Aluminum-based copper clad plate and preparation method thereof

Abstract

An aluminum-based copper-clad plate and a preparation method thereof, the aluminum-based copper-clad plate comprising, from bottom to top, an aluminum plate, an insulating adhesive film, and a composite copper foil, the composite copper foil being composed of a carrier film and a copper foil, and the insulating adhesive film being located between the carrier film and the aluminum plate. The present application can effectively solve the defects of air gap and cracking of the insulating layer during bending and folding of the traditional aluminum substrate, resulting in attenuation of the insulating performance, and solve the problem of brittleness of the insulating layer during three-dimensional processing, which is prone to breakage.

Description

Technical Field

[0001] This invention belongs to the field of copper clad laminate technology, and more specifically, relates to an aluminum-based copper clad laminate for three-dimensional lighting and its preparation method. Background Technology

[0002] Aluminum-based copper-clad laminates are widely used, especially in LED lighting, due to their excellent thermal conductivity and superior cost-effectiveness. Conventional LED substrates have a planar structure, but with the development of the lighting industry, LED lighting is trending towards three-dimensional structures. Compared to traditional planar LED lighting, three-dimensional LED lighting requires the aluminum substrate to possess excellent heat dissipation, heat resistance, insulation, and peel strength, while also exhibiting excellent toughness and flexibility. This is to ensure that the insulation layer does not crack or delaminate during the irregular shaping and bending of the three-dimensional LED structure.

[0003] In conventional aluminum-based copper clad laminates (CCLs), the insulating layer is either an adhesive film or a prepreg. Since the adhesive film contains no reinforcing material, and the prepreg's reinforcing material is fiberglass cloth, both are essentially rigid materials. During use, the rigidity of the aluminum plate and the insulating layer prevents the CCL from deforming. If this type of CCL is used in bent or folded three-dimensional structures, microscopic stress cracking will occur in the insulating layer, leading to performance degradation and making it difficult to meet the requirements of some three-dimensional LED lighting fixtures with non-planar structures. Summary of the Invention

[0004] The purpose of this invention is to provide a flexible aluminum-based copper-clad laminate with high insulation reliability to meet the needs of three-dimensional structure LED lighting.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A copper-clad laminate based on aluminum includes: an aluminum plate, an insulating film, and a composite copper foil arranged sequentially from bottom to top. The composite copper foil is composed of a carrier film and a copper foil, and the insulating film is located between the carrier film and the aluminum plate.

[0007] Optionally, the aluminum plate is an annealed aluminum plate, with one side of the aluminum plate being oxidized and the other side being brushed, and the brushed surface of the aluminum plate serving as the bonding surface with the insulating film.

[0008] Optionally, the insulating film is formed from a thermally conductive adhesive liquid coated on the surface of the carrier film, the thermally conductive adhesive liquid comprising the following components: bisphenol A epoxy resin, isocyanate modified epoxy resin, phenoxy resin, toughening agent, core-shell rubber, curing agent, curing accelerator, and micron filler.

[0009] Optionally, the proportions of each component in the thermally conductive adhesive film are as follows:

[0010] 30-40 parts by weight of bisphenol A epoxy resin, 8-18 parts by weight of isocyanate modified epoxy resin, 5-15 parts by weight of phenoxy resin, 8-18 parts by weight of toughening agent, 5-15 parts by weight of core-shell rubber, 4-9 parts by weight of curing agent, 0.05-0.20 parts by weight of curing accelerator, and 15-25 parts by weight of thermally conductive filler.

[0011] Optionally, the thermally conductive filler includes spherical alumina and silicon dioxide, wherein the mass ratio of the spherical alumina to the silicon dioxide is 1:0.1 to 0.3.

[0012] Optionally, the thickness of the aluminum plate is 0.2 mm to 0.8 mm, the thickness of the insulating film is 10 μm to 50 μm, the thickness of the carrier film is 8 μm to 25 μm, and the thickness of the copper foil is 5 μm to 8 μm.

[0013] Optionally, the carrier film is a polybutylene terephthalate film, a polyethylene naphthalate film, a polyethylene terephthalate film, or a polyimide film.

[0014] The present invention also provides a method for preparing the aforementioned aluminum-based copper-clad laminate, comprising the following steps:

[0015] Preparation of thermally conductive adhesive liquid for adhesive films;

[0016] To fabricate composite copper foil, the carrier film is subjected to corona treatment under high-voltage and high-frequency pyrolysis discharge impact conditions. Then, a conductive copper metal underlayer is fabricated on the surface of the carrier film. The conductive copper metal underlayer is thickened to the required thickness by electroplating to obtain a composite copper foil composed of a carrier film and a copper foil.

