Circuit Board Detection Method, Electronic Device, and Readable Storage Medium

Abstract

The present invention relates to the technical field of circuit board detection, and particularly relates to a circuit board detection method, an electronic device, and a readable storage medium. This method inputs an electrical detection signal by using the idle pins reserved at the edge of the chip in the circuit board to be detected as detection points, and determines whether the circuit board to be detected is damaged according to the output detection signal. The above-mentioned circuit board detection method is applicable to various circuit board detection scenarios, and has high detection result accuracy, short detection time, and will not cause any damage to the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board detection, and particularly to a circuit board detection method, an electronic device, and a readable storage medium. Background Art

[0002] With the development of electronic devices, the number of hardware circuits integrated by printed circuit boards (PCBs) in electronic devices is also increasing. However, the PCB board will undergo varying degrees of deformation under mechanical stress or thermal stress, and the deformation parameters of the chips soldered on the PCB board are inconsistent with those of the PCB board. Therefore, the solder bumps (hereinafter referred to as solder balls) of the chips will be subjected to the tensile force of the PCB board, resulting in problems such as cracks, detachment, and fracture, leading to poor connection or loss of connection between the chips and the PCB board, and further causing the risk of failure of the corresponding functions of the chip products. As Figure 1 shown in, affected by stress, the edge solder ball A between the chip 101 and the PCB pad 102 shows an open circuit, making the chip 101 unable to work properly; or as Figure 1 shown in, the solder ball B deforms due to stress and contacts the adjacent solder ball, which will also make the chip 101 unable to work properly.

[0003] Therefore, it is necessary to regularly detect the connection status of the solder balls between the chips and the PCB board, find the solder balls with problems such as cracks, detachment, and fracture, and timely repair the solder balls with the above problems such as cracks, detachment, and fracture, so that the chips can continue to work properly. Summary of the Invention

[0004] The embodiments of the present application provide a circuit board detection method, an electronic device, and a readable storage medium. By using the idle pins reserved at the edge of the chip in the circuit board to be detected as detection points to input an electrical detection signal, and determining whether the circuit board to be detected is damaged according to the output detection signal.

[0005] In a first aspect, the embodiments of the present application provide a method. The circuit board includes a substrate, a connection part, and a chip. The chip is fixed on the substrate through the connection part, and the chip is electrically connected to the substrate through the connection part. And the method includes: determining at least one idle pin in the chip; determining whether the connection part is damaged by inputting an electrical detection signal to at least one idle pin.

[0006] It can be understood that the connection part can be the solder ball mentioned in the present application, and the substrate can be the PCB board mentioned in the present application. An idle pin refers to a pin in the chip that is not used or connected to a signal source, or can also refer to a pin reserved for chip detection that comes with the chip when it leaves the factory.

[0007] It can be understood that in this application, the chip realizes electrical connection with the substrate (i.e., the PCB board) through the connection part (i.e., the solder ball). When performing circuit board detection, at least one idle pin in the chip can be confirmed first, and then an electrical detection signal, such as the input voltage, input current, etc. mentioned in this application, can be input through this idle pin. Further, the connection part can be determined whether it is damaged according to the detection signal corresponding to the output end of the idle pin, such as the level signal, voltage value, current value, etc. mentioned in this application.

[0008] Based on the above method, it can ensure that the detection result has high accuracy, short detection time, and will not cause any damage to the circuit board. In addition, the circuit board detection provided in this application is applicable to various circuit board detection scenarios.

[0009] In a possible implementation of the above first aspect, the above method further includes: determining whether the connection part is damaged by inputting an electrical detection signal to at least one idle pin, including: inputting a voltage signal to at least one idle pin and reading the level signal corresponding to the output end of at least one idle pin; when the level signal is a high-level signal, it is determined that the connection part is damaged.

[0010] It can be understood that in this application, a detection circuit is mentioned for inputting a voltage signal to at least one idle pin. When the connection part corresponding to the above at least one idle pin is normal, the corresponding voltage is the ground voltage and the level signal is a low-level signal. Therefore, when the level signal is a high-level signal, it is determined that the connection part corresponding to the idle pin is damaged.

[0011] In a possible implementation of the above first aspect, the above method further includes: determining whether the connection part is damaged by inputting an electrical detection signal to at least one idle pin, and further includes: when the level signal is a low-level signal, it is determined that the connection part is not damaged.

[0012] It can be understood that as described above, when the connection part of the above at least one idle pin is normal, the corresponding voltage is the ground voltage and the level signal is a low-level signal. Therefore, when the level signal is a low-level signal, it is determined that the connection part is not damaged.

[0013] In a possible implementation of the above first aspect, the above method further includes: inputting an electrical detection signal to at least one idle pin includes: inputting a high-level voltage signal to at least one idle pin.

[0014] It can be understood that, for example, the control chip mentioned in the detection circuit in this application has a pull-up function or a pull-up resistor is set to pull up the level of the detection circuit to a high-level signal. At this time,

[0015] In a possible implementation of the above first aspect, the above method further includes: at least one idle pin is a ground pin.

[0016] It can be understood that when at least one of the above-mentioned idle pins is a ground pin, the voltage corresponding to the ground pin is the ground voltage, and the value is close to zero. Therefore, the level signal of the ground pin is a low-level signal.

[0017] In a possible implementation of the above first aspect, the above method further includes: at least one idle pin is a plurality of bump pins, and by inputting an electrical detection signal to at least one idle pin, it is determined whether there is damage to the connection part, including: connecting the plurality of bump pins through a side line; inputting a voltage to the bump pin at the first end of the side line among the plurality of bump pins, and reading the voltage value corresponding to the bump pin at the second end of the side line among the plurality of bump pins; when the voltage value is zero, it is determined that there is damage to the connection part.

[0018] It can be understood that the first end of the side line can be the start end of the side line mentioned in this application, and the second end of the side line can be the end end of the side line mentioned in this application.

[0019] It can be understood that in this application, a part of the above side line can be arranged in the chip, and the other part is arranged on the PCB board, and the above plurality of bump pins are connected through the side line. Further, a voltage is input to the bump pin at the first end (i.e., the start end of the side line) of the side line among the plurality of bump pins. When the voltage value corresponding to the bump pin at the second end (i.e., the end end of the side line) of the plurality of bump pins is zero, it indicates that there is damage to at least one of the connection parts corresponding to the plurality of bump pins. For example, in this application, a voltage is input to the bump pin at the start end of the side line among the plurality of bump pins through a voltage source, and the voltage value corresponding to the bump pin at the end end of the side line among the plurality of bump pins is read.

[0020] In a possible implementation of the above first aspect, the above method further includes: by inputting an electrical detection signal to at least one idle pin, determining whether there is damage to the connection part, and further includes: when the voltage value is not zero, reading the first current value corresponding to the bump pin at the second end of the side line among the plurality of bump pins; when the first current value is the first predetermined value, it is determined that there is no damage to the connection part; when the first current value is not the first predetermined value, it is determined that there is damage to the connection part.

[0021] Wherein, the above first predetermined value can be the predetermined value V / R mentioned in this application.

[0022] It can be understood that when the voltage value corresponding to the bump pin at the second end (i.e., the starting end of the side line) of the multiple bump pins located on the side line is not zero, it is also necessary to obtain the first current value corresponding to the bump pin at the second end (i.e., the starting end of the side line) of the side line, which is used to determine whether there is a partial break in the connection part among the multiple bump pins. It is known that when there is a partial break in the connection part, the corresponding impedance will increase and the detected first current value will change. Therefore, when the detected first current value is not equal to the first predetermined value (i.e., the predetermined value V / R), it is determined that there is damage to the connection part corresponding to at least one of the multiple bump pins. When the first current value is the first predetermined value, it is determined that the connection part is not damaged.

[0023] In a possible implementation of the above first aspect, the above method further includes: at least one idle pin is a plurality of bump pins, and by inputting an electrical detection signal to at least one idle pin, determining whether there is damage to the connection part, including: connecting the plurality of bump pins through a side line; inputting a current to the bump pin at the first end of the side line among the plurality of bump pins, and reading the second current value corresponding to the bump pin at the second end of the side line among the plurality of bump pins; when the second current value is zero, determining that there is damage to the connection part.

[0024] It can be understood that the first end of the side line can be the starting end of the side line mentioned in this application, and the second end of the side line can be the end of the side line mentioned in this application.

[0025] It can be understood that a part of the above side line can be arranged in the chip and another part can be arranged on the PCB board. The above plurality of bump pins are connected through the side line. Further, when a current is input to the bump pin at the first end (i.e., the starting end of the side line) of the plurality of bump pins, when the second current value corresponding to the bump pin at the second end (i.e., the end of the side line) of the plurality of bump pins is zero, it indicates that there is damage to the connection part corresponding to at least one of the plurality of bump pins.

