A heat sink and a rectifier-inverter device

Abstract

The application provides a radiator and a rectifier inverter device, and relates to the technical field of electronic products.The radiator comprises a substrate and a first radiating fin group.The substrate has opposite first and second sides.The first side is connected with a heat generating device.The first radiating fin group has a plurality of first radiating fins.The first radiating fins are connected with the second side of the substrate.The substrate comprises at least a first substrate and a second substrate.The first side comprises a first substrate first side and a second substrate first side.The second side comprises a first substrate second side and a second substrate second side.The first substrate first side and the second substrate first side are respectively connected with different heat generating devices.The first radiating fin group is respectively connected with the first substrate second side and the second substrate second side.The first radiating fin group can conduct the heat of the first substrate and the second substrate.Through the design of the structure, the heat can be avoided from being concentrated, the heat transfer path can be shortened, and the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the field of electronic product technology, and in particular to a heat sink and a rectifier-inverter device. Background Technology

[0002] A heat sink is a component used to help heat-generating devices dissipate heat in a timely manner, preventing the devices from overheating and being damaged. Heat sinks are divided into active cooling and passive cooling, and there are also combinations of active and passive cooling. Active cooling is exemplified by air-cooled heat sinks, while passive cooling is exemplified by heat sink fins.

[0003] Currently, each heat-generating device has its own heat sink, which requires a large amount of space and results in low space utilization. In order to save space, the heat-generating devices on the substrate of the heat sink are placed too centrally, resulting in a long heat transfer path and poor heat dissipation effect, and low heat dissipation efficiency of the heat sink. Summary of the Invention

[0004] This invention provides a heat sink and a rectifier-inverter device to solve the technical problem of how to improve heat dissipation efficiency while increasing the space utilization of the heat sink.

[0005] This invention provides a heat sink, comprising: a substrate having a first side and a second side opposite to each other, the first side being connected to a heat-generating device; and a first heat sink assembly having a plurality of first heat sinks connected to the second side of the substrate; wherein the substrate includes at least a first substrate and a second substrate, the first side including a first side of the first substrate and a first side of the second substrate, the second side including a second side of the first substrate and a second side of the second substrate, the first side of the first substrate and the first side of the second substrate being respectively connected to different heat-generating devices, and the first heat sink assembly being respectively connected to the second side of the first substrate and the second side of the second substrate, the first heat sink assembly being capable of dissipating heat from the first substrate and the second substrate.

[0006] Furthermore, the first substrate is connected to the second substrate, the first side of the first substrate and the first side of the second substrate form a first preset angle, a portion of the first heat sink is connected to the first substrate, and the remaining first heat sink is connected to the second substrate.

[0007] Furthermore, the plurality of first heat sinks in the first heat sink group are spaced apart, and the first heat sink has a first end and a second end in the extension direction. The first end is connected to the first substrate or the second substrate, and the second end extends in a direction away from the first substrate and the second substrate. The extension direction of the first heat sink forms a second preset angle with the second side of the first substrate.

[0008] Furthermore, the heat sink also includes a centralized heat-conducting part and a second heat sink assembly. The centralized heat-conducting part is connected to the second side of the first substrate and the second side of the second substrate, respectively. The second heat sink assembly includes a plurality of second heat sinks, and the second heat sinks are connected to the centralized heat-conducting part.

[0009] Furthermore, the extension direction of the second heat sink is parallel to the extension direction of the first heat sink, and the extension direction of the second heat sink is perpendicular to the first connecting surface, which is the plane formed by the connection position of the second heat sink and the concentrated heat conduction part.

[0010] Furthermore, the second end of the first heat sink extends away from the first substrate and the second substrate, and the second end of the first heat sink is flush with the end face of the first substrate or the end face of the second substrate.

[0011] This invention also provides a rectifier-inverter device, comprising: the aforementioned heat sink; an inverter board having an inverter power transistor connected to the first substrate; and a rectifier board having a rectifier power transistor connected to the second substrate.

[0012] Furthermore, the inverter board and the rectifier board are arranged at intervals in the vertical direction, and the heat sink is located between the inverter board and the rectifier board; wherein, the first substrate and the second substrate are connected, the extension direction of the first substrate is parallel to the extension direction of the inverter board, and the extension direction of the second substrate is perpendicular to the extension direction of the inverter board.

[0013] Furthermore, there are multiple heat sinks, which are spaced apart along the length of the rectifier plate. The length is perpendicular to the plane of the first side of the second substrate. Both the inverter plate and the rectifier plate are connected to multiple sets of bus capacitors. The bus capacitors are located between the inverter plate and the rectifier plate, and each set of bus capacitors is close to one of the heat sinks.

[0014] Furthermore, the rectifier power transistor includes an AC-mode power device and a battery-mode power device, wherein the AC-mode power device and the battery-mode power device are connected to the second substrate of the same heat sink; or, the AC-mode power device and the battery-mode power device are respectively connected to the second substrate of different heat sinks.

