A processing method for Ka-band spatial S-bend digital transmission waveguide

Abstract

The present application relates to the technical field of digital waveguide processing, and in particular to a processing method for a Ka-band spatial S-bend digital waveguide. Obtain the parameters of the digital waveguide to be processed, generate a first-level cover plate, a first-level cavity and a first-level welding sheet according to the decomposition model and the parameters of the digital waveguide to be processed; set fixed parameters according to the parameters of the digital waveguide to be processed, assemble a first-level cover plate, a first-level cavity and a first-level welding sheet according to the fixed parameters, and generate a first-level rough blank according to the preset welding parameters; process the first-level rough blank according to the preset first-level processing parameters to generate a second-level rough blank, and set the second-level processing parameters according to the parameters of the digital waveguide to be processed, and generate a spatial S-bend digital waveguide according to the second-level processing parameters. By structurally decomposing the Ka-band spatial S-bend digital waveguide to be processed, welding the whole in a vacuum furnace, and forming the whole by electro-machining, it is ensured that the produced S-bend digital waveguide meets the requirements of structural size and performance indicators, while reducing production costs and improving processing efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of digital transmission waveguide processing, and in particular to a processing method for a Ka-band spatial S-bend digital transmission waveguide. Background Art

[0002] As a relatively basic passive microwave device in satellite communications, digital waveguides are widely used in satellites. Although their technological content is not cutting-edge, as their applications become more and more widespread, the rationality of their design will directly affect the satellite's space utilization and load.

[0003] In recent years, with the continuous development of satellite miniaturization and high integration, the structural complexity of digital waveguides has become increasingly complex, from the original straight waveguides and single-bend waveguides to the later U-shaped and multi-bend waveguides, which are all two-dimensional digital waveguides in a plane. Now, customers have demanded high-frequency spatial three-dimensional S-bend digital waveguides.

[0004] The traditional process for this type of digital waveguide is to meet the requirements through multiple bends or multiple welding. However, the disadvantage of bending is that it will cause compression and stretching of the material, and wrinkles, deformation or even fractures will appear on the inner wall of the waveguide cavity, which will have a significant impact on the high-frequency waveguide; the multi-section welding process is not ideal for position accuracy control. If material compression and stretching occur during the processing, and wrinkles, deformation or even fractures appear on the inner wall of the waveguide cavity, it will be impossible to repair and cannot meet the technical index requirements and quality requirements. Summary of the invention

[0005] The purpose of this application is: to solve the above-mentioned technical problems, this application provides a method for processing a Ka-band spatial S-bend digital transmission waveguide, aiming to improve the processing efficiency of the spatial S-bend digital transmission waveguide and reduce production costs.

[0006] In some embodiments of the present application, the Ka-band spatial S-bend digital waveguide to be processed is structurally decomposed into components such as a cover plate, a cavity, and a welding sheet, and then integrally welded in a vacuum furnace and formed by electro-machining to avoid wrinkles, deformation, and fractures inside the waveguide cavity. This ensures that the produced S-bend digital waveguide meets the requirements of structural dimensions and performance indicators, reduces production costs, and improves the processing efficiency of the spatial S-bend digital waveguide.

[0007] In some embodiments of the present application, a method for processing a Ka-band spatial S-bend digital transmission waveguide is provided, comprising:

[0008] Obtain the parameters of the data transmission waveguide to be processed, and generate a first-level cover plate, a first-level cavity and a first-level welding sheet according to the decomposition model and the parameters of the data transmission waveguide to be processed;

[0009] Set fixed parameters according to the parameters of the data transmission waveguide to be processed, assemble the first-level cover plate, the first-level cavity and the first-level welding sheet according to the fixed parameters, and generate the first-level rough blank according to the preset welding parameters;

[0010] The first rough blank is processed according to preset first-level processing parameters to generate a second rough blank, and the second-level processing parameters are set according to the parameters of the data transmission waveguide to be processed, and the second-level rough blank is processed according to the second-level processing parameters to generate a spatial S-bend data transmission waveguide.

