Chip testing equipment with adaptive testing capabilities

The two-way vibration and temperature adjustment mechanism of the adaptive test equipment solves the problem that the chip test equipment cannot perform impact and temperature detection, realizes the effective detection of chips in different environments, and ensures the test effect and chip stability.

CN118465504BActive Publication Date: 2025-09-09JIANGXI WANNIANXIN MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202410620508.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-20
Publication Date
2025-09-09
Estimated Expiration
2044-05-20

AI Technical Summary

Technical Problem

Existing chip testing equipment is unable to perform impact detection and temperature detection, resulting in poor chip testing results. In addition, when used in extreme environments, the chip may be damaged or its function may be reduced.

Method used

A chip testing equipment with adaptive testing capability was designed, which includes a bidirectional vibration mechanism and a temperature control mechanism. The hollow slider drives the chip clamp to move left and right for impact detection, and a semi-open bellows and electric heating wire ring are used to achieve high and low temperature testing. Combined with the clamping and fixing mechanism, the stable clamping of the chip is ensured.

Benefits of technology

It achieves effective detection of chips under impact and temperature changes, ensures the normal progress of chip testing and the accuracy of results, and avoids chip damage or functional degradation in extreme environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a chip testing device with adaptive testing capability, relating to the field of chip testing technology, comprising a body, wherein a two-way vibration mechanism is arranged inside the body, a temperature regulating mechanism is arranged at the bottom of the body, a clamping and fixing mechanism is arranged at the bottom of the two-way vibration mechanism, the two-way vibration mechanism comprises an L-shaped swing rod, a two-way rotating wheel, a hollow slider and a chip board clamp, the L-shaped swing rod is arranged at the top of the body, the hollow slider is arranged at the bottom of the L-shaped swing rod, the two-way rotating wheel is arranged at the rear end of the body, and the chip board clamp is arranged at the bottom of the hollow slider, the two-way vibration mechanism is used to perform two-way vibration detection operations on the box plate carrying the chip clamped by the chip board clamp, further ensuring the normal progress of the chip vibration detection, and the temperature regulating mechanism is used to perform high-temperature and low-temperature testing operations on the chip in the chip loading box clamped by the chip board clamp.
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Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a chip testing device with adaptive testing capability. Background Art

[0002] Chip testing refers to a process method used to test various functional environments of chips in various forms after production, and chip testing equipment is used to perform functional tests on these chips, thereby detecting chip products with the same data as standard chips, thereby ensuring that these chips can be fully and effectively used in various specific environments, further promoting the development of various chip industries;

[0003] However, existing chip testing equipment still has a series of problems during use, such as:

[0004] First, existing chip testing equipment is mostly a fixed whole. In actual chip testing scenarios, the chip to be tested is placed at the test light spot position by a machine or manually. During the specified test process, however, due to the instability of manual placement, the chip may deviate from the test light spot or fail to perform various light spot tests. In addition, existing chip testing equipment can only perform light spot irradiation tests on chips, but cannot perform physical impact tests on chips. This results in poor chip testing results, resulting in poor performance of the tested chip, decreased functionality, and chip exposure, which seriously affects the normal progress of chip testing.

[0005] Secondly, chip testing is carried out in a specified constant temperature environment. This will cause the tested chips to arc and burn due to high temperature, damage the chips, or freeze and become silent due to low temperature when used in some extreme environments, seriously affecting the performance of the chips. Summary of the Invention

[0006] (1) Technical problems solved

[0007] In response to the above-mentioned shortcomings of the prior art, the present invention provides a chip testing device with adaptive testing capabilities, which can effectively solve the problem that the existing chip testing equipment cannot perform impact detection on the chip, and solve the problem that the existing chip testing equipment cannot perform temperature detection on the chip.