[0015] This invention provides a heat sink and a rectifier-inverter device. The heat sink includes a substrate and a first heat sink assembly. The substrate has a first side and a second side facing each other. The first heat sink assembly has a plurality of first heat sinks. The first side is connected to a heat-generating device, thereby conducting the heat generated by the heat-generating device to the substrate. The second side is connected to the first heat sinks, allowing the heat introduced into the substrate to be quickly dissipated through the first heat sinks. The arrangement of the two sides effectively shortens the heat conduction path of the substrate, improves the heat dissipation efficiency, and also increases the contact area between the first heat sink and the air. This avoids the situation where some air does not come into contact with the heat sink due to the heat-generating device and the first heat sink being arranged on the same side, thus preventing air leakage and reducing the heat dissipation efficiency. Furthermore, the substrate includes at least a first substrate and a second substrate. The first side includes a first side of the first substrate and a first side of the second substrate, and the second side includes a second side of the first substrate and a second side of the second substrate. By connecting the first side of the first substrate and the first side of the second substrate to different heat-generating devices, and connecting the first heat sink group to the second side of the first substrate and the second side of the second substrate respectively, the problem of excessive heat concentration and low heat dissipation efficiency caused by concentrating multiple heat-generating devices on the same substrate surface can be effectively avoided. At the same time, the multiple parts of the substrate are connected to the same set of heat sinks, which improves the utilization rate of the heat sink, saves the space occupied by the heat sink, and also improves the heat dissipation efficiency of the heat sink. Attached Figure Description

[0016] Figure 1 A schematic diagram of a heat sink provided for implementation of the present invention;

[0017] Figure 2 A schematic diagram of the heat sink from another perspective provided for the implementation of the present invention;

[0018] Figure 3 A schematic diagram of another heat sink provided for the implementation of the present invention;

[0019] Figure 4 A schematic diagram of another heat sink provided for the implementation of the present invention;

[0020] Figure 5 A schematic diagram of another heat sink provided for the implementation of the present invention;

[0021] Figure 6 A schematic diagram showing the connection between the heat sink, the inverter power transistor, and the rectifier power transistor for the purpose of implementing the present invention;

[0022] Figure 7 A schematic diagram of the structure of a rectifier-inverter device provided for the implementation of this invention;

[0023] Figure 8 An exploded structural diagram of a rectifier-inverter device provided for the implementation of this invention;

[0024] Explanation of reference numerals in the attached figures

[0025] 10. Rectifier-inverter device; 100. Heat sink; 110. Substrate; 111. First side; 1111. First side of first substrate; 1112. Second side of first substrate; 112. Second side; 1121. First side of second substrate; 1122. Second side of second substrate; 113. First substrate; 1131. End face of first substrate; 114. Second substrate; 1141. End face of second substrate; 120. First heat sink assembly; 121. First heat sink; 1211. First end; 1212. Second end; 130. Centralized heat conduction part; 131. First connecting surface; 140. Second heat sink assembly; 141. Second heat sink; 200. Heat-generating device; 300. Inverter board; 310. Inverter power transistor; 400. Rectifier board; 410. Rectifier power transistor; 500. Bus capacitor; α1. First preset angle; α2. Second preset angle. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0027] The specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction. For example, different combinations of specific technical features can form different embodiments and technical solutions. To avoid unnecessary repetition, the various possible combinations of the specific technical features in this invention will not be described separately.

[0028] In the following description, the terms "first," "second," etc., are used merely to distinguish different objects and do not indicate that the objects have the sameness or relationship. It should be understood that the directional descriptions "above," "below," "outside," and "inside" refer to the orientation under normal use conditions, while "left" and "right" refer to the left and right directions shown in the corresponding diagrams, which may or may not be the left and right directions under normal use conditions.

[0029] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. The term "connection," unless otherwise specified, includes both direct and indirect connections.

[0030] In specific embodiments, the heat sink is suitable for heat dissipation in any electronic product. For example, it is suitable for heat dissipation of the motherboard in an electronic product; for example, it is suitable for heat dissipation of an uninterruptible power supply (UPS); for example, it is also suitable for heat dissipation of the power supply in a dual-circuit or dual-switch electrical product. For ease of explanation, the following description uses the application of the heat sink to uninterruptible power supply heat dissipation as an example.

[0031] Currently, most heat dissipation methods involve separate heat dissipation designs for each functional heat-generating component, meaning that the heat dissipation path for each component is independent. When some heat-generating components are not operating or are operating at low power, the utilization rate of the heat dissipation equipment is low, resulting in wasted resources. Furthermore, separate heat dissipation designs require significant space, potentially leading to wasted space utilization. Some structures, in an effort to save space, concentrate heat-generating components on the same substrate of the heat sink, which may cause excessive heat concentration and hinder timely heat dissipation. Additionally, the long heat transfer path results in poor heat dissipation. To address these issues, this application provides a heat sink to overcome these problems.

