Component life evaluation method and device, computer device and storage medium

Abstract

The application relates to a component life evaluation method and device, computer equipment, a storage medium and a computer program product. The method comprises the following steps: fitting an accelerated life test model under different stress conditions according to performance indexes of components under the different stress conditions, to obtain a fitted accelerated life test model; determining average lives of the components under the different stress conditions based on the fitted accelerated life test model, and determining the component life according to the average lives. The method can improve the accuracy of component life evaluation, and further improve the reliability of a server.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server testing, and in particular to a component life evaluation method and device, computer equipment, a storage medium, and a computer program product. BACKGROUND

[0002] With the rapid development of information technology, the application of server products is becoming more and more widespread. For a server, it needs to carry and respond to the service requests of thousands of users, and can carry the high load requirements for years. Therefore, it is crucial to ensure the long-term reliable operation of the server. From the perspective of components, selecting more reliable components is the most basic step to improve the reliability of the server product system.

[0003] In the traditional technology, the life evaluation of server components is mainly realized by establishing a degradation model. The degradation model analyzes the influence of a certain stress on the life of a component. For example, an accelerated life test of temperature stress is performed through the degradation model, and based on the obtained test results, the working life of the component is evaluated.

[0004] However, in the traditional technology, the influence of a single stress on the life of a component is considered, which leads to an overestimation of the estimated life of the component, and further leads to a low accuracy of screening unqualified components and a reduction in the overall operation reliability of the server. SUMMARY

[0005] Therefore, it is necessary to provide a component life evaluation method, device, computer equipment, computer readable storage medium, and computer program product to solve the above technical problems.

[0006] In a first aspect, the present application provides a component life evaluation method, which comprises:

[0007] fitting an accelerated life test model under different stress conditions based on the performance indicators of the components under the different stress conditions to obtain a fitted accelerated life test model;

[0008] determining the average life of the components under the different stress conditions based on the fitted accelerated life test model, and determining the life of the components according to the average lives.

[0009] In this embodiment, the accelerated life test models under different stress conditions are fitted, the influence of different stress conditions on the life of the components is comprehensively considered, and then the life of the components is determined based on the fitted accelerated life model, which improves the evaluation accuracy of the life of the components and further improves the operation reliability of the server.

[0010] In one of the embodiments, the method further comprises:

[0011] Accelerated life tests are respectively performed on the components under different stress conditions to obtain test results;

[0012] Performance indexes of the components under the different stress conditions are determined based on the test results.

[0013] In this embodiment, the accelerated life tests are performed on the components under different stress conditions to obtain test results, and then performance indexes of the components under different stress conditions are determined based on the test results, so that the life of the components can be accurately evaluated based on the performance of the components under different stress conditions.

[0014] In one of the embodiments, the test results include the number of failures of the components in multiple time intervals, and the performance indexes of the components under the different stress conditions are determined based on the test results, including:

[0015] Failure rates in each of the time intervals are determined based on the number of failures of the components in the multiple time intervals under the different stress conditions;

[0016] Cumulative failure rates of the components under the different stress conditions are determined based on the failure rates in each of the time intervals;

[0017] Average time-to-failure of the components under the different stress conditions is determined based on the cumulative failure rates.

[0018] In this embodiment, the failure rates are determined based on the number of failures, the cumulative failure rates are determined based on the failure rates, and the average time-to-failure is finally calculated, so that the reliability and life performance of the components under different stress conditions can be evaluated. These indexes can be used to guide the selection, design and reliability evaluation of the components, thereby improving the stability and reliability of the server.

[0019] In one of the embodiments, the average time-to-failure of the components under the different stress conditions includes a first average time-to-failure under working stress conditions and a second average time-to-failure under storage conditions.

[0020] In this embodiment, the first MTTF under working stress conditions and the second MTTF under storage conditions are determined, so that the reliability and life characteristics of the components under different stress conditions can be comprehensively evaluated, and the accuracy and reliability of the life evaluation of the components can be improved.

[0021] In one of the embodiments, the fitted accelerated life test model includes a working fitted accelerated life test model and a non-working fitted accelerated life test model; and the fitted accelerated life test model is obtained by fitting the accelerated life test model under different stress conditions based on the performance indexes of the components under the different stress conditions, including:

[0022] obtain a temperature stress accelerated life test model and an electric stress accelerated life test model, and based on the first average time before failure, construct a working fitting accelerated life test model;

[0023] obtain a temperature and humidity stress accelerated life test model, and based on the second average time before failure, construct a non-working fitting accelerated life test model.

[0024] In the embodiment, the accelerated life test models under different stress conditions are obtained, and the fitting model is constructed based on the average time before failure, which is helpful to evaluate the life of the component under working and non-working conditions, and improve the use reliability of the component.

