A low-stray inductance power assembly and converter

Abstract

This invention discloses a low stray inductance power component and a converter. In this low stray inductance power component, a first switching module and a second switching module, comprising multiple switching modules, are arranged in the switching wiring area of ​​the circuit board. A capacitor module is also arranged on one side of the switching wiring area. Each switching module includes several individual transistors, which cooperate to achieve a controllable switching function and form the input, output, and drive terminals of the switching module. The individual transistors are diodes, transistors, or MOSFETs. Furthermore, the sum of the circuit lengths from the two first switching modules to the capacitor module is less than the sum of the circuit lengths from the two second switching modules to the capacitor module. This low stray inductance power component can reduce the overall cost of the converter despite the high price of IGBT modules.

Description

Technical Field

[0001] This invention relates to the field of power components and converters, and more specifically to a low stray inductance power component and converter. Background Technology

[0002] Converters are widely used in power systems, rail transportation, military industry, petroleum machinery, new energy vehicles, wind power generation, solar photovoltaic and other fields. They can realize unidirectional or bidirectional conversion of electrical energy and have rectification and inversion functions. Among them, the NPC (Neutral Point Clamp) or ANPC (Active Neutral Point Clamp) three-level topology can use IGBT devices with low blocking voltage to increase the DC bus voltage, thereby increasing the AC output voltage and expanding the system power level. Therefore, it has been widely used in converters.

[0003] The main component of a converter is the power module, which primarily consists of a capacitor busbar and several switching transistors, typically IGBT modules. The rapid switching of these IGBT modules enables AC-DC conversion. However, the relatively high price of existing IGBT modules increases the overall cost of the converter. Summary of the Invention

[0004] The purpose of this invention is to overcome the aforementioned defects or problems in the prior art and to provide a low stray inductance power component and converter that can reduce the overall cost of the converter when the price of IGBT modules is high.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Technical Solution 1: A low stray inductance power component, comprising: a circuit board defining a plurality of switch wiring areas arranged along a first direction; a plurality of capacitor modules, each capacitor module corresponding one-to-one with each switch wiring area and located on a first side of its corresponding switch wiring area relative to the first direction; each switch wiring area is provided with two first switch modules and two second switch modules, the first switch modules comprising a first number of switch modules connected in parallel, and the second switch modules comprising a second number of switch modules connected in parallel; each switch module comprising a plurality of single transistors, each single transistor cooperating with each other to realize a controllable switching function, and forming an input terminal, an output terminal, and a driving terminal of the switch module; the single transistors are diodes, transistors, or MOSFETs; each switch module in each switch wiring area is connected to a corresponding capacitor module through a circuit on the circuit board, wherein the sum of the circuit lengths from the two first switch modules to the capacitor module is less than the sum of the circuit lengths from the two second switch modules to the capacitor module.

[0007] Technical Solution 2 is based on Technical Solution 1: In each switch wiring area, two second switch modules are arranged adjacent to each other, and two first switch modules are arranged along the first direction and located on both sides of the two second switch modules respectively.

[0008] Technical solution three is based on technical solution two: In the first switch module, each switch module is arranged sequentially along the second direction, which is perpendicular to the first direction.

[0009] Technical solution four is based on technical solution three: In the second switch module, each switch module is arranged sequentially along the second direction, and the two second switch modules in the wiring area of ​​each switch are arranged along the first direction.

[0010] Technical solution five is based on technical solution four: in each switch wiring area, two switch modules are arranged adjacently along the second direction; in the second switch module, some switch modules are arranged sequentially along the first direction, and the remaining switch modules are located between the two second switch modules.

[0011] Technical solution six is ​​based on technical solution five: within each switch wiring area, two first switch modules are arranged adjacent to each other along the first direction, and two second switch modules are arranged adjacent to each other along the first direction, and the two first switch modules are closer to the capacitor module corresponding to the switch wiring area than the two second switch modules.