[0008] (2) Technical solution

[0009] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0010] The invention discloses a chip testing device with adaptive testing capability, comprising a body, wherein a two-way vibration mechanism is provided inside the body, a temperature regulating mechanism is provided at the bottom of the body, and a clamping and fixing mechanism is provided at the bottom of the two-way vibration mechanism, wherein the two-way vibration mechanism comprises an L-shaped swing rod, a two-way rotating wheel, a hollow slider and a chip board clamp, the L-shaped swing rod is arranged on the top of the body, the hollow slider is arranged on the bottom of the L-shaped swing rod, the two-way rotating wheel is arranged on the rear end of the body, and the chip board clamp is arranged on the bottom of the hollow slider. The two-way vibration mechanism is used to perform two-way vibration detection operation on the box plate carrying the chip clamped by the chip board clamp, further ensuring the normal progress of the chip vibration detection, the temperature regulating mechanism comprises a column rod and two transmission belts, the column rod is symmetrically arranged at the bottom of the I-shaped slider, the two transmission belts are arranged at the bottom of the two-way rotating wheel, the temperature regulating mechanism is used to perform high-temperature and low-temperature testing operations on the chip in the chip loading box clamped by the chip board clamp, and the clamping and fixing mechanism comprises a spiral rod, and the spiral rod is arranged at the left end of the chip board clamp.

[0011] Furthermore, the bidirectional vibration mechanism also includes a crank groove wheel, which passes through and is rotatably connected to the inner wall of the machine body, the top of the L-shaped swing arm is rotatably connected to the top of the machine body, and the crank groove wheel is slidably connected to a column block on the side away from the machine body, and the end of the column block away from the crank groove wheel is fixedly connected to the L-shaped swing arm, the top of the hollow slider passes through and is slidably connected to the bottom of the L-shaped swing arm, the chip board clamp is fixedly connected to the bottom of the hollow slider, and the side of the hollow slider close to the machine body is slidably connected to two slide rails 1, the slide rail 1 is arranged in a long strip shape, and the side of the slide rail 1 away from the hollow slider is fixedly connected to an I-shaped slider.

[0012] Furthermore, two slide rails are symmetrically provided on both sides of the I-shaped slider close to the machine body, and the two slide rails are fixedly connected to the machine body on one side away from the I-shaped slider.

[0013] Furthermore, a spring 1 is symmetrically provided on one side of the machine body close to the L-shaped swing arm, and the bottoms of the two springs 1 are fixedly connected to the top of the I-shaped slider.

[0014] Furthermore, the hollow slider is provided with pin holes on both sides close to the slide rail one, and the hollow slider is fixedly connected to spring 2 on both sides away from the L-shaped swing rod. The ends of the two springs 2 away from the hollow slider are fixedly connected to the limiting support frame, and the ends of the two limiting support frames close to the slide rail two are fixedly connected to the I-shaped slider.

[0015] Furthermore, the top of the I-shaped slider is fixedly connected to a connecting plate, and the side of the body close to the crank groove wheel is penetrated and rotatably connected to a double-toothed wheel, and the side of the double-toothed wheel close to the crank groove wheel is slidably connected to the top of the connecting plate.

[0016] Furthermore, the double-toothed wheel is fixedly connected to a transmission wheel one on the side away from the machine body, the outer surface of the transmission wheel one is transmission-connected to a transmission belt one, the outer surface of the bidirectional wheel is transmission-connected to a transmission belt one, the side of the bidirectional wheel away from the transmission belt one passes through a motor and is fixedly connected to the output shaft of the motor, and the side of the crank slot wheel away from the machine body is fixedly connected to the output shaft of the motor.

[0017] Furthermore, the temperature control mechanism also includes a balance support rod, which is rotatably connected to the bottom of the body, and a movable plate is symmetrically arranged on the top of the balance support rod. The top of the movable plate is fixedly connected to a semi-open bellows, and an electric heating wire ring is fixedly connected between the inner walls of the semi-open bellows.

