PCBA startup troubleshooting method and related equipment in a wet and cold environment

Abstract

The present application provides a method and related equipment for handling startup failures of a PCBA in a wet and cold environment, and relates to the field of PCBA technology. The method includes: obtaining a wet and cold environment characteristic value corresponding to the target working environment of the PCBA; determining a wet and cold environment level corresponding to the wet and cold environment characteristic value, wherein the wet and cold environment levels are respectively corresponding to wet and cold environment weights; performing weighted calculation on the standard thresholds of each startup failure according to the wet and cold environment weights to obtain an environment level threshold; determining a startup failure whose wet and cold environment characteristic value is greater than the environment level threshold as a target startup failure, and determining a target processing solution corresponding to the target startup failure; and optimizing the production process of the PCBA using the target processing solution. This method can more accurately determine whether a startup failure occurs, and thus can optimize the production process of the PCBA using a more accurate processing solution for startup failures.

Description

Technical Field

[0001] The present application relates to the field of PCBA technology, and in particular to a method for handling startup failures of a PCBA in a wet and cold environment and related equipment. Background Art

[0002] A printed circuit board assembly (PCBA) is a printed circuit board (PCB) with components mounted and connected to the printed circuit board (PCB), forming a complete circuit system. PCBAs are widely used and often face harsh operating environments in production and daily life. In particular, in humid and cold environments, the reliability and stability of PCBAs are reduced, making startup failures more likely. These failures can be caused by oxidation of component pins, moisture on the PCB, moisture on solder joints, component cracking, failure of leakage protection, degraded insulation performance, and accelerated component aging.

[0003] When determining that a PCBA will operate in a damp, cold environment, it's necessary to identify potential startup failures and implement targeted protective measures during production. Previously, the identification of startup failures often relied on manual judgment. This subjective nature of manual judgment, coupled with a lack of reliable theoretical guidance and analytical tools, resulted in inaccurate predictions of startup failures, making it difficult to implement accurate solutions for these problems. Summary of the Invention

[0004] The present application provides a method and related equipment for handling startup failures of a PCBA in a wet and cold environment. The method adjusts a standard startup failure threshold based on the wet and cold environment level corresponding to the wet and cold environment characteristic value of the PCBA's target operating environment and the wet and cold environment weight corresponding to the wet and cold environment level. This method obtains an environmental level threshold that better matches the actual future operating environment of the PCBA. This method enables more accurate judgment of whether a startup failure has occurred, and further optimizes the PCBA production process using a more accurate handling solution for startup failures.

[0005] In a first aspect, the present application provides a method for handling startup failures of a PCBA in a wet and cold environment, the method comprising:

[0006] Obtain the wet and cold environment characteristic values corresponding to the target working environment of the PCBA;

[0007] Determining a wet and cold environment level corresponding to the wet and cold environment characteristic value, wherein the wet and cold environment levels respectively correspond to wet and cold environment weights;

[0008] Perform weighted calculation on the standard threshold of each startup fault according to the wet and cold environment weight to obtain the environment level threshold;

[0009] Determine the startup fault whose wet and cold environment characteristic value is greater than the environment level threshold as a target startup fault, and determine a target processing solution corresponding to the target startup fault;

[0010] The target processing solution is used to optimize the production process of the PCBA.

[0011] By adopting the above technical solution, the standard threshold value of the startup failure is adjusted according to the wet and cold environment level of the wet and cold environment characteristic value corresponding to the target working environment of the PCBA, and then according to the wet and cold environment weight corresponding to the wet and cold environment level, so as to obtain an environmental level threshold that is more in line with the actual working environment of the PCBA in the future. This can more accurately determine whether a startup failure occurs, and thus can optimize the PCBA production process by using a more accurate processing solution for startup failures.

[0012] Optionally, the wet and cold environment characteristic value includes a minimum temperature and humidity value and a maximum temperature and humidity change value. The step of obtaining the wet and cold environment characteristic corresponding to the target working environment of the PCBA includes:

[0013] Obtain historical regional climate information of the target working environment of the PCBA;

[0014] Extracting the daily minimum temperature and humidity values and the maximum temperature and humidity changes from the historical regional climate information;

[0015] The daily minimum temperature and humidity values and the maximum temperature and humidity changes are obtained to obtain the maximum characteristic value of the wet and cold environment and the characteristic value of the wet and cold environment mutation.

[0016] By adopting the above technical solution, the climate and environmental conditions of the PCBA's target operating environment can be determined by obtaining historical regional climate information for the target PCBA's operating environment. The minimum and maximum temperature and humidity variations in this historical regional climate information are then extracted. Daily statistics are then calculated to obtain the maximum characteristic value and sudden change characteristic value for the wet and cold environment in the region. The maximum characteristic value for the wet and cold environment reflects the extreme temperature and humidity conditions in the region, while the sudden change characteristic value reflects the drastic temperature and humidity fluctuations in the region. These two characteristic values provide a comprehensive assessment of the wet and cold degree of the target operating environment, providing an important reference for subsequent assessments of the impact of different levels of wet and cold environments, making startup fault diagnosis and environmental adaptability optimization more accurate and effective.