[0017] An insulating film is prepared by coating the surface of the carrier film with the thermally conductive adhesive liquid and drying it to obtain a semi-cured insulating film.

[0018] Aluminum-based copper-clad laminate is produced by pressing a composite copper foil with an insulating film on it at high temperature.

[0019] Optionally, when preparing the composite copper foil, the carrier film that has undergone corona treatment is oxidized, a coupling agent is coated on the surface of the carrier film and dried, and a surface activation layer is formed on the surface of the carrier film.

[0020] Optionally, for the oxidized carrier film, the carrier film is laminated into a double layer using heat sealing technology, and the conductive copper substrate is fabricated on the two outer surfaces of the double-layer film using magnetron sputtering. The conductive copper substrate is thickened to the required thickness by aqueous electroplating, and the laminated carrier films are separated to obtain a composite copper foil with a carrier film on one side and a copper foil on the other side.

[0021] Optionally, the preparation steps of the thermally conductive adhesive film are as follows:

[0022] The toughening agent and the core rubber were dissolved in a solvent to obtain a mixed solution ①;

[0023] Dissolve the curing agent and curing accelerator in a solvent, then add bisphenol A epoxy resin, isocyanate modified epoxy resin, phenoxy resin and thermally conductive filler respectively, and stir until completely dissolved to obtain mixed solution ②;

[0024] Mix solution ① and mixed solution ②, stir evenly, and adjust the gelation time of the adhesive to 160~260s / 171±1℃ to obtain the thermally conductive adhesive film.

[0025] As can be seen from the above technical solutions, the copper-clad laminate of the present invention is used for three-dimensional LED structures. It uses an aluminum plate as the substrate, which has good mechanical properties and machinability. This allows the copper-clad laminate to avoid cracking of the insulating film layer due to deformation stress of the aluminum plate during three-dimensional processing. Simultaneously, the insulating film, while possessing good flexibility, also exhibits excellent heat resistance and pressure resistance. Combined with a composite copper foil made of a carrier film and copper foil, the carrier film in the composite copper foil has good electrical insulation properties, as well as good continuity and flexibility. It will not crack even after arbitrary bending and folding, providing high insulation reliability for bendable three-dimensional lighting aluminum-based copper-clad laminates. This effectively solves the defects of traditional aluminum substrates where air gaps and cracks appear in the insulating layer during bending and folding, leading to insulation performance degradation. It also solves the problem of the insulating layer being brittle and prone to breakage during three-dimensional processing. Attached Figure Description

[0026] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of the aluminum-based copper-clad laminate according to an embodiment of the present invention. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings. In the detailed description of the embodiments of the present invention, for ease of explanation, the drawings illustrating the device structure will be partially enlarged without adhering to the general scale. Furthermore, the schematic diagrams are merely examples and should not be construed as limiting the scope of protection of the present invention. It should be noted that the drawings are in a simplified form and use non-precise scales, solely for the purpose of conveniently and clearly illustrating the embodiments of the present invention. Additionally, in the description of this application, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Terms such as "positive," "negative," "bottom," "upper," and "lower" indicate orientation or positional relationships based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] Copper clad laminate, also known as copper foil laminate, is a plate-shaped material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin to form an insulating board, then covering one or both sides of the insulating board with copper foil and hot pressing it.

[0031] like Figure 1 As shown, the aluminum-based copper-clad laminate in this embodiment consists of an aluminum plate 1, an insulating film 2, and a composite copper foil 3 from bottom to top. The aluminum plate 1, the insulating film 2, and the composite copper foil 3 are coated with adhesive and then stacked together, and pressed into an aluminum-based copper-clad laminate under high temperature and high pressure, such as pressing at 175°C for 1 hour.

[0032] The aluminum plate of the present invention is an annealed aluminum plate. After annealing, the plasticity and toughness of the aluminum plate can be improved, the corrosion resistance of the aluminum plate can be enhanced, and stress and defects can be eliminated, thereby improving the mechanical properties and machinability of the aluminum plate. This allows the copper-clad laminate to avoid cracking of the insulating film layer due to the deformation stress of the aluminum plate during three-dimensional processing.

