A copper polishing device for protecting the welding point of a circular induction synchronizer

Abstract

The present invention discloses a circular induction synchronizer solder joint protection copper polishing device, which relates to the technical field of circular induction synchronizers and includes a lifting mechanism and a polishing mechanism. The lifting mechanism is provided with a polishing mechanism, and the lifting mechanism is used to drive the polishing mechanism to lift and lower. The polishing mechanism includes a driving assembly, an inner circle polishing assembly, an outer circle polishing assembly, a gap polishing assembly, and a solder joint protection cover. The driving assembly is provided on the lifting mechanism, and the driving assembly is used to drive the inner circle polishing assembly, the outer circle polishing assembly, and the gap polishing assembly to move synchronously. By providing a solder joint protection cover, the present invention ensures that the circular induction synchronizer effectively protects the solder joints during the polishing process, thereby avoiding damage to the solder joints during the polishing process. In the polishing mechanism of the present invention, through the coordinated action of the gap polishing block, the outer circle polishing block, and the inner circle polishing block, the full coverage of the synchronizer copper surface polishing is achieved, thereby ensuring the polishing quality of the entire copper surface.

Description

Technical Field

[0001] The invention relates to the technical field of circular induction synchronizers, and in particular to a circular induction synchronizer solder joint protection copper polishing device. Background Art

[0002] Circular induction synchronizers are angular displacement sensors with a range of advantages, including resistance to harsh environments, high measurement accuracy, long life, low cost, easy installation, fast operation, and stability and reliability. Consequently, they are widely used in aerospace, machinery manufacturing, precision instruments, and metrology. However, polishing circular induction synchronizers in existing technologies typically relies on manual labor, resulting in a low degree of automation. Furthermore, the polishing process can easily scratch and damage solder joints. Summary of the Invention

[0003] In response to the above technical problems, the technical solution adopted by the present invention is: a circular induction synchronizer solder point protection copper skin polishing device, including a lifting mechanism and a polishing mechanism, the lifting mechanism is provided with a polishing mechanism, the lifting mechanism is used to drive the polishing mechanism to lift and lower; the polishing mechanism includes a driving assembly, an inner circle polishing assembly, an outer circle polishing assembly, a gap polishing assembly and a solder point protection cover, the driving assembly is provided on the lifting mechanism, the driving assembly is used to drive the inner circle polishing assembly, the outer circle polishing assembly and the gap polishing assembly to move synchronously, the solder point protection cover is used to block the solder points on the edge of the copper skin of the circular induction synchronizer, the inner circle polishing assembly, the outer circle polishing assembly and the gap polishing assembly are used to polish the part of the synchronizer copper skin that is not blocked by the solder point protection cover.

[0004] Furthermore, the driving assembly includes a driving motor, a driving plate is fixedly mounted on the output shaft of the driving motor, a circular hole is provided at the first end of the driving plate, and a linear slide groove is provided at the second end of the driving plate.

[0005] Furthermore, the inner circle polishing assembly includes an inner circle track plate, which is provided with a vortex line groove, and an inner circle smooth rod is slidably installed inside the vortex line groove of the inner circle track plate. The inner circle smooth rod is vertically arranged, and the inner circle smooth rod is also slidably installed in the linear groove of the driving plate, and the bottom end of the inner circle smooth rod is fixedly installed with an inner circle polishing block.

[0006] Furthermore, the outer circle polishing assembly includes an outer circle smooth rod, which is fixedly mounted on the circular hole of the driving plate. The outer circle smooth rod is vertically arranged, and an outer circle polishing block is fixedly mounted on the bottom end of the outer circle smooth rod.

[0007] Furthermore, the gap polishing assembly includes a gap track plate, which is evenly distributed with a plurality of linear slide grooves, and a gap slide rod is slidably installed in each linear slide groove of the gap track plate, and the gap slide rod is vertically arranged, and a gap polishing block is fixedly installed at the bottom end of the gap slide rod, and the gap slide rod is also fixedly installed on the triangular block, and the triangular block is in contact with the driving plate, and the triangular block is slidably installed on the limit rod, and the limit rod is fixedly installed on the fixed ring, and the triangular block and the fixed ring are connected by a spring.

[0008] Furthermore, 16 solder point protection blocks are evenly distributed on the solder point protection cover, and each solder point protection block is provided with a square groove.

[0009] Furthermore, the welding point protection cover is made of SFB-1 polytetrafluoroethylene material.