[0017] Optionally, determining the wet and cold environment level corresponding to the wet and cold environment characteristic value includes:

[0018] Dividing the plurality of temperature intervals and the plurality of humidity intervals, wherein the plurality of temperature intervals and the plurality of humidity intervals respectively correspond to a plurality of temperature scores and a plurality of humidity scores;

[0019] Determining a target temperature score and a target humidity score corresponding to the wet and cold environment characteristic value according to the target temperature interval and the target humidity interval in which the wet and cold environment characteristic value lies;

[0020] Normalizing the target temperature score and the target humidity score to obtain a wet and cold environment score;

[0021] The wet and cold environment level corresponding to the wet and cold environment characteristic value is determined according to the score range of the wet and cold environment score.

[0022] By adopting the above technical solution and converting the segmentation intervals and scores, a clear correspondence can be established between the characteristic values of the wet and cold environment and the environmental level, providing support for subsequent steps such as determining weights according to the environmental level and calculating new fault thresholds.

[0023] Optionally, after determining the wet and cold environment level corresponding to the wet and cold environment characteristic value, the method further includes:

[0024] Obtaining the standard operating temperature and standard operating humidity of the PCBA;

[0025] The wet and cold environment weights corresponding to the wet and cold environment levels are determined according to the difference between the intermediate temperature of each wet and cold environment level and the standard operating temperature, and the difference between the intermediate humidity of each wet and cold environment level and the standard operating humidity.

[0026] By adopting the above technical solution and determining the weight according to the actual degree of deviation between the environment and the standard working conditions, the weight value of the wet and cold environment level can be made more consistent with the impact of the actual environment on the PCBA, thereby calculating a more accurate environment level threshold for subsequent optimization processing.

[0027] Optionally, the use of the target processing solution to optimize the production process of the PCBA includes:

[0028] If there are multiple target startup faults, respectively determine multiple fault locations of the multiple target startup faults in the PCBA;

[0029] Sorting the multiple target processing solutions corresponding to the multiple target startup faults in descending order of the number of overlaps including the fault location to obtain an implementation order for the multiple target processing solutions;

[0030] According to the implementation order, the production process of the PCBA is optimized using the multiple target processing solutions.

[0031] By employing this technical solution, multiple target solutions are ranked based on the amount of overlap, with solutions with greater overlap receiving higher priority. Finally, the ranked solutions are implemented in the order in which they are applied to optimize the production process. By determining the relationship between fault locations, possible common causes can be identified to address the most impactful issues. Implementing solutions based on the priority of common causes improves optimization efficiency and effectiveness, further enhancing the reliability of PCBAs in this environment.

[0032] Optionally, after optimizing the production process of the PCBA using the target processing solution, the method further includes:

[0033] Obtaining a feedback failure rate of the PCBA under a simulated working environment after optimization using the current target processing solution;

[0034] Determining whether the feedback failure rate is lower than a failure rate threshold;

[0035] If the feedback failure rate is lower than the failure rate threshold or higher than or equal to the failure rate threshold, the production process of the PCBA is optimized using the multiple target processing solutions according to the implementation order.

[0036] By adopting the above technical solution, the next highest priority solution is selected based on the previously determined implementation order of the solutions. This new solution is then used to continue optimizing the production process, and the optimization verification process is repeated until the PCBA feedback failure rate is below the required threshold. This closed-loop verification of the optimization results makes the optimization of the PCBA production process more accurate and effective, ensuring that the optimized PCBA can adapt to the target operating environment and meet reliability requirements.

[0037] Optionally, after determining whether the feedback failure rate is lower than a failure rate threshold, the method further includes:

[0038] If the feedback failure rate is lower than the failure rate threshold or higher than or equal to the failure rate threshold, then removing the target processing solutions of the same category as the current target processing solution from the implementation order to obtain the current implementation order;

[0039] According to the current implementation order, the production process of the PCBA is optimized using the multiple target processing solutions.

[0040] By adopting the above technical solutions, the highest-priority target solution is selected based on the adjusted current implementation order, and this new, differentiated solution is used to further optimize the PCBA production process. By removing ineffective solutions within the same category and adjusting the implementation order, the PCBA production process optimization becomes more targeted. The new, differentiated solution is likely to improve startup failures in the current environment, thereby enhancing the reliability and environmental adaptability of the PCBA.

[0041] In a second aspect, the present application provides a device for handling startup failures of a PCBA in a wet and cold environment, the device comprising:

[0042] Environmental feature acquisition module, used to obtain the wet and cold environment feature value corresponding to the target working environment of the PCBA;

[0043] a level determination module, configured to determine a wet and cold environment level corresponding to the wet and cold environment characteristic value, wherein the wet and cold environment levels are respectively associated with wet and cold environment weights;

[0044] A threshold calculation module, configured to perform weighted calculation on the standard threshold of each startup fault according to the wet and cold environment weight to obtain an environment level threshold;

[0045] a processing solution determination module, configured to determine the startup fault whose wet and cold environment characteristic value is greater than the environment level threshold as a target startup fault, and determine a target processing solution corresponding to the target startup fault;

[0046] An optimization module is used to optimize the production process of the PCBA using the target processing solution.

[0047] In a third aspect, the present application provides a computer storage medium, wherein the computer storage medium stores a plurality of instructions, wherein the instructions are suitable for being loaded by a processor and executing any one of the above methods.

[0048] In a fourth aspect, the present application provides an electronic device comprising a processor, a memory and a transceiver, wherein the memory is used to store instructions, the transceiver is used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device performs any one of the above methods.

