Method, device, equipment and storage medium for preparing optical components capable of resisting impact and absorbing energy

Abstract

The present application provides a method, device, equipment and storage medium for preparing an optical component that is resistant to impact and energy absorption, and relates to the technical field of preparation of optical components. The method includes: constructing a three-dimensional model of the optical component; meshing the three-dimensional model, and applying preset boundary conditions and loads to the three-dimensional model according to the material properties of the optical component; generating a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads; generating a preparation plan according to the stress distribution cloud map and the strain distribution cloud map, so that a deposition device deposits a polymer material film layer on the optical component according to the preparation plan. The technical effect of the present application is: meeting the impact resistance requirements of the optical component.

Description

Technical Field

[0001] The present application relates to the technical field of preparation of optical components, and in particular to a method, device, equipment and storage medium for preparing an optical component that is resistant to impact and energy absorption. Background Art

[0002] Optical components are widely used in various optical systems, such as camera lenses, telescopes, microscopes and other imaging systems. During the use of optical systems, their components are easily damaged by external impact. Therefore, it is necessary to cover the surface of the optical components with a layer of polymer film to improve their impact resistance.

[0003] In the prior art, sputtering or evaporation processes are often used to form a polymer film layer on the surface of an optical component. Since the functions and structures of various parts of an optical component are different, and the requirements for impact resistance are also different, the above method coats the entire optical component without performing differentiated treatment on various parts of the optical component, and it is difficult to meet the impact resistance requirements of the optical component. Summary of the invention

[0004] The present application provides a method, device, equipment and storage medium for preparing an optical component that is resistant to impact and absorbs energy, which are used to meet the impact resistance performance requirements of the optical component.

[0005] In a first aspect, the present application provides a method for preparing an optical component that is resistant to impact and energy absorption, the method comprising: constructing a three-dimensional model of the optical component; meshing the three-dimensional model, and applying preset boundary conditions and loads to the three-dimensional model according to material parameters of the optical component; generating a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads; generating a preparation plan according to the stress distribution cloud map and the strain distribution cloud map, so that a deposition device deposits a polymer material film layer on the optical component according to the preparation plan.

[0006] By adopting the above technical solution, by constructing a three-dimensional model of the optical component and performing meshing, combined with material parameters, preset boundary conditions and precise application of loads, a detailed simulation of the stress and strain distribution of the optical component is achieved, providing key visual data and quantitative basis for the formulation of the preparation plan. Through these distribution cloud maps, the areas where stress and strain are concentrated in the optical component can be accurately identified, allowing the preparation plan to deposit polymer material films in these key areas in a targeted manner, optimize the use of materials and ensure the effectiveness of the film layer. Improve the overall impact resistance of the optical component, especially in key parts that are vulnerable to structural damage, thereby extending the service life of the component. At the same time, because this method can achieve differentiated processing, it avoids the application of unnecessary polymer materials in non-critical areas, reduces material costs and reduces component weight. This targeted protective layer will not have a general impact on optical performance and meets the impact resistance requirements of optical components.

[0007] Optionally, the three-dimensional model is meshed and preset boundary conditions and loads are applied to the three-dimensional model according to material parameters of the optical component, including: importing the three-dimensional model into the finite element analysis software for meshing to obtain multiple mesh areas; and applying preset boundary conditions and loads to each mesh area in combination with the material parameters of the optical component, the working environment of the optical component and the use conditions of the optical component.

[0008] By adopting the above technical solution, by importing the three-dimensional model into the finite element analysis software and performing meshing, multiple mesh areas are obtained. This process lays the foundation for the subsequent stress and strain distribution analysis. Combined with the material parameters, working environment and use conditions of the optical component, preset boundary conditions and loads are applied to each mesh area to make the analysis more in line with the actual use scenario. By accurately simulating the performance of the optical component under the actual working environment through the finite element analysis software, the stress and strain distribution of the component in actual application can be more accurately predicted. Through this refined simulation, the areas where the optical component is most likely to be damaged can be identified, and then the polymer material film layer can be accurately deposited in these areas to achieve targeted strengthening. This technical effect not only improves the impact resistance of the optical component, but also avoids the waste of materials and potential reduction in optical performance caused by uniformly coating the protective layer on the entire optical component by accurately controlling the deposition area of ​​the polymer material film layer.