[0032] In some embodiments, such as Figures 1 to 5 As shown, the heat sink 100 includes a substrate 110 and a first heat sink assembly 120. The substrate 110 has a first side 111 and a second side 112 opposite to each other. The first side 111 is connected to the heat-generating device 200. The first heat sink assembly 120 has a plurality of first heat sinks 121, and the first heat sinks 121 are connected to the second side 112 of the substrate 110.

[0033] First, the heat sink 100 is a structure used to dissipate heat from the heat-generating device 200. The heat-generating device 200 includes power devices of various functions, such as rectifier power transistors of rectifier power devices, inverter power transistors of inverter power devices, etc. The specific types are not limited, and any power device that needs to be dissipated is acceptable.

[0034] The heat sink 100 itself includes a substrate 110, which is used to fix the heat-generating device 200 and achieve heat conduction. The heat-generating device 200 is fixedly connected to the substrate 110. The specific connection method can be determined according to the actual situation. For example, the heat-generating device 200 is bonded to the substrate 110. The heat generated by the heat-generating device 200 is transferred to the substrate 110 and then transferred from the substrate 110 to the heat sink for heat dissipation.

[0035] In order to shorten the heat transfer path of the substrate 110 and accelerate the heat dissipation efficiency, the substrate 110 has a first side 111 and a second side 112 opposite to each other in the thickness direction. The first side 111 is connected to the heat-generating device 200; the second side 112 is connected to the first heat sink 121. The heat generated by the heat-generating device 200 only needs to pass through the thickness of the substrate 110 to be dissipated through the first heat sink 121, which greatly reduces the heat transfer path.

[0036] To avoid excessive heat concentration and to distribute the heat-generating devices 200 as much as possible, the substrate 110 of the heat sink 100 may include multiple parts. The substrate 110 includes at least a first substrate 113 and a second substrate 114. The first side 111 includes the first side 1111 of the first substrate and the first side 1121 of the second substrate. The second side 112 includes the second side 1112 of the first substrate and the second side 1122 of the second substrate. The first side 1111 of the first substrate and the first side 1121 of the second substrate are respectively connected to different heat-generating devices 200. It should be noted that different heat-generating devices 200 include the same heat-generating component and different heat-generating components. Specifically, it can be understood that, firstly, the same heat-generating component has multiple heat-generating ends, and different heat-generating ends are connected to different substrates, that is, the first substrate 113 and the second substrate 114 together conduct heat for the same heat-generating component; secondly, two completely different heat-generating components are respectively connected to different substrates, that is, the first substrate 113 and the second substrate 114 conduct heat for different heat-generating components. The first heat sink assembly 120 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The first heat sink assembly 120 can conduct heat out of the first substrate 113 and the second substrate 114.

[0037] For example, the heat sink 100 has a cubic structure with 6 faces. The substrate 110 of the heat sink 100 includes two parts, namely a first substrate 113 and a second substrate 114. The first substrate 113 and the second substrate 114 occupy 2 of the 6 faces of the cube respectively. The first substrate 113 and the second substrate 114 can be arranged adjacently or oppositely, depending on the actual heat dissipation requirements.

[0038] For example, such as Figure 4As shown, a first substrate 113 and a second substrate 114 are arranged opposite to each other. The first substrate 113 has a first substrate first side 1111 and a first substrate second side 1112, and the second substrate 114 has a second substrate first side 1121 and a second substrate second side 1122. In this structure, the first substrate first side 1111 and the first substrate first side 1121 are arranged back to back. The first substrate first side 1111 and the first substrate first side 1121 are respectively connected to different heat-generating devices 200. The first substrate second side 1112 and the second substrate second side 1122 are arranged opposite to each other. One end of the first heat sink 121 is connected to the first substrate second side 1112, and the other end of the first heat sink 121 is connected to the second substrate second side 1122, so that the first heat sink 121 is simultaneously connected to the first substrate second side 1112 and the second substrate second side 1122. In this way, different heat-generating devices 200 transfer heat to the first heat sink 121 in the middle through the first substrate 113 and the second substrate 114 on both sides of the heat sink 100, and jointly use the same first heat sink 121 for heat dissipation.