[0018] Furthermore, the top of the transmission belt 2 is connected to the bidirectional rotating wheel transmission, the bottom of the transmission belt 2 is connected to the transmission wheel 2, the side of the transmission wheel 2 away from the transmission belt 2 passes through and is rotatably connected to the bottom of the body, and the side of the transmission wheel 2 close to the balance support rod is fixedly connected to the fan.

[0019] Furthermore, the clamping and fixing mechanism also includes a concave movable clamping plate, the side of the concave movable clamping plate away from the chip board clamp is rotatably connected to the spiral rod, and the end of the concave movable clamping plate away from the spiral rod is slidably connected to the chip board clamp.

[0020] (3) Beneficial effects

[0021] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0022] 1. By providing a hollow slider and a chip clamp, when the hollow slider moves left and right, the chip clamp can be driven to move left and right, so that the chip clamp clamps and drives the carrier box with the chip to perform left and right moving impact test, thereby enhancing the functional test of the chip under the impact state and ensuring the normal progress of the chip functional test process.

[0023] 2. By setting up a temperature control mechanism, when the chip clamp moves left and right, the user can perform different temperature tests on the chip clamped in the chip clamp by moving the semi-open bellows up and down, thereby enhancing the adaptability test of the chip in different hot and cold environments. The fan can also continuously blow air to diffuse the heat generated in the semi-open bellows, further enhancing the effectiveness of the high and low temperature test of the chip and ensuring the normal progress of the chip adaptive temperature test.

[0024] 3. By providing a clamping and fixing mechanism, the user can manually rotate the spiral rod to drive the rotating connected concave movable plate to move toward the chip clamp, so that the concave movable plate can clamp and fix the carrier box with the chip on the chip clamp, further assisting the chip clamp to test the chip and ensure the normal progress of each chip testing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0026] Figure 1 It is a three-dimensional structural diagram of the present invention;

[0027] Figure 2 It is a partially cutaway three-dimensional structural diagram of the present invention;

[0028] Figure 3 It is a partial three-dimensional structural diagram of the bidirectional vibration mechanism of the present invention;

[0029] Figure 4 For the present invention Figure 2 A local enlarged structural diagram at point A in the middle;

[0030] Figure 5 For the present invention Figure 2 A local enlarged structural diagram at point B in the middle;

[0031] Figure 6 For the present invention Figure 2 A partial enlarged structural diagram at point C in the middle;

[0032] Figure 7 It is a partial three-dimensional structural diagram of the double-toothed runner and the connecting plate in the present invention;

[0033] Figure 8 It is a partial three-dimensional structural diagram of the balancing support rod and the movable plate in the present invention;

[0034] Figure 9 It is a partial three-dimensional structural diagram of the motor and the bidirectional rotating wheel in the present invention;

[0035] Figure 10 It is a partial three-dimensional structural diagram of the transmission belt 2 and the transmission wheel 2 in the present invention;

[0036] Figure 11 It is a partial three-dimensional structural diagram of the clamping and fixing mechanism of the present invention;

[0037] Figure 12It is a partial three-dimensional structural diagram of the semi-open bellows and the electric heating wire coil in the present invention.

[0038] The numbers in the figure represent:

[0039] 100, body;

[0040] 200, bidirectional vibration mechanism; 201, L-shaped swing arm; 202, spring 1; 203, crank groove rotor; 204, double-tooth rotor; 205, I-shaped slider; 206, slide rail 1; 207, hollow slider; 208, spring 2; 209, slide rail 2; 210, drive wheel 1; 211, drive belt 1; 212, connecting plate; 213, limit support frame; 214, column block; 215, latch hole; 216, motor; 217, bidirectional rotor; 218, chip board clamp;

[0041] 300, temperature control mechanism; 301, column; 302, semi-open bellows; 303, balance support rod; 304, fan; 305, movable plate; 306, transmission belt 2; 307, transmission wheel 2; 308, electric heating coil;

[0042] 400. Clamping and fixing mechanism; 401. Concave movable splint; 402. Screw rod. DETAILED DESCRIPTION

[0043] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0044] The present invention will be further described below with reference to the embodiments.