[0011] In some embodiments of the present application, the setting of fixed parameters includes:

[0012] Generate the number of S-bends, space occupied volume and inner cavity thickness c of the data transmission waveguide to be processed according to the parameters of the data transmission waveguide to be processed;

[0013] According to the inner cavity thickness c set pin diameter d;

[0014] Generate a first reference evaluation value H1 according to the number of S-bends;

[0015] Generate a second reference evaluation value H2 based on the space occupied volume;

[0016] Generate a processing evaluation value a according to the first reference evaluation value H1 and the second reference evaluation value H2;

[0017] a=e1*H1+e2*H2, where e1 is the preset first weight coefficient and e2 is the preset second weight coefficient;

[0018] According to the processing evaluation value a, the spacing distance b between adjacent pins is set;

[0019] The pin hole position parameters on the primary cover plate, the primary cavity and the primary welding piece are set according to the pin diameter d and the spacing distance b between adjacent pins.

[0020] In some embodiments of the present application, when setting the pin diameter d, it includes:

[0021] Preset a first inner cavity thickness interval (C1, C2), a second inner cavity thickness interval (C2, C3) and a third inner cavity thickness interval (C3, C4);

[0022] If the inner cavity thickness c is within the preset first inner cavity thickness range, the pin diameter d is set to the preset first pin diameter D1, ie d = D1;

[0023] If the inner cavity thickness c is within the preset second inner cavity thickness range, the pin diameter d is set to the preset second pin diameter D2, ie d = D2;

[0024] If the inner cavity thickness c is within the preset third inner cavity thickness range, the pin diameter d is set to the preset third pin diameter D3, that is, d=D3; and D1 <D2<D3。

[0025] In some embodiments of the present application, when setting the spacing distance b between adjacent pins, it includes:

[0026] Preset a first processing evaluation value interval (A1, A2), a second processing evaluation value interval (A2, A3) and a third processing evaluation value interval (A3, A4);

[0027] If the processing evaluation value a is within the preset first processing evaluation value interval, the interval distance b is set to the preset first interval distance B1, ie b=B1;

[0028] If the processing evaluation value a is within the preset second processing evaluation value interval, the interval distance b is set to the preset second interval distance B2, ie b = B2;

[0029] If the processing evaluation value a is within the preset third processing evaluation value interval, the interval distance b is set to the preset third interval distance B3, that is, b=B3, and B1 <B2<B3。

[0030] In some embodiments of the present application, when processing the primary rough blank according to the preset primary processing parameters, it includes:

[0031] According to the inner cavity thickness c of the data transmission waveguide to be processed, the primary margin f is set;

[0032] The compensation coefficient m is set according to the processing evaluation value a, and the first-level margin f is corrected according to the compensation coefficient m;

[0033] According to the first-level margin f, the remaining amount to be removed of the first-level rough blank is set;

[0034] Set the fast wire cutting parameters according to the excess to be removed;

[0035] Set milling parameters according to the flange parameters of the data transmission waveguide to be processed;

[0036] The first-level rough blank is processed in sequence according to the fast wire cutting parameters and the milling parameters to generate a second-level rough blank.

[0037] In some embodiments of the present application, when setting the first-level margin f, it includes:

[0038] If the inner cavity thickness c is within the preset first inner cavity thickness range, the first level margin f is set to the preset first level margin F1, ie f = F1;

[0039] If the inner cavity thickness c is within the preset second inner cavity thickness range, the first level margin f is set to the preset second level margin F2, ie f = F2;

[0040] If the inner cavity thickness c is within the preset third inner cavity thickness range, the first-level margin f is set to the preset third first-level margin F3, that is, f=F3; and F1 <F2<F3。

[0041] In some embodiments of the present application, when setting the compensation coefficient m, it includes:

[0042] If the processing evaluation value a is within the preset first processing evaluation value interval, the compensation coefficient m is set to the preset first compensation coefficient m1, that is, m=m1, and the corrected first margin f=m1*Fi, (i=1,2,3);

[0043] If the processing evaluation value a is within the preset second processing evaluation value interval, the compensation coefficient m is set to the preset second compensation coefficient m2, that is, m=m2, and the corrected first margin f=m2*Fi, (i=1,2,3);

[0044] If the processing evaluation value a is in the preset third processing evaluation value interval, the compensation coefficient m is set to the preset first compensation coefficient m1, that is, m=m1 corrected first margin f=m3*Fi, (i=1,2,3);

[0045] And 1 <m1<m2<m3。

[0046] In some embodiments of the present application, when setting the secondary processing parameters according to the parameters of the data transmission waveguide to be processed, it includes:

[0047] Generate a processing area of ​​the secondary rough blank according to the structural parameters of the data transmission waveguide to be processed;

[0048] Set the slow wire cutting parameters according to the number of areas to be processed;

[0049] The secondary rough blank is processed according to the slow wire processing parameters to generate a spatial S-bend digital waveguide.

