A SOC packaging processing method and system for millimeter wave chips

Abstract

The present invention provides a SOC packaging processing method and system for a millimeter-wave chip, belonging to the field of semiconductor technology, and specifically comprising: obtaining the operating temperature reliability of packaging sizes corresponding to different available packaging solutions, and determining the comprehensive operating reliability of the available packaging solutions and alternative packaging solutions in combination with the operating reliability of the available packaging solutions at different matching operating frequencies; obtaining the packaging chip density and packaging cost of different alternative packaging solutions, and determining the optimal packaging solution in combination with the comprehensive operating reliability of the alternative packaging solutions; and performing packaging processing of the millimeter-wave chip using the optimal packaging solution, thereby further ensuring the reliability of the packaging processing.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and in particular relates to a SOC packaging processing method and system for a millimeter wave chip. Background Art

[0002] Millimeter-wave frequency bands facilitate the design of miniaturized antennas, leading a growing number of research institutes to focus on antenna-in-package (AiP) design for these bands. Furthermore, this packaging technology enables the use of interconnect networks between antennas and other components of the communication system, significantly improving overall system efficiency and reducing losses and costs. This, in turn, makes accurately assessing the package size of millimeter-wave chips a pressing technical challenge.

[0003] To solve the above technical problems, the existing technical solution in invention patent application CN201810625705.0 "Power Module Packaging Structure Optimization Method" comprehensively considers the factors affecting the cycle life and temperature cycle of the power module chip, and can accurately determine the reasonable power module packaging size. However, it is not difficult to find through analysis that there are the following technical problems:

[0004] Unlike power modules, the package size of millimeter-wave chips also affects the mutual coupling between the antenna inside the package structure and its surrounding circuits during the communication process, thereby having a certain degree of impact on the performance of the millimeter-wave chip in terms of gain, directivity, return loss, matching, etc. Therefore, if the above factors are not combined, it is impossible to accurately determine the size of the millimeter-wave chip.

[0005] In response to the above technical problems, the present invention provides a SOC packaging processing method and system for millimeter wave chips. Summary of the Invention

[0006] To achieve the purpose of the present invention, the present invention adopts the following technical solutions:

[0007] According to one aspect of the present invention, a SOC packaging method for a millimeter wave chip is provided.

[0008] A method for SOC packaging of a millimeter wave chip, characterized by comprising:

[0009] S1 determines the operating temperature reliability and optional package sizes of the millimeter wave chip in different package sizes based on simulation data of the operating temperature of the millimeter wave chip under preset operating conditions within a matching operating frequency range;

[0010] S2 adopts the millimeter wave chip of the optional package size as an alternative package solution, determines the performance data of the alternative simulation solution in different dimensions at different matching operating frequencies within the matching operating frequency range through simulation data of different alternative package solutions, and performs operation reliability and available package solutions at different matching operating frequencies based on the performance data;

[0011] S3: Obtaining the operating temperature reliability of the package sizes corresponding to different available package solutions, and determining the comprehensive operating reliability of the available package solutions and alternative package solutions based on the operating reliability of the available package solutions at different matching operating frequencies;

[0012] S4 obtains the package chip density and package cost of different alternative package solutions, determines the optimal package solution based on the comprehensive working reliability of the alternative package solutions, and uses the optimal package solution to package the millimeter wave chip.

[0013] The beneficial effects of the present invention are:

[0014] 1. Based on the simulation data of the operating temperature of the millimeter wave chip under preset operating conditions within the matching operating frequency range, the operating temperature reliability and optional package sizes of the millimeter wave chip in different package sizes are determined, thereby realizing the screening of package sizes with reliable operating temperatures from the perspective of the simulation data of the operating temperature, and avoiding the technical problem that the operating reliability of the packaging processing results cannot meet the requirements due to the use of package sizes with unreliable operating temperatures.

[0015] 2. The optimal packaging solution is determined based on the package chip density, package cost, and comprehensive working reliability of the alternative packaging solutions, thereby realizing the screening of the optimal packaging solution from multiple angles. It not only considers the working reliability of different alternative packaging solutions, but also ensures the reliability and safety of the packaging process by further combining the differences in the reliability of the packaging process caused by the package chip density and the differences in the packaging cost.

[0016] A further technical solution is that the matching operating frequency range is determined according to the type of the millimeter wave chip.

