Intelligent power modules and electronic devices

Abstract

The invention discloses an intelligent power module and an electronic device, wherein the intelligent power module comprises: a plastic package; a substrate; a drive side lead frame; a power pad comprises a drive side connecting rod base island, the drive side connecting rod base island is arranged at a first side end angle, a portion of the drive side pin is extended toward the drive side connecting rod base island to form a drive side connecting rod, and an end of the drive side connecting rod is connected to the drive side connecting rod base island; a power side pin, the power pad also comprises a power side connecting rod base island, the power side connecting rod base island is arranged at a second side end angle, a portion of the power side pin is extended toward the power side connecting rod base island to form a power side connecting rod, and an end of the power side connecting rod is connected to the power side connecting rod base island. Thus, under the premise of avoiding the generation of overflow defects on the substrate surface, not only can the process complexity be reduced, but also the area on the power pad for arranging power chips can be increased, the use performance of the intelligent power module can be improved, and the reliability of the intelligent power module can also be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an intelligent power module and electronic equipment. Background Art

[0002] An intelligent power module usually includes a substrate, a power chip, a driver chip, a lead frame and a connecting rod. The connecting rod is arranged on the lead frame to press the substrate during the manufacturing process to prevent the plastic packaging material from overflowing onto the substrate surface and causing overflow defects on the substrate surface.

[0003] In the related art, a connecting rod is usually set separately on the lead frame, and the connecting rod is a non-functional pin. Although this can avoid the defect of overflow on the substrate surface, there are also problems such as the connecting rod needs to be cut separately during the forming of the rib, which increases the complexity of the process and easily causes the plastic package to crack, and the connecting rod occupies the substrate area, affecting the placement of large-size chips. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an intelligent power module, which has higher reliability and better performance.

[0005] Another object of the present invention is to provide an electronic device.

[0006] The intelligent power module according to the embodiment of the present invention comprises: a plastic package; a substrate, the substrate is arranged in the plastic package, the bottom surface of the substrate is flush with the bottom surface of the plastic package and exposed from the plastic package, the substrate is provided with a power pad, and the power pad is provided with a power chip; a drive side lead frame, the drive side lead frame is arranged in the plastic package and is arranged at intervals on one side of the first direction of the substrate, the drive side lead frame comprises a drive side pin and a drive pad, a part of the drive side pin is protruded toward the first direction away from the side of the substrate to form a drive pad The drive side pin comprises a functional pin and a supporting pin, wherein the functional pin extends in a first direction away from a side of the substrate and extends out of the plastic package body for being electrically connected to an external electrical device, and the supporting pins are connected to both sides of the drive pad in a second direction, and the supporting pins on both sides of the drive pad in the second direction extend to both sides of the plastic package body in the second direction respectively to support both sides of the drive pad; the power pad comprises a chip base island and a drive side connecting rod base island, wherein the chip base island and the drive side connecting rod base island are spaced apart and insulated from each other, and the power chip is arranged The drive side connecting rod base island is arranged on the chip base island, and the end of the substrate adjacent to the drive side pin has a first side end angle, the drive side connecting rod base island is arranged at the first side end angle, and part of the drive side pin is extended toward the drive side connecting rod base island to form a drive side connecting rod, and the end of the drive side connecting rod is connected to the drive side connecting rod base island, and the end of the drive side connecting rod is suitable for correspondingly abutting with the core pulling needle; the power side pin is arranged in the plastic package body and is located on the side of the substrate away from the drive pad in the first direction, and the power side pin is suitable for being electrically connected to the power chip, The power pad also includes a power side connecting rod base island, which is spaced apart from the chip base island and the driving side connecting rod base island and insulated from each other. The end of the substrate adjacent to the power side pin has a second side end angle, and the power side connecting rod base island is arranged at the second side end angle. Part of the power side pin extends toward the power side connecting rod base island to form the power side connecting rod, and the end of the power side connecting rod is connected to the power side connecting rod base island, and the end of the power side connecting rod is suitable for abutting against the corresponding core pulling pin, wherein the first direction and the second direction are perpendicular to each other.

[0007] Therefore, by setting the driving side connecting rod base island at the first side end angle, part of the driving side pin is extended toward the driving side connecting rod base island to form a driving side connecting rod, and the end of the driving side connecting rod is connected to the driving side connecting rod base island, and setting the power side connecting rod base island at the second side end angle, part of the power side pin is extended toward the power side connecting rod base island to form a power side connecting rod, and the end of the power side connecting rod is connected to the power side connecting rod base island, this can not only reduce the process complexity of the intelligent power module, but also increase the area on the power pad for arranging the power chip, improve the performance of the intelligent power module, and improve the reliability of the intelligent power module.

[0008] In some examples of the present invention, there are two first side end angles and they are respectively arranged at the two ends of the second direction of the substrate, at least one of the two first side end angles is provided with the driving side connecting rod base island, there is at least one driving side connecting rod and it is connected one-to-one with at least one driving side connecting rod base island; there are two second side end angles and they are respectively arranged at the two ends of the second direction of the substrate, at least one of the two second side end angles is provided with the power side connecting rod base island, there is at least one power side connecting rod and it is connected one-to-one with at least one power side connecting rod base island.

[0009] In some examples of the present invention, the two first side end angles are respectively the first end angle and the second end angle, the two second side end angles are respectively the third end angle and the fourth end angle, the first end angle and the third end angle are both located on one side of the second direction of the substrate, the second end angle and the fourth end angle are both located on the other side of the second direction of the substrate, the driving side connecting rod and the power side connecting rod are each one, the first end angle is provided with the driving side connecting rod base island, the fourth end angle is provided with the power side connecting rod base island, one end of the driving side connecting rod is connected to the first end angle, and one end of the power side connecting rod is connected to the fourth end angle; and / or the second end angle is provided with the driving side connecting rod base island, the third end angle is provided with the power side connecting rod base island, one end of the driving side connecting rod is connected to the second end angle, and one end of the power side connecting rod is connected to the third end angle.

[0010] In some examples of the present invention, the two first side end angles are respectively the first end angle and the second end angle, the two second side end angles are respectively the third end angle and the fourth end angle, the first end angle and the third end angle are both located on one side of the second direction of the substrate, the second end angle and the fourth end angle are both located on the other side of the second direction of the substrate, the first end angle and the second end angle are both provided with a driving side connecting rod base island, there are two driving side connecting rods, the ends of the two driving side connecting rods are respectively connected to the first end angle and the second end angle, the third end angle or the fourth end angle is provided with a power side connecting rod base island, there is one power side connecting rod, and one power side connecting rod is connected to the third end angle or the fourth end angle; and / or the third end angle and the fourth end angle are both provided with a power side connecting rod base island, there are two power side connecting rods, the ends of the two power side connecting rods are respectively connected to the third end angle and the fourth end angle, the first end angle or the second end angle is provided with a driving side connecting rod base island, there is one driving side connecting rod, and one driving side connecting rod is connected to the first end angle or the second end angle.

[0011] In some examples of the present invention, the two first side end angles are respectively the first end angle and the second end angle, the two second side end angles are respectively the third end angle and the fourth end angle, the first end angle and the third end angle are both located on one side of the second direction of the substrate, the second end angle and the fourth end angle are both located on the other side of the second direction of the substrate, the first end angle and the second end angle are both provided with a driving side connecting rod base island, the third end angle and the fourth end angle are both provided with a power side connecting rod base island, there are two driving side connecting rods and two power side connecting rods, the ends of the two driving side connecting rods are respectively connected to the first end angle and the second end angle, and the ends of the two power side connecting rods are respectively connected to the third end angle and the fourth end angle.

