Quality control method and equipment for tinned copper alloy wire

Abstract

The present application is applicable to the field of copper alloy wire technology, and in particular relates to a method and equipment for quality control of tinned copper alloy wires. The method comprises: controlling the tinned copper alloy wire quality control equipment to send the tinned copper alloy wires through a plurality of temperature-controllable zones; scratching the tinned copper alloy wires in each temperature-controllable zone; acquiring an image of each scratch and inputting it into a scratch image analysis model to obtain analysis information of the image of each scratch; obtaining quality score data based on the analysis information; comparing the quality score data with reference quality score data, marking line segments with unqualified quality, and generating production improvement suggestions to be output to an operating table. The method can ensure that the produced tinned copper alloy wires can maintain good quality at different temperatures, making the tinned copper alloy wires more durable, reducing the loss caused by wire quality problems, improving the reliability during use, and better protecting the safety of users and equipment.

Description

Technical Field

[0001] The present invention relates to the field of copper alloy wire technology, and in particular to a method and equipment for quality control of tinned copper alloy wires. Background Art

[0002] The quality control of tinned copper alloy wire is an indispensable part of the wire production process. Testing and monitoring are used to ensure the quality of the wire.

[0003] In the existing technology, the adhesion of the coating on the surface of the wire is usually only tested at room temperature. However, the temperature of the actual working environment of the wire often has both low and high temperatures. Therefore, the test results at room temperature cannot accurately reflect the actual performance of the wire in different temperature environments, and cannot accurately control the quality of the wire. Summary of the Invention

[0004] The embodiments of the present application provide a method and device for controlling the quality of tinned copper alloy wires, which can solve the problem in the prior art that the coating adhesion quality of tinned copper alloy wires under different temperature environments cannot be accurately detected.

[0005] In a first aspect, an embodiment of the present application provides a tinned copper alloy wire quality control method, which is applied to a tinned copper alloy wire quality control device, wherein the tinned copper alloy wire quality control device includes a scoring device, and the method includes:

[0006] Controlling the tinned copper alloy wire quality control device to send the tinned copper alloy wire through a plurality of temperature-controllable zones; wherein the plurality of temperature-controllable zones include a normal temperature zone, a high temperature zone, and a low temperature zone;

[0007] Controlling the scoring device to score the tinned copper alloy wire in each of the temperature-controllable regions; wherein the score in the normal temperature region is a first score, the score in the high temperature region is a second score, and the score in the low temperature region is a third score;

[0008] Acquire images of the scratches and input them into a scratch image analysis model, respectively, so as to output analysis information of the scratch images through the scratch image analysis model;

[0009] Obtaining corresponding quality score data according to the analysis information of each scratch image;

[0010] The quality score data is compared with the reference quality score data, and the line segments with unqualified quality are marked according to the comparison results, and production improvement suggestions are generated and output to the operation console.

[0011] The above technical solutions in the embodiments of the present application have at least the following technical effects:

[0012] The tinned copper alloy wire quality control equipment is controlled to send the tinned copper alloy wire through multiple temperature-controlled areas; the scratching device is controlled to scratch the tinned copper alloy wire in each temperature-controlled area; the image of each scratch is obtained and input into the scratch image analysis model respectively, so that the scratch image analysis model outputs analysis information of each scratch image respectively; the corresponding quality score data is obtained based on the analysis information of each scratch image; the quality score data is compared with the reference quality score data, and the line segments with unqualified quality are marked according to the comparison results, and production improvement suggestions are generated and output to the operation table. The method scratches the tinned copper alloy wire at different temperatures and analyzes the scratches to detect the adhesion quality of the coating of the tinned copper alloy wire at different temperatures, which is conducive to controlling the quality of the produced tinned copper alloy wire at different temperatures, making the tinned copper alloy wire more durable, reducing the loss caused by wire quality problems, improving the reliability during use, and better protecting the safety of users and equipment.

[0013] In a possible implementation of the first aspect, controlling the tinned copper alloy wire quality control device to send the tinned copper alloy wire through multiple temperature-controllable zones includes:

[0014] Controlling the tinned copper alloy wire quality control device to continuously feed the tinned copper alloy wire, and randomly marking an initial point on the continuously fed tinned copper alloy wire;

[0015] When it is detected that the initial point enters the temperature-controllable area farthest from the feed end of the tinned copper alloy wire quality control equipment, the tinned copper alloy wire quality control equipment is controlled to adjust the temperature of the tinned copper alloy wire in the temperature-controllable area to a preset temperature.

