An LED bracket, an LED package and a light-emitting device

Abstract

This application provides an LED bracket, an LED package, and a light-emitting device. The LED bracket includes a cup-shaped substrate. The cup-shaped substrate includes a base, a surrounding barrier, and strip-shaped protrusions. Multiple spaced die-bonding regions are disposed on the upper surface of the base. The surrounding barrier surrounds the edge of the base, forming a cup-shaped structure together with the base. The strip-shaped protrusions are disposed on the upper surface of the base, located between adjacent die-bonding regions, and protrude from the upper surface of the base. Both ends of the strip-shaped protrusions extend towards the inner sidewall of the surrounding barrier, and the ends of the strip-shaped protrusions are spaced apart from the inner sidewall of the surrounding barrier. The technical solution of this application can effectively reduce the deformation problem of the cup rim of the LED bracket's cup structure, improve the LED's lifespan, and also increase the luminous brightness.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor processing and manufacturing, and more specifically, to an LED bracket, an LED package, and a light-emitting device. Background Technology

[0002] Light-emitting diodes (LEDs) have been applied in an increasing number of applications due to their advantages such as high luminous efficiency, low energy consumption, and zero pollution. Before being applied to specific fields, LED chips need to be encapsulated to protect them from compression or oxidation, thereby ensuring that the LED encapsulation structure achieves high luminous efficiency and a long service life.

[0003] Currently, in existing multi-LED packaging products, the cup-shaped packaging substrate (or focusing substrate) is basically formed by combining two or more metal electrodes with plastic material. The metal electrodes are usually separated by raised plastic structures, which extend to the inner wall of the cup-shaped packaging substrate to increase structural strength. Afterwards, the LED chip is soldered onto the metal electrodes, and then the cup-shaped packaging substrate is filled with encapsulating material before baking and curing.

[0004] First, the plastic protrusion structure is generally formed by injection molding. Since the two ends of the protrusion structure extend to the inner wall of the cup-shaped packaging substrate and are connected as one piece, the protrusion structure will apply stress to the inner wall of the cup-shaped packaging substrate during molding, causing the side wall to bend and deform.

[0005] Meanwhile, during the process of filling the encapsulating adhesive into the cup substrate and baking and curing, the plastic material extends to the inner wall of the cup substrate at both ends and becomes integrated. This causes structural instability during baking, which in turn causes the protruding structure to further exert stress on the inner wall of the cup substrate, resulting in deformation of the cup mouth of the cup substrate. This may lead to gaps between the encapsulating adhesive and the cup mouth sidewall of the cup substrate, allowing moisture and air to enter the cup and affecting the lifespan of the LED. Summary of the Invention

[0006] The purpose of this application is to provide an LED bracket, an LED package, and a light-emitting device, which can effectively reduce the deformation problem of the cup mouth of the LED bracket's bowl structure, improve the lifespan of the LED, and also increase the luminous brightness.

[0007] In a first aspect, an LED support is provided, comprising a cup-shaped substrate. The cup-shaped substrate includes a base, a retaining wall, and strip-shaped protrusions. A plurality of spaced die-bonding regions are disposed on the upper surface of the base. The retaining wall surrounds the edge of the base, forming a cup-shaped structure together with the base. The strip-shaped protrusions are disposed on the upper surface of the base, located between adjacent die-bonding regions, and protrude from the upper surface of the base. Both ends of the strip-shaped protrusions extend towards the inner sidewall of the retaining wall, and the ends of the strip-shaped protrusions are spaced apart from the inner sidewall of the retaining wall.

[0008] Secondly, an LED package is also provided, which includes the LED bracket as described in the aforementioned solution; it also includes an LED chip and an encapsulating adhesive layer. The LED chip is disposed on the die-bonding region of the substrate of the LED bracket, and the encapsulating adhesive layer is filled in the cup structure formed by the enclosure of the LED bracket and the substrate.

[0009] Thirdly, a light-emitting device is also provided, including at least one LED package as described in the aforementioned scheme, and also including a circuit board, wherein the LED package is disposed on the circuit board.

