Power converter
By configuring anti-damage components on the module housing of the power converter, covering vulnerable areas and guiding damaged parts to non-vulnerable areas, the problem of fragments scattering when the diode module is short-circuited is solved, thereby improving equipment reliability and cost-effectiveness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MITSUBISHI ELECTRIC CORP
- Filing Date
- 2022-04-06
- Publication Date
- 2026-05-26
AI Technical Summary
When the diode module of an existing power converter is short-circuited, the resulting fragments scatter, which reduces the reliability of external devices and increases costs and physical space requirements.
Damage-resistant components are installed on the module housing of the power converter to cover vulnerable areas and guide damaged parts to non-vulnerable areas, preventing debris from scattering.
It maintains the reliability of external devices of the power converter, avoids debris scattering, reduces costs, and simplifies the design and manufacturing process.
Smart Images
Figure CN118355596B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a power converter with rectification function. Background Technology
[0002] Power converters, such as transformers, have diode modules that integrate a diode bridge into a single package (module housing). If any diode within this module short-circuits, a short-circuit path is created through the short-circuited diode and the other diodes, resulting in a short circuit in two of the three AC (alternating current) phases. This causes a large current (short-circuit current) to flow within the diode module, leading to a rapid increase in internal temperature and pressure, ultimately damaging the module housing.
[0003] Typically, diode modules are filled with encapsulation materials such as silicone gel. When the diode module casing is damaged, the high-temperature encapsulation material is dispersed. Therefore, it is common practice to insert external protection devices (instantaneous fuses) in series with at least two of the three-phase AC inputs of the converter to prevent excessive current flow in the event of a short circuit in the diode module. However, this increases the cost of power converters and leads to a larger physical space requirement.
[0004] In order to address the short circuit within the diode module as described above, the semiconductor device described in Patent Document 1 has a fibrous reinforcing member wound around the outer periphery of the frame surrounding the semiconductor chip to prevent fragments of the components constituting the semiconductor device from flying out of the semiconductor device.
[0005] Patent Document 1: International Publication No. 2020 / 157960 Summary of the Invention
[0006] However, in the technology of the aforementioned Patent Document 1, in the event of damage such as fragments of the components constituting the diode module flying out of the module housing, the fragments will fly out of the power converter, such as the converter, resulting in a decrease in the reliability of the device located outside the power converter.
[0007] The present invention was made in view of the above circumstances, and its object is to provide a power converter that can maintain the reliability of devices configured externally to the power converter even in the event of damage such as the scattering of fragments of components constituting the diode module to the outside of the module housing.
[0008] To address the aforementioned issues and achieve the objective, the power converter of the present invention comprises: a diode module having a diode bridge with rectification function disposed within a module housing; and a main housing housing housing the diode module and having an opening in a portion of a first surface. In the power converter of the present invention, the module housing has a facing surface (opposing surface) and other outer wall surfaces (non-opposing surfaces) among its outer wall surfaces, and a damage-resistant member is disposed on at least one of the facing and non-opposing surfaces to prevent damage to the module housing. Furthermore, in the power converter of the present invention, when the damage-resistant member is disposed on the facing surface, the damage-resistant member is configured as a first damage-resistant member that completely covers the facing surface. When the damage-resistant member is disposed on a non-opposing surface, the non-opposing surface on which the damage-resistant member is disposed is the non-opposing surface with the largest area among the outer wall surfaces of the module housing, and the damage-resistant member is configured as a second damage-resistant member having a non-distribution area, where at least a portion of the area of the non-opposing surface that is farther from the center of the non-opposing surface than the first surface is not provided with the damage-resistant member.
[0009] The effects of the invention
[0010] The power converter according to the present invention has the effect that it can maintain the reliability of the device configured outside the power converter even in the event of damage such as the fragments of the components constituting the diode module flying out of the module housing. Attached Figure Description
[0011] Figure 1 This is a diagram showing the structure of the converter involved in Embodiment 1.
[0012] Figure 2 This is a diagram showing the structure of the diode module in the converter according to Embodiment 1.
[0013] Figure 3 This is a diagram illustrating other structural examples of the diode module included in the converter according to Embodiment 1.
[0014] Figure 4 This is a diagram showing the structure of the diode module in the converter according to Embodiment 2.
[0015] Figure 5 This is a diagram showing the structure of the diode module in the converter according to Embodiment 3.
[0016] Figure 6 This is a diagram illustrating another structural example of the diode module in the converter according to Embodiment 2.
[0017] Figure 7This is a diagram illustrating another structural example of the diode module in the converter according to Embodiment 3. Detailed Implementation
[0018] The power converter according to the embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0019] Implementation method 1.