[0012] In some examples of the present invention, the support pin includes a first support pin portion and a second support pin portion, the first support pin portion is connected to one side of the drive pad in the second direction, the first support pin portion is extended in the second direction and extends to one side of the plastic package body in the second direction, the second support pin portion is connected to the other side of the drive pad in the second direction, the second support pin portion is extended in the second direction and extends to the other side of the plastic package body in the second direction, and portions of the first support pin portion and / or the second support pin portion are selectively extended toward the power pad to form the drive side connecting rod.

[0013] In some examples of the present invention, the power pad includes a low-voltage power pad and a high-voltage power pad, there are three low-voltage power pads, and there is one high-voltage power pad, the three low-voltage power pads and the one high-voltage power pad are arranged in sequence in the second direction, a low-voltage power chip is arranged on each of the three low-voltage power pads, and three high-voltage power chips are arranged in sequence in the second direction on one high-voltage power pad, the three low-voltage power pads include a first low-voltage power pad, a second low-voltage power pad and a third low-voltage power pad arranged in sequence in the second direction, compared with the first low-voltage power pad, the third low-voltage power pad is closer to the high-voltage power pad, the first side end angle is located on the side of the first low-voltage power pad and the high-voltage power pad facing the driving lead frame, the first side end angle on the first low-voltage power pad is located at an end of the first low-voltage power pad in the second direction away from the second low-voltage power pad, and the first side end angle on the high-voltage power pad is located at an end of the high-voltage power pad in the second direction away from the third low-voltage power pad.

[0014] In some examples of the present invention, there are multiple power side pins, and the multiple power side pins include a first power side pin, a second power side pin, a third power side pin, a fourth power side pin, a fifth power side pin and a sixth power side pin which are arranged in sequence and spaced apart in the second direction, the first power side pin, the second power side pin and the third power side pin are respectively connected to the three low-voltage power chips, the fourth power side pin, the fifth power side pin and the sixth power side pin are respectively connected to the three high-voltage power chips, the second side end angle is located on the side of the first low-voltage power pad and the high-voltage power pad facing the power side pin, the second side end angle on the first low-voltage power pad is located at an end of the first low-voltage power pad in the second direction away from the second low-voltage power pad, and the The second side end angle on the high-voltage power pad is located at an end of the high-voltage power pad in the second direction away from the third low-voltage power pad; the first power side pin and the second power side pin are both spaced apart on one side of the second direction of the substrate, the third power side pin is spaced apart from the substrate in the first direction, and at least a portion of the third power side pin is selectively extended toward the power pad to form the power side connecting rod; the fourth power side pin, the fifth power side pin and the sixth power side pin are all spaced apart from the substrate in the first direction, the fourth power side pin is connected to the chip base island of the first low-voltage power pad, the fifth power side pin is connected to the chip base island of the second low-voltage power pad, and the sixth power side pin is connected to the chip base island of the third low-voltage power pad.

[0015] In some examples of the present invention, the plurality of power side pins also include a seventh power side pin and a mounting pin, and the first power side pin, the second power side pin, the third power side pin, the fourth power side pin, the fifth power side pin, the sixth power side pin, the seventh power side pin and the mounting pin are sequentially spaced apart in the second direction, and the seventh power side pin is connected to the chip base island of the high-voltage power pad; the mounting pin is suitable for being connected to an electrical device on the power pad, and the mounting pin is spaced apart from the substrate in the first direction, and at least a portion of the mounting pin is selectively extended toward the power pad to form the power side connecting rod.

[0016] In some examples of the present invention, the plastic package body is provided with two mounting holes spaced apart in a second direction, and the heat exchanger is installed by penetrating the mounting holes with screws, and the two mounting holes are respectively located on both sides of the second direction of the substrate. During the installation of the heat exchanger, gaskets are arranged on the mounting holes to buffer the screws, and the projections of the two gaskets on the bottom surface of the plastic package body are both set as gasket projections, and the projections of the power side connecting rod and the drive side connecting rod on the plastic package body are spaced apart from the two gasket projections.

[0017] An electronic device according to an embodiment of the present invention includes: the above-mentioned intelligent power module.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a schematic diagram of an intelligent power module according to an embodiment of the prior art;

[0021] Figure 2 is a schematic diagram of an intelligent power module according to an embodiment of the present invention;

[0022] Figure 3 is a schematic diagram of an intelligent power module according to another embodiment of the present invention;

[0023] Figure 4 is a schematic diagram of an intelligent power module according to yet another embodiment of the present invention.

[0024] Reference numerals:

[0025] 100. Intelligent power module;

[0026] 1. Plastic package; 11. Drive side; 12. Power side;

[0027] 2. substrate; 21. power pad; 211. low voltage power pad; 2111. first low voltage power pad; 2112. second low voltage power pad; 2113. third low voltage power pad; 212. high voltage power pad; 213. chip base island; 214. drive side connecting rod base island; 215. power side connecting rod base island; 22. first side end angle; 221. first end angle; 222. second end angle; 23. second side end angle; 231. third end angle; 232. fourth end angle;

[0028] 3. Lead frame;

[0029] 31. Drive side lead frame;

[0030] 311, driving side pin; 3111, supporting pin; 31111, first supporting pin portion; 31112, second supporting pin portion; 3112, functional pin;

[0031] 312, driving side connecting rod;

[0032] 313, driving pad; 3131, low voltage driving pad; 3132, high voltage driving pad; 31321, first high voltage driving pad;

[0033] 32. Power side lead frame;

[0034] 321, power side pin; 3211, first power side pin; 3212, second power side pin; 3213, third power side pin; 3214, fourth power side pin; 3215, fifth power side pin; 3216, sixth power side pin; 3217, seventh power side pin; 3218, mounting pin;

[0035] 322, power side connecting rod;

[0036] 33. Independent connecting rod;

[0037] 4. Power chip; 41. Low voltage power chip; 42. High voltage power chip;

[0038] 5. Driver chip; 51. Low voltage driver chip; 52. High voltage driver chip;

[0039] 200, core pulling needle projection;

[0040] 300. Gasket projection. DETAILED DESCRIPTION

[0041] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0042] Reference below Figure 1-Figure 4 The intelligent power module 100 according to the embodiment of the present invention is described. The intelligent power module 100 can be applied to electronic devices.

[0043] Combination Figure 2-Figure 4 As shown, the intelligent power module 100 according to the present invention may mainly include: a plastic package 1, a substrate 2, a lead frame 3, a power chip 4 and a driving chip 5.

[0044] Specifically, the plastic encapsulation body 1 is obtained by mold encapsulation, and the mold encapsulation can be generated by transfer molding using thermoplastic materials or chemical curing materials, and the molding material can be epoxy resin. The two opposite sides of the first direction of the plastic encapsulation body 1 are respectively the driving side 11 and the power side 12, and the substrate 2, at least part of the lead frame 3, the power chip 4 and the driver chip 5 are all arranged in the plastic encapsulation body 1, so that the plastic encapsulation body 1 can provide physical and electrical protection for the substrate 2, at least part of the lead frame 3, the power chip 4 and the driver chip 5 to prevent the damage of the substrate 2, at least part of the lead frame 3, the power chip 4 and the driver chip 5 caused by the impact of the external environment, and ensure the normal operation of the intelligent power module 100. Among them, the bottom surface of the substrate is flush with the bottom surface of the plastic encapsulation body 1 and is exposed from the plastic encapsulation body 1, and a power pad 21 is arranged on the substrate 2, and the power chip 4 can be arranged on the power pad 21.

