A transient thermal radiation interface reflectivity measurement system and method

Abstract

The present application belongs to the field of shock wave physics technology, and in particular, relates to a transient thermal radiation interface reflectivity measurement system and method. The transient thermal radiation interface reflectivity measurement system includes a pulsed white light source; a measuring probe connected to the pulsed white light source; a white light coupler installed on a multimode optical fiber between the pulsed white light source and the measuring probe; a first beam splitter connected to the measuring probe; a second beam splitter connected to the white light coupler; a first photoelectric converter connected to the first beam splitter; a second photoelectric converter connected to the white light coupler; and a data acquisition system connecting the first photoelectric converter and the second photoelectric converter. The system can calculate the reflectivity of the sample to be tested. In the transient thermal radiation interface reflectivity measurement method, the data acquisition system compares the data generated by the pulsed white light reflected light and the spontaneous radiation light on the sample to be tested with the standard data generated by the single pulsed white light to obtain the reflectivity of the sample to be tested.

Description

Technical Field

[0001] The present application belongs to the field of shock wave physics technology, and in particular, relates to a transient thermal radiation interface reflectivity measurement system and method. Background Art

[0002] There are two main methods for directly measuring temperature in shock wave physics. One is based on the basic assumption of blackbody (graybody) radiation, and the other is based on the characteristic signal of the interaction between atomic or ion thermal motion and photons. The second method is to analyze the absorption spectrum of wide-spectrum X-rays or the broadening of monochromatic X-ray diffraction signals. The accuracy is not enough to provide in-depth understanding of physical problems. Radiation temperature measurement is currently the most reliable temperature measurement method, including brightness temperature method and color temperature method. Brightness temperature is a quantitative measurement based on the radiation brightness of monochromatic signals. It usually takes the overall brightness change in a relatively wide spectral range as the measurement data to eliminate the influence of some discrete spectra. The core of this method is accurate calibration and dynamic measurement of emissivity, and the specific implementation is in the form of scanning optical pyrometer. The color temperature method measures the radiation intensity of multiple wavelengths, and gives the closest gray body radiation fitting data through the fitting of the spectrum intensity to determine the temperature. This method also requires accurate calibration. Due to the large number of channels, it is difficult to directly give the emissivity data of each measurement wavelength. It is usually assumed that the emissivity is consistent within the measured wavelength range, which also brings huge risks to the reliability of physical data.

[0003] There are currently two methods in use for dynamic measurement of temperature and reflectivity in impact dynamics research. The first is to measure reflectivity based on the change in the intensity of the reflected signal given by an imaging velocity interferometer of an arbitrary reflecting surface. This method has a high time resolution, but is limited by the number of diagnostic light sources and streak cameras, and can only give the reflectivity of a narrow-band laser, which is still quite different from wide-spectrum temperature measurement. The second is to measure reflectivity using a constant white light source combined with an integrating sphere. The problem is that it can only measure the reflectivity of 1-2 wavelengths, and the time resolution is limited by the integration time of the integrating sphere, so it is impossible to carry out high-time-resolution signal measurement. At the same time, the reflectivity measurement area and the temperature radiation signal measurement are separated in the spatial region, that is, the two are not directly related.

[0004] Multi-channel radiation temperature measurement technology is currently the most reliable transient temperature measurement method. Its principle is to split the radiation signal of the sample area according to the spectrum and perform time-resolved measurement of the radiation intensity of different light spectra. However, it cannot achieve reflectivity measurement and temperature measurement for the same sample area at the same time, because the superimposed continuous signal cannot distinguish whether it is caused by gray body radiation or reflection of the illumination light source. Summary of the invention

[0005] The embodiment of the present application provides a transient thermal radiation interface reflectivity measurement system and method. When the system performs reflectivity measurement, a pulsed white light is separately split, and then collected by a data acquisition system after photoelectric conversion to form standard data. The standard data is used as a reference value during the measurement process to realize reflectivity measurement and temperature measurement, and the reflectivity of the sample to be measured under transient high temperature can be accurately calculated for the same sample area.