[0010] Compared with the prior art, the beneficial effects of this application include at least the following:

[0011] 1. During the manufacturing of the LED bracket of this application, since the ends of the strip-shaped protrusions are spaced apart from the inner wall of the enclosure, excessive stress will not be applied to the inner wall of the enclosure during the forming of the strip-shaped protrusions, thereby reducing the risk of deformation of the enclosure.

[0012] 2. When the encapsulating adhesive is filled into the bowl structure of the LED bracket in this application and baked, the ends of the strip-shaped protrusions are spaced apart from the inner sidewall of the enclosure, that is, the ends of the strip-shaped protrusions are not connected to the inner sidewall of the enclosure. This makes the cup mouth (i.e., the enclosure) of the bowl structure less prone to deformation, and thus makes it less likely for gaps to appear between the inner sidewall of the enclosure and the encapsulating adhesive layer. This ensures that the encapsulating adhesive layer and the inner sidewall of the enclosure maintain a good sealing contact effect, thereby reducing the probability of moisture and air entering the bowl structure and reducing the probability of moisture absorption and oxygen absorption by the encapsulating adhesive layer and LED chip inside the bowl structure during use. This improves the airtightness and structural reliability of the LED package 100, thereby increasing the service life of the LED chip.

[0013] 3. The cup structure formed by the enclosure and the base itself has a light-focusing effect. After the strip protrusion is set, its surface can also reflect the light emitted from the side of the LED chip, thereby further improving the luminous intensity and brightness. It also works in conjunction with the cup structure to further improve the light concentration. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a three-dimensional structural diagram of the first type of LED bracket according to Embodiment 1 of this application;

[0016] Figure 2 for Figure 1 Top view of the LED bracket;

[0017] Figure 3 For along Figure 2 Cross-sectional view of AA;

[0018] Figure 4 Here is a cross-sectional view of BB along route 2;

[0019] Figure 5a For along Figure 2 Cross-sectional view of CC;

[0020] Figure 5b When the width of the strip boss is greater than the gap between the circuit layers, along Figure 2 Cross-sectional view of CC;

[0021] Figure 6 This is a three-dimensional structural diagram of the second type of LED bracket shown in Embodiment 1 of this application;

[0022] Figure 7 for Figure 6 Top view of the LED bracket;

[0023] Figure 8 For along Figure 2 Cross-sectional view of DD;

[0024] Figure 9 This is a three-dimensional structural diagram of an LED package according to Embodiment 1 of this application;

[0025] Figure 10 Figure 5 shows a cross-sectional view of the LED package along its length.

[0026] Figure 11 This is a three-dimensional structural schematic diagram of a light-emitting device according to Embodiment 1 of this application;

[0027] Figure 12 This is a three-dimensional structural diagram of an LED bracket according to Embodiment 2 of this application;

[0028] Figure 13 for Figure 8 Top view of the LED bracket;

[0029] Figure 14 For along Figure 9 Cross-sectional view of EE;

[0030] Figure 15 This is a three-dimensional structural diagram of an LED package according to Embodiment 2 of this application;

[0031] Figure 16 for Figure 11 A cross-sectional view of the LED package along its length;

[0032] Figure 17 This is a three-dimensional structural diagram of the first type of LED bracket shown in Embodiment 3 of this application;

[0033] Figure 18 for Figure 17 Top view of the LED bracket;

[0034] Figure 19 This is a three-dimensional structural diagram of an LED package according to Embodiment 3 of this application;

[0035] Figure 20 This is a three-dimensional structural diagram of the second type of LED bracket shown in Embodiment 3 of this application;

[0036] Figure 21 for Figure 20 Top view of the LED bracket;

[0037] Figure 22 This is a three-dimensional structural diagram of the third type of LED bracket according to Embodiment 3 of this application;

[0038] Figure 23 for Figure 22 Top view of the LED bracket.