[0050] Compared with the prior art, the processing method of a Ka-band spatial S-bend data transmission waveguide in the embodiment of the present application has the following beneficial effects:

[0051] In some embodiments of the present application, the Ka-band spatial S-bend digital waveguide to be processed is structurally decomposed into components such as a cover plate, a cavity, and a welding sheet, and then integrally welded in a vacuum furnace and formed by electro-machining to avoid wrinkles, deformation, and fractures inside the waveguide cavity. This ensures that the produced S-bend digital waveguide meets the requirements of structural dimensions and performance indicators, reduces production costs, and improves the processing efficiency of the spatial S-bend digital waveguide. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 It is a flow chart of a method for processing a Ka-band spatial S-bend digital transmission waveguide in a preferred embodiment of the present application;

[0053] Figure 2 It is a structural schematic diagram of a Ka-band spatial S-bend data transmission waveguide in a preferred embodiment of the present application.

[0054] In the figure, flange 100; straight waveguide 200; first curved cavity 300; second curved cavity 400; third curved cavity 500. DETAILED DESCRIPTION

[0055] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but are not intended to limit the scope of the present application.

[0056] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0057] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0058] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] like Figure 1-Figure 2 As shown, a method for processing a Ka-band spatial S-bend data transmission waveguide in a preferred embodiment of the present application is characterized by comprising:

[0060] Obtain the parameters of the data transmission waveguide to be processed, and generate a first-level cover plate, a first-level cavity and a first-level welding sheet according to the decomposition model and the parameters of the data transmission waveguide to be processed;

[0061] Set fixed parameters according to the parameters of the data transmission waveguide to be processed, assemble the first-level cover plate, the first-level cavity and the first-level welding sheet according to the fixed parameters, and generate the first-level rough blank according to the preset welding parameters;

[0062] The first rough blank is processed according to the preset first-level processing parameters to generate a second rough blank, and the second-level processing parameters are set according to the parameters of the data transmission waveguide to be processed, and the second rough blank is processed according to the second-level processing parameters to generate a spatial S-bend data transmission waveguide.

[0063] Specifically, in the above embodiment, the data transmission waveguide to be processed is decomposed and converted into a first-level cover plate, a first-level cavity and a first-level welding sheet, and then integrally processed and formed to avoid wrinkles, deformation and fracture problems inside the waveguide cavity. While ensuring that the produced S-bend data transmission waveguide meets the requirements of structural dimensions and performance indicators, the production cost is reduced and the processing efficiency of the spatial S-bend data transmission waveguide is improved.

[0064] Specifically, after the data transmission waveguide to be processed is split, the first-level cover plate, the first-level cavity and the first-level welding sheet are pre-processed, and the corresponding pin holes are set. Then, after the first-level cover plate, the first-level cavity and the first-level welding sheet are pre-processed, they are cleaned and assembled according to the preset process. They are positioned with pins and the assembled parts are placed in an empty brazing furnace for welding to generate a first-level rough blank.

[0065] In a preferred embodiment of the present application, when setting fixed parameters, it includes:

[0066] Generate the number of S-bends, space occupied volume and inner cavity thickness c of the data transmission waveguide to be processed according to the parameters of the data transmission waveguide to be processed;

[0067] According to the inner cavity thickness c set pin diameter d;

[0068] Generate a first reference evaluation value H1 according to the number of S-bends;

[0069] Generate a second reference evaluation value H2 based on the space occupied volume;

[0070] Generate a processing evaluation value a according to the first reference evaluation value H1 and the second reference evaluation value H2;

[0071] a=e1*H1+e2*H2, where e1 is the preset first weight coefficient and e2 is the preset second weight coefficient;

[0072] According to the processing evaluation value a, the spacing distance b between adjacent pins is set;

[0073] The pin hole position parameters on the primary cover plate, the primary cavity and the primary welding piece are set according to the pin diameter d and the spacing distance b between adjacent pins.