[0006] A transient thermal radiation interface reflectivity measurement system, comprising:

[0007] Pulsed white light source;

[0008] A measuring probe, wherein the measuring probe is connected to the pulse white light source through a first multimode optical fiber, the pulse white light can be transmitted to the measuring probe through the first multimode optical fiber, the measuring probe is aimed at the sample to be measured, and the irradiation area of ​​the measuring probe on the sample to be measured is the same as the temperature measurement area on the sample to be measured;

[0009] A white light coupler, wherein the white light coupler is mounted on the first multimode optical fiber;

[0010] A first optical splitter, wherein the first optical splitter is connected to the measuring probe via a second multimode optical fiber;

[0011] A second optical splitter, wherein the second optical splitter is connected to the white light coupler via a third multimode optical fiber;

[0012] a first photoelectric converter, wherein the first photoelectric converter is connected to the first optical splitter via a fourth multimode optical fiber;

[0013] a second photoelectric converter, wherein the second photoelectric converter is connected to the second optical splitter via a fifth multimode optical fiber;

[0014] A data acquisition system, wherein the data acquisition system is connected to the first photoelectric converter via a first data transmission cable, and the data acquisition system is connected to the second photoelectric converter via a second data transmission cable.

[0015] According to some other embodiments of the transient thermal radiation interface reflectivity measurement system of the present invention, there are multiple first photoelectric converters, each of which is connected to the first spectrometer via the fourth multi-mode optical fiber, and each of which is connected to the data acquisition system via the first data transmission cable.

[0016] According to some other embodiments of the transient thermal radiation interface reflectivity measurement system of the present invention, there are multiple second photoelectric converters, each of which is connected to the second spectrometer via the fifth multi-mode optical fiber, and each of which is connected to the data acquisition system via the second data transmission cable.

[0017] In the transient thermal radiation interface reflectivity measurement system according to some other embodiments of the present invention, the measurement probe is a dual-core multimode optical fiber measurement probe.

[0018] According to some other embodiments of the transient thermal radiation interface reflectivity measurement system of the present invention, the number of spectroscopic channels of the second spectrometer and the spectral parameters of each channel are consistent with the number of spectroscopic channels of the first spectrometer and the spectral parameters of each channel.

[0019] A method for measuring interface reflectivity in transient temperature, using any of the above transient thermal radiation interface reflectivity measurement systems, comprising the following steps:

[0020] Reflectivity detection steps:

[0021] The measuring probe is aimed at the sample to be measured;

[0022] The pulsed white light enters the measuring probe through the first multimode optical fiber and then irradiates the sample to be measured;

[0023] The pulsed white light reflected by the sample to be tested and the temperature spontaneous radiation light on the sample to be tested will enter the second multimode optical fiber, and then the second multimode optical fiber will transmit the reflected light of the pulsed white light and the temperature spontaneous radiation light to the first beam splitter;

[0024] The first optical splitter performs spectral splitting and transmits light of different wavelength bands to the corresponding first photoelectric converter through the fourth multimode optical fiber;

[0025] Each first photoelectric converter transmits the generated electrical signal to the data acquisition system for collection through the first data transmission cable;

[0026] Standard pulse detection steps:

[0027] Leading the pulsed white light out through the third multimode optical fiber and entering the second optical splitter;

[0028] The second optical splitter performs spectral splitting, and transmits the different wavelength bands of the pulsed white light to the corresponding second photoelectric converter through the fifth multimode optical fiber;

[0029] The electrical signals generated by each second photoelectric converter are transmitted to the data acquisition system through the second data transmission cable for collection;

[0030] The data acquisition system compares the data generated by the pulsed white light reflected light and the spontaneous radiation light on the sample to be tested with the standard data generated by the single pulsed white light to obtain the reflectivity of the sample to be tested under transient high temperature.

[0031] According to some other embodiments of the method for measuring interface reflectivity in transient temperature of the present invention, when the spectral stability of the pulsed white light source is good enough, the third multimode optical fiber is directly connected to the pulsed white light source and the second photoelectric converter, and the reflectivity of the sample to be tested under transient high temperature can be obtained by comparing the total intensity of the pulsed white light and the intensity of the reflected signal.

[0032] According to some other embodiments of the method for measuring interface reflectivity in transient temperature of the present invention, when the spectral stability and single pulse energy stability of the pulsed white light source are good enough, only the reflectivity detection step is performed, and the reflectivity of the sample to be tested in each channel under transient high temperature can be obtained by comparing the changes in the signal intensity of each channel after the first spectrometer before and after the temperature signal appears.

