Anti-splash zinc alloy precision die casting electroplating device and method

By adding a filter slot to the electroplating device of zinc alloy precision die -casting, the circulation flow of the electroplating solution is used instead of the traditional mixing method, which solves the problem of splashing the electroplating fluid, realizes the uniformity and filtration effect of the electroplating fluid, improved the electroplating effect and safety sex.

CN118563395BActive Publication Date: 2025-01-28HUANXUN PRECISION PROD (NANTONG) CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202411031266.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-30
Publication Date
2025-01-28
Estimated Expiration
2044-07-30

AI Technical Summary

Technical Problem

Stirring during traditional electroplating can easily cause electroplating solution to splash, posing safety hazards.

Method used

A kind of anti -splattered zinc alloy precision die -casting device is designed. By adding a filter slot under the plating box, the circular flow of the electroplating fluid instead of the mechanical stirring and bubble stirring to avoid splashing. At the same time, the circulating flow is used to reduce impurities.

Benefits of technology

Effectively avoid splashing of plating fluid, ensure the uniformity of plating fluid, reduce impurities, improve electroplating effects, and improve safety.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN118563395B_ABST
    Figure CN118563395B_ABST
Patent Text Reader

Abstract

The present invention relates to the technical field related to electroplating, and discloses an anti-splash zinc alloy precision die-casting electroplating device and method. By adding a filter tank under the electroplating box, a water pump is used to drive the circulation of the electroplating solution, so that the flow of the electroplating solution can be used to replace mechanical stirring and bubble stirring, while ensuring the uniformity of the electroplating solution and avoiding the splash of the electroplating solution. At the same time, the circulation of the electroplating solution can also be used to filter the electroplating solution, reduce impurities in the electroplating solution, and improve the electroplating effect.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of electroplating, and in particular to a splash-proof zinc alloy precision die-casting electroplating device and method. Background Art

[0002] Electroplating is a common surface treatment method for zinc alloy precision die castings, aiming to improve their appearance, corrosion resistance and wear resistance.

[0003] Since the chemical components in the electroplating solution may be stratified or uneven during use, the electrolyte needs to be continuously stirred during the electroplating process of zinc alloy die-castings. For example, Chinese patent CN108355530B discloses an electroplating solution stirring device, which breaks these stratifications by stirring to keep the chemical components in the electroplating solution evenly distributed. This ensures that the entire die-casting surface is fully plated, avoids problems such as missed plating or uneven plating thickness, and ultimately obtains high-quality electroplating results. However, during the stirring process, whether it is mechanical stirring or aeration stirring, it is easy to cause the electroplating solution to splash, which may cause safety hazards. Summary of the invention

[0004] The object of the present invention is to provide a splash-proof zinc alloy precision die-casting electroplating device and method to solve the problem that stirring in the current traditional electroplating process easily causes splashing of the electroplating solution as mentioned in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: an anti-splash zinc alloy precision die casting electroplating device, comprising an electroplating apparatus, a plating box is arranged on one side of the electroplating apparatus, a filter tank is arranged below the electroplating box, and a power supply is arranged on one side of the electroplating box;

[0006] A first anode interface is provided above the power supply, the first anode interface is connected to a first anode hanging rod, a second anode interface is provided above the power supply, the second anode interface is connected to a second anode hanging rod, a power connection sleeve is provided above the power supply, the power connection sleeve is fixedly connected to the cathode of the power supply, the power connection sleeve is slidably connected to the cathode hanging rod, a composite sleeve is fixedly connected above the electroplating apparatus, the cathode hanging rod penetrates the composite sleeve, and one end of the cathode hanging rod is connected to a reciprocating drive mechanism;

[0007] The electroplating box is provided with an overflow pipe for electroplating liquid, the overflow pipe for electroplating liquid is provided with a downpipe, the lower end of the downpipe is inserted into the filter tank, the filter tank is provided with a sedimentation bin, the lower end of the downpipe is located in the sedimentation bin, a drawer-type filter is provided on one side of the sedimentation bin, filter paper is provided in the drawer-type filter, a heating bin is provided on one side of the drawer-type filter, an ion adsorption bin is provided on one side of the heating bin, a supply bin is provided on one side of the ion adsorption bin, a pump is provided in the supply bin, and a water outlet elbow is connected to the upper end of the pump.

[0008] Furthermore, a first anode plate is hung on the first anode hanging rod, a second anode plate is hung on the second anode hanging rod, and a zinc alloy precision die-casting to be electroplated is hung on the cathode hanging rod.