[0074] Specifically, the first reference evaluation value and the second reference evaluation value have the same value range. The larger the number of S-bends corresponding to the first reference evaluation value is, the larger the space occupied volume is, and the larger the corresponding second reference evaluation value is. Among them, the space occupied volume refers to the space volume obtained by establishing a coordinate system based on any plane of the digital waveguide to be processed, and the product of the maximum distances on the X-axis, Y-axis and Z-axis.

[0075] Specifically, the larger the processing evaluation value is, the greater the processing difficulty of the current data transmission waveguide to be processed is.

[0076] Specifically, when setting the pin diameter d, it includes:

[0077] Preset a first inner cavity thickness interval (C1, C2), a second inner cavity thickness interval (C2, C3) and a third inner cavity thickness interval (C3, C4);

[0078] If the inner cavity thickness c is within the preset first inner cavity thickness range, the pin diameter d is set to the preset first pin diameter D1, ie d = D1;

[0079] If the inner cavity thickness c is within the preset second inner cavity thickness range, the pin diameter d is set to the preset second pin diameter D2, ie d = D2;

[0080] If the inner cavity thickness c is within the preset third inner cavity thickness range, the pin diameter d is set to the preset third pin diameter D3, that is, d=D3; and D1 <D2<D3。

[0081] Specifically, when setting the spacing distance b between adjacent pins, it includes:

[0082] Preset a first processing evaluation value interval (A1, A2), a second processing evaluation value interval (A2, A3) and a third processing evaluation value interval (A3, A4);

[0083] If the processing evaluation value a is within the preset first processing evaluation value interval, the interval distance b is set to the preset first interval distance B1, ie b=B1;

[0084] If the processing evaluation value a is within the preset second processing evaluation value interval, the interval distance b is set to the preset second interval distance B2, ie b = B2;

[0085] If the processing evaluation value a is within the preset third processing evaluation value interval, the interval distance b is set to the preset third interval distance B3, that is, b=B3, and B1 <B2<B3。

[0086] Specifically, in the above embodiment, the pin parameters are dynamically adjusted according to the parameters of the digital waveguide to be processed, so as to more stably position the first-level cavity, the first-level cover plate and the first-level welding sheet, which is convenient for subsequent CNC machine tools, slow wire and electric spark machining, and improves the overall production efficiency.

[0087] In a preferred embodiment of the present application, when processing the primary rough blank according to the preset primary processing parameters, it includes:

[0088] According to the inner cavity thickness c of the data transmission waveguide to be processed, the primary margin f is set;

[0089] The compensation coefficient m is set according to the processing evaluation value a, and the first-level margin f is corrected according to the compensation coefficient m;

[0090] According to the first-level allowance f, the allowance to be removed of the first-level rough blank is set;

[0091] Set the fast wire cutting parameters according to the excess to be removed;

[0092] Set milling parameters according to the flange parameters of the data transmission waveguide to be processed;

[0093] The first-level rough blank is processed in sequence according to the fast wire cutting parameters and the milling parameters to generate the second-level rough blank.

[0094] Specifically, the first-level allowance refers to the difference between the rough blank of the welded parts after fast-wire cutting and the digital waveguide to be processed. By setting the first-level allowance, subsequent milling and slow-wire processing operations on CNC machine tools are facilitated to ensure that the processing dimensions of the digital waveguide to be processed meet the standards.

[0095] Specifically, when setting the milling parameters, it includes milling two flanges and holes with a CNC machine tool, and processing the flange surface based on the two waveguide openings, ensuring the size of 45.8±0.03, the surface roughness of Ra1.6, and processing the flange shape and holes.