[0026] In a possible implementation of the above first aspect, the above method further includes: by inputting an electrical detection signal to at least one idle pin, determining whether there is damage to the connection part, further including: when the second current value is not zero, gradually increasing the input current of the bump pin at the first end of the side line among the plurality of bump pins; when the input current is greater than the current threshold and the second current value is not zero, determining that the connection part is not damaged.

[0027] It can be understood that the input current is increased by gradually increasing the current multiplication factor of the input current. The above current threshold can be the input current value corresponding to when the current multiplication factor N mentioned in this application is the maximum value.

[0028] It can be understood that when the second current value is not zero, by gradually increasing the input current of the bump pins located at the starting end of the side line among the multiple bump pins, a micro-damage fault is triggered. For example, when the connection part corresponding to one of the bump pins is partially broken, the current multiplication factor of the input current can be gradually increased, thereby increasing the input current and causing the connection part corresponding to the bump pin to be completely broken. It should be understood that the purpose of this step is to reduce the number of detections of the circuit board, pre-determine whether there are hidden solder ball damage hazards in the circuit board to be detected, and solve the damage hazards in a timely manner.

[0029] In a possible implementation of the foregoing first aspect, the foregoing method further includes: at least one idle pin is a plurality of bump pins, and by inputting an electrical detection signal to the at least one idle pin, it is determined whether the connection part is damaged. It further includes: connecting the plurality of bump pins through a side line; grounding the bump pin located at the second end of the side line among the plurality of bump pins through a capacitor, and charging the capacitor within the first time; reading the level signal corresponding to the bump pin located at the second end of the side line among the plurality of bump pins; when the level signal is a low level signal, it is determined that the connection part is damaged.

[0030] It can be understood that the foregoing first time may be the delay time T1 mentioned in this application; the foregoing capacitor may be the capacitor C1 mentioned in this application.

[0031] It can be understood that, for example, in this application, within the delay time T1, the capacitor C1 is charged. After the delay time T, the capacitor C1 starts to discharge. When the connection parts (i.e., solder balls) corresponding to the plurality of bump pins are not damaged, the level signal of the bump pin located at the second end (i.e., the starting end of the side line) of the side line is a high level; when at least one of the solder balls corresponding to the connection parts (i.e., solder balls) of the plurality of bump pins is damaged, the level signal of the bump pin located at the second end (i.e., the starting end of the side line) of the side line is a low level. Therefore, when the level signal corresponding to the bump pin located at the second end (i.e., the end of the side line) of the side line among the plurality of bump pins is read as a low level signal, it is determined that the connection part is damaged.

[0032] In a possible implementation of the foregoing first aspect, the foregoing method further includes: by inputting an electrical detection signal to the at least one idle pin, it is determined whether the connection part is damaged. It further includes: when the level signal is a high level signal, it is determined that the connection part is not damaged.

[0033] In a possible implementation of the foregoing first aspect, the foregoing method further includes: the connection part includes at least one connection point; determining that the connection part is damaged includes: determining that the connection point corresponding to the idle pin with a high level signal among the at least one idle pin is damaged.

[0034] It can be understood that the above connection part includes at least one connection point, that is, at least one solder ball. In the present application, when at least one idle pin is a ground pin, the detection circuit inputs a high-level voltage signal to the ground pin. It should be understood that when the solder ball corresponding to the above ground pin is not damaged, the corresponding level signal is a low-level signal. Therefore, when the detected corresponding level signal is a high-level signal, the solder ball corresponding to the idle pin is damaged.

[0035] In a possible implementation of the above first aspect, the above method further includes: the connection part includes at least one connection point; the method further includes: respectively connecting a preset number of bump pins among the multiple bump pins to corresponding resistors and then grounding them, and obtaining the voltage value output by the circuit board; determining the damaged connection point in the connection part according to the voltage value and at least one preset voltage threshold, and the connection point corresponds to the idle pin.

[0036] It can be understood that when different connection points are damaged, the corresponding voltage values output by the circuit board are different. Therefore, different voltage thresholds can be set to determine the damaged connection point in the connection part. For example, in the present application, by setting the first voltage division value, the second voltage division value, the third voltage division value, the fourth voltage division value, etc. as voltage thresholds, and comparing them with the voltage value output by the circuit board obtained, it is determined that there is a damaged solder ball in the connection part. Among them, the number of voltage thresholds is related to the number of corresponding bump pins.

[0037] In a possible implementation of the above first aspect, the above method further includes: the idle pin is a pin at the edge of the chip.

[0038] It can be understood that the connection part (i.e., the solder ball) corresponding to the pin at the edge of the chip in the circuit board is most likely to be affected by stress and break. Generally, when the solder ball corresponding to the pin at the edge does not break, the solder ball corresponding to the internal pin will not break. Therefore, the above idle pin can be a pin at the edge of the chip in the circuit board.

[0039] In a second aspect, the present application provides an electronic device, including: a memory and a processor, wherein the memory is used to store instructions executed by one or more processors of the electronic device, and the processor is one of the one or more processors of the electronic device and is used to execute the circuit board detection method mentioned in the present application.

[0040] In a third aspect, the present application provides a readable storage medium, wherein instructions are stored on the readable storage medium, and when the instructions are executed on the electronic device, the electronic device is caused to execute the circuit board detection method mentioned in the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 According to the embodiments of the present application, a schematic diagram showing the deformation or fracture of solder ball stress is shown;

[0042] Figure 2A The embodiment of the present application shows a schematic diagram of an application scenario for circuit board detection;

[0043] Figure 2B The embodiment of the present application shows a schematic diagram of the circuit connection of a detection circuit;

[0044] Figure 2C The embodiment of the present application shows another schematic diagram of the circuit connection of a detection circuit;

[0045] Figure 2D The embodiment of the present application shows a schematic diagram of the circuit connection for determining the fault location;

[0046] Figure 3 The embodiment of the present application shows a schematic diagram of the process of a circuit board detection method;

[0047] Figure 4 The embodiment of the present application shows a flowchart of a circuit board detection method for a single detection point;

[0048] Figure 5A The embodiment of the present application shows a schematic diagram of the circuit connection for multiple detection points;

[0049] Figure 5B The embodiment of the present application shows a flowchart of a circuit board detection method for multiple detection points;

[0050] Figure 6A The embodiment of the present application shows a schematic diagram of the circuit connection using a voltage source;

[0051] Figure 6B The embodiment of the present application shows a flowchart of a circuit board detection method using a voltage source;

[0052] Figure 7A The embodiment of the present application shows a schematic diagram of the circuit connection using a current source;

[0053] Figure 7B The embodiment of the present application shows a flowchart of a circuit board detection method using a current source;

[0054] Figure 8A The embodiment of the present application shows a schematic diagram of the circuit connection of a zero detection device;

[0055] Figure 8B The embodiment of the present application shows a flowchart of a circuit board detection method of a zero detection device;

[0056] Figure 9A schematic flowchart for determining the fault location is shown according to an embodiment of the present application;

[0057] Figure 10 A schematic diagram of the hardware structure of an electronic device is shown according to an embodiment of the present application. Detailed implementation manners

[0058] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described in detail below with reference to the accompanying drawings of the specification and specific implementation manners.

[0059] It should also be stated that the numbering of the steps in the methods and processes in the embodiments of the present application is for convenience of reference and does not limit the sequence. If there is a sequence between the steps, it shall be subject to the written description.

[0060] It can be understood that in the existing detection methods, the PCB board is usually subjected to grinding treatment in a physical destruction manner to determine the solder ball sites that are broken due to stress in the circuit board. However, the above method will cause irreparable damage to the PCB board, so that the PCB board after grinding treatment cannot be used normally anymore. Or, in the existing detection methods, a method of using 3D-x ray scanning (three dimensions xray, 3D-xray) technology to scan the PCB board layer by layer, generate a layer scan image of the PCB board, and locate the appearance of the solder balls is also provided, so as to obtain the solder ball sites that are broken due to stress in the circuit board. However, the detection time using 3D-x ray scanning (three dimensions xray, 3D-xray) technology is relatively long, and the corresponding 3D-x ray scanning device is expensive, and has relatively high requirements for the professionalism of the operators.

[0061] It can be understood that in the actual scenario, the solder balls at the edge of the chip are most likely to be affected by stress and break. Generally, when the edge solder balls do not break, the internal solder balls will not break. Therefore, to solve the above problems, an embodiment of the present application provides a circuit board detection method. Specifically, the method inputs a detection signal by using the idle pins reserved at the edge of the chip in the circuit board to be detected as detection points, and determines whether the circuit board to be detected is damaged according to the output detection signal. Since the chip and the PCB board are connected by solder balls, that is, the idle pins reserved at the edge of the chip are electrically connected to the PCB board through solder balls. For example, the pins at the edge of the chip are connected to the ground through solder balls. If the solder balls break, the voltage of the ground pins at the edge of the chip is no longer the ground voltage. Among them, the above idle pins refer to the pins in the chip that are not used or connected to the signal source, or can also refer to the pins reserved for chip detection that come with the chip when it leaves the factory.