[0009] Furthermore, the first anode plate and the second anode plate are respectively located on both sides of the cathode hanging rod.

[0010] Furthermore, the first anode hanging rod, the second anode hanging rod and the cathode hanging rod are all made of copper, and the material of the first anode plate and the second anode plate is the same as the plating cation.

[0011] Furthermore, the reciprocating drive mechanism includes a servo motor, which is installed on the top of the electroplating instrument. An eccentric rod is fixedly connected to the output shaft of the servo motor. A connecting slider is provided at the end of the eccentric rod. The connecting slider is slidably connected to a sliding guide rail, and the cathode hanging rod is fixedly connected to the sliding guide rail.

[0012] Furthermore, a foam overflow trough is provided at the upper end of the electroplating liquid overflow pipe, a sedimentation suction trough is provided at the lower end of the electroplating liquid overflow pipe, and the upper end inlet of the down pipe is flush with the foam overflow trough.

[0013] Furthermore, a water dividing plate is arranged on the drawer-type filter, water leakage holes are opened on the bottom of the drawer-type filter and the water dividing plate, and the filter paper is laid under the water dividing plate.

[0014] Furthermore, a steam heater is provided in the heating chamber, and activated carbon is provided in both the heating chamber and the ion adsorption chamber.

[0015] The present invention provides another technical solution: a method for electroplating a splash-proof zinc alloy precision die casting, comprising the following steps:

[0016] S1. Wax removal: Soak the die casting in 2.5%-3% volume fraction wax removal water for 10-20 minutes, and then clean it in an ultrasonic cleaning tank for 10-20 minutes;

[0017] S2. Degreasing: Use 70-80g / L alkaline detergent and 20-30g / L surfactant for 5-10min, and keep the temperature between 60-95°C;

[0018] S3. Pre-plating closed protective layer: a layer of alkaline zinc-nickel alloy is plated on the surface of the zinc alloy die casting;

[0019] S4. Electroplating main coating: Electroplating the main coating outside the closed protective layer according to the current electroplating process.

[0020] Furthermore, the plating solution in S3 is formulated as 6-8 g / L zinc, 1-2 g / L nickel, 100-150 g / L sodium hydroxide, 100-150 mL / L auxiliary agent, 5-10 mL / L opener, and 5-10 mL / L brightener. The plating tank temperature is maintained between 20-25°C, and the cathode current density is 1-2 A / dm 2 , nickel plate is used as anode, anode current density is 2-5A / dm 2 , the cathode moves 4-6m / min, and the thickness of the zinc-nickel alloy coating is 10-15μm.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The present invention discloses an anti-splash zinc alloy precision die-casting electroplating device. By adding a filter tank under the electroplating box, a water pump is used to drive the electroplating solution to circulate, so that the flow of the electroplating solution can replace mechanical stirring and bubble stirring, thereby ensuring the uniformity of the electroplating solution and avoiding the splash of the electroplating solution. At the same time, the circulation of the electroplating solution can be used to filter the electroplating solution, reduce impurities in the electroplating solution, and improve the electroplating effect.

[0023] 2. The present invention discloses a method for electroplating a splash-proof zinc alloy precision die-casting, which comprises the steps of plating a layer of alkaline zinc-nickel alloy on the surface of the zinc alloy die-casting before electroplating the main plating layer, and utilizing the high dispersion and covering ability of the alkaline zinc-nickel alloy to effectively seal the pores on the surface of the die-casting and improve its corrosion resistance, thereby achieving better bonding between the plating layer and the substrate and preventing chemical reaction between the plating layer and the zinc alloy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the appearance structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the electroplating box of the present invention;

[0026] Figure 3 This is a schematic diagram of the filter tank structure of the present invention;

[0027] Figure 4 This is a schematic diagram of the internal structure of the filter tank of the present invention;

[0028] Figure 5 This is a schematic diagram of the cross-sectional structure of the filter tank of the present invention;

[0029] Figure 6 This is a schematic diagram of the structure of the drawer-type filter of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the reciprocating drive mechanism of the present invention.