[0039] For example, such as Figure 2 As shown, the first substrate 113 and the second substrate 114 are arranged adjacent to each other. The first substrate 113 has a first substrate first side 1111 and a first substrate second side 1112, and the second substrate 114 has a second substrate first side 1121 and a second substrate second side 1122. The first substrate 113 and the second substrate 114 are connected. In this structure, the first substrate first side 1111 and the second substrate first side 1121 form a first preset angle, defined as α1. For a cubic structure like the heat sink 100, the first preset angle α1 is 90 degrees. Depending on the structure, the first substrate... The first side 1111 of the first substrate and the first side 1121 of the second substrate form a first preset angle α1, which also varies accordingly. The first side 1111 of the first substrate and the first side 1121 of the second substrate are arranged adjacent to each other. The first side 1111 of the first substrate and the first side 1121 of the second substrate are respectively connected to different heat-generating devices 200. The second side 1112 of the first substrate and the second side 1122 of the second substrate are also arranged adjacent to each other. Considering the convenience of processing, some of the first heat sinks 121 can be connected to the second side 1112 of the first substrate, and the remaining first heat sinks 121 are connected to the second side 1122 of the second substrate. In this structure, the first heat sinks 121 connected to the first substrate 113 and the second substrate 114 are different. The heat-generating device 200 connected to the first substrate 113 mainly relies on the first heat sink 121 connected to the first substrate 113 for heat dissipation, while the heat-generating device 200 connected to the second substrate 114 mainly relies on the first heat sink 121 connected to the second substrate 114 for heat dissipation.

[0040] For example, such as Figure 5As shown, the heat sink 100 has a cubic structure with 6 faces. The base plate 110 of the heat sink 100 includes three parts: a first base plate 113, a second base plate 114, and a third base plate 115. The first base plate 113, the second base plate 114, and the third base plate 115 each occupy 3 of the 6 faces of the cube. The first base plate 113, the second base plate 114, and the third base plate 115 can be arranged in pairs or in sequence, depending on the actual heat dissipation requirements.

[0041] For example, the first substrate 113, the second substrate 114 and the third substrate 115 are adjacent to each other, and any two of the first heat sinks 121 in the heat sink 100 can be connected. The first heat sink 121 is connected to the first substrate 113 and the second substrate 114 respectively, the first heat sink 121 is connected to the second substrate 114 and the third substrate 115 respectively, and the first heat sink 121 is connected to the first substrate 113 and the third substrate 115 respectively.

[0042] For example, in order to achieve a good ventilation channel, the first substrate 113, the second substrate 114 and the third substrate 115 can be connected in sequence. Similarly, the first heat sink 121 can be connected to any one of the first substrate 113, the second substrate 114 and the third substrate 115, or any two of them.

[0043] It should be noted that, as Figure 2 As shown, the first heat sink group 120 has multiple first heat sinks 121 spaced apart, including uniform and non-uniform spacing. When the multiple first heat sinks 121 are spaced apart in parallel, the distance between two adjacent first heat sinks 121 is the tooth gap B, and the distance from the connection position to the other end away from the connection position of the first heat sink 121 is the tooth height H. When manufacturing the radiator 100 using aluminum extrusion or die casting, the higher the H / B ratio, the greater the processing difficulty, the lower the service life of the corresponding mold, and the higher the defect rate of the manufactured radiator 100. However, the heat dissipation area of ​​the radiator 100 per unit volume is limited, and the increase of the tooth gap B will also lead to a lower wind speed and thus a lower heat transfer coefficient. Therefore, it is necessary to comprehensively consider the values ​​of tooth height H and tooth gap B and their corresponding ratio.

[0044] This invention provides a heat sink and a rectifier-inverter device. The heat sink includes a substrate and a first heat sink assembly. The substrate has a first side and a second side facing each other. The first heat sink assembly has a plurality of first heat sinks. The first side is connected to a heat-generating device, thereby conducting the heat generated by the heat-generating device to the substrate. The second side is connected to the first heat sinks, allowing the heat introduced into the substrate to be quickly dissipated through the first heat sinks. The arrangement of the two sides effectively shortens the heat conduction path of the substrate, improves the heat dissipation efficiency, and also increases the contact area between the first heat sink and the air. This avoids the situation where some air does not come into contact with the heat sink due to the heat-generating device and the first heat sink being arranged on the same side, thus preventing air leakage and reducing the heat dissipation efficiency. Furthermore, the substrate includes at least a first substrate and a second substrate. The first side includes a first side of the first substrate and a first side of the second substrate, and the second side includes a second side of the first substrate and a second side of the second substrate. By connecting the first side of the first substrate and the first side of the second substrate to different heat-generating devices, and connecting the first heat sink group to the second side of the first substrate and the second side of the second substrate respectively, the problem of excessive heat concentration and low heat dissipation efficiency caused by concentrating multiple heat-generating devices on the same substrate surface can be effectively avoided. At the same time, the multiple parts of the substrate are connected to the same set of heat sinks, which improves the utilization rate of the heat sink, saves the space occupied by the heat sink, and also improves the heat dissipation efficiency of the heat sink.