[0025] In one of the embodiments, based on the fitting accelerated life test model, determining the average life of the component under the different stress conditions comprises:

[0026] obtain a first stress value under a normal working stress condition, and based on the first stress value and the fitting accelerated life test model, determine a first average life under the normal working stress condition;

[0027] obtain a second stress value under a normal storage condition, and based on the second stress value and the fitting accelerated life test model, determine a second average life under the normal storage condition.

[0028] In the embodiment, based on the pre-constructed fitting accelerated life test model, the first average life and the second average life of the component under normal conditions are calculated, not only considering the life loss of the component under working state, but also considering the component loss under storage condition, comprehensively evaluating the life of the component under different stress conditions, and improving the accuracy and reliability of the life evaluation of the component.

[0029] In one of the embodiments, the average life of the component under the different stress conditions comprises a first average life under a normal working stress condition and a second average life under a normal storage condition; and based on each of the average lives, determining the life of the component comprises:

[0030] based on the second average life and the real storage time of the component, constructing a correction factor;

[0031] based on the correction factor and the first average life, determining the life of the component.

[0032] In this embodiment, based on the second average life under the storage condition and the quasi-time storage time of the component, a correction factor is determined, the correction factor considers the influence of the component under the storage condition on the life of the component, and then the first average life is corrected based on the correction factor to determine the life of the component, the influence of each stress on the life of the component under the working stress condition and the non-working stress condition is comprehensively considered, the life of the component is evaluated, the accuracy of the life prediction can be improved, and then the reliability of the server is improved.

[0033] In a second aspect, the present application also provides a component life evaluation device, the device comprises:

[0034] A fitting processing module is configured to fit the accelerated life test models under different stress conditions according to the performance indicators of the components under the different stress conditions, and obtain fitted accelerated life test models.

[0035] A determination module is configured to determine the average lives of the components under the different stress conditions based on the fitted accelerated life test models, and determine the life of the component according to the average lives.

[0036] In a third aspect, the present application also provides a computer device, which comprises a memory and a processor, the memory stores a computer program, and the processor implements the following steps when executing the computer program:

[0037] The accelerated life test models under different stress conditions are fitted according to the performance indicators of the components under the different stress conditions, and fitted accelerated life test models are obtained.

[0038] The average lives of the components under the different stress conditions are determined based on the fitted accelerated life test models, and the life of the component is determined according to the average lives.

[0039] In a fourth aspect, the present application also provides a computer readable storage medium, which stores a computer program, and the computer program implements the following steps when executed by a processor:

[0040] The accelerated life test models under different stress conditions are fitted according to the performance indicators of the components under the different stress conditions, and fitted accelerated life test models are obtained.

[0041] The average lives of the components under the different stress conditions are determined based on the fitted accelerated life test models, and the life of the component is determined according to the average lives.

[0042] In a fifth aspect, the present application also provides a computer program product, which comprises a computer program, and the computer program implements the following steps when executed by a processor:

[0043] The performance indexes of the components under different stress conditions are fitted to the accelerated life test model under the different stress conditions to obtain a fitted accelerated life test model.

[0044] Based on the fitted accelerated life test model, the average life of the components under the different stress conditions is determined, and the life of the components is determined according to the average life.

[0045] The component life evaluation method, device, computer equipment, storage medium and computer program product determine the average life of the components under the different stress conditions based on the fitted accelerated life test model, and determine the life of the components according to the average life. By fitting the accelerated life test model under different stress conditions, the influence of different stress conditions on the life of the components is comprehensively considered, and then the life of the components is determined based on the fitted accelerated life test model, which improves the evaluation accuracy of the life of the components, and further improves the operation reliability of the server. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the embodiments or related art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0047] Figure 1 A flowchart of a component life evaluation method in an embodiment;

[0048] Figure 2 A flowchart of a step of determining the performance index of the component in an embodiment;

[0049] Figure 3 A flowchart of a step of determining the failure rate and the average time before failure in an embodiment;

[0050] Figure 4 A flowchart of a step of constructing a fitted accelerated life test model in an embodiment;

[0051] Figure 5 A flowchart of a step of determining the average life of the components under different working stress conditions in an embodiment;

[0052] Figure 6 A flowchart of a step of determining the life of the components in an embodiment;

[0053] Figure 7 A specific example flow chart of the component life evaluation method in an embodiment;

[0054] Figure 8 A structural block diagram of the component life evaluation device in an embodiment;

[0055] Figure 9 An internal structure diagram of the computer device in an embodiment. DETAILED DESCRIPTION

[0056] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0057] In an embodiment, as shown in Figure 1 a component life evaluation method is provided, and the embodiment is exemplified by the method applied to a computer device. It should be understood that the computer device can be a terminal, a server, or a system including a terminal and a server, and the interaction between the terminal and the server is realized. In the embodiment, the method includes the following steps:

[0058] In step 102, the accelerated life test model under different stress conditions is fitted according to the performance indicators of the components under different stress conditions, and a fitted accelerated life test model is obtained.