[0012] Technical solution seven is based on technical solution four: in the first switch module and the second switch module, each switch module is arranged in a matrix.

[0013] Technical solution eight is based on technical solution seven: in each switch wiring area, two clamping modules are also provided; each clamping module includes at least one clamping diode and is connected to the first switch module, the second switch module and the capacitor module.

[0014] Technical solution nine is based on technical solution eight: each switch module is further provided with a drive connector, which is connected to the drive end of each switch module in the switch module it is located in, and is adapted to receive external signals to control the switching module to turn on or off.

[0015] Technical Solution 10: A converter comprising a low stray inductance power component as described in any one of Technical Solutions 1 to 9.

[0016] As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects:

[0017] In technical solution one, several switch wiring areas are defined on the circuit board. These switch wiring areas can be used to set switch modules. The switch modules include a first switch module and a second switch module. Both of them include a certain number of switch modules. The number of switch modules in the two can be the same or different. Each switch wiring area forms a commutation circuit through the cooperation of multiple switch modules and is connected to the capacitor module to realize the power conversion function of the power component. Each switching module consists of several individual transistors, functioning as an IGBT module. The combination of these semiconductor transistors enables the controllable switching function of the switching module. Each switching module forms its input, output, and drive terminals through the collector, emitter, and gate of the corresponding semiconductor transistor, facilitating external wiring. Furthermore, using individual semiconductor transistors to form the switching module is less expensive than using individual switching modules, effectively reducing the cost of the power component. The use of individual semiconductor transistors also provides a larger heat dissipation area, improving the heat dissipation efficiency of the power component. Additionally, the increased number of circuit connection points allows for easier fault location in case of a malfunction, and repairs can be completed simply by replacing the faulty semiconductor transistor, resulting in higher maintenance efficiency. Moreover, a single switching module includes multiple switching modules connected in parallel, reducing the stress on each module and its internal semiconductor transistors, making them less prone to damage.

[0018] However, combining individual semiconductor components to form a switching module can lead to a problem of high stray inductance in the power component commutation circuit. To address this, this technical solution designs the arrangement of each switching module so that the circuit length connecting the two first switching modules to the capacitor module is shorter than the circuit length connecting the two second switching modules to the capacitor module. This shortens the path from the commutation circuit to the capacitor module and reduces the stray inductance in the power component commutation circuit.

[0019] In technical solution two, two second switch modules are arranged adjacent to each other, and two other first switch modules are located on both sides of the two second switch modules. This can minimize the distance between each switch module, shorten the length of the commutation circuit between the four switch modules, reduce the overall stray inductance of the power component, and enable the power component to meet the stray inductance requirements during use.

[0020] In technical solution three, each switch module in the first switch module is arranged sequentially along the second direction, which facilitates the arrangement of the two first switch modules on the circuit board. At the same time, the two first switch modules can define a space between them, thus conveniently sandwiching the two second switch modules in the middle.

[0021] In technical solution four, each switch module in the second switch module is also arranged sequentially along the second direction, and the two second switch modules are also arranged along the first direction, so that the four switch modules form a layout arranged sequentially along the first direction, making the overall circuit components more regular and orderly, and the circuit connection more concise.

[0022] In technical solution five, some switch modules in two adjacent second switch modules arranged in the second direction are arranged sequentially along the first direction, and the remaining switch modules can be located between these switch modules arranged along the first direction. Of course, the remaining switch modules should be the same number or fewer as the switch modules arranged along the first direction, so that the arrangement of each switch module in the second switch module can be balanced. With this setting, the switch modules in the second switch module can be more concentrated, further shortening the commutation loop and reducing stray inductance.

[0023] In technical solution six, two first switch modules are arranged adjacent to each other along the first direction, and two second switch modules are also arranged adjacent to each other along the first direction, thereby forming a matrix-shaped layout. At the same time, the first switch modules are placed closer to the capacitor modules, making the circuit layout simpler, and the two first switch modules can have a shorter commutation path from the capacitor modules.