[0045] In some embodiments, such as Figure 2As shown, the first heat sink 121 has a first end 1211 and a second end 1212 in its extending direction. The first end 1211 is connected to the first substrate 113 or the second substrate 114, and the second end 1212 extends away from the first substrate 113 and the second substrate 114. The extending direction of the first heat sink 121 forms a second preset angle with the second side 1112 of the first substrate. Specifically, considering that the first substrate 113 and the second substrate 114 are arranged adjacently, the first side 1111 of the first substrate and the first side 1121 of the second substrate form a first preset angle α1, for example, the first preset angle α1 is 90 degrees. The first substrate 113 and the second substrate 114 are arranged in an L-shaped structure. The first end 1211 and the second end 1212 of the first heat sink 121 can be selected to be connected to one of the first substrate 113 or the second substrate 114, thereby realizing that each substrate is individually connected to the first heat sink 121, which can effectively improve the heat dissipation efficiency. Considering that dust may accumulate on the first heat sink 121, potentially reducing its heat dissipation efficiency, the first heat sink 121 can be arranged at an angle to minimize dust accumulation. Specifically, when the heat sink 100 is placed horizontally, the first substrate 113 is located at the top of the heat sink 100, and the second substrate 114 is located on the side of the heat sink 100. The first end 1211 of the first heat sink 121 is connected to either the first substrate 113 or the second substrate 114, and the extending direction of the first heat sink 121 forms a second pre-angle with the second side 1112 of the first substrate. Let α2 be the included angle. When the first preset included angle α1 is 90 degrees, the angle between the extension direction of the first heat sink 121 and the second side 1122 of the second substrate is complementary to the second preset included angle α2. The specific size of the second preset included angle α2 is not limited. The larger the included angle α2 is, the larger the tilt angle of the first heat sink 121 is, and the lower the probability of dust accumulation. The larger the included angle α2 is, the smaller the included angle between the first heat sink 121 and the second substrate 114 is, which may cause inconvenience to the manufacturing and processing of the heat sink 100. Therefore, a comprehensive consideration is required. For example, if the second preset included angle α2 is 45 degrees, then the angle between the extension direction of the first heat sink 121 and the second side 1112 of the first substrate, as well as the angle between the extension direction of the first heat sink 121 and the second side 1122 of the second substrate, are both 45 degrees. When the first substrate 113 and the second substrate 114 have the same shape and size, the first heat sink 121 is evenly distributed on the first substrate 113 and the second substrate 114, half of the first heat sink 121 is connected to the first substrate 113, and the other half of the first heat sink 121 is connected to the second substrate 114.

[0046] In some embodiments, such as Figure 2 and Figure 3As shown, the heat sink 100 also includes a centralized heat-conducting section 130 and a second heat sink assembly 140. The centralized heat-conducting section 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The second heat sink assembly 140 includes a plurality of second heat sinks 141, which are connected to the centralized heat-conducting section 130. Specifically, the first side 1121 of the second substrate 114 is connected to the heat-generating device 200, and the second side 1122 of the second substrate 114 is connected to the first heat sink 121. The heat-generating device 200 occupies only a portion of the first side 1121 of the second substrate, and the entire second side 1122 of the second substrate is connected to the first heat sink 121. The temperature at the connection position occupied by the heat-generating device 200 is inevitably higher than that of other areas not connected to the heat-generating device 200. Heat is quickly transferred through the second substrate 114 to the nearest first heat sink 121, which may cause some of the first heat sinks 121 to overheat, resulting in untimely heat dissipation and some of the first heat sinks 121 not fully utilizing their heat dissipation function. To address heat dissipation efficiency, and to ensure faster and more uniform heat dissipation from each heat sink, thereby improving the utilization efficiency of individual heat sinks and preventing excessive heat concentration on certain heat sinks, a concentrated heat-conducting section 130 is provided on the heat sink 100. The concentrated heat-conducting section 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The heat sink 100 also includes a second heat sink 141, which is connected to the concentrated heat-conducting section 130. It should be noted that the second heat sink 141 has the same structural performance as the first heat sink 121; however, due to the different connection positions, it is referred to as the first heat sink 121 for ease of distinction. The second heat sink 141, by providing a concentrated heat-conducting part 130, increases the thickness of the substrate, effectively increasing the heat capacity of the heating devices 200 on the first substrate 113 and the second substrate 114 in the corresponding areas of the substrate. This effectively copes with instantaneous high heat loss. At the same time, the greater the thickness of the heat-conducting component, the lower the corresponding thermal resistance. The concentrated heat-conducting part 130 can reduce the thermal resistance of heat transfer to its central area, making the temperature uniformity of the first heat sink 121 and the second heat sink 141 better and the heat dissipation more uniform. The concentrated heat-conducting part 130 can also reduce the tooth height of the second heat sink 141, which is convenient for the processing and manufacturing of the heat sink 100. The specific structure and shape of the concentrated heat-conducting part 130 are not limited, and the entire heat sink 100 can be a one-piece molded structure.