[0009] Optionally, the preset boundary conditions and loads are applied to each grid area in combination with the material parameters of the optical component, the working environment of the optical component and the use conditions of the optical component, including: determining the initial preset boundary conditions of each grid area according to the material parameters of the optical component; setting the initial load of each grid area according to the working environment of the optical component; adjusting the initial preset boundary conditions and the initial load of each grid area according to the use conditions of the optical component, generating the preset boundary conditions and loads for each grid area, and applying the preset boundary conditions and the loads to each grid area.

[0010] By adopting the above technical solution and applying preset boundary conditions and loads by combining the material parameters, working environment and usage conditions of the optical components, it is possible to simulate and predict the performance of the optical components in actual use, thereby improving the accuracy and reliability of the design and ensuring that the performance of the components in the actual working environment meets the expected requirements.

[0011] Optionally, generating a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads includes: obtaining stress parameters and displacement parameters of the optical component under the preset boundary conditions and loads; drawing a stress distribution cloud map according to the stress parameters, and drawing a strain distribution cloud map according to the displacement parameters.

[0012] By adopting the above technical solution, the stress and displacement parameters of the optical component under the preset boundary conditions and loads are obtained through finite element analysis software, and stress distribution cloud maps and strain distribution cloud maps are drawn accordingly, realizing the intuitive display of stress and strain conditions of the optical component under actual working conditions. This facilitates the subsequent enhancement of the impact resistance of the optical component while maintaining the optical performance without damage.

[0013] Optionally, generating a preparation plan according to the stress distribution cloud map and the strain distribution cloud map includes: dividing the optical component into regions according to the stress distribution cloud map and the strain distribution cloud map to obtain a plurality of regions; and generating a preparation plan corresponding to each of the regions according to regional characteristics of each of the regions.

[0014] By adopting the above technical solution, the optical components are divided into targeted areas using stress distribution cloud maps and strain distribution cloud maps, and specific preparation plans for each area are formulated accordingly. This process greatly improves the pertinence and efficiency of the preparation plan. Through the distribution data of stress and strain, the changes in the structural strength and stability of the optical components in different areas can be accurately determined, so that the preparation plan can provide additional reinforcement or optimized design for those areas with high stress or large deformation while ensuring the performance of the optical components. This preparation plan based on stress and strain distribution maps allows the optical components to be structurally optimized according to actual working conditions during the design and manufacturing process. Such a process not only improves the performance and reliability of the optical components, but also avoids excessive use of materials in unnecessary areas, thereby maximizing cost-effectiveness. By accurately preparing different areas, not only the structural strength and service life of the components are improved, but also the optimization of optical performance is ensured.

[0015] Optionally, the regional characteristics include stress level, strain level and functional requirements, and the preparation plan corresponding to each of the regions is generated according to the regional characteristics of each of the regions, including: calculating the impact resistance performance index of each of the regions according to the stress level and the strain level of each of the regions; determining the impact resistance performance priority of each of the regions according to the functional requirements of each of the regions; dividing each of the regions into groups according to the impact resistance performance index and the impact resistance performance priority of each of the regions to obtain multiple category regions; and generating a preparation plan corresponding to each of the category regions.

[0016] By adopting the above technical solution, the preparation process of optical components adopts refined regional characteristic analysis, that is, the components are divided into regional characteristics according to stress level, strain level and functional requirements, and the impact resistance performance indicators of different regions are calculated based on this, and the priority of impact resistance performance is established in combination with functional requirements, and then the different regions of the components are classified according to performance indicators and priorities, and corresponding preparation plans are formulated for each category area. This makes the preparation process more precise and purposeful, ensuring that the preparation plan for each area is customized based on the actual working conditions and functional requirements of the area, ensuring that the optical components can provide the best performance in their respective application environments.

[0017] Optionally, after generating a preparation plan based on the stress distribution cloud map and the strain distribution cloud map so that a deposition device deposits a polymer material film layer on the optical component according to the preparation plan, the method further includes: controlling an impact testing device to perform an impact test on the optical component to obtain a test result; determining an anti-impact energy absorption effect of the polymer material film layer based on the test result; and adjusting parameters for depositing the polymer material film layer on the optical component in the preparation plan based on the anti-impact energy absorption effect of the polymer material film layer.

[0018] By adopting the above technical solution, by controlling the impact test equipment to conduct the impact test and obtaining the test results, the impact resistance and energy absorption effect of the polymer material film layer can be actually evaluated. According to the test results, the actual impact resistance of the deposited polymer material film layer can be determined, which provides an experimental basis for further optimization of the preparation scheme. When the test results indicate that the impact resistance needs to be improved, adjusting the deposition parameters according to the impact resistance and energy absorption effect of the polymer material film layer is an iterative optimization process. It can ensure that the optical component finally has the expected impact resistance. By combining experimental testing with the preparation process, fine control and continuous optimization of the optical component preparation process are achieved, and the performance and quality of the optical component are improved.

