SiP systems, SiP system manufacturing methods and electronic products

Abstract

This application provides a SiP system, a SiP system manufacturing method, and an electronic product. The SiP system includes a core SiP system, a WiFi SiP system, an antenna module, and an isolation component. A first surface is connected to the core SiP system, and the WiFi module is disposed between the first surface and a second surface. A sputtered antenna is disposed on the second surface and electrically connected to the core SiP system via a first connector. A first isolation portion is disposed between the WiFi module and the first connector. An isolation groove is provided between the WiFi module and the sputtered antenna, and a second isolation portion is disposed in the isolation groove and connected to the first isolation portion to isolate the WiFi module and the antenna module. The sputtered antenna and isolation component effectively reduce the stacking structure of the SiP system, ensuring its stability.

Description

Technical Field

[0001] This invention relates to the field of electronic product processing technology, and more specifically, to a SiP system, a SiP system manufacturing method, and an electronic product. Background Technology

[0002] In the existing technology, in order to meet the requirements of miniaturization and lightweighting of AR (Augmented Reality) modules, the core system part of the AR module is usually made into SiP (System in Package) to form a SiP system.

[0003] However, in current SiP systems, WiFi antennas are usually integrated into the WiFi part structure using onboard or external FPC (Flexible Printed Circuit) antennas, resulting in a large stacked structure and poor stability of the SiP system.

[0004] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] One object of the present invention is to provide a new technology solution for a SiP system, a SiP system manufacturing method, and electronic products.

[0006] According to a first aspect of the present invention, a SiP system is provided, wherein the SiP system comprises:

[0007] Core System SiP;

[0008] The WiFi SiP includes a first surface, a second surface, and a WiFi module. The first surface and the second surface are opposite sides of the WiFi SiP. The first surface is connected to the core system SiP, and the WiFi module is disposed between the first surface and the second surface.

[0009] An antenna module, comprising a sputtered antenna and a first connector, wherein the sputtered antenna is disposed on the second surface and is electrically connected to the core system SiP via the first connector;

[0010] An isolation component is provided, comprising a first isolation portion and a second isolation portion. The first isolation portion is disposed between the WiFi module and the first connector. An isolation groove is provided between the WiFi module and the sputtered antenna. The second isolation portion is disposed in the isolation groove and connected to the first isolation portion, for isolating the WiFi module and the antenna module.

[0011] Optionally, the isolation groove is trapezoidal.

[0012] Optionally, the material of the first isolation part includes at least one of nickel silver, 314 stainless steel and 316 stainless steel;

[0013] The material of the second isolation section is silver paste.

[0014] Optionally, the SiP system further includes a shielding portion that surrounds at least a portion of the WiFi module, and the shielding portion is connected to the second isolation portion.

[0015] Optionally, the material of the shielding part includes at least one of 314 stainless steel and 316 stainless steel.

[0016] Optionally, the material of the sputtered antenna includes at least one of 314 stainless steel and 316 stainless steel.

[0017] Optionally, the first connector is a copper pillar.

[0018] Optionally, the SiP system further includes a second connector for electrically connecting the WiFi module and the core system SiP.

[0019] Optionally, the SiP system further includes a flexible printed circuit board, which is electrically connected to the core SiP system.

[0020] According to a second aspect of the present invention, a method for manufacturing a SiP system is provided, applicable to a SiP system as described in any one of the first aspects, the method comprising:

[0021] Set up the first isolation unit on the WiFi SiP;

[0022] The WiFi SiP is encapsulated to form a second surface on the WiFi SiP;

[0023] An isolation groove is formed on the second surface, and the second isolation part is filled into the isolation groove so that the second isolation part is connected to the first isolation part.

[0024] Optionally, the SiP system manufacturing method further includes:

[0025] The second surface is sputtered to form a sputtered material layer;

[0026] Partial removal of the sputtered material layer is performed to form a shield and the sputtered antenna;

[0027] The isolation groove is created at the location where the sputtered material layer is removed.

[0028] According to a third aspect of the present invention, an electronic product is provided, wherein the product includes a SiP system as described in the first aspect.