[0045] A chip testing device with adaptive testing capability in this embodiment, such as Figures 1-12As shown, it includes a body 100, a two-way vibration mechanism 200 is arranged inside the body 100, and a clamping and fixing mechanism 400 is arranged at the bottom of the two-way vibration mechanism 200. The two-way vibration mechanism 200 includes an L-shaped swing rod 201, a two-way rotating wheel 217, a hollow slider 207 and a chip board clamp 218. The L-shaped swing rod 201 is arranged at the top of the body 100, the hollow slider 207 is arranged at the bottom of the L-shaped swing rod 201, the two-way rotating wheel 217 is arranged at the rear end of the body 100, and the chip board clamp 218 is arranged at the bottom of the hollow slider 207. The two-way vibration mechanism 200 is used to perform a two-way vibration detection operation on the box plate carrying the chip clamped by the chip board clamp 218, so as to further ensure the normal progress of the chip vibration detection. The clamping and fixing mechanism 400 includes a spiral rod 402, and the spiral rod 402 is arranged at the left end of the chip board clamp 218.

[0046] Among them, the bidirectional vibration mechanism 200 also includes a crank groove wheel 203, which passes through and is rotatably connected to the inner wall of the body 100, and the top of the L-shaped swing arm 201 is rotatably connected to the top of the body 100. The crank groove wheel 203 is slidably connected to the side away from the body 100 with a column block 214, and the end of the column block 214 away from the crank groove wheel 203 is fixedly connected to the L-shaped swing arm 201, and the top of the hollow slider 207 passes through and is slidably connected to the bottom of the L-shaped swing arm 201, and the chip board clamp 218 is fixedly connected to the bottom of the hollow slider 207. The side of the hollow slider 207 close to the body 100 is slidably connected to two slide rails 1 206, and the slide rail 1 206 is arranged in a long strip shape, and the side of the slide rail 1 206 away from the hollow slider 207 is fixedly connected to the I-shaped slider 205.

[0047] Among them, two slide rails 209 are symmetrically arranged on both sides of the I-shaped slider 205 close to the body 100, and the two slide rails 209 are fixedly connected to the body 100 on the side away from the I-shaped slider 205.

[0048] Among them, spring 1 202 is symmetrically provided on one side of the body 100 close to the L-shaped swing rod 201, and the bottoms of the two springs 1 202 are fixedly connected to the top of the I-shaped slider 205.

[0049] Among them, the hollow slider 207 is provided with pin holes 215 on both sides close to the slide rail 1 206, and the hollow slider 207 is fixedly connected with spring 208 on both sides away from the L-shaped swing rod 201. The ends of the two springs 208 away from the hollow slider 207 are fixedly connected to the limiting support frame 213, and the ends of the two limiting support frames 213 close to the slide rail 2 209 are fixedly connected to the I-shaped slider 205.

[0050] Among them, the top of the I-shaped slider 205 is fixedly connected to the connecting plate 212, and the side of the body 100 close to the crank groove wheel 203 is penetrated and rotatably connected with the double-toothed wheel 204, and the side of the double-toothed wheel 204 close to the crank groove wheel 203 is slidingly connected to the top of the connecting plate 212.

[0051] Among them, the double-toothed wheel 204 is fixedly connected to the transmission wheel 210 on the side away from the body 100, the outer surface of the transmission wheel 210 is transmission-connected to the transmission belt 211, the outer surface of the bidirectional wheel 217 is transmission-connected to the transmission belt 211, the side of the bidirectional wheel 217 away from the transmission belt 211 passes through the motor 216 and is fixedly connected to the output shaft of the motor 216, and the side of the crank groove wheel 203 away from the body 100 is fixedly connected to the output shaft of the motor 216.