[0031] Numbers in the figure: 1, electroplating apparatus; 2, electroplating box; 201, splash cover; 3, filter tank; 4, power supply; 401, first anode interface; 402, second anode interface; 403, power connection sleeve; 5, first anode hanging rod; 6, first anode plate; 7, second anode hanging rod; 8, second anode plate; 9, cathode hanging rod; 10, composite sliding sleeve; 11, reciprocating drive mechanism; 1101, servo motor; 1102, eccentric rod; 1103 , connecting slider; 1104, sliding guide rail; 12, electroplating solution overflow pipe; 1201, foam overflow trough; 1202, sedimentation suction trough; 13, sewer pipe; 14, sedimentation bin; 15, drawer filter; 1501, water distribution plate; 1502, leakage hole; 16, filter paper; 17, heating bin; 18, activated carbon; 19, steam heater; 20, ion adsorption bin; 21, water supply bin; 22, pump; 23, water outlet elbow. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings.

[0034] Combination Figure 1 - Figure 7 , a splash-proof zinc alloy precision die-casting electroplating device, comprising an electroplating apparatus 1, an electroplating box 2 is arranged on one side of the electroplating apparatus 1, a filter tank 3 is arranged below the electroplating box 2, and a power supply 4 for providing a stable current is arranged on one side of the electroplating box 2;

[0035] A first anode interface 401 is arranged above the power supply 4, the first anode interface 401 is connected to a first anode hanging rod 5, a first anode plate 6 is hung on the first anode hanging rod 5, a second anode interface 402 is arranged above the power supply 4, the second anode interface 402 is connected to a second anode hanging rod 7, a second anode plate 8 is hung on the second anode hanging rod 7, an electricity connecting sleeve 403 is arranged above the power supply 4, the electricity connecting sleeve 403 is fixedly connected to the cathode of the power supply 4, the electricity connecting sleeve 403 is slidably connected to a cathode hanging rod 9, a zinc alloy precision die-casting to be electroplated is hung on the cathode hanging rod 9, in this way, the first anode plate 6 and the second anode plate 8 are connected to positive electricity, and the zinc alloy precision die-casting is hung on the cathode hanging rod 9 to connect negative electricity, so that a current path can be formed for electroplating, and the first anode plate 6 and the second anode plate 8 are respectively located on both sides of the cathode hanging rod 9, which can increase the uniformity of electroplating.

[0036] A composite sliding sleeve 10 is fixedly connected to the top of the electroplating apparatus 1, and a cathode hanging rod 9 passes through the composite sliding sleeve 10. One end of the cathode hanging rod 9 is connected to a reciprocating drive mechanism 11. The reciprocating drive mechanism 11 includes a servo motor 1101. The servo motor 1101 is installed on the top of the electroplating apparatus 1. An eccentric rod 1102 is fixedly connected to the output shaft of the servo motor 1101. A connecting slider 1103 is provided at the end of the eccentric rod 1102. The connecting slider 1103 is slidably connected to a sliding guide rail 1104. The cathode hanging rod 9 It is fixedly connected to the sliding guide rail 1104, so that the servo motor 1101 can drive the eccentric rod 1102 to rotate when it is started. Since the eccentric rod 1102 is slidably connected to the sliding guide rail 1104 through the connecting slider 1103, and the cathode hanging rod 9 can only move linearly under the restriction of the power-connecting sliding sleeve 403 and the composite sliding sleeve 10, the eccentric rod 1102 can drive the sliding guide rail 1104 and the cathode hanging rod 9 to continuously reciprocate linearly along the direction of the power-connecting sliding sleeve 403 and the composite sliding sleeve 10.

[0037] A plating liquid overflow pipe 12 is provided in the electroplating box 2, and a downpipe 13 is provided in the electroplating liquid overflow pipe 12. The lower end of the downpipe 13 is inserted into the filter tank 3. A sedimentation bin 14 is provided in the filter tank 3. The lower end of the downpipe 13 is located in the sedimentation bin 14, so that most impurities can be precipitated in the sedimentation bin 14 to avoid rapid clogging of the filter paper 16. A drawer-type filter 15 is provided on one side of the sedimentation bin 14. The filter paper 16 is provided in the drawer-type filter 15. A heating bin 17 is provided on one side of the drawer-type filter 15. An ion adsorption bin 20 is provided on one side of the heating bin 17. An upper water bin 21 is provided on one side of the ion adsorption bin 20. A pump 22 is provided in the upper water bin 21. The upper end of the pump 22 is connected to a water outlet elbow 23. The water outlet elbow 23 discharges water horizontally, so that the plating liquid can rotate and circulate in the electroplating box 2, making the plating liquid more uniform.