[0033] Optionally, the thickness of the aluminum plate is 0.2mm to 0.8mm. 1-series aluminum plates are preferred, as they have low density and good plasticity, making them more suitable for processing three-dimensional structural graphics. Further optionally, after annealing, one surface of the aluminum plate is oxidized, and the other surface is brushed, with the brushed surface used as the bonding surface for the insulating film.

[0034] The insulating film of the present invention is formed from a thermally conductive adhesive liquid, which comprises the following components: bisphenol A epoxy resin, isocyanate-modified epoxy resin, phenoxy resin, toughening agent, core-shell rubber, curing agent, curing accelerator, and conductive filler. These components are added to a solvent to form the thermally conductive adhesive liquid. The solvent can be ketone solvents such as acetone, butanone, and cyclohexanone, and / or dimethylformamide, dimethylacetamide, toluene, ethylene glycol methyl ether, and ethylene glycol methyl ether acetate. The formulation of each component in the thermally conductive adhesive liquid is as follows:

[0035]

[0036] Optionally, the bisphenol A epoxy resin can be a long-chain molecular structure resin, such as a bisphenol A epoxy resin with an epoxy equivalent of 1000-1500 g / mol, to improve good adhesion and heat resistance.

[0037] Optionally, the isocyanate-modified epoxy resin can be of MDI type or TDI type, with an epoxy equivalent of 280-320 g / eq and a viscosity (25℃) of 100-1000 mPa·s, to improve the heat resistance and bonding strength of the composition, so that the composition has a higher glass transition temperature when used in aluminum-based copper-clad laminates.

[0038] The toughening agent of the present invention may be one or more of carboxyl-terminated nitrile butadiene rubber, styrene-butadiene rubber, polyvinyl butyral, and phenolic resin. Optionally, the toughening agent in this embodiment is carboxyl-terminated nitrile butadiene rubber, and the number average molecular weight (Mn) may be 20,000 to 50,000.

[0039] The curing agent of this invention can be one or more selected from dicyandiamide, diaminodiphenyl sulfone, diaminodiphenylmethane, dio-o-chlorodiphenylamine methane, diethyldiaminodiphenylmethane, polytetramethylene ether glycol bis(p-aminobenzoate), and dimethyldiaminodicyclohexylmethane. In this embodiment, the curing agent used is dio-o-chlorodiphenylamine methane, with analytical purity, generally not less than 99%.

[0040] The curing accelerator of the present invention can be an imidazole-based curing accelerator, such as 2-methylimidazole, 2-phenylimidazole, or 2-ethyl-4-methylimidazole. In this embodiment, the curing accelerator is 2-methylimidazole, which is chemically pure.

[0041] The filler used in this invention is a micron-sized thermally conductive filler. Using a thermally conductive filler allows the insulating film formed by the thermally conductive adhesive to have good heat dissipation properties. The thermally conductive filler includes spherical alumina and silicon dioxide, with a mass ratio of 1:0.1 to 0.3. The particle size D50 of the spherical alumina is 2 μm to 5 μm; the particle size of the silicon dioxide is 5.0 μm to 8.0 μm.

[0042] The core-shell rubber in this embodiment is a copolymer of methyl acrylate-butadiene-styrene core-shell structured micro / nano rubber particles.

[0043] In the thermally conductive adhesive of this invention, isocyanate-modified epoxy resin and phenoxy resin are compounded in a specific ratio, which enables the adhesive composition to possess both good flexibility and high bonding strength and heat resistance. The compounding of isocyanate-modified epoxy resin and bisphenol A epoxy resin in a specific ratio increases the glass transition temperature of the composition system, ensuring excellent heat resistance and pressure resistance. The toughening agent, selected as carboxyl-terminated nitrile butadiene rubber, when compounded with core-shell rubber in a specific ratio, further enhances the heat resistance, flexibility, and pressure stability of the composition, maintaining the glass transition temperature. When applied to aluminum-based copper-clad laminates, it exhibits high heat resistance, flexibility, and good processability.

[0044] After preparing the thermally conductive adhesive solution, the solution is roller-coated onto a carrier film of composite copper foil. After drying, an insulating film is obtained. The thickness of the insulating film is 10μm to 50μm. The insulating film of this invention has high adhesive strength, high flexibility and ductility, and good heat resistance. It solves the problem of brittleness and easy breakage of the insulating layer during three-dimensional processing, meeting the application requirements of three-dimensional LEDs and irregularly shaped lighting fields.

