Display panel and display device

Abstract

The present invention provides a display panel and a display device. By increasing the height of at least some of the multiple metal terminals of the bonding pads of a flexible circuit board from close to the driver chip to away from the driver chip, more space is left for the connection wiring between the metal terminals and the driver chip, meeting the wiring requirements, avoiding the short circuit between the multiple connection wirings caused by limited space for the connection wiring, and causing display abnormalities. At the same time, the metal terminals are prevented from being too close to the fan-out wiring area, thereby reducing impedance and improving display quality.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the technological development of full-screen displays, the screen-to-body ratio of displays is constantly increasing, and the bottom bezel of displays is getting smaller and smaller. However, the narrowing of the bottom bezel will directly lead to the compression of the space for setting driver chips, wiring or other components, resulting in limited space for wiring setting, which can easily cause adverse phenomena such as short circuits between multiple wiring.

[0003] like Figure 1 As shown, a conventional display panel 100 includes an array substrate 101. A flexible circuit board bonding pad 106 is provided on the glass substrate of the array substrate 101. The flexible circuit board bonding pad 106 includes a plurality of metal terminals 1061. Since a connecting trace 107 is required to electrically connect the flexible circuit board bonding pad 106 to the driver chip 105, a fan-out trace 108 is required to electrically connect the driver chip 105 to the display area 102 of the array substrate 101. Both the connecting trace 107 and the fan-out trace 108 compress the space for wiring within the lower frame of the array substrate 101. However, when the height of the metal terminals 1061 in the conventional technology is kept consistent, the space near the driver chip 105 is small. All the connecting traces 107 must pass through the space near the driver chip 105 to be electrically connected to the driver chip 105. As a result, the connecting traces 107 near the driver chip 105 are overcrowded, which may cause a short circuit and lead to display abnormalities.

[0004] Therefore, it is necessary to provide a new display panel and display device to solve the above technical problems. Summary of the Invention

[0005] The present invention provides a display panel and a display device, which solve the technical problem that when the sizes of metal terminals in the bonding pads of a flexible circuit board are kept consistent, the space for setting connecting wires between the metal terminals on the side close to the driver chip and the driver chip is limited, thereby causing undesirable phenomena such as short circuits between multiple connecting wires and causing display abnormalities.

[0006] To solve the above problems, the present invention provides the following technical solutions:

[0007] An embodiment of the present invention provides a display panel, including:

[0008] An array substrate, the array substrate comprising a display area and a non-display area arranged outside the display area;

[0009] A driving chip is disposed in the non-display area; and

[0010] A flexible circuit board bonding pad is provided in the non-display area and is located on at least one side of the driver chip, and a connecting trace is provided between the driver chip and the flexible circuit board bonding pad;

[0011] The flexible circuit board bonding pad includes a plurality of metal terminals, and the heights of at least some of the metal terminals increase from close to the driver chip to away from the driver chip.

[0012] In the display panel provided by the embodiment of the present invention, the at least part of the metal terminals is a first metal terminal group, and the plurality of metal terminals includes a second metal terminal group except the first metal terminal group.

[0013] In the display panel provided by the embodiment of the present invention, the metal terminals of the first metal terminal group are sequentially arranged from close to the driving chip to far away from the driving chip.

[0014] In the display panel provided by the embodiment of the present invention, the first metal terminal group is arranged on a side close to the driving chip.

[0015] In the display panel provided by the embodiment of the present invention, at least some of the metal terminals of the second metal terminal group are disposed between the plurality of metal terminals of the first metal terminal group.

[0016] In the display panel provided by the embodiment of the present invention, the height of each metal terminal of at least a portion of the second metal terminal group is equal to the height of any metal terminal of the first metal terminal group arranged adjacent thereto.

[0017] In the display panel provided by the embodiment of the present invention, the height of each metal terminal of at least a portion of the second metal terminal group is between the heights of the metal terminals of the first metal terminal group arranged adjacent thereto.

[0018] In the display panel provided by the embodiment of the present invention, the area of ​​each of the metal terminals is comparable or equal.

[0019] In the display panel provided by the embodiment of the present invention, the shapes of the plurality of metal terminals are polygonal and arc-shaped or a combination of one or more shapes.

[0020] In the display panel provided in an embodiment of the present invention, the non-display area includes a fan-out routing area, which is arranged between the display area and the driver chip, wherein the distance between the fan-out routing area and at least part of the metal terminal decreases from close to the driver chip to away from the driver chip.