[0059] In implementation, different stress conditions can include working stress conditions and non-working stress conditions (storage conditions, or environmental conditions), and each stress condition includes multiple stresses, for example, the working stress conditions include temperature, voltage and other stress indicators. Therefore, when evaluating the life of the components to be tested, the computer device performs accelerated life tests on each component, and each accelerated life test is used to test the effect of a stress indicator on the life of the component, so as to determine the performance indicators of the components under different stress conditions. Then, the accelerated life test models corresponding to different stress indicators are created, and the computer device can fit the accelerated life test models corresponding to different stress indicators according to the determined performance indicators of the components under different stress conditions, to obtain the fitted accelerated life test models. The fitted accelerated life test models can consider the effect of comprehensive stress conditions on the life of the components. The life of the components is evaluated.

[0060] In step 104, the average life of the components under different stress conditions is determined based on the fitted accelerated life test model, and the life of the components is determined according to the average life.

[0061] In the implementation, the computer device obtains stress values of the normal state under different stress conditions, and inputs the stress values of the normal state into the fitted accelerated life test model, to obtain the average life of the component under different stress conditions in the normal case based on the fitted accelerated life test model. Further, the computer device can determine the life of the component based on the average life under different stress conditions.

[0062] In the embodiment, the accelerated life test model under different stress conditions is fitted, the influence of different stress conditions on the life of the component is comprehensively considered, and then the life of the component is determined based on the fitted accelerated life test model, thereby improving the evaluation accuracy of the life of the component, and further improving the operation reliability of the server.

[0063] In one embodiment, as shown in Figure 2 the method further includes:

[0064] Step 201, respectively, the component is subjected to accelerated life test under different stress conditions, and the test results are obtained.

[0065] In the implementation, the computer device respectively subjects the component to accelerated life test under different stress conditions, and obtains the test results. Specifically, the computer device subjects n components to be evaluated to high accelerated life test for a time T, divides the time T into r time intervals, counts the number of failures of the components in each time interval, and finally takes the number of failures in the r time intervals as the test results.

[0066] Step 202, determining the performance indicators of each component under different stress conditions based on the test results.

[0067] In the implementation, the performance indicators include the failure rate and the mean time to failure of the component. The computer device determines the failure rate of each component under different stress conditions based on the test results, and then determines the performance indicators of each component under different stress conditions based on the failure rate.

[0068] In the embodiment, the accelerated life test of the component under different stress conditions is performed to obtain the test results, and then the performance indicators of each component under different stress conditions are determined based on the test results, so that the life of the component can be accurately evaluated based on the performance of the component under different stress conditions.

[0069] In one embodiment, as shown in Figure 3 the test results include the number of failures of the component in multiple time intervals, and step 202 includes steps 301 to 303. Wherein:

[0070] Step 301, determining the failure rate in each time interval based on the number of failures of the component in multiple time intervals under different stress conditions.

[0071] In the implementation, the computer device determines the failure rate of the component in each time interval based on the number of failures of the component in the plurality of time intervals under different stress conditions. Specifically, the computer device calculates the ratio of the number of failures of the component in each time interval under the working stress condition to the number of survivals of the component before the time interval, to obtain the failure rate of the component in each time interval under the working stress condition, according to the test results (i.e., the number of failures) of the accelerated life test of the component under the working stress condition. The calculation formula of the failure rate is shown in the following formula (1):

[0072] (1)

[0073] wherein, is the failure rate of the component in the time interval ; is the number of failed samples in the time interval ; is the number of survivals of the component before the time interval , is the length of the time interval .

[0074] Similarly, the computer device can calculate the ratio of the number of failures of the component in each time interval under the non-working stress condition to the number of survivals of the component before the time interval, to obtain the failure rate of the component in each time interval under the non-working stress condition. The embodiments of the present application will not be repeated here.

[0075] In step 302, the computer device determines the cumulative failure rate of the component under different stress conditions based on the failure rate in each time interval.

[0076] In the implementation, the computer device determines the cumulative failure rate of the component under different stress conditions based on the failure rate in each time interval. Specifically, the computer device accumulates the failure rate in each time interval under the working stress condition, to obtain the cumulative failure rate of the component under the working stress condition. Similarly, the computer device can determine the cumulative failure rate of the component under the non-working stress condition.

[0077] In step 303, the computer device determines the average time-to-failure of the component under different stress conditions based on the cumulative failure rate.