[0047] In some embodiments, such as Figure 3 As shown, the concentrated heat conduction part 130 has a cubic structure. The concentrated heat conduction part 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The second heat sink 141 is connected to the two sides of the concentrated heat conduction part 130.

[0048] In some embodiments, such as Figure 2As shown, the extension direction of the second heat sink 141 is parallel to the extension direction of the first heat sink 121, and the extension direction of the second heat sink 141 is perpendicular to the first connecting surface 131. The first connecting surface 131 is the plane formed by the connection position of the second heat sink 141 and the concentrated heat conduction part 130. Specifically, the concentrated heat conduction part 130 can be understood as a right-angled triangular prism structure. The two right-angled faces of the right-angled triangular prism are connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The other face of the right-angled triangular prism is the first connecting surface 131. The second heat sink 141 is connected to the first connecting surface 131, and the extension direction of the second heat sink 141 is perpendicular to the first connecting surface 131.

[0049] In some embodiments, such as Figure 2 As shown, considering the space utilization of the heat sink 100 and minimizing space waste, the first end 1211 of the first heat sink 121 is connected to the first substrate 113 or the second substrate 114, and the second end 1212 of the first heat sink 121 extends away from the first substrate 113 and the second substrate 114, and the second end 1212 of the first heat sink 121 is flush with the end face 1131 of the first substrate or the end face 1141 of the second substrate. If the heat sink 100 also includes a concentrated heat conduction part 130 and a second heat sink 141, one end of the second heat sink 141 is connected to the concentrated heat conduction part 130, and the second end of the second heat sink 141 also extends away from the first substrate 113 and the second substrate 114, and the second end of the second heat sink 141 is also flush with the end face of the first substrate 113 or the end face of the second substrate 114.

[0050] This application also provides a rectifier-inverter device 10, such as... Figures 6 to 8As shown, the rectifier-inverter device 10 includes a heat sink 100, a heat-generating device 200, an inverter board 300, and a rectifier board 400. The inverter board 300 can be understood as a PCB board, on which inverter power transistors 310 are disposed. The inverter power transistors 310 are connected to the first substrate 113. The rectifier board 400 can also be understood as a PCB board, on which rectifier power transistors 410 are disposed. The rectifier power transistors 410 are connected to the second substrate 114. Specifically, the rectifier-inverter device 10 realizes uninterruptible power supply (UPS) technology. For ease of understanding, a brief explanation of UPS technology is given first. UPS (Uninterruptible Power Supply) is an uninterruptible power supply containing an energy storage device, mainly used to provide uninterrupted power to some equipment with high power stability requirements. When the mains power input is normal, the UPS stabilizes the mains power and supplies it to the load. In this state, the UPS functions as an AC voltage regulator while simultaneously charging its internal battery. When the mains power is interrupted, the UPS immediately switches from the battery's DC power to the load via an inverter, continuing to supply 220V AC power to maintain normal operation and protect the load's hardware and software from damage. UPS devices typically provide protection against both overvoltage and undervoltage. Uninterruptible power supplies (UPSs) are widely used in: mining, aerospace, industry, communications, defense, hospitals, computer terminals, network servers, network equipment, data storage devices, emergency lighting systems, railways, shipping, transportation, power plants, substations, nuclear power plants, fire safety alarm systems, wireless communication systems, program-controlled exchanges, mobile communications, solar energy storage and conversion equipment, control equipment and their emergency protection systems, personal computers, and other fields. For dual-circuit or dual-switch electrical equipment, there are also scenarios similar to the alternating operation of rectifier and battery modes in UPS systems.

[0051] Uninterruptible power supplies (UPS) have multiple operating states, and the losses of different power devices vary under different operating states. They typically operate in an alternating manner, mainly divided into a bypass section and a power section. The power section includes heat-generating devices 200, such as inverter power transistors 310 and rectifier power transistors 410. The power section is further divided into mains power state and battery power state. In mains power state, battery-related power devices in the rectifier circuit, such as IGBTs, diodes, and inductors, are temporarily inactive, while the mains-powered power devices in the rectifier circuit and the power devices in the inverter circuit operate continuously. In battery power state, both battery-powered and inverter power devices in the rectifier circuit operate continuously, while mains-powered power devices in the rectifier circuit are temporarily inactive. Even in both mains power state and battery power state, the losses of the power devices in the inverter circuit, operating continuously, differ under different conditions. By connecting the inverter power transistor 310 on the inverter board 300 to the first substrate 113, and the rectifier power transistor 410 on the rectifier board 400 to the second substrate 114, the inverter power transistor 310 and the rectifier power transistor 410 are prevented from being concentrated on the same substrate surface, which would cause excessive heat concentration. At the same time, the use of the same heat sink 100 for the inverter power transistor 310 and the rectifier power transistor 410 can improve the utilization rate of the heat sink. Even when the power transistors are in alternating working states, there will be no waste of the heat sink 100's performance.