[0045] The lead frame 3 may include a driving side lead frame 31 and a power side lead frame 32 which are spaced apart in the first direction. The driving side lead frame 31 and the power side lead frame 32 are respectively disposed on both sides of the substrate 2 in the first direction.

[0046] Among them, the driving side lead frame 31 is arranged in the plastic package 1 and is spaced apart on one side of the first direction of the substrate 2. The driving side lead frame 31 may include a driving pad 313 and a driving side pin 311. A portion of the driving side pin 311 is protruded toward the side away from the substrate 2 in the first direction to form a driving pad 313.

[0047] Further, the driving side pin 311 may mainly include a functional pin 3112 and a supporting pin 3111. The functional pin 3112 extends toward a side away from the substrate 2 in the first direction and extends out of the plastic package 1. The high-voltage driving chip 52 and the low-voltage driving chip 51 are electrically connected to the functional pin 3112, respectively, and the functional pin 3112 can be used to electrically connect to an external electrical device, thereby ensuring the normal operation of the intelligent power module 100. Support pins 3111 are connected to both sides of the driving pad 313 in the second direction. The supporting pins 3111 on both sides of the driving pad 313 in the second direction extend to both sides of the plastic package 1 in the second direction, respectively, to support both sides of the driving pad 313, thereby improving the stability of the driving side lead frame 31.

[0048] It should be noted that at least part of the functional pins 3112 can also be led out from the second direction to both sides of the plastic package body 1 to support both sides of the driving side lead frame 31 in the second direction, which will not be elaborated here.

[0049] Furthermore, the power side pin 321 is located on a side of the substrate 2 in the first direction away from the driving pad 313 , and the power side pin 321 is suitable for being electrically connected to the power chip 4 , and the power chip 4 is electrically connected to the driving chip 5 .

[0050] Among them, the power chip 4 can be an insulated gate bipolar transistor (IGBT) and a fast recovery diode (FRD) electrically connected to each other, the insulated gate bipolar transistor and the fast recovery diode are arranged at intervals in the first direction, and the low-voltage drive chip 51 can be bonded to the fast recovery diode through the insulated gate bipolar transistor, and then bonded to the power side lead frame 32.

[0051] Furthermore, the power chip 4 may also be a reverse conducting insulated gate bipolar transistor (RC-IGBT), which is a single type of power chip 4. This can reduce the number of cores in the intelligent power module 100 and the number of bonding wires.

[0052] In this way, the basic structure of the intelligent power module 100 can be formed to ensure the normal operation of the intelligent power module 100 .

[0053] During the manufacturing process of the intelligent power module 100 , a connecting rod needs to be provided to press the substrate 2 to prevent the plastic packaging material from overflowing on the surface of the substrate 2 and to avoid overflow defects on the surface of the substrate 2 .

[0054] Attached Figure 1Schematic diagram of an intelligent power module 100 of the prior art. There are two independent connecting rods 33 and they are separately arranged on the lead frame 3. The two independent connecting rods 33 are respectively arranged on both sides of the second direction of the substrate 2 and correspond to the middle of the first direction of the substrate 2. Correspondingly, welding areas of the independent connecting rods 33 are arranged on both sides of the second direction of the substrate 2 and in the middle of the first direction, which are used for welding with the independent connecting rods 33. Although this can make the independent connecting rods 33 press the substrate 2 during the manufacturing process to avoid flash defects on the surface of the substrate 2, there are also some problems.

[0055] On the one hand, the independent connecting rod 33 needs to be cut separately during the cutting and forming process, which not only increases the complexity of the process, but also easily causes the plastic package body 1 to break.

[0056] On the other hand, the welding point between the independent connecting rod 33 and the substrate 2 is located in the middle of both sides of the second direction of the substrate 2, which will occupy the area in the middle of both sides of the second direction of the substrate 2, dividing the substrate 2 into two areas in the first direction. If the size of the power chip 4 (especially the size in the second direction) exceeds the area, it will be impossible to place it.

[0057] On the other hand, when the power chip 4 adopts a reverse-conducting insulated gate bipolar transistor, the power chip 4 near the side of the second direction is prone to collide with the independent connecting rod 33 during wire bonding, causing leakage or bonding problems.

[0058] Combination Figure 2-Figure 4 As shown, the intelligent power module 100 according to the embodiment of the present invention may further include: a driving-side connecting rod 312 and a power-side connecting rod 322 .

[0059] Among them, the power pad 21 may include a chip base island 213 and a driving side connecting rod base island 214, the chip base island 213 and the driving side connecting rod base island 214 are arranged at intervals and insulated from each other, the power chip 4 is arranged on the chip base island 213, the end of the substrate 2 on the side adjacent to the driving side pin 311 has a first side end angle 22, the driving side connecting rod base island 214 is arranged at the first side end angle 22, and a part of the driving side pin 311 extends toward the driving side connecting rod base island 214 to form a driving side connecting rod 312, and the end of the driving side connecting rod 312 is connected to the driving side connecting rod base island 214.

[0060] In addition, the power pad 21 can also include a power side connecting rod base island 215, which is spaced apart from the chip base island 213 and the driving side connecting rod base island 214 and insulated from each other. The end of the substrate 2 adjacent to the power side pin 321 has a second side end angle 23, and the power side connecting rod base island 215 is arranged at the second side end angle 23. Part of the power side pin 321 extends toward the power side connecting rod base island 215 to form a power side connecting rod 322, and the end of the power side connecting rod 322 is connected to the power side connecting rod base island 215.

[0061] Specifically, the chip base island 213 is used to set the power chip 4, the driving side connecting rod base island 214 is used to connect the driving side connecting rod 312, and the power side connecting rod base island 215 is used to connect the power side connecting rod 322. By making the chip base island 213, the driving side connecting rod base island 214 and the power side connecting rod base island 215 spaced and insulated from each other, it can be avoided that the setting of the driving side connecting rod 312 and the power side connecting rod 322 affects the normal operation of the power chip 4, thereby ensuring the normal operation of the intelligent power module 100.

[0062] By setting a driving side connecting rod 312 and a power side connecting rod 322, the end of the driving side connecting rod 312 is connected to the driving side connecting rod base island 214, and the end of the power side connecting rod 322 is connected to the power side connecting rod base island 215, so that the driving side pin 311 and the power side pin 321 can press the substrate 2 on both sides of the first direction of the substrate 2 respectively, thereby preventing the plastic packaging material from overflowing on the surface of the substrate 2 and causing overflow defects on the surface of the substrate 2.