[0024] In technical solution seven, each switch module is also arranged in a matrix in each switch module, with a neat and orderly layout, simpler circuit connection, and reduced space occupation in the first direction, thus reducing the size of the circuit board.

[0025] In technical solution eight, a clamping module is set up, and the clamping diodes in the clamping module realize the NPC or ANPC type three-level commutation topology of the power component.

[0026] In technical solution nine, a drive connector is provided in the switch module. The drive connector is connected to the drive end of the switch module and can receive external control signals, which facilitates the on / off control of the switch module.

[0027] In technical solution ten, a converter is provided. This converter, by adopting the aforementioned low stray inductance power components, can effectively reduce manufacturing costs and has low circuit stray inductance, thus meeting the application requirements. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments are briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1A schematic diagram of a low stray inductance power component provided in an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of a three-level commutator circuit provided in an embodiment of the present invention. Figure 1 ;

[0031] Figure 3 A schematic diagram of a three-level commutator circuit provided in an embodiment of the present invention. Figure 2 ;

[0032] Figure 4 A schematic diagram of a three-level commutator circuit provided in an embodiment of the present invention. Figure 3 ;

[0033] Figure 5 This is a schematic diagram of a switch module provided in an embodiment of the present invention;

[0034] Figure 6 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 1 ;

[0035] Figure 7 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 2 ;

[0036] Figure 8 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 3 ;

[0037] Figure 9 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 4 ;

[0038] Figure 10 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 5 .

[0039] Explanation of key figure labels:

[0040] Circuit board 1; switch wiring area 2; first switch module 3; second switch module 4; switch module 5; input terminal 6; output terminal 7; drive terminal 8; capacitor module 9; drive connector 10; clamping module 11. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are preferred embodiments of the present invention and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0042] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and accompanying drawings of this invention is for distinguishing different objects and not for describing a specific order.

[0043] Unless otherwise expressly defined, in the claims, description, and accompanying drawings of this invention, the use of directional terms such as "center," "lateral," "longitudinal," "horizontal," "vertical," "top," "bottom," "inner," "outer," "upper," "lower," "front," "rear," "left," "right," "clockwise," and "counterclockwise" to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention.

[0044] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection by other means or components.

[0045] In the claims, description and accompanying drawings of this invention, the terms "comprising," "having," and variations thereof are used to mean "including but not limited to."

[0046] Example

[0047] Reference Figure 1 This embodiment provides a low stray inductance power component, which includes a circuit board 1 and electrical components disposed on the circuit board 1.

[0048] Specifically, the low stray inductance power component provided in this embodiment is used to achieve Figure 2 or Figure 3 The circuits shown are both inverter circuits used to convert DC input to AC output. Figure 2 It is a T-type three-level topology circuit. Figure 3 It is a type I three-level topology circuit. Figure 4 This is an ANPC type three-level topology circuit. (Refer to...) Figure 2 and Figure 3 It can be seen that both inverter circuits include four switching units, each consisting of a switching transistor T and a diode D. The switching units are numbered according to the transistor or diode number; for example, the switching unit corresponding to transistor T1 and diode D1 is switching unit number 1. (Refer to...) Figure 4 ,and Figure 2 and Figure 3 The difference lies in the fact that... Figure 2 and Figure 3 The two individually used diodes D in the circuit are replaced with a complete switching unit. In use, the switching on and off of each switching transistor is controlled by a drive control board to achieve various forms of AC output. This application method is a conventional technique in this technical field and will not be elaborated upon here. Typically, this switching transistor can be implemented using an IGBT module; however, IGBT modules are expensive, and their large-scale use would lead to excessively high manufacturing costs for this low stray inductance power component.