[0029] According to an embodiment of the present invention, a SiP system is provided, comprising a core system SiP, a WiFi SiP, an antenna module, and an isolation component. The WiFi SiP includes a first surface, a second surface, and a WiFi module, wherein the first surface and the second surface are opposite sides of the WiFi SiP, the first surface is connected to the core system SiP, and the WiFi module is disposed between the first surface and the second surface. The antenna module includes a sputtered antenna and a first connector, the sputtered antenna is disposed on the second surface, and the sputtered antenna is electrically connected to the core system SiP through the first connector. The isolation component includes a first isolation portion and a second isolation portion, the first isolation portion being disposed between the WiFi module and the first connector. An isolation groove is provided between the WiFi module and the sputtered antenna, the second isolation portion is disposed in the isolation groove, and the second isolation portion is connected to the first isolation portion to isolate the WiFi module and the antenna module. By setting the sputtered antenna and the isolation component, the stacking structure of the SiP system is effectively reduced, ensuring the stability of the SiP system.

[0030] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0032] Figure 1 This is a schematic diagram of the structure of a SiP system in one embodiment of the present invention.

[0033] Figure 2 This is a flowchart of a SiP system manufacturing method in one embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Core System SiP; 2. WiFi SiP; 21. First Surface; 22. Second Surface; 23. WiFi Module; 231. Main Chip; 232. Auxiliary Circuit; 24. Isolation Groove; 3. Antenna Module; 31. Sputtered Antenna; 32. First Connector; 4. Isolation Assembly; 41. First Isolation Section; 42. Second Isolation Section; 5. Shielding Section; 6. Flexible Printed Circuit Board. Detailed Implementation

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0037] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0039] According to one embodiment of this application, a SiP system is provided, see [link to SiP system]. Figure 1 As shown, the SiP system includes a core system SiP1, a WiFi SiP2, an antenna module 3, and an isolation component 4. The WiFi SiP2 includes a first surface 21, a second surface 22, and a WiFi module 23. The first surface 21 and the second surface 22 are the WiFi... On opposite sides of SiP2, the first surface 21 is connected to the core system SiP1, and the WiFi module 23 is disposed between the first surface 21 and the second surface 22. The antenna module 3 includes a sputtered antenna 31 and a first connector 32. The sputtered antenna 31 is disposed on the second surface 22 and is electrically connected to the core system SiP1 through the first connector 32. The isolation component 4 includes a first isolation part 41 and a second isolation part 42. The first isolation part 41 is disposed between the WiFi module 23 and the first connector 32. An isolation groove 24 is provided between the WiFi module 23 and the sputtered antenna 31. The second isolation part 42 is disposed in the isolation groove 24 and is connected to the first isolation part 41 to isolate the WiFi module 23 and the antenna module 3.

[0040] Specifically, such as Figure 1As shown in the embodiments of this application, the core system SiP1 is a highly integrated module that encapsulates the core system components using SiP, and the WiFi SiP2 is a highly integrated WiFi module that encapsulates the WiFi components using SiP. The core system SiP1 includes a display, sensors, a computing platform, an interactive interface, network connectivity, and a rendering engine. The WiFi SiP2 includes a first surface 21 and a second surface 22, with the first surface 21 connected to the core system SiP1. After the WiFi SiP2 is connected to the core system SiP1, a mold surface for the WiFi SiP2 is formed on the side of the WiFi SiP2 facing away from the core system SiP1; this mold surface is the second surface 22. The second surface 22 can be used to form a sputtered antenna 31 using a sputtered antenna pattern, and the sputtered antenna 31 is connected to the core system SiP1 via a first connector 32.

[0041] Therefore, this embodiment of the application, by making the core system part and the WiFi part into a modular SiP, and forming the sputtered antenna 31 on the mold surface of the formed WiFi SiP2, allows the sputtered antenna 31 to be built into the WiFi SiP2. This effectively reduces the stacked structure size of the SiP system in this embodiment of the application, lowers the package height, and compared to the traditional method of integrating the WiFi part with onboard or external FPC antennas, greatly saves the size and area of ​​the core circuit of the SiP system. This makes the ID (Industrial Design) of electronic products including the SiP system more flexible and aesthetically pleasing, and more conducive to the promotion and use of electronic products.

[0042] Furthermore, to further prevent the sputtered antenna 31 built into the WiFi SiP2 from affecting the performance of the WiFi module 23 of the WiFi SiP2, thus causing poor stability of the SiP system, this embodiment of the application also provides an isolation component 4 between the WiFi module 23 and the antenna module 3. The isolation component 4 includes a first isolation part 41 and a second isolation part 42. The first isolation part 41 is disposed between the WiFi module 23 and the first connector 32. An isolation groove 24 is provided between the WiFi module 23 and the sputtered antenna 31. The second isolation part 42 is disposed in the isolation groove 24 and is connected to the first isolation part 41. Thus, through the setting of the first isolation part 41 and the second isolation part 42, the WiFi module 23 and the antenna module 3 are effectively isolated, greatly ensuring the working stability and reliability of the WiFi module 23 and significantly improving the stability of the SiP system.