[0063] Furthermore, by setting the driving side connecting rod base island 214 at the first side end angle 22 and the power side connecting rod base island 215 at the second side end angle 23, the setting positions of the driving side connecting rod base island 214 and the power side connecting rod base island 215 can be optimized, the connection position of the driving side connecting rod 312 and the substrate 2 can be optimized, and the connection position of the power side connecting rod 322 and the substrate 2 can be optimized. In this way, not only can the driving side connecting rod 312 and the power side connecting rod 322 be prevented from occupying the area of ​​the middle part of both sides in the second direction of the substrate 2, the area for arranging the power chip 4 on the power pad 21 can be increased, and the placement of a large-sized power chip 4 can be facilitated, but also the setting position of the power side connecting rod 322 can be adapted to the setting of a single-type power chip 4, avoiding interference between the bonding wire and the power side connecting rod 322, avoiding leakage or bonding problems, and improving the reliability of the intelligent power module 100.

[0064] Furthermore, by extending a portion of the driving side pin 311 toward the driving side connecting rod base island 214 to form a driving side connecting rod 312, and extending a portion of the power side pin 321 toward the power side connecting rod base island 215 to form a power side connecting rod 322, the driving side connecting rod 312 and the power side connecting rod 322 can be formed while the lead frame 3 is cut and formed to form the driving side pin 311 and the power side pin 321, thereby eliminating the need for separate cutting of the ribs. This can not only reduce the process complexity and the manufacturing difficulty of the intelligent power module 100, but also avoid cracking of the plastic package 1, thereby improving the reliability of the intelligent power module 100.

[0065] Combination Figure 2-Figure 4As shown, the end of the driving-side connecting rod 312 may be adapted to abut against the corresponding core-pulling needle, and the end of the power-side connecting rod 322 may be adapted to abut against the corresponding core-pulling needle.

[0066] Specifically, the plastic encapsulation body 1 is formed by injecting glue into the plastic encapsulation mold and solidifying it. Before injecting glue, the core pulling needle can be extended to contact the substrate 2. Under the action of the core pulling needle, the substrate 2 can be prevented from being deformed. In this way, the glue is not easy to overflow to the back of the substrate 2 during the packaging of the plastic encapsulation body 1, or the distance between the substrate 2 and the surface of the plastic encapsulation body 1 is ensured, which is conducive to the smooth packaging of the plastic encapsulation body 1 and ensures the power performance of the intelligent power module 100.

[0067] Considering that the end of the driving side connecting rod 312 is connected to the first side end angle 22 of the substrate 2, and the end of the power side connecting rod 322 is connected to the second side end angle 23 of the substrate 2, during the plastic packaging process, the end of the core pulling needle can be correspondingly abutted with the end of the driving side connecting rod 312, and the end of the core pulling needle can be correspondingly abutted with the end of the power side connecting rod 322. That is, the projection of the core pulling needle on the bottom surface of the plastic packaging body 1 is set as the core pulling needle projection 200, and the core pulling needle projection 200 can fall on the end of the driving side connecting rod 312, and the core pulling needle projection 200 can fall on the end of the power side connecting rod 322.

[0068] In this way, both sides of the substrate 2 in the first direction can be pressed by the core-pulling needle, and the substrate 2 is prevented from being offset during the process of encapsulating the plastic package body 1, thereby ensuring the normal plastic packaging and improving the reliability of the intelligent power module 100, and the core-pulling needle can minimize the area occupied by the substrate 2 while ensuring the pressing effect of the core-pulling needle on the substrate 2, thereby increasing the area on the power pad 21 for arranging the power chip 4, and further improving the performance of the intelligent power module 100. In addition, the core-pulling needle will not interfere with the power chip 4, which is conducive to the normal use of the power chip 4.

[0069] Therefore, by setting the driving side connecting rod base island 214 at the first side end angle 22, part of the driving side pin 311 is extended toward the driving side connecting rod base island 214 to form a driving side connecting rod 312, and the end of the driving side connecting rod 312 is connected to the driving side connecting rod base island 214, and the power side connecting rod base island 215 is set at the second side end angle 23, part of the power side pin 321 is extended toward the power side connecting rod base island 215 to form a power side connecting rod 322, and the end of the power side connecting rod 322 is connected to the power side connecting rod base island 215. In this way, under the premise of avoiding overflow defects on the surface of the substrate 2, not only the process complexity of the intelligent power module 100 can be reduced, but also the area on the power pad 21 for arranging the power chip 4 can be increased, thereby improving the performance of the intelligent power module 100 and the reliability of the intelligent power module 100.

[0070] Combination Figure 2-Figure 4 As shown, there are two first side end angles 22 and they are respectively arranged at the two ends of the second direction of the substrate 2, at least one of the two first side end angles 22 is provided with a driving side connecting rod base island 214, and there is at least one driving side connecting rod 312 and it is connected to at least one driving side connecting rod base island 214 in a one-to-one correspondence.

[0071] There are two second side end angles 23 which are respectively arranged at the two ends of the second direction of the substrate 2, at least one of the two second side end angles 23 is provided with a power side connecting rod base island 215, and there is at least one power side connecting rod 322 which is connected one-to-one with at least one power side connecting rod base island 215.

[0072] Specifically, at least one of the two first side end corners 22 is provided with a driving side connecting rod base island 214, and correspondingly, at least one driving side connecting rod 312 is provided, so that at least one driving side connecting rod 312 is connected to at least one driving side connecting rod base island 214 in a one-to-one correspondence. In this way, during the manufacturing process, the driving side connecting rod 312 can press the base plate 2 on the side close to the driving side 11 in the first direction.

[0073] Furthermore, by providing a power side connecting rod base island 215 on at least one of the two second side end corners 23, and correspondingly providing at least one power side connecting rod 322, at least one power side connecting rod 322 is connected to at least one power side connecting rod base island 215 in a one-to-one correspondence. In this way, during the manufacturing process, the power side connecting rod 322 can press the base plate 2 on the side close to the power side 12 in the first direction.

[0074] In this way, by connecting at least one driving side connecting rod 312 and at least one driving side connecting rod base island 214, and by connecting at least one power side connecting rod 322 and at least one power side connecting rod base island 215, the substrate 2 can be pressed on both sides of the first direction, and the substrate 2 can be pressed more reliably, thereby avoiding the overflow of the plastic packaging material on the surface of the substrate 2 during the manufacturing process, and avoiding overflow defects on the surface of the substrate 2.

[0075] Combination Figure 2-Figure 4 As shown, the two first side end angles 22 are respectively the first end angle 221 and the second end angle 222, the two second side end angles 23 are respectively the third end angle 231 and the fourth end angle 232, the first end angle 221 and the third end angle 231 are both located on one side of the second direction of the substrate 2, and the second end angle 222 and the fourth end angle 232 are both located on the other side of the second direction of the substrate 2. It can be understood that the first end angle 221 and the fourth end angle 232 are a pair of opposite corners of the substrate 2, and the second end angle 222 and the third end angle 231 are another pair of opposite corners of the substrate 2.

[0076] In some embodiments of the present invention, Figure 2-Figure 4 As shown, the driving side connecting rod 312 and the power side connecting rod 322 are both one, and the driving side connecting rod 312 and the power side connecting rod 322 respectively correspond to a pair of diagonals of the substrate 2, so that the driving side connecting rod 312 and the power side connecting rod 322 can respectively apply force to the substrate 2 at the diagonals of the substrate 2, and the connecting line of the driving side connecting rod 312 and the power side connecting rod 322 is the diagonal line of the substrate 2.