[0045] The composite copper foil of this invention consists of a carrier film and a copper foil, which are bonded together by physical and chemical means. The carrier film has excellent electrical insulation properties, as well as good continuity and flexibility. It will not crack even when bent and folded, providing high insulation reliability for bendable aluminum-based copper-clad laminates for three-dimensional lighting. It can effectively solve the defects of traditional aluminum substrates, such as air gaps and cracks in the insulation layer when bent and folded, which lead to the degradation of insulation performance.

[0046] In the fabrication of aluminum-based copper-clad laminates, the carrier film and insulating film of the composite copper foil are bonded together. Conventional carrier films are thermoplastic materials and thermosetting insulating films, exhibiting poor compatibility at high temperatures. Direct lamination results in low bond strength at the interface between the carrier film and the insulating film, affecting the product's heat resistance. Therefore, the carrier film of this invention undergoes double-sided corona treatment, followed by activation treatment with a coupling agent, and then an adhesive layer. This addresses the problem of low bond strength at the interface, which leads to low heat resistance of the laminate.

[0047] The carrier film in the composite copper foil can be a polybutylene terephthalate (PBT) film, a polyethylene naphthalate (PEN) film, a polyethylene terephthalate (PET) film, or a polyimide (PI) film. In this embodiment, the carrier film is a PET film with a thickness of 8μm to 25μm. This is because when the thickness is less than 8μm, the high-voltage insulation performance of the aluminum-based copper clad laminate decreases; when the thickness is greater than 25μm, the bending and folding performance of the aluminum-based copper clad laminate decreases. The copper foil thickness is 5μm to 8μm. This thickness range ensures the copper foil's current-carrying capacity while also guaranteeing the bending and folding performance of the aluminum-based copper clad laminate.

[0048] The carrier film undergoes corona treatment under high voltage (10kV–20kV) and high frequency (10–25kHz) spark discharge impact. The corona treatment is carried out in air, where the gas forms a weak electrolyte, creating various polar functional groups. Simultaneously, the double chains on the carbon bonds of the polyolefin molecules in the film open, and during the discharge, these polar functional groups undergo a grafting reaction with the polymer surface, transforming the carrier film surface from non-polar to polar, thus further increasing the surface free energy. Furthermore, the high-voltage, high-frequency spark discharge roughens the film surface through impact, revealing small tubular grooves and unevenness under high-magnification transmission electron microscopy. The corona-treated carrier film exhibits a surface tension ≥38 dynes and a surface roughness Ra of 0.08–0.16, which improves the wettability and specific surface area of ​​the carrier film surface, enhancing its adhesion from a physical perspective and thus improving the heat resistance of the aluminum-based copper-clad laminate.

[0049] Furthermore, the corona-treated carrier film undergoes a surface activation treatment by coating a silane coupling agent onto its surface, causing a chemical reaction that forms a new surface layer. This new surface layer further enhances the surface energy of the carrier film, improving its wettability and adhesion, thereby increasing the heat resistance of the aluminum-based copper clad laminate.

[0050] Optionally, the siloxane coupling agent can be a coupling agent such as vinylsilane, aminosilane, epoxysilane, mercaptosilane, and methacryloxysilane.

[0051] The corona-treated carrier film is composited into a double-sided film. Then, a 15nm-85nm conductive copper substrate is first fabricated on the surface using magnetron sputtering. The conductive copper substrate is then thickened to the required thickness using aqueous electroplating. The stacked carrier films are then separated to obtain a composite copper foil with a carrier film on one side and a copper foil on the other.

[0052] A thermally conductive adhesive film is coated onto the surface of the carrier film of the composite copper foil. After baking at 155°C for 3–15 minutes, it retains a certain degree of fluidity, forming a semi-cured state. The thickness of the insulating film in the semi-cured state is 10 μm–50 μm.

[0053] The present invention will be further described below through specific embodiments. Unless otherwise specified, the reagents, materials and instruments used in the following description are all conventional reagents, materials and instruments, which are commercially available, and the reagents involved can also be synthesized by conventional synthetic methods.

[0054] Example 1

[0055] The preparation steps of the copper-clad laminate in this embodiment are as follows:

[0056] The thermally conductive adhesive solution for the film was prepared. The proportions of each component in the thermally conductive adhesive solution are shown in the table below (in Examples 1-3, solvent 1 is methyl ethyl ketone and solvent 2 is dimethylformamide).