[0043] System-on-Package (SiP) is an advanced electronic packaging technology that integrates multiple electronic components and functions into a single package to form a complete system. For example, SiP can integrate multiple chips and passive components into a single package, reducing the physical distance between components to effectively lower the overall module's power consumption and increase its integration density. Furthermore, SiP can employ various packaging forms, including BGA (Ball Grid Array), WLP (Wafer Level Package), and 3D-IC (Three-dimensional integrated circuit) stacking, broadening its applicability. Moreover, SiP can reduce the number of external components, effectively simplifying PCB (Printed Circuit Board) design and significantly reducing overall costs. Additionally, SiP contributes to the miniaturization of electronic devices, meeting the demands for miniaturization and lightweight electronic products.

[0044] Optionally, the isolation groove 24 is trapezoidal.

[0045] Specifically, such as Figure 1 As shown, the WiFi module 23 described in this embodiment includes a main chip 231 and an auxiliary circuit 232, with the mounting surfaces of the main chip 231 and the auxiliary circuit 232 located on the same plane. The first isolation portion 41 is a metal shield, which covers at least a portion of the auxiliary circuit 232 to isolate the auxiliary circuit 232 from the first connector 32.

[0046] Therefore, to further isolate the WiFi module 23 from the sputtered antenna 31, this embodiment of the application also provides an isolation groove 24 facing the first surface 21 on the second surface 22. The bottom of the isolation groove 24 is located on the side of the first isolation part 41 facing the second surface 22, so that after the second isolation part 42 is placed in the isolation groove 24, the second isolation part 42 can be connected to the first isolation part 41, thereby better achieving isolation between the WiFi module 23 and the antenna module 3.

[0047] In this embodiment, the isolation groove 24 is trapezoidal, which effectively ensures the molding quality of the second isolation part 42 and improves the stability and reliability of the SiP system.

[0048] Of course, while ensuring the molding quality of the second isolation section 42, the isolation groove 24 can also be set as a rectangle or a triangle. Those skilled in the art can choose according to actual needs, and this application does not impose specific restrictions here.

[0049] Optionally, the material of the first isolation part 41 includes at least one of nickel silver, 314 stainless steel and 316 stainless steel; the material of the second isolation part 42 is silver paste.

[0050] Specifically, in this embodiment of the application, by setting the material of the first isolation part 41 to any one of nickel silver, 314 stainless steel and 316 stainless steel, the isolation effect of the first isolation part 41 is effectively guaranteed and the manufacturing cost of the first isolation part 41 is significantly reduced.

[0051] Of course, in this application embodiment, any combination of two or three of nickel silver, 314 stainless steel and 316 stainless steel can be selected to manufacture the first isolation part 41. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions here.

[0052] Furthermore, this embodiment of the application also sets the material of the second isolation portion 42 to silver paste, so that the isolation effect of the second isolation portion 42 can be more effectively guaranteed when molding the second isolation portion 42.

[0053] Optionally, the SiP system further includes a shielding part 5, which surrounds at least a portion of the WiFi module 23 and is connected to the second isolation part 42.

[0054] Specifically, such as Figure 1As shown, in this embodiment of the application, the shielding part 5 can cover the outer surface of the WiFi SiP2 to completely surround the WiFi module 23; or, the shielding part 5 can cover at least a portion of the outer surface of the WiFi SiP2 to surround at least a portion of the WiFi module 23.

[0055] Furthermore, by connecting the shielding part 5 to the second isolation part 42, the isolation between the WiFi module 23 and other modules is effectively achieved, further ensuring the working stability and reliability of the WiFi module 23.

[0056] Optionally, the material of the shielding part 5 includes at least one of 314 stainless steel and 316 stainless steel.

[0057] Specifically, in this embodiment of the application, by setting the material of the shielding part 5 to either 314 stainless steel or 316 stainless steel, the isolation effect of the shielding part 5 is effectively guaranteed, and the manufacturing cost of the shielding part 5 is significantly reduced.

[0058] Of course, in this application embodiment, a combination of 314 stainless steel and 316 stainless steel can also be selected to manufacture the shielding part 5. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions here.

[0059] Optionally, the material of the sputtered antenna 31 includes at least one of 314 stainless steel and 316 stainless steel.