[0052] The clamping and fixing mechanism 400 further includes a concave movable clamp 401 , the side of the concave movable clamp 401 away from the chip board clamp 218 is rotationally connected to the spiral rod 402 , and the end of the concave movable clamp 401 away from the spiral rod 402 is slidingly connected to the chip board clamp 218 .

[0053] Compared with the existing technology, this chip testing equipment with adaptive testing capabilities can solve the problem that the original chip testing equipment cannot perform impact detection on the chip. The hollow slider 207 can be moved left and right to drive the chip board clamp 218 to move left and right, thereby enabling the chip board clamp 218 to move left and right to perform impact and vibration operations on the carrier box with the chip, thereby ensuring the normal progress of the chip functional testing process.

[0054] In other aspects, this embodiment also provides a chip testing device with adaptive testing capabilities, such as Figure 2 、 Figure 6 、 Figure 9 As shown, a temperature control mechanism 300 is provided at the bottom of the body 100. The temperature control mechanism 300 includes a column 301 and a second transmission belt 306. The column 301 is symmetrically arranged at the bottom of the I-shaped slider 205, and the second transmission belt 306 is arranged at the bottom of the bidirectional rotating wheel 217. The temperature control mechanism 300 is used to perform high and low temperature testing operations on the chip in the chip loading box clamped by the chip plate clamp 218.

[0055] Among them, the temperature control mechanism 300 also includes a balance support rod 303, which is rotatably connected to the bottom of the body 100. A movable plate 305 is symmetrically arranged on the top of the balance support rod 303. The top of the movable plate 305 is fixedly connected to a semi-open bellows 302, and an electric heating wire ring 308 is fixedly connected between the inner walls of the semi-open bellows 302.

[0056] Among them, the top of the transmission belt 2 306 is connected to the bidirectional rotating wheel 217, the bottom of the transmission belt 2 306 is connected to the transmission wheel 2 307, the side of the transmission wheel 2 307 away from the transmission belt 2 306 passes through and is rotatably connected to the bottom of the body 100, and the side of the transmission wheel 2 307 close to the balance support rod 303 is fixedly connected to the fan 304.

[0057] Compared with the existing technology, the chip testing equipment with adaptive testing capability can solve the problem that the original chip testing equipment cannot perform temperature detection on the chip. The semi-open bellows 302 can move up and down to drive the electrically heated heating wire ring 308 to move up and down, thereby enabling the semi-open bellows 302 to perform high and low temperature testing operations on the chip moving left and right. Under the continuous blowing action of the fan 304, the fan 304 blows and diffuses the heat energy in the semi-open bellows 302, thereby strengthening the semi-open bellows 302 to perform gradual self-adjusting temperature testing on the moving chip, thereby ensuring the normal progress of the chip temperature test.

[0058] Working principle:

[0059] The first step is to open the front door of the machine body 100 and place a chip loading cassette containing several chips in the clamping opening of the chip board clamp 218 in the bidirectional vibration mechanism 200. Manually rotate the screw rod 402 in the clamping and fixing mechanism 400 clockwise to drive the rotatably connected concave movable clamping plate 401 to move toward the chip board clamp 218 and gradually clamp the chip loading cassette. When the concave movable clamping plate 401 and the chip board clamp 218 fully clamp the chip loading cassette, stop rotating the screw rod 402 and close the front door of the machine body 100.