[0062] For example, refer to Figure 2A as shown Figure 2A According to an embodiment of the present application, a schematic diagram of an application scenario for circuit board detection is shown. This scenario includes: a detection circuit 201 and a circuit board 202 to be detected. Among them, the circuit board 202 to be detected includes a chip 202a, solder balls 202b, and a PCB board 202c. The chip 202a is connected to the PCB board 202c through the solder balls 202b.

[0063] It can be understood that when performing circuit board detection, the detection circuit 201 is connected to the pins reserved at the edge of the circuit board 202 to be detected. Further, the detection circuit 201 inputs a detection signal to the circuit board 202 to be detected, and determines whether the circuit board 202 to be detected is damaged according to the output detection signal.

[0064] In some embodiments, when the pins reserved at the edge of the chip in the circuit board to be detected are ground pins (GND pins), the above ground pins are used as detection points. The detection circuit inputs a voltage to the circuit board to be detected through the detection point and reads the level of the detection point. If the voltage of the detection point is low level, it indicates that the connection of the detection point is normal and there is no breakage or other conditions. Otherwise, it means that the detection point has a breakage situation. For example, as Figure 2B shown Figure 2B includes a test circuit 201A and a circuit board 202 to be detected. The detection circuit 201A includes a control chip 201a, an initialization input / output port (general-purpose input / output, GPIO), a pull-up resistor R0, and a supply voltage VCC. The circuit board 202 to be detected includes a chip 202a (not marked in the figure), solder balls 202b (not marked in the figure), and a PCB board 202c. There are multiple idle ground pins on the circuit board 202c to be detected that can be used as detection points, such as P1, P2, P3, and P4.

[0065] It can be understood that the test circuit 201A can be connected to the detection point P1 of the circuit board 202 to be detected. The control chip 201a in the detection circuit 201A initializes the GPIO and sets the GPIO to the input mode. When the detection point P1 is normally connected and there is no breakage or other conditions, since the detection point P1 is grounded, the voltage division value of the detection point P1 is close to 0V. Therefore, the level of the detection point P1 is low level. When the detection point P1 is abnormally connected, that is, there is a breakage or other conditions, the detection point P1 is no longer grounded. At this time, the pull-up resistor R0 in the detection circuit 201A pulls up the level of the circuit to high level. Therefore, the level of the detection point P1 is also high level. In some embodiments, the level detection result of the above detection point P1 can be output to the control chip 201a through the GPIO. For example, outputting "1" means that the level of the detection point P1 is high level; outputting "0" means that the level of the detection point P1 is low level.

[0066] In other embodiments, multiple GPIOs can also be set to correspondingly connect to multiple different detection points, so as to reduce the detection time and improve the detection efficiency.

[0067] For another example, in some other embodiments, when the pins reserved at the edge of the chip 202a in the to-be-detected circuit board 202 are bump pins, multiple pins at the edge can be connected, and a voltage or current is input through the pin at the starting end of the wire, and then the voltage value or current value of the pin at the ending end of the wire is detected, and then it is determined whether the circuit board has a breakage according to the above voltage value or current value.

[0068] Refer to Figure 2C as shown in Figure 2C It includes a detection circuit 201B and a to-be-detected circuit board 202. Among them, the detection circuit 201B further includes an input circuit 201b and a detection device 201c. The above input circuit 201b can include a voltage source V1 or a current source A1 and a switch K0. The detection device 201c can include a detection device for voltage value or current value, such as a voltmeter V, an ammeter A or a multimeter, etc. The to-be-detected circuit board 202 includes a chip 202a (not marked in the figure), solder balls 202b (not marked in the figure) and a PCB board 202c. Multiple idle bump pins are included on the to-be-detected circuit board 202c and can be used as detection points, such as B1, B2, B3 and B4.

[0069] It can be understood that by setting wire X1, wire X2 and wire X3, the detection points B1 to B4 are connected. Among them, wire X1 and wire X2 are set inside the chip 202a, and wire X3 is set on the PCB board 202c. When detecting the circuit board, switch K0 is turned on, and the input circuit 201b inputs a voltage or current through the pin at the starting end of the wire, that is, B1 in the figure, and the detection device 201c detects the voltage value or current value of the pin at the ending end of the wire, that is, the detection point B2. When the detected voltage value or current value is zero, it indicates that at least one of the above detection points has a breakage in the solder ball or the like.

[0070] In some embodiments, after it is determined that there is a breakage in the solder ball in the above circuit board, it is also necessary to continue to detect the position of the broken solder ball, that is, to judge the fault position. Different voltage values correspond to different positions of the broken solder balls. Therefore, an analog-to-digital converter (ADC) can be used to collect the voltage values of the pins and judge the position of the broken solder balls according to the collected voltage values.

[0071] For example, refer to Figure 2D as shown in Figure 2DIt includes a sampling circuit 301 and a circuit board 202 to be detected. The sampling circuit 301 includes an ADC 301a, a switch K1, a pull-up resistor R1, and a supply voltage VCC. The circuit board 202 to be detected includes a chip 202a (not marked in the figure), solder balls 202b (not marked in the figure), and a PCB board 202c. The circuit board 202 to be detected has multiple idle grounding points that can be used as detection points, such as N1, N2, N3, and N4. The detection points N1 to N4 are connected through the internal side lines X4 and X5 of the chip and the side line X6 on the PCB board 202c.

[0072] Continue to refer to Figure 2D , the detection point N1 is grounded through a resistor R4, the detection point N2 is directly grounded, the detection point N3 is grounded through R2, and the detection point N4 is grounded through R3. Taking the sampling circuit 301 connecting to the circuit board 202 to be detected through the detection point N1 as an example, when judging the fault location, turn on the switch K1. It should be understood that for different fault locations, the corresponding sampled voltage values are also different. Therefore, the fault location in the circuit board 202 to be detected can be judged according to the sampled voltage value. For example, when judging the fault location, turn off the switch K1. At this time, the detection point P1 is also connected to the supply voltage VCC through the resistor R1. When the solder balls corresponding to the detection points N1 to N4 are intact, the ADC reading is zero; when the ADC reading is VCC, it indicates that the solder ball corresponding to the detection point N1 is damaged; when the ADC reading is , the solder ball corresponding to the detection point P2 is damaged; when the ADC reading is , the solder ball corresponding to the detection point P3 is damaged; when the ADC reading is , the solder ball corresponding to the detection point P4 is damaged. In addition, after detecting the fault detection point, the switch K1 needs to be turned off to prevent leakage and other situations in the circuit board 202 to be detected.

[0073] It can be understood that based on the above circuit board detection method, it is possible to detect the circuit board to be detected without any damage and with high detection result accuracy. In addition, the above method is applicable to various application scenarios such as production line testing, high-dimensional testing, R & D testing, and user-side remote monitoring. And the above circuit board detection method can detect either single detection points or multiple detection points, improving the detection efficiency.

[0074] Next, in combination with Figure 3 The specific implementation process of the circuit board detection method provided by the embodiments of the present application will be described in detail. Figure 3 According to the embodiments of the present application, a flowchart of a circuit board detection method is shown.

[0075] Figure 3 The specific steps are as follows:

[0076] 301: The detection circuit is connected to the circuit board to be detected through an idle pin, and an electrical detection signal is input into the circuit board to be detected.

[0077] It can be understood that after determining the corresponding detection circuit, the detection circuit is connected to the circuit board to be detected through an idle pin. Furthermore, the detection circuit inputs an electrical detection signal into the circuit board to be detected through this idle pin. The specific input form of the electrical detection signal can refer to the relevant descriptions in Embodiment 1 and Embodiment 2 below, and will not be elaborated here.

[0078] 302: Determine whether the solder balls in the circuit board to be detected are damaged according to the output detection signal.

[0079] It can be understood that according to the output detection signal and in combination with the corresponding judgment conditions, it is determined whether the circuit board to be detected has a fault condition. The reading method of the above output detection signal can be implemented by any one of the methods shown in Embodiment 1 and Embodiment 2 above, and will not be elaborated here.

[0080] When the circuit board to be detected is damaged, step 303 is executed to determine that the solder balls in the circuit board to be detected are damaged;

[0081] When the circuit board to be detected is not damaged, step 304 is executed to determine that the solder balls in the circuit board to be detected are normal, and the detection ends.

[0082] 303: Determine that the solder balls in the circuit board to be detected are damaged.