[0010] Furthermore, 16 linear slide grooves are evenly distributed on the slot track plate.

[0011] Furthermore, the shape of the gap polishing block is the same as the shape of the synchronizer copper skin that is not blocked between the two solder joint protection blocks.

[0012] The beneficial effects of the present invention compared with the prior art are as follows: (1) the present invention ensures effective protection of the solder joints of the circular induction synchronizer during the polishing process by providing a solder joint protection cover, thereby avoiding possible damage to the solder joints during the polishing process; (2) the polishing mechanism of the present invention achieves comprehensive coverage of the synchronizer copper surface through the coordinated action of the gap polishing block, the outer circle polishing block and the inner circle polishing block, thereby ensuring the polishing quality of the entire copper surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0014] Figure 2 It is a structural schematic diagram of the lifting mechanism of the present invention.

[0015] Figure 3 It is a schematic structural diagram of the polishing mechanism of the present invention.

[0016] Figure 4 It is a schematic diagram of the partial structure of the polishing mechanism of the present invention.

[0017] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.

[0018] Figure 6 This is a schematic diagram of the installation relationship between the welding point protection cover and the circular induction synchronizer of the present invention.

[0019] Figure 7 for Figure 6Cross-sectional view along the BB direction.

[0020] Figure 8 for Figure 7 A partial enlarged view of point C in the middle.

[0021] Figure markings: 101-base plate; 102-vertical plate; 103-horizontal plate; 104-lifting motor; 105-lifting screw; 106-lifting plate; 107-fixed plate; 108-limiting ring; 201-driving motor; 202-inner circle track plate; 203-driving plate; 204-fixed ring; 205-connecting rod; 206-slit track plate; 207-connecting plate; 208-inner circle smooth rod; 209-inner circle polishing block; 210-retaining ring; 211-outer circle smooth rod; 212-outer circle polishing block; 213-triangular block; 214-limiting rod; 215-spring; 216-slit slide rod; 217-slit polishing block; 218-soldering point protection cover; 301-synchronizer soldering point; 302-synchronizer copper sheet; 303-synchronizer substrate. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Example: Figures 1-8 The copper polishing device for protecting the welding point of a circular induction synchronizer shown in the figure comprises a lifting mechanism and a polishing mechanism. The polishing mechanism is provided on the lifting mechanism, and the lifting mechanism is used to drive the polishing mechanism to rise and fall.

[0024] The circular induction synchronizer includes synchronizer solder points 301 , synchronizer copper sheets 302 and a synchronizer substrate 303 . The synchronizer copper sheets 302 are provided on the synchronizer substrate 303 , and 16 synchronizer solder points 301 are evenly distributed on the synchronizer copper sheets 302 .

[0025] The lifting mechanism includes a base plate 101, a vertical plate 102, a horizontal plate 103, a lifting motor 104, a lifting screw 105, a lifting plate 106, a fixed plate 107 and a limit ring 108. The limit ring 108 is fixedly installed on the base plate 101. The base plate 101 is also fixedly installed with a vertically arranged vertical plate 102. The vertical plate 102 is fixedly installed with a horizontally arranged horizontal plate 103. The horizontal plate 103 is fixedly installed with a vertically arranged lifting motor 104. The output shaft of the lifting motor 104 and the lifting screw 105 are fixedly installed. The lifting screw 105 is vertically arranged. The lifting screw 105 is rotatably installed on the base plate 101. The lifting screw 105 and the lifting plate 106 are threadedly installed. The end of the lifting plate 106 is fixedly installed with a fixed plate 107, and the fixed plate 107 is coaxially arranged with the limit ring 108.

[0026] The polishing mechanism includes a drive assembly, an inner circle polishing assembly, an outer circle polishing assembly, a gap polishing assembly and a solder joint protection cover 218. The drive assembly is arranged on the lifting mechanism. The drive assembly is used to drive the inner circle polishing assembly, the outer circle polishing assembly and the gap polishing assembly to move synchronously. The solder joint protection cover 218 is used to cover the solder joints on the edge of the copper skin of the circular induction synchronizer. The inner circle polishing assembly, the outer circle polishing assembly and the gap polishing assembly are used to polish the parts of the synchronizer copper skin that are not covered by the solder joint protection cover 218.

[0027] The solder joint protection cover 218 is made of SFB-1 polytetrafluoroethylene material, with an outer diameter of Φ117mm, an inner hole of Φ111mm, a height of 9mm, 16 solder joint protection blocks evenly distributed, and the edges are blunted and burred.