[0021] In the display panel provided by the embodiment of the present invention, the display panel includes two flexible circuit board bonding pads, and the two flexible circuit board bonding pads are respectively arranged on two opposite sides of the driving chip.

[0022] In the display panel provided in an embodiment of the present invention, the display panel also includes a flexible circuit board, which includes a main body section and a first connecting section and a second connecting section respectively located on opposite sides of the main body section, and the first connecting section and the second connecting section are respectively connected to the flexible circuit board bonding pads.

[0023] An embodiment of the present invention provides a display device including the above-mentioned display panel.

[0024] The beneficial effects of the present invention are as follows: the display panel and display device provided by the present invention, by increasing the height of at least some of the multiple metal terminals of the flexible circuit board bonding pad from close to the driver chip to away from the driver chip, thereby leaving more space for the connection wiring between the metal terminals and the driver chip, meeting the wiring requirements, avoiding the limited space for setting the connection wiring and causing short circuits between multiple connection wirings, causing display abnormalities, and at the same time avoiding the metal terminals from being too close to the fan-out wiring area, so as to reduce impedance and improve display quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 is a schematic structural diagram of an existing display panel;

[0027] Figure 2 A schematic structural diagram of a display panel provided in the first embodiment of the present invention;

[0028] Figure 3A A schematic structural diagram of a first flexible circuit board bonding pad provided in Example 1 of the present invention;

[0029] Figure 3B A schematic structural diagram of a second flexible circuit board bonding pad provided in the first embodiment of the present invention;

[0030] Figure 3C A schematic structural diagram of a third flexible circuit board bonding pad provided in the first embodiment of the present invention;

[0031] Figure 3DA schematic structural diagram of a fourth flexible circuit board bonding pad provided in the first embodiment of the present invention;

[0032] Figure 3E A schematic structural diagram of a fifth flexible circuit board bonding pad provided in the first embodiment of the present invention;

[0033] Figure 4A A schematic diagram of the shape and structure of the metal terminal of the first flexible circuit board bonding pad provided in the first embodiment of the present invention;

[0034] Figure 4B A schematic diagram of the shape and structure of the metal terminal of the second flexible circuit board bonding pad provided in the first embodiment of the present invention;

[0035] Figure 5A A schematic structural diagram of a first flexible circuit board provided in Example 1 of the present invention;

[0036] Figure 5B A schematic structural diagram of a second flexible circuit board provided in the first embodiment of the present invention;

[0037] Figure 6 This is a structural diagram of a display device provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0038] The following descriptions of the embodiments are provided with reference to the accompanying drawings to illustrate specific embodiments in which the present invention may be implemented. Directional terms used herein, such as "up," "down," "front," "back," "left," "right," "inside," "outside," and "side," refer only to the directions in the accompanying drawings. Therefore, these directional terms are intended to illustrate and facilitate understanding of the present invention and are not intended to limit the present invention. In the drawings, similarly structured elements are denoted by the same reference numerals.

[0039] The embodiments of the present invention address the technical problem of display panels and display devices in the prior art. Because the metal terminals within the bonding pads of a flexible circuit board are uniform in size, the space for connecting wiring between the metal terminals near the driver chip and the driver chip is limited. This can cause short circuits between multiple connecting wirings, resulting in display abnormalities. This embodiment can address this problem.

[0040] Example 1

[0041] like Figure 2As shown, the display panel 200 provided by the embodiment of the present invention includes an array substrate 201 and a color filter substrate 202 arranged opposite to the array substrate. The array substrate 201 includes a display area 203 and a non-display area 204 arranged outside the display area 203. The non-display area 204 includes a driver chip 205 and a flexible circuit board bonding pad 206. The flexible circuit board bonding pad 206 is arranged on at least one side of the driver chip 205. A connecting trace 207 is provided between the driver chip 205 and the flexible circuit board bonding pad 206 for transmitting display signals.

[0042] The display area 203 and the driver chip 205 are both rectangular in shape. The length of the driver chip 205 is shorter than that of the display area 203. Furthermore, to minimize the height of the lower frame of the array substrate 201, the bottom of the flexible circuit board bonding pad 206 is flush with the bottom of the driver chip 205. It is understood that in other embodiments, the driver chip 205 may have other shapes, as long as the flexible circuit board bonding pad 206 is disposed on the side of the driver chip 205. For example, the bottom of the flexible circuit board bonding pad 206 may be lower or higher than the bottom of the driver chip 205.

