A multi-point jet flow topology special-shaped micro-channel radiator for high heat flow field scenarios
By using a multi-point jet topology irregular microchannel structure, combined with the connection between the manifold and the microchannel, the problems of high thermal resistance and high flow resistance of traditional microchannel heat sinks in high heat flux scenarios are solved, achieving efficient heat dissipation and making it suitable for high heat flux density radio frequency electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-05
- Publication Date
- 2026-04-14
AI Technical Summary
In high heat flux scenarios, the cooling medium flow direction of traditional microchannel radiators is parallel to the heat source surface, resulting in increased convection temperature and high thermal resistance in the thermal boundary layer, making it difficult to effectively solve the heat dissipation problem in high heat flux scenarios. Furthermore, the heat exchange effect of the jet channel is limited in the non-jet influence area.
A multi-point jet topology irregular microchannel structure is adopted, which is connected to the microchannel through a manifold. Combined with the jet column, the return-jet chamber and the return column, a multi-point jet effect is formed, which increases the jet influence area, reduces flow resistance and improves heat exchange efficiency.
Significantly reduces flow resistance, expands heat dissipation area, improves heat dissipation efficiency, adapts to high heat flux scenarios, reduces temperature rise of T/R components, and ensures the stability of RF electronic equipment.
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Figure CN118540914B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of radio frequency electronic equipment heat dissipation technology, specifically relating to a multi-point jet topology irregular microchannel heat sink for high heat flux scenarios. Background Technology
[0002] Thermal management remains a significant challenge in current industrial and technological fields, especially in high-heat-flux scenarios such as high-performance radio frequency electronic equipment, aerospace applications, and industrial processing. Effective heat dissipation technology is crucial for maintaining equipment performance and extending its lifespan. Microchannel heat sinks, as an important thermal management solution, have received considerable attention in recent years. Traditional heat dissipation methods often rely on a single heat conduction path, such as heat plates or heat sinks. However, in high-heat-flux scenarios, these traditional methods often fail to provide sufficient heat dissipation efficiency. Therefore, a more efficient heat sink design is needed to meet the ever-increasing heat demands. Microchannel heat sinks utilize the structure of microchannels to guide the heat transfer medium to the vicinity of the heat source, where the flow of liquid or gas carries away the heat, thereby achieving the purpose of heat dissipation.
[0003] However, in high heat flux scenarios, especially where the heat flux density of radio frequency electronic components has reached as high as 500 W / cm², the actual heat flux density is still high. 2 As mentioned above, in traditional microchannel radiators, the cooling medium flow direction is parallel to the heat source surface, such as the invention patent "A Multi-channel Radiator with Coolant Distributor" (Publication No. CN116960083A) and the utility model patent "A Finned Radiator" (Publication No. CN216795614U). This results in a high convective temperature rise due to the thermal boundary layer and significant thermal resistance, making it difficult to solve heat dissipation problems in high heat flux scenarios. To address this, researchers have proposed various improvement schemes, such as using new materials and optimizing the microchannel structure. Among these, when the cooling medium flow direction of the microchannel radiator is perpendicular to the heat source surface, i.e., a jet flow channel configuration is adopted, it can effectively weaken the thermal boundary layer, reduce thermal resistance, and improve heat transfer efficiency. However, jets often lead to increased flow resistance, and the jet configuration can only significantly weaken the thermal boundary layer and achieve a high heat transfer coefficient in the region affected by the jet; the improvement in heat transfer effect is limited in other non-jet-affected areas. Summary of the Invention
[0004] To overcome the shortcomings of the prior art, the present invention aims to provide a multi-point jet topology irregular microchannel heat sink for high heat flux scenarios. By increasing the jet influence area through multi-point jetting, the overall heat exchange efficiency is improved; by using the topology irregular microchannel structure, the flow resistance of the heat dissipation channel is significantly reduced; it can meet the heat dissipation requirements of high heat flux density and has the characteristics of small size, high heat dissipation efficiency, and low flow resistance.