[0078] In the implementation, the computer device determines the average time-to-failure of the component under different stress conditions based on the cumulative failure rate. Specifically, the calculation formula of the average time-to-failure of the component is shown in the following formula (2):

[0079] (2)

[0080] According to R(t)=1-F(t), f(t)=dF(t) / dt=-dR(t) / dt, substituting into equation (2), where R(t) is the reliability of the component at time t, F(t) is the cumulative distribution function of the component failure rate, and f(t) is the probability density function of the failure time:

[0081] (3)

[0082] Substituting R(∞)=0 and R(0)=1, MTTF can be expressed as:

[0083] (4)

[0084] For electronic components on the server, the failure rate h(t) is mostly constant failure rate, that is:

[0085] h(t)= λ (5)

[0086] For electronic products (e.g., servers), the distribution function is generally exponential distribution, so the cumulative distribution function of the failure rate can be expressed as:

[0087] (6)

[0088] The reliability function R(t) can be expressed as:

[0089] (7)

[0090] Substituting equation (6) into equation (4), MTTF can be expressed as:

[0091] (8)

[0092] In this embodiment, by determining the failure rate based on the number of failures, then determining the cumulative failure rate according to the failure rate, and finally calculating the mean time to failure, the reliability and life performance of the components under different stress conditions can be evaluated. These indicators can be used to guide component selection, design and reliability evaluation, thereby improving the stability and reliability of the server.

[0093] In one embodiment, the mean time to failure of the components under different stress conditions includes a first mean time to failure under working stress conditions and a second mean time to failure under storage conditions.

[0094] In implementation, different stress conditions include working stress conditions and non-working stress conditions (also referred to as storage conditions). In order to comprehensively consider the effect of each stress on the life of the components, the mean time to failure of the components under different stress conditions, i.e., the first mean time to failure and the second mean time to failure, are calculated respectively.

[0095] In this embodiment, by determining the first MTTF under the working stress condition and the second MTTF under the storage condition, the reliability and life characteristics of the components under different stress conditions can be comprehensively evaluated, and the accuracy and reliability of the component life evaluation can be improved.

[0096] In one embodiment, as shown in FIG. 1, the fitting accelerated life test model includes a working fitting accelerated life test model and a non-working fitting accelerated life test model, and step 102 includes steps 401-402, wherein: Figure 4

[0097] In step 401, the temperature stress accelerated life test model and the electrical stress accelerated life test model are obtained, and based on the first average time-to-failure, a working fitting accelerated life test model is constructed.

[0098] In implementation, the life of the component during working is mainly affected by temperature stress and electrical stress, the relationship between temperature stress and component life can be represented by the Arrhenius reaction model, and the relationship between electrical stress and component life can be represented by the inverse power law model. Therefore, the computer device can calculate the first average time-to-failure L1 and the first average time-to-failure L0 of the component based on different working stress values under the working stress condition. In this way, the computer device fits the obtained temperature stress accelerated life test model (i.e., the Arrhenius reaction model) and the electrical stress accelerated life test model (i.e., the inverse power law model) based on the first average time-to-failure (L0 and L1) under the working stress condition, to obtain the fitted fitting accelerated life test model:

[0099] L 0 L 1 = V 0 V 1 - n exp [ E a / k( 1 T 0 - 1 T 1 )] (9)

[0100] In the formula, L0 and L1 are the life (i.e., the average time-to-failure) of the component under different stress conditions; V0 is the electrical stress corresponding to L0, and V1 is the electrical stress corresponding to L1; T0 is the absolute temperature stress corresponding to L0, and T1 is the absolute temperature stress corresponding to L1; E a is the activation energy, and k is the Boltzmann constant.

[0101] ​Then, the computer device substitutes the accelerated stress value (e.g., absolute electrical stress, absolute temperature stress) under normal working stress conditions into the fitted accelerated life test model under the fitted storage conditions, solves the unknown number n in the model of formula (9), and obtains the final fitted accelerated life test model under working stress conditions.

[0102] Step 402 : Acquire a temperature and humidity stress accelerated life test model, and construct a non-operating fitting accelerated life test model based on the second mean time before failure.

[0103] In practice, the life of components in the storage process (non-working stress conditions) is mainly affected by temperature stress and humidity stress. The computer equipment obtains the temperature and humidity stress accelerated life test model and calculates the second mean time before failure T under non-working stress conditions. f , construct a non-working fitting accelerated life test model. Specifically, the relationship between component life and temperature and humidity stress can be expressed by the Peck model, that is:

[0104] (10)

[0105] Among them, T f is the component life (second mean time before failure), A and n are constants, RH is the relative humidity, T is the absolute temperature, Ea is the activation energy, and k is the Boltzmann constant.

[0106] Then, the computer device substitutes the accelerated stress value (e.g., relative humidity, absolute temperature) under normal storage conditions (also called normal non-working stress conditions) into the fitted accelerated life test model under the fitted storage conditions, solves the unknown number n in the model of formula (10), and obtains the final fitted accelerated life test model under the storage conditions.