[0028] The driving assembly includes a driving motor 201 and a driving plate 203. The driving motor 201 is fixedly mounted on the fixed plate 107. The driving plate 203 is fixedly mounted on the output shaft of the driving motor 201. The driving plate 203 is horizontally arranged. A circular hole is provided on one side of the driving plate 203, and a linear slide groove is provided on the other side of the driving plate 203.

[0029] The inner circle polishing assembly includes an inner circle track plate 202, an inner circle smooth rod 208, an inner circle polishing block 209 and a retaining ring 210. A vertical rod is vertically arranged on the inner circle track plate 202. The vertical rod on the inner circle track plate 202 is fixedly installed on the fixed plate 107. A vortex line groove is provided on the inner circle track plate 202. The inner circle smooth rod 208 is slidably installed inside the vortex line groove of the inner circle track plate 202. The inner circle smooth rod 208 is vertically arranged. The inner circle smooth rod 208 is also slidably installed in the linear groove of the drive plate 203. Two retaining rings 210 are fixedly installed on the inner circle smooth rod 208. The first retaining ring 210 is in contact with the upper surface of the inner circle track plate 202, and the second retaining ring 210 is in contact with the lower surface of the drive plate 203. The bottom end of the inner circle smooth rod 208 is fixedly installed with an inner circle polishing block 209.

[0030] The outer circle polishing assembly includes an outer circle smooth rod 211 and an outer circle polishing block 212 . The outer circle smooth rod 211 is fixedly mounted on the circular hole of the driving plate 203 . The outer circle smooth rod 211 is vertically arranged. The outer circle polishing block 212 is fixedly mounted on the bottom end of the outer circle smooth rod 211 .

[0031] The gap polishing assembly includes a fixing ring 204, a connecting rod 205, a gap track plate 206, a connecting plate 207, a triangular block 213, a limiting rod 214, a spring 215, a gap slide 216 and a gap polishing block 217. The connecting rod 205 is fixedly mounted on the fixing plate 107. The gap track plate 206 is fixedly mounted on the connecting rod 205. The connecting plate 207 is also fixedly mounted on the connecting rod 205. The connecting plate 207 and the welding point protection cover 218 are fixedly mounted. There are 16 linear slides evenly distributed on the gap track plate 206. A gap slide 216 is slidably mounted in each linear slide of the gap track plate 206. The gap slide 216 The gap polishing block 217 is fixedly installed on the bottom end of the gap slide bar 216, and the gap slide bar 216 is also fixedly installed on the triangular block 213. The triangular block 213 is in contact with the driving plate 203. The upper surface of the triangular block 213 is provided with a vertically arranged sliding plate. The sliding plate on the triangular block 213 is slidably installed on the limit rod 214. The limit rod 214 is fixedly installed on the fixing ring 204. The fixing ring 204 is fixedly installed on the fixing plate 107. A spring 215 is sleeved on the limit rod 214. One end of the spring 215 is fixedly installed on the sliding plate of the triangular block 213, and the second end of the spring 215 is fixedly installed on the fixing ring 204.

[0032] There are 16 solder point protection blocks evenly distributed on the solder point protection cover 218, and each solder point protection block is provided with a square groove.

[0033] The shape of the gap polishing block 217 is the same as the shape of the synchronizer copper skin that is not blocked between the two solder joint protection blocks.

[0034] The working principle of the present invention is as follows: first, the circular induction synchronizer is placed on the limiting ring 108, the synchronizer welding point 301 on the circular induction synchronizer is aligned with the square groove of the welding point protection cover 218, and then placed on the base plate 101, and the circular induction synchronizer is limited by the limiting ring 108.

[0035] Then start the lifting motor 104, which drives the lifting screw 105 to rotate, and the lifting screw 105 drives the lifting plate 106 and the fixed plate 107 to descend, and the fixed plate 107 drives the polishing mechanism to descend, so that the solder joint protection cover 218 in the polishing mechanism is placed on the circular induction synchronizer, and the 16 evenly distributed solder joint protection blocks of the solder joint protection cover 218 are aligned with the solder joints on the edge of the circular induction synchronizer copper skin to cover them; after confirming that the alignment is correct, use the polishing mechanism to polish the surface of the exposed synchronizer copper skin 302 except the solder joint protection blocks.