[0049] In summary, the beneficial effects brought about by the technical solution of this application include:

[0050] According to the wet and cold environment level corresponding to the wet and cold environment characteristic value of the PCBA's target working environment, and then according to the wet and cold environment weight corresponding to the wet and cold environment level, the standard threshold of the startup failure is adjusted to obtain an environmental level threshold that is more in line with the actual working environment of the PCBA in the future. This can more accurately determine whether a startup failure occurs, and then use a more accurate processing solution for startup failures in the PCBA production process for optimization. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 This is a flow chart of a method for handling startup failures of a PCBA in a wet and cold environment according to an embodiment of the present application;

[0052] Figure 2 This is a structural diagram of a device for handling startup failures of a PCBA in a wet and cold environment according to an embodiment of the present application;

[0053] Figure 3 This is a structural diagram of an electronic device provided in an embodiment of the present application.

[0054] Explanation of the accompanying drawings: 201, environmental feature acquisition module; 202, level determination module; 203, threshold calculation module; 204, processing solution determination module; 205, optimization module; 300, electronic device; 301, processor; 302, communication bus; 303, user interface; 304, network interface; 305, memory. DETAILED DESCRIPTION

[0055] In order to enable people skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0056] In the description of the embodiments of this application, words such as "exemplary," "for example," or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary," "for example," or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary," "for example," or "for example" is intended to present the relevant concepts in a concrete manner.

[0057] In the description of the embodiments of the present application, the term "multiple" means two or more. For example, multiple systems refer to two or more systems, and multiple screen terminals refer to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0058] See Figure 1 The following is a flow chart illustrating a method for handling startup failures of a PCBA in a wet and cold environment, provided in an embodiment of the present application. This method can be implemented using a computer program, a single-chip microcontroller, or a von Neumann-based PCBA startup failure handling device in a wet and cold environment. The computer program can be integrated into an application or run as a standalone tool. The specific steps of the method for handling startup failures of a PCBA in a wet and cold environment are described in detail below.

[0059] Step S101: obtaining a wet and cold environment characteristic value corresponding to the target working environment of the PCBA.

[0060] In this application, the target operating environment refers to the actual operating environment that the PCBA is expected to operate in. In the embodiments of this application, the target operating environment can be understood as the use scenario of the PCBA, such as an industrial humidity sensor scenario, a communication device scenario in a cold region, etc.

[0061] The wet and cold environment characteristic value refers to a specific parameter that reflects the wet and cold environment conditions. In the present embodiment, the wet and cold environment characteristic value can be understood as a parameter of temperature and humidity, used to assess the severity of the wet and cold environment faced by the PCBA. Obtaining accurate wet and cold environment characteristic values is fundamental to assessing possible startup failures of the PCBA in such an environment and developing targeted solutions.

[0062] To obtain the wet and cold environment characteristic values corresponding to the PCBA's target operating environment, for example, this information can be directly obtained from PCBA orders or customer specifications. When a PCBA order is received, it will specify the PCBA's intended operating environment, such as an industrial park or a specific city. With this information, the PCBA's target operating location can be determined, and the wet and cold environment characteristics can be determined based on that location's meteorological data.

[0063] In an optional embodiment, the wet and cold environment characteristic value includes the minimum temperature and humidity value and the maximum temperature and humidity change value. Obtaining the wet and cold environment characteristic corresponding to the target working environment of the PCBA includes:

[0064] Obtain historical regional climate information for the PCBA's target work environment;

[0065] Extract the daily minimum temperature and humidity values and the maximum temperature and humidity changes from historical regional climate information;

[0066] Obtain the daily minimum temperature and humidity values and the maximum temperature and humidity changes to obtain the maximum characteristic value of the wet and cold environment and the characteristic value of the wet and cold environment mutation.

[0067] In this embodiment, the wet and cold environment characteristic values corresponding to the PCBA target working environment are obtained to evaluate the severity of the specific wet and cold environment faced by the PCBA. The wet and cold environment characteristic values include the minimum temperature and humidity values and the maximum temperature and humidity change values.

[0068] The specific acquisition method is as follows: First, based on the identified PCBA target work environment area, extract 20 years of historical regional climate information from the meteorological bureau database. Then, analyze and extract the daily minimum temperature and humidity combination values from the historical data, that is, the lowest temperature and humidity values reached simultaneously in a day. Next, analyze and extract the daily maximum temperature and humidity change values from the historical data, that is, the value with the largest temperature or humidity change in a day. Finally, the lowest value among all daily minimum temperature and humidity values is selected as the maximum characteristic value of the wet and cold environment, and the maximum value among all daily maximum temperature and humidity changes is selected as the sudden change characteristic value of the wet and cold environment.

[0069] Step S102: Determine the wet and cold environment level corresponding to the wet and cold environment characteristic value, and the wet and cold environment level corresponds to a wet and cold environment weight.

[0070] The wet and cold environment grade refers to the rating of the severity of the wet and cold environment. In the embodiment of the present application, the wet and cold environment grade can be understood as a qualitative classification of the wet and cold environment based on temperature and humidity parameters, which is used to judge the degree of impact of the wet and cold environment on the reliability of the PCBA.