[0052] In some embodiments, such as Figure 7As shown, the rectifier-inverter device 10 includes an inverter board 300 and a rectifier board 400. The inverter board 300 and the rectifier board 400 are arranged vertically at intervals. The specific form is not limited. It is acceptable for the inverter board 300 to be above the rectifier board 400 or for the rectifier board 400 to be above the inverter board 300. The following description will take the example of the inverter board 300 being above the rectifier board 400, and the extension direction of the inverter board 300 and the rectifier board 400 being parallel to the horizontal plane after installation. The heat sink 100 is located between the inverter board 300 and the rectifier board 400. Its specific fixing position can be determined according to the actual situation. For example, the heat sink 100 can be fixed on the PCB board with the rectifier power tube 410, i.e., on the rectifier board 400. Its specific fixing method can also be determined according to the requirements. For example, the heat sink 100 can be soldered to the rectifier board 400, or the heat sink 100 can be fixed to the rectifier board 400 by screws. The first substrate 113 and the second substrate 114 of the heat sink 100 are arranged adjacent to each other and connected. The first preset angle α1 between the first side 1111 of the first substrate and the first side 1121 of the second substrate is 90 degrees. The first substrate 113 and the second substrate 114 are arranged in an L-shaped structure. After placement, the first substrate 113 is parallel to the horizontal plane, and the second substrate 114 is parallel to the vertical direction, that is, the extension direction of the second substrate 114 is perpendicular to the extension direction of the inverter board 300. The first substrate 113 of the heat sink 100 is connected to the inverter power tube 310, and the second substrate 114 of the heat sink 100 is connected to the rectifier power tube 410, which can effectively save the space occupied by the rectifier inverter device 10 in the height direction and improve the space utilization rate. Meanwhile, the heat sink 100 includes a first heat sink 121 and a second heat sink 141. The first heat sink 121 and the second heat sink 141 are parallel, and the angle between the extension direction of the first heat sink 121 and the second side 1122 of the second substrate is 45 degrees, which facilitates the heat dissipation of the inverter power transistor 310 and the rectifier power transistor 410.

[0053] In some embodiments, to further improve the heat dissipation efficiency of the heat sink, the rectifier-inverter device 10 also includes a fan. The specific arrangement of the fan can be determined according to the actual situation. It should be noted that, in order to ensure that the airflow generated by the fan can better contact the first heat sink 121 and the second heat sink 141 for heat exchange, the direction of the airflow generated by the fan is approximately parallel to the plane where the second side 112 of the substrate 110 is located. Specifically, it can be understood that the direction of the airflow is parallel to the width direction of the rectifier-inverter device 10 (e.g., ...). Figure 8(As indicated by the middle arrow), the inverter board 300 and rectifier board 400 are arranged vertically in the height direction, the multiple heat sinks 100 are arranged sequentially in the length direction, and the direction perpendicular to both the length and height directions is the width direction. In the width direction, airflow enters from one end of the heat sink 100 and fully exchanges heat with the first heat sink 121 and the second heat sink 141, and then exits from the other end of the heat sink 100. In some embodiments, such as Figure 7 and Figure 8 As shown, there are multiple heat sinks 100, which are spaced apart along the length of the rectifier plate 400. The length direction is perpendicular to the plane of the first side 1121 of the second substrate. Multiple sets of bus capacitors 500 are connected to both the inverter plate 300 and the rectifier plate 400 of the rectifier-inverter device 10. To further optimize the layout and improve the structural compactness, the bus capacitors 500 are located between the inverter plate 300 and the rectifier plate 400, and are arranged side by side with the heat sinks 100 to save space in the height direction of the rectifier-inverter device 10. Based on the number of bus capacitors 500 and heat sinks 100, the bus capacitors 500 and heat sinks 100 are arranged adjacent to each other, with one set of bus capacitors 500 close to one heat sink 100. To improve the heat dissipation effect, bus capacitors 500 are located on both sides of the heat sink 100, and heat sinks 100 are located on both sides of the bus capacitors 500. This structure can effectively avoid heat concentration between two adjacent heat sinks 100 and accelerate the heat dissipation efficiency.

[0054] In some embodiments, the power devices in the inverter circuit operate continuously, regardless of whether it is in mains power mode or battery mode, meaning that the inverter power transistor 310 continuously generates heat. Considering that the rectifier power transistor 410 includes mains power devices and battery power devices, in mains power mode, the mains power devices in the rectifier power transistor 410 operate and generate heat, while the battery power devices in the rectifier power transistor 410 stop operating and do not generate heat; in battery mode, the battery power devices in the rectifier power transistor 410 operate and generate heat, while the mains power devices in the rectifier power transistor 410 stop operating and do not generate heat. Therefore, the mains power devices and battery power devices in the rectifier power transistor 410 operate alternately.