[0107] In this embodiment, accelerated life test models under different stress conditions are obtained, and a fitting model is constructed based on the mean time before failure, which helps to evaluate the life of components under working and non-working conditions and improve the reliability of the components.

[0108] In one embodiment, Figure 5 As shown, based on the above embodiment, it can be seen that the average life of the component calculated under the working stress condition is the first average life, and the average life of the component calculated under the non-working stress condition (i.e., the storage condition) is the second average life. Then, step 102 includes the following steps 501 to 502, wherein:

[0109] Step 501 : obtaining a first stress value under normal working stress conditions, and determining a first average life under normal working stress conditions based on the first stress value and a fitted accelerated life test model.

[0110] In implementation, the computer device acquires the first stress value under normal working stress condition, and then determines the first average life of the component under normal working stress condition based on the first stress value and the fitted accelerated life test model under working stress condition. Specifically, based on the fitted accelerated life test model under working stress condition determined in the above embodiment, the computer device substitutes the first stress value (i.e. normal working voltage and normal working temperature) under normal working stress condition into the fitted accelerated life test model, solves the fitted accelerated life test model, and thus obtains the first average life of the component under working condition.

[0111] In step 502, the second stress value under normal storage condition is acquired, and the second average life under normal storage condition is determined based on the second stress value and the fitted accelerated life test model.

[0112] In implementation, the computer device acquires the second stress value under normal storage condition, and then determines the second average life of the component under normal storage condition based on the second stress value and the fitted accelerated life test model under storage condition. Specifically, based on the fitted accelerated life test model under storage condition determined in the above embodiment, the computer device substitutes the second stress value (i.e. temperature value and humidity value under normal storage condition) under normal storage condition into the fitted accelerated life test model, solves the fitted accelerated life test model, and thus obtains the second average life of the component under storage condition.

[0113] In the embodiment, the first average life and the second average life of the component under normal condition are calculated based on the pre-constructed fitted accelerated life test model, which not only considers the life loss of the component under working state, but also considers the component loss under storage condition, comprehensively evaluates the life of the component under different stress conditions, and improves the accuracy and reliability of the life evaluation of the component.

[0114] In one embodiment, the average life of the component under different stress conditions includes the first average life under normal working stress condition and the second average life under normal storage condition. Furthermore, in order to improve the accuracy of the life evaluation of the component, the computer device can comprehensively consider the first average life under working stress condition and the second average life under non-working stress condition, and thus obtain the most accurate life evaluation result of the component. Therefore, the steps include steps 601 to 602, in which:

[0115] In step 601, a correction factor is constructed based on the second average life and the real storage time of the component.

[0116] In implementation, the computer device constructs the correction factor based on the second average life and the real storage time of the component. z The correction factor μ is defined as:

[0117] (11)

[0118] wherein, L s represents the average life of the component under storage condition (i.e. the second average life), L z is the real storage time of the component, and further, the actual performance of the current storage condition of the component is determined based on the determined correction factor.

[0119] In step 602, the life of the component is determined based on the correction factor and the first average life.

[0120] In implementation, the computer device determines the life of the component based on the correction factor and the first average life. Specifically, the calculation formula of the life of the component is as follows:

[0121] (12)

[0122] The computer device corrects the average life of the component under working stress condition (i.e. the first average life) based on the correction factor, as shown in the above formula (12), so as to obtain the corrected life of the component .

[0123] In this embodiment, the correction factor is determined based on the second average life under storage condition and the real storage time of the component, the correction factor considers the influence of the component under storage condition on the life of the component, and further, the first average life is corrected based on the correction factor to determine the life of the component, which comprehensively considers the influence of each stress under working stress condition and non-working stress condition on the life of the component, and the life of the component is evaluated, which can improve the accuracy of life prediction and further improve the reliability of the server.

[0124] In one embodiment, as shown in Figure 7 , a specific example flow of a component life evaluation method is given, which includes the following steps:

[0125] In step 701, the accelerated life test of the component under working stress condition is performed to obtain the first test result.

[0126] In step 702, the accelerated life test of the component under non-working stress condition is performed to obtain the second test result.

[0127] ​Step 703, based on the first test result, determine the performance index of the component under the working stress condition, and fit the temperature-voltage accelerated life test model under the working stress condition based on the performance index.

[0128] Step 704, based on the second test result, determine the performance index of the component under the non-working stress condition, and fit the temperature-humidity accelerated life test model under the non-working stress condition based on the performance index.

[0129] Step 705, determine the average life of the component under the working stress condition based on the fitted temperature-voltage accelerated life test model.

[0130] Step 706, determine the average life of the component under the non-working stress condition based on the fitted temperature-humidity accelerated life test model.

[0131] Step 707, based on the average life of the component under the non-working stress condition, construct a correction factor to correct the average life of the component under the working stress condition, and obtain the corrected component life.