[0020] Figure 1 This is a diagram illustrating the structure of the converter according to Embodiment 1. In the following description, two axes orthogonal to each other in a plane parallel to the upper surface of the converter 101, which is a power converter, are designated as the X-axis and Y-axis. An axis orthogonal to the X-axis and Y-axis is designated as the Z-axis. The main body housing 1 of the converter 101 is, for example, a cuboid, with its upper and bottom surfaces parallel to the XY plane. Furthermore, in the following description, the two side surfaces of the main body housing 1 are described as being parallel to the XZ plane, and the front and back surfaces are parallel to the YZ plane. Additionally, in the main body housing 1, the terms upper surface, bottom surface, side surface, front surface, and back surface are used for convenience in describing the various surfaces of the main body housing 1 and do not determine the actual orientation of the converter 101.
[0021] The converter 101 internally has one or more diode modules 4. The converter 101, for example, has a rectification function that converts three-phase AC to DC (Direct Current). Furthermore, the converter 101 can be configured within an inverter.
[0022] The converter 101 has a main body housing 1 and a heat sink 3 as an external component. Furthermore, the main body housing 1 has a slit 2 in a portion therein for exchanging internal and external gases within the converter 101. The slit 2 is an opening in the main body housing 1. Moreover, the shape of the opening in the main body housing 1 is not limited to a slit shape and can be any shape. A diode module 4 is housed within the main body housing 1 in the converter 101.
[0023] Each diode module 4 configured in the converter 101 houses a diode bridge in a frame (module housing 10 described later), and one side (bottom surface) of the module housing 10 is in physical contact with the heat sink 3.
[0024] The module housing 10 is, for example, a cuboid, with its top and bottom surfaces parallel to the XY plane. Additionally, two side surfaces of the module housing 10 are parallel to the XZ plane, and its front and back surfaces are parallel to the YZ plane. Furthermore, in the context of the module housing 10, the terms "top surface," "bottom surface," "side surface," "front surface," and "back surface" are used for ease of description and do not determine the actual orientation of the module housing 10.
[0025] In converter 101, diode module 4 is arranged such that the mounting surface (first surface) 15 of main housing slit 2 and the front surface of diode module 4 are opposite each other. That is, mounting surface 15 of main housing slit 2 is parallel to the YZ plane. When viewed from the front surface side of diode module 4, the side on the right is the right side and the side on the left is the left side.
[0026] Furthermore, the opposing surface of the outer wall of the cover module housing 10 that is opposite to the arrangement surface 15 of the main housing slit 2 is a surface with an angle of less than 90 degrees relative to the arrangement surface 15 of the main housing slit 2. The non-opposing surface that is not opposite to the arrangement surface 15 of the main housing slit 2 is a surface with an angle of greater than or equal to 90 degrees relative to the arrangement surface 15 of the main housing slit 2.
[0027] exist Figure 1 In the case of diode module 4 shown, the front surface of diode module 4 is the opposite surface to the configuration surface 15 of the main housing slit 2, and the other surfaces are non-opposing surfaces.
[0028] In converter 101, the orientation of diode module 4 relative to the slit 2 of the main housing is important. Figure 1 and what follows Figures 2 to 5 For ease of explanation, reference point 5 is shown on the upper surface of diode module 4. Reference point 5 is used to illustrate the orientation of diode module 4 relative to the slit 2 of the main housing. Reference point 5 is a point near the vertex that connects to the upper surface, right side, and back surface of diode module 4.
[0029] Diode module 4 has one or more diode bridges, which have rectification functions. Diode module 4 can be a module in which switching elements, commonly known as IGBT (Insulated Gate Bipolar Transistor) modules, and diode bridges are connected in parallel. Alternatively, diode module 4 can also be a module in which switching elements, commonly known as smart power modules, and diode bridges are connected in parallel, and circuitry is connected to drive the switching elements.
[0030] Figure 2 This is a diagram showing the structure of the diode module in the converter according to Embodiment 1. Diode module 4A is an example of diode module 4.
[0031] The diode module 4A has a damage-resistant member 6A on its outer wall portion. The damage-resistant member 6A is, for example, disposed on the surface with the largest area within the surface covering the diode module 4A (outer wall surface). Figure 2In this description, the upper surface 11 and the bottom surface of the module housing 10 of the diode module 4A are the surfaces with the largest area among the outer wall surfaces covering the diode module 4A. Furthermore, the surface with the largest area is the surface with the largest area when viewed from a direction parallel to the normal vector. That is, when there are multiple surfaces with the same area when viewed from a direction parallel to the normal vector, these multiple surfaces become the surface with the largest area.