[0039] In the diagram: 10, LED bracket; 1, cup-shaped substrate; 11, base; 12, enclosure; 13, strip-shaped boss; 131, first strip-shaped boss; 132, second strip-shaped boss; 133, gap; 134, sloped surface; 135, right-angled surface; 136, notch; 14, die bonding area; 2, first circuit layer; 3, second circuit layer; 20, LED chip; 30, encapsulant layer; 100, LED package; 200, circuit board. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0042] This application first provides an LED support, including a cup-shaped substrate. The cup-shaped substrate includes a base, a surrounding barrier, and strip-shaped protrusions; the upper surface of the base is provided with a plurality of spaced die-bonding regions. The surrounding barrier surrounds the edge of the base, forming a cup-shaped structure together with the base. The strip-shaped protrusions are disposed on the upper surface of the base, located between adjacent die-bonding regions, and protrude from the upper surface of the base by a predetermined height. The two ends of the strip-shaped protrusions extend towards the inner sidewall of the surrounding barrier, and the ends of the strip-shaped protrusions are spaced apart from the inner sidewall of the surrounding barrier.

[0043] In the LED package formed using the LED bracket of this application, an LED chip is placed in the cup structure of the LED bracket, and then encapsulating glue is filled in, baked and cured to form an encapsulating glue layer. The encapsulating glue layer is bonded to the inner wall of the cup structure (i.e., the inner wall of the enclosure).

[0044] In the LED bracket of this application, since the ends of the strip protrusions are spaced apart from the inner wall of the enclosure, excessive stress will not be applied to the inner wall of the enclosure during the forming of the strip protrusions, thereby reducing the risk of deformation of the enclosure.

[0045] Meanwhile, when the encapsulating adhesive is filled into the bowl structure of the LED bracket and baked, the ends of the strip-shaped protrusions are spaced apart from the inner wall of the enclosure, meaning the ends of the strip-shaped protrusions are not connected to the inner wall of the enclosure. This makes the cup mouth (i.e., the enclosure) of the bowl structure less prone to deformation, thus preventing gaps from forming between the inner wall of the enclosure and the encapsulating adhesive layer. This ensures a good sealing contact between the encapsulating adhesive layer and the inner wall of the enclosure, reducing the probability of moisture and air entering the bowl structure. It also reduces the probability of moisture and oxygen absorption by the encapsulating adhesive layer and LED chip inside the bowl structure during use. This improves the airtightness and structural reliability of the LED package 100, thereby increasing the lifespan of the LED chip.

[0046] In addition, the bowl-shaped structure formed by the enclosure and the base itself has a light-focusing effect. After the strip protrusions are set, their surfaces can also reflect the light emitted from the side of the LED chip, thereby further improving the luminous intensity and brightness. In conjunction with the bowl-shaped structure, it further improves the light concentration.

[0047] In the technical solution of this application, the LED bracket includes a first circuit layer and a second circuit layer. The first circuit layer is disposed on the surface of the die-bonding region. The second circuit layer is disposed in the substrate and led out from the bottom or side surface, and the second circuit layer is electrically connected to the first circuit layer.

[0048] It should be noted that the die-bonding areas on both sides of the strip-shaped boss can be used to bond one or more LED chips. Furthermore, the strip-shaped boss can be placed between any two adjacent pairs of die-bonding areas.

[0049] In the technical solution of this application, the cross-sectional width of the strip-shaped boss can be less than or equal to the gap width between adjacent circuit layers. The upper width of the cross-section of the strip-shaped boss can also be greater than the gap width between adjacent circuit layers, and they press against the upper surface of the adjacent circuit layers respectively.

[0050] In the technical solution of this application, the distance between the end of the strip-shaped protrusion and the inner wall of the enclosure is d, where 0μm < d ≤ 100μm. For example, the value of d can be 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, etc. In one solution, the value of d can be set to 0μm < d ≤ 50μm, which ensures that the end of the strip-shaped protrusion does not directly contact the inner wall of the enclosure, leaving a certain gap, while also preventing the gap from being too large. This ensures structural strength and reduces the risk of cup-mouth deformation in the bowl-shaped structure. In another solution, the value of d can be set to 50μm < d ≤ 100μm, so that the distance between the end of the strip-shaped protrusion and the inner wall of the enclosure is large enough, further reducing the risk of cup-mouth deformation in the bowl-shaped structure. If d > 100 μm, the strength of the cup structure will be reduced to some extent. Therefore, it is not recommended to set the distance between the end of the strip boss and the inner wall of the enclosure to be more than 100 μm.