[0060] Specifically, since 314 stainless steel and 316 stainless steel have excellent corrosion resistance and high temperature resistance, high strength, good plasticity and weldability, and strong electromagnetic compatibility, manufacturing the sputtered antenna 31 with 314 stainless steel and 316 stainless steel can effectively ensure the stability and reliability of the sputtered antenna 31 and make the sputtered antenna 31 have a long service life.

[0061] Furthermore, since both the shielding portion 5 and the sputtered antenna 31 described in this application embodiment can be manufactured using at least one of 314 stainless steel and 316 stainless steel, and both the shielding portion 5 and the sputtered antenna 31 can be disposed on the second surface 22, this application can use the sputtering method to simultaneously form the shielding portion 5 and the sputtered antenna 31, thereby effectively improving the manufacturing efficiency of the SiP system and reducing the manufacturing cost of the SiP system.

[0062] In addition, the use of sputtering to form the shielding part 5 and the sputtered antenna 31 in this application can significantly enhance the forming quality of the shielding part 5 and the sputtered antenna 31, making the structure of the shielding part 5 and the sputtered antenna 31 more uniform, dense, robust and reproducible, thereby further improving the performance of the SiP system.

[0063] Optionally, the first connector 32 is a copper pillar.

[0064] Specifically, by setting the first connector 32 to a copper pillar, the stability and reliability of the first connector 32 can be effectively improved, and the manufacturing cost of the first connector 32 can be reduced.

[0065] When the first connector 32 is a copper pillar, the first connector 32 can be mounted on the WiFi SiP2 using SMT (Surface-Mounted Technology), thereby significantly reducing the size of the SiP system and giving the SiP system better component density, significantly improving assembly efficiency and consistency, and reducing manufacturing costs.

[0066] Of course, the first connector 32 can also be a POP (Package on Package) structure. Those skilled in the art can choose according to actual needs, and this application does not impose specific restrictions here.

[0067] Optionally, the SiP system further includes a second connector for electrically connecting the WiFi module 23 and the core system SiP1.

[0068] Specifically, in this application embodiment, the second connector can be a copper pillar or an interposer board (adapter board) to effectively improve the connection performance between the WiFi module 23 and the core system SiP1, and to make the SiP system have higher integration and smaller footprint.

[0069] Optionally, the SiP system further includes a flexible printed circuit board 6, which is electrically connected to the core system SiP1.

[0070] Specifically, such as Figure 1 As shown, the core system SiP1 described in this embodiment can be connected to external circuits through the flexible printed circuit board 6, thereby further improving the performance of the SiP system.

[0071] According to another embodiment of this application, a method for manufacturing a SiP system is provided, applied to the SiP system described in the embodiment of this application, the manufacturing method comprising:

[0072] S101, A first isolation unit 41 is set on WiFi SiP2;

[0073] S102, Encapsulate the WiFi SiP2 to form a second surface 22 on the WiFi SiP2;

[0074] S103, an isolation groove 24 is formed on the second surface 22, and the second isolation part 42 is filled into the isolation groove 24 so that the second isolation part 42 is connected to the first isolation part 41.

[0075] Specifically, in step S101, this embodiment of the application provides the first isolation part 41 to the WiFi SiP2, and the first isolation part 41 covers at least part of the auxiliary circuit 232, so that the first isolation part 41 can isolate the auxiliary circuit 232 from the first connector 32.

[0076] The first isolation part 41 can be a metal shield, and the material of the first isolation part 41 can include at least one of nickel silver, 314 stainless steel and 316 stainless steel.

[0077] In step S102, the WiFi SiP2 is encapsulated with an encapsulation material in this embodiment of the application, such that a mold surface of the WiFi SiP2 is formed on the side of the WiFi SiP2 away from the core system SiP1, and the mold surface of the WiFi SiP2 is the second surface 22.

[0078] In step S103, this embodiment of the application opens an isolation groove 24 facing the first surface 21 on the second surface 22. The bottom of the isolation groove 24 is located on the side of the first isolation part 41 facing the second surface 22, so that after the second isolation part 42 is filled into the isolation groove 24, the second isolation part 42 can be connected to the first isolation part 41, thereby better realizing the isolation between the WiFi module 23 and the antenna module 3.

[0079] The isolation groove 24 can be trapezoidal, and the material of the second isolation part 42 can be silver paste.

[0080] Optionally, the SiP system manufacturing method further includes:

[0081] A1, sputtering is performed on the second surface 22 to form a sputtering material layer;

[0082] A2, partially remove the sputtered material layer to form the shielding part 5 and the sputtered antenna 31;

[0083] A3, the isolation groove 24 is opened at the location where the sputtered material layer is removed.