[0057]

[0058]

[0059] The composite copper foil is fabricated by subjecting the carrier film to corona treatment under high voltage (10KV-20KV) and high frequency (10-25KHz) spark discharge impact conditions. In this embodiment, after corona treatment, the carrier film is also subjected to oxidation treatment. The oxidation treatment involves coating a silane coupling agent onto both surfaces of the carrier film, drying it, and performing surface activation treatment to form a surface activation layer on the surface of the carrier film. The carrier film is then laminated into a double-layer film using heat sealing technology. A layer of conductive copper metal is fabricated on the two outer surfaces of the double-layer film using magnetron sputtering. Finally, the conductive copper metal is thickened to the required thickness using aqueous electroplating, and the laminated carrier films are separated to obtain a composite copper foil with one side being the carrier film and the other side being copper foil.

[0060] A thermally conductive adhesive film is coated on the surface of the carrier film of the composite copper foil. After baking at 155°C for 3 to 15 minutes, it retains a certain fluidity and forms a semi-cured insulating film. The coating thickness of the thermally conductive adhesive film is controlled to be 30 μm to 100 μm.

[0061] Aluminum sheet is made by annealing 1060 aluminum sheet at 300-500℃ for 1-4 hours, and then naturally cooling it to room temperature to obtain annealed aluminum sheet; one surface of the annealed aluminum sheet is oxidized and the other surface is brushed, with the brushed surface serving as the bonding surface;

[0062] Aluminum-based copper-clad laminate is produced by pressing a composite copper foil with an insulating film and an aluminum plate at 175°C for 1 hour.

[0063] The specific steps for preparing the thermally conductive adhesive film in this embodiment are as follows:

[0064] Dissolve the carboxyl-terminated butadiene-nitrile rubber and the core-shell rubber in solvent 1 to obtain a mixed solution ①, which is an elastomer resin solution;

[0065] Dissolve the curing agent and curing accelerator in solvent 2, then add bisphenol A epoxy resin, isocyanate modified epoxy resin, phenoxy resin and conductive filler respectively, and stir until completely dissolved to obtain mixed solution ②;

[0066] Mix solution ① and mixed solution ②, stir evenly, and add catalyst to adjust the gelation time GT of the gel to 160~260s / 171±1℃.

[0067] The aluminum-based copper-clad laminate prepared in this embodiment was subjected to thermal stress test, peel test and bending test. The test methods in standard TM650 were used for the test, and the test results are shown in the table below.

[0068]

[0069] Example 2

[0070] The difference between this embodiment and Embodiment 1 lies in the proportion of each component of the thermally conductive adhesive liquid. The proportion of each component of the thermally conductive adhesive liquid in this embodiment is shown in the table below.

[0071] Material Name mass ratio Bisphenol A epoxy resin 36 Isocyanate modified epoxy resin 10 phenoxy resin 7 Carboxyl-terminated nitrile butadiene rubber 14 Core-shell rubber 11 curing agent 8 Curing accelerator 0.14 Solvent 1 45 Solvent 2 65 Inorganic packing 20

[0072] The aluminum-based copper-clad laminate prepared in this embodiment was subjected to thermal stress test, peel test and bending test, and the test results are shown in the table below.

[0073]

[0074] Example 3

[0075] The difference between this embodiment and Embodiment 1 lies in the proportion of each component of the thermally conductive adhesive liquid. The proportion of each component of the thermally conductive adhesive liquid in this embodiment is shown in the table below.

[0076] Material Name mass ratio Bisphenol A epoxy resin 32 Isocyanate modified epoxy resin 14 phenoxy resin 13 Carboxyl-terminated nitrile butadiene rubber 10 Core-shell rubber 13 curing agent 5 Curing accelerator 0.11 Solvent 1 45 Solvent 2 65 Inorganic packing 20

[0077] The aluminum-based copper-clad laminate prepared in this embodiment was subjected to thermal stress test, peel test and bending test, and the test results are shown in the table below.

[0078]

[0079] The test results above show that the aluminum-based copper-clad laminates prepared in each embodiment have a peel strength ≥5 LBS / in on the bending surface, a thermal stress of 288℃ with tin floating ≥10 min, a breakdown voltage A-state ≥10.0kV on the 90° bending surface, a breakdown voltage A-state ≥8.0kV on the 180° bending surface, and a breakdown voltage A-state ≥5.0kV on the 360° bending surface. After bending 360°, the insulation layer did not crack, and there was no delamination or glue peeling between the insulation layer and the aluminum plate. It has excellent heat dissipation, heat resistance, peel strength, insulation reliability, and superior processing flexibility, meeting the requirements of three-dimensional structure LED lighting. Among them, the manufacturing process of Example 2 is better and easier to control.