[0083] It can be understood that according to the output detection signal and in combination with the judgment conditions, it is determined that the solder balls in the circuit board to be detected are damaged. Among them, the above judgment conditions will be described in detail in Embodiment 1 and Embodiment 2 below, and will not be elaborated here.

[0084] 304: Determine that the circuit board to be detected is normal.

[0085] Exemplarily, when the circuit board to be detected has no fault condition, it is determined that the circuit board to be detected is normal, and the detection ends.

[0086] The following will introduce in detail the specific implementation process of the circuit board detection method provided by this application in combination with embodiments.

[0087] Embodiment 1

[0088] In this embodiment, the detection circuit inputs a voltage into the circuit board to be detected through the reserved idle ground pin on the circuit board to be detected, then detects the level information of the detection point, and judges whether the connection of the detection point is normal according to the level information, so as to achieve the purpose of circuit board detection.

[0089] For example, when detecting the idle ground pins reserved on the circuit board to be detected, a GPIO can be set to connect to a detection point to detect the connection status of each detection point one by one. For example, as shown in the above Figure 2B shown. The specific detection method can refer to the relevant description of FIG. 2 above and will not be elaborated here.

[0090] Combined with Figure 2B , Figure 4 shows a flowchart of a circuit board detection method for a single detection point. Among them, the execution subject of the above circuit board detection method can be Figure 2B the detection circuit 201A in

[0091] Figure 4 The specific steps are as follows:

[0092] 401: Initialize the GPIO, set it to input mode and turn on the internal pull-up or external pull-up, and the VCC starts to supply power.

[0093] Exemplarily, as shown in 2B, the detection circuit 201 includes a control chip 201a. When the control chip 201a has a pull-up function, the detection circuit 201A does not include a pull-up resistor R0. The role of pull-up is to clamp the uncertain level signal (that is, it is impossible to determine whether the current level signal is low level, high level or floating) at a high level, improve the stability of the circuit, and thus improve the accuracy of the detection result.

[0094] It can be understood that after receiving the detection instruction, the control chip 201a of the detection circuit 201A initializes the GPIO, sets it to input mode, and the power supply voltage VCC starts to supply power. Due to the effect of pull-up, the level of the detection circuit 201A is high level.

[0095] 402: Determine whether the read GPIO is low level.

[0096] It can be understood that the detection circuit 201A is connected to the detection point P1, so the GPIO feeds back the level information of the detection point P1.

[0097] When it is determined that the read GPIO is low level, execute step 404 to determine that the circuit board 202 to be detected is normal and the detection is passed.

[0098] When it is determined that the read GPIO is high level, execute step 403 to determine that the circuit board 202 to be detected has a fault and report the fault.

[0099] 403: Determine that the circuit board to be detected is damaged and report a fault event.

[0100] It can be understood that when the connection of the detection point P1 is abnormal, such as the solder ball is broken, the detection point P1 is no longer grounded. At this time, since the control chip 201a in the detection circuit 201A has a pull-up function or the detection circuit 201 is provided with a pull-up resistor RO, the level of the circuit is pulled up to a high level, and the level of the detection point P1 is also a high level. Therefore, when it is determined that the read GPIO is high, it can be determined that the circuit board 202 to be detected is faulty, and at the same time, the fault event is reported and displayed, such as "The detection point P1 has a fault".

[0101] 404: Determine that the circuit board to be detected is normal and the detection is passed.

[0102] It can be understood that since the detection point P1 is grounded, the voltage division value of the detection point P1 is close to 0V. Therefore, the level of the detection point P1 is a low level. Therefore, when it is determined that the read GPIO is low, it indicates that the circuit board to be detected is normal, and the detection is passed at this time.

[0103] 405: Turn off the internal pull-up or turn off the external pull-up power supply.

[0104] It can be understood that after obtaining the detection result, the internal pull-up of the control chip 201a should be turned off or the power supply voltage VCC connected to the external pull-up resistor R0 should be disconnected.

[0105] For another example, by setting multiple GPIOs to connect to different detection points, it is possible to detect multiple different detection points simultaneously, reducing the detection time. For example, refer to Figure 5A As shown, the detection circuit 501 includes a control chip 501a, GPIO1, GPIO2, GPIO3, GPIO4, pull-up resistor R5, pull-up resistor R6, pull-up resistor R7, pull-up resistor R8, and four power supply voltages VCC. Among them, the power supply voltage VCC serves as the pull-up power supply VCC. The circuit board 202 to be detected includes a chip 201a (not marked in the figure), solder balls 202b (not marked in the figure), and a PCB board 202c. There are multiple idle grounding points on the circuit board 202 to be detected that can be used as detection points, such as P1, P2, P3, and P4. As shown in 5A, the detection point P1 is connected to the power supply voltage VCC through the pull-up resistor R5, the detection point P2 is connected to the power supply voltage VCC through the pull-up resistor R7, the detection point P3 is connected to the power supply voltage VCC through the pull-up resistor R6, and the detection point P4 is connected to the power supply voltage VCC through the pull-up resistor R8. The control chip 501a sets multiple GPIOs to connect to the corresponding detection points. For example, GPIO1 is connected to the detection point P1, GPIO2 is connected to the detection point P2, GPIO3 is connected to the detection point P3, and GPIO4 is connected to the detection point P4.

[0106] Continue to refer to Figure 5A, the control chip 501a initializes GPIO1, GPIO2, GPIO3, and GPIO4 simultaneously and sets GPIO1, GPIO2, GPIO3, and GPIO4 to input mode. Since the detection points P1, P2, P3, and P4 are all grounded, when the connections of the detection points are normal, the voltages of the detection points are all close to 0V, so the electrical levels of the detection points are all low levels. When there is an abnormal connection at the detection point, for example, when the solder ball of the detection point is broken, the detection point is no longer grounded and the electrical level of the detection point is high level.

[0107] It can be understood that the electrical level detection results of the above detection points can be fed back to the control chip 501a through their respective corresponding GPIOs. For example, if GPIO1 feeds back "1", it means that the electrical level of the detection point P1 is high level; if GPIO2 feeds back "0", it means that the electrical level of the detection point P2 is low level. The control chip 401a can display whether there is a fault in the circuit board 202 to be detected and the information of the detection point where the fault specifically occurs to the user or the tester according to the received feedback information, such as "display the fault of the detection point P1".

[0108] Combined with Figure 5A , Figure 5B shows a flowchart of a circuit board detection method with multiple detection points. Among them, the execution subject of the above circuit board detection method can be Figure 5A the detection circuit 501 in

[0109] The specific steps of Figure 5 are as follows:

[0110] 501: Initialize GPIO1 to GPIO4, set them to input mode and turn on the pull-up power supply VCC of the internal pull-up or external pull-up resistors R5 to R8 respectively.

[0111] Exemplarily, the detection circuit 501 includes a control chip 501a. After receiving the detection instruction, the control chip 501a of the detection circuit 501 initializes GPIO1, GPIO2, GPIO3, and GPIO4, sets the multiple GPIOs to input mode, and the multiple power supply voltages VCC start to supply power. Due to the pull-up effect, the electrical level of the detection circuit 501 is high level.

[0112] 502: Determine whether the multiple GPIOs read are all low levels.

[0113] It can be understood that the detection circuit 501 is respectively connected to the detection point P1, the detection point P2, the detection point P3, and the detection point P4. Therefore, the electrical level information of the corresponding detection points is fed back by each GPIO.

[0114] When it is determined that the multiple GPIOs read are all low levels, execute step 504 to determine that the circuit board is normal and the detection is passed.

[0115] When it is determined that there is a high level among the multiple GPIOs read, step 503 is executed to determine that the circuit board is damaged and report the fault.

[0116] 503: Determine that the circuit board to be detected is damaged and report the fault event.

[0117] It can be understood that when the detection point is abnormally connected, for example, when the solder ball is broken, the detection point is no longer grounded. Due to the pull-up effect, the level of the circuit is pulled up to a high level, and the level of the detection point is also a high level. Therefore, when it is determined that the read GPIO is high, it can be determined that the circuit board 202 to be detected is faulty. It should be understood that when at least one of the read GPIOs is at a high level, it can be determined that the circuit board 202 to be detected is damaged and the fault event is reported. For example, when it is determined that the read GPIO2 is at a high level, it indicates that the level of the detection point P2 is high, the detection point P2 has an abnormal connection, the circuit board 202 to be detected is faulty, and at the same time the fault event is reported and displayed, such as "The detection point P2 has a fault".

[0118] 504: Determine that the circuit board to be detected is normal and the detection is passed.