[0049] Therefore, the low stray inductance power component provided in this embodiment adopts the following solution:

[0050] The low stray inductance power component includes a circuit board 1 and a plurality of capacitor modules 9. The circuit board 1 defines a plurality of switch wiring regions 2 arranged along a first direction. Each switch wiring region 2 is provided with two first switch modules 3 and two second switch modules 4. The first switch modules 3 include a first number of switch modules 5 connected in parallel, and the second switch modules 4 include a second number of switch modules 5 connected in parallel. Each capacitor module 9 corresponds one-to-one with each switch wiring region 2 and is located on a first side of its corresponding switch wiring region 2 relative to the first direction. Furthermore, each switch module in each switch wiring region 2 is connected to its corresponding capacitor module 9 through circuits on the circuit board 1, wherein the sum of the circuit lengths from the two first switch modules 3 to the capacitor module 9 is less than the sum of the circuit lengths from the two second switch modules 4 to the capacitor module 9.

[0051] Among them, reference Figure 1 In this embodiment, the first direction refers to the left-right direction of the circuit board 1, the second direction refers to the up-down direction of the circuit board 1, and the first side relative to the first direction is the lower side of the circuit board 1. Therefore, each capacitor module 9 is located below the corresponding switch wiring area 2.

[0052] The switching module 5 includes several single transistors, which cooperate with each other to achieve a controllable switching function and form the input terminal 6, output terminal 7 and driving terminal 8 of the switching module 5; the single transistors are diodes, transistors or MOSFETs.

[0053] Specifically, refer to Figure 1 The electrical components in this power assembly include a switching module and a capacitor module 9, wherein the capacitor module 9 is... Figure 2 , Figure 3 or Figure 4 The capacitors C1, C2, C3, or C4 in the circuit shown represent the switching module. Figure 2 , Figure 3 or Figure 4 The circuit shown includes a switching unit, and according to the order of the switching units, the two first switching modules 3 correspond to switching units 1 and 4 respectively, and the two second switching modules 4 correspond to switching units 2 and 3 respectively. A switch wiring area 2 includes a set of... Figure 2 , Figure 3 or Figure 4 The circuit shown in the circuit board 1 includes a total of three sets of circuits for realizing the inversion of three-phase electricity.

[0054] The circuit board 1 is a conventional printed circuit board, and its substrate material can be glass fiber reinforced epoxy resin to improve the structural strength of the circuit board 1. A metal layer is covered on the surface of the circuit board 1, and circuit patterns can be formed on the metal layer through chemical etching or other methods to connect the electrical components thereon. Through the circuit board 1, the electrical components in the low stray inductance power assembly can be supported and connected through the circuit patterns on the circuit board 1. Therefore, the aforementioned switching module can be reliably installed, connected, and fixed to form a complete circuit system. In addition, the circuit board 1 can be a single-layer structure or a multi-layer structure. A multi-layer circuit board 1 can accommodate more circuits and arrange components more efficiently.

[0055] Each switch module includes multiple switch modules 5, each independently possessing a corresponding switching and conductive function. The parallel connection of multiple switch modules 5 enhances the stress resistance of the entire switch module. (Refer to...) Figure 5 Each switching module 5 includes a transistor, a MOSFET, and a diode. The drain of the MOSFET is connected in parallel to the base of the transistor and the cathode of the diode, and the source of the MOSFET is connected to the emitter of the transistor and the anode of the diode. Diode D1 serves as a freewheeling diode, providing a path for current to continue flowing when the circuit from the transistor to the MOSFET is broken in the switching module 5, preventing backflow current from the load inductor in the circuit and thus protecting the entire switching module 5 from damage. After forming the switching module 5 using the aforementioned semiconductor components, the collector and emitter of the transistor are used as the input terminal 6 and output terminal 7 of the switching module 5, while the gate of the MOSFET serves as the driving terminal 8 of the switching module 5. Figure 6 or Figure 7Each switching module 5 has its input terminal 6, output terminal 7, and drive terminal 8 connected to corresponding wiring points via etched circuits on the circuit board 1, facilitating wiring and maintenance. Using these semiconductor components to form IGBT modules results in lower costs compared to directly using IGBT modules, effectively reducing the cost of the power component. Furthermore, using individual semiconductor components provides a larger heat dissipation area for the entire switching module 5 compared to a single IGBT module, improving the heat dissipation efficiency of the power component. Simultaneously, the increased number of circuit connection points allows for easy identification of the fault point in case of a failure, and repairs can be completed simply by replacing the faulty semiconductor component, resulting in higher maintenance efficiency and reduced repair costs. Of course, in other embodiments, the specific type and connection method of each individual transistor within the switching module 5 can be adjusted according to actual needs, such as using only diodes and MOSFETs, or employing thyristors, etc.