[0038] A water dividing plate 1501 is provided on the drawer-type filter 15, and leakage holes 1502 are provided at the bottom of the drawer-type filter 15 and on the water dividing plate 1501. The filter paper 16 is laid under the water dividing plate 1501, so that the plating liquid overflowing from the sedimentation bin 14 will flow evenly onto the filter paper 16 through the leakage holes 1502 on the water dividing plate 1501, and after being filtered, it will flow out evenly through the leakage holes 1502 at the bottom of the drawer-type filter 15.

[0039] Specifically, a foam overflow groove 1201 is provided at the upper end of the electroplating liquid overflow pipe 12, so that the floating foam can overflow from the foam overflow groove 1201 and flow into the sewer pipe 13. The upper inlet of the sewer pipe 13 is flush with the foam overflow groove 1201, so that the foam can enter the sewer pipe 13 conveniently. A sedimentation suction groove 1202 is provided at the lower end of the electroplating liquid overflow pipe 12, so that the sediment can be sucked into the electroplating liquid overflow pipe 12 and flow into the sewer pipe 13 under the action of negative pressure.

[0040] Specifically, the first anode hanging rod 5, the second anode hanging rod 7 and the cathode hanging rod 9 are all made of copper, which has good conductivity and can reduce current loss. The material of the first anode plate 6 and the second anode plate 8 is the same as the plating cation to avoid contaminating the electroplating solution.

[0041] Specifically, a steam heater 19 is provided in the heating chamber 17 to heat the electroplating solution to keep it at a constant temperature. Activated carbon 18 is provided in both the heating chamber 17 and the ion adsorption chamber 20 to adsorb metal ion impurities.

[0042] Specifically, a liquid level sensor is also provided in the upper water tank 21 to monitor the liquid level to prevent the liquid level from being too high or too low, causing overflow or dry burning of the pump 22. Due to the overflow structure adopted, the pump 22 continuously pumps the electroplating liquid in the upper water tank 21 upward into the electroplating box 2, so the liquid level of the electroplating box 2 is always kept stable, and it is sufficient to monitor the liquid level of the upper water tank 21.

[0043] A method for electroplating a splash-proof zinc alloy precision die casting comprises the following steps:

[0044] 1. Wax removal: Since zinc alloy die castings are usually coated with a layer of wax during the manufacturing process to protect their surface from oxidation or other contaminants. However, this layer of wax will hinder the contact between the plating solution and the surface of the die casting, thereby affecting the uniformity and adhesion of the electroplating. Therefore, the wax removal treatment can ensure the cleanliness of the surface of the die casting, which helps to enhance the adhesion between the electroplating layer and the substrate, so that the electroplating solution can fully contact and evenly adhere to the surface, thereby producing a uniform and dense electroplating layer. If the wax removal treatment is not performed, the electroplating solution may not be able to evenly cover the surface, resulting in defects or unevenness in the electroplating layer. The wax layer may also peel off during the electroplating process or affect the adhesion of the electroplating coating, resulting in the electroplating layer being weak or easy to fall off. Therefore, the wax removal treatment can ensure the cleanliness of the die casting surface, enhance the adhesion between the electroplating layer and the substrate, and improve the uniformity and quality of the electroplating effect, thereby obtaining high-quality electroplated products. The wax removal treatment mainly includes two steps: chemical wax removal and ultrasonic wax removal.

[0045] Chemical dewaxing solutions are usually alkaline or acidic and contain organic solvents, surfactants and other dewaxing agents. These chemicals can effectively dissolve and remove wax, grease and other organic matter from the surface of die castings. By soaking and stirring the die castings in the solution, you can ensure that the dewaxing agent fully contacts and cleans the surface, so that the surface is in a clean state and ready for subsequent processing steps. Chemical dewaxing mainly includes the following steps:

[0046] 1. Prepare a wax removal tank: First, prepare a suitable container or tank filled with 2.5%-3% wax removal water by volume.

[0047] 2. Soak the die castings: Place the alloy precision die castings to be treated into the dewaxing tank, making sure they are completely immersed in the solution.

[0048] 3. Cleaning and stirring: Start the agitator of the dewaxing tank and ensure that the dewaxing solution fully contacts and cleans the surface of the die casting.

[0049] 4. Processing time control: Control the processing time between 10-20 minutes.

[0050] 5. Remove the die casting: After the treatment is completed, remove the die casting from the wax removal tank and rinse the surface with clean water.