[0119] It can be understood that since the detection points P1 to P4 are grounded, the voltage division values of the detection points P1 to P4 are close to 0V, so the levels of the detection points P1 to P4 are low levels. When it is determined that the read GPIO is low, it indicates that the circuit board 202 to be detected is normal, and the detection is passed at this time. It should be understood that when it is determined that all of the read GPIO1 to GPIO4 are low levels, it is determined that the circuit board 202 to be detected is normal and the detection is passed.

[0120] 505: Turn off the pull-up power supply VCC of the internal pull-up or the external pull-up resistors R5 to R8.

[0121] It can be understood that after obtaining the detection result, the internal pull-up of the control chip 501a should be turned off or the pull-up power supply VCC connected to the external pull-up resistors R5 to R8 should be disconnected.

[0122] In this embodiment, the detection circuit inputs a voltage into the circuit board to be detected through the idle ground pins reserved on the circuit board to be detected, and determines whether there is a fault in the circuit board to be detected according to the detected level information, so as to achieve the purpose of circuit board detection.

[0123] Next, another embodiment will be introduced. When the pins reserved at the edge of the circuit board to be detected are bump pins, multiple pins at the edge can be connected, and a voltage or current is input through the pin at the beginning of the wire, and then the voltage value or current value of the pin at the end of the wire is detected, and then whether the circuit board has a break is determined according to the above voltage value or current value.

[0124] Embodiment 2

[0125] For example, when the pins reserved at the edge of the circuit board to be detected are bump pins, multiple pins at the edge can be connected. Then, voltage is input through the pin at the starting end of the wire, and the voltage value of the pin at the ending end of the wire is detected. Furthermore, it is determined whether the circuit board has a break according to the above voltage value. As Figure 6A shown

[0126] Refer to Figure 6A shown Figure 6A It includes a detection circuit 601 and a circuit board 202 to be detected. Among them, the detection circuit 201 further includes an input circuit 601a and a detection device 601b. The above input circuit 601a may include a voltage source V2 and a switch K2. The detection device 601b may be a detection device for voltage values, such as a voltmeter, an ammeter, and a multimeter, etc., which is not limited here. The circuit board 202 to be detected includes a chip 202a (not marked in the figure), solder balls 202b (not marked in the figure), and a PCB board 202c. There are multiple idle bump pins on the circuit board 202c to be detected that can be used as detection points, such as B1, B2, B3, and B4.

[0127] It can be understood that by setting wire X1, wire X2, and wire X3, the detection points B1 to B4 are connected. Among them, wire X1 and wire X2 are set inside the chip 202a, and wire X3 is set on the PCB board 202c. When detecting the circuit board, switch K2 is turned on, and the input circuit 601a inputs voltage through the pin at the starting end of the wire, that is, B1 in the figure, and the detection device 601b detects the voltage value of the pin at the ending end of the wire, that is, detection point B2. When the detected voltage value is zero, it indicates that at least one of the solder balls at the above multiple detection points has a break or other conditions.

[0128] Combined with Figure 6A , Figure 6B shows a flowchart of a circuit board detection method using a voltage source. Among them, the execution subject of the above circuit board detection method can be Figure 6A the detection circuit 601 in

[0129] The specific steps of FIG. 6 are as follows:

[0130] 601: Initialize the voltage source, set the voltage of the voltage source to V, and turn on the voltage source.

[0131] It can be understood that the detection circuit 601 initializes the voltage source to its initial settings and states, sets the voltage of the voltage source to V, and turns on the voltage source. Among them, the voltage value V of the above voltage source can be reasonably set according to actual application requirements, but it cannot exceed the maximum voltage value that the circuit board 202 to be detected can withstand.

[0132] 602: Determine whether the voltage value of the voltmeter is zero.

[0133] It can be understood that in step 601, a voltage is input through the pin at the starting end of the wire, and then the voltage value of the pin at the ending end of the wire is detected by the voltmeter. Then, based on the detected voltage value, it is determined whether the circuit board 202 to be detected is damaged.

[0134] When it is determined that the voltage value of the voltmeter is zero, step 603 is executed to determine the fault of the circuit board 202 to be detected;

[0135] When it is determined that the voltage value of the voltmeter is not zero, step 604 is executed to detect the current value of the pin at the ending end of the wire.

[0136] 603: Determine the fault of the circuit board to be detected.

[0137] It can be understood that when the detected voltage value is zero, it indicates that at least one solder ball at the detection points on the circuit board to be detected is broken or the like. Then, the fault of the circuit board 202 to be detected is determined.

[0138] 604: Turn off the voltmeter, turn on the ammeter, and the internal resistance of the ammeter is R.

[0139] It can be understood that when the solder ball of one of the detection points is partially broken, the voltage value is also not zero. Therefore, the above situation cannot be detected by the voltage value. Based on this, an ammeter with an internal resistance of R can be set. When the solder balls at each detection point are normal, the current value of the pin at the ending end of the wire is V / R. When a detection point is partially broken, the impedance in the circuit will increase, and the current value of the pin at the ending end of the wire is not V / R.

[0140] 605: Determine whether the current value is the set value V / R.

[0141] When it is determined that the current value is the set value V / R, step 607 is executed to determine that the circuit board 202 to be detected passes the detection;

[0142] When it is determined that the current value is not the set value V / R, step 606 is executed to determine that the circuit 202 to be detected fails the detection and report the fault.

[0143] 606: Determine that the circuit board to be detected fails the detection and report the fault event.

[0144] It can be understood that when it is determined that the voltage value of the voltmeter is zero or when it is determined that the current value is not the set value V / R, at least one solder ball at the above-mentioned detection points is broken or partially broken or the like. Based on this, it is determined that the circuit board 202 to be detected fails the detection and a fault event is reported, such as reporting that "the circuit board to be detected has a fault".

[0145] 607: Determine that the circuit board to be detected passes the detection.

[0146] It can be understood that when the judged current value is the set value V / R, it indicates that all the above-mentioned detection points are normally connected, and then it is determined that the circuit board 202 to be detected passes the detection.

[0147] 608: Turn off the voltage source and the ammeter.

[0148] Exemplarily, after determining the detection result of the circuit board 202 to be detected, in order to prevent the occurrence of circuit leakage, it is also necessary to turn off the voltage source and at the same time turn off the ammeter.

[0149] It can be understood that current can also be input through the pin at the starting end of the wire, and then the current value of the pin at the ending end of the wire is detected. Furthermore, according to the above current value, it is determined whether the circuit board has a break. As Figure 7A shown, the detection circuit 701 includes an input circuit 701a and a detection device 701b. Among them, the input circuit 701a includes a current source A2 and a switch K3. The detection device 701b can be an ammeter A or a multimeter, etc., which is not limited here. For the relevant explanations of the circuit board 202 to be detected and the wires X1, X2, and X3, reference can be made to Figure 6A the relevant descriptions therein, which will not be elaborated here.

[0150] When performing circuit board detection, turn on the switch K3. The input circuit 701a inputs current through the pin at the starting end of the wire, that is, B1 in the figure, and the detection device 701b detects the current value of the pin at the ending end of the wire, that is, the detection point B2. When the detected current value is zero, it indicates that at least one of the above-mentioned multiple detection points has a broken solder ball or other conditions. Furthermore, it indicates that there is a fault in the circuit board 202 to be detected.

[0151] Furthermore, the current value can be gradually increased to the set maximum value to further stimulate the micro-damage fault. For example, when the solder ball at the detection point B2 is partially broken, the input current value can be increased so that the solder ball at the detection point B2 is completely broken. It should be understood that the purpose of this step is to reduce the number of detections of the circuit board 202 to be detected, pre-determine whether there is a hidden danger of solder ball breakage in the circuit board 202 to be detected, and solve the breakage hidden danger in time.

[0152] It can be understood that in combination with Figure 7A , Figure 7B shows a flowchart of a circuit board detection method using a current source.

[0153] 701: Initialize the current source, and set the initial current to I1 and the initial current increment multiple N to 0.

[0154] Exemplarily, the above initial current I1 can be any current value not exceeding the maximum current value that the circuit board 202 to be detected can withstand, and no limitation is made here.

[0155] 702: Set the detection current of the current source to I1 + N*S, and turn on the current source.

[0156] It can be understood that in this embodiment, as Figure 7A shown, in order to know in advance whether there is a hidden danger of solder ball fracture in the circuit board 202 to be detected, it is also necessary to gradually increase the current value to the set maximum value. Therefore, set the detection current of the current source to I1 + N*S. Where S is the current increment, which is a fixed value, for example, set to 100 mA, 200 mA, etc., and no limitation is made here.

[0157] 703: Determine whether the current value of the ammeter is zero.

[0158] It can be understood that when all the detection points are connected normally, the value of the ammeter is not zero. Correspondingly, when at least one of the detection points has an abnormal connection, the value of the ammeter is zero.