[0077] In this way, the number and relative position of the driving side connecting rod 312 and the power side connecting rod 322 can be optimized, so that the force distribution of the driving side connecting rod 312 and the power side connecting rod 322 on the substrate 2 is more reasonable, so that the substrate 2 can be pressed more reliably during the manufacturing process, avoiding the overflow of the plastic packaging material on the surface of the substrate 2 and avoiding overflow defects on the surface of the substrate 2.

[0078] Optionally, as attached Figure 3 and attached Figure 4 As shown, the first end corner 221 is provided with a driving side connecting rod base island 214, the fourth end corner 232 is provided with a power side connecting rod base island 215, the end of a driving side connecting rod 312 is connected to the first end corner 221, and the end of a power side connecting rod 322 is connected to the fourth end corner 232.

[0079] Optionally, as attached Figure 2 As shown, the second end angle 222 is provided with a driving side connecting rod base island 214, the third end angle 231 is provided with a power side connecting rod base island 215, the end of a driving side connecting rod 312 is connected to the second end angle 222, and the end of a power side connecting rod 322 is connected to the third end angle 231.

[0080] In some other embodiments of the present invention, there are two driving side connecting rods 312 and one power side connecting rod 322. The first end angle 221 and the second end angle 222 are both provided with a driving side connecting rod base island 214, and the ends of the two driving side connecting rods 312 are respectively connected to the first end angle 221 and the second end angle 222. In addition, the third end angle 231 or the fourth end angle 232 is provided with a power side connecting rod base island 215, and one power side connecting rod 322 is connected to the third end angle 231 or the fourth end angle 232.

[0081] In this way, the two driving side connecting rods 312 can press the substrate 2 at the first end angle 221 and the second end angle 222 respectively, and a power side connecting rod 322 can press the substrate 2 at the third end angle 231 or the fourth end angle 232, and the connecting line of the two driving side connecting rods 312 and the one power side connecting rod 322 can be a triangle.

[0082] In this way, the number and relative position of the driving side connecting rod 312 and the power side connecting rod 322 can be optimized, so that the force distribution of the driving side connecting rod 312 and the power side connecting rod 322 on the substrate 2 is more reasonable, so that the substrate 2 can be pressed more reliably during the manufacturing process, avoiding the overflow of the plastic packaging material on the surface of the substrate 2 and avoiding overflow defects on the surface of the substrate 2.

[0083] In other embodiments of the present invention, there are two power-side connecting rods 322 and one driving-side connecting rod 312. The third end angle 231 and the fourth end angle 232 are both provided with a power-side connecting rod base island 215, and the ends of the two power-side connecting rods 322 are respectively connected to the third end angle 231 and the fourth end angle 232, and the first end angle 221 or the second end angle 222 is provided with a driving-side connecting rod base island 214, and one driving-side connecting rod 312 is connected to the first end angle 221 or the second end angle 222.

[0084] In this way, the two power side connecting rods 322 can press the substrate 2 at the third end angle 231 and the fourth end angle 232 respectively, and the one driving side connecting rod 312 can press the substrate 2 at the first end angle 221 or the second end angle 222, and the connecting line of the two power side connecting rods 322 and one driving side connecting rod 312 can be a triangle.

[0085] In this way, the number and relative position of the driving side connecting rod 312 and the power side connecting rod 322 can be optimized, so that the force distribution of the driving side connecting rod 312 and the power side connecting rod 322 on the substrate 2 is more reasonable, so that the substrate 2 can be pressed more reliably during the manufacturing process, avoiding the overflow of the plastic packaging material on the surface of the substrate 2 and avoiding overflow defects on the surface of the substrate 2.

[0086] In some other embodiments of the present invention, the first end angle 221 and the second end angle 222 are both provided with a driving side connecting rod base island 214, the third end angle 231 and the fourth end angle 232 are both provided with a power side connecting rod base island 215, and there are two driving side connecting rods 312 and two power side connecting rods 322, and the ends of the two driving side connecting rods 312 are respectively connected to the first end angle 221 and the second end angle 222, and the ends of the two power side connecting rods 322 are respectively connected to the third end angle 231 and the fourth end angle 232. In this way, the two driving side connecting rods 312 can press the substrate 2 at the first end angle 221 and the second end angle 222, respectively, and the two power side connecting rods 322 can press the substrate 2 at the third end angle 231 and the fourth end angle 232, respectively. That is, during the manufacturing process, the four end angles of the substrate 2 are all pressed, so that the substrate 2 can be pressed more stably and reliably, and the plastic encapsulation material is prevented from overflowing on the surface of the substrate 2, and the surface overflow defect of the substrate 2 is avoided.

[0087] Combination Figure 2-Figure 4As shown, the functional pin 3112 can mainly include a first support pin portion 31111 and a second support pin portion 31112, the first support pin portion 31111 is connected to one side of the driving pad 313 in the second direction, the first support pin portion 31111 is extended in the second direction and extends to one side of the plastic package 1 in the second direction, the second support pin portion 31112 is connected to the other side of the driving pad 313 in the second direction, the second support pin portion 31112 is extended in the second direction and extends to the other side of the plastic package 1 in the second direction, and a portion of the first support pin portion 31111 and / or the second support pin portion 31112 is selectively extended toward the power pad 21 to form a driving side connecting rod 312.

[0088] Specifically, the first support pin portion 31111 is connected to one side of the driving pad 313 in the second direction, the first support pin portion 31111 is extended in the second direction and extends to one side of the plastic package body 1 in the second direction, the second support pin portion 31112 is connected to the other side of the driving pad 313 in the second direction, the second support pin portion 31112 is extended in the second direction and extends to the other side of the plastic package body 1 in the second direction, so that the first support pin portion 31111 and the second support pin portion 31112 can support the driving pad 313 on both sides of the second direction, thereby avoiding the shaking of the driving pad 313 supported on one side and improving the stability of the frame 3.

[0089] Further, considering that the first support pin portion 31111 and the second support pin portion 31112 are both located on the side of the driving pin close to the substrate 2 in the first direction, the first support pin portion 31111 and the second support pin portion 31112 are both spaced apart from the substrate 2 in the first direction.

[0090] A portion of the first support pin portion 31111 can be extended toward the power pad 21 to form a driving side connecting rod 312, a portion of the second support pin portion 31112 can be extended toward the power pad 21 to form a driving side connecting rod 312, or portions of the first support pin portion 31111 and the second support pin portion 31112 can be extended toward the power pad 21 to form two driving side connecting rods 312.

[0091] In this way, the original structure of the first support pin portion 31111 and the second support pin portion 31112 can be fully utilized. It is only necessary to selectively integrate the driving side connecting rod 312 on the first support pin portion 31111 and the second support pin portion 31112 so that the driving side connecting rod 312 extends to the first side end angle 22. The power side connecting rod 322 can press the substrate 2 during the manufacturing process to prevent the plastic packaging material from overflowing on the surface of the substrate 2.

[0092] In this way, the design of the driving side connecting rod 312 can be optimized. Under the premise of ensuring the normal operation of the driving side connecting rod 312, not only the structure of the driving side connecting rod 312 can be simplified and the production of the driving side connecting rod 312 can be facilitated, but also the length of the driving side connecting rod 312 can be shortened, the structural reliability and structural strength of the driving side connecting rod 312 can be improved, and the interference between the driving side connecting rod 312 and other driving side pins 311 can be avoided, thereby ensuring the normal operation of the intelligent power module 100.