[0033] The transient thermal radiation interface reflectivity measurement system of the embodiment of the present invention has at least the following beneficial effects: during the measurement process, one path of the pulsed white light emitted by the pulsed white light source passes through the first multimode optical fiber to enter the measurement probe, and the other path passes through the third multimode optical fiber to enter the second optical splitter, and then enters the second photoelectric converter, and is converted by the second photoelectric converter and collected by the data acquisition system, thereby collecting pulse data of pure pulsed white light to form standard data, and the pulsed white light entering the measurement probe is irradiated on the sample to be measured, and since the irradiation area of ​​the measurement probe on the sample to be measured is the same as the temperature measurement area on the sample to be measured, the pulsed white light of the pulsed white light emitted by the pulsed white light source is irradiated on the sample to be measured. The domains are the same, so the reflected light of the pulsed white light irradiated on the sample to be tested and the high-temperature radiation light of the sample to be tested itself will enter the second multimode optical fiber together, and then the temperature radiation light of the sample to be tested and the reflected light of the pulsed white light will be spectrally split by the first spectrometer, thereby obtaining a continuous radiation signal and a pulse detection signal within the spectral range of each channel. After the signal is received by the first photoelectric converter, it is collected by the data acquisition system. The data acquisition system compares the reflected light of the pulsed white light and the pulse data of the spontaneous radiation light of the sample to be tested with the above-mentioned standard data to obtain the reflectivity of the sample to be tested under transient high temperature. Therefore, when the system is measuring the reflectivity, one pulsed white light is separately split, and then after photoelectric conversion, it is collected by the data acquisition system to form standard data, which is used as a reference value during the measurement process to realize reflectivity measurement and temperature measurement, and accurately calculate the reflectivity of the sample to be tested under transient high temperature for the same sample area. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic diagram of a transient thermal radiation interface emissivity measurement system provided in an embodiment of the present application;

[0035] Figure 2 It is a schematic diagram of a transient thermal radiation interface emissivity measurement system when the spectral stability of a pulsed white light source provided by an embodiment of the present application is good enough;

[0036] Figure 3 It is a schematic diagram of a transient thermal radiation interface emissivity measurement system when the spectral stability and single pulse energy stability of a pulsed white light source provided by an embodiment of the present application are good enough;

[0037] Figure 4 It is the experimental single-channel measurement signal of the transient thermal radiation interface emissivity measurement system under application;

[0038] Figure 5 It is the experimental single-channel standard signal of the transient thermal radiation interface emissivity measurement system under application. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0040] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0041] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0042] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0043] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] There are two main methods for directly measuring temperature in shock wave physics. One is based on the basic assumption of blackbody (graybody) radiation, and the other is based on the characteristic signal of the interaction between atomic or ion thermal motion and photons. The second method is to analyze the absorption spectrum of wide-spectrum X-rays or the broadening of monochromatic X-ray diffraction signals. The accuracy is not enough to provide in-depth understanding of physical problems. Radiation temperature measurement is currently the most reliable temperature measurement method, including brightness temperature method and color temperature method. Brightness temperature is a quantitative measurement based on the radiation brightness of monochromatic signals. It usually takes the overall brightness change in a relatively wide spectral range as the measurement data to eliminate the influence of some discrete spectra. The core of this method is accurate calibration and dynamic measurement of emissivity, and the specific implementation is in the form of scanning optical pyrometer. The color temperature method measures the radiation intensity of multiple wavelengths, and gives the closest gray body radiation fitting data through the fitting of the spectrum intensity to determine the temperature. This method also requires accurate calibration. Due to the large number of channels, it is difficult to directly give the emissivity data of each measurement wavelength. It is usually assumed that the emissivity is consistent within the measured wavelength range, which also brings huge risks to the reliability of physical data.

[0045] There are currently two methods in use for dynamic measurement of temperature and reflectivity in impact dynamics research. The first is to measure reflectivity based on the change in the intensity of the reflected signal given by an imaging velocity interferometer of an arbitrary reflecting surface. This method has a high time resolution, but is limited by the number of diagnostic light sources and streak cameras, and can only give the reflectivity of a narrow-band laser, which is still quite different from wide-spectrum temperature measurement. The second is to measure reflectivity using a constant white light source combined with an integrating sphere. The problem is that it can only measure the reflectivity of 1-2 wavelengths, and the time resolution is limited by the integration time of the integrating sphere, so it is impossible to carry out high-time-resolution signal measurement. At the same time, the reflectivity measurement area and the temperature radiation signal measurement are separated in the spatial region, that is, the two are not directly related.