[0071] Specifically, this application pre-sets several wet and cold environment levels, each corresponding to a specific temperature and humidity range, and assigns different level weights. The lower the temperature and the higher the humidity, the larger the level weight, indicating a more severe environment and a greater impact on PCBA reliability. After determining the temperature and humidity parameters of the PCBA's target operating environment, the temperature and humidity range it falls into is determined based on the parameter values, and the corresponding preset wet and cold environment level can be obtained.

[0072] The wet and cold environment weight refers to a numerical weight corresponding to the wet and cold environment level. In the embodiment of the present application, the wet and cold environment weight can be understood as a differentiated weight value for different wet and cold environment levels when evaluating the wet and cold environment faced by the PCBA, which is used in subsequent calculations to determine the environmental impact of each startup fault type.

[0073] Specifically, when presetting the wet and cold environment levels, each level is assigned a wet and cold environment weight. Higher levels indicate harsher environments and are associated with larger weights. Once the wet and cold environment level to which the PCBA's target operating environment belongs is determined, the corresponding weight is calculated. This wet and cold environment weight is then used to weight the standard thresholds for each possible startup failure, resulting in a new threshold for environmental adaptation.

[0074] The purpose of determining the wet and cold environment level corresponding to the wet and cold environment characteristic value is to evaluate the severity of the wet and cold environment represented by the obtained wet and cold environment characteristic value.

[0075] First, multiple damp and cold environment levels are preset, each corresponding to a temperature range and humidity range. Each level is assigned a weight, with a higher weight indicating a more severe damp and cold environment. Next, based on the temperature and humidity parameters in the damp and cold environment characteristic values obtained previously, the temperature and humidity levels corresponding to the characteristic values are determined. The average or maximum value of the corresponding weights is then taken as the final weight for the overall damp and cold environment level.

[0076] In an optional embodiment, multiple temperature intervals and multiple humidity intervals are divided, and the multiple temperature intervals and the multiple humidity intervals respectively correspond to multiple temperature scores and multiple humidity scores; according to the target temperature interval and the target humidity interval where the wet and cold environment characteristic value is located, the target temperature score and the target humidity score corresponding to the wet and cold environment characteristic value are determined; the target temperature score and the target humidity score are normalized to obtain the wet and cold environment score; according to the score range where the wet and cold environment score is located, the wet and cold environment level corresponding to the wet and cold environment characteristic value is determined.

[0077] In order to further clarify the correspondence between the wet and cold environment characteristic value and the wet and cold environment level, the following technical means can be used: First, multiple temperature intervals and multiple humidity intervals are pre-divided, and each interval is assigned a temperature score and humidity score. The larger the value, the more severe the environmental conditions. Then, based on the temperature and humidity parameter values in the obtained wet and cold environment characteristic value, determine which temperature interval and humidity interval they fall into, so as to determine the corresponding target temperature score and target humidity score. The target temperature score and target humidity score are then normalized, for example, mapped to the range of 0-1, to obtain a single wet and cold environment score corresponding to the wet and cold environment characteristic value. Finally, based on the numerical range of this wet and cold environment score, determine which preset wet and cold environment level it corresponds to.

[0078] The above technical means can establish a clear correspondence between the characteristic values of the wet and cold environment and the environmental level. Through the intermediate conversion of scores, the two parameters of temperature and humidity are mapped to a comprehensive evaluation score, and then the environmental level to which they belong is determined.

[0079] In an optional embodiment, the standard operating temperature and standard operating humidity of the PCBA are obtained; and the wet and cold environment weights corresponding to the wet and cold environment levels are determined based on the difference between the intermediate temperature of each wet and cold environment level and the standard operating temperature, as well as the difference between the intermediate humidity of each wet and cold environment level and the standard operating humidity.

[0080] The wet and cold environment weight refers to a numerical weight corresponding to the wet and cold environment level. In the embodiments of this application, the wet and cold environment weight can be understood as a differentiated weight value for different wet and cold environment levels when assessing the wet and cold environment faced by the PCBA, which is used in subsequent calculations to determine the probability and severity of each startup fault type in that specific environment.

[0081] Specifically, each preset cold and wet environment level is assigned a specific cold and wet environment weight. Higher levels correspond to larger weights, indicating a more severe impact on the PCBA. Once the cold and wet environment level to which the PCBA's target operating environment belongs is determined, the corresponding weight is calculated. This cold and wet environment weight is then used to weight indicators such as the standard probability or standard impact of various possible startup failures, resulting in new indicator values for that specific environment. This allows assessment of the risk and severity of different types of failures in that environment.

[0082] Obtain the PCBA's standard operating temperature and standard operating humidity—these are the reference temperature and humidity conditions for the PCBA's normal operation. Calculate the median temperature and humidity for each preset damp and cold environment level, i.e., the median value of the temperature and humidity range for that level. Calculate the difference between the median temperature and the standard operating temperature, and the difference between the median humidity and the standard operating humidity, for each environmental level. These two differences represent the degree of deviation from the PCBA's standard operating conditions. Based on the magnitude of these differences, determine the damp and cold environment weight corresponding to that environmental level. The greater the difference, the more the environment deviates from standard operating conditions, and the greater the weight should be. This technical approach allows for a more accurate assessment of the severity of each damp and cold environment level based on the actual degree of deviation from the PCBA's standard operating conditions, thereby determining a reasonable weight.

[0083] Step S103: performing weighted calculation on the standard thresholds of each startup fault according to the wet and cold environment weights to obtain the environment level thresholds.