[0093] In some embodiments of the present invention, the driving pad 313 includes a low-voltage driving pad 3131 and a high-voltage driving pad 3132, the low-voltage driving pad 3131 and the high-voltage driving pad 3132 are both one, the second support pin portion 31112 is connected to a side of a high-voltage driving pad 3132 away from a low-voltage driving pad 3131 in the second direction, and the first support pin portion 31111 is connected to a side of a low-voltage driving pad 3131 away from a high-voltage driving pad 3132 in the second direction.

[0094] In other embodiments of the present invention, Figure 2-Figure 4 As shown, there is one low-voltage driving pad 3131 and three high-voltage driving pads 3132. The three high-voltage driving pads 3132 are spaced apart in the second direction and connected to each other. One of the three high-voltage driving pads 3132 that is away from a low-voltage driving pad 3131 is defined as a first high-voltage driving pad 31321. The second supporting pin portion 31112 is connected to a side of the first high-voltage driving pad 31321 that is away from the low-voltage driving pad 3131 in the second direction. The first supporting pin portion 31111 is connected to a side of the low-voltage driving pad 3131 that is away from the high-voltage driving pad 3132 in the second direction.

[0095] Combination Figure 2-Figure 4 As shown, the power pad 21 may include a low-voltage power pad 211 and a high-voltage power pad 212, there are three low-voltage power pads 211 and one high-voltage power pad 212, the three low-voltage power pads 211 and one high-voltage power pad 212 are arranged in sequence at intervals in the second direction, a low-voltage power chip 41 is arranged on each of the three low-voltage power pads 211, and three high-voltage power chips 42 arranged at intervals in the second direction are arranged on one high-voltage power pad 212.

[0096] Among them, the three low-voltage power pads 211 may include a first low-voltage power pad 2111, a second low-voltage power pad 2112 and a third low-voltage power pad 2113 which are arranged in sequence in the second direction. Compared with the first low-voltage power pad 2111, the third low-voltage power pad 2113 is closer to the high-voltage power pad 212.

[0097] The two first side end angles 22 are located on the side of the first low-voltage power pad 2111 and the high-voltage power pad 212 facing the driving lead frame 3, the first side end angle 22 on the first low-voltage power pad 2111 is located at one end of the first low-voltage power pad 2111 away from the second low-voltage power pad 2112 in the second direction, and the first side end angle 22 on the high-voltage power pad 212 is located at one end of the high-voltage power pad 212 away from the third low-voltage power pad 2113 in the second direction.

[0098] The two second side end angles 23 are located on the side of the first low-voltage power pad 2111 and the high-voltage power pad 212 facing the power side pin 321, the second side end angle 23 on the first low-voltage power pad 2111 is located at one end of the first low-voltage power pad 2111 away from the second low-voltage power pad 2112 in the second direction, and the second side end angle 23 on the high-voltage power pad 212 is located at one end of the high-voltage power pad 212 away from the third low-voltage power pad 2113 in the second direction.

[0099] Correspondingly, there are multiple power side pins 321, and the multiple power side pins 321 may include a first power side pin 3211, a second power side pin 3212, a third power side pin 3213, a fourth power side pin 3214, a fifth power side pin 3215 and a sixth power side pin 3216 which are arranged in sequence in the second direction. By connecting the first power side pin 3211, the second power side pin 3212 and the third power side pin 3213 to the three low-voltage power chips 41 respectively, and connecting the fourth power side pin 3214, the fifth power side pin 3215 and the sixth power side pin 3216 to the three high-voltage power chips 42 respectively, the normal operation of the intelligent power module 100 can be guaranteed.

[0100] Among them, considering the wiring requirements of the intelligent power module 100, the first power side pin 3211 and the second power side pin 3212 are both spaced apart on one side of the second direction of the substrate 2, the third power side pin 3213 is spaced apart from the substrate 2 in the first direction and corresponds to the second side end angle 23, the fourth power side pin 321, the fifth power side pin 321 and the sixth power side pin 321 are all spaced apart from the substrate 2 in the first direction, the fourth power side pin 321 is connected to the chip base island 213 of the first low-voltage power pad 2111, the fifth power side pin 321 is connected to the chip base island 213 of the second low-voltage power pad 2112, and the sixth power side pin 321 is connected to the chip base island 213 of the third low-voltage power pad 2113.

[0101] Further, at least a portion of the third power-side pin 321 is selectively extended toward the power pad 21 to form a power-side connecting rod 322 .

[0102] Specifically, since the third power side pin 321 and the substrate 2 are spaced apart in the first direction, the original structure of the third power side pin 321 can be fully utilized. By extending at least a portion of the third power side pin 321 toward the power pad 21, a power side connecting rod 322 can be formed, and the power side connecting rod 322 is connected to the power side connecting rod base island 215, so that the power side connecting rod 322 presses the substrate 2 during the manufacturing process to prevent the plastic packaging material from overflowing on the surface of the substrate 2.

[0103] In this way, the design of the power side connecting rod 322 can be optimized. Under the premise of ensuring the normal operation of the power side connecting rod 322, not only the structure of the power side connecting rod 322 can be simplified and the production of the power side connecting rod 322 can be facilitated, but also the length of the power side connecting rod 322 can be shortened, thereby improving the structural reliability and structural strength of the power side connecting rod 322.

[0104] Combination Figure 2-Figure 4 As shown, the multiple power side pins 321 can also include a seventh power side pin 3217 and an installation pin 3218, and the first power side pin 3211, the second power side pin 3212, the third power side pin 3213, the fourth power side pin 3214, the fifth power side pin 3215, the sixth power side pin 3216, the seventh power side pin 3217 and the installation pin 3218 are arranged in sequence in the second direction.

[0105] Among them, considering the wiring requirements inside the intelligent power module 100, the seventh power side pin 321 is connected to the chip base island 213 of the high-voltage power pad 212, and the mounting pin 3218 is suitable for connecting to the electrical device on the power pad 21, and the mounting pin 3218 is spaced apart from the substrate 2 in the first direction.

[0106] Further, at least a portion of the mounting pins 3218 is selectively extended toward the power pad 21 to form a power-side connecting rod 322 .

[0107] Specifically, considering that the mounting pin 3218 and the substrate 2 are spaced apart in the first direction, the original structure of the mounting pin 3218 can be fully utilized. It is only necessary to extend at least a portion of the mounting pin 3218 toward the power pad 21 to form a power side connecting rod 322, and the power side connecting rod 322 is connected to the power side connecting rod base island 215, so that the power side connecting rod 322 can press the substrate 2 during the manufacturing process to prevent the plastic packaging material from overflowing on the surface of the substrate 2.

[0108] In this way, the design of the power side connecting rod 322 can be optimized. Under the premise of ensuring the normal operation of the power side connecting rod 322, not only the structure of the power side connecting rod 322 can be simplified and the production of the power side connecting rod 322 can be facilitated, but also the length of the power side connecting rod 322 can be shortened, thereby improving the structural reliability and structural strength of the power side connecting rod 322.

[0109] Combination Figure 2-Figure 4 As shown, the plastic package body 1 is provided with two mounting holes spaced apart in the second direction, and screws are passed through the mounting holes to install the heat exchanger. The two mounting holes are respectively located on both sides of the second direction of the substrate 2. During the installation of the heat exchanger, gaskets are set on the mounting holes to cushion the screws.