[0032] exist Figure 2 The image shows a case where the anti-damage component 6A is disposed on the upper surface 11 of the module housing 10 of the diode module 4A. Furthermore, Figure 2 The diode module 4A is configured to be located within the converter 101 as follows: Figure 1 The diode module 4A is configured as follows. That is, the diode module 4A is configured within the converter 101 such that the front surface 12 of the module housing 10 faces the mounting surface 15 of the main housing slit 2. The reference point 5 is a point near the vertex 20 connecting the upper surface 11, right side surface 13, and back surface of the outer wall. That is, the reference point 5 is located on the upper surface 11 of the module housing 10 at a position away from the main housing slit 2. The front surface 12 of the outer wall of the module housing 10 is the facing surface opposite to the mounting surface 15 of the main housing slit 2; the other surfaces are non-facing surfaces. Additionally, the upper surface 11 of the outer wall of the module housing 10 is a non-facing mounting surface. If there are multiple surfaces of the module housing 10 where the area of the non-facing surface is the largest, the anti-damage member 6A can be configured on at least one of these surfaces.
[0033] The anti-damage component 6A is shaped to cover a portion of the upper surface 11 of the diode module 4A, but does not cover other parts (the non-configuration area 7A). The non-configuration area 7A is the area containing the reference point 5. Figure 2 The diagram illustrates the case where the non-configuration region 7A is a triangular region containing the reference point 5. The non-configuration region 7A is the area on the upper surface 11 of the module housing 10 that is farther from the configuration surface 15 than the center of the upper surface 11. That is, in Figure 2 In this illustration, the non-positioned region 7A is described as a triangular region including the reference point 5. However, the non-positioned region 7A can simply be a region that is far from the center of the upper surface 11 compared to the positioning surface 15 and where no anti-damage member 6A is positioned on the upper surface 11. The shape of the non-positioned region 7A can be, for example, a polygon or a circle. Furthermore, the reference point 5 is illustrated for ease of explanation, and the non-positioned region 7A does not necessarily need to include the reference point 5. In addition, the anti-damage member 6A is an example of a second anti-damage member.
[0034] The anti-damage component 6A is made of non-combustible material. The anti-damage component 6A may contain, for example, rigid material or adhesive. The anti-damage component 6A is configured to be in close contact with the upper surface 11 of the module housing 10, and to prevent or mitigate damage to the portion in contact with the module housing 10 when the diode module 4A attempts to break (crack) from the inside.
[0035] Furthermore, examples of rigid materials used as materials for the anti-damage component 6A include PBT (Poly Butylene Terephthalate), epoxy resin glass, etc., and examples of adhesives include polycarbonate, etc.
[0036] Furthermore, the anti-damage component 6A is designed to withstand impacts that could damage the diode module 4A, and therefore can be attached to the diode module 4A for fixation, or fixed to a part that will not be damaged even if the diode module 4A is damaged (e.g., Figure 1 (e.g., heat sink 3). Furthermore, the damage-resistant member 6A only needs to be configured to withstand impacts that could damage the diode module 4A. For example, the damage-resistant member 6A can be disposed within the main housing 1 of the converter 101, between a structural component of the converter 101 (not shown) and the diode module 4A, and fixed in place by being sandwiched between the structural component of the converter 101 and the diode module 4A.
[0037] like Figure 2 As shown, a damage-resistant member 6A is provided in the diode module 4A, so when the diode module 4A is damaged, the portion where the damage-resistant member 6A is provided will not be damaged. In other words, when the diode module 4A is damaged, the portion without the damage-resistant member 6A is damaged. For example, when the diode module 4A is damaged, the non-deployed area 7A is damaged. In Embodiment 1, the upper surface 11 covering the outer wall of the diode module 4A is the surface with the largest area, and is most susceptible to force from the inside of the module housing 10, making it most susceptible to damage. Moreover, by providing a portion on the upper surface 11 of the module housing 10 where the damage-resistant member 6A is provided and a non-deployed area 7A without the damage-resistant member 6A, a strength difference can be set between the surface with the largest area most susceptible to force from the inside of the module housing 10, and the damaged portion can be guided to the non-deployed area 7A.
[0038] As described above, in the diode module 4A, when the anti-damage member 6A is disposed on a non-opposing surface of the outer wall of the module housing 10, the non-opposing surface on which the anti-damage member 6A is disposed is the non-opposing surface with the largest area among the outer wall surfaces of the module housing 10, namely the upper surface 11 (non-opposing placement surface). Furthermore, in the diode module 4A, a portion of the area on the upper surface 11 where the anti-damage member 6A is disposed that is farther away from the placement surface 15 than the center of the upper surface 11 is called the non-placement area 7A.