[0019] In a second aspect, the present application provides a device for preparing an optical component that is resistant to impact and energy absorption, the device comprising: a building module, a dividing module, a first generating module and a second generating module; wherein the building module is used to construct a three-dimensional model of the optical component; the dividing module is used to grid the three-dimensional model and apply preset boundary conditions and loads to the three-dimensional model according to the material properties of the optical component; the first generating module is used to generate a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads; the second generating module is used to generate a preparation plan based on the stress distribution cloud map and the strain distribution cloud map, so that the deposition equipment deposits a polymer material film layer on the optical component according to the preparation plan.

[0020] By adopting the above technical solution, by constructing a three-dimensional model of the optical component and performing meshing, combined with material parameters, preset boundary conditions and precise application of loads, a detailed simulation of the stress and strain distribution of the optical component is achieved, providing key visual data and quantitative basis for the formulation of the preparation plan. Through these distribution cloud maps, the areas where stress and strain are concentrated in the optical component can be accurately identified, allowing the preparation plan to deposit polymer material films in these key areas in a targeted manner, optimize the use of materials and ensure the effectiveness of the film layer. Improve the overall impact resistance of the optical component, especially in key parts that are vulnerable to structural damage, thereby extending the service life of the component. At the same time, because this method can achieve differentiated processing, it avoids the application of unnecessary polymer materials in non-critical areas, reduces material costs and reduces component weight. This targeted protective layer will not have a general impact on optical performance and meets the impact resistance requirements of optical components.

[0021] In a third aspect, the present application provides an electronic device, which adopts the following technical solution: it includes a processor, a memory, a user interface and a network interface, the memory is used to store instructions, the user interface and the network interface are used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device executes a computer program such as any of the above-mentioned methods for preparing optical components that are resistant to impact and energy absorption.

[0022] In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution: a computer program that can be loaded by a processor and execute any of the above-mentioned methods for preparing an optical component that is resistant to impact and energy absorption is stored.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. Meet the impact resistance requirements of optical components;

[0025] 2. Achieve differentiated processing, avoid applying unnecessary polymer materials in non-critical areas, reduce material costs and reduce component weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic flow chart of a method for preparing an optical component capable of resisting impact and absorbing energy provided in an embodiment of the present application;

[0027] Figure 2 It is a structural schematic diagram of an optical component preparation device for resisting impact and absorbing energy provided in an embodiment of the present application;

[0028] Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0029] Description of reference numerals: 1000, electronic device; 1001, processor; 1002, communication bus; 1003, user interface; 1004, network interface; 1005, memory. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0031] In the description of the embodiments of the present application, words such as "illustrative", "for example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "illustrative", "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "illustrative", "for example" or "for example" is intended to present related concepts in a concrete way.

[0032] Figure 1 FIG. 1 is a flow chart of a method for preparing an optical component that is impact-resistant and energy-absorbing according to an embodiment of the present application. Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but the steps are not necessarily executed in the order indicated by the arrows; unless otherwise specified in this document, there is no strict order restriction for the execution of the steps, and the steps may be executed in other orders; and Figure 1 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0033] The present application discloses a method for preparing an optical component that is resistant to impact and energy absorption, such as Figure 1 As shown, the method includes S101-S104.

[0034] S101, constructing a three-dimensional model of an optical component.

[0035] In one example, the optical component may be a lens, such as a convex lens, a concave lens, a spherical lens, etc.; a reflector, such as a plane mirror, a curved mirror, a parabolic mirror, etc.; and a prism, a filter, a polarizer, etc.

[0036] In order to accurately predict and evaluate the stress and strain distribution of optical components in actual use environments, it is necessary to conduct simulation analysis by establishing a three-dimensional finite element model of the optical component. The establishment of a three-dimensional model needs to consider factors such as the geometric shape, material parameters, and assembly relationship of the optical component. Specifically, it is first necessary to collect detailed structural drawings of the optical component to obtain the three-dimensional geometric model of components such as optical lenses, frames, and fixtures; then refer to the optical design parameters to determine the key dimensional parameters such as the curvature, center thickness, and peripheral thickness of the lens; at the same time, consult the material information and set the material properties of each component, such as the refractive index, density, elastic modulus, and other parameters of the glass lens; finally, consider the positioning relationship of the components and obtain a complete three-dimensional model of the optical component through three-dimensional assembly.