[0084] Specifically, in step A1, the present application embodiment may use sputtering to deposit the sputtering material layer, and the material of the sputtering material layer may include at least one of 314 stainless steel and 316 stainless steel.

[0085] In step A2, this embodiment of the application may use a laser etching process to partially remove the sputtered material layer to form the shielding part 5 and the sputtered antenna 31.

[0086] In step A3, in this embodiment of the application, the isolation groove 24 can be formed at the location where the sputtered material layer is removed using a laser etching process.

[0087] Optionally, the method further includes the following steps before step S101:

[0088] S100, the WiFi SiP2 is set in the core system SiP1.

[0089] Specifically, in this embodiment, two Interposer boards are disposed between the first surface 21 of the WiFi SiP2 and the core system SiP1, so that the two Interposer boards can connect the WiFi SiP2 and the core system SiP1, thereby effectively reducing the stacking structure size of the SiP system and reducing the height of the SiP system package size.

[0090] According to another embodiment of this application, an electronic product is provided, including the SiP system as described in the embodiments of this application.

[0091] Specifically, the electronic products described in the embodiments of this application can be smart glasses (such as AR / VR glasses), head-mounted devices, displays, or headphones, etc.

[0092] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0093] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A SiP system, characterized in that, include: Core System SiP (1); WiFi SiP (2), the WiFi SiP (2) includes a first surface (21), a second surface (22) and a WiFi module (23), the first surface (21) and the second surface (22) are opposite sides of the WiFi SiP (2), the first surface (21) is connected to the core system SiP (1), and the WiFi module (23) is disposed between the first surface (21) and the second surface (22); Antenna module (3), the antenna module (3) includes a sputtered antenna (31) and a first connector (32), the sputtered antenna (31) is disposed on the second surface (22), and the sputtered antenna (31) is electrically connected to the core system SiP (1) through the first connector (32); An isolation component (4) includes a first isolation part (41) and a second isolation part (42). The first isolation part (41) is disposed between the WiFi module (23) and the first connector (32). An isolation groove (24) is provided between the WiFi module (23) and the sputtered antenna (31). The second isolation part (42) is disposed in the isolation groove (24) and is connected to the first isolation part (41) to isolate the WiFi module (23) and the antenna module (3). Two Interposer boards are positioned between the first surface (21) of the WiFi SiP (2) and the core system SiP (1).

2. The SiP system according to claim 1, characterized in that, The isolation groove (24) is trapezoidal.

3. The SiP system according to claim 1, characterized in that, The material of the first isolation part (41) includes at least one of nickel silver, 314 stainless steel and 316 stainless steel; The material of the second isolation part (42) is silver paste.

4. The SiP system according to claim 1, characterized in that, The SiP system further includes a shield (5) that surrounds at least a portion of the WiFi module (23) and is connected to the second isolation part (42).

5. The SiP system according to claim 4, characterized in that, The material of the shielding part (5) includes at least one of 314 stainless steel and 316 stainless steel.

6. The SiP system according to claim 1, characterized in that, The material of the sputtered antenna (31) includes at least one of 314 stainless steel and 316 stainless steel.

7. The SiP system according to claim 1, characterized in that, The first connector (32) is a copper pillar.

8. The SiP system according to claim 1, characterized in that, The SiP system also includes a second connector for electrically connecting the WiFi module (23) and the core system SiP (1).

9. The SiP system according to claim 1, characterized in that, The SiP system also includes a flexible printed circuit board (6), which is electrically connected to the core system SiP (1).

10. A method for manufacturing a SiP system, applied to the SiP system as described in any one of claims 1-9, characterized in that, The SiP system manufacturing method includes: A first isolation unit (41) is set on the WiFi SiP (2); The WiFi SiP (2) is encapsulated to form a second surface (22) on the WiFi SiP (2); An isolation groove (24) is formed on the second surface (22), and a second isolation part (42) is filled in the isolation groove (24) so ​​that the second isolation part (42) is connected to the first isolation part (41).

11. The SiP system manufacturing method according to claim 10, characterized in that, The SiP system manufacturing method further includes: The second surface (22) is sputtered to form a sputtered material layer; The sputtered material layer is partially removed to form a shield (5) and the sputtered antenna (31). The isolation groove (24) is opened at the location where the sputtered material layer is removed.

12. An electronic product, characterized in that, Including the SiP system as described in any one of claims 1-9.

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