[0060] Then, the bidirectional vibration mechanism 200 starts to work, and the output shaft of the starting motor 216 rotates forward, driving the crank groove wheel 203 to rotate clockwise, and the crank groove wheel 203 rotates to drive the column block 214 to slide clockwise along the inner groove at the top of the crank groove wheel 203, indirectly causing the column block 214 to drive the fixedly connected L-shaped swing rod 201 to swing back and forth left and right, and then causing the L-shaped swing rod 201 to drive the slidingly connected hollow slider 207 to slide left and right along the track direction of the two slide rails 206, so that the hollow slider 207 drives the fixedly connected chip board clamp 218 to shake left and right, and in the process of working Under the limiting action of the limiting support frames 213 fixedly connected to both sides of the shaped slider 205, when the hollow slider 207 swings left and right, the pin holes 215 on both sides of the hollow slider 207 will engage with one end of the two limiting support frames 213, and produce a vibration effect, thereby enabling the hollow slider 207 to perform a mobile vibration detection operation on the chip clamped by the chip board clamp 218, thereby ensuring the normal progress of the chip vibration detection process. The two second springs 208 are both fixedly connected to one side of the hollow slider 207 and the limiting support frames 213, so that the two second springs 208 can provide stable elastic support for the left and right vibration of the hollow slider 207;

[0061] In the second step, under the action of the continuous rotation force of the output shaft of the motor 216, the fixedly connected bidirectional rotating wheel 217 can be driven to rotate clockwise, and the rotation of the bidirectional rotating wheel 217 drives the transmission wheel 1 210 connected to one end of the transmission belt 1 211 to rotate clockwise, thereby causing the transmission wheel 1 210 to rotate and drive the fixedly connected double-toothed rotating wheel 204 to rotate clockwise. When the teeth of the double-toothed rotating wheel 204 rotate clockwise until they conflict with the top of the connecting plate 212, the double-toothed rotating wheel 204 can rotate and squeeze the connecting plate 212. 2 moves downward, and the connecting plate 212 drives the I-shaped slider 205 to move downward, and the I-shaped slider 205 pulls the spring 1 202 fixed at both ends to stretch downward, further causing the I-shaped slider 205 to drive the hollow slider 207 sliding left and right to move downward along the track direction of the two slide rails 209. At the same time, the I-shaped slider 205 drives the column 301 fixed at the bottom to move downward, thereby causing the two column rods 301 in the temperature control mechanism 300 to gradually contact the two movable plates 305 downward.

[0062] When the hollow slider 207 slides to the left to the left end of the slide rail 1 206, the column 301 on the left side of the I-shaped slider 205 can squeeze the movable plate 305 below to move downward, and drive the movable plate 305 to drive the left end of the balancing support rod 303 to deviate downward, and lift the right end of the balancing support rod 303, synchronously causing the right end of the balancing support rod 303 to lift the rotatable movable plate 305 to move upward, so that the movable plate 305 drives the semi-open bellows 302 fixed on the top to move upward to the right side of the I-shaped slider 205, further causing the semi-open bellows 302 to drive the electric heating wire ring 308 fixed on the inner wall to move upward, so that when the hollow slider 207 drives the chip board clamp 218 to move right again, the electric heating wire ring 308 in the movable plate 305 can be energized and heated, so that the movable plate 305 can perform high-temperature detection on the chip clamped by the chip board clamp 218, thereby assisting the operator to test the chip at different heat levels;

[0063] When the teeth of the double-toothed runner 204 are separated from the top of the connecting plate 212, the two springs 1 202 can elastically contract, so that the two springs 1 202 can pull the I-shaped slider 205 to move upward along the track direction of the two slide rails 209, and the I-shaped slider 205 drives the two fixedly connected slide rails 1 206 to move upward. At the same time, the two slide rails 1 206 drive the hollow slider 207 sliding to the right to move upward, and further the I-shaped slider 205 pushes the connecting plate 212 to move upward to its original position.

[0064] When the hollow slider 207 moves to the rightmost end of the I-shaped slider 205, the I-shaped slider 205 continues to move downward along the trajectory direction of the two slide rails 209, and indirectly drives the column 301 on the right side of the I-shaped slider 205 to resist downward and push the movable plate 305 with the semi-open bellows 302 to move downward, thereby causing the semi-open bellows 302 to drive the heating wire coil 308 to move downward, and simultaneously causing the movable plate 305 to squeeze the right side of the balance support rod 303 and deviate downward, so that the left side of the balance support rod 303 begins to rise, and at the same time, the left side of the balance support rod 303 pushes the movable plate 305 connected to the top rotation to move upward. When the movable plate 305 on the left moves upward to the bottom of the column 301, the I-shaped slider 205 moves up to its original position again, and the cyclic detection operation is performed.