[0051] Ultrasonic wax removal uses tiny bubbles formed by ultrasound in the liquid, and uses the high energy released when the bubbles burst to clean the surface. The bursting of these tiny bubbles will produce a violent impact force and liquid flow power, which can effectively remove wax, grease and other contaminants on the surface. Ultrasonic wax removal is widely used in many industrial applications because of its high efficiency, speed and no mechanical contact. Ultrasonic wax removal includes the following steps:

[0052] 1. Prepare an ultrasonic cleaning tank: Prepare an ultrasonic cleaning tank filled with clean water.

[0053] 2. Place the die casting in the tank: Place the die casting to be processed in the ultrasonic cleaning tank, making sure it is completely immersed in water.

[0054] 3. Turn on the ultrasonic wave: Start the ultrasonic generator of the ultrasonic cleaning tank to generate ultrasonic vibration.

[0055] 4. Cleaning: Control the cleaning time between 10 and 20 minutes. Ultrasonic vibration will form tiny bubbles in the liquid. These bubbles release high energy when they burst on the surface of the die-casting, thereby generating a weak water flow and stirring effect to clean the surface of the die-casting.

[0056] 5. Remove the die casting and rinse: After the treatment is completed, remove the die casting and rinse the surface with clean water.

[0057] 2. Degreasing: During the manufacturing and processing process, the surface of zinc alloy die-castings may be stained with various oily substances such as grease, lubricants, and protective film agents. These oil stains will hinder the physical and chemical bonding between the electroplating layer and the surface of the die-casting, reduce the adhesion of the electroplating layer, and hinder the good contact between the electroplating liquid and the surface of the die-casting, resulting in various defects in the electroplating process, such as bubbles, holes, spots, etc., affecting the quality and appearance of the electroplating coating. Through degreasing treatment, the surface oil stains can be effectively removed, the bonding strength between the electroplating layer and the substrate can be improved, the corrosion resistance and wear resistance of the electroplated parts can be enhanced, and the electroplating liquid can be evenly covered on the surface of the die-casting to ensure the thickness and uniformity of the electroplating layer. The degreasing treatment mainly includes the following steps:

[0058] 1. Prepare a degreasing tank: Prepare a degreasing tank of appropriate size and make sure its interior is clean.

[0059] 2. Prepare the degreasing agent: add alkaline cleaning agent at a ratio of 70-80g / L and add surfactant at a ratio of 20-30g / L.

[0060] 3. Soak the die castings: Place the zinc alloy die castings in the degreasing tank, making sure they are completely immersed in the degreasing liquid.

[0061] 4. Degreasing treatment time: Keep the temperature between 60-95°C and clean for 5-10 minutes.

[0062] 5. Rinse the die castings: Take out the degreased die castings and rinse them thoroughly with clean water to remove the degreasing liquid residue on the surface.

[0063] 3. Pre-plating closed protective layer: There are usually some tiny pores or air holes on the surface of zinc alloy die castings, which leads to the inaccurate combination of the coating and the substrate, making the coating easy to fall off or peel off. At the same time, the coating is also easy to react chemically with the substrate, resulting in damage to the coating quality or color difference. The alkaline zinc-nickel alloy plating solution has high dispersibility and covering ability, which can effectively close the pores on the surface of the die casting and improve its corrosion resistance.

[0064] The bonding strength between the substrates is good. Therefore, before formal gold plating, a layer of alkaline zinc-nickel alloy needs to be plated on the surface of the zinc alloy die-casting. The pre-plating of the closed protective layer mainly includes the following two steps:

[0065] 1. Prepare the plating solution:

[0066] Zinc 6-8g / L;

[0067] Nickel 1-2 g / L;

[0068] Sodium hydroxide 100-150g / L;

[0069] Auxiliary agent 100-150mL / L;

[0070] Opening agent 5-10mL / L;

[0071] Brightener 5-10mL / L.

[0072] 2. Electroplating: The plating tank temperature is maintained between 20-25°C, and the cathode current density is 1-2A / dm 2 , nickel plate is used as anode, anode current density is 2-5A / dm 2 , the cathode moves 4-6m / min. The thickness of the zinc-nickel alloy coating is 10-15μm.

[0073] 4. Main plating layer: According to the required plating metal, configure the appropriate plating solution and perform electroplating under appropriate conditions. Taking the current nickel electroplating as an example, the plating solution is: nickel sulfate 200g / L, sulfuric acid 30g / L, boric acid 10g / L, copper sulfate 1g / L. The plating tank temperature is maintained between 45-55°C, and the cathode current density is 1.5A / dm 2 , nickel plate is used as anode, anode current density is 2A / dm 2 .