[0132] In an embodiment, a specific example of a component life evaluation method is given, which is specifically:

[0133] A certain capacitor on a certain server mainboard is a vulnerable component of the server, and a high accelerated life test is performed on it. The reduction percentage of the capacitance value of the capacitor relative to the initial capacitance is defined as the degradation of the capacitor. When the degradation of the capacitor is greater than 10%, the capacitor is determined to be failed, and thus the failure rate and the mean time to failure (MTTF) of the capacitor are determined.

[0134] Specifically, the failure rate and MTTF of the capacitor under working conditions are as shown in Table 1 below:

[0135] Table 1

[0136]

[0137] Assuming that the activation energy Ea of the capacitor is 0.25ev, and the calculated MTTF is 6300 and 5900 respectively, based on the fitted accelerated life test model under the working stress condition, i.e. formula (9) in the above embodiment, the following results are obtained:

[0138] 6300 5900 = 50 100 - n exp [ 0.25 8.623 * 1 0 - 5 ( 1 278 - 1 308 )]

[0139] The computer device substitutes the accelerated stress value (absolute temperature stress, electric stress) into the calculated formula result to solve the unknown number, and obtains the unknown number n=-1.37 in the fitting accelerated life test model. Assuming that the normal working condition of the component is 25℃ and 25V, the first average life of the component corresponding to different stress conditions under the normal working stress can be calculated:

[0140] L 0 =6000( 25 35 ) 1.37 exp [ 0.25 8.623 × 1 0 - 5 ( 1 298 - 1 308 )]

[0141]

[0142] The failure rate and MTTF of the capacitor under the non-working condition are as follows:

[0143] Table 2

[0144]

[0145] Assuming that the activation energy of the capacitor is 0.25ev, n=-9.16 and A=1.74e -19 .

[0146] The normal non-working condition of the component is 50℃ and 98%RH, and then:

[0147]

[0148] Assuming that the real storage time of the component is 150h, the corrected life of the component under the working condition is:

[0149]

[0150] It should be understood that although the steps in the flowcharts involved in the embodiments described above are shown in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts involved in the embodiments described above can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of the steps or stages is not necessarily sequential, but can be alternately executed with other steps or steps or stages in at least part of other steps.

[0151] Based on the same inventive concept, the embodiments of the present application also provide a component life assessment device for implementing the component life assessment method described above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more component life assessment device embodiments provided below can refer to the limitations of the component life assessment method in the above text, which will not be repeated here.

[0152] In one exemplary embodiment, as shown in Figure 8 A component life assessment device 800 is provided, comprising: a fitting processing module 801 and a determination module 802, wherein:

[0153] The fitting processing module 801 is configured to fit the accelerated life test model under different stress conditions according to the performance indicators of the component under different stress conditions, to obtain a fitted accelerated life test model.

[0154] The determination module 802 is configured to determine the average life of the component under different stress conditions based on the fitted accelerated life test model, and determine the component life according to each average life.

[0155] In an exemplary embodiment, the device 800 further comprises:

[0156] The processing module is configured to perform accelerated life tests on the component under different stress conditions respectively to obtain test results.

[0157] The second determination module is configured to determine the performance indicators of each component under different stress conditions based on the test results.

[0158] In an exemplary embodiment, the test results include the number of failures of the component in multiple time intervals, and the second determination module is specifically configured to determine the failure rate in each time interval based on the number of failures of the component in the multiple time intervals under different stress conditions.

[0159] Determine the cumulative failure rate of the component under different stress conditions based on the failure rate in each time interval;

[0160] Determine the average time before failure of the component under different stress conditions based on the cumulative failure rate.

[0161] In an exemplary embodiment, the average time before failure of the component under different stress conditions includes a first average time before failure under working stress conditions and a second average time before failure under storage conditions.

[0162] In an exemplary embodiment, the fitting accelerated life test model includes a working fitting accelerated life test model and a non-working fitting accelerated life test model; the fitting processing module 801 is specifically configured to obtain a temperature stress accelerated life test model and an electrical stress accelerated life test model, and construct the working fitting accelerated life test model based on the first average time before failure;

[0163] Obtain a temperature and humidity stress accelerated life test model, and construct the non-working fitting accelerated life test model based on the second average time before failure.

[0164] In an exemplary embodiment, the determining module 802 is specifically configured to obtain a first stress value under normal working stress conditions, and determine a first average life under normal working stress conditions based on the first stress value and the fitting accelerated life test model.

[0165] Obtain a second stress value under normal storage conditions, and determine a second average life under normal storage conditions based on the second stress value and the fitting accelerated life test model.

[0166] In an exemplary embodiment, the average life of the component under different stress conditions includes a first average life under normal working stress conditions and a second average life under normal storage conditions, and the determining module 802 is specifically configured to construct a correction factor based on the second average life and the actual storage time of the component.