[0039] In the diode module 4A of Embodiment 1, there are portions (non-distribution area 7A) without the anti-damage member 6A and portions with the anti-damage member 6A relative to the module housing 10. Therefore, when the diode module 4A is damaged, the damaged portion can be guided. That is, the diode module 4A can be guided to cause damage to the non-distribution area 7A in the module housing 10 without the anti-damage member 6A.
[0040] In embodiment 1, the non-configured area 7A of the module housing 10 of the diode module 4A, which does not have the anti-damage component 6A, is set away from the module housing 10. Figure 1 The non-configuration area 7A is a portion of the main housing slit 2 of the converter 101. Therefore, in the event of damage to the diode module 4A, it is possible to prevent damaging material from flying out of the converter 101 through the main housing slit 2. That is, the non-configuration area 7A is a region far from the configuration surface 15 of the main housing slit 2, thus preventing the encapsulation material filling the diode module 4A from flying out from the main housing slit 2 even if the diode module 4A is damaged.
[0041] Furthermore, the shape of the non-configuration area 7A, which does not have the anti-damage component 6A, can be set in various ways by the shape of the converter 101, the position of the main body housing slit 2 relative to the main body housing 1 of the converter 101, the shape of the main body housing slit 2, the position of the diode module 4A inside the converter 101, and the shape of the diode module 4A.
[0042] Figure 3 This diagram illustrates another structural example of the diode module included in the converter according to Embodiment 1. Diode module 4B is an example of diode module 4. Diode module 4B, like diode module 4A, is also included within the converter 101 as... Figure 1 It is configured like diode module 4.
[0043] Similar to diode module 4A, the upper surface 11 and bottom surface of module housing 10 of diode module 4B are the surfaces with the largest area covering the outer wall surface of diode module 4B.
[0044] like Figure 3As shown, compared to diode module 4A, diode module 4B, which is another structural example of diode module 4, has a damage-resistant member 6B instead of the damage-resistant member 6A. Like the damage-resistant member 6A, the damage-resistant member 6B contains a non-combustible rigid material or a non-combustible adhesive.
[0045] The anti-damage component 6B is composed of a rectangular plate-shaped part. The anti-damage component 6B is disposed on the mounting surface 15 side of the main housing slit 2, relative to the center of the upper surface 11 of the module housing 10 of the diode module 4B.
[0046] Furthermore, in diode module 4B, compared to diode module 4A, a non-configuration region 7B is provided instead of non-configuration region 7A. Non-configuration region 7B is a rectangular region. Like non-configuration region 7A, non-configuration region 7B includes reference point 5. Non-configuration region 7B is a region on the upper surface 11 of module housing 10 that is farther from the configuration surface 15 than the center of the upper surface 11. Like non-configuration region 7A, non-configuration region 7B can be any region that is farther from the configuration surface 15 than the center of the upper surface 11 and where no anti-damage member 6B is configured on the upper surface 11. The shape of non-configuration region 7B can be, for example, polygonal, circular, etc. Moreover, reference point 5 is illustrated for ease of explanation; non-configuration region 7B does not necessarily need to include reference point 5. Furthermore, anti-damage member 6B is an example of a second anti-damage member.
[0047] Furthermore, the shapes of diode modules 4A and 4B are not limited to cuboids; they can be prisms other than cuboids. In this case, diode modules 4A and 4B are arranged such that at least one face of the prism that does not have the largest area faces the arrangement face 15 of the main housing slit 2. Damage-resistant members are arranged on the upper surface 11 of diode modules 4A and 4B, and diode modules 4A and 4B have non-arrangement areas. In this case, the non-arrangement areas, like the non-arrangement areas 7A and 7B, are located on the opposite side of the arrangement face 15 of the main housing slit 2.
[0048] Here, a comparative diode module (hereinafter referred to as the comparator diode module) is described. The entire casing of the comparator diode module is covered by a damage-resistant component. In this comparator diode module, damage exceeding design specifications sometimes occurs. In the case of this comparator diode module, for example, the surface with the largest area is highly likely to be damaged by significant force. For example, the largest surface in the comparator diode module is the top surface. If the damage occurs near a slit in the main casing, fragments of the components constituting the comparator diode module may scatter outwards from the main casing slit to the outside of the converter. In this case, the reliability of devices located outside the converter decreases. Furthermore, implementing special construction to prevent damage to the comparator diode module complicates the design and manufacturing processes, thus reducing reliability and increasing manufacturing costs.