[0017] A further technical solution is that the preset operating conditions include a preset operating time and a preset working state.

[0018] A further technical solution is that the preset working state is a continuous working state.

[0019] A further technical solution is that the method for determining the operating temperature reliability of the millimeter wave chip in the package size is:

[0020] A millimeter-wave chip of the package size is used as a packaged millimeter-wave chip, and based on the simulation data of the operating temperature, the operating temperature of the packaged millimeter-wave chip at different moments within a preset operating time and temperature variation data within different divided time periods within the preset operating time are determined;

[0021] Determine the temperature reliability evaluation amount in different divided time periods based on the temperature variation data and the operating temperature in different divided time periods;

[0022] The operating temperature reliability of the millimeter wave chip in the package size is determined by temperature reliability evaluation amounts in different divided time periods.

[0023] A further technical solution is that the operating temperature reliability of the millimeter wave chip in the package size ranges from 0 to 1, wherein when the operating temperature reliability of the millimeter wave chip in the package size is within a preset temperature reliability range, the package size is determined to be an optional package size.

[0024] A further technical solution is that the method for determining the comprehensive working reliability of the available packaging solutions is:

[0025] Determining the operating reliability of the available packaging solutions based on the operating reliability of the different available packaging solutions at different matching operating frequencies;

[0026] The comprehensive working reliability of different available packaging solutions is determined by analyzing the operating temperature reliability and working reliability of the packaging sizes corresponding to different available packaging solutions, and the alternative packaging solutions are determined using the comprehensive working reliability.

[0027] A further technical solution is that when the comprehensive working reliability of the available packaging solution meets the requirements, the available packaging solution is determined to be an alternative packaging solution.

[0028] A further technical solution is that the method for determining the optimal packaging solution is:

[0029] Determine the comprehensive evaluation amount of different alternative packaging solutions based on the weights of package chip density, package cost and comprehensive working reliability of different alternative packaging solutions;

[0030] The optimal packaging solution is determined through the comprehensive evaluation.

[0031] On the other hand, the present invention provides a computer system comprising: a memory and a processor in communication connection, and a computer program stored in the memory and capable of running on the processor, characterized in that: when the processor runs the computer program, it executes the above-mentioned SOC packaging processing method of a millimeter wave chip.

[0032] Other features and advantages will be described in the following description, and in part will become apparent from the description, or understood by practicing the invention. The purpose and other advantages of the invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings.

[0035] Figure 1 The present invention is a flow chart of a SOC packaging processing method for a millimeter wave chip;

[0036] Figure 2 A flow chart of a method for determining the operating temperature reliability of a millimeter wave chip in a package size;

[0037] Figure 3 It is a flow chart of a method for determining the operational reliability at a matching operating frequency. DETAILED DESCRIPTION

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed description will be omitted.

[0039] The terms "a", "an", "the", and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0040] Example 1

[0041] To solve the above problems, according to one aspect of the present invention, Figure 1According to one aspect of the present invention, a SOC packaging method for a millimeter wave chip is provided, which is characterized by specifically comprising:

[0042] S1 determines the operating temperature reliability and optional package sizes of the millimeter wave chip in different package sizes based on simulation data of the operating temperature of the millimeter wave chip under preset operating conditions within a matching operating frequency range;

[0043] Furthermore, the matching operating frequency range is determined according to the type of the millimeter wave chip.

[0044] Specifically, the preset operating conditions include a preset operating time and a preset working state.

[0045] It should be noted that the preset working state is a continuous working state.

[0046] Specifically, such as Figure 2 As shown, the method for determining the operating temperature reliability of the millimeter wave chip in the package size is:

[0047] A millimeter-wave chip of the package size is used as a packaged millimeter-wave chip, and based on the simulation data of the operating temperature, the operating temperature of the packaged millimeter-wave chip at different moments within a preset operating time and temperature variation data within different divided time periods within the preset operating time are determined;

[0048] Determine the temperature reliability evaluation amount in different divided time periods based on the temperature variation data and the operating temperature in different divided time periods;

[0049] The operating temperature reliability of the millimeter wave chip in the package size is determined by temperature reliability evaluation amounts in different divided time periods.

[0050] Furthermore, the operating temperature reliability of the millimeter wave chip in the package size has a value range between 0 and 1, wherein when the operating temperature reliability of the millimeter wave chip in the package size is within a preset temperature reliability range, the package size is determined to be an optional package size.