[0056] At the same time, refer to Figure 6 When each switch module 5 is mounted on the circuit board 1, its input terminal 6, output terminal 7, and drive terminal 8 are arranged in parallel. Specifically, the main body of the semiconductor device in each switch module 5 can be mounted on the back of the circuit board 1, and the pins of each semiconductor device are inserted into the circuit board 1, forming corresponding solder joints on the front of the circuit board 1. The collector and emitter of the transistor and the gate of the MOSFET form three solder joints for each switch module 5. These three solder joints are arranged in parallel along a specific direction, which can be the arrangement direction of the three semiconductor devices in the switch module 5. Arranging the input terminal 6, output terminal 7, and drive terminal 8 of each switch module 5 in parallel facilitates the etching and connection of the wiring circuit on the circuit board 1, makes the circuit layout of each switch module 5 more regular, and also facilitates the integrated setup of the corresponding switch modules.

[0057] Reference Figure 6 Each switch wiring area 2 includes two first switch modules 3 and two second switch modules 4. Figure 6 In the embodiment shown, the first switch module 3 has 4 switch modules 5, and the second switch module 4 has 3 switch modules 5. Within their respective switch modules, these switch modules 5 are connected in parallel.

[0058] The sum of the circuit lengths from the two first switch modules 3 to their corresponding capacitor modules 9 is less than the sum of the circuit lengths from the two second switch modules 4 to their corresponding capacitor modules 9. This means that the distance between the two first switch modules 3 and their corresponding capacitor modules 9 in the connection circuit is shorter than that between the two second switch modules 4, thus shortening the commutation loop path and reducing stray inductance in the circuit. Each switch module 5 in the switch module is connected to the capacitor module 9 via circuits etched onto the circuit board 1. The layout and circuit arrangement of each switch module will be further explained below.

[0059] Reference Figure 6 This diagram illustrates a layout of a switch module. Within a switch wiring area 2, two second switch modules 4 are arranged adjacently, with two first switch modules 3 located on either side of the two second switch modules 4. Each switch module 5 in the two first switch modules 3 is arranged sequentially along a second direction, which is perpendicular to the first direction. Furthermore, within each switch wiring area 2, the input terminals 6, output terminals 7, and drive terminals 8 of the switch modules 5 belonging to different first switch modules 3 are oriented opposite to each other in the first direction. Additionally, the second switch modules 4 are arranged adjacently in the second direction, and within the two second switch modules 4, some switch modules 5 are arranged sequentially along the first direction, while the remaining switch modules 5 are located between the switch modules 5 arranged sequentially along the first direction within the two second switch modules 4.