[0065] Driven by the continuous rotation force of the two-way rotating wheel 217, the two-way rotating wheel 217 can rotate to drive the transmission wheel 2 307 connected to the bottom of the transmission belt 2 306 to rotate clockwise, and then the transmission wheel 2 307 rotates to drive the fixedly connected fan 304 to rotate clockwise to blow air. Therefore, when the semi-open bellows 302 performs high and low temperature tests on the chip clamped by the chip board clamp 218, the fan 304 can continuously rotate and blow air to allow the fan 304 to blow and diffuse the heat emitted by the semi-open bellows 302, further enhancing the effectiveness of the high and low temperature tests of the chip and ensuring the normal progress of the chip temperature test. When the chip impact and temperature detection are completely completed After the bundle is bundled, the rotation of the motor 216 is paused, and the power supply of the heating wire coil 308 is disconnected, the heating wire coil 308 stops heating, and then the front door of the body 100 is opened, and the spiral rod 402 is manually rotated to drive the concave movable clamp 401 to slide in the opposite direction of the chip board clamp 218, thereby making the concave movable clamp 401 and the chip board clamp 218 release the clamped chip carrier box, and then manually remove the inspected chip carrier box, and arrange the inspected chips in the designated stacking position, and then check whether there are any uninspected chips. If so, continue to perform the same steps for inspection. If not, stop the motor 216, close the front door of the body 100, stop the device, and the inspection is completed.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A chip testing device with adaptive testing capability, comprising a body (100), characterized in that: A bidirectional vibration mechanism (200) is provided inside the body (100), a temperature adjustment mechanism (300) is provided at the bottom of the body (100), and a clamping and fixing mechanism (400) is provided at the bottom of the bidirectional vibration mechanism (200); The bidirectional vibration mechanism (200) comprises an L-shaped swinging rod (201), a bidirectional rotating wheel (217), a hollow slider (207) and a chip board clamp (218), wherein the L-shaped swinging rod (201) is arranged at the top of the machine body (100), the hollow slider (207) is arranged at the bottom of the L-shaped swinging rod (201), the bidirectional rotating wheel (217) is arranged at the rear end of the machine body (100), and the chip board clamp (218) is arranged at the bottom of the hollow slider (207). The bidirectional vibration mechanism (200) is used to perform bidirectional vibration detection on the box plate carrying the chip clamped by the chip board clamp (218), thereby further ensuring the normal performance of the chip vibration detection. The temperature regulating mechanism (300) includes a column (301) and a second transmission belt (306), wherein the column (301) is symmetrically arranged at the bottom of the I-shaped slider (205), and the second transmission belt (306) is arranged at the bottom of the bidirectional rotating wheel (217). The temperature regulating mechanism (300) is used to perform high temperature and low temperature testing operations on the chip in the chip loading box clamped by the chip plate clamp (218); The clamping and fixing mechanism (400) includes a spiral rod (402), and the spiral rod (402) is arranged at the left end of the chip board clamp (218).

2. The chip testing device with adaptive testing capability according to claim 1, characterized in that: The bidirectional vibration mechanism (200) further comprises a crank groove wheel (203), the crank groove wheel (203) penetrates and is rotatably connected to the inner wall of the machine body (100), the top of the L-shaped swing rod (201) is rotatably connected to the top of the machine body (100), and a column block (214) is slidably connected to the side of the crank groove wheel (203) away from the machine body (100), and the end of the column block (214) away from the crank groove wheel (203) is fixed to the L-shaped swing rod (201). The top of the hollow slider (207) is connected to the bottom of the L-shaped swing rod (201) through and slidingly connected, the chip board clamp (218) is fixedly connected to the bottom of the hollow slider (207), and the side of the hollow slider (207) close to the body (100) is slidably connected to two slide rails (206), the slide rails (206) are arranged in a long strip shape, and the side of the slide rails (206) away from the hollow slider (207) is fixedly connected to an I-shaped slider (205).