[0046] Multi-channel radiation temperature measurement technology is currently the most reliable transient temperature measurement method. Its principle is to split the radiation signal of the sample area according to the spectrum and perform time-resolved measurement of the radiation intensity of different light spectra. However, it cannot achieve reflectivity measurement and temperature measurement for the same sample area at the same time, because the superimposed continuous signal cannot distinguish whether it is caused by gray body radiation or reflection of the illumination light source.

[0047] Reference Figure 1 The present application provides a transient thermal radiation interface reflectivity measurement system, including a pulsed white light source 100, a measurement probe 200, a white light coupler 300, a first spectrometer 400, a second spectrometer 500, a first photoelectric converter 600, a second photoelectric converter 700 and a data acquisition system 800.

[0048] The measuring probe 200 is connected to the pulse white light source 100 through the first multimode optical fiber 301, the pulse white light can be transmitted to the measuring probe 200 through the first multimode optical fiber 301, the measuring probe 200 is aimed at the sample to be measured 900, the irradiation area of ​​the measuring probe 200 on the sample to be measured 900 is the same as the temperature measurement area on the sample to be measured 900, the white light coupler 300 is installed on the first multimode optical fiber 301, the first optical splitter 400 is connected to the measuring probe 200 through the second multimode optical fiber 401, the second optical splitter 500 is connected to the white light coupler 300 through the third multimode optical fiber 302, the first photoelectric converter 600 is connected to the first optical splitter 400 through the fourth multimode optical fiber 402, the second photoelectric converter 700 is connected to the second optical splitter 500 through the fifth multimode optical fiber 501, the data acquisition system 800 is connected to the first photoelectric converter 600 through the first data transmission cable 601, and the data acquisition system 800 and the second photoelectric converter 700 are both connected through the second data transmission cable 701.

[0049] During the measurement process, one path of the pulsed white light emitted by the pulsed white light source 100 passes through the first multimode optical fiber 301 and enters the measuring probe 200, and the other path passes through the third multimode optical fiber 302 and enters the second optical splitter 500, and then enters the second photoelectric converter 700. After conversion by the second photoelectric converter 700, it is collected by the data acquisition system 800, thereby collecting pulse data of pure pulsed white light to form standard data. The pulsed white light entering the measuring probe 200 is irradiated onto the sample to be measured 900. Since the irradiation area of ​​the measuring probe 200 on the sample to be measured 900 is the same as the temperature measurement area on the sample to be measured 900, the pulsed white light irradiated onto the sample to be measured is The reflected light of the pulsed white light on the sample 900 and the high-temperature radiation light of the sample 900 will enter the second multimode optical fiber 401 together, and then the temperature spontaneous radiation light of the sample 900 and the reflected light of the pulsed white light will be spectrally split by the first optical splitter 400, so as to obtain the continuous radiation signal and the pulse detection signal within the spectral range of each channel. The signal is received by the first photoelectric converter 600 and collected by the data acquisition system 800. The data acquisition system 800 compares the reflected light of the pulsed white light and the pulse data of the spontaneous radiation light of the sample 900 with the above-mentioned standard data, and the reflectivity of the sample 900 under transient high temperature can be obtained. Therefore, when the system measures the reflectivity, a pulsed white light is separately split, and then after photoelectric conversion, it is collected by the data acquisition system 800 to form standard data, which is used as a reference value in the measurement process, so as to realize the reflectivity measurement and temperature measurement, and accurately calculate the reflectivity of the sample 900 under transient high temperature for the same sample area.

[0050] Figure 4 The pulse signal in the front part is the reflection signal after the pulse white light irradiates the sample 900 to be tested, and the signal in the shadow part at the back is the pulse of the sample 900 to be tested in the high temperature luminescence state. During this period, the reflectivity of the sample 900 to be tested drops significantly, so the original signal strength of the sample 900 to be tested can be measured by Figure 5 If the pulse signal is clearly visible at high temperature, the emissivity change can be confirmed based on the standard data signal.