[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:
[0006] A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios includes a solid domain 1 of the heat sink body and a fluid domain 2 of the heat sink cavity.
[0007] The radiator cavity fluid domain 2 includes an inlet manifold 4, an outlet manifold 5, an upstream topological microchannel 8, a midstream topological microchannel 9, and a downstream topological microchannel 10. The inlet manifold 4 and the upstream topological microchannel 8 are connected by a first jet column 11, the upstream topological microchannel 8 and the midstream topological microchannel 9 are connected by a first return-jet chamber 12, the midstream topological microchannel 9 and the downstream topological microchannel 10 are connected by a second return-jet chamber 13, and the downstream topological microchannel 10 and the outlet manifold 5 are connected by a first return column 14. The heating surface is located above the topological microchannels, the inlet manifold 4 is located below the upstream topological microchannel 8, and the outlet manifold 5 is located below the downstream topological microchannel 10.
[0008] One end of the inlet manifold 4 is a cooling medium inlet 6. The height of the inlet manifold 4 is 3mm and the width is 5mm.
[0009] The upstream topological irregular microchannel 8 includes two first sub-heat dissipation units that are symmetrical from left to right. The internal flow channel exhibits the irregular shape of leaf veins. It includes two rows of first jet holes and one row of first return holes. The first jet holes are connected to the inlet manifold 4 through the first jet column 11, and the first return holes are connected to the midstream topological irregular microchannel 9 through the first return-jet chamber 12. The flow channel depth of the upstream topological irregular microchannel 8 is 0.5 mm, and the minimum flow channel width is 0.5 mm.
[0010] The midstream topological irregular microchannel 9 includes two second sub-heat dissipation units that are symmetrically arranged on the left and right sides. The internal flow channel exhibits an irregular shape resembling leaf veins. It includes a total of two rows of second jet holes and one row of second return holes. The second jet holes are connected to the upstream topological irregular microchannel 8 through the first return-jet chamber 12, and the second return holes are connected to the downstream topological irregular microchannel 10 through the second return-jet chamber 13. The flow channel depth of the midstream topological irregular microchannel 9 is 0.5 mm, and the minimum flow channel width is 0.5 mm.
[0011] The downstream topological irregular microchannel 10 includes two symmetrical third sub-heat dissipation units. The internal flow channel exhibits the irregular shape of leaf veins. It includes a row of third jet holes and a row of third return holes. The third jet holes are connected to the midstream topological irregular microchannel 9 through the second return-jet chamber 13. The third return holes are connected to the outlet manifold 5 through the first return column 14. The flow channel depth of the downstream topological irregular microchannel 10 is 0.5 mm, and the minimum flow channel width is 0.5 mm.
[0012] One end of the outlet manifold 5 is the cooling medium outlet 7. The height of the outlet manifold 5 is 3mm and the width is 5mm.
[0013] The first jet column 11 includes 12 fourth circular jet holes, which are symmetrically distributed from left to right, and the diameter of the fourth circular jet holes is 0.8 mm.
[0014] The first reflux-jet chamber 12 includes two first square reflux holes and four first square jet holes, which are symmetrically distributed from left to right. The length of the first square reflux hole is 2.3 mm and the width is 0.6 mm. The length of the first square jet hole is 2.3 mm and the width is 0.4 mm.
[0015] The second reflux-jet chamber 13 includes two second square reflux holes and two second square jet holes, which are symmetrically distributed from left to right. The length of the second square reflux hole is 2.3 mm and the width is 0.6 mm. The length of the second square jet hole is 2.3 mm and the width is 0.4 mm.
[0016] The first reflux column 14 includes a total of 6 third circular reflux holes, which are symmetrically distributed from left to right, and the diameter of the third circular reflux holes is 0.8 mm.
[0017] The multi-point jet topology irregular microchannel heat sink is formed by metal 3D printing process and serves as a heat dissipation unit of the large array heat sink. Each heat dissipation unit is connected through the inlet manifold 4 and the outlet manifold 5.
