, the organic thin film 200 is output from the second take-up and unwinding mechanism 22; the second sputtering source mechanism 322 performs magnetron sputtering coating on the second side of the organic thin film 200 as it passes through the second coating roller 232 to form a copper layer on the activation layer of the second side of the organic thin film; the second sputtering source mechanism 322 performs magnetron sputtering coating on the first side of the organic thin film 200 as it passes through the first coating roller 231 to form a copper layer on the activation layer of the first side of the organic thin film; and the organic thin film 200 is wound up by the first take-up and unwinding mechanism 21.

[0046] As one implementation method, please refer to Figure 2 and Figure 4As shown, the telescopic adjustment unit 312 includes an adjustment cylinder 3121 disposed in the vacuum container 10 and a fixing rod 3122 connected to the arc-shaped fixing unit 311. The cylinder body 3121a of the adjustment cylinder 3121 is fixed to the bottom wall of the vacuum chamber of the vacuum container 10, and the fixing rod 3122 is connected to the piston rod 3121b of the adjustment cylinder 3121. When the piston rod 3121b is pushed out of the cylinder body 3121a, it drives the fixing rod 3122 to move closer to the coating roller 23, so that the corresponding sputtering source mechanism 32 is closer to the coating roller 23; when the piston rod 3121b retracts into the cylinder body 3121a, it drives the fixing rod 3122 to move away from the coating roller 23, so that the corresponding sputtering source mechanism 32 is away from the coating roller 23.

[0047] In one embodiment, the composite copper foil production apparatus 100 further includes a first pulse sputtering power supply electrically connected to the first sputtering source mechanism 321 and a second pulse sputtering power supply electrically connected to the second sputtering source mechanism 322. The first pulse sputtering power supply and the second pulse sputtering power supply can each be a pulsed DC power supply.

[0048] In one embodiment, the composite copper foil production apparatus 100 further includes a first gas flow controller and a second gas flow controller. The first gas flow controller is used to control the flow rate of inert gas introduced into the vacuum container 10, and the second gas flow controller is used to control the flow rate of oxygen introduced into the vacuum container 10.

[0049] As one implementation method, please refer to Figure 5 and Figure 6 As shown, the vacuum container 10 includes a shell 11 and a fixing plate 12 covering the shell 11. The shell 11 and the fixing plate 12 surround to form a vacuum chamber 10a. The vacuum container 10 also includes a fixing frame 13 disposed on the fixing plate 12. A first winding and unwinding mechanism 21, a coating winding mechanism 23 and a second winding and unwinding mechanism 22 are respectively disposed on the fixing frame 13. The cylinder body 3121a of the adjusting cylinder 3121 is fixed to the bottom wall of the vacuum chamber 10a of the vacuum container 10.

[0050] In some embodiments, the vacuum container 10 further includes a first slider mechanism 14 disposed at the bottom of the fixed plate 12 and a second slider mechanism 15 disposed at the bottom of the housing 11; the composite copper foil production apparatus 100 further includes a guide rail assembly 60, with the first slider mechanism 14 and the second slider mechanism 15 respectively slidingly engaged with the guide rail assembly 60.

[0051] In some embodiments, the composite copper foil production apparatus 100 further includes a sealing mechanism, which includes a first magnetic attraction part 411 disposed on the fixed plate 12, a first sealing part 412 disposed on the first magnetic attraction part 411, a second magnetic attraction part 421 disposed on the housing 11, and a second sealing part 422 disposed on the second magnetic attraction part 421.

[0052] Specifically, when the fixing plate 12 is closed onto the housing 11, the first sealing part 412 and the second sealing part 422 are attached together, and the first magnetic part 411 and the second magnetic part 421 are opposite each other. When the power is applied, the first magnetic part 411 and the second magnetic part 421 generate an attraction force to press the first sealing part 412 and the second sealing part 422 together, so as to seal the vacuum chamber 10a.

[0053] In some embodiments, the first magnetic attraction part 411 and the second magnetic attraction part 421 may be magnets, and the first sealing part 412 and the second sealing part 422 may be sealant layers.

[0054] An embodiment of this application also provides a method for producing composite copper foil, applied to the aforementioned composite copper foil production apparatus, the method comprising:

[0055] S11, by means of the corresponding telescopic adjustment part, each of the first sputtering source mechanisms is brought closer to the coating roller, and each of the second sputtering source mechanisms is moved away from the coating roller;

[0056] S12, turn on the first pulse sputtering power supply, introduce inert gas into the vacuum container at a first flow rate through the first gas flow controller, introduce oxygen into the vacuum container at a second flow rate through the second gas flow controller, output the organic film from the first take-up and unwinding mechanism, the first sputtering source mechanism performs magnetron sputtering coating treatment on the organic film when the organic film passes through the coating winding mechanism to form an activation layer on the organic film, and wind the organic film into the second take-up and unwinding mechanism;

[0057] S13, by means of the corresponding telescopic adjustment part, each of the second sputtering source mechanisms is brought closer to the coating roller, and each of the first sputtering source mechanisms is moved away from the coating roller;

[0058] S14, turn on the second pulse sputtering power supply, and introduce inert gas into the vacuum container at a first flow rate through the first gas flow controller. Output the organic thin film from the second take-up and unwinding mechanism. The second sputtering source mechanism performs magnetron sputtering coating on the organic thin film when it passes through the coating winding mechanism to form a copper layer on the activated layer of the organic thin film, thereby obtaining a composite copper foil. The composite copper foil is then wound into the first take-up and unwinding mechanism.