[0036] During polishing, the drive motor 201 is started, and the drive motor 201 drives the drive plate 203 to rotate. One side of the drive plate 203 drives the outer circular sliding rod 211 and the outer circular polishing block 212 to perform circular motion, and the outer circular part of the synchronizer copper skin 302 is polished by the outer circular polishing block 212.

[0037] As the driving plate 203 rotates, the linear groove on one side of the driving plate 203 drives the inner smooth rod 208 to slide in the linear groove of the driving plate 203. At the same time, the inner smooth rod 208 also slides in the spiral groove of the inner circular track plate 202, thereby polishing the inner circular part of the synchronizer copper skin 302 through the inner circular polishing block 209 on the inner circular smooth rod 208.

[0038] When the end of the driving plate 203 rotates to contact the triangular block 213, the driving plate 203 drives the gap slide 216 to slide in the linear groove of the gap track plate 206 through the triangular block 213, and the sliding plate on the triangular block 213 slides on the limit rod 214, stretching the spring 215, and the gap slide 216 drives the gap polishing block 217 to polish the synchronizer copper skin 302 that is not blocked between the two solder joint protection blocks.

Claims

1. A circular induction synchronizer solder joint protection copper polishing device, comprising a lifting mechanism and a polishing mechanism, characterized in that: The lifting mechanism is provided with a polishing mechanism, and the lifting mechanism is used to drive the polishing mechanism to move up and down; The polishing mechanism comprises a driving assembly, an inner circle polishing assembly, an outer circle polishing assembly, a gap polishing assembly and a soldering point protection cover (218); the driving assembly is arranged on the lifting mechanism, the driving assembly is used to drive the inner circle polishing assembly, the outer circle polishing assembly and the gap polishing assembly to move synchronously, the soldering point protection cover (218) is used to shield the soldering points on the edge of the copper sheet of the circular induction synchronizer, and the inner circle polishing assembly, the outer circle polishing assembly and the gap polishing assembly are used to polish the portion of the synchronizer copper sheet that is not shielded by the soldering point protection cover (218); The driving assembly comprises a driving motor (201), a driving plate (203) is fixedly mounted on an output shaft of the driving motor (201), a circular hole is provided at a first end of the driving plate (203), and a linear slide is provided at a second end of the driving plate (203); The inner circle polishing assembly includes an inner circle track plate (202), a vortex line slide groove is provided on the inner circle track plate (202), an inner circle smooth rod (208) is slidably installed inside the vortex line slide groove of the inner circle track plate (202), the inner circle smooth rod (208) is vertically arranged, and the inner circle smooth rod (208) is also slidably installed in the linear slide groove of the driving plate (203), and the bottom end of the inner circle smooth rod (208) is fixedly installed with an inner circle polishing block (209); The outer circle polishing assembly comprises an outer circle smooth rod (211), the outer circle smooth rod (211) is fixedly mounted on the circular hole of the driving plate (203), the outer circle smooth rod (211) is vertically arranged, and an outer circle polishing block (212) is fixedly mounted on the bottom end of the outer circle smooth rod (211); The gap polishing assembly includes a gap track plate (206), a plurality of linear slide grooves are evenly distributed on the gap track plate (206), and a gap slide bar (216) is slidably installed in each linear slide groove of the gap track plate (206), the gap slide bar (216) is vertically arranged, and a gap polishing block (217) is fixedly installed at the bottom end of the gap slide bar (216), and the gap slide bar (216) is also fixedly installed on the triangular block (213), and the triangular block (213) and the driving plate (203) are in contact and fit, and the triangular block (213) is slidably installed on the limiting rod (214), and the limiting rod (214) is fixedly installed on the fixing ring (204), and the triangular block (213) and the fixing ring (204) are connected by a spring (215).

2. A circular induction synchronizer solder joint protection copper polishing device as claimed in claim 1, characterized in that: The soldering point protection cover (218) is evenly distributed with 16 soldering point protection blocks, and each soldering point protection block is provided with a square groove.

3. A circular induction synchronizer solder joint protection copper polishing device as claimed in claim 1, characterized in that: The welding point protection cover (218) is made of SFB-1 polytetrafluoroethylene material.

4. A circular induction synchronizer solder joint protection copper polishing device as claimed in claim 1, characterized in that: Sixteen linear slide grooves are evenly distributed on the gap track plate (206).

5. A circular induction synchronizer solder joint protection copper polishing device as claimed in claim 1, characterized in that: The shape of the gap polishing block (217) is the same as the shape of the synchronizer copper skin that is not blocked between the two soldering point protection blocks.

Images