[0110] Specifically, the intelligent power module 100 generates heat when working. On the one hand, the ceramic layer of the substrate 2 can play a role in heat dissipation. On the other hand, by connecting a heat exchanger to the outside of the plastic package 1, the heat exchanger can play a role in heat dissipation and cooling the intelligent power module 100, thereby avoiding heat accumulation in the intelligent power module 100, ensuring the normal operation of the intelligent power module 100, and improving the working performance of the intelligent power module 100.

[0111] The plastic package body 1 is provided with two mounting holes spaced apart in the second direction, and screws can be passed through the mounting holes to connect the plastic package body 1 and the heat exchanger to achieve the installation of the heat exchanger. The two mounting holes are respectively located on both sides of the second direction of the substrate 2. During the installation of the heat exchanger, gaskets can be set on the mounting holes to cushion the screws and improve the stability and reliability of the heat exchanger installation.

[0112] The projections of the two gaskets on the bottom surface of the plastic package 1 are both set as the gasket projection 300, and the projection of the substrate 2 on the bottom surface of the plastic package 1 is set as the substrate projection. By arranging the two gasket projections 300 on both sides of the second direction of the substrate projection and being spaced apart from the substrate projection, interference between the gasket and the substrate 2 can be avoided. When the heat exchanger is connected to the plastic package 1, the gasket will not apply pressure to the substrate 2, thereby avoiding the ceramic layer of the substrate 2 from breaking, and ensuring the heat dissipation performance of the substrate 2 and even the intelligent power module 100.

[0113] Furthermore, the projections of the power side connecting rod 322 and the drive side connecting rod 312 on the plastic package 1 are spaced from the two gasket projections 300. Specifically, by making the projections of the power side connecting rod 322 and the drive side connecting rod 312 on the plastic package 1 spaced from the two gasket projections 300, interference between the gasket and the drive side connecting rod 312 can be avoided, and interference between the gasket and the power side connecting rod 322 can be avoided. When the heat exchanger is connected to the plastic package 1, the gasket will not apply pressure to the substrate 2 through the drive side connecting rod 312 or the drive side connecting rod 312, thereby avoiding the ceramic layer of the substrate 2 from breaking, and ensuring the heat dissipation performance of the substrate 2 and even the intelligent power module 100.

[0114] The electronic device according to the present invention may mainly include: the above-mentioned intelligent power module 100. By applying the intelligent power module 100 to the electronic device, not only the production difficulty and production cost of the electronic device can be reduced, but also the reliability of the electronic device can be improved, thereby enhancing the product competitiveness of the electronic device and improving the user experience.

[0115] Other structures and operations of the electronic device according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0116] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0117] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0118] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An intelligent power module, characterized in that: include: Plastic sealing body (1); A substrate (2), the substrate (2) being arranged in the plastic package body (1), the bottom surface of the substrate (2) being flush with the bottom surface of the plastic package body (1) and exposed from the plastic package body (1), the substrate (2) being provided with a power pad (21), and the power pad (21) being provided with a power chip (4); A drive side lead frame (31), the drive side lead frame (31) being arranged in the plastic package (1) and spaced apart on one side of the substrate (2) in the first direction, the drive side lead frame (31) comprising a drive side pin (311) and a drive pad (313), a portion of the drive side pin (311) being protruding towards a side away from the substrate (2) in the first direction to form a drive pad (313); The driving side pin (311) comprises a functional pin (3112) and a supporting pin (3111); the functional pin (3112) extends in a first direction away from a side of the substrate (2) and protrudes from the plastic package (1) for being electrically connected to an external electrical device; both sides of the driving pad (313) in a second direction are connected to the supporting pin (3111); the supporting pins (3111) on both sides of the driving pad (313) in the second direction respectively extend to both sides of the plastic package (1) in the second direction for supporting both sides of the driving pad (313); The power pad (21) comprises a chip base island (213) and a driving side connecting rod base island (214); the chip base island (213) and the driving side connecting rod base island (214) are arranged at intervals and insulated from each other; the power chip (4) is arranged on the chip base island (213); an end of the substrate (2) adjacent to the driving side pin (311) has a first side end angle (22); the driving side connecting rod base island (214) is arranged at the first side end angle (22); a portion of the driving side pin (311) is extended toward the driving side connecting rod base island (214) to form a driving side connecting rod (312); an end of the driving side connecting rod (312) is connected to the driving side connecting rod base island (214); and the end of the driving side connecting rod (312) is suitable for correspondingly abutting against a core pulling pin; A power side pin (321), the power side pin (321) being arranged in the plastic package (1) and being located on a side of the substrate (2) in a first direction away from the driving pad (313), the power side pin (321) being suitable for being electrically connected to the power chip (4), the power pad (21) further comprising a power side connecting rod base island (215), the power side connecting rod base island (215) being spaced apart from the chip base island (213) and the driving side connecting rod base island (214) and being insulated from each other, the substrate (2) being adjacent to the power side pin The end of one side of the foot (321) has a second side end angle (23), the power side connecting rod base island (215) is arranged at the second side end angle (23), a portion of the power side pin (321) is extended toward the power side connecting rod base island (215) to form the power side connecting rod (322), the end of the power side connecting rod (322) is connected to the power side connecting rod base island (215), and the end of the power side connecting rod (322) is suitable for correspondingly abutting against a core pulling needle, wherein the first direction and the second direction are perpendicular to each other.

2. The intelligent power module according to claim 1, characterized in that: There are two first side end angles (22) and they are respectively arranged at two ends of the second direction of the base plate (2); at least one of the two first side end angles (22) is provided with the driving side connecting rod base island (214); there is at least one driving side connecting rod (312) and it is connected to at least one driving side connecting rod base island (214) in a one-to-one correspondence; There are two second side end angles (23) and they are respectively arranged at two ends of the second direction of the substrate (2); at least one of the two second side end angles (23) is provided with the power side connecting rod base island (215); there is at least one power side connecting rod (322) and it is connected to at least one power side connecting rod base island (215) in a one-to-one correspondence.

3. The intelligent power module according to claim 2, characterized in that: The two first side end angles (22) are respectively a first end angle (221) and a second end angle (222); the two second side end angles (23) are respectively a third end angle (231) and a fourth end angle (232); the first end angle (221) and the third end angle (231) are both located on one side of the second direction of the substrate (2); the second end angle (222) and the fourth end angle (232) are both located on the other side of the second direction of the substrate (2); the driving side connecting rod (312) and the power side connecting rod (322) are both one; the first end angle (221) is provided with the driving side connecting rod base island (214); the fourth end angle (232) is provided with the power side connecting rod base island (215); an end of one driving side connecting rod (312) is connected to the first end angle (221); and an end of one power side connecting rod (322) is connected to the fourth end angle (232); or The second end angle (222) is provided with the driving side connecting rod base island (214), the third end angle (231) is provided with the power side connecting rod base island (215), an end of the driving side connecting rod (312) is connected to the second end angle (222), and an end of the power side connecting rod (322) is connected to the third end angle (231).