[0037] The purpose of establishing a three-dimensional model is to import the finite element analysis software for subsequent meshing, loading and other simulation analysis. Compared with the simplified two-dimensional model, the three-dimensional model can more comprehensively and accurately reflect the geometric shape, component relationship and mechanical response of the optical component, which is conducive to improving the accuracy of the simulation calculation, predicting the stress concentration and deformation of each part, and providing a basis for the subsequent optimization of the impact-resistant structure.

[0038] S102, meshing the three-dimensional model, and applying preset boundary conditions and loads to the three-dimensional model according to material parameters of the optical component.

[0039] In one example, in order to use the finite element method to simulate the three-dimensional model of the optical component, it needs to be discretized. After the three-dimensional model is imported into the finite element analysis software, the model needs to be meshed first, that is, the calculation domain of the model is divided into multiple small units to generate a mesh model. The meshing adopts tetrahedral meshes and performs mesh densification. The meshes of important parts such as lenses and joints are encrypted to ensure the calculation accuracy. At the same time, the balance between the number of meshes and the calculation time cost is considered. After meshing, the mesh quality check needs to be performed to ensure that the meshes are not overlapped or missing and meet the calculation requirements. After the meshing is completed, the material parameters of each mesh unit need to be set according to the actual material parameters of the optical component, such as the glass lens is set to glass material and the metal frame is set to aluminum alloy material. Material parameters include parameters such as density, elastic modulus, and Poisson's ratio. Next, it is necessary to apply preset boundary conditions and loads to the mesh model according to the actual working conditions and stress conditions of the optical component, mainly including: setting mechanical constraint boundary conditions, such as the connection of the fixed lens cannot move; applying surface pressure loads to simulate force impact.

[0040] This allows the finite element simulation calculation to reflect the actual working conditions, thereby accurately predicting the stress and deformation of the optical components and providing suggestions for subsequent optimization. After the above discretization grid processing and loading application, the grid model can be submitted to the finite element analysis software for subsequent calculation and analysis.

[0041] Based on the above embodiment, as an optional implementation, in S102: meshing the three-dimensional model, and applying preset boundary conditions and loads to the three-dimensional model according to the material parameters of the optical component, specifically including: importing the three-dimensional model into finite element analysis software for meshing to obtain multiple mesh areas; applying preset boundary conditions and loads to each mesh area in combination with the material parameters of the optical component, the working environment of the optical component and the use conditions of the optical component.

[0042] In one example, in order to use the finite element method to simulate and analyze optical glass, meshing and loading are required. First, the established three-dimensional optical glass model is imported into the finite element analysis software. The model is automatically meshed using the tetrahedron mesh method, and local encryption is performed to ensure the calculation accuracy. Then, the material properties of each mesh unit are set according to the actual material parameters of the optical glass, such as refractive index, density, elastic modulus, etc. Next, considering the actual use environment and working conditions of the optical glass, isotropic pressure or point load is applied to the mesh model to simulate external impact loads. Constrained boundary conditions can also be set to simulate the actual fixing method. By setting loading and constraint conditions representing the actual situation, the simulation calculation results can more accurately reflect the mechanical response and internal force distribution of the optical glass. Provide a basis for subsequent structural optimization. After the above discretization processing, the meshed model can be imported into the finite element software to start calculation. Finally, the stress and strain distribution results of the optical glass under different loading conditions can be obtained.

[0043] In combination with the material parameters of the optical component, the working environment of the optical component and the use conditions of the optical component, preset boundary conditions and loads are applied to each grid area, including: determining the initial preset boundary conditions of each grid area according to the material parameters of the optical component; setting the initial load of each grid area according to the working environment of the optical component; adjusting the initial preset boundary conditions and initial load of each grid area according to the use conditions of the optical component, generating preset boundary conditions and loads for each grid area, and applying the preset boundary conditions and loads to each grid area.