[0060] Specifically, in Figure 6 In the illustrated embodiment, two first switch modules 3 are located at both ends in a first direction, and two second switch modules 4 are located at both ends in a second direction, with the two second switch modules 4 placed between the two first switch modules 3. Figure 6 Taking the direction shown as an example, the two first switch modules 3 are located on the left and right sides respectively, and the switch modules 5 within these two switch modules are arranged vertically. In the first switch module 3 on the left, the tube portion of the switch module 5 is on the right, and the wiring terminal portion is on the left. Similarly, in the second switch module 4 on the right, the tube portion of the switch module 5 is on the left, and the wiring terminal portion is on the right. This arrangement allows the wiring to the two first switch modules 3 to be placed on the left and right sides of the switch wiring area 2, without encroaching on the central space. At the same time, Figure 6In this configuration, each of the two second switch modules 4 contains three switch modules 5 arranged in an "L" shape. Taking the upper second switch module 4 as an example, two switch modules 5 are arranged along the first direction, with another switch module 5 located below them. The other second switch module 4 located at the lower side is similar. Similar to the arrangement of the first switch module 3, in the two second switch modules 4, the corresponding terminals of the switch modules 5 arranged along the first direction are also opposite to each other, thus avoiding excessive convergence during wiring. With this arrangement, the wiring of the first switch module 3 can be arranged on the side of the switch wiring area 2, leaving the middle of the switch wiring area 2 for the second switch module 4 to wire. This results in a clearer and simpler wiring layout, while shortening the commutation loop and reducing stray inductance.

[0061] Meanwhile, when arranging the circuits on the circuit board 1, the first switch module 3 located on the left needs to extend its circuit from the left side to the capacitor module 9, and the first switch module 3 located on the right needs to extend its circuit from the right side to the capacitor module 9. The second switch module 4 located on the lower side can directly extend its circuit downwards to the capacitor module 9, while the second switch module 4 located on the upper side needs to extend its circuit upwards before turning left or right and then downwards to the capacitor module 9. This arrangement ensures that the total circuit length of the two first switch modules 3 is less than the total circuit length of the two second switch modules 4, thereby reducing the length of the commutation loop. This allows the two first switch modules 3, which bear more current stress, to be closer to the capacitor module 9, reducing the current stress on the two first switch modules 3 and ensuring that the switch modules can operate normally.

[0062] Reference Figure 7 This illustrates another layout for the switch modules. Within a switch wiring area 2, two second switch modules 4 are arranged adjacently, with two first switch modules 3 located on either side of the two second switch modules 4. Each switch module 5 in the two first switch modules 3 is arranged sequentially along a second direction, which is perpendicular to the first direction. Simultaneously, within each switch wiring area 2, each switch module 5 in the second switch modules 4 is arranged sequentially along the second direction, and the two second switch modules 4 within each switch wiring area 2 are arranged along the first direction.

[0063] Specifically, in Figure 7In the illustrated embodiment, four switch modules are arranged sequentially along a first direction, and the switch modules 5 within each switch module are arranged sequentially along a second direction, thus forming four vertical columns. Specifically, the wiring terminals of the switch modules 5 in the first switch module 3 and the second switch module 4 located on the left face left, while the wiring terminals of the switch modules 5 in the first switch module 3 and the second switch module 4 located on the right face right. This arrangement ensures that the switch modules 5 of the four switch modules extend vertically and are arranged horizontally during wiring, preventing mutual interference and making wiring and maintenance more convenient.

[0064] Meanwhile, when arranging the circuits on the circuit board 1, the first switch modules 3 located on the left and right sides extend from the left and right sides to the capacitor module 9, respectively. The two second switch modules 4 located in the middle extend from the top to the left and right sides, respectively, and then extend downwards to the capacitor module 9.

[0065] Reference Figure 8 This illustrates another layout of the switch modules. Within a switch wiring area 2, two first switch modules 3 are arranged adjacent to each other along a first direction, and two second switch modules 4 are arranged adjacent to each other along the first direction, with the two first switch modules 3 being closer to the capacitor module 9 corresponding to the switch wiring area 2 than the two second switch modules 4.

[0066] Specifically, in Figure 8 In the embodiment shown, the four switch modules are arranged in a matrix and are located at the four corners of the switch wiring area 2. When designing the circuit, the two first switch modules 3 located at the bottom can be directly led down to the capacitor module 9, and the two second switch modules 4 located at the top can be led out to the left and right sides respectively and then turned down to extend to the capacitor module 9.