[0043] The flexible circuit board bonding pad 206 includes a plurality of metal terminals, that is, the plurality of metal terminals are connected to the driver chip 205 through the plurality of connecting traces 207. Specifically, the height of at least some of the plurality of metal terminals increases from the direction close to the driver chip 205 to the direction away from the driver chip 205, wherein the at least some of the metal terminals are a first metal terminal group 206a, and the plurality of metal terminals include a second metal terminal group 206b in addition to the first metal terminal group 206a. The plurality of metal terminals of the first metal terminal group 206a are arranged continuously or discontinuously, such as Figure 2 The metal terminals of the first metal terminal group 206a are shown as being arranged sequentially from the direction closest to the driver chip 205 to the direction away from the driver chip 205, i.e., continuously arranged, and the first metal terminal group 206a is disposed on a side close to the driver chip 205. It will be appreciated that in other embodiments, the multiple metal terminals of the first metal terminal group 206a may also be arranged discontinuously, i.e., other metal terminals may be disposed between the multiple metal terminals of the first metal terminal group 206a, such as at least some of the metal terminals of the second metal terminal group 206b.

[0044] Compared with the prior art, since the metal terminals of the first metal terminal group 206a increase in number from close to the driver chip 205 to far away from the driver chip 205, the wiring space of the connecting wires 207 between the metal terminals of the first metal terminal group 206a and the driver chip 205 is greatly increased, thereby avoiding the situation where a short circuit occurs between multiple connecting wires 207 due to limited space for setting the connecting wires 207, causing display abnormalities.

[0045] It should be noted that the number of the multiple metal terminals is at least two. For the convenience of description, this embodiment is explained by taking the number of metal terminals in the flexible circuit board bonding pad 206 as 6 as an example, wherein the multiple metal terminals are arranged in sequence from close to the driver chip 205 to away from the driver chip 205, and the arrangement order is metal terminal 2061, metal terminal 2062, metal terminal 2063, metal terminal 2064, metal terminal 2065 and metal terminal 2066.

[0046] The multiple metal terminals included in the flexible circuit board bonding pad 206 may all be the first metal terminal group 206a; or, some of the multiple metal terminals may be the first metal terminal group 206a, and the rest may be the second metal terminal group 206b.

[0047] Specifically, in this embodiment, the plurality of metal terminals in the flexible circuit board bonding pad 206 are all the first metal terminal group 206a. Figure 3A As shown, that is, the height of the metal terminal 2061 is less than the height of the metal terminal 2062, less than the height of the metal terminal 2063, less than the height of the metal terminal 2064, less than the height of the metal terminal 2065, less than the height of the metal terminal 2066. Compared with the prior art, the wiring space of the connecting wire 207 between the metal terminal close to the driving chip 205 and the driving chip 205 is greatly increased, thereby avoiding the situation where a short circuit occurs between multiple connecting wires 207 due to limited space for setting the connecting wire 207, causing display abnormality.

[0048] In another embodiment, at least two metal terminals among the plurality of metal terminals are the first metal terminal group 206a, and the remaining metal terminals are the second metal terminal group 206b, wherein the first metal terminal group 206a includes at least two adjacently arranged metal terminals.

[0049] For example, the second metal terminal group 206b is located between the first metal terminal group 206a and the driver chip 205. Figure 3BAs shown, the first metal terminal group 206a includes a metal terminal 2064, a metal terminal 2065, and a metal terminal 2066, and the second metal terminal group 206b includes a metal terminal 2061, a metal terminal 2062, and a metal terminal 2063, wherein the height of the metal terminal 2064 is less than the height of the metal terminal 2065 and is less than the height of the metal terminal 2066. In order to increase wiring space, the heights of the metal terminals 2061, 2062, and 2063 are less than or equal to the height of the metal terminal 2064. Of course, in other embodiments, the heights of the metal terminals 2061, 2062, and 2063 may also be greater than the height of the metal terminal 2064.

[0050] For another example, the second metal terminal group 206b is located on both sides of the first metal terminal group 206a. Figure 3C As shown, the first metal terminal group 206a includes a metal terminal 2062, a metal terminal 2063 and a metal terminal 2064, and the second metal terminal group 206b includes a metal terminal 2061, a metal terminal 2065 and a metal terminal 2066, wherein the height of the metal terminal 2062 is less than the height of the metal terminal 2063 and is less than the height of the metal terminal 2064, and the height of the metal terminal 2061 is less than or equal to the height of the metal terminal 2062. In order to increase the wiring space, the height of the metal terminal 2065 and the metal terminal 2066 may be less than or equal to the height of the metal terminal 2064.