[0049] On the other hand, in Embodiment 1, the diode modules 4A and 4B are guided to areas where damage is less likely (non-configuration areas 7A and 7B), i.e., areas far from the main housing slit 2. Therefore, when diode modules 4A and 4B are damaged, fragments generated by the damage can be prevented from scattering to the outside of the converter 101. As described above, diode modules 4A and 4B are designed to withstand damage beyond their design specifications, and the damaged areas are guided to locations where fragments generated by the damage will not scatter to the outside of the converter 101. Furthermore, diode modules 4A and 4B themselves do not require special structures, thus avoiding complexity in the design and manufacturing processes and suppressing increases in manufacturing costs.
[0050] As described above, in Embodiment 1, considering the configuration within the converter 101 of the diode modules 4A and 4B, portions of the module housing 10 for the diode modules 4A and 4B are provided with anti-damage components 6A and 6B, and non-configuration areas 7A and 7B are provided without anti-damage components 6A and 6B. Therefore, the converter 101 can guide the damage site, exceeding the design intent of the diode modules 4A and 4B, to the non-configuration areas 7A and 7B.
[0051] Therefore, even in the event of damage such as fragments of components constituting diode modules 4A and 4B flying out of the diode modules 4A and 4B, converter 101 can reliably prevent fragments from flying out of converter 101. As a result, converter 101 can maintain the reliability of devices disposed outside converter 101 even if diode modules 4A and 4B are damaged.
[0052] Implementation method 2.
[0053] Next, use Figure 4 Embodiment 2 will be described. In Embodiment 2, a damage-resistant member is disposed on the front surface 12 of the module housing 10 of the diode module. Furthermore, in... Figure 4 From then on, the front surface 12 of the module housing 10 is omitted from the illustration.
[0054] Figure 4 This diagram illustrates the structure of the diode module included in the converter according to Embodiment 2. Diode module 4C is an example of diode module 4. Diode module 4C, like diode module 4A, is also configured to be located within the converter 101 as follows: Figure 1 It is configured like diode module 4.
[0055] Diode module 4C differs from diode modules 4A and 4B in that the front surface 12 of the module housing 10 (and) Figure 2 The front surface 12 of the diode module 4C is the surface with the largest area among the outer wall surfaces covering the diode module 4C. Furthermore, the front surface 12 of the diode module 4C is the opposing surface to the mounting surface (first surface) 15 of the main housing slit 2 of the converter 101. The diode module 4C is provided with a damage-resistant member 6C in such a way that it completely covers the front surface 12 (opposing surface) of the module housing 10. Like the damage-resistant member 6A, the damage-resistant member 6C contains a non-flammable rigid material or a non-flammable adhesive.
[0056] The anti-damage component 6C is configured to completely cover the front surface 12 of the module housing 10 of the diode module 4C. That is, there is no non-configured area on the front surface 12 of the module housing 10 of the diode module 4C. The anti-damage component 6C is an example of a first anti-damage component.
[0057] As described above, in Embodiment 2, the diode module 4C is arranged such that the front surface 12 of the module housing 10, where the anti-damage member 6C is disposed, and the placement surface 15 of the main housing slit 2 are opposite to each other. That is, in the diode module 4C, the surface of the outer wall of the module housing 10 that faces the placement surface 15 (the opposing surface, i.e., the front surface) has the largest area compared to the other outer wall surfaces (i.e., the non-opposing surfaces), therefore, the anti-damage member 6C to prevent damage to the module housing 10 is disposed on the opposing surface. Furthermore, the anti-damage member 6C is not disposed on the non-opposing surfaces of the outer wall of the module housing 10. Moreover, in the diode module 4C, the anti-damage member 6C may not be disposed on all non-opposing surfaces, or it may not be disposed on a portion of the non-opposing surfaces. That is, the anti-damage member 6C can be configured to not be disposed on at least a portion of the non-opposing surfaces.
[0058] As described above, the diode module 4C is provided with a damage-resistant member 6C that covers the entire front surface 12 of the module housing 10. Therefore, when the diode module 4C is damaged, the portion where the damage-resistant member 6C is provided will not be damaged. On the other hand, the surface of the outer wall of the diode module 4C other than the front surface where the damage-resistant member 6C is not provided may be damaged. That is, by providing the damage-resistant member 6C on the entire opposite surface, the diode module 4C can establish a strength difference with the non-opposite surface where the damage-resistant member 6C is not provided, and can guide the damaged part to the non-opposite surface that is not opposite to the slit 2 of the main housing.