[0044] In one example, in order to make the finite element simulation reflect the actual working conditions of the optical component, it is necessary to consider the material parameters, working environment and use conditions to reasonably define the loading of each grid. First, according to the material properties of different parts of the optical component, such as the refractive index of the lens, the density of the frame, etc., the basic boundary conditions, such as constraints, rigid connections, etc., are pre-set. Then, according to the use environment of the optical component, such as a stable indoor environment or a frequently moved outdoor environment, the initial load conditions, such as static gravity loads or random dynamic loads, are applied. Finally, combined with the specific use of the optical component, such as fixed installation or portable use, the boundary conditions and loads of each grid are corrected and adjusted to make them more in line with the actual situation. In this way, various influencing factors are taken into account in the simulation calculation, so that the analysis results can more accurately reflect the mechanical response and performance of the optical component under complex working conditions. It provides a reliable basis for subsequent structural optimization.

[0045] S103, generating a stress distribution cloud map and a strain distribution cloud map of the optical component according to preset boundary conditions and loads.

[0046] In one example, after completing the establishment of a three-dimensional model, meshing, boundary conditions and load loading, it is necessary to start the finite element analysis simulation calculation to obtain the mechanical response results of the optical component under the preset working conditions. The discrete stress and strain results of each unit of the optical component can be obtained by finite element analysis. In order to facilitate the intuitive representation of the overall stress and strain distribution of the optical component, post-processing is required to generate a cloud map. Specifically, the simulation calculation results of each unit are read using the post-processing module, including the stress parameters (normal stress, shear stress, etc.) and displacement parameters of each unit. These parameters are then mapped on the three-dimensional model, and the parameter values ​​are visualized in a color gradient by setting the color function correspondence. For example, if the stress value is set from small to large to correspond to blue to red, the high stress area is displayed in red, and the low stress area is displayed in blue, and finally a stress cloud map is formed. The generation process of the strain cloud map is similar. The purpose of generating a stress-strain cloud map is to intuitively reflect the internal force distribution and deformation of the optical component at different parts, judge the stress concentration area by color and shape, find the weak links of the structure, provide a basis for subsequent optimization, and improve the impact resistance. The stress-strain cloud map can also be analyzed by cross-section slicing or magnifying local details to obtain accurate numerical results for key areas and provide detailed reference for structural optimization.

[0047] Based on the above embodiment, as an optional implementation, in S103, a stress distribution cloud map and a strain distribution cloud map of the optical component are generated according to preset boundary conditions and loads, including: obtaining stress parameters and displacement parameters of the optical component under preset boundary conditions and loads; drawing a stress distribution cloud map according to the stress parameters, and drawing a strain distribution cloud map according to the displacement parameters.

[0048] In one example, in order to intuitively display the internal force distribution of the optical component, it is necessary to generate the stress and strain distribution results in the form of a cloud map. By completing the loading and solving the calculation in the finite element software, the actual stress parameters (such as equivalent stress, shear stress, etc.) and displacement parameters of each unit can be obtained. Then, the calculation results of each unit are read through the post-processing module and mapped to each node of the three-dimensional model construction. Next, set the correspondence between parameter values ​​and colors, for example, the stress values ​​are mapped from small to large to colors from blue to red. And perform three-dimensional visualization. Finally, generate a stress cloud map based on the stress parameters, and generate a strain cloud map based on the displacement parameters. The color and shape can intuitively judge the size and distribution of the internal force of the optical component.

[0049] The purpose of generating cloud maps is to visually determine the weak areas and internal force distribution of components, and provide a basis for subsequent structural optimization. Stress-strain cloud maps can make full use of finite element results and intuitively reflect the impact resistance weaknesses of optical systems.

[0050] S104, generating a preparation plan according to the stress distribution cloud map and the strain distribution cloud map, so that a deposition device deposits a polymer material film layer on the optical component according to the preparation plan.

[0051] In one example, in order to improve the impact resistance of optical glass in a targeted manner, it is necessary to generate a preparation plan based on the stress distribution cloud map and strain distribution cloud map calculated previously. The stress cloud map and strain cloud map can intuitively reflect the internal force distribution of optical glass in different parts. According to the cloud map, the key areas with large stress and strain can be clearly judged, and these areas are the objects that need to improve the impact resistance first. Therefore, the optical glass can be divided into regions according to the cloud map results, and the areas with large stress and strain are determined as key strengthening areas. For these areas, a customized preparation plan is generated to improve their impact resistance. The specific preparation plan can be: in the stress concentration area, optimize the structural design to avoid stress concentration; in the area with large strain, add ribs to improve the deformation resistance; in the local weak areas such as the frame connection, take reinforcement measures. At the same time, since the polymer coating has a good impact buffering effect, the thickness of the polymer coating can be increased by vacuum deposition in the above-mentioned key areas to further enhance the impact resistance of these parts. Through this targeted regional preparation plan, the impact resistance of key parts of optical glass can be improved, so as to achieve the purpose of comprehensively optimizing the impact resistance of optical glass. At the same time, it also avoids unnecessary waste of resources.