[0018] The working fluid flow path of the multi-point jet topology irregular microchannel radiator is as follows: the working fluid enters the inlet manifold 4 from the cooling working fluid inlet 6, enters the upstream topology irregular microchannel 8 through the first jet column 11, enters the midstream topology irregular microchannel 9 through the first return-jet chamber 12, enters the downstream topology irregular microchannel 10 through the second return-jet chamber 13, enters the outlet manifold 5 through the first return column 14, and finally flows out through the cooling working fluid outlet 7.
[0019] The multi-point jet topology irregular microchannel heat sink is 27mm long, 27mm wide, and 6.5mm thick. The inlet manifold 4 and outlet manifold 5 are 1mm away from the lower surface of the heat sink. The upstream topology irregular microchannel 8, the midstream topology irregular microchannel 9, and the downstream topology irregular microchannel 10 are located below the heating surface and are 1mm away from the heating surface.
[0020] Compared with the prior art, the beneficial effects of the present invention are:
[0021] This invention employs a manifold and microchannel connection. The manifold enhances the expandability and connectivity of the heat sink, allowing it to function as a heat dissipation unit within a large-area heat sink. The use of a topologically irregular microchannel reduces flow resistance, thereby minimizing pressure drop. The manifold's location below the topologically irregular microchannel improves the compactness of the heat sink's layout and increases space utilization.
[0022] This invention employs a jet column, a return-jet chamber, and a return column-connected irregular microchannel topology to enhance the jet effect of the heat sink and improve heat transfer efficiency. The multi-point jet scheme increases the flow area dominated by the jet flow pattern. The combination of multi-point jet and irregular microchannel structure expands the heat dissipation area, reduces flow resistance, and improves the heat conduction path, enabling the heat sink to better adapt to high heat flux scenarios and provide stronger heat dissipation performance. For high heat flux RF electronic devices, it can significantly reduce the temperature rise of the T / R component, which is beneficial to the realization of antenna array temperature uniformity and ensures the stability of T / R component operation, making it applicable in the field of RF electronics. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the heat sink structure of the present invention.
[0024] Figure 2 This is a schematic diagram of the manifold structure of the present invention.
[0025] Figure 3 This is a schematic diagram of the topologically irregular microchannel structure of the present invention.
[0026] Figure 4 This is a schematic diagram of the manifold and topologically irregular microchannel connection structure of the present invention.
[0027] Figure 5 This is a schematic diagram of the working fluid flow path in the radiator of the present invention. Detailed Implementation
[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0029] like Figure 1 As shown, a multi-point jet topology irregular microchannel heat sink for high heat flux scenarios includes a solid domain 1 of the heat sink body and a fluid domain 2 of the heat sink cavity. The side view 3 of the fluid domain of the heat sink cavity shows the spatial relationship of the internal flow channels.
[0030] like Figures 2-4 As shown, the radiator cavity fluid domain 2 includes an inlet manifold 4, an outlet manifold 5, a cooling medium inlet 6, a cooling medium outlet 7, an upstream topological irregular microchannel 8, a midstream topological irregular microchannel 9, and a downstream topological irregular microchannel 10.
[0031] The inlet manifold 4 and the upstream irregular microchannel 8 are connected by the first jet column 11. The upstream irregular microchannel 8 and the midstream irregular microchannel 9 are connected by the first reflux-jet chamber 12. The midstream irregular microchannel 9 and the downstream irregular microchannel 10 are connected by the second reflux-jet chamber 13. The downstream irregular microchannel 10 and the outlet manifold 5 are connected by the first reflux column 14. The heating surface is located above the irregular microchannel, the inlet manifold 4 is located below the upstream irregular microchannel 8, and the outlet manifold 5 is located below the downstream irregular microchannel 10.
[0032] like Figures 2-4 As shown, one end of the inlet manifold 4 is a cooling medium inlet 6, and the height of the inlet manifold 4 is 3mm and the width is 5mm.