[0059] Furthermore, the diode module 4C can be configured such that two surfaces of the module housing 10, namely the front surface and one side surface (e.g., the right side surface 13), are opposite to the arrangement surface 15 of the main housing slit 2. In this case, the entire front surface and the right side surface 13 of the module housing 10 of the diode module 4C become opposing surfaces, and the anti-damage member 6C is disposed on the entire front surface and the entire right side surface 13. For example, when the angle between the front surface 12 of the module housing 10 and the arrangement surface 15 of the main housing slit 2 is less than 90 degrees, and the angle between the right side surface 13 of the module housing 10 and the arrangement surface 15 of the main housing slit 2 is less than 90 degrees, the anti-damage member 6C is disposed on the front surface 12 and the right side surface 13 of the module housing 10.
[0060] Furthermore, the shape of the diode module 4C is not limited to a cuboid; it can be a prism other than a cuboid. In this case, the diode module 4C is also arranged such that at least one face of the prism faces the arrangement face 15 of the main housing slit 2, and a damage-resistant member is arranged on the opposite face of the diode module 4C that faces the arrangement face 15.
[0061] As described above, in Embodiment 2, considering the configuration within the converter 101 of the diode module 4C, a surface (front surface) with the anti-damage member 6C and a surface without the anti-damage member 6C are provided relative to the module housing 10 of the diode module 4C. Therefore, the converter 101 can guide the damaged portion of the diode module 4C to a surface other than the opposite surface of the module housing 10 when the diode module 4C is damaged.
[0062] Therefore, even in the event of damage such as fragments of components constituting diode module 4C flying out of diode module 4C, converter 101 can reliably prevent fragments from flying out of converter 101. As a result, converter 101 can maintain the reliability of devices configured externally even if diode module 4C is damaged.
[0063] Implementation method 3.
[0064] Next, use Figure 5 Embodiment 3 will be described. In Embodiment 3, a damage-resistant member larger than the front surface 12 is disposed on the front surface 12 of the module housing 10 of the diode module.
[0065] Figure 5 This diagram illustrates the structure of the diode module included in the converter according to Embodiment 3. Diode module 4D is an example of diode module 4. Diode module 4D, like diode module 4A, is also located within the converter 101. Figure 1 It is configured like diode module 4.
[0066] Similar to diode module 4C, diode module 4D has a front surface 12 (with) of module housing 10. Figure 2 The front surface 12 (the surface corresponding to the front surface) is the surface with the largest area among the outer wall surfaces covering the diode module 4D. Furthermore, the front surface of the diode module 4D is the opposing surface opposite to the arrangement surface (first surface) 15 of the main housing slit 2 of the converter 101. The diode module 4D is provided with a damage-resistant member 6D in such a way that it completely covers the front surface 12 (opposing surface) of the module housing 10. Like the damage-resistant member 6A, the damage-resistant member 6D contains a non-flammable rigid material or a non-flammable adhesive.
[0067] The area of the anti-damage member 6D is larger than the area of the front surface 12 of the module housing 10 of the diode module 4D. That is, the area of the side (back side) of the anti-damage member 6D opposite to the front surface 12 of the module housing 10 is larger than the area of the front surface 12 of the module housing 10. In other words, the area of the surface of the anti-damage member 6D that includes the region in contact with the opposing surface (front surface 12 of the module housing 10) of the diode module 4D is larger than the area of the front surface 12 of the module housing 10. Furthermore, the anti-damage member 6D is configured to completely cover the front surface 12 of the module housing 10 of the diode module 4D. That is, in the diode module 4D, there is no non-distributed area on the front surface 12 of the module housing 10. The anti-damage member 6D is an example of a first anti-damage member.
[0068] The portion of the anti-damage member 6D that does not contact the front surface 12 of the module housing 10 extends along the length direction of the main housing slit 2. That is, the anti-damage member 6D is positioned opposite the main housing slit 2. For example, the anti-damage member 6D protrudes beyond the non-opposing surface, i.e., the upper surface 11, which extends in a direction intersecting the opposing surface, i.e., the front surface 12, of the module housing 10 of the diode module 4D. When observing the interior of the converter 101 from the outside of the converter 101 via the main housing slit 2, the anti-damage member 6D is configured such that the diode module 4D is not visible. Furthermore, the anti-damage member 6D is not disposed on the non-opposing surfaces of the outer wall of the module housing 10. Moreover, in the diode module 4D, the anti-damage member 6D may not be disposed on all non-opposing surfaces, or it may not be disposed on a portion of the non-opposing surfaces. That is, the anti-damage member 6D can be configured to not be disposed on at least a portion of the non-opposing surfaces.