[0052] Based on the above embodiment, as an optional implementation, in S104, generating a preparation plan according to the stress distribution cloud map and the strain distribution cloud map specifically includes:

[0053] According to the stress distribution cloud map and the strain distribution cloud map, the optical component is divided into regions to obtain multiple regions; according to the regional characteristics of each region, a corresponding preparation plan for each region is generated.

[0054] In one example, in order to improve the impact resistance of optical components in a targeted manner, regional division and preparation scheme design can be performed based on the stress-strain cloud map. According to the stress cloud map and the strain cloud map, key parts such as high stress areas, large deformation areas, and connection areas of the optical components can be clearly judged. According to these results, the optical components are divided into different levels of areas, such as key reinforcement areas, conventional areas, etc. For key reinforcement areas, such as high stress and large deformation areas, the preparation scheme can enhance the impact resistance by increasing the coating thickness. For conventional areas, the original coating thickness can be maintained. For connection areas, a scheme to enhance the connection strength can be designed. Through this targeted regional preparation scheme, the impact resistance of key parts is improved, and resource waste is avoided, so that the overall impact resistance of the optical components is optimized.

[0055] Regional characteristics include stress level, strain level and functional requirements. According to the regional characteristics of each region, a corresponding preparation plan for each region is generated, including: calculating the impact resistance index of each region according to the stress level and strain level of each region; determining the impact resistance priority of each region according to the functional requirements of each region; dividing each region into groups according to the impact resistance index and impact resistance priority of each region to obtain multiple category regions; generating a preparation plan corresponding to each category region.

[0056] In one example, in order to further optimize the impact resistance of optical components, a preparation plan can be formulated by comprehensively considering the stress, strain and functional requirements of each area. First, the stress level and strain level of each area are calculated based on the cloud map, and the impact resistance index of each area is evaluated in combination with the material parameters. Then, based on the working principle of the optical component, the function and performance priority of each area are judged, such as image quality sensitive areas. Next, all areas are classified into different categories, such as critical areas, non-critical areas, etc., according to the impact resistance index and functional priority of each area. Finally, different preparation plans are formulated for different categories of areas. Thickening coating or structural optimization is adopted for critical areas, and the original plan is maintained for non-critical areas. Through this classified preparation idea that takes into account various factors, limited resources can be used in the most important areas, thereby optimizing the overall impact resistance of optical components at the system level.

[0057] In another example, according to the preparation scheme generated previously, it is necessary to deposit a polymer coating on the key parts of the optical glass to improve the impact resistance of these parts. The polymer coating is deposited in the high stress area, large strain area and structural weak area determined by the preparation scheme. Sputtering coating is adopted, and a vacuum sputtering instrument is used to deposit special fluorosilicone polymer materials in the target area. Considering the impact buffering effect, the coating thickness is generally controlled at 0.1-0.5mm. The coating thickness can be precisely controlled by adjusting the deposition time. In addition, surface treatment is required to improve the adhesion of the coating. The purpose is to form an elastic polymer buffer layer on the key parts of the optical glass. When encountering an impact, the polymer material deforms to absorb the impact energy, plays a role in protecting the substrate, and prevents the glass and metal materials from being damaged by excessive stress. This directional and efficient key part reinforcement method not only improves the impact resistance, but also controls the difficulty of production. It makes the optical glass meet the demand for high impact resistance.

[0058] After depositing a polymer material film layer on the optical component according to the preparation plan, the method also includes: controlling an impact test device to perform an impact test on the optical component to obtain a test result; determining the anti-impact energy absorption effect of the polymer material film layer based on the test result; and adjusting the parameters for depositing the polymer material film layer on the optical component in the preparation plan based on the anti-impact energy absorption effect of the polymer material film layer.

[0059] In one example, after the deposition of the polymer coating in the key area of ​​the optical component is completed, an impact test is required to verify the impact resistance of the coating. The processed optical components are impact tested using standard impact testing equipment to obtain data results of various indicators, such as maximum impact acceleration, maximum deformation, etc. By comparing with the test results in the unprocessed state, the effect of improving the impact resistance brought by the polymer coating can be determined. If the test results show that the impact resistance is not obvious, it is necessary to adjust the coating parameters, such as using different materials or increasing the coating thickness, and repeat the test optimization. Finally, a solution with impact resistance that meets the design requirements is obtained, and the impact resistance optimization of the optical component is completed. This closed-loop test feedback design idea can make the configuration of the polymer coating more in line with actual needs, and continuously optimize the final impact resistance through multiple rounds of testing, so as to design a more reliable optical system.