[0096] Specifically, when setting the first-level margin f, it includes:

[0097] If the inner cavity thickness c is within the preset first inner cavity thickness range, the first level margin f is set to the preset first level margin F1, ie f = F1;

[0098] If the inner cavity thickness c is within the preset second inner cavity thickness range, the first level margin f is set to the preset second level margin F2, ie f = F2;

[0099] If the inner cavity thickness c is within the preset third inner cavity thickness range, the first-level margin f is set to the preset third first-level margin F3, that is, f=F3; and F1 <F2<F3。

[0100] Specifically, when setting the compensation coefficient m, it includes:

[0101] If the processing evaluation value a is within the preset first processing evaluation value interval, the compensation coefficient m is set to the preset first compensation coefficient m1, that is, m=m1, and the corrected first margin f=m1*Fi, (i=1,2,3);

[0102] If the processing evaluation value a is within the preset second processing evaluation value interval, the compensation coefficient m is set to the preset second compensation coefficient m2, that is, m=m2, and the corrected first margin f=m2*Fi, (i=1,2,3);

[0103] If the processing evaluation value a is in the preset third processing evaluation value interval, the compensation coefficient m is set to the preset first compensation coefficient m1, that is, m=m1 corrected first margin f=m3*Fi, (i=1,2,3);

[0104] And 1 <m1<m2<m3。

[0105] Specifically, in the above embodiment, the corresponding first-level margin is set according to the inner cavity thickness, and the correction coefficient is set according to the processing evaluation value to dynamically adjust the first-level margin, so that the first-level margin can fully guarantee the subsequent milling and slow wire processing operations, and ensure the accuracy of the digital transmission fluctuation size to be processed.

[0106] In a preferred embodiment of the present application, when setting the secondary processing parameters according to the parameters of the data transmission waveguide to be processed, the following steps are included:

[0107] Generate a processing area of ​​the secondary rough blank according to the structural parameters of the data transmission waveguide to be processed;

[0108] Set the slow wire cutting parameters according to the number of areas to be processed;

[0109] The secondary rough blank is processed according to the slow wire processing parameters to generate a spatial S-bend digital transmission waveguide.

[0110] Specifically, the area to be processed refers to the redundant part of the secondary rough blank compared to the spatial S-bend digital waveguide, which is processed in sequence using a slow wire machine to ensure the accuracy of the processing size, thereby realizing the overall forming of the spatial S-bend digital waveguide.

[0111] According to the first concept of the present application, the Ka-band spatial S-bend digital waveguide to be processed is structurally decomposed into components such as a cover plate, a cavity, and a welding sheet, and then integrally welded in a vacuum furnace and formed by electro-machining to avoid wrinkles, deformation, and fractures inside the waveguide cavity. While ensuring that the produced S-bend digital waveguide meets the requirements of structural dimensions and performance indicators, the production cost is reduced and the processing efficiency of the spatial S-bend digital waveguide is improved.

[0112] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present application. These improvements and substitutions should also be regarded as the scope of protection of the present application.

Claims

1. A method for processing a Ka-band spatial S-bend digital transmission waveguide, characterized in that: include: Obtain the parameters of the data transmission waveguide to be processed, and generate a first-level cover plate, a first-level cavity and a first-level welding sheet according to the decomposition model and the parameters of the data transmission waveguide to be processed; Set fixed parameters according to the parameters of the data transmission waveguide to be processed, assemble the first-level cover plate, the first-level cavity and the first-level welding sheet according to the fixed parameters, and generate the first-level rough blank according to the preset welding parameters; Processing the primary rough blank according to preset primary processing parameters to generate a secondary rough blank, setting secondary processing parameters according to the parameters of the data transmission waveguide to be processed, and processing the secondary rough blank according to the secondary processing parameters to generate a spatial S-bend data transmission waveguide; The setting of fixed parameters includes: Generate the number of S-bends, space occupied volume and inner cavity thickness c of the data transmission waveguide to be processed according to the parameters of the data transmission waveguide to be processed; According to the inner cavity thickness c set pin diameter d; Generate a first reference evaluation value H1 according to the number of S-bends; Generate a second reference evaluation value H2 based on the space occupied volume; Generate a processing evaluation value a according to the first reference evaluation value H1 and the second reference evaluation value H2; a=e1*H1+e2*H2, where e1 is the preset first weight coefficient and e2 is the preset second weight coefficient; According to the processing evaluation value a, the spacing distance b between adjacent pins is set; The pin hole position parameters on the first-level cover plate, the first-level cavity and the first-level welding piece are set according to the pin diameter d and the spacing distance b between adjacent pins; When the first-level rough blank is processed according to the preset first-level processing parameters, it includes: According to the inner cavity thickness c of the data transmission waveguide to be processed, the primary margin f is set; The compensation coefficient m is set according to the processing evaluation value a, and the first-level margin f is corrected according to the compensation coefficient m; According to the first-level margin f, the remaining amount to be removed of the first-level rough blank is set; Set the fast wire cutting parameters according to the excess to be removed; Set milling parameters according to the flange parameters of the data transmission waveguide to be processed; The first-level rough blank is processed in sequence according to the fast wire cutting parameters and the milling parameters to generate a second-level rough blank.