[0051] Assuming that the standard pulse light source intensity is A1, A2, the measurement channel pulse intensity is B1, B2, and its reflectivity is R, the standard pulse light source intensity is A3 under high temperature, and the measurement channel pulse intensity is B3 under high temperature. The reflectivity calculation formula under high temperature state is:

[0052] In some embodiments, there are multiple first photoelectric converters 600, each of which is connected to the first optical splitter 400 via the fourth multimode optical fiber 402, and each of which is connected to the data acquisition system 800 via the first data transmission cable 601. This makes it convenient to receive light of different wavelengths split by the first optical splitter 400.

[0053] In the embodiment shown in the present application, two first photoelectric converters 600 are provided.

[0054] In some embodiments, there are multiple second photoelectric converters 700, each second photoelectric converter 700 is connected to the second optical splitter 500 through the fifth multimode optical fiber 501, and each second photoelectric converter 700 is connected to the data acquisition system 800 through the second data transmission cable 701.

[0055] In the embodiment shown in the present application, two second photoelectric converters 700 are provided.

[0056] In some embodiments, the measuring probe 200 is a dual-core multimode optical fiber measuring probe, which is convenient for connecting two multimode optical fibers.

[0057] In the embodiment shown in the present application, the number of splitting channels and the spectral parameters of each channel of the second splitter 500 are consistent with the number of splitting channels and the spectral parameters of each channel of the first splitter 400 .

[0058] The present application also provides a method for measuring transient thermal radiation interface reflectivity, comprising the following steps:

[0059] Reflectivity detection steps:

[0060] The measuring probe 200 is aligned with the sample 900 to be measured;

[0061] Introducing pulsed white light into the measurement probe 200 through the first multimode optical fiber 301;

[0062] The pulsed white light reflected by the sample 900 and the spontaneous radiation light on the sample 900 will enter the second multimode optical fiber 401, and then the second multimode optical fiber 401 will transmit the reflected light of the pulsed white light and the spontaneous radiation light of temperature to the first beam splitter 400;

[0063] The first optical splitter 400 performs spectral splitting and transmits the lights of different wavelength bands to the corresponding first photoelectric converter 600 through the fourth multimode optical fiber 402;

[0064] Each first photoelectric converter 600 transmits the generated electrical signal to the data acquisition system 800 through the first data transmission cable 601 for collection;

[0065] Standard pulse detection steps:

[0066] The pulsed white light is led out through the fifth multimode optical fiber 501 and enters the second optical splitter 500;

[0067] The second optical splitter 500 performs spectral splitting, and transmits the light of different wavelength bands of the pulsed white light to the corresponding second photoelectric converter 700 through the fifth multimode optical fiber 501;

[0068] The electrical signals generated by each second photoelectric converter 700 are transmitted to the data acquisition system 800 through the second data transmission cable 701 for collection;

[0069] The data acquisition system 800 compares the data generated by the pulsed white light reflected light and the spontaneous radiation light on the sample 900 to be tested with the data generated by the single pulsed white light to obtain the reflectivity of the sample 900 to be tested under transient high temperature.

[0070] This method can accurately and simply measure the reflectivity of the sample 900 under a transient high temperature state.

[0071] In some embodiments, the number of the first photoelectric converters 600 is the same as the number of the second photoelectric converters 700 .

[0072] In some embodiments, two first photoelectric converters 600 are provided, and two second photoelectric converters 700 are provided.

[0073] Reference Figure 2 In some other embodiments, when the spectral stability of the pulsed white light source is good enough, the third multimode optical fiber 302 is directly connected to the pulsed white light source 100 and the second photoelectric converter 700, and the reflectivity of the sample 800 under transient high temperature can be obtained by comparing the total intensity of the pulsed white light and the intensity of the reflected signal.

[0074] Reference Figure 3 Furthermore, when the spectral stability and single-pulse energy stability of the pulsed white light source are good enough, only the reflectivity detection step is performed. By comparing the changes in the signal intensity of each channel after the first spectrometer 400 before and after the temperature signal appears, the reflectivity of the sample 800 to be tested in each channel under transient high temperature can be obtained.