[0033] like Figures 2-4 As shown, the upstream topological irregular microchannel 8 includes two first sub-heat dissipation units that are symmetrically arranged on the left and right sides. The internal flow channel exhibits the irregular shape of leaf veins. It includes a total of two rows of first jet holes and one row of first return holes. The first jet holes are connected to the inlet manifold 4 through the first jet column 11, and the first return holes are connected to the midstream topological irregular microchannel 9 through the first return-jet chamber 12. The flow channel depth of the upstream topological irregular microchannel 8 is 0.5 mm, and the minimum flow channel width is 0.5 mm.
[0034] like Figures 2-4 As shown, the midstream topological irregular microchannel 9 includes two second sub-heat dissipation units that are symmetrically arranged on the left and right. The internal flow channel exhibits an irregular shape resembling leaf veins. It includes a total of two rows of second jet holes and one row of second return holes. The second jet holes are connected to the upstream topological irregular microchannel 8 through the first return-jet chamber 12, and the second return holes are connected to the downstream topological irregular microchannel 10 through the second return-jet chamber 13. The flow channel depth of the midstream topological irregular microchannel 9 is 0.5 mm, and the minimum flow channel width is 0.5 mm.
[0035] like Figures 2-4 As shown, the downstream topological irregular microchannel 10 includes two symmetrical third sub-heat dissipation units. The internal flow channel exhibits an irregular shape resembling leaf veins. It includes a row of third jet holes and a row of third return holes. The third jet holes are connected to the midstream topological irregular microchannel 9 through the second return-jet chamber 13, and the third return holes are connected to the outlet manifold 5 through the first return column 14. The flow channel depth of the downstream topological irregular microchannel 10 is 0.5 mm, and the minimum flow channel width is 0.5 mm.
[0036] like Figure 2As shown, the upstream irregular microchannel 8, midstream irregular microchannel 9, and downstream irregular microchannel 10 are generated by a topology optimization algorithm. The specific steps include: 1) determining the design domain size and boundary conditions; 2) determining the layout of the multi-point jet and giving constraints; 3) solving the microchannel flow field and temperature field; 4) calculating the microchannel structure sensitivity; and 5) updating the microchannel structure and judging convergence. The microchannel structure is generated by using a topology optimization algorithm to reduce the flow resistance caused by the jet effect and reduce the power consumption of the radiator pump.
[0037] like Figures 2-4 As shown, one end of the outlet manifold 5 is the cooling medium outlet 7, and the height of the outlet manifold 5 is 3mm and the width is 5mm.
[0038] like Figure 4 As shown, the first jet column 11 includes 12 fourth circular jet holes, which are symmetrically distributed from left to right, and the diameter of the fourth circular jet holes is 0.8 mm.
[0039] like Figure 4 As shown, the first reflux-jet chamber 12 includes two first square reflux holes and four first square jet holes, both of which are symmetrically distributed from left to right; the length of the first square reflux hole is 2.3 mm and the width is 0.6 mm; the length of the first square jet hole is 2.3 mm and the width is 0.4 mm.
[0040] like Figure 4 As shown, the second reflux-jet chamber 13 includes two second square reflux holes and two second square jet holes, which are symmetrically distributed from left to right; the length of the second square reflux hole is 2.3 mm and the width is 0.6 mm; the length of the second square jet hole is 2.3 mm and the width is 0.4 mm.
[0041] like Figure 4 As shown, the first reflux column 14 includes a total of 6 third circular reflux holes, which are symmetrically distributed from left to right, and the diameter of the third circular reflux holes is 0.8 mm.
[0042] like Figure 4 As shown, the first jet column 11, the first return-jet chamber 12, the second return-jet chamber 13, and the first return column 14 can effectively thin the thermal boundary layer by utilizing the jet effect, and the multi-point jet heat dissipation method can expand the jet influence area and reduce the flow resistance generated by the jet, aiming to improve the heat exchange efficiency of the radiator.
