Inductor and method of manufacturing the same, filter, electronic device

By forming a coil structure on a dielectric substrate and embedding a magnetic core, the problems of large area occupation and severe mutual inductance of planar spiral inductors are solved, thus achieving miniaturization and performance improvement of inductors.

CN118556274BActive Publication Date: 2026-01-16BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202280001938.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-29
Publication Date
2026-01-16
Estimated Expiration
2042-06-29

AI Technical Summary

Technical Problem

With the miniaturization of electronic devices, the coil size of planar spiral inductors has decreased, resulting in a large area occupied. They cannot have a magnetic core structure, and when used in combination with other devices, the trace distance is large, leading to serious mutual inductance.

Method used

The first and second substructures on the dielectric substrate are connected to form a coil structure by connecting electrodes, and a magnetic core is embedded in the slot. The magnetic core is used to improve the inductance performance, while the substructures are isolated by an insulating layer to reduce the occupied area.

Benefits of technology

This achieves a multiple increase in inductance, reduces device package size, facilitates device miniaturization, and lowers manufacturing costs.

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Abstract

The present disclosure provides an inductor and a preparation method thereof, a filter and an electronic device, and belongs to the technical field of electronic components. The inductor comprises: a first dielectric substrate (10) comprising a first surface and a second surface arranged oppositely along the thickness direction thereof, the first dielectric substrate (10) having a first connecting via (11) penetrating through the thickness direction thereof, and a first slot portion (12) penetrating through at least part of the first dielectric substrate (10); a first substructure (21) arranged on the first surface; a second substructure (22) arranged on the second surface; a first connecting electrode (25) arranged in the first connecting via (11) and sequentially connecting the first substructure (21) and the second substructure (22) to form a coil structure of the inductor; and a magnetic core (3) arranged in the first slot portion (12), wherein the magnetic core (3) is arranged in insulation with the first substructure (21) and the second substructure (22) and located in the coil structure.
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Citation Information

Patent Citations

  • Semiconductor structure and forming method thereof

    CN105336842A

  • Semiconductor structure and manufacturing method thereof

    CN112864136A

  • MEMS solenoid inductor and manufacturing method therefor

    WO2020087972A1