[0167] Determine the life of the component based on the correction factor and the first average life.

[0168] Each module in the above component life evaluation device can be realized by software, hardware and their combinations in whole or in part. The above modules can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory in the computer device in software form, so as to call and execute the operations corresponding to the above modules by the processor.

[0169] In an exemplary embodiment, a computer device is provided, which can be a server, and its internal structure diagram can be as shown in Figure 9The computer device shown in the figure includes a processor, a memory, an input / output interface (I / O for short) and a communication interface. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operating system and the computer program in the non-volatile storage medium to run. The database of the computer device is used to store component test results, component performance indicators, component life and other component life evaluation method related data. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals through network connection. The computer program is executed by the processor to implement a component life evaluation method.

[0170] Those skilled in the art can understand that, Figure 9 The structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can include more or fewer components than those shown in the figure, or combine certain components, or have a different component arrangement.

[0171] In one exemplary embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program:

[0172] According to the performance indicators of the components under different stress conditions, the accelerated life test models under different stress conditions are fitted to obtain fitted accelerated life test models;

[0173] Based on the fitted accelerated life test models, the average life of the components under different stress conditions is determined, and the life of the components is determined according to the average life.

[0174] In one embodiment, the processor further implements the following steps when executing the computer program:

[0175] The accelerated life tests of the components under different stress conditions are performed respectively to obtain test results;

[0176] The performance indicators of the components under different stress conditions are determined based on the test results.

[0177] In one embodiment, the test results include the number of failures of the components in a plurality of time intervals, and the processor further implements the following steps when executing the computer program:

[0178] determine the failure rate in each time interval based on the number of failures of the component in the plurality of time intervals under different stress conditions;

[0179] determine the cumulative failure rate of the component under different stress conditions based on the failure rate in each time interval;

[0180] determine the mean time to failure of the component under different stress conditions based on the cumulative failure rate.

[0181] In one embodiment, the mean time to failure of the component under different stress conditions comprises a first mean time to failure under operating stress conditions and a second mean time to failure under storage conditions.

[0182] In one embodiment, the fitting accelerated life test model comprises an operating fitting accelerated life test model and a non-operating fitting accelerated life test model; the processor further implements the following steps when executing the computer program:

[0183] obtaining a temperature stress accelerated life test model and an electrical stress accelerated life test model, and constructing the operating fitting accelerated life test model based on the first mean time to failure;

[0184] obtaining a temperature and humidity stress accelerated life test model, and constructing the non-operating fitting accelerated life test model based on the second mean time to failure.

[0185] In one embodiment, the processor further implements the following steps when executing the computer program:

[0186] obtaining a first stress value under normal operating stress conditions, and determining a first average life under normal operating stress conditions based on the first stress value and the fitting accelerated life test model;

[0187] obtaining a second stress value under normal storage conditions, and determining a second average life under normal storage conditions based on the second stress value and the fitting accelerated life test model.

[0188] In one embodiment, the mean life of the component under different stress conditions comprises a first average life under normal operating stress conditions and a second average life under normal storage conditions; the processor further implements the following steps when executing the computer program:

[0189] constructing a correction factor based on the second average life and the actual storage time of the component;

[0190] determining the life of the component based on the correction factor and the first average life.

[0191] In one embodiment, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program, and the computer program is executed by a processor to implement the following steps:

[0192] According to the performance indexes of the components under different stress conditions, an accelerated life test model under different stress conditions is fitted to obtain a fitted accelerated life test model;

[0193] Based on the fitted accelerated life test model, the average life of the components under different stress conditions is determined, and the life of the components is determined according to the average life.

[0194] In one embodiment, the computer program, when executed by the processor, further implements the following steps:

[0195] The accelerated life test of the components under different stress conditions is respectively performed to obtain test results;

[0196] Based on the test results, the performance indexes of the components under different stress conditions are determined.

[0197] In one embodiment, the computer program, when executed by the processor, further implements the following steps:

[0198] Based on the number of failures of the components under different stress conditions in a plurality of time intervals, the failure rate in each time interval is determined;

[0199] Based on the failure rate in each time interval, the cumulative failure rate of the components under different stress conditions is determined;

[0200] Based on the cumulative failure rate, the average time-to-failure of the components under different stress conditions is determined.

[0201] In one embodiment, the average time-to-failure of the components under different stress conditions includes a first average time-to-failure under working stress conditions and a second average time-to-failure under storage conditions.

[0202] In one embodiment, the fitted accelerated life test model includes a working fitted accelerated life test model and a non-working fitted accelerated life test model; the computer program, when executed by the processor, further implements the following steps:

[0203] The temperature stress accelerated life test model and the electric stress accelerated life test model are obtained, and based on the first average time-to-failure, the working fitted accelerated life test model is constructed;

[0204] The temperature and humidity stress accelerated life test model is obtained, and based on the second average time-to-failure, the non-working fitted accelerated life test model is constructed.