[0043] like Figures 1-2As shown, the multi-point jet topology irregular microchannel heat sink is formed by metal 3D printing process. This heat sink can also be used as a heat dissipation unit of a large array heat sink. Each heat dissipation unit is connected through an inlet manifold 4 and an outlet manifold 5.
[0044] like Figure 5 As shown, the top view 15 and side view 16 of the solid domain of the radiator show the working fluid flow path of the radiator. The working fluid flow path of the multi-point jet topology microchannel radiator is as follows: the working fluid enters the inlet manifold 4 from the cooling working fluid inlet 6, enters the upstream topology microchannel 8 through the first jet column 11, then enters the midstream topology microchannel 9 through the first return-jet chamber 12, then enters the downstream topology microchannel 10 through the second return-jet chamber 13, then enters the outlet manifold 5 through the first return column 14, and finally flows out through the cooling working fluid outlet 7.
[0045] like Figure 5 As shown, the top view 15 and side view 16 of the solid domain of the radiator show the dimensional relationship of the radiator. The multi-point jet topology irregular microchannel radiator is 27mm long, 27mm wide, and has an overall thickness of 6.5mm. The inlet manifold 4 and outlet manifold 5 are 1mm away from the lower surface of the radiator. The upstream topology irregular microchannel 8, the midstream topology irregular microchannel 9, and the downstream topology irregular microchannel 10 are located below the heating surface and are 1mm away from the heating surface.
[0046] Numerical experimental analysis shows that the structure in this embodiment has a heating resistance power of 500W / cm. 2 At that time, the temperature rise of the chip case temperature compared to the liquid supply temperature is 60°C. This temperature rise includes the cold plate convection temperature rise, the thermal expansion temperature rise, and the contact temperature rise.
[0047] Although the invention has been described above with reference to specific embodiments, those skilled in the art will understand that many modifications can be made to the configurations and details disclosed herein within the principles and scope of the invention. The scope of protection of the invention is determined by the appended claims, which are intended to cover all modifications included in the literal meaning or scope of equivalents of the technical features in the claims.
Claims
1. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios, characterized in that, The radiator includes a solid domain (1) and a fluid domain (2) within the radiator cavity. The fluid domain (2) within the radiator cavity includes an inlet manifold (4), an outlet manifold (5), an upstream topological microchannel (8), a midstream topological microchannel (9), and a downstream topological microchannel (10). The inlet manifold (4) and the upstream topological microchannel (8) are connected by a first jet column (11), and the upstream topological microchannel (8) and the midstream topological microchannel (9) are connected by a second jet column (10). A return-jet chamber (12) is connected, the midstream topological irregular microchannel (9) and the downstream topological irregular microchannel (10) are connected through a second return-jet chamber (13), and the downstream topological irregular microchannel (10) and the outlet manifold (5) are connected through a first return column (14); the heating surface is located above the topological irregular microchannel, the inlet manifold (4) is located below the upstream topological irregular microchannel (8), and the outlet manifold (5) is located below the downstream topological irregular microchannel (10); The upstream topological irregular microchannel (8) includes two first sub-heat dissipation units that are symmetrical on the left and right. The internal flow channel presents the irregular feature of leaf veins. It includes two rows of first jet holes and one row of first return holes. The first jet holes are connected to the inlet manifold (4) through the first jet column (11), and the first return holes are connected to the midstream topological irregular microchannel (9) through the first return-jet chamber (12). The midstream topological irregular microchannel (9) includes two second sub-heat dissipation units that are symmetrical on the left and right. The internal flow channel presents the irregular feature of leaf veins. It includes two rows of second jet holes and one row of second return holes. The second jet holes are connected to the upstream topological irregular microchannel (8) through the first return-jet chamber (12), and the second return holes are connected to the downstream topological irregular microchannel (10) through the second return-jet chamber (13). The downstream topological irregular microchannel (10) includes two third sub-heat dissipation units that are symmetrical on the left and right. The internal flow channel presents the irregular feature of leaf veins. It includes a row of third jet holes and a row of third return holes. The third jet holes are connected to the midstream topological irregular microchannel (9) through the second return-jet chamber (13). The third return holes are connected to the outlet manifold (5) through the return column (14). The upstream topological irregular microchannel (8), midstream topological irregular microchannel (9), and downstream topological irregular microchannel (10) are generated by a topology optimization algorithm. The specific steps include: 1) determining the design domain size and boundary conditions; 2) determining the layout of the multi-point jet and giving constraints; 3) solving the microchannel flow field and temperature field; 4) calculating the microchannel structure sensitivity; 5) updating the microchannel structure and judging convergence. The microchannel structure is generated by the topology optimization algorithm to reduce the flow resistance caused by the jet effect and reduce the power consumption of the radiator pump.