[0051] In the technical solution of this application, the end face of the strip-shaped boss facing the inner wall of the enclosure can be configured as a sloping surface or a vertical surface. When configured as a sloping surface, that is, in the cross-sectional shape along the direction perpendicular to the extension of the strip-shaped boss, the upper width is smaller than the lower width, and the sloping surface forms an approximately V-shaped notch with the inner wall of the enclosure. When configured as a vertical surface, the sloping surface forms an approximately rectangular or inverted trapezoidal notch with the inner wall of the enclosure. The dimension of the widest part of the notch can be used as an indicator to measure the distance between the end of the strip-shaped boss and the inner wall of the enclosure.

[0052] In the technical solution of this application, the height of the strip-shaped protrusion can be set lower than the height of the enclosure, so that the subsequent encapsulating adhesive layer will also completely cover the strip-shaped protrusion, thereby reducing the possibility of moisture and air entering the cup structure. Preferably, the height of the strip-shaped protrusion can be set to not exceed 1 / 2 of the height of the enclosure.

[0053] In the technical solution of this application, after the LED chip is installed in the die-bonding area, the height of the strip-shaped boss can be set to be lower than the height of the LED chip.

[0054] In the technical solution of this application, the two side walls of the strip boss along its extension direction can be set as vertical surfaces.

[0055] In the technical solution of this application, the two side walls of the strip-shaped protrusion along its extension direction can be set as inclined surfaces. As can be seen from the aforementioned solution, the strip-shaped protrusion is disposed between adjacent die-bonding areas. The light emitted from the side of the LED chip disposed on the die-bonding area will be further focused when it reaches the inclined surfaces of the two side walls of the strip-shaped protrusion along its extension direction, thereby improving the light focusing performance.

[0056] Furthermore, in the technical solution of this application, concave surfaces can be provided on the inclined surfaces of the two side walls of the strip-shaped boss along its extension direction to form a concave mirror effect, which can further improve light focusing and brightness.

[0057] In the technical solution of this application, the inner sidewall of the bowl-shaped substrate can be set as a slope or a vertical surface.

[0058] In the technical solution of this application, the strip-shaped boss may include multiple first strip-shaped bosses, which may be arranged in parallel. For a long strip-shaped LED bracket, by setting multiple parallel first strip-shaped bosses spaced at predetermined intervals, the stability of the structure can be increased, and multiple die-bonding regions can be separated.

[0059] In the technical solution of this application, the strip-shaped protrusions may include intersecting first and second strip-shaped protrusions. The first strip-shaped protrusions extend along a first direction, and the second strip-shaped protrusions extend along a second direction, with the first and second directions perpendicular to each other. For LED brackets whose dimensions extend along both the first and second directions, the perpendicular intersection of the first and second strip-shaped protrusions forms a grid-like structure, which can increase the stability of the LED bracket structure and also separate multiple die-bonding areas.

[0060] In the technical solution of this application, at the intersection of the first strip boss and the second strip boss, the first strip boss or the second strip boss can be disconnected so that the first strip boss and the second strip boss do not contact each other at the intersection point, thus avoiding the problem of stress concentration at the intersection of the first strip boss and the second strip boss.

[0061] In the technical solution of this application, at the intersection of the first strip boss and the second strip boss, both the first strip boss and the second strip boss can be disconnected, so that the first strip boss and the second strip boss form a gap at the intersection point. This can also avoid the problem of stress concentration at the intersection of the first strip boss and the second strip boss.

[0062] This application also provides an LED package, which includes the LED bracket described in the aforementioned scheme; it also includes an LED chip and an encapsulating adhesive layer. The LED chip is disposed on the die-bonding region of the substrate of the LED bracket, and the encapsulating adhesive layer is filled in the cup structure formed by the enclosure of the LED bracket and the substrate.