[0051] In another embodiment, the method for determining the operating temperature reliability of the millimeter wave chip in the package size is:

[0052] Using a millimeter-wave chip of the package size as a packaged millimeter-wave chip, determining the operating temperature of the packaged millimeter-wave chip at different times within a preset operating time based on the simulation data of the operating temperature, and judging whether the number of times when the operating temperature does not meet the requirement meets the requirement; if so, proceeding to the next step; if not, determining that the package size does not belong to the optional package size;

[0053] Determining, based on the temperature change data in different divided time periods within the preset operating time, moments when the temperature change rate does not meet the requirements, and taking them as moments of abnormal temperature change, determining whether the number of moments of abnormal temperature change meets the requirements, if so, proceeding to the next step, if not, determining that the package size does not belong to the optional package size;

[0054] The moment when the temperature does not meet the requirements is regarded as the abnormal temperature moment, and the divided time periods when the temperature changes abnormally and the abnormal temperature moments are regarded as the screening divided time periods, and whether the number of the screening divided time periods meets the requirements is determined. If so, the next step is performed; if not, it is determined that the package size does not belong to the optional package size;

[0055] Determine temperature anomaly evaluation values ​​for different screening time periods based on the number of abnormal temperature moments and operating temperatures, the number of abnormal temperature change moments, and the temperature change amounts in different screening time periods, and determine whether there is a screening time period in which the temperature anomaly evaluation value does not meet the requirements. If so, determine that the package size does not belong to the optional package size; if not, proceed to the next step;

[0056] Based on the temperature change data in different divided time periods and the operating temperature at different times, the temperature reliability evaluation amount in different divided time periods is determined, and the operating temperature reliability of the millimeter wave chip in the packaging size is determined by the temperature reliability evaluation amount in different divided time periods and the temperature anomaly evaluation value of different screening divided time periods.

[0057] In another embodiment, the method for determining the operating temperature reliability of the millimeter wave chip in the package size is:

[0058] A millimeter-wave chip of the package size is used as a packaged millimeter-wave chip, and the operating temperature of the packaged millimeter-wave chip at different times within a preset operating time is determined based on the simulation data of the operating temperature, and whether the final operating temperature of the packaged millimeter-wave chip meets the requirement is judged; if so, the package size is determined to be an optional package size, and the operating temperature reliability of the package size is determined based on the average value of the operating temperature; if not, proceed to the next step;

[0059] The moment when the temperature does not meet the requirement is regarded as the abnormal temperature moment, and the earliest abnormal temperature moment is regarded as the starting abnormal moment, and whether the starting abnormal moment meets the requirement is determined. If so, the next step is performed; if not, it is determined that the package size does not belong to the optional package size;

[0060] Determine, based on the temperature change data in different divided time periods within the preset operating time, the time when the temperature change rate does not meet the requirements, and regard it as the temperature change abnormal time, the time when the temperature does not meet the requirements as the abnormal temperature time, and the divided time period with the abnormal temperature change time and the abnormal temperature time as the screening divided time period;

[0061] Determine temperature anomaly evaluation values ​​for different screening periods based on the number of abnormal temperature moments and operating temperatures, the number of abnormal temperature change moments, and the temperature change amounts in different screening periods, and determine a comprehensive temperature anomaly value in combination with the number of screening periods to determine whether the comprehensive temperature anomaly value meets the requirements. If so, proceed to the next step; if not, determine that the package size does not belong to the optional package size.

[0062] Based on the temperature change data in different divided time periods and the operating temperature at different times, the temperature reliability evaluation amount in different divided time periods is determined, and the operating temperature reliability of the millimeter wave chip in the packaging size is determined by the temperature reliability evaluation amount in different divided time periods and the comprehensive temperature anomaly value.

[0063] S2 adopts the millimeter wave chip of the optional package size as an alternative package solution, determines the performance data of the alternative simulation solution in different dimensions at different matching operating frequencies within the matching operating frequency range through simulation data of different alternative package solutions, and performs operation reliability and available package solutions at different matching operating frequencies based on the performance data;

[0064] Furthermore, the performance data in different dimensions include signal gain, directivity, return loss, and signal matching.