[0159] When it is determined that the current value of the ammeter is zero, execute step 705 to determine that the circuit board 202 to be detected fails the detection, and report a fault event.

[0160] When it is determined that the current value of the ammeter is not zero, execute step 704 to gradually increase the detection current.

[0161] 704: The current increment multiple N = N + 1, and N is not greater than the maximum value.

[0162] When it is determined that the current value of the ammeter is not zero, gradually increase the value of the current increment multiple N, and N is not greater than the maximum value.

[0163] When N is not greater than the maximum value, execute step 702 to gradually increase the detection current, and continue to determine whether the ammeter value is zero;

[0164] When N is greater than the maximum value, execute step 706 to determine that the circuit board 202 to be detected fails the detection, and report a fault event.

[0165] 705: Determine that the circuit board to be detected fails the detection, and report a fault event.

[0166] It can be understood that when it is determined that the current value of the ammeter is zero, the solder balls of at least one of the above multiple detection points are fractured or the like. Based on this, it is determined that the circuit board 202 to be detected fails the detection, and a fault event is reported, such as reporting "a fault occurs in the circuit board to be detected".

[0167] 706: Determine that the circuit board to be detected passes the detection.

[0168] When the current multiplication factor N is greater than the maximum value and the current value of the ammeter is not zero, it indicates that the connections at each detection point are normal, and it is determined that the circuit board 202 to be detected passes the detection.

[0169] 707: Turn off the current source and the ammeter.

[0170] It can be understood that after the detection is completed, it is necessary to turn off the current source and the ammeter, and the detection circuit no longer inputs the detection current to the circuit board to be detected.

[0171] In this embodiment, when it is impossible to add detection devices, such as a voltmeter, an ammeter, etc., to detect the detection signals output by the pins at the end of the side line, the Figure 8A detection circuit shown can be used to implement a circuit board detection method with zero detection devices. Refer to Figure 8A , Figure 8A It includes a detection circuit 801 and a circuit board 202 to be detected. Among them, the detection circuit 801 further includes a control chip 801a, GPIO5, a pull-down resistor R, and a capacitor C1. For the relevant explanations of the circuit board 202 to be detected and the side lines X1, X2, and X3, reference can be made to the relevant descriptions in Figure 6A and will not be elaborated here.

[0172] Continue to refer to Figure 8A , the control chip 801a is connected to the circuit board 202 to be detected through the detection point B1, and the detection point B3 is grounded through the capacitor C1. The pull-down resistor R pulls down the level in the circuit to a stable low level, ensuring the stable state of GPIO5 when reading the level information and improving the accuracy of the reading result. When performing circuit board detection, the control chip 801a first initializes GPIO5 and sets GPIO5 to the mode of outputting a high level. Then, after a delay time T, GPIO5 is set to the input mode, and the capacitor C1 discharges. At this time, the level of GPIO5 is read, and the corresponding level information is judged according to the voltage value. It should be understood that the above delay time T is both the interval time for the control chip 801a to switch GPIO5 from the output mode to the input mode and the charging time required for the capacitor C1. When the read GPIO5 is at a high level, it indicates that the connections at each detection point of the circuit board 202 to be detected are normal; when the read GPIO5 is at a low level, it indicates that there is an abnormality in the connection of at least one detection point in the circuit board 202 to be detected. For example, if the solder ball at the detection point B4 is broken, the read GPIO5 is at a low level.

[0173] It can be understood that in combination with Figure 8A, Figure 8B a flowchart of a circuit board detection method with zero detection devices is provided. Among them, the execution subject of the above circuit board detection method can be Figure 8A the detection circuit 801 in

[0174] The specific steps are as follows:

[0175] 801: Initialize GPIO5, set GPIO5 to output mode and output high level.

[0176] It can be understood that the detection circuit 801 further includes a control chip 801a. After receiving the detection instruction, the control chip 801a initializes GPIO5, sets it to output mode, and outputs high level to charge the capacitor C1.

[0177] 802: Within the delay time TI, the capacitor C1 is fully charged.

[0178] Exemplarily, the above delay time T is both the interval time for the control chip 801a to switch GPIO5 from output mode to input mode and the time required for the capacitor C1 to be charged.

[0179] 803: Set GPIO5 to input mode and read the level information of GPIO5.

[0180] It can be understood that the control chip 801a of the detection circuit 801 sets GPIO5 to input mode and reads the level information of GPIO5. Generally, the voltage of GPIO5 is read first, and then the level information of GPIO5 is determined according to the read voltage.

[0181] 804: Determine whether the level of the read GPIO5 is high level.

[0182] When it is determined that the level of the read GPIO5 is high level, execute step 806 to determine that the circuit board to be detected passes the detection.

[0183] When it is determined that the level of the read GPIO5 is low level, execute step 805 to determine that the circuit board to be detected fails the detection and report a fault.

[0184] 805: Determine that the circuit board to be detected fails the detection and report a fault event.

[0185] When it is determined that the level of the read GPIO5 is low level, it indicates that at least one of the detection points is abnormally connected. Therefore, it can be determined that the circuit board 202 to be detected fails the detection and report the result of the failed detection. For example, report "The circuit board to be detected has a fault".

[0186] 806: Determine that the circuit board to be detected passes the detection.

[0187] It can be understood that when it is determined that the level of the read GPIO5 is high level, it indicates that all the detection points are normally connected, and then it is determined that the circuit board 202 to be detected passes the detection.

[0188] 807: Set GPIO5 to high impedance state.

[0189] It can be understood that after determining the detection result, GPIO5 needs to be set to the high-impedance state. It should be understood that configuring GPIO5 to the high-impedance state can prevent the detection circuit 801 from interfering with the circuit board 202 to be detected.

[0190] In some embodiments, after determining that there is a solder ball breakage in the circuit board to be detected, it is also necessary to continue to detect the position of the broken solder ball, that is, to determine the fault position. For example, an analog-to-digital converter (ADC) is used to sample the voltage values of the above-mentioned pins, and the position of the broken solder ball is determined based on the sampled voltage values. For example, as shown above Figure 2D shown. The specific detection method can refer to the relevant description of the above Figure 2D and will not be elaborated here.

[0191] It can be understood that in combination with the above circuit structure diagram for determining the fault position, Figure 9 a schematic flow diagram for determining the fault position is shown. Among them, the execution subject of the above-mentioned process for determining the fault position can be Figure 2D the sampling circuit 301 in

[0192] As Figure 9 shown, the implementation process may include the following steps:

[0193] 901: Initialize the ADC, turn on the switch K1, and the supply voltage VCC starts to supply power.

[0194] It can be understood that when determining the failure fault position, the ADC needs to be initialized and the switch K1 needs to be turned on to ensure that the sampled voltage value is the divided voltage value of the circuit board 202 to be detected. Among them, the above ADC can be implemented by hardware or by software code, and no limitation is made here.

[0195] 902: Determine whether the voltage value read by the ADC is zero.

[0196] It can be understood that when the connections from the detection point N1 to the detection point N4 are all normal, the voltage value sampled by the ADC is equivalent to the divided voltage value of the detection point N2. Since the detection point N2 is directly grounded, the divided voltage value of the detection point N2 is zero.

[0197] When it is determined that the voltage value read by the ADC is zero, step 903 is executed to determine that the detection of the circuit board 202 to be detected passes;

[0198] When it is determined that the voltage value read by the ADC is not zero, step 904 is executed to further determine the voltage value read by the ADC.

[0199] 903: Determine that the detection of the circuit board to be detected passes.

[0200] It can be understood that when the connections from detection point N1 to detection point N4 are all normal, the voltage value sampled by the ADC is equivalent to the voltage division value of detection point N2. Since detection point N2 is directly grounded, the voltage division value of detection point N2 is zero. Therefore, when it is determined that the voltage value read by the ADC is zero, it can be determined that the circuit board 202 to be detected passes the detection.

[0201] 904: Determine whether the voltage value read by the ADC is the first voltage division value.

[0202] Exemplarily, referring to Figure 2D the sampling circuit 301 shown, the above-mentioned first voltage division value can be

[0203]

[0204] When it is determined that the voltage value read by the ADC is the first voltage division value, execute step 905 to determine that the solder ball corresponding to detection point N2 is damaged;

[0205] When it is determined that the voltage value read by the ADC is not the first voltage division value, execute step 906 to further determine the voltage value read by the ADC.

[0206] 905: Determine that the solder ball corresponding to detection point N2 is damaged.

[0207] It can be understood that when the connection of detection point N2 is abnormal, that is, when the solder ball corresponding to detection point N2 is damaged, the voltage value sampled by the ADC is equivalent to the voltage value corresponding to detection point N4. Therefore, when the voltage value read by the ADC is equal to the first voltage division value, it can be determined that the solder ball corresponding to detection point N2 is damaged.