[0051] For another example, the second metal terminal group 206b is located on a side of the first metal terminal group 206a away from the driver chip 205. Figure 3D As shown, the first metal terminal group 206a includes a metal terminal 2061, a metal terminal 2062 and a metal terminal 2063, and the second metal terminal group 206b includes a metal terminal 2064, a metal terminal 2065 and a metal terminal 2066. The height of the metal terminal 2061 is less than the height of the metal terminal 2062 and is less than the height of the metal terminal 2063. In order to increase the wiring space, the heights of the metal terminal 2064, the metal terminal 2065 and the metal terminal 2066 may be less than or equal to the height of the metal terminal 2063.

[0052] Alternatively, at least two of the multiple metal terminals are the first metal terminal group 206a, and the remaining metal terminals are the second metal terminal group 206b, and at least some of the metal terminals of the second metal terminal group 206b are provided between the multiple metal terminals of the first metal terminal group 206a, wherein the height of each metal terminal of the at least some of the second metal terminal group 206b is equal to the height of any metal terminal of the first metal terminal group 206a arranged adjacent to it, or is between the heights of the metal terminals of the first metal terminal group 206a arranged adjacent to it.

[0053] For example, the first metal terminal group 206a may include at least two metal terminals arranged at intervals. Figure 3E As shown, the first metal terminal group 206a includes a metal terminal 2061, a metal terminal 2063, and a metal terminal 2065. The height of metal terminal 2061 is less than the height of metal terminal 2063, which is less than the height of metal terminal 2065. The second metal terminal group 206b includes a metal terminal 2062, a metal terminal 2064, and a metal terminal 2066. To increase wiring space, the height of metal terminal 2062 is equal to the height of metal terminal 2061, the height of metal terminal 2064 is equal to the height of metal terminal 2063, and the height of metal terminal 2066 is less than or equal to the height of metal terminal 2065. Of course, the height of metal terminal 2062 may also be between the heights of metal terminal 2061 and metal terminal 2063, and the height of metal terminal 2064 may also be between the heights of metal terminal 2063 and metal terminal 2065. In other embodiments, the number of metal terminals in the second metal terminal group 206b between metal terminal 2061 and metal terminal 2063 is not limited to one, but may also be multiple, and the present invention should not be limited to this.

[0054] Furthermore, the area of ​​each metal terminal remains comparable. Preferably, the area of ​​each metal terminal remains equal, and the area of ​​each metal terminal should not be too small to ensure the effective pressing area of ​​each metal terminal, thereby ensuring the stable connection of the signal contact point, and at the same time, the pressing impedance of the metal terminal can be kept unchanged to reduce the bonding impedance. Furthermore, since the height of the metal terminals in the first metal terminal group 206a increases from the direction close to the driver chip 205 to the direction away from the driver chip 205, the width of the metal terminals in the first metal terminal group 206a decreases from the direction close to the driver chip 205 to the direction away from the driver chip 205. Figure 3AFor example, the width of metal terminal 2061 is greater than the width of metal terminal 2062, greater than the width of metal terminal 2063, greater than the width of metal terminal 2064, greater than the width of metal terminal 2065, and greater than the width of metal terminal 2066. Generally, the height of each metal terminal ranges from 0.01 mm to 3 mm, and the width of each metal terminal ranges from 0.01 mm to 3 mm.

[0055] Furthermore, the shape of the plurality of metal terminals is one of a polygon and an arc, and the polygon can be a rectangle, a trapezoid, a pentagon, etc. For example, Figure 3A-Figure 3E As shown in FIG, the shape of the metal terminal is rectangular. Figure 4A As shown, the shape of the metal terminal in the flexible circuit board bonding pad 206 is a trapezoid, which is a regular trapezoid with a narrow top and a wide bottom, so that more wiring space can be left above the metal terminal for the connecting trace 207. For another example, the shape of the metal terminal in the flexible circuit board bonding pad 206 is an arc, which can be a rectangular, circular, elliptical, semicircular, or curved shape. Figure 4B As shown, the shape of the metal terminal is an ellipse. Of course, the shape of the metal terminal can also be other polygons or arcs, or one or more combinations of polygons and arcs, and the embodiment of the present invention should not be limited thereto.