[0084] The environmental level threshold refers to the probability threshold for each startup failure in a specific wet and cold environment. In the embodiments of the present application, the environmental level threshold can be understood as a new probability threshold value obtained by weighting the standard threshold for each startup failure by the wet and cold environment weight. This is used to more accurately assess the risk of each startup failure occurring under these specific wet and cold environmental conditions.

[0085] Specifically, the environmental level threshold is a new threshold value that is obtained by adjusting the standard occurrence probability threshold of each startup fault based on the determined wet and cold environment level and corresponding weight of the PCBA's target operating environment. This new threshold value can better reflect the impact of the wet and cold environment on the probability of each fault.

[0086] The standard thresholds for each startup fault are weighted based on the wet and cold environment weights. The purpose of obtaining environmental level thresholds is to modify and more accurately determine the impact of different environments on the probability of fault occurrence. First, based on the wet and cold environment level corresponding to the PCBA's target operating environment, the wet and cold environment weight for that environment level is determined. Next, technical documentation is consulted to obtain the standard occurrence thresholds for each possible startup fault—that is, the probability thresholds for that fault under a standard environment. Next, the standard thresholds for each fault are multiplied by the corresponding wet and cold environment weight to perform a weighted adjustment. Finally, a weighted calculation results in the environmental level threshold for each startup fault under that specific wet and cold environment.

[0087] Step S104: determining the startup fault whose wet and cold environment characteristic value is greater than the environment level threshold as a target startup fault, and determining a target processing solution corresponding to the target startup fault.

[0088] The target treatment plan refers to the solution to the target startup failure. In the embodiments of this application, the target treatment plan can be understood as a treatment plan formulated for the high-risk startup failure in a specific wet and cold environment. These plans are used to implement these solutions during the PCBA design and production stages to reduce or eliminate the startup failure.

[0089] Specifically, the targeted treatment plans are based on the previously identified target startup failures—the types of failures that require key prevention and control in this wet and cold environment—and combine the mechanisms and influencing factors of these failures to develop technical solutions that can resolve or mitigate these failures. These targeted treatment plans are particularly important in this environmental condition, so they should be prioritized for implementation during the PCBA production process to improve PCBA reliability and environmental adaptability.

[0090] The startup failure with a characteristic value of a wet and cold environment greater than the environmental level threshold is identified as a target startup failure, and the corresponding target processing solution is determined. This is to find out the key startup failures with higher risks in this specific wet and cold environment and formulate targeted processing measures.

[0091] The specific method is as follows: First, the environmental level threshold for each startup fault in the wet and cold environment, obtained from the previous calculation, is determined. Then, combined with the obtained wet and cold characteristic value of the environment, a determination is made as to whether the wet and cold characteristic value is greater than the environmental level threshold for each startup fault. Finally, startup faults with wet and cold characteristic values greater than the environmental level threshold are identified as target startup faults, i.e., faults that have a high risk of occurring in this environment and require special prevention and control. At the same time, standard solutions are queried to determine the corresponding solutions and treatment measures for these target startup faults as target treatment solutions. In this way, the key fault types that require priority prevention and control in this specific wet and cold environment can be identified from the many possible startup faults, and targeted treatment solutions can be developed.

[0092] For example, for startup failures caused by moisture on the circuit board, excessive humidity can easily lead to moisture on the circuit board, causing circuit shorts or open circuits. The corresponding target treatment solution is to use a conformal coating target treatment solution. By spraying a layer of conformal coating on the surface of the PCBA, it prevents chemicals, moisture, and other contaminants from corroding the circuit board.

[0093] Step S105: Optimizing the production process of the PCBA using the target processing solution.

[0094] The purpose of optimizing the PCBA production process using a targeted processing solution is to improve the reliability and environmental adaptability of the PCBA by implementing solutions specifically for target startup failures.

[0095] The specific approach is as follows: First, based on the previously determined target faults and their corresponding targeted treatment plans, the PCBA design plan is updated and optimized, targeting optimization points related to the PCBA design phase. For optimization points related to the PCBA process, the relevant process flow is adjusted and improved, such as adding preheating and dehumidification steps. For optimization points related to PCBA testing, relevant test items are added. Finally, by applying the targeted treatment plan across design, process, and testing, the entire PCBA production process is comprehensively optimized and improved under these specific humid and cold environmental conditions.

[0096] In an optional embodiment, if there are multiple target startup failures, multiple fault locations of the multiple target startup failures in the PCBA are determined respectively; multiple target processing solutions corresponding to the multiple target startup failures are sorted in descending order of the number of overlaps including the fault locations to obtain an implementation order of the multiple target processing solutions; and according to the implementation order, the multiple target processing solutions are used to optimize the production process of the PCBA.

[0097] The fault location refers to the physical location of the component causing the startup failure. In this embodiment, the fault location can be understood as the specific area or component on the PCBA where the startup failure occurs. This is used to determine whether there is overlap in the locations of multiple target startup failures, thereby assessing whether there is a common cause.

[0098] Specifically, the fault location is a sensitive area or vulnerable component on the PCBA that causes startup failures, such as a poor connector contact area or a degraded energy storage component. Calculating the overlap between multiple fault locations can determine whether these faults share a common influencing factor or common cause. A high overlap suggests the possibility of modifying the common cause location to eliminate multiple startup failures.