[0055] For example, the first substrate 113 of the heat sink 100 is connected to the inverter power transistor 310, and the second substrate 114 of the heat sink 100 is connected to both the mains-powered and battery-powered power devices in the rectifier power transistor 410. Regardless of the state, the inverter power transistor 310 on the first substrate 113 continuously generates heat, while the mains-powered and battery-powered power devices on the second substrate 114 alternately generate heat. This can be simply understood as the first substrate 113 and the second substrate 114 constantly generating heat. This structure also facilitates installation, as the installation method for each heat sink 100 is identical, improving installation efficiency.

[0056] For example, the first substrate 113 of the heat sink 100 is connected to the inverter power transistor 310, and the second substrate 114 of the heat sink 100 is connected to one of the mains-powered power devices and the battery-powered power devices in the rectifier power transistor 410. That is, the mains-powered power devices and the battery-powered power devices are respectively connected to the second substrate 114 of different heat sinks 100. For example, if the first substrate 113 of the same heat sink 100 is connected to the inverter power transistor 310, and its second substrate 114 is connected to the mains-powered power device, in the mains-powered state, both the first substrate 113 and the second substrate 114 generate heat, while in the battery-powered state, only the first substrate 113 generates heat. In another heat sink 100, the first substrate 113 is connected to the inverter power transistor 310, and its second substrate 114 is connected to the battery-powered power device. In the mains-powered state, only the first substrate 113 generates heat, while in the battery-powered state, both the first substrate 113 and the second substrate 114 generate heat.

[0057] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. A heat sink, characterized by, The heat sink comprises: a substrate having opposite first and second sides, the first side being connected with a heat generating device; a first fin group having a plurality of first fins, the first fins being connected with the second side of the substrate; wherein the substrate comprises at least a first substrate and a second substrate, the first side comprises a first substrate first side and a second substrate first side, the second side comprises a first substrate second side and a second substrate second side, the first substrate first side and the second substrate first side are respectively connected with different heat generating devices, the first fin group is respectively connected with the first substrate second side and the second substrate second side, the first fin group can conduct heat of the first substrate and the second substrate, the first substrate is connected with the second substrate, the first substrate first side and the second substrate first side form a first preset angle, part of the first fins are connected with the first substrate, and the rest of the first fins are connected with the second substrate, the heat sink further comprises a concentrated heat conduction part and a second fin group, the concentrated heat conduction part is respectively connected with the first substrate second side and the second substrate second side, and the second fin group comprises a plurality of second fins, the second fins being connected with the concentrated heat conduction part.

2. The heat spreader of claim 1, wherein, The plurality of first fins in the first fin group are arranged at intervals, the first fins have first ends and second ends in an extension direction, the first ends are connected with the first substrate or the second substrate, the second ends extend away from the first substrate and the second substrate, and the extension direction of the first fins forms a second preset angle with the first substrate second side.

3. The heat sink of claim 1 or 2, wherein, The extension direction of the second fins is parallel to the extension direction of the first fins, the extension direction of the second fins is perpendicular to a first connecting surface, and the first connecting surface is a plane formed by the connecting position of the second fins and the concentrated heat conduction part.

4. The heat sink of claim 2, wherein, The second ends of the first fins extend away from the first substrate and the second substrate, and the second ends of the first fins are flush with the end surface of the first substrate or the end surface of the second substrate.

5. A rectifier-inverter device, characterized by comprising: The heat sink comprises: the heat sink according to any one of claims 1 to 4; an inverter board having an inverter power tube, the inverter power tube being connected with the first substrate; a rectifier board having a rectifier power tube, the rectifier power tube being connected with the second substrate.

6. The rectifier-inverter device according to claim 5, wherein The inverter board and the rectifier board are arranged at intervals in a vertical direction, and the heat sink is located between the inverter board and the rectifier board; wherein the first substrate is connected with the second substrate, the extension direction of the first substrate is parallel to the extension direction of the inverter board, and the extension direction of the second substrate is perpendicular to the extension direction of the inverter board.

7. The rectifier-inverter device according to claim 6, wherein The number of the heat sinks is a plurality, the plurality of heat sinks are arranged at intervals along the length direction of the rectifier board, the length direction is perpendicular to the plane in which the second substrate first side is located, the inverter board and the rectifier board are connected with a plurality of bus capacitors, the bus capacitors are located between the inverter board and the rectifier board, and one group of bus capacitors is close to one heat sink.

8. The rectifier-inverter device according to claim 7, wherein The rectification power tube comprises a mains power device and a battery power device, and the mains power device and the battery power device are connected with the second substrate of the same heat sink. Or, the mains power device and the battery power device are respectively connected with the second substrate of different heat sinks.

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