[0060] Based on the above method, the present application also discloses a device for preparing an optical component that is resistant to impact and absorbs energy, such as Figure 2 As shown, Figure 2 It is a structural schematic diagram of an optical component preparation device that is resistant to impact and absorbs energy provided in an embodiment of the present application.

[0061] A device for preparing an optical component that is resistant to impact and absorbs energy, the device comprising: a building module, a dividing module, a first generating module and a second generating module; wherein the building module is used to construct a three-dimensional model of the optical component; the dividing module is used to grid the three-dimensional model and apply preset boundary conditions and loads to the three-dimensional model according to the material properties of the optical component; the first generating module is used to generate a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads; the second generating module is used to generate a preparation plan according to the stress distribution cloud map and the strain distribution cloud map, so that a deposition device deposits a polymer material film layer on the optical component according to the preparation plan.

[0062] It should be noted that: when the device provided in the above embodiment realizes its function, only the division of the above functional modules is used as an example. In actual application, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be repeated here.

[0063] See also Figure 3 , is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3 As shown, the electronic device 1000 may include: at least one processor 1001 , at least one network interface 1004 , a user interface 1003 , a memory 1005 , and at least one communication bus 1002 .

[0064] The communication bus 1002 is used to realize the connection and communication between these components.

[0065] The user interface 1003 may include a display screen (Display) and a camera (Camera). Optionally, the user interface 1003 may also include a standard wired interface and a wireless interface.

[0066] The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).

[0067] Among them, the processor 1001 may include one or more processing cores. The processor 1001 uses various interfaces and lines to connect various parts in the entire server, and executes various functions of the server and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 1005, and calling data stored in the memory 1005. Optionally, the processor 1001 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 1001 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 1001, and it can be implemented separately through a chip.

[0068] Among them, the memory 1005 may include a random access memory (Random Access Memory, RAM) and may also include a read-only memory (Read-Only Memory). Optionally, the memory 1005 includes a non-transitory computer-readable storage medium. The memory 1005 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 1005 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 1005 may optionally also be at least one storage device located away from the aforementioned processor 1001. As Figure 3 As shown, the memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and an application program of a method for preparing an optical component that resists impact and absorbs energy.

[0069] exist Figure 3In the electronic device 1000 shown, the user interface 1003 is mainly used to provide an input interface for the user and obtain data input by the user; and the processor 1001 can be used to call an application program stored in the memory 1005 for a method for preparing an optical component that is resistant to impact and energy absorption. When executed by one or more processors, the electronic device executes one or more of the methods described in the above embodiments.

[0070] An electronic device readable storage medium stores instructions, which, when executed by one or more processors, enable the electronic device to execute one or more of the methods described in the above embodiments.

[0071] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the order of the actions described, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for the present application.

[0072] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0073] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0074] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0075] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0076] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: various media that can store program codes, such as USB flash drives, mobile hard drives, magnetic disks or optical disks.

[0077] The above is only an exemplary embodiment of the present disclosure, and the scope of the present disclosure cannot be limited thereto. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the specification and practicing the disclosure here, those skilled in the art will easily think of other embodiments of the present disclosure. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the technical field not recorded in the present disclosure. The description and examples are only regarded as exemplary, and the scope and spirit of the present disclosure are defined by the claims.

Claims

1. A method for preparing an optical component that is resistant to impact and absorbs energy, characterized in that: The method comprises: Build 3D models of optical components; Meshing the three-dimensional model, and applying preset boundary conditions and loads to the three-dimensional model according to material parameters of the optical component; Generating a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads; Generate a preparation scheme according to the stress distribution cloud map and the strain distribution cloud map, so that a deposition device deposits a polymer material film layer on the optical component according to the preparation scheme; The step of generating a preparation scheme according to the stress distribution cloud map and the strain distribution cloud map comprises: According to the stress distribution cloud map and the strain distribution cloud map, the optical component is divided into regions to obtain a plurality of regions; Generating a preparation scheme corresponding to each of the regions according to the regional characteristics of each of the regions; the regional characteristics include stress level, strain level and functional requirements, and generating a preparation scheme corresponding to each of the regions according to the regional characteristics of each of the regions includes: calculating the impact resistance index of each of the regions according to the stress level and the strain level of each of the regions; Determining the impact resistance priority of each of the areas according to the functional requirements of each of the areas; According to the impact resistance performance index and the impact resistance performance priority of each area, each area is divided into groups to obtain a plurality of category areas; and a preparation plan corresponding to each category area is generated; After generating a preparation scheme according to the stress distribution cloud map and the strain distribution cloud map so that a deposition device deposits a polymer material film layer on the optical component according to the preparation scheme, the method further includes: Controlling the impact test equipment to perform an impact test on the optical component to obtain a test result; According to the test results, the impact resistance and energy absorption effect of the polymer material film layer is determined; According to the impact resistance and energy absorption effect of the polymer material film layer, the parameters of depositing the polymer material film layer on the optical component in the preparation scheme are adjusted.