[0069] As described above, in Embodiment 3, considering the configuration within the converter 101 of the diode module 4D, a surface (front surface) with the anti-damage member 6D and a surface without the anti-damage member 6D are provided relative to the module housing 10 of the diode module 4D. Therefore, the converter 101 can guide the damaged portion of the diode module 4D to a surface other than the front surface when it is damaged.
[0070] In addition, the damage prevention component 6D has a portion that protrudes beyond the upper surface 11 of the module housing 10, thus preventing fragments from flying from the upper surface 11 of the module housing 10 to the outside of the converter 101 in the event of damage to the diode module 4D.
[0071] Therefore, even in the event of damage such as fragments of components constituting the diode module 4D flying out of the diode module 4D, the converter 101 can reliably prevent fragments from flying out of the converter 101. As a result, the converter 101 can maintain the reliability of devices configured externally even if the diode module 4D is damaged.
[0072] Furthermore, in embodiments 1 to 3, the anti-damage components 6C and 6D are first anti-damage components, and the anti-damage components 6A and 6B are second anti-damage components.
[0073] Here, variations of Embodiment 2 and Embodiment 3 will be described. Figure 6 This is a diagram illustrating another structural example of the diode module in the converter according to Embodiment 2. Figure 7 This is a diagram illustrating another structural example of the diode module in the converter according to Embodiment 3. Figure 6 The diode module 4C' shown is Figure 4 The diode module 4C shown is a modified example. Figure 7 The diode module 4D' shown is Figure 5 The example shown is a variation of the diode module 4D.
[0074] In embodiments 2 and 3 described above, the front surfaces of diode modules 4C and 4D, which are opposite surfaces, are described as having the largest area among their outer wall surfaces. As described above, anti-damage members 6C and 6D are disposed on the front surfaces. However, the anti-damage members 6C and 6D only need to be configured to completely cover the opposite surface of the main body housing 1 of the converter 101, which is opposite to the surface (first surface) where the main body housing slit 2 is provided. For example, ... Figure 6 and Figure 7 As shown, diode modules 4C' and 4D' can have a front surface where the opposing surface of the outer wall of module housing 10, which is opposite to the mounting surface (first surface) 15 of the main housing slit 2 of converter 101, is designated as the front surface. A non-opposing surface with the largest area extending in the direction intersecting the opposing surface (X direction) is designated as the upper surface 11. Damage-preventing members 6C' and 6D' are configured to completely cover the front surface, which has an area smaller than the upper surface 11. Alternatively, damage-preventing members 6C' and 6D' can be configured without being placed on the non-opposing surface including the upper surface 11. In this configuration, the damaged area is easily guided to the upper surface 11 with the largest area on the outer wall of module housing 10, achieving the same effect as embodiments 2 and 3 described above.
[0075] And, for example, Figure 7 As shown, the diode module 4D' is provided with a damage-resistant member 6D' that completely covers the front surface, which is smaller than the area of the upper surface 11. Similar to the damage-resistant member 6D described in Embodiment 3 above, the damage-resistant member 6D' protrudes beyond the upper surface 11 of the module housing 10 of the diode module 4D'. Furthermore, the damage-resistant member 6D' is not provided on the non-opposing surface including the upper surface 11. In the case described above, the upper surface 11, which has the largest area and is easily guided to the outer wall surface of the module housing 10, can further suppress the situation where fragments flying from the upper surface 11 of the module housing 10 fly to the outside of the converter 101 when the diode module 4D' is damaged.
[0076] In the above-described embodiment 1, anti-damage members 6A and 6B were provided on the non-opposing surfaces (upper surface 11) of the outer wall surface of the module housing 10, which are non-opposing surfaces and have the largest area. At least a portion of the area in which the diode modules 4A and 4B are located further away from the center of the non-opposing surface than the first surface (15) was described as having non-configuration areas 7A and 7B. However, the anti-damage members 6A and 6B can be provided on surfaces other than the non-opposing surfaces of the outer wall surface of the module housing 10, as long as they are non-opposing surfaces with the largest area among the non-opposing surfaces and at least a portion of the area in which the area is located further away from the center of the non-opposing surface than the first surface. For example, when the anti-damage members 6A and 6B are arranged on the non-opposing surfaces of diode modules 4A and 4B within the outer wall surface of the module housing 10, having the largest area on the non-opposing surfaces, the diode modules 4A and 4B, having non-configuration areas 7A and 7B in at least a portion of the area farther from the center of the non-opposing surfaces than the first surface, can be arranged to completely cover the front surface (opposing surface) smaller than the upper surface area of the opposing surface (the surface opposite to the configuration surface (first surface) 15 of the main housing slit 2 of the converter 101). In the case described above, the diode modules 4A and 4B can guide the damaged portion to the non-configuration areas 7A and 7B as described in Embodiment 1, and it is difficult to damage the opposing surface opposite to the configuration surface 15 of the main housing slit 2 of the converter 101. Furthermore, even if the diode modules 4A and 4B are damaged, the reliability of the device configured externally to the converter 101 can be further maintained.