[0056] Continue to refer Figure 2 The non-display area 204 also includes a fan-out routing area, which is arranged between the display area 203 and the driver chip 205. Specifically, the fan-out routing area includes a first fan-out routing 208 and a second fan-out routing 209. The first fan-out routing 208 connects the data line located in the display area 203 and the driver chip 205, and is used to transmit the data signal to the display area 203; the second fan-out routing 209 connects the scan line located in the display area 203 and the driver chip 205, and is used to transmit the scan signal to the display area 203. Among them, the second fan-out line 209 is a GOA line, and the second fan-out line 209 includes a parallel section located outside the display area 203 and parallel to the edge of the display area 203, and an inclined section located in the non-display area 204 and pointing to the driver chip 205. The inclined section of the second fan-out line 209 is connected to the driver chip 205 to input the scan signal, and the parallel section of the second fan-out line 209 is connected to the scan line to output the scan signal.

[0057] The distance between the fan-out routing area and the metal terminals in the first metal terminal group 206a decreases from closer to the driver chip 205 to farther away from it. This increases the space available for the connecting routing, preventing short circuits between multiple connecting routings 207 due to limited space for the connecting routings 207, which could lead to display anomalies. Furthermore, compared to the prior art, the distance between the metal terminals and the second fan-out routing 209 is significantly increased, freeing up more routing space for the connecting routings 207 and the second fan-out routing 209. This maximizes the use of limited routing space, avoids placing metal terminals too close to the second fan-out routing 209, and reduces impedance, thereby improving display quality. Since the space between the metal terminal and the folded line segment of the second fan-out trace 209 is the wiring area of ​​the connecting trace 207, the shape of the connecting trace 207 can also be designed to be a folded line, so that the wiring of the connecting trace 207 is more flexible, thereby effectively utilizing the space between the metal terminal and the second fan-out trace 209.

[0058] Generally, in order to evenly route all traces within the array substrate 201 , the array substrate 201 includes two identical flexible circuit board bonding pads 206 , and the two flexible circuit board bonding pads 206 are respectively arranged on opposite sides of the driver chip 205 and remain symmetrical with each other.

[0059] like Figure 5A As shown, accordingly, to cooperate with the use of the flexible circuit board bonding pads 206, the display panel 200 also includes a flexible circuit board 210. The flexible circuit board 210 is bonded to the non-display area 204 of the array substrate 201 via the multiple metal terminals within the flexible circuit board bonding pads 206. The multiple metal terminals transmit signals on the flexible circuit board 210 to the driver chip 205 via the connecting traces 207. Specifically, the flexible circuit board 210 is "Y"-shaped and includes a main body section 2101 and a first connecting section 2102 and a second connecting section 2103 located on opposite sides of the main body section 2101. The first connecting section 2102 and the second connecting section 2103 are respectively connected to the flexible circuit board bonding pads 206.

[0060] Furthermore, the first connecting section 2102 and the second connecting section 2103 are both provided with multiple connecting terminals (not shown in the figure), and the multiple connecting terminals are respectively arranged corresponding to the multiple metal terminals, wherein the number, size and shape of the connecting terminals and the metal terminals can be kept consistent to ensure that the connecting terminals can be fully fitted with the metal terminals, thereby ensuring effective signal transmission between the flexible circuit board 210 and the driving chip 205.

[0061] Preferably, if Figure 5B As shown, according to the arrangement structure of the metal terminals in the flexible circuit board driving pad 206, the shapes of the first connecting section 2102 and the second connecting section 2103 of the flexible circuit board 210 can be designed accordingly, that is, the height of the first connecting section 2102 and the second connecting section 2103 close to the driving chip 205 is lower, and the height of the first connecting section 2102 and the second connecting section 2103 away from the driving chip 205 is higher, which can reduce the area of ​​the flexible circuit board 210 and the space for the flexible circuit board 210 to be attached to the array substrate 201.

[0062] Example 2

[0063] like Figure 6 As shown, an embodiment of the present invention further provides a display device 10, comprising a display panel 200 and a backlight module 300 in one embodiment. The display device 10 can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a digital camera, etc. At the same time, the display device 10 has the technical effects of the display panel 200 in one embodiment, which will not be described in detail here.