[0067] At the same time, Figure 8 In the layout shown, each switch module includes four switch modules 5, which are arranged in a matrix and will not interfere with each other during wiring.

[0068] In addition, in the above Figures 6 to 8 In the layout shown, each switching module is further provided with a drive connector 10, which is connected to the drive terminal 8 of each switching module 5 in the switching module it is located in, and is adapted to receive external signals to control the switching module 5 to turn on and off. The drive connector 10 is disposed on the circuit board 1 and is connected to the drive terminal 8 of each switching module 5 in the switching module it is located in through a circuit. An external drive control board can be connected to the drive connector 10 and transmit the pulse signal used to control the switching module 5 to the drive terminal 8 of the switching module 5 through the drive connector 10, thereby realizing the on and off control of the MOS transistor in the switching module 5.

[0069] Meanwhile, in this power assembly, each switch wiring area 2 is also equipped with two clamping modules 11, each clamping module 11 including at least one clamping diode. The wiring relationship between the clamping diode and other components can be referred to Figures 2 to 4 In the circuit shown, the clamping diodes are diodes D5 and D6. The clamping module 11 can perform functions such as midpoint potential balancing, clamping, freewheeling protection, and harmonic reduction, thereby improving the performance and reliability of the entire system.

[0070] Reference Figure 9 It shows a layout of clamping modules 11 in each switch wiring area 2. In this embodiment, two clamping modules 11 are arranged adjacent to each other along the second direction and are located in the middle of four matrix-arranged switch modules. This can shorten the length of the circuit connected to each switch module, thereby shortening the path of the commutation loop. The layout is also compact and can shorten the size of the switch wiring area 2 in the left and right directions.

[0071] Reference Figure 10 , and Figure 9 The difference is that the two clamping modules 11 are arranged adjacent to each other along the first direction, which can also shorten the length of the circuit connecting the clamping module 11 to each switching module, thereby shortening the path of the commutation circuit.

[0072] The low stray inductance power component provided in this embodiment defines several switch wiring areas 2 on the circuit board 1. These switch wiring areas 2 can be used to set switch modules. The switch modules include a first switch module 3 and a second switch module 4. Both include a certain number of switch modules 5. The number of switch modules 5 in the two can be the same or different. Each switch wiring area 2 forms a commutation circuit through the cooperation between multiple switch modules and is connected to the capacitor module 9 to realize the power component's conversion function. Each switching module 5 is formed by a transistor, a MOSFET, and a diode. The combination of these semiconductor components enables the function of an IGBT module. Each switching module 5 can form an input terminal 6, an output terminal 7, and a drive terminal 8 through the collector, emitter, and gate of the corresponding semiconductor component, facilitating external wiring. Furthermore, using these semiconductor components to form an IGBT module is less expensive than using a separate IGBT module, effectively reducing the cost of the power component. The use of individual semiconductor components provides a larger heat dissipation area for the entire switching module 5 compared to a single IGBT module, improving the heat dissipation efficiency of the power component. It also has more circuit connection points, making it easier to pinpoint the fault location in case of a failure, and repairs can be completed simply by replacing the faulty semiconductor component, resulting in higher inspection and repair efficiency. In addition, a switching module includes multiple switching modules 5 connected in parallel. Each switching module 5 and its internal semiconductor components experience lower stress and are less prone to damage. However, combining individual semiconductor components to form IGBT modules can lead to high stray inductance in the power component commutation circuit. To address this, this technical solution designs the arrangement of each switching module so that the circuit length connecting the two first switching modules 3 to the capacitor module 9 is shorter than the circuit length connecting the two second switching modules 4 to the capacitor module 9. This shortens the path from the commutation circuit to the capacitor module 9 and reduces the stray inductance in the power component commutation circuit.