[0208] 906: Determine whether the voltage value read by the ADC is the second voltage division value.

[0209] Exemplarily, referring to Figure 2D the sampling circuit 301 shown, the above-mentioned second voltage division value can be:

[0210]

[0211] When it is determined that the voltage value read by the ADC is the second voltage division value, execute step 907 to determine that the solder ball corresponding to detection point N4 is damaged;

[0212] When it is determined that the voltage value read by the ADC is not the second voltage division value, execute step 908 to further determine the voltage value read by the ADC.

[0213] 907: Determine that the solder ball corresponding to detection point N4 is damaged.

[0214] It can be understood that when the detection point N4 is abnormally connected, that is, when the solder ball corresponding to the detection point N4 is damaged, the voltage value sampled by the ADC is equivalent to the voltage value corresponding to the detection point N3. Therefore, when the voltage value read by the ADC is equal to the second divided voltage value, it can be determined that the solder ball corresponding to the detection point N4 is damaged.

[0215] 908: Determine whether the voltage value read by the ADC is the third divided voltage value.

[0216] Exemplarily, referring to Figure 2D the sampling circuit 301 shown, the above-mentioned third divided voltage value can be:

[0217]

[0218] When it is determined that the voltage value read by the ADC is the third divided voltage value, execute step 909 to determine that the solder ball corresponding to the detection point N3 is damaged;

[0219] When it is determined that the voltage value read by the ADC is not the third divided voltage value, execute step 910 to further determine the voltage value read by the ADC.

[0220] 909: Determine that the solder ball corresponding to the detection point N3 is damaged.

[0221] It can be understood that when the detection point N3 is abnormally connected, that is, when the solder ball corresponding to the detection point N3 is damaged, the voltage value sampled by the ADC is equivalent to the voltage value corresponding to the detection point N1. Therefore, when the voltage value read by the ADC is equal to the third divided voltage value, it can be determined that the solder ball corresponding to the detection point N3 is damaged.

[0222] 910: Determine whether the voltage value read by the ADC is the fourth divided voltage value.

[0223] Exemplarily, referring to Figure 2D the sampling circuit 301 shown, the above-mentioned fourth divided voltage value can be: VCC.

[0224] When it is determined that the voltage value read by the ADC is the fourth divided voltage value, execute step 911 to determine that the solder ball corresponding to the detection point N1 is damaged; 911: Determine that the solder ball corresponding to the detection point N1 is damaged.

[0225] It can be understood that when the detection point N1 is abnormally connected, that is, when the solder ball corresponding to the detection point N1 is damaged, the voltage value sampled by the ADC is equivalent to the supply voltage VCC. Therefore, when the voltage value read by the ADC is equal to the fourth divided voltage value, it can be determined that the solder ball corresponding to the detection point N1 is damaged.

[0226] 912: Determine that the circuit board to be detected fails the detection and report a fault event.

[0227] It can be understood that when any one or more solder balls corresponding to the detection points of detection circuit N1, detection circuit N2, detection circuit N3, and detection circuit N4 are damaged, it can be determined that the circuit board 202 to be detected fails the detection, and a fault event is reported, such as reporting "The solder ball at detection point N3 is damaged!".

[0228] 913: Turn off the ADC, disconnect switch K1, and the power supply voltage VCC stops power supply.

[0229] It can be understood that after the fault location is determined, the ADC needs to be turned off, switch K1 is disconnected, and the power supply voltage VCC stops power supply. It should be understood that the purpose of this step is to prevent the circuit board 202 to be detected from being damaged due to leakage.

[0230] In various embodiments of the present application, switch K0, switch K1, and switch 2 can all be metal-oxide-semiconductor field-effect transistors (MOS), or other controllable switch tubes, which are not limited herein.

[0231] Based on the above solution, it is possible to perform detection on the circuit board to be detected without any damage, and the detection result has high accuracy. In addition, the above solution is applicable to various application scenarios such as production line testing, high-dimensional testing, R & D testing, and user-end remote monitoring. Moreover, the above circuit board detection method can perform single detection point detection or multi-detection point detection, improving the detection efficiency.

[0232] Figure 10 According to the embodiments of the present application, a schematic diagram of the hardware structure of an electronic device is shown. The electronic device provided by the embodiments of the present application may include the above detection circuit, and the electronic device is not limited to various detection devices with detection functions.

[0233] As Figure 10 shown, the electronic device may include a processor 110 (or called a host), a power module 140, a memory 180, a mobile communication module 130, a wireless communication module 120, a sensor module 190, an audio module 150, a camera 170, an interface module 160, a button 101, a display screen 102, and a touch screen 103, etc.

[0234] It can be understood that the structure schematically shown in the embodiments of the present invention does not constitute a limitation on the only implementable manner of the electronic device. In other embodiments of the present application, the electronic device may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or have different component arrangements. The components shown in the figure can be implemented in hardware, software, or a combination of software and hardware.

[0235] The processor 110 may include one or more processing units. For example, it may include a processing module or processing circuit such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a Digital Signal Processor, a Micro-programmed Control Unit (MCU), an Artificial Intelligence (AI) processor, or a Field Programmable Gate Array (FPGA). Among them, different processing units may be independent devices or integrated in one or more processors. A storage unit may also be provided in the processor 110 for storing instructions and data. In some embodiments, the storage unit in the processor 110 is a cache memory 180, which can save the instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to use the instruction or data again, it can directly call it from the storage unit, avoiding repeated access, reducing the waiting time of the processor 110, and thus improving the efficiency of the system.

[0236] The controller can generate operation control signals according to the instruction operation code and timing signals to complete the control of fetching and executing instructions.

[0237] It can be understood that in the embodiments of the present application, the processor may include the above detection circuit, which can be used to execute the steps of the circuit board detection method of the present application.

[0238] The power supply module 140 may include a power supply, a power management component, etc. The power supply may be a battery. The power management component is used to manage the charging of the power supply and the power supply to other modules. In some embodiments, the power management component includes a charging management module and a power management module. The charging management module is used to receive the charging input from the charger; the power management module is used to connect the power supply, and the charging management module is connected to the processor 110. The power management module receives the input of the power supply and / or the charging management module and supplies power to the processor 110, the display screen 102, the camera 170, the wireless communication module 120, etc.

[0239] The mobile communication module 130 may include, but is not limited to, an antenna, a power amplifier, a filter, a low noise amplifier (LAN), etc. The mobile communication module 130 may provide solutions for wireless communications such as 2G / 3G / 4G / 5G applied to the electronic device. The mobile communication module 130 may receive electromagnetic waves through the antenna, filter, amplify, and process the received electromagnetic waves, and then transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 130 may also amplify the signal modulated by the modulation and demodulation processor and convert it into electromagnetic waves through the antenna for radiation. In some embodiments, at least some functional modules of the mobile communication module 130 may be provided in the processor 110. In some embodiments, at least some functional modules of the mobile communication module 130 and at least some modules of the processor 110 may be provided in the same device.

[0240] The wireless communication module 120 may include an antenna and realize the transceiver of electromagnetic waves through the antenna. The wireless communication module 120 may provide solutions for wireless communications such as wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared technology (IR), etc. applied to the electronic device.

[0241] In some embodiments, the mobile communication module 130 and the wireless communication module 120 of the electronic device may also be located in the same module.

[0242] The display screen 102 is used to display a human-machine interaction interface, images, videos, etc. The display screen 102 includes a display panel. The display panel may adopt a liquid crystal display (LCD), an organic light emitting diode (OLED), an active-matrix organic light emitting diode (AMOLED), a flexible light-emitting diode (FLED), a quantum dot light emitting diode (QLED), etc.

[0243] The sensor module 190 may include a proximity light sensor, a pressure sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, an electromagnetic wave absorption rate sensor, a sound sensor, etc.

[0244] The audio module 150 is used to convert a digital audio signal into an analog audio signal for output, or convert an analog audio input into a digital audio signal. The audio module 150 can also be used to encode and decode audio signals. In some embodiments, the audio module 150 may be disposed in the processor 110, or some functional modules of the audio module 150 may be disposed in the processor 110. In some embodiments, the audio module 150 may include a speaker, a receiver, a microphone, and a headphone jack.

[0245] The camera 170 is used to capture a static image or video. An object generates an optical image through a lens and projects it onto a photosensitive element. The photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to an Image Signal Processing (ISP) to convert it into a digital image signal. The electronic device can implement a shooting function through the ISP, the camera 170, a video codec, a Graphic Processing Unit (GPU), the display screen 102, and an application processor, etc.