[0065] Specifically, such as Figure 3 As shown, the method for determining the operating reliability under the matching operating frequency is:

[0066] Determine the performance deviation amount in different dimensions based on the performance data of different dimensions and the preset performance threshold;

[0067] The basic weight values ​​of different dimensions are determined by the types of different dimensions, and the operating reliability under the matching working frequency is determined in combination with the performance deviation amounts of different dimensions.

[0068] Furthermore, the basic weight value of the dimension is used to determine the degree of influence of the performance data of the dimension on the operation stability of the millimeter wave chip.

[0069] Specifically, when the operating reliability of the alternative packaging solution at different matching operating frequencies meets the requirements, the alternative packaging solution is determined to be an available packaging solution.

[0070] In another embodiment, the method for determining the operating reliability at the matching operating frequency is:

[0071] Determine the performance deviation amount of different dimensions based on the performance data of different dimensions and the preset performance threshold, and divide the dimensions into performance deviation dimensions and performance reliability dimensions according to the performance deviation amount;

[0072] Determine the running performance deviation amount of the performance deviation dimension according to different performance deviation dimension types, performance deviation amounts, and the number of performance deviation dimensions; and determine the running performance reliability of the performance reliability dimension according to different performance reliability dimension types, performance deviation amounts, and the number of performance reliability dimensions;

[0073] The operation reliability under the matching operating frequency is determined by the operation performance deviation amount of the performance deviation dimension and the operation performance reliability of the performance reliability dimension.

[0074] In another embodiment, the method for determining the operating reliability at the matching operating frequency is:

[0075] Determine the performance deviation of different dimensions based on the performance data of different dimensions and the preset performance threshold, and judge whether there is a dimension whose performance deviation does not meet the requirements. If so, determine that the alternative packaging solution is not an available packaging solution; if not, proceed to the next step;

[0076] Dividing the dimension into a performance deviation dimension and a performance reliability dimension according to the performance deviation amount, determining whether the number of the performance deviation dimensions meets the requirement, and if so, proceeding to the next step; if not, determining that the alternative packaging solution does not belong to the available packaging solution;

[0077] Determine the basic weight values ​​of different dimensions by the types of different dimensions, and judge whether the sum of the basic weight values ​​of the performance deviation dimension meets the requirements. If so, proceed to the next step; if not, determine that the alternative packaging solution does not belong to the available packaging solution;

[0078] Determine the running performance deviation amount of the performance deviation dimension according to the type of different performance deviation dimensions, the performance deviation amount, and the number of performance deviation dimensions, and judge whether the running performance deviation amount of the performance deviation dimension meets the requirements. If so, proceed to the next step; if not, determine that the alternative packaging solution does not belong to the available packaging solution;

[0079] The operating performance reliability of the performance reliability dimension is determined by the types of different performance reliability dimensions, the performance deviation amounts, and the number of performance reliability dimensions. The operating reliability under the matching operating frequency is determined by the operating performance deviation amounts of the performance deviation dimension and the operating performance reliability of the performance reliability dimension.

[0080] In another embodiment, the method for determining the operating reliability at the matching operating frequency is:

[0081] Determine the performance deviation of each dimension based on the performance data of each dimension and a preset performance threshold, determine the basic weight value of each dimension based on the type of each dimension, determine the corrected deviation of each dimension based on the basic weight value and the performance deviation, and determine whether there is a dimension whose corrected deviation does not meet the requirements. If so, determine that the alternative packaging solution is not an available packaging solution; if not, proceed to the next step;

[0082] Dividing the dimension into a performance deviation dimension and a performance reliability dimension by using the corrected deviation amount, determining whether a preset dimension exists in the performance deviation dimension, and if so, determining that the alternative packaging solution does not belong to the available packaging solution; if not, proceeding to the next step;

[0083] Determine the running performance deviation amount of the performance deviation dimension according to the type of different performance deviation dimensions, the performance deviation amount, and the number of performance deviation dimensions, and judge whether the running performance deviation amount of the performance deviation dimension meets the requirements. If so, proceed to the next step; if not, determine that the alternative packaging solution does not belong to the available packaging solution;

[0084] The operating performance reliability of the performance reliability dimension is determined by the types of different performance reliability dimensions, the performance deviation amounts, and the number of performance reliability dimensions. The operating reliability under the matching operating frequency is determined by the operating performance deviation amounts of the performance deviation dimension and the operating performance reliability of the performance reliability dimension.