[0063] It should be noted that a die bonding area can be designed to bond only one LED chip, or it can be designed to bond multiple LED chips.

[0064] In the structure of the LED package, the strip-shaped protrusions increase the contact area between the encapsulating adhesive layer and the cup substrate, which also helps to improve the adhesion between the encapsulating adhesive layer and the cup substrate, thereby enhancing the stability of the sealing structure.

[0065] This application also provides a light-emitting device, which includes at least one LED package as described above, and also includes a circuit board, wherein the LED package is disposed on the circuit board.

[0066] To provide a more detailed description of the LED package of this application, the following embodiments are provided. It should be noted that the technical features and solutions in the following embodiments can be used in combination without conflict.

[0067] Example 1

[0068] like Figures 1-8 As shown, this embodiment first provides an LED support 10, which includes a cup-shaped substrate 1. The cup-shaped substrate 1 includes a base 11, a retaining wall 12, and a strip-shaped protrusion 13, which are integrally continuous structures. Multiple spaced die-bonding regions 14 are provided on the upper surface of the base 11. The retaining wall 12 surrounds the edge of the base 11, forming a cup-shaped structure together with the base 11. The strip-shaped protrusion 13 is located on the upper surface of the base 11, between adjacent die-bonding regions 14, and protrudes from the upper surface of the base 11. Both ends of the strip-shaped protrusion 13 extend towards the inner wall of the retaining wall 12, and the ends of the strip-shaped protrusion 13 are spaced apart from the inner wall of the retaining wall 12.

[0069] like Figure 10 As shown, in the LED package 100 formed using the LED bracket 10 of this application, an LED chip 20 is disposed in the cup structure of the LED bracket 10, and then encapsulating glue is filled in and baked to form an encapsulating glue layer 30. The encapsulating glue layer 30 is bonded to the inner wall of the cup structure (i.e., the inner wall of the enclosure 12).

[0070] In the LED bracket 10 of this embodiment, since the ends of the strip protrusions 13 are spaced apart from the inner sidewall of the enclosure 12, excessive stress will not be applied to the inner sidewall of the enclosure 12 when the strip protrusions 13 are formed, thereby reducing the risk of deformation of the enclosure 12.

[0071] Meanwhile, when the encapsulating adhesive is filled into the cup structure of the LED bracket 10 and baked, the ends of the strip protrusions 13 are spaced apart from the inner wall of the enclosure 12, meaning the ends of the strip protrusions 13 are not connected to the inner wall of the enclosure 12. This makes the cup mouth (i.e., the enclosure 12) of the cup structure less prone to deformation, and thus makes it less likely for gaps to appear between the inner wall of the enclosure 12 and the encapsulating adhesive layer 30. This ensures that the encapsulating adhesive layer 30 and the inner wall of the enclosure 12 maintain a good sealing contact effect, thereby reducing the probability of moisture and air entering the cup structure and reducing the probability of moisture absorption and oxygen absorption by the encapsulating adhesive layer 30 and the LED chip 20 inside the cup structure during use. This improves the airtightness and structural reliability of the LED package 100, thereby increasing the service life of the LED chip 20.

[0072] In addition, the bowl-shaped structure formed by the enclosure 12 and the base 11 has a light-focusing effect. After the strip protrusion 13 is set, its surface can also reflect the light emitted from the side of the LED chip 20, thereby further improving the luminous intensity and brightness, and cooperating with the bowl-shaped structure to further improve the light concentration.

[0073] like Figure 1 , Figure 4 Figure 5 Figure 6 and Figure 8 As shown, the LED support 10 includes a first circuit layer 2 and a second circuit layer 3. The first circuit layer 2 is disposed on the surface of the die-bonding region 14. The second circuit layer 3 is disposed in the substrate 11 and extends from the bottom or side surface, and is electrically connected to the first circuit layer 2. The accompanying drawings of this embodiment only show the configuration where the second circuit layer 3 extends from the bottom surface of the substrate 11.