[0077] In the above-described embodiment 3, the diode module 4D was described as having a damage-resistant member 6D that completely covers the front surface 12 of the module housing 10, and the damage-resistant member 6D protrudes beyond the upper surface 11 of the module housing 10. However, the damage-resistant member 6D' disposed on the front surface 12 of the module housing 10 can be configured such that the area of the surface including the region in contact with the opposing surface is larger than the area of the opposing surface, and it completely covers the front surface that serves as the opposing surface. For example, the diode module 4D' can be configured with the damage-resistant member 6D' that completely covers the front surface 12 of the module housing 10, and the damage-resistant member 6D' is configured to protrude beyond the upper surface 11 and two side surfaces of the module housing 10. In the case described above, even if the damaged part is guided to any part of the non-opposing surface where the damage-resistant member 6D' is not disposed, it is possible to further prevent fragments from the diode module 4D' from flying out of the converter 101 when the diode module 4D' is damaged.
[0078] The structure shown in the above embodiments is an example, and it can also be combined with other known technologies, and the embodiments can be combined with each other. Without departing from the spirit of the subject, some parts of the structure can be omitted or changed.
[0079] Explanation of the label
[0080] 1 Main housing, 2 Main housing slit, 3 Heat sink, 4, 4A~4D, 4C′, 4D′ diode modules, 5 Reference point, 6A~6D, 6C′, 6D′ anti-damage components, 7A, 7B Non-configuration areas, 10 Module housing, 11 Top surface, 12 Front surface, 13 Right side surface, 15 Configuration surface, 20 Vertex, 101 Converter.
Claims
1. A power converter, characterized in that, have: A diode module, which has a diode bridge with rectification function configured within the module housing; and The main housing, which houses the diode module, has an opening on a portion of its first surface. The module housing has an outer wall surface that faces the first surface (i.e., an opposing surface) and other outer wall surfaces (i.e., non-opposing surfaces). At least one of the opposing surface and the non-opposing surface is provided with a damage-resistant member to prevent damage to the module housing. When the anti-damage member is disposed on the opposing surface, the anti-damage member is disposed as a first anti-damage member that completely covers the opposing surface. When the anti-damage member is disposed on the non-opposing surface, the non-opposing surface on which the anti-damage member is disposed is the surface with the largest area among the outer wall surfaces of the module housing, and is any one of the plurality of non-opposing surfaces, i.e., a non-opposing configuration surface. The anti-damage member is disposed as a second anti-damage member, which has at least a portion of a region on the non-opposing configuration surface that is farther away from the center of the non-opposing configuration surface from the first surface where the anti-damage member is not disposed, and there is no non-disposition area other than the at least portion on the non-opposing configuration surface, forming a strength difference to guide the damage site.
2. The power converter according to claim 1, characterized in that, The damage prevention member is disposed on both the opposing surface and the non-opposing surface. When the second damage prevention member is disposed on the non-opposing surface, the first damage prevention member is disposed on the opposing surface, which has a smaller area than the non-opposing surface.
3. The power converter according to claim 1, characterized in that, When the first anti-damage member is disposed on the opposite surface, the first anti-damage member is configured such that the area of the surface including the region in contact with the opposite surface is greater than the area of the opposite surface and completely covers the opposite surface.
4. The power converter according to claim 1, characterized in that, The module housing has the opposing surfaces designated as the front surface, and the non-opposing surfaces among the outer wall surfaces designated as the upper surfaces extending in a direction intersecting the opposing surfaces. When the first anti-damage member is disposed on the opposite surface, the first anti-damage member protrudes from the upper surface of the outer wall surface of the module housing.
5. The power converter according to any one of claims 1 to 4, characterized in that, When the first anti-damage member is disposed on the opposite surface, the first anti-damage member comprises a non-combustible rigid material or a non-combustible adhesive.
6. The power converter according to claim 1, characterized in that, When the second anti-damage member is disposed on the non-opposite surface, the second anti-damage member comprises a non-combustible rigid material or a non-combustible adhesive.