[0064] The beneficial effects are as follows: the display panel and display device provided by the present invention gradually increase the height of at least some of the multiple metal terminals of the flexible circuit board bonding pads from close to the driver chip to away from the driver chip, thereby leaving more space for the connection wiring between the metal terminals and the driver chip, meeting the wiring requirements, avoiding the limited space for setting the connection wiring and causing short circuits between multiple connection wirings, causing display abnormalities, and at the same time avoiding the metal terminals from being too close to the fan-out wiring area, thereby reducing impedance and improving display quality.

[0065] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A display panel, characterized in that: include: array substrate; A driving chip is provided on the array substrate; A flexible circuit board bonding pad is provided on the array substrate and is located on at least one side of the driver chip; as well as A flexible circuit board includes a main body section and a first connecting section and a second connecting section located on opposite sides of the main body section, wherein the first connecting section and the second connecting section are respectively connected to the driver chip via the flexible circuit board bonding pads, and the flexible circuit board does not cover the driver chip; The flexible circuit board bonding pad includes a plurality of metal terminals, and the plurality of metal terminals include at least a first metal terminal group. The heights of the plurality of metal terminals in the first metal terminal group increase from close to the driver chip to away from the driver chip.

2. The display panel according to claim 1, wherein: The plurality of metal terminals further includes a second metal terminal group in addition to the first metal terminal.

3. The display panel according to claim 2, wherein: The second metal terminal group is located between the first metal terminal group and the driver chip; The heights of the metal terminals in the second metal terminal group are equal and less than or equal to the height of any metal terminal in the first metal terminal group.

4. The display panel according to claim 2, wherein: The first metal terminal group is located between the second metal terminal group and the driver chip; The heights of the metal terminals in the second metal terminal group are equal and greater than or equal to the height of any metal terminal in the first metal terminal group.

5. The display panel according to claim 2, wherein: The metal terminals in the first metal terminal group and the metal terminals in the second metal terminal group are arranged alternately one by one; The height of the metal terminal in the second metal terminal group is equal to the height of one of the metal terminals in the first metal terminal group that is arranged adjacent to the metal terminal.

6. The display panel according to claim 2, wherein: The metal terminals in the first metal terminal group and the metal terminals in the second metal terminal group are arranged alternately one by one; The height of the metal terminal in the second metal terminal group is between the heights of the two adjacent metal terminals in the first metal terminal group.

7. The display panel according to claim 2, wherein: The first metal terminal group is located between two adjacent metal terminals in the second metal terminal group; Among them, the height of the metal terminal in the second metal terminal group located on the side of the first metal terminal group close to the driver chip is equal to the height of the metal terminal in the first metal terminal group arranged adjacent to it, and the height of the metal terminal in the second metal terminal group located on the side of the first metal terminal group away from the driver chip is equal to the height of the metal terminal in the first metal terminal group arranged adjacent to it.

8. The display panel according to claim 1, wherein: The orthographic projection areas of each of the metal terminals on the array substrate are equal.

9. The display panel according to claim 1, wherein: The shapes of the plurality of metal terminals are polygonal and arc-shaped or a combination of one or more shapes.

10. The display panel according to claim 1, wherein The display panel includes a display area and a non-display area located at least on one side of the display area, and the driving chip and the flexible circuit board bonding pad are located in the non-display area; The display panel also includes a fan-out routing area, which is arranged between the display area and the driver chip; wherein, in the direction from the display area to the driver chip, the distance between the fan-out routing area and the first metal terminal group decreases from the direction close to the driver chip to the direction away from the driver chip.

11. The display panel according to claim 10, wherein: A side of the flexible circuit board bonding pad away from the display area is kept flush with a side of the driving chip away from the display area.

12. The display panel according to claim 1, wherein The display panel further includes a plurality of connection wires disposed on the array substrate, and the plurality of connection wires are correspondingly connected between the plurality of metal terminals and the driving chip.

13. The display panel according to claim 1, wherein The first connection section and the second connection section respectively include a plurality of connection terminals correspondingly connected to the plurality of metal terminals; The heights of the plurality of connection terminals correspondingly connected to the plurality of metal terminals in the first metal terminal group increase gradually from close to the main body section to away from the main body section.

14. The display panel according to claim 1, wherein The display panel includes two flexible circuit board bonding pads, and the two flexible circuit board bonding pads are respectively arranged on opposite sides of the driving chip; The first connecting section and the second connecting section are respectively connected to two flexible circuit board bonding pads in a one-to-one correspondence.

15. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 14.

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