3. The chip testing device with adaptive testing capability according to claim 2, characterized in that: The I-shaped slider (205) is symmetrically provided with two slide rails (209) on both sides close to the machine body (100), and the two slide rails (209) are fixedly connected to the machine body (100) on the side away from the I-shaped slider (205).

4. The chip testing device with adaptive testing capability according to claim 2, characterized in that: A spring 1 (202) is symmetrically provided on one side of the machine body (100) close to the L-shaped swing rod (201), and the bottoms of the two springs 1 (202) are fixedly connected to the top of the I-shaped slider (205).

5. The chip testing device with adaptive testing capability according to claim 2, characterized in that: The hollow slider (207) is provided with latch holes (215) on both sides close to the first slide rail (206), and the hollow slider (207) is fixedly connected to the second spring (208) on both sides away from the L-shaped swing rod (201), and the ends of the two second springs (208) away from the hollow slider (207) are fixedly connected to the limiting support frame (213), and the ends of the two limiting support frames (213) close to the second slide rail (209) are fixedly connected to the I-shaped slider (205).

6. The chip testing device with adaptive testing capability according to claim 2, characterized in that: The top of the I-shaped slider (205) is fixedly connected to a connecting plate (212); a double-toothed wheel (204) is passed through and rotatably connected to a side of the machine body (100) close to the crank groove wheel (203); and a side of the double-toothed wheel (204) close to the crank groove wheel (203) is slidably connected to the top of the connecting plate (212).

7. The chip testing device with adaptive testing capability according to claim 6, characterized in that: The side of the double-toothed rotating wheel (204) away from the machine body (100) is fixedly connected to a transmission wheel (210), the outer surface of the transmission wheel (210) is transmission-connected to a transmission belt (211), the outer surface of the bidirectional rotating wheel (217) is transmission-connected to the transmission belt (211), the side of the bidirectional rotating wheel (217) away from the transmission belt (211) passes through a motor (216) and is fixedly connected to the output shaft of the motor (216), and the side of the crank groove rotating wheel (203) away from the machine body (100) is fixedly connected to the output shaft of the motor (216).

8. The chip testing device with adaptive testing capability according to claim 1, characterized in that: The temperature control mechanism (300) further comprises a balance support rod (303), wherein the balance support rod (303) is rotatably connected to the bottom of the machine body (100), and a movable plate (305) is symmetrically provided on the top of the balance support rod (303), and a semi-open bellows (302) is fixedly connected to the top of the movable plate (305), and an electric heating wire coil (308) is fixedly connected between the inner walls of the semi-open bellows (302).

9. The chip testing device with adaptive testing capability according to claim 8, characterized in that: The top of the second transmission belt (306) is connected to the bidirectional rotating wheel (217), and the bottom of the second transmission belt (306) is connected to the second transmission wheel (307). The side of the second transmission wheel (307) away from the second transmission belt (306) passes through and is rotatably connected to the bottom of the machine body (100). The side of the second transmission wheel (307) close to the balance support rod (303) is fixedly connected to the fan (304).

10. The chip testing device with adaptive testing capability according to claim 1, characterized in that: The clamping and fixing mechanism (400) further comprises a concave movable clamp (401), wherein the side of the concave movable clamp (401) away from the chip board clamp (218) is rotationally connected to the spiral rod (402), and the end of the concave movable clamp (401) away from the spiral rod (402) is slidingly connected to the chip board clamp (218).

Citation Information

Patent Citations

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