2. The method for processing the Ka-band spatial S-bend digital waveguide according to claim 1, characterized in that: When setting the pin diameter d, include: Preset a first inner cavity thickness interval (C1, C2), a second inner cavity thickness interval (C2, C3) and a third inner cavity thickness interval (C3, C4); If the inner cavity thickness c is within the preset first inner cavity thickness range, the pin diameter d is set to the preset first pin diameter D1, ie d = D1; If the inner cavity thickness c is within the preset second inner cavity thickness range, the pin diameter d is set to the preset second pin diameter D2, ie d = D2; If the inner cavity thickness c is within the preset third inner cavity thickness range, the pin diameter d is set to the preset third pin diameter D3, that is, d=D3; and D1 <D2<D3。 3. The method for processing the Ka-band spatial S-bend digital waveguide according to claim 2, characterized in that: When setting the spacing distance b between adjacent pins, include: Preset a first processing evaluation value interval (A1, A2), a second processing evaluation value interval (A2, A3) and a third processing evaluation value interval (A3, A4); If the processing evaluation value a is within the preset first processing evaluation value interval, the interval distance b is set to the preset first interval distance B1, ie b=B1; If the processing evaluation value a is within the preset second processing evaluation value interval, the interval distance b is set to the preset second interval distance B2, ie b = B2; If the processing evaluation value a is within the preset third processing evaluation value interval, the interval distance b is set to the preset third interval distance B3, that is, b=B3, and B1 <B2<B3。 4. The method for processing the Ka-band spatial S-bend digital waveguide according to claim 3, characterized in that: When setting the first-level margin f, include: If the inner cavity thickness c is within the preset first inner cavity thickness range, the first level margin f is set to the preset first level margin F1, ie f = F1; If the inner cavity thickness c is within the preset second inner cavity thickness range, the first level margin f is set to the preset second level margin F2, ie f = F2; If the inner cavity thickness c is within the preset third inner cavity thickness range, the first-level margin f is set to the preset third first-level margin F3, that is, f=F3; and F1 <F2<F3。 5. The method for processing the Ka-band spatial S-bend digital waveguide according to claim 4, characterized in that: When setting the compensation coefficient m, include: If the processing evaluation value a is within the preset first processing evaluation value interval, the compensation coefficient m is set to the preset first compensation coefficient m1, that is, m=m1, and the corrected first margin f=m1*Fi, i=1,2,3; If the processing evaluation value a is within the preset second processing evaluation value interval, the compensation coefficient m is set to the preset second compensation coefficient m2, that is, m=m2, and the corrected first margin f=m2*Fi, i=1,2,3; If the processing evaluation value a is in the preset third processing evaluation value interval, the compensation coefficient m is set to the preset first compensation coefficient m1, that is, m=m1 corrected first margin f=m3*Fi, i=1,2,3; And 1 <m1<m2<m3。 6. The method for processing the Ka-band spatial S-bend digital waveguide according to claim 1, characterized in that: When setting the secondary processing parameters according to the parameters of the data transmission waveguide to be processed, it includes: Generate a processing area of ​​the secondary rough blank according to the structural parameters of the data transmission waveguide to be processed; Set the slow wire cutting parameters according to the number of areas to be processed; The secondary rough blank is processed according to the slow wire processing parameters to generate a spatial S-bend digital waveguide.

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