[0099] The specific method is as follows: First, determine the specific fault locations of multiple target startup faults within the PCBA. Next, calculate the overlap between these fault locations. A greater overlap indicates a more concentrated location and a greater likelihood of a common cause problem. Next, sort the fault locations by the number of overlaps, from highest to lowest. Target solutions with greater overlap receive a higher priority. The resulting target solutions are then implemented in a prioritized order, with the highest-priority solution implemented first to address the most impactful common cause. Finally, based on this optimized implementation order, the PCBA production process is optimized using multiple target solutions.

[0100] In an optional embodiment, a feedback failure rate of the PCBA in a simulated working environment after optimization using the current target processing solution is obtained; a determination is made as to whether the feedback failure rate is lower than a failure rate threshold; and if the feedback failure rate is lower than the failure rate threshold but higher than or equal to the failure rate threshold, the PCBA production process is optimized using multiple target processing solutions in an implementation order.

[0101] A simulated operating environment refers to test conditions that mimic the actual operating environment of a PCBA. In the present application, a simulated operating environment can be understood as artificially simulating temperature and humidity conditions similar to the target operating environment of the PCBA in a test laboratory or factory. This is used to test the optimized PCBA and obtain performance feedback in an environment close to its actual use.

[0102] The feedback failure rate refers to the actual probability of failure of an optimized PCBA when tested in a simulated operating environment. In this embodiment, the feedback failure rate can be understood as the ratio of the actual number of startup failures occurring during tests of the optimized PCBA in a simulated target operating environment to the total number of tests. This is used to evaluate the actual effectiveness of the current PCBA production process optimization in preventing startup failures.

[0103] Specifically, the feedback failure rate is determined by setting up a simulation environment, testing the optimized PCBA within that environment, counting the number of startup failures, and calculating the ratio of each failure to the total number of tests, i.e., the occurrence rate. This allows us to determine the actual failure level of the optimized PCBA and determine whether the current production process optimization has achieved the desired results.

[0104] The purpose of adopting this optional solution is to verify the effectiveness of the optimization and re-optimize any substandard solutions. Specifically, after optimizing the PCBA production process using the current target solution, the actual test failure rate of the optimized PCBA, measured under a simulated target operating environment, is obtained. The actual failure rate reported back is then determined to be below a pre-set acceptable failure rate threshold. If the actual failure rate is higher than or equal to the threshold, indicating that the optimization effect is not yet significant, re-optimization is performed. Then, referring to the previously determined target solution implementation order, the next unimplemented target solution is selected from the sequence list and used to continue optimizing the PCBA production process. This verification and optimization process is repeated until the failure rate meets the required requirements.

[0105] In an optional embodiment, if the feedback indicates whether the failure rate is lower than the failure rate threshold or higher than or equal to the failure rate threshold, the target processing solutions of the same category as the current target processing solution in the implementation order are removed to obtain the current implementation order; and according to the current implementation order, the PCBA production process is optimized using multiple target processing solutions.

[0106] The specific implementation method is as follows: First, determine whether the optimization effect of the currently used target treatment solution meets the requirements, that is, whether the feedback failure rate is below the threshold. If the effect is not significant, then remove other solutions in the implementation order that share the same category as the current solution. For example, if the current solution is "adding a moisture barrier," then remove other structural optimization solutions such as "enhanced shielding." Then, after removing the duplicate categories, a new current implementation order is obtained. Next, according to the new order, continue to select the target treatment solution with the highest priority, and use this new solution to further optimize the PCBA production process.

[0107] The following are device embodiments of the present application, which can be used to implement the method embodiments of the present application. For details not disclosed in the device embodiments of the present application, please refer to the method embodiments of the present application.

[0108] See Figure 2 , which shows a schematic diagram of the structure of a device for handling startup failures of a PCBA in a wet and cold environment, provided by an exemplary embodiment of the present application. This device can be implemented as all or part of a device through software, hardware, or a combination of both. The device includes an environmental feature acquisition module 201, a level determination module 202, a threshold calculation module 203, a treatment solution determination module 204, and an optimization module 205.

[0109] The environmental characteristic acquisition module 201 is used to obtain the wet and cold environment characteristic value corresponding to the target working environment of the PCBA;

[0110] A level determination module 202 is used to determine the wet and cold environment level corresponding to the wet and cold environment characteristic value, and the wet and cold environment level corresponds to a wet and cold environment weight;

[0111] The threshold calculation module 203 is used to perform weighted calculation on the standard threshold of each startup fault according to the wet and cold environment weight to obtain the environment level threshold;

[0112] The processing solution determination module 204 is configured to determine a startup fault whose wet and cold environment characteristic value is greater than an environment level threshold as a target startup fault, and determine a target processing solution corresponding to the target startup fault;

[0113] The optimization module 205 is used to optimize the production process of the PCBA using the target processing solution.

[0114] Optionally, the environmental feature acquisition module 201 further includes an environmental feature extraction unit.

[0115] The environmental feature extraction unit is used to obtain the historical regional climate information of the target working environment of the PCBA; extract the daily minimum temperature and humidity values and the maximum temperature and humidity change values from the historical regional climate information; calculate the daily minimum temperature and humidity values and the maximum temperature and humidity change values to obtain the maximum characteristic value of the wet and cold environment and the characteristic value of the wet and cold environment mutation.

[0116] Optionally, the level determination module 202 further includes a cooling environment score calculation unit and a weight determination unit.