[0085] It should be noted that the basic weight value of the dimension is used to determine the degree of influence of the performance data of the dimension on the operation stability of the millimeter wave chip.

[0086] Specifically, the preset dimensions include return loss and signal matching.

[0087] S3: Obtaining the operating temperature reliability of the package sizes corresponding to different available package solutions, and determining the comprehensive operating reliability of the available package solutions and alternative package solutions based on the operating reliability of the available package solutions at different matching operating frequencies;

[0088] Specifically, the method for determining the comprehensive working reliability of the available packaging solutions is:

[0089] Determining the operating reliability of the available packaging solutions based on the operating reliability of the different available packaging solutions at different matching operating frequencies;

[0090] The comprehensive working reliability of different available packaging solutions is determined by analyzing the operating temperature reliability and working reliability of the packaging sizes corresponding to different available packaging solutions, and the alternative packaging solutions are determined using the comprehensive working reliability.

[0091] Furthermore, when the comprehensive working reliability of the available packaging solution meets the requirement, the available packaging solution is determined to be an alternative packaging solution.

[0092] In another embodiment, the method for determining the comprehensive operational reliability of the available packaging solutions is:

[0093] S31 obtains the number of available packaging solutions, determines whether the number of available packaging solutions is greater than the preset number of solutions, and if so, proceeds to the next step, if not, proceeds to step S35;

[0094] S32: obtaining the operating temperature reliability of the package size corresponding to the available package solution, and determining whether the operating temperature reliability of the package size corresponding to the available package solution is less than the average value of the operating temperature reliabilities of different available package solutions; if so, determining that the available package solution does not belong to the alternative package solution; if not, proceeding to the next step;

[0095] S33: determining screening reliability thresholds at different matching operating frequencies based on the operational reliability of different available packaging solutions at different matching operating frequencies, and taking the matching operating frequencies in the available packaging solutions whose operational reliability is less than the screening reliability threshold as deviation operating frequencies, and determining whether the number of deviation operating frequencies of the available packaging solutions meets the requirement; if not, determining that the available packaging solution does not belong to the alternative packaging solution; if so, proceeding to the next step;

[0096] S34: determining a comprehensive deviation of the reliability of the available packaging solution based on the number of deviation operating frequencies of the available packaging solution and the deviations of the operating reliability at different deviation operating frequencies from the screening reliability threshold, and judging whether the comprehensive deviation of the reliability of the available packaging solution meets the requirement; if not, determining that the available packaging solution does not belong to the alternative packaging solution; if so, proceeding to the next step;

[0097] S35 determines the working reliability of the available packaging solutions based on the operating reliability of the different available packaging solutions at different matching operating frequencies, determines the comprehensive working reliability of the different available packaging solutions through the operating temperature reliability and working reliability of the packaging sizes corresponding to the different available packaging solutions, and determines the alternative packaging solutions using the comprehensive working reliability.

[0098] S4 obtains the package chip density and package cost of different alternative package solutions, determines the optimal package solution based on the comprehensive working reliability of the alternative package solutions, and uses the optimal package solution to package the millimeter wave chip.

[0099] Specifically, the method for determining the optimal packaging solution is:

[0100] Determine the comprehensive evaluation amount of different alternative packaging solutions based on the weights of package chip density, package cost and comprehensive working reliability of different alternative packaging solutions;

[0101] The optimal packaging solution is determined through the comprehensive evaluation.

[0102] Example 2

[0103] On the other hand, the present invention provides a computer system comprising: a memory and a processor in communication connection, and a computer program stored in the memory and capable of running on the processor, characterized in that: when the processor runs the computer program, it executes the above-mentioned SOC packaging processing method of a millimeter wave chip.

[0104] Through the above embodiments, the present application achieves the following technical effects:

[0105] 1. Based on the simulation data of the operating temperature of the millimeter wave chip under preset operating conditions within the matching operating frequency range, the operating temperature reliability and optional package sizes of the millimeter wave chip in different package sizes are determined, thereby realizing the screening of package sizes with reliable operating temperatures from the perspective of the simulation data of the operating temperature, and avoiding the technical problem that the operating reliability of the packaging processing results cannot meet the requirements due to the use of package sizes with unreliable operating temperatures.