[0059] In this embodiment, the telescopic adjustment unit can move the first sputtering source mechanism closer to / away from the coating winding mechanism and the second sputtering source mechanism further away from / closer to the coating winding mechanism, so as to realize the magnetron sputtering of the activation layer and the copper layer in the same vacuum container in sequence, without having to switch the organic thin film back and forth between different magnetron sputtering devices, which is beneficial to improving production efficiency and copper plating quality.

[0060] In one embodiment, the inert gas is argon, the first flow rate is 100-200 sccm, the second flow rate is 5.0-7.0 sccm, and the pulse frequency of the first pulse sputtering power supply is 200-320 kHz.

[0061] In some embodiments, the duration of the oxidation process of the active metal target and the duration of the sputtering process can be adjusted by regulating the duty cycle of the first pulse sputtering power supply, thereby adjusting the molar ratio of the activated metal oxide to the activated metal in the activated layer. For example, the duty cycle of the first pulse sputtering power supply can be 40% to 100%.

[0062] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A composite copper foil production apparatus characterized by comprising: The device comprises a vacuum container, a rotating winding assembly arranged in the vacuum container, and a sputtering coating assembly arranged in the vacuum container. The rotating winding assembly comprises a first winding and unwinding mechanism, a coating winding mechanism, and a second winding and unwinding mechanism. The sputtering coating assembly comprises a plurality of support mechanisms and a plurality of sputtering source mechanisms arranged on the plurality of support mechanisms respectively.

2. The composite copper foil production apparatus according to claim 1, characterized by The first winding and unwinding mechanism and the second winding and unwinding mechanism are arranged in a central symmetry, and the coating winding mechanism comprises a first coating roller and a second coating roller arranged in a central symmetry.

3. The composite copper foil production apparatus according to claim 1, characterized by The telescopic adjusting part comprises an adjusting cylinder arranged in the vacuum container and a fixing rod connected to the arc-shaped fixing part.

4. The composite copper foil production apparatus according to claim 3, characterized by The device further comprises a first pulsed sputtering power source electrically connected to the first sputtering source mechanism and a second pulsed sputtering power source electrically connected to the second sputtering source mechanism.

5. The composite copper foil production apparatus according to claim 4, characterized by The device further comprises a first gas flow controller and a second gas flow controller.

6. The composite copper foil production apparatus according to claim 5, wherein The vacuum container comprises a shell and a fixing plate arranged on the shell, and the shell and the fixing plate form a vacuum cavity.

7. The composite copper foil production apparatus according to claim 6, wherein The vacuum container further comprises a first sliding block mechanism arranged at the bottom of the fixing plate and a second sliding block mechanism arranged at the bottom of the shell. The device further comprises a guide rail assembly, and the first sliding block mechanism and the second sliding block mechanism are in sliding cooperation with the guide rail assembly respectively.

8. The composite copper foil production apparatus according to claim 6, wherein The vacuum container further comprises a sealing mechanism, which comprises a first magnetic attraction part arranged on the fixing plate, a first sealing part arranged on the first magnetic attraction part, a second magnetic attraction part arranged on the shell, and a second sealing part arranged on the second magnetic attraction part.

9. A composite copper foil production method characterized by, The device is applied to the method for producing the composite copper foil. Each of the first sputtering source mechanisms is made close to the coating roller by the corresponding telescopic adjusting part, and each of the second sputtering source mechanisms is made away from the coating roller. Turning on the first pulsed sputtering power source, inert gas is introduced into the vacuum container through the first gas flow controller at a first flow rate, oxygen is introduced into the vacuum container through the second gas flow controller at a second flow rate, the organic film is output from the first take-up and pay-off mechanism, the first sputtering source mechanism performs magnetron sputtering coating treatment on the organic film when the organic film passes through the coating winding mechanism to form an activation layer on the organic film, and the organic film is wound on the second take-up and pay-off mechanism; Each of the second sputtering source mechanisms is made to approach the coating roller through the corresponding telescopic adjusting part, and each of the first sputtering source mechanisms is made to move away from the coating roller; Turning on the second pulsed sputtering power source, inert gas is introduced into the vacuum container through the first gas flow controller at a first flow rate, the organic film is output from the second take-up and pay-off mechanism, the second sputtering source mechanism performs magnetron sputtering coating treatment on the organic film when the organic film passes through the coating winding mechanism to form a copper layer on the activation layer of the organic film, and a composite copper foil is obtained, and the composite copper foil is wound on the first take-up and pay-off mechanism.

10. The composite copper foil production method according to claim 9, characterized by, The inert gas is argon, the first flow rate is 100-200 sccm, the second flow rate is 5.0-7.0 sccm, and the pulse frequency of the first pulsed sputtering power source is 200-320 KHz.

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