[0117] The refrigeration environment score calculation unit is used to divide the system into multiple temperature intervals and multiple humidity intervals, each of which corresponds to a plurality of temperature scores and a plurality of humidity scores; the target temperature score and the target humidity score corresponding to the wet and cold environment characteristic value are determined according to the target temperature interval and the target humidity interval in which the wet and cold environment characteristic value is located; the target temperature score and the target humidity score are normalized to obtain the wet and cold environment score; and the wet and cold environment level corresponding to the wet and cold environment characteristic value is determined according to the score range in which the wet and cold environment score is located.

[0118] The weight determination unit is used to obtain the standard operating temperature and standard operating humidity of the PCBA; and determine the wet and cold environment weights corresponding to the wet and cold environment levels according to the difference between the intermediate temperature of each wet and cold environment level and the standard operating temperature, and the difference between the intermediate humidity of each wet and cold environment level and the standard operating humidity.

[0119] Optionally, the optimization module 205 further includes a sorting unit, a feedback unit, and an order adjustment unit.

[0120] The sorting unit is configured to, if there are multiple target startup failures, respectively determine multiple fault locations of the multiple target startup failures in the PCBA; sort multiple target processing solutions corresponding to the multiple target startup failures in descending order of the number of overlaps of the fault locations, to obtain an implementation order of the multiple target processing solutions; and optimize the PCBA production process using the multiple target processing solutions according to the implementation order.

[0121] The feedback unit is used to obtain the feedback failure rate of the PCBA in a simulated working environment after optimization using the current target processing solution; determine whether the feedback failure rate is lower than the failure rate threshold; if the feedback failure rate is lower than the failure rate threshold or higher than or equal to the failure rate threshold, continue to optimize the PCBA production process using multiple target processing solutions according to the implementation order.

[0122] The order adjustment unit is used to remove the target processing solutions of the same category as the current target processing solution in the implementation order if the feedback failure rate is lower than the failure rate threshold or higher than or equal to the failure rate threshold, so as to obtain the current implementation order; and optimize the PCBA production process using multiple target processing solutions according to the current implementation order.

[0123] The present application also provides a computer storage medium that can store multiple instructions, which are suitable for being loaded and executed by a processor as described above. Figure 1 The PCBA startup failure handling method in a wet and cold environment of the embodiment shown in the figure can be found in the specific execution process. Figure 1 The detailed description of the illustrated embodiment will not be repeated here.

[0124] See Figure 3 , is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3 As shown, the electronic device 300 may include: at least one processor 301 , at least one network interface 304 , a user interface 303 , a memory 305 , and at least one communication bus 302 .

[0125] The communication bus 302 is used to implement the connection and communication between these components.

[0126] The user interface 303 may include a standard wired interface or a wireless interface.

[0127] The network interface 304 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).

[0128] The processor 301 may include one or more processing cores. Using various interfaces and circuits, the processor 301 connects to various components within the server. It executes instructions, programs, code sets, or instruction sets stored in the memory 305, as well as accesses data stored in the memory 305, to perform various server functions and process data. Optionally, the processor 301 may be implemented using at least one of the following hardware forms: a digital signal processing (DSP), a field-programmable gate array (FPGA), or a programmable logic array (PLA). The processor 301 may integrate one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), and a modem. The CPU primarily processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing content displayed on the display screen; and the modem handles wireless communications. It is understood that the modem may not be integrated into the processor 301 but implemented as a separate chip.

[0129] Among them, the memory 305 may include a random access memory (RAM) or a read-only memory (Read-Only Memory). Optionally, the memory 305 includes a non-transitory computer-readable storage medium. The memory 305 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 305 may also be optionally at least one storage device located away from the aforementioned processor 301. As Figure 3 As shown, the memory 305 as a computer storage medium may include an operating system, a network communication module, a user interface module, and an application program of a method for handling startup failures of a PCBA in a wet and cold environment.

[0130] exist Figure 3In the electronic device 300 shown, the user interface 303 is mainly used to provide an input interface for the user and obtain data input by the user; and the processor 301 can be used to call an application stored in the memory 305 for a method for handling startup failures of a PCBA in a wet and cold environment. When executed by one or more processors, the electronic device executes one or more methods in the above-mentioned embodiments.

[0131] An electronic device readable storage medium stores instructions, which, when executed by one or more processors, enable the electronic device to execute one or more methods in the above embodiments.

[0132] It should be noted that for the aforementioned method embodiments, for simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that this application is not limited by the order of the actions described, because according to this application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for this application.

[0133] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0134] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic, such as the division of units, which is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interface, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0135] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0136] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0137] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of this application, or the portion that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the method of this application. The aforementioned memory includes various media that can store program code, such as USB flash drives, mobile hard drives, magnetic disks, or optical disks.

[0138] The above are merely exemplary embodiments of the present disclosure and are not intended to limit the scope of the present disclosure. That is, any equivalent changes and modifications made in accordance with the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, those skilled in the art will easily think of other embodiments of the present disclosure. This application is intended to cover any variations, uses or adaptive changes of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the field of the present technology that are not recorded in the present disclosure.