[0246] The interface module 160 includes an external memory interface, a universal serial bus (USB) interface, etc. Among them, the external memory interface can be used to connect an external memory card, such as a Micro SD card, to implement the storage capacity expansion of the electronic device. The external memory card communicates with the processor 110 through the external memory interface to implement the data storage function. The universal serial bus interface is used for the electronic device to communicate with other electronic devices.

[0247] In some embodiments, the electronic device further includes a key 101, a motor, and an indicator, etc. Among them, the key 101 may include a volume key, a power on / off key, etc. The motor is used to make the electronic device generate a vibration effect, and different application scenarios (such as time reminder, receiving information, alarm clock, game, etc.) can correspond to different vibration feedback effects. The indicator may include a laser indicator, a radio frequency indicator, a light emitting diode (LED) indicator, etc.

[0248] This application provides a readable storage medium, wherein instructions are stored on the readable storage medium, and when the instructions are executed on the electronic device, the electronic device executes the circuit board detection method mentioned in this application.

[0249] The various embodiments disclosed in this application can be implemented in hardware, software, firmware, or a combination of these implementation methods. The embodiments of this application can be implemented as a computer program or program code executed on a programmable system, which includes at least one processor, a storage system (including volatile and non-volatile memories and / or storage elements), at least one input device, and at least one output device.

[0250] The program code can be applied to the input instructions to perform the various functions described in this application and generate output information. The output information can be applied to one or more output devices in a known manner. For the purposes of this application, a processing system includes any system having a processor such as, for example, a digital signal processor, a microcontroller, an application specific integrated circuit, or a microprocessor.

[0251] The program code can be implemented in a high-level procedural language or an object-oriented programming language in order to communicate with the processing system. When needed, the program code can also be implemented in assembly language or machine language. In fact, the mechanisms described in this application are not limited to the scope of any particular programming language. In any case, the language can be a compiled language or an interpreted language.

[0252] In some cases, the disclosed embodiments can be implemented in hardware, firmware, software, or any combination thereof. The disclosed embodiments can also be implemented as instructions carried or stored on one or more transient or non-transient machine-readable (e.g., computer-readable) storage media, which can be read and executed by one or more processors. For example, the instructions can be distributed via a network or via other computer-readable media. Thus, a machine-readable medium can include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computer), including but not limited to, a floppy disk, a compact disc, an optical disc, a magneto-optical disc, a read-only memory (ROM), a random access memory (RAM), a magnetic card or an optical card, a flash memory, an electrically erasable programmable read-only memory (EEPROM), or a tangible machine-readable memory for transmitting information (e.g., carrier waves, infrared signals, digital signals, etc.) in the form of electrical, optical, acoustic, or other propagated signals using the Internet. Thus, a machine-readable medium includes any type of machine-readable medium suitable for storing or transmitting electronic instructions or information in a form readable by a machine (e.g., a computer).

[0253] In the accompanying drawings, some structural or method features may be shown in a specific arrangement and / or order. However, it should be understood that such specific arrangements and / or orderings may not be required. Instead, in some embodiments, these features may be arranged in a manner and / or order different from that shown in the illustrative drawings. Additionally, the inclusion of a structural or method feature in a particular figure does not imply that such a feature is required in all embodiments, and in some embodiments, these features may be omitted or combined with other features.

[0254] It should be noted that each unit / module mentioned in the device embodiments of the present application is a logical unit / module. Physically, a logical unit / module can be a physical unit / module, a part of a physical unit / module, or can be implemented as a combination of multiple physical units / module. The physical implementation manner of these logical units / module themselves is not the most important. The combination of the functions implemented by these logical units / module is the key to solving the technical problems proposed by the present application. In addition, in order to highlight the innovative part of the present application, the above device embodiments of the present application do not introduce units / modules that are not closely related to solving the technical problems proposed by the present application. This does not mean that there are no other units / modules in the above device embodiments.

[0255] It should be noted that in the examples and descriptions of this patent, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising one" does not exclude the presence of additional identical elements in the process, method, article or device comprising the above element.

[0256] The reference in the specification to "one embodiment" or "an embodiment" means that the specific features, structures, or characteristics described in connection with the embodiment are included in at least one exemplary embodiment or technique disclosed in accordance with the embodiments of the present application. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily all refer to the same embodiment.

[0257] Although the present application has been illustrated and described by reference to certain preferred embodiments thereof, those of ordinary skill in the art should understand that various changes can be made in form and detail without departing from the scope of the present application.

Claims

1. A circuit board detection method, characterized in that, the circuit board includes a substrate, a connection part and a chip, the chip is fixed on the substrate through the connection part, and the chip is electrically connected to the substrate through the connection part; and the method includes: determining at least one idle pin in the chip; inputting an electrical detection signal to the at least one idle pin, and reading the detection signal corresponding to the output end of the at least one idle pin, and determining whether the connection part is damaged based on the detection signal corresponding to the output end of the at least one idle pin, the idle pin is a ground pin, and the idle pin is a pin reserved for chip detection at the edge of the chip; wherein, the at least one idle pin is a plurality of bump pins, and the inputting an electrical detection signal to the at least one idle pin, and reading the detection signal corresponding to the output end of the at least one idle pin, and determining whether the connection part is damaged based on the detection signal corresponding to the output end of the at least one idle pin includes: connecting the plurality of bump pins through a side line; inputting a voltage to the bump pin at the first end of the side line among the plurality of bump pins, and reading the voltage value corresponding to the bump pin at the second end of the side line among the plurality of bump pins; when the voltage value is zero, determining that the connection part is damaged; when the voltage value is not zero, reading the first current value corresponding to the bump pin at the second end of the side line among the plurality of bump pins; when the first current value is a first predetermined value, determining that the connection part is not damaged; when the first current value is not the first predetermined value, determining that the connection part is damaged.

2. The method according to claim 1, characterized in that, the inputting an electrical detection signal to the at least one idle pin to determine whether the connection part is damaged includes: inputting a voltage signal to the at least one idle pin, and reading the level signal corresponding to the output end of the at least one idle pin; when the level signal is a high level signal, determining that the connection part is damaged.

3. The method according to claim 2, characterized in that, the inputting an electrical detection signal to the at least one idle pin to determine whether the connection part is damaged further includes: when the level signal is a low level signal, determining that the connection part is not damaged.

4. The method according to any one of claims 2-3, characterized in that, it includes: the inputting an electrical detection signal to the at least one idle pin includes: inputting a high level voltage signal to the at least one idle pin.

5. The method according to claim 1, characterized in that, the at least one idle pin is a plurality of bump pins, and the inputting an electrical detection signal to the at least one idle pin to determine whether the connection part is damaged includes: connecting the plurality of bump pins through a side line; inputting a current to the bump pin at the first end of the side line among the plurality of bump pins, and reading the second current value corresponding to the bump pin at the second end of the side line among the plurality of bump pins; When the second current value is zero, it is determined that the connection part is damaged.

6. The method according to claim 5, wherein, determining whether the connection part is damaged by inputting an electrical detection signal to the at least one idle pin further includes: when the second current value is not zero, gradually increasing the input current of the bump pin at the first end located on the side line among the plurality of bump pins; when the input current is greater than the current threshold and the second current value is not zero, it is determined that the connection part is not damaged.

7. The method according to claim 1, wherein, the at least one idle pin is a plurality of bump pins, and determining whether the connection part is damaged by inputting an electrical detection signal to the at least one idle pin further includes: connecting the plurality of bump pins through a side line; connecting the bump pin at the second end located on the side line among the plurality of bump pins to ground through a capacitor, and charging the capacitor within a first period of time; reading the level signal corresponding to the bump pin at the second end located on the side line among the plurality of bump pins; when the level signal is a low level signal, it is determined that the connection part is damaged.

8. The method according to claim 7, wherein, determining whether the connection part is damaged by inputting an electrical detection signal to the at least one idle pin further includes: when the level signal is a high level signal, it is determined that the connection part is not damaged.

9. The method according to claim 2, the connection part includes at least one connection point; determining that the connection part is damaged, includes: determining that the connection point corresponding to the idle pin with a high level signal among the at least one idle pin is damaged.

10. The method according to claim 1, wherein, the connection part includes at least one connection point; the method further includes: connecting a preset number of bump pins among the plurality of bump pins to ground respectively after connecting corresponding resistors, acquiring the voltage value output by the circuit board; determining the damaged connection point of the connection part according to the voltage value and at least one preset voltage threshold, and the connection point corresponds to the idle pin.

11. An electronic device, wherein, comprises: a memory and a processor, the memory is used to store instructions executed by one or more processors of the electronic device, and the processor is one of the one or more processors of the electronic device, and is used to execute the circuit board detection method according to any one of claims 1-10.

12. A readable storage medium, wherein, instructions are stored on the readable storage medium, and when the instructions are executed on an electronic device, the electronic device is caused to execute the circuit board detection method according to any one of claims 1-10.

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