[0074] It should be noted that the die-bonding areas 14 on both sides of the strip-shaped boss 13 can be used to bond one or more LED chips 20. Furthermore, a strip-shaped boss 13 can be provided between any two adjacent pairs of die-bonding areas 14.

[0075] In this embodiment, as Figure 5a As shown, the cross-sectional width of the strip-shaped boss 13 can be less than or equal to the gap width between adjacent circuit layers. For example... Figure 5b As shown, the upper width of the cross-section of the strip boss 13 can also be greater than the gap width between adjacent circuit layers, and presses onto the upper surface of the adjacent circuit layers respectively.

[0076] In this embodiment, as Figure 3 and Figure 8 As shown, the distance between the end of the strip protrusion 13 and the inner wall of the enclosure 12 is d, where 0μm < d ≤ 100μm, and can be, for example, 5μm, 15μm, 25μm, 35μm, 45μm, 55μm, 65μm, 75μm, 85μm, 95μm, etc.

[0077] like Figure 3 As shown, the end face of the strip-shaped protrusion 13 facing the inner wall of the enclosure 12 can be configured as a ramp 134, forming an approximately V-shaped notch 136 with the inner wall of the enclosure 12. The V-shaped notch 135 allows the end of the strip-shaped protrusion 13 to be spaced apart from the inner wall of the enclosure 12, while also ensuring that the root of the end of the strip-shaped protrusion 13 has some contact with the root of the inner wall of the enclosure 12, thus guaranteeing structural strength. The widest dimension of the V-shaped notch 136 can be used as an indicator of the distance between the end of the strip-shaped protrusion 13 and the inner wall of the enclosure 12.

[0078] like Figure 8 As shown, the end face of the strip-shaped protrusion 13 facing the inner wall of the enclosure 12 can be set as a vertical surface 135, and the sloping surface 134 forms an approximately rectangular or inverted trapezoidal notch 136 with the inner wall of the enclosure 12. The dimension of the widest part of the approximately rectangular or inverted trapezoidal notch 135 can be used as an indicator to measure the distance between the end of the strip-shaped protrusion 13 and the inner wall of the enclosure 12.

[0079] In this embodiment, as shown in FIG5, the height of the strip-shaped protrusion 13 can be set to be lower than the height of the enclosure 12, so that the subsequent encapsulating adhesive layer 30 can also completely cover the strip-shaped protrusion 13, thereby reducing the possibility of moisture and air entering the cup structure. Preferably, the height of the strip-shaped protrusion 13 can be set to not exceed 1 / 2 of the height of the enclosure 12.

[0080] In this embodiment, as Figure 10 As shown, after the LED chip 20 is installed in the die bonding area 14, the height of the strip boss 13 can be set to be lower than the height of the LED chip 20.

[0081] In this embodiment, as Figure 5b As shown, the two side walls of the strip boss 13 along its extension direction can be set as vertical surfaces.

[0082] In this embodiment, as Figure 5a As shown, the two side walls of the strip-shaped boss 13 along its extension direction can also be set as inclined surfaces, that is, in the case of... Figure 5aIn the cross-sectional shape of the strip-shaped protrusion 13 shown, the upper width is smaller than the lower width. As can be seen from the aforementioned scheme, the strip-shaped protrusion 13 is disposed between adjacent die-bonding regions 14. Light emitted from the side of the LED chip 20 disposed on the die-bonding region 14 is further focused when it reaches the inclined surfaces of the two side walls of the strip-shaped protrusion 13 along its extension direction, thus improving light concentration. Furthermore, concave surfaces can be provided on the inclined surfaces of the two side walls of the strip-shaped protrusion 13 along its extension direction to form a concave mirror effect, which can further improve light concentration and brightness.

[0083] In this embodiment, the inner sidewall of the enclosure 12 of the bowl-cup substrate 1 can be configured as a vertical surface. For example... Figure 5a As shown, the inner wall or part of the inner wall of the enclosure 12 of the cup substrate 1 can also be set as a slope to further improve light concentration and brightness.