[0074] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A splash-proof zinc alloy precision die casting electroplating device, comprising an electroplating apparatus (1), characterized in that: An electroplating box (2) is provided on one side of the electroplating apparatus (1), a filter tank (3) is provided below the electroplating box (2), and a power supply (4) is provided on one side of the electroplating box (2); A first anode interface (401) is arranged above the power source (4), the first anode interface (401) is connected to a first anode hanging rod (5), a second anode interface (402) is arranged above the power source (4), the second anode interface (402) is connected to a second anode hanging rod (7), a power connection sliding sleeve (403) is arranged above the power source (4), the power connection sliding sleeve (403) is fixedly connected to the cathode of the power source (4), the power connection sliding sleeve (403) is slidably connected to a cathode hanging rod (9), a composite sliding sleeve (10) is fixedly connected above the electroplating apparatus (1), the cathode hanging rod (9) passes through the composite sliding sleeve (10), and one end of the cathode hanging rod (9) is connected to a reciprocating drive mechanism (11); The electroplating box (2) is provided with an electroplating liquid overflow pipe (12), and a downpipe (13) is provided in the electroplating liquid overflow pipe (12). The lower end of the downpipe (13) is inserted into the filter tank (3), and a sedimentation tank (14) is provided in the filter tank (3). The lower end of the downpipe (13) is located in the sedimentation tank (14). A drawer-type filter (15) is provided on one side of the sedimentation tank (14), and filter paper (16) is provided in the drawer-type filter (15). A heating tank (17) is provided on one side of the drawer-type filter (15), and an ion adsorption tank (20) is provided on one side of the heating tank (17). A water supply tank (21) is provided on one side of the ion adsorption tank (20), and a pump (22) is provided in the water supply tank (21). The upper end of the pump (22) is connected to a water outlet elbow (23).

2. The splash-proof zinc alloy precision die casting electroplating device according to claim 1, characterized in that: The first anode hanging rod (5) is fixedly connected to a first anode plate (6), the second anode hanging rod (7) is hung with a second anode plate (8), and the cathode hanging rod (9) is hung with a zinc alloy precision die-casting to be electroplated.

3. The splash-proof zinc alloy precision die casting electroplating device according to claim 2, characterized in that: The first anode plate (6) and the second anode plate (8) are respectively located on both sides of the cathode hanging rod (9).

4. The splash-proof zinc alloy precision die casting electroplating device according to claim 3 is characterized in that: The first anode hanging rod (5), the second anode hanging rod (7) and the cathode hanging rod (9) are all made of red copper, and the material of the first anode plate (6) and the second anode plate (8) is the same as that of the plated cations.

5. The splash-proof zinc alloy precision die casting electroplating device according to claim 1, characterized in that: The reciprocating drive mechanism (11) comprises a servo motor (1101), the servo motor (1101) being mounted on the top of the electroplating apparatus (1), an eccentric rod (1102) being fixedly connected to the output shaft of the servo motor (1101), a connecting slider (1103) being provided at the end of the eccentric rod (1102), the connecting slider (1103) being slidably connected to a sliding guide rail (1104), and the cathode hanging rod (9) being fixedly connected to the sliding guide rail (1104).

6. The splash-proof zinc alloy precision die casting electroplating device according to claim 1, characterized in that: The upper end of the electroplating liquid overflow pipe (12) is provided with a froth overflow groove (1201), the lower end of the electroplating liquid overflow pipe (12) is provided with a sedimentation suction groove (1202), and the upper end inlet of the down pipe (13) is flush with the froth overflow groove (1201).

7. The splash-proof zinc alloy precision die casting electroplating device according to claim 1, characterized in that: The drawer-type filter (15) is provided with a water distribution plate (1501), and water leakage holes (1502) are provided on the bottom of the drawer-type filter (15) and the water distribution plate (1501), and the filter paper (16) is laid below the water distribution plate (1501).

8. The splash-proof zinc alloy precision die casting electroplating device according to claim 1, characterized in that: A steam heater (19) is arranged in the heating chamber (17), and activated carbon (18) is arranged in both the heating chamber (17) and the ion adsorption chamber (20).

Citation Information

Patent Citations

  • An electroplating solution stirring device

    CN108355530B

  • Non-cyanide electroplating method replacing cyanide-containing alkaline copper for directly plating zinc alloy matrix

    CN107142502A

  • Circuit board processing electroplating device

    CN215404623U