2. The method for preparing an optical component capable of absorbing impact energy according to claim 1, characterized in that: The meshing of the three-dimensional model and applying preset boundary conditions and loads to the three-dimensional model according to the material parameters of the optical component include: Importing the three-dimensional model into finite element analysis software to perform mesh division to obtain multiple mesh regions; In combination with the material parameters of the optical component, the working environment of the optical component and the use conditions of the optical component, preset boundary conditions and loads are applied to each grid area.

3. The method for preparing an optical component capable of absorbing impact energy according to claim 2, characterized in that: The applying preset boundary conditions and loads to each grid area in combination with the material parameters of the optical component, the working environment of the optical component and the use conditions of the optical component comprises: Determining initial preset boundary conditions of each of the grid regions according to material parameters of the optical component; According to the working environment of the optical component, setting the initial load of each grid area; According to the use conditions of the optical component, the initial preset boundary conditions and the initial load of each grid area are adjusted, the preset boundary conditions and the load of each grid area are generated, and the preset boundary conditions and the load are applied to each grid area.

4. The method for preparing an optical component capable of absorbing impact energy according to claim 1, characterized in that: The step of generating a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads includes: Obtaining stress parameters and displacement parameters of the optical component under the preset boundary conditions and loads; A stress distribution cloud diagram is drawn according to the stress parameters, and a strain distribution cloud diagram is drawn according to the displacement parameters.

5. An optical component preparation device that is resistant to impact and absorbs energy, characterized in that: The device comprises: a construction module, a division module, a first generation module and a second generation module; wherein, The building module is used to build a three-dimensional model of the optical component; The partitioning module is used to perform mesh partitioning on the three-dimensional model and apply preset boundary conditions and loads to the three-dimensional model according to the material parameters of the optical component; The first generating module is used to generate a stress distribution cloud map and a strain distribution cloud map of the optical component according to the preset boundary conditions and loads; The second generating module is used to generate a preparation scheme according to the stress distribution cloud map and the strain distribution cloud map, so that a deposition device deposits a polymer material film layer on the optical component according to the preparation scheme; The step of generating a preparation scheme according to the stress distribution cloud map and the strain distribution cloud map comprises: According to the stress distribution cloud map and the strain distribution cloud map, the optical component is divided into regions to obtain a plurality of regions; Generating a preparation scheme corresponding to each of the regions according to the regional characteristics of each of the regions; the regional characteristics include stress level, strain level and functional requirements, and generating a preparation scheme corresponding to each of the regions according to the regional characteristics of each of the regions includes: calculating the impact resistance index of each of the regions according to the stress level and the strain level of each of the regions; Determining the impact resistance priority of each of the areas according to the functional requirements of each of the areas; According to the impact resistance performance index and the impact resistance performance priority of each area, each area is divided into groups to obtain a plurality of category areas; and a preparation plan corresponding to each category area is generated; After generating a preparation scheme according to the stress distribution cloud map and the strain distribution cloud map so that a deposition device deposits a polymer material film layer on the optical component according to the preparation scheme, the method further includes: Controlling the impact test equipment to perform an impact test on the optical component to obtain a test result; According to the test results, the impact resistance and energy absorption effect of the polymer material film layer is determined; According to the impact resistance and energy absorption effect of the polymer material film layer, the parameters of depositing the polymer material film layer on the optical component in the preparation scheme are adjusted.

6. An electronic device, characterized in that: It includes a processor, a memory, a user interface and a network interface, the memory is used to store instructions, the user interface and the network interface are used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device executes the method according to any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that: A computer program is stored which can be loaded by a processor and execute the method according to any one of claims 1 to 4.

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