[0084] like Figure 9 and Figure 10 As shown, this embodiment also provides an LED package 100, which includes the LED bracket 10 in this embodiment; it also includes an LED chip 20 and an encapsulating adhesive layer 30. The LED chip 20 is disposed on the die-bonding region 14 of the substrate 11 of the LED bracket 10, and the encapsulating adhesive layer 30 is filled in the cup structure formed by the enclosure 12 of the LED bracket 10 and the substrate 11.

[0085] It should be noted that a die bonding area 14 can be designed to bond only one LED chip 20, or it can be designed to bond multiple LED chips 20.

[0086] In the structure of the LED package 100, the strip-shaped protrusion 13 increases the contact area between the encapsulating adhesive layer 30 and the cup substrate 1, which also helps to improve the adhesion effect between the encapsulating adhesive layer 30 and the cup substrate 1, thereby enhancing the stability of the sealing structure.

[0087] like Figure 11 As shown, this embodiment also provides a light-emitting device, including at least one LED package 100 provided in this embodiment, and a circuit board 200, wherein the LED package 100 is disposed on the circuit board 200.

[0088] Example 2

[0089] like Figures 12-14 As shown, this embodiment also provides an LED bracket 10. The difference between the LED bracket 10 provided in Embodiment 1 is that in the LED bracket 10 of this embodiment, the strip protrusion 13 includes a plurality of first strip protrusions 131, while in the LED bracket 10 of Embodiment 1, there is only one strip protrusion 13.

[0090] In this embodiment, as Figure 12 , Figure 13 and Figure 14 As shown, multiple first strip-shaped protrusions 131 are arranged in parallel. For the elongated LED bracket 10, by setting multiple parallel first strip-shaped protrusions 131 spaced at predetermined intervals, the stability of the structure can be increased, and multiple die-bonding regions 14 can be separated.

[0091] like Figure 15 and Figure 16 As shown, this embodiment also provides an LED package 100, which includes the LED bracket 10 in this embodiment; it also includes an LED chip 20 and an encapsulating adhesive layer 30. The LED chip 20 is disposed on each die-bonding region 14 of the substrate 11 of the LED bracket 10, and the encapsulating adhesive layer 30 is filled in the cup structure formed by the enclosure 12 of the LED bracket 10 and the substrate 11.

[0092] Example 3

[0093] like Figures 17-18 As shown, this embodiment also provides an LED bracket 10. The difference between the LED bracket 10 provided in Embodiment 2 is that in the LED bracket 10 of this embodiment, the strip protrusion 13 includes a first strip protrusion 131 and a second strip protrusion 132, while the LED bracket 10 of Embodiment 2 only includes the first strip protrusion 131.

[0094] In this embodiment, as Figure 17 and Figure 18 As shown, the first strip-shaped protrusion 131 extends along a first direction, and the second strip-shaped protrusion 132 extends along a second direction, with the first and second directions perpendicular to each other. For LED brackets 10 whose dimensions extend along both the first and second directions, such as square, rectangular, or circular LED brackets 10, the perpendicular intersection of the first strip-shaped protrusion 131 and the second strip-shaped protrusion 132 forms a grid structure, which can increase the stability of the LED bracket structure and also separate multiple die-bonding areas 14.

[0095] In this embodiment, as Figure 20 and Figure 21 As shown, at the intersection of the first strip boss 131 and the second strip boss 132, either the first strip boss 131 or the second strip boss 132 can be disconnected so that the first strip boss 131 and the second strip boss 132 do not contact each other at the intersection point. This avoids the problem of stress concentration at the intersection of the first strip boss 131 and the second strip boss 132.

[0096] In this embodiment, as Figure 22 and Figure 23As shown, at the intersection of the first strip boss 131 and the second strip boss 132, both the first strip boss 131 and the second strip boss 132 can be disconnected, so that the first strip boss 131 and the second strip boss 132 form a gap 133 at the intersection point. This can also avoid the problem of stress concentration at the intersection of the first strip boss 131 and the second strip boss 132.