[0080] The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of the present invention.

Claims

1. An aluminum-based copper-clad plate, characterized by, include: An aluminum plate, an insulating film, and a composite copper foil are arranged sequentially from bottom to top. The composite copper foil is composed of a carrier film and a copper foil, and the insulating film is located between the carrier film and the aluminum plate. The insulating film is formed from a thermally conductive adhesive liquid coated on the surface of the carrier film, and the thermally conductive adhesive liquid comprises the following components: 30-40 parts by weight of bisphenol A epoxy resin, 8-18 parts by weight of isocyanate modified epoxy resin, 5-15 parts by weight of phenoxy resin, 8-18 parts by weight of toughening agent, 5-15 parts by weight of core-shell rubber, 4-9 parts by weight of curing agent, 0.05-0.20 parts by weight of curing accelerator, and 15-25 parts by weight of thermally conductive filler. The composite copper foil is prepared by the following steps: The carrier film is subjected to corona treatment under high voltage (10KV–20KV) and high frequency (10–25KHz) spark discharge impact conditions; the corona-treated carrier film is then oxidized; a coupling agent is coated onto the surface of the carrier film and dried to form a surface activation layer; the oxidized carrier film is then laminated into a double layer using heat sealing technology; a conductive copper underlayer is fabricated on the two outer surfaces of the double-layer carrier film using magnetron sputtering; the conductive copper underlayer is thickened to the required thickness using aqueous electroplating; the laminated carrier films are then separated to obtain a composite copper foil with one side being the carrier film and the other side being copper foil; the thickness of the insulating film is 10μm–50μm, the thickness of the carrier film is 8μm–25μm, and the thickness of the copper foil is 5μm–8μm.

2. The aluminum-based copper-clad laminate as described in claim 1, characterized in that: The aluminum plate is an annealed aluminum plate, with one side of the aluminum plate having an oxidized surface and the other side having a brushed surface. The brushed surface of the aluminum plate serves as the bonding surface with the insulating film.

3. The aluminum-based copper-clad laminate as described in claim 1, characterized in that: The thermally conductive filler comprises spherical alumina and silicon dioxide, wherein the mass ratio of the spherical alumina to the silicon dioxide is 1:0.1 to 0.

3.

4. The aluminum-based copper-clad laminate as described in claim 1, characterized in that: The thickness of the aluminum plate is 0.2mm to 0.8mm.

5. The aluminum-based copper-clad laminate as described in claim 1, characterized in that: The carrier film is a polybutylene terephthalate film, a polyethylene naphthalate film, a polyethylene terephthalate film, or a polyimide film.

6. The method for preparing aluminum-based copper-clad laminate according to any one of claims 1 to 5, characterized in that, Includes the following steps: Preparation of thermally conductive adhesive liquid for adhesive films; To fabricate a composite copper foil, a carrier film is subjected to corona treatment under high voltage (10KV-20KV) and high frequency (10-25KHz) spark discharge impact conditions. The corona-treated carrier film is then oxidized. A coupling agent is coated onto the surface of the carrier film and dried to form a surface activation layer. The oxidized carrier film is then laminated into a double layer using heat sealing technology. A conductive copper underlayer is fabricated on the two outer surfaces of the double-layer carrier film using magnetron sputtering. The conductive copper underlayer is then thickened to the required thickness using aqueous electroplating. Finally, the laminated carrier films are separated to obtain a composite copper foil with a carrier film on one side and a copper foil on the other. An insulating film is prepared by coating the surface of the carrier film with the thermally conductive adhesive liquid and drying it to obtain a semi-cured insulating film. Aluminum-based copper-clad laminate is produced by pressing a composite copper foil with an insulating film on it at high temperature.

7. The method for preparing aluminum-based copper-clad laminate as described in claim 6, characterized in that: The preparation steps of the thermally conductive adhesive film are as follows: The toughening agent and core-shell rubber were dissolved in a solvent to obtain a mixed solution ①; Dissolve the curing agent and curing accelerator in a solvent, then add bisphenol A epoxy resin, isocyanate modified epoxy resin, phenoxy resin and thermally conductive filler respectively, and stir until completely dissolved to obtain mixed solution ②; Mix solution ① and mixed solution ②, stir evenly, and adjust the gelation time of the adhesive to 160~260s / 171±1℃ to obtain the thermally conductive adhesive film.

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