4. The intelligent power module according to claim 2, characterized in that: The two first side end angles (22) are respectively a first end angle (221) and a second end angle (222); the two second side end angles (23) are respectively a third end angle (231) and a fourth end angle (232); the first end angle (221) and the third end angle (231) are both located on one side of the second direction of the substrate (2); the second end angle (222) and the fourth end angle (232) are both located on the other side of the second direction of the substrate (2); the first end angle (221) and the second end angle (222) are respectively ) are provided with a driving side connecting rod base island (214), there are two driving side connecting rods (312), the ends of the two driving side connecting rods (312) are respectively connected to the first end angle (221) and the second end angle (222), the third end angle (231) or the fourth end angle (232) is provided with a power side connecting rod base island (215), there is one power side connecting rod (322), and one power side connecting rod (322) is connected to the third end angle (231) or the fourth end angle (232); or The third end angle (231) and the fourth end angle (232) are both provided with a power side connecting rod base island (215), there are two power side connecting rods (322), ends of the two power side connecting rods (322) are respectively connected to the third end angle (231) and the fourth end angle (232), the first end angle (221) or the second end angle (222) is provided with a driving side connecting rod base island (214), there is one driving side connecting rod (312), and one driving side connecting rod (312) is connected to the first end angle (221) or the second end angle (222).

5. The intelligent power module according to claim 2, characterized in that: The two first side end angles (22) are respectively a first end angle (221) and a second end angle (222); the two second side end angles (23) are respectively a third end angle (231) and a fourth end angle (232); the first end angle (221) and the third end angle (231) are both located on one side of the second direction of the substrate (2); the second end angle (222) and the fourth end angle (232) are both located on the other side of the second direction of the substrate (2); the first end angle (221) and the second end angle (222) are respectively A driving side connecting rod base island (214) is provided on each of the third end angle (231) and the fourth end angle (232), and a power side connecting rod base island (215) is provided on each of the third end angle (231) and the fourth end angle (232). There are two driving side connecting rods (312) and two power side connecting rods (322), and the ends of the two driving side connecting rods (312) are respectively connected to the first end angle (221) and the second end angle (222), and the ends of the two power side connecting rods (322) are respectively connected to the third end angle (231) and the fourth end angle (232).

6. The intelligent power module according to claim 1, characterized in that: The support pin (3111) includes a first support pin portion (31111) and a second support pin portion (31112), wherein the first support pin portion (31111) is connected to one side of the driving pad (313) in the second direction, the first support pin portion (31111) is extended in the second direction and extends to one side of the plastic package (1) in the second direction, the second support pin portion (31112) is connected to the other side of the driving pad (313) in the second direction, the second support pin portion (31112) is extended in the second direction and extends to the other side of the plastic package (1) in the second direction, and a portion of the first support pin portion (31111) and / or the second support pin portion (31112) is selectively extended toward the power pad (21) to form the driving side connecting rod (312).

7. The intelligent power module according to claim 1, characterized in that: The power pad (21) comprises a low-voltage power pad (211) and a high-voltage power pad (212); there are three low-voltage power pads (211) and one high-voltage power pad (212); the three low-voltage power pads (211) and the one high-voltage power pad (212) are sequentially arranged at intervals in the second direction; a low-voltage power chip (41) is respectively arranged on the three low-voltage power pads (211); and three high-voltage power chips (42) are arranged at intervals in the second direction on the one high-voltage power pad (212); the three low-voltage power pads (211) comprise a first low-voltage power pad (2111), a second low-voltage power pad (2112) and a third low-voltage power pad (2112) which are sequentially arranged at intervals in the second direction. 113), compared with the first low-voltage power pad (2111), the third low-voltage power pad (2113) is closer to the high-voltage power pad (212), the first side end angle (22) is located on the side of the first low-voltage power pad (2111) and the high-voltage power pad (212) facing the drive side lead frame (31), the first side end angle (22) on the first low-voltage power pad (2111) is located at an end of the first low-voltage power pad (2111) away from the second low-voltage power pad (2112) in the second direction, and the first side end angle (22) on the high-voltage power pad (212) is located at an end of the high-voltage power pad (212) away from the third low-voltage power pad (2113) in the second direction.

8. The intelligent power module according to claim 7, characterized in that: There are a plurality of power side pins (321), and the plurality of power side pins (321) include a first power side pin (3211), a second power side pin (3212), a third power side pin (3213), a fourth power side pin (3214), a fifth power side pin (3215), and a sixth power side pin (3216) which are sequentially arranged in a spaced relationship in the second direction, wherein the first power side pin (3211), the second power side pin (3212), and the third power side pin (3213) are respectively connected to the three low-voltage power chips (41), and the fourth power side pin (3214), the fifth power side pin (3215), and the sixth power side pin (3216) are respectively connected to the three low-voltage power chips (41). The power side pins (3216) are respectively connected to the three high-voltage power chips (42) correspondingly, the second side end angle (23) is located on the side of the first low-voltage power pad (2111) and the high-voltage power pad (212) facing the power side pin (321), the second side end angle (23) on the first low-voltage power pad (2111) is located at an end of the first low-voltage power pad (2111) away from the second low-voltage power pad (2112) in the second direction, and the second side end angle (23) on the high-voltage power pad (212) is located at an end of the high-voltage power pad (212) away from the third low-voltage power pad (2113) in the second direction; The first power side pin (3211) and the second power side pin (3212) are both arranged at intervals on one side of the substrate (2) in the second direction, the third power side pin (3213) is arranged at intervals with the substrate (2) in the first direction, and at least a portion of the third power side pin (3213) is selectively extended toward the power pad (21) to form the power side connecting rod (322); The fourth power side pin (3214), the fifth power side pin (3215) and the sixth power side pin (3216) are all arranged at intervals with respect to the substrate (2) in a first direction; the fourth power side pin (3214) is connected to the chip base island (213) of the first low-voltage power pad (2111); the fifth power side pin (3215) is connected to the chip base island (213) of the second low-voltage power pad (2112); and the sixth power side pin (3216) is connected to the chip base island (213) of the third low-voltage power pad (2113).

9. The intelligent power module according to claim 8, characterized in that: The plurality of power side pins (321) further include a seventh power side pin (3217) and a mounting pin (3218); the first power side pin (3211), the second power side pin (3212), the third power side pin (3213), the fourth power side pin (3214), the fifth power side pin (3215), the sixth power side pin (3216), the seventh power side pin (3217) and the mounting pin (3218) are sequentially arranged at intervals in the second direction; the seventh power side pin (3217) is connected to the chip base island (213) of the high-voltage power pad (212); The mounting pin (3218) is suitable for connecting to an electrical device on the power pad (21), the mounting pin (3218) and the substrate (2) are spaced apart in a first direction, and at least a portion of the mounting pin (3218) is selectively extended toward the power pad (21) to form the power side connecting rod (322).

10. The intelligent power module according to claim 1, characterized in that: The plastic package body (1) is provided with two mounting holes spaced apart in a second direction, and screws are passed through the mounting holes to mount the heat exchanger. The two mounting holes are respectively located on both sides of the second direction of the substrate (2). During the process of mounting the heat exchanger, gaskets are arranged on the mounting holes to cushion the screws. The projections of the two gaskets on the bottom surface of the plastic package body (1) are both gasket projections (300), and the projections of the power side connecting rod (322) and the drive side connecting rod (312) on the plastic package body (1) are both spaced apart from the two gasket projections (300).

11. An electronic device, characterized in that: include: The intelligent power module (100) according to any one of claims 1 to 10.

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