[0097] like Figure 19 As shown, this embodiment also provides an LED package 100, which includes the LED bracket 10 in this embodiment; it also includes an LED chip 20 and an encapsulating adhesive layer 30. The LED chip 20 is disposed on each die-bonding region 14 of the substrate 11 of the LED bracket 10, and the encapsulating adhesive layer 30 is filled in the cup structure formed by the enclosure 12 of the LED bracket 10 and the substrate 11.

[0098] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An LED bracket, characterized in that, The LED bracket (10) includes a bowl-shaped substrate (1); The bowl-shaped substrate (1) includes a base (11), a barrier (12), and a strip-shaped boss (13); the upper surface of the base (11) is provided with a plurality of spaced die-bonding regions (14). The enclosure (12) surrounds the edge of the base (11) and together with the base (11) forms a bowl-shaped structure; The strip-shaped protrusion (13) is provided on the upper surface of the substrate (11), located between adjacent die-bonding regions (14), and protrudes from the upper surface of the substrate (11); The two ends of the strip-shaped protrusion (13) extend toward the inner wall of the enclosure (12), and the ends of the strip-shaped protrusion (13) are spaced apart from the inner wall of the enclosure (12). The strip-shaped protrusion (13) includes a first strip-shaped protrusion (131) and a second strip-shaped protrusion (132) that intersect each other; the first strip-shaped protrusion (131) extends along a first direction, and the second strip-shaped protrusion (132) extends along a second direction, wherein the first direction is perpendicular to the second direction; At the intersection of the first strip protrusion (131) and the second strip protrusion (132), the first strip protrusion (131) or the second strip protrusion (132) is disconnected so that the first strip protrusion (131) and the second strip protrusion (132) do not contact each other at the intersection point; Alternatively, at the intersection of the first strip protrusion (131) and the second strip protrusion (132), both the first strip protrusion (131) and the second strip protrusion (132) are disconnected, so that the first strip protrusion (131) and the second strip protrusion (132) form a gap (133) at the intersection point.

2. The LED bracket according to claim 1, characterized in that, The distance between the end of the strip protrusion (13) and the inner wall of the enclosure (12) is d, where 0μm < d ≤ 100μm.

3. The LED bracket according to claim 2, characterized in that, The end face of the strip protrusion (13) facing the inner wall of the enclosure (12) is set as a sloping surface (134) or a vertical surface (135).

4. The LED bracket according to claim 1, characterized in that, The height of the strip-shaped protrusion (13) is lower than the height of the enclosure (12).

5. The LED bracket according to claim 4, characterized in that, After the LED chip (20) is installed in the die bonding area (14), the height of the strip boss (13) is lower than the height of the LED chip (20).

6. The LED bracket according to claim 1, characterized in that, The two side walls or part of the side walls of the strip boss (13) along its extension direction are set as inclined or vertical surfaces.

7. The LED bracket according to claim 1, characterized in that, The inner wall or part of the inner wall of the enclosure (12) of the bowl-cup substrate (1) is set as a slope or a vertical surface.

8. The LED bracket according to claim 1, characterized in that, The LED bracket (10) includes a first circuit layer (2) and a second circuit layer (3); The first circuit layer (2) is disposed on the surface of the die-bonding region (14); The second circuit layer (3) is disposed in the substrate (11) and led out from the bottom or side surface, and the second circuit layer (3) is electrically connected to the first circuit layer (2).

9. The LED bracket according to any one of claims 1-8, characterized in that, The strip boss (13) includes at least one first strip boss (131). When the number of the first strip protrusions (131) is greater than or equal to two, the multiple first strip protrusions (131) are arranged in parallel.

10. An LED package, characterized in that, The LED package (100) includes the LED bracket (10) as described in any one of claims 1-9; and further includes: LED chip (20) is disposed on die bonding region (14) of substrate (11) of LED bracket (10); An encapsulating adhesive layer (30) is filled in the cup structure formed by the enclosure (12) of the LED bracket (10) and the substrate (11).

11. A light-emitting device, characterized in that, It includes at least one LED package as described in claim 10, and also includes a circuit board (200) on which the LED package is disposed.

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