Claims

1. A method for handling startup failures of a PCBA in a wet and cold environment, characterized in that: The method comprises: Obtain the wet and cold environment characteristic values corresponding to the target working environment of the PCBA; Determining a wet and cold environment level corresponding to the wet and cold environment characteristic value, wherein the wet and cold environment levels respectively correspond to wet and cold environment weights; Determining the wet and cold environment level corresponding to the wet and cold environment characteristic value includes: dividing a plurality of temperature intervals and a plurality of humidity intervals, wherein the plurality of temperature intervals and the plurality of humidity intervals respectively correspond to a plurality of temperature scores and a plurality of humidity scores; determining the target temperature score and the target humidity score corresponding to the wet and cold environment characteristic value according to the target temperature interval and the target humidity interval in which the wet and cold environment characteristic value is located; normalizing the target temperature score and the target humidity score to obtain a wet and cold environment score; determining the wet and cold environment level corresponding to the wet and cold environment characteristic value according to the score range in which the wet and cold environment score is located; obtaining the standard operating temperature and the standard operating humidity of the PCBA; determining the wet and cold environment weights corresponding to the wet and cold environment levels respectively according to the difference between the intermediate temperature of each of the wet and cold environment levels and the standard operating temperature, and the difference between the intermediate humidity of each of the wet and cold environment levels and the standard operating humidity; Perform weighted calculation on the standard threshold of each startup fault according to the wet and cold environment weight to obtain the environment level threshold; Determine the startup fault whose wet and cold environment characteristic value is greater than the environment level threshold as a target startup fault, and determine a target processing solution corresponding to the target startup fault; The target processing solution is used to optimize the production process of the PCBA.

2. The method according to claim 1, characterized in that The wet and cold environment characteristic value includes the minimum temperature and humidity value and the maximum temperature and humidity change value. The wet and cold environment characteristic value corresponding to the target working environment of the PCBA is obtained, including: Obtain historical regional climate information of the target working environment of the PCBA; Extracting the daily minimum temperature and humidity values and the maximum temperature and humidity changes from the historical regional climate information; The daily minimum temperature and humidity values and the maximum temperature and humidity changes are obtained to obtain the maximum characteristic value of the wet and cold environment and the characteristic value of the wet and cold environment mutation.

3. The method according to claim 1, characterized in that The use of the target processing solution to optimize the production process of the PCBA includes: If there are multiple target startup faults, respectively determine multiple fault locations of the multiple target startup faults in the PCBA; Sorting the target processing solutions corresponding to the target startup faults in descending order of the number of overlapping target startup faults including the fault location to obtain an implementation order for the target processing solutions; According to the implementation order, the production process of the PCBA is optimized using the multiple target processing solutions.

4. The method according to claim 3, characterized in that After optimizing the production process of the PCBA using the target processing solution, the method further includes: Obtaining a feedback failure rate of the PCBA under a simulated working environment after optimization using the current target processing solution; Determining whether the feedback failure rate is lower than a failure rate threshold; If the feedback failure rate is higher than or equal to the failure rate threshold, the production process of the PCBA is optimized using the next target processing solution that has not been implemented in the implementation sequence.

5. The method according to claim 4, characterized in that After determining whether the feedback failure rate is lower than the failure rate threshold, the method further includes: If the feedback failure rate is higher than or equal to the failure rate threshold, removing target processing solutions of the same category as the current target processing solution from the implementation order to obtain the current implementation order; According to the current implementation order, the production process of the PCBA is optimized using the multiple target processing solutions.

6. A device for handling startup failures of a PCBA in a wet and cold environment, characterized in that: The device comprises: Environmental feature acquisition module, used to obtain the wet and cold environment feature value corresponding to the target working environment of the PCBA; a level determination module for determining the wet and cold environment level corresponding to the wet and cold environment characteristic value, wherein the wet and cold environment levels respectively correspond to wet and cold environment weights; determining the wet and cold environment level corresponding to the wet and cold environment characteristic value, comprising: dividing the wet and cold environment characteristic value into multiple temperature intervals and multiple humidity intervals, wherein the multiple temperature intervals and the multiple humidity intervals respectively correspond to multiple temperature scores and multiple humidity scores; determining the target temperature score and the target humidity score corresponding to the wet and cold environment characteristic value according to the target temperature interval and the target humidity interval in which the wet and cold environment characteristic value is located; normalizing the target temperature score and the target humidity score to obtain the wet and cold environment score; determining the wet and cold environment level corresponding to the wet and cold environment characteristic value according to the score range in which the wet and cold environment score is located; obtaining the standard operating temperature and standard operating humidity of the PCBA; determining the wet and cold environment weights corresponding to the wet and cold environment levels respectively according to the difference between the intermediate temperature of each of the wet and cold environment levels and the standard operating temperature, and the difference between the intermediate humidity of each of the wet and cold environment levels and the standard operating humidity; A threshold calculation module, configured to perform weighted calculation on the standard threshold of each startup fault according to the wet and cold environment weight to obtain an environment level threshold; a processing solution determination module, configured to determine the startup fault whose wet and cold environment characteristic value is greater than the environment level threshold as a target startup fault, and determine a target processing solution corresponding to the target startup fault; An optimization module is used to optimize the production process of the PCBA using the target processing solution.

7. A computer storage medium, characterized in that The computer storage medium stores a plurality of instructions, and the instructions are suitable for being loaded by a processor and executing the method according to any one of claims 1 to 5.

8. An electronic device, characterized in that: The electronic device comprises a processor, a memory and a transceiver, wherein the memory is used to store instructions, the transceiver is used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device executes the method according to any one of claims 1 to 5.

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