[0075] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

Claims

1. A transient thermal radiation interface reflectivity measurement system, characterized in that: include Pulsed white light source (100); a measuring probe (200), the measuring probe (200) being connected to the pulsed white light source (100) via a first multimode optical fiber (301), the pulsed white light being capable of being transmitted to the measuring probe (200) via the first multimode optical fiber (301), the measuring probe (200) being aimed at a sample to be measured (900), and the irradiation area of ​​the measuring probe (200) on the sample to be measured (900) being the same as the temperature measurement area on the sample to be measured (900); a white light coupler (300), the white light coupler (300) being mounted on the first multimode optical fiber (301); A first optical splitter (400), the first optical splitter (400) being connected to the measuring probe (200) via a second multimode optical fiber (401); a second optical splitter (500), the second optical splitter (500) being connected to the white light coupler (300) via a third multimode optical fiber (302); A first photoelectric converter (600), wherein the first photoelectric converter (600) is connected to the first optical splitter (400) via a fourth multimode optical fiber (402); a second photoelectric converter (700), wherein the second photoelectric converter (700) is connected to the second optical splitter (500) via a fifth multimode optical fiber (501); A data acquisition system (800), wherein the data acquisition system (800) is connected to the first photoelectric converter (600) via a first data transmission cable (601), and the data acquisition system (800) is connected to the second photoelectric converter (700) via a second data transmission cable (701); A plurality of the first photoelectric converters (600) are provided, each of the first photoelectric converters (600) is connected to the first optical splitter (400) via the fourth multimode optical fiber (402), and each of the first photoelectric converters (600) is connected to the data acquisition system (800) via the first data transmission cable (601); A plurality of the second photoelectric converters (700) are provided, each of the second photoelectric converters (700) is connected to the second optical splitter (500) via the fifth multimode optical fiber (501), and each of the second photoelectric converters (700) is connected to the data acquisition system (800) via the second data transmission cable (701).

2. The transient thermal radiation interface reflectivity measurement system according to claim 1, characterized in that: The measuring probe (200) is a dual-core multi-mode optical fiber measuring probe.

3. The transient thermal radiation reflectivity measurement system according to claim 1, characterized in that: The number of spectroscopic channels and the spectral parameters of each channel of the second spectroscopic device (500) are consistent with the number of spectroscopic channels and the spectral parameters of each channel of the first spectroscopic device (400).

4. A transient thermal radiation interface reflectivity measurement method, using any one of the transient thermal radiation interface reflectivity measurement systems of claims 1 to 3, characterized in that: The following steps are included Reflectivity detection steps: The measuring probe (200) is aligned with the sample to be measured (900); The pulsed white light enters the measuring probe (200) through the first multimode optical fiber (301) and then irradiates the sample to be measured (900); The pulsed white light reflected by the sample to be tested (900) and the temperature spontaneous radiation light on the sample to be tested (900) will enter the second multimode optical fiber (401), and then the second multimode optical fiber (401) will transmit the reflected light of the pulsed white light and the temperature spontaneous radiation light to the first beam splitter (400); The first optical splitter (400) performs spectral splitting, and transmits light of different wavelength bands to corresponding first photoelectric converters (600) through fourth multimode optical fibers (402); Each first photoelectric converter (600) transmits the generated electrical signal to the data acquisition system (800) through the first data transmission cable (601) for collection; Standard pulse detection steps: Leading the pulsed white light out separately through a third multimode optical fiber (302) and into a second optical splitter (500); The second optical splitter (500) performs spectral splitting to transmit light of different wavelength bands of the pulsed white light to the corresponding second photoelectric converter (700) through the fifth multimode optical fiber (501); The electrical signals generated by each second photoelectric converter (700) are transmitted to the data acquisition system (800) via the second data transmission cable (701) for collection; The data acquisition system (800) compares the data generated by the pulsed white light reflected light and the spontaneous radiation light on the sample to be tested (800) with the standard data generated by the single pulsed white light to obtain the reflectivity of the sample to be tested (800) under transient high temperature.

5. The method for measuring transient thermal radiation interface reflectivity according to claim 4, characterized in that: When the spectral stability of the pulsed white light source is good enough, the third multimode optical fiber (302) is directly connected to the pulsed white light source (100) and the second photoelectric converter (700), and the reflectivity of the sample to be tested (800) under transient high temperature can be obtained by comparing the total intensity of the pulsed white light and the intensity of the reflected signal.

6. The method for measuring transient thermal radiation interface reflectivity according to claim 4, characterized in that: When the spectral stability and single pulse energy stability of the pulsed white light source are good enough, only the reflectivity detection step is performed, and the reflectivity of the sample to be tested (800) in each channel under transient high temperature can be obtained by comparing the changes in the signal intensity of each channel after the first spectrometer (400) before and after the temperature signal appears.

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