2. The multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The inlet manifold (4) has a cooling medium inlet (6) at one end, and the height of the inlet manifold (4) is 3 mm and the width is 5 mm. The outlet manifold (5) has a cooling medium outlet (7) at one end, and the height of the outlet manifold (5) is 3 mm and the width is 5 mm.
3. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 2, characterized in that, The working fluid flow path of the multi-point jet topology microchannel radiator is as follows: the working fluid enters the inlet manifold (4) through the cooling working fluid inlet (6), enters the upstream topology microchannel (8) through the first jet column (11), then enters the midstream topology microchannel (9) through the first return-jet chamber (12), then enters the downstream topology microchannel (10) through the second return-jet chamber (13), then enters the outlet manifold (5) through the first return column (14), and finally flows out through the cooling working fluid outlet (7).
4. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The upstream topological irregular microchannel (8) has a channel depth of 0.5 mm and a minimum channel width of 0.5 mm.
5. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The midstream topological irregular microchannel (9) has a flow channel depth of 0.5 mm and a minimum flow channel width of 0.5 mm.
6. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The downstream topological irregular microchannel (10) has a flow channel depth of 0.5 mm and a minimum flow channel width of 0.5 mm.
7. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The first jet column (11) includes 12 fourth circular jet holes, which are symmetrically distributed on the left and right sides, and the diameter of the fourth circular jet holes is 0.8 mm; the first return column (14) includes 6 third circular return holes, which are symmetrically distributed on the left and right sides, and the diameter of the third circular return holes is 0.8 mm.
8. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The first reflux-jet chamber (12) includes two first square reflux holes and four first square jet holes. The first square reflux holes and the first square jet holes are symmetrically distributed from left to right. The length of the first square reflux hole is 2.3 mm and the width is 0.6 mm. The length of the first square jet hole is 2.3 mm and the width is 0.4 mm. The second reflux-jet chamber (13) includes two second square reflux holes and two second square jet holes. The second square reflux holes and the second square jet holes are symmetrically distributed from left to right. The length of the second square reflux hole is 2.3 mm and the width is 0.6 mm. The length of the second square jet hole is 2.3 mm and the width is 0.4 mm.
9. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The multi-point jet topology irregular microchannel heat sink is formed by metal 3D printing process and serves as a heat dissipation unit of the large array heat sink. Each heat dissipation unit is connected by an inlet manifold (4) and an outlet manifold (5).
10. A multi-point jet topology irregular microchannel heat sink for high heat flux scenarios according to claim 1, characterized in that, The multi-point jet topology irregular microchannel heat sink is 27mm long, 27mm wide, and 6.5mm thick. The inlet manifold (4) and outlet manifold (5) are 1mm away from the lower surface of the heat sink. The upstream topology irregular microchannel (8), the midstream topology irregular microchannel (9), and the downstream topology irregular microchannel (10) are located below the heating surface and are 1mm away from the heating surface.
Citation Information
Patent Citations
Multi-channel radiator with cooling liquid distributor
CN116960083A
Fin radiator
CN216795614U
Jet flow-cross flow combined immersed heat dissipation device and method
CN113543588A