[0073] Furthermore, this invention also provides a converter that includes the low stray inductance power component described above. Typically, the converter may also include a heat sink, which is disposed on the back of the low stray inductance power component and in contact with the pipe portions of each switching module 5, thereby dissipating heat from the switching modules 5, reducing their temperature, and ensuring the normal operation of the low stray inductance power component.

[0074] The foregoing description of the specifications and embodiments is intended to explain the scope of protection of this invention, but does not constitute a limitation on the scope of protection of this invention. Modifications, equivalent substitutions, or other improvements to the embodiments of this invention or a portion thereof that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of this invention or the foregoing embodiments, in conjunction with common knowledge, general technical knowledge, and / or existing technology, should all be included within the scope of protection of this invention.

Claims

1. A low stray inductance power component, characterized in that it comprises: The circuit board (1) defines a plurality of switch wiring areas (2) arranged along a first direction. Several capacitor modules (9) are provided, each capacitor module (9) corresponds to each switch wiring area (2) and is located on the first side of its corresponding switch wiring area (2) relative to the first direction. The first side relative to the first direction is the lower side of the circuit board (1). Each switch wiring area (2) is provided with two first switch modules (3) and two second switch modules (4). The first switch module (3) includes a first number of switch modules (5) connected in parallel, and the second switch module (4) includes a second number of switch modules (5) connected in parallel. The switching module (5) includes several single transistors, each of which cooperates with each other to achieve a controllable switching function and forms the input terminal (6), output terminal (7) and driving terminal (8) of the switching module (5); the single transistor is a diode, a transistor or a MOSFET; Each switch module in each switch wiring area (2) is connected to the corresponding capacitor module (9) through the circuit on the circuit board (1). The sum of the circuit lengths from the two first switch modules (3) to the capacitor module (9) is less than the sum of the circuit lengths from the two second switch modules (4) to the capacitor module (9).

2. The low stray inductance power component as described in claim 1, characterized in that, Within each switch wiring area (2), two second switch modules (4) are arranged adjacent to each other, and two first switch modules (3) are arranged along the first direction and located on both sides of the two second switch modules (4).

3. A low stray inductance power component as described in claim 2, characterized in that, In the first switch module (3), each switch module (5) is arranged sequentially along the second direction, which is perpendicular to the first direction.

4. A low stray inductance power component as described in claim 3, characterized in that, In the second switch module (4), each switch module (5) is arranged sequentially along the second direction, and the two second switch modules (4) in each switch wiring area (2) are arranged along the first direction.

5. A low stray inductance power component as described in claim 3, characterized in that, In each switch wiring area (2), two second switch modules (4) are arranged adjacent to each other along the second direction; in the second switch module (4), some switch modules (5) are arranged sequentially along the first direction, and the remaining switch modules (5) are located between the switch modules (5) arranged sequentially along the first direction in the two second switch modules (4).

6. A low stray inductance power component as described in claim 1, characterized in that, In each switch wiring area (2), two first switch modules (3) are arranged adjacent to each other along the first direction, and two second switch modules (4) are arranged adjacent to each other along the first direction. The two first switch modules (3) are closer to the capacitor module (9) corresponding to the switch wiring area (2) than the two second switch modules (4).

7. A low stray inductance power component as described in claim 6, characterized in that, In the first switch module (3) and the second switch module (4), each switch module (5) is arranged in a matrix.

8. A low stray inductance power component as described in any one of claims 1-7, characterized in that, Each switch wiring area (2) is also provided with two clamping modules (11); each clamping module (11) includes at least one clamping diode and is connected to the first switch module (3), the second switch module (4) and the capacitor module (9).

9. A low stray inductance power component as described in claim 8, characterized in that, Each switch module is also provided with a drive connector (10), which is connected to the drive end (8) of each switch module (5) in the switch module it is located in, and is adapted to receive external signals to control the switching module (5) to turn on and off.

10. A converter, characterized in that, Includes the low stray inductance power component as described in any one of claims 1-9.

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