[0106] 2. The optimal packaging solution is determined based on the package chip density, package cost, and comprehensive working reliability of the alternative packaging solutions, thereby realizing the screening of the optimal packaging solution from multiple angles. It not only considers the working reliability of different alternative packaging solutions, but also ensures the reliability and safety of the packaging process by further combining the differences in the reliability of the packaging process caused by the package chip density and the differences in the packaging cost.

[0107] The various embodiments in this specification are described in a progressive manner. Similar portions between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the device, apparatus, and non-volatile computer storage medium embodiments are generally similar to the method embodiments, so their descriptions are relatively simplified. For relevant details, refer to the descriptions of the method embodiments.

[0108] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or the sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0109] The foregoing description is merely one or more embodiments of this specification and is not intended to limit this specification. It will be apparent to those skilled in the art that various modifications and variations may be made to one or more embodiments of this specification. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of one or more embodiments of this specification are intended to be within the scope of the claims of this specification.

Claims

1. A SOC packaging method for a millimeter wave chip, characterized in that: Specifically include: Determining the operating temperature reliability and optional package sizes of the millimeter wave chip in different package sizes based on simulation data of the operating temperature of the millimeter wave chip under preset operating conditions within a matching operating frequency range; Using the millimeter-wave chip with the optional package size as an alternative simulation solution, determining performance data of the alternative simulation solution in different dimensions at different matching operating frequencies within the matching operating frequency range through simulation data of different alternative simulation solutions, and determining the operating reliability and available packaging solutions at different matching operating frequencies based on the performance data; Obtaining the operating temperature reliability of package sizes corresponding to different available package solutions, and determining the comprehensive operating reliability of the available package solutions and alternative package solutions based on the operating reliability of the available package solutions at different matching operating frequencies; Obtain the packaging chip density and packaging cost of different alternative packaging solutions, and determine the optimal packaging solution based on the comprehensive working reliability of the alternative packaging solutions, and use the optimal packaging solution to package the millimeter wave chip.

2. The SOC packaging method for a millimeter wave chip according to claim 1, wherein: The matching operating frequency range is determined according to the type of the millimeter wave chip.

3. The SOC packaging method for a millimeter wave chip according to claim 1, wherein: The preset operating conditions include a preset operating time and a preset working state.

4. The SOC packaging method for a millimeter wave chip according to claim 3, wherein: The preset working state is a continuous working state.

5. The SOC packaging method for a millimeter wave chip according to claim 1, wherein: The method for determining the operating temperature reliability of the millimeter wave chip in the package size is: A millimeter-wave chip of the package size is used as a packaged millimeter-wave chip, and based on the simulation data of the operating temperature, the operating temperature of the packaged millimeter-wave chip at different moments within a preset operating time and temperature variation data within different divided time periods within the preset operating time are determined; Determine the temperature reliability evaluation amount in different divided time periods based on the temperature variation data and the operating temperature in different divided time periods; The operating temperature reliability of the millimeter wave chip in the package size is determined by temperature reliability evaluation amounts in different divided time periods.

6. The SOC packaging method for a millimeter wave chip according to claim 1, wherein: The operating temperature reliability of the millimeter wave chip in the package size has a value range of 0 to 1, wherein when the operating temperature reliability of the millimeter wave chip in the package size is within a preset temperature reliability range, the package size is determined to be an optional package size.

7. The SOC packaging method for a millimeter wave chip according to claim 1, wherein: The performance data in different dimensions include signal gain, directivity, return loss, and signal matching.

8. The SOC packaging method for a millimeter wave chip according to claim 1, wherein: The method for determining the operating reliability under the matching operating frequency is: Determine the performance deviation amount in different dimensions based on the performance data of different dimensions and the preset performance threshold; The basic weight values ​​of different dimensions are determined by the types of different dimensions, and the operating reliability under the matching working frequency is determined in combination with the performance deviation amounts of different dimensions.

9. The SOC packaging method for a millimeter wave chip according to claim 8, wherein: The basic weight value of the dimension is used to determine the degree of influence of the performance data of the dimension on the operation stability of the millimeter wave chip.

10. A computer system comprising: A memory and a processor in communication connection, and a computer program stored in the memory and capable of running on the processor, characterized in that when the processor runs the computer program, it executes the SOC packaging processing method of a millimeter wave chip as described in any one of claims 1-9.

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