[0205] In one embodiment, the computer program, when executed by the processor, further implements the following steps:

[0206] obtaining a first stress value under a normal working stress condition, determining a first average life under the normal working stress condition based on the first stress value and the fitted accelerated life test model;

[0207] obtaining a second stress value under a normal storage condition, determining a second average life under the normal storage condition based on the second stress value and the fitted accelerated life test model.

[0208] In one embodiment, the average life of the component under different stress conditions includes the first average life under the normal working stress condition and the second average life under the normal storage condition; the computer program, when executed by the processor, further implements the following steps:

[0209] constructing a correction factor based on the second average life and an actual storage time of the component;

[0210] determining the life of the component based on the correction factor and the first average life.

[0211] In one embodiment, a computer program product is provided, including a computer program, which, when executed by a processor, implements the steps in the above-mentioned method embodiments.

[0212] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0213] Any combination of the technical features of the above embodiments can be made. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist, it should be considered as the scope of the present application.

[0214] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A component life assessment method, characterized in that: The method comprises: fitting the accelerated life test model under different stress conditions according to the performance indicators of the components under different stress conditions to obtain a fitted accelerated life test model; Based on the fitted accelerated life test model, determining the average life of the components under the different stress conditions, and determining the component life according to each of the average lifespans; the different stress conditions include working stress conditions and non-working stress conditions, and the fitted accelerated life test model includes a working fitted accelerated life test model and a non-working fitted accelerated life test model; the average life of the components under the different stress conditions includes a first average life under normal working stress conditions and a second average life under normal storage conditions; Determining the component lifespan according to the average lifespans includes: constructing a correction factor based on the second average lifespan and the actual storage time of the component; The component lifespan is determined based on the correction factor and the first average lifespan.

2. The method according to claim 1, characterized in that The method further comprises: Conduct accelerated life tests on components under different stress conditions and obtain test results; Based on the test results, the performance indicators of each component under the different stress conditions are determined.

3. The method according to claim 2, characterized in that The test results include the number of component failures within multiple time intervals, and determining the performance indicators of each component under the different stress conditions based on the test results includes: determining a failure rate in each of the time intervals based on the number of failures of components in the multiple time intervals under the different stress conditions; determining the cumulative failure rate of components under the different stress conditions based on the failure rate in each of the time intervals; The average time before failure of the components under the different stress conditions is determined based on the cumulative failure rate.

4. The method according to any one of claims 1 to 3, characterized in that The mean time before failure of components under different stress conditions includes a first mean time before failure under working stress conditions and a second mean time before failure under storage conditions.

5. The method according to claim 4, characterized in that The fitted accelerated life test model includes a working fitted accelerated life test model and a non-working fitted accelerated life test model; the accelerated life test model under different stress conditions is fitted according to the performance indicators of the components under different stress conditions to obtain the fitted accelerated life test model, including: Obtaining a temperature stress accelerated life test model and an electrical stress accelerated life test model, and constructing a working fitting accelerated life test model based on the first mean time before failure; A temperature and humidity stress accelerated life test model is obtained, and a non-working fitting accelerated life test model is constructed based on the second mean time before failure.

6. The method according to claim 1, characterized in that Determining the average life of components under the different stress conditions based on the fitted accelerated life test model includes: Obtaining a first stress value under normal working stress conditions, and determining a first average life under the normal working stress conditions based on the first stress value and the fitted accelerated life test model; A second stress value under normal storage conditions is obtained, and a second average life under the normal storage conditions is determined based on the second stress value and the fitted accelerated life test model.

7. A component life assessment device, characterized in that: The device comprises: A fitting processing module, configured to fit the accelerated life test model under different stress conditions according to the performance indicators of the components under different stress conditions, to obtain a fitted accelerated life test model; a determination module, configured to determine, based on the fitted accelerated life test model, the average lifespan of the components under the different stress conditions, and determine the component lifespan based on the average lifespans; the different stress conditions include working stress conditions and non-working stress conditions, the fitted accelerated life test model includes a working fitted accelerated life test model and a non-working fitted accelerated life test model; the average lifespan of the components under the different stress conditions includes a first average lifespan under normal working stress conditions and a second average lifespan under normal storage conditions; The determining module is specifically configured to construct a correction factor based on the second average lifespan and the actual storage time of the component; The component lifespan is determined based on the correction factor and the first average lifespan.

8. The device according to claim 7, characterized in that The device further comprises: A processing module is used to perform accelerated life tests on components under different stress conditions and obtain test results; The second determining module is used to determine the performance index of each component under the different stress conditions based on the test results.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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