[0016] In a possible implementation of the first aspect, before controlling the tinned copper alloy wire quality control device to adjust the temperature of the tinned copper alloy wire in the temperature controllable area to a preset temperature, the method further includes:

[0017] receiving the maximum operating temperature data and the minimum operating temperature data input by the operator; and / or

[0018] receiving working environment information input by an operator, matching the working environment information in a working environment database and obtaining working environment temperature information; wherein the working environment database includes a plurality of working environment temperature information, the plurality of working environment temperature information and the plurality of working environment information have a corresponding relationship, and one piece of working environment temperature information includes a maximum working temperature data and a minimum working temperature data;

[0019] The preset temperature of the high temperature zone is set according to the obtained maximum operating temperature data, and the preset temperature of the low temperature zone is set according to the obtained minimum operating temperature data.

[0020] In a possible implementation of the first aspect, the controlling and scoring device respectively scores the tinned copper alloy wire in each of the temperature controllable regions, including:

[0021] receiving scratch length data, scratch pressure data, and scratch angle data input by an operator, and controlling the scratching device according to the scratch length data, the scratch pressure data, and the scratch angle data;

[0022] When the temperature of the tinned copper alloy wire in each of the temperature-controllable areas reaches a preset temperature, the scoring device is controlled to form the first scratch, the second scratch and the third scratch on the tinned copper alloy wire in the normal temperature zone, the high temperature zone and the low temperature zone respectively.

[0023] In a possible implementation of the first aspect, before the temperature of the tinned copper alloy wire in each of the temperature-controllable areas reaches a preset temperature, the method further includes:

[0024] Obtaining a feed speed of the tinned copper alloy wire and a temperature adjustment power of a tinned copper alloy wire quality control device;

[0025] Obtaining temperature adjustment time data required to adjust the temperature of the tinned copper alloy wire in each temperature controllable area to the preset temperature based on the maximum operating temperature data, the minimum operating temperature data, and the temperature adjustment power;

[0026] Temperature adjustment stroke data is obtained based on the feed speed and the temperature adjustment time data; wherein the temperature adjustment stroke data reflects the length of the tinned copper alloy wire fed from the initial point into the temperature controllable area farthest from the feed end of the tinned copper alloy wire quality control device to the time when the temperature of the tinned copper alloy wire in each temperature controllable area reaches the preset temperature;

[0027] Control the tinned copper alloy wire quality control equipment to set the temperature controllable areas at intervals; wherein the interval distance between the temperature controllable areas is greater than the sum of the temperature adjustment stroke data and the scratch length data.

[0028] In a possible implementation of the first aspect, the scratch image analysis model is trained using multiple sets of training data, each set of the multiple sets of training data including a scratch image and identification information for identifying a scratch depth and a peeling form in the scratch image; the analysis information includes the scratch depth data and the peeling form information; and obtaining corresponding quality score data based on the analysis information of each scratch image includes:

[0029] Assigning a value to the spalling form information in the analysis information to obtain spalling value data;

[0030] A weighted calculation is performed on the scratch depth data and the peeling value data of the first scratch, the second scratch, and the third scratch, respectively, to obtain corresponding first quality score data, second quality score data, and third quality score data.

[0031] In a possible implementation manner of the first aspect, before comparing the quality score data with reference quality score data, the method includes:

[0032] Selecting a section of qualified sample wire, and controlling the scoring device to score the qualified sample wire multiple times at room temperature based on the score length data, the scoring pressure data, and the scoring angle data;

[0033] Collecting scratch images generated by scratching the qualified sample wire rod multiple times to obtain a plurality of standard scratch images;

[0034] Inputting the plurality of standard scratch images into the scratch image analysis model to obtain a plurality of standard scratch information output by the scratch image analysis model; wherein the standard scratch information includes standard scratch depth data and standard peeling form information;

[0035] Assigning a value to the standard peeling form information to obtain standard peeling value data;

[0036] Based on the plurality of standard scratch depth data and the standard peeling value data of the qualified sample wire rod, reference scratch depth data and reference peeling value data are obtained;

[0037] The reference scratch depth data and the reference peeling value data are weightedly calculated to obtain reference quality score data.

[0038] In a second aspect, an embodiment of the present application provides a tinned copper alloy wire quality control system, which is applied to a tinned copper alloy wire quality control device, wherein the tinned copper alloy wire quality control device includes a scoring device, and the system includes:

[0039] A first control unit is configured to control the tinned copper alloy wire quality control device to send the tinned copper alloy wire through a plurality of temperature-controllable zones; wherein the plurality of temperature-controllable zones include a normal temperature zone, a high temperature zone, and a low temperature zone;

[0040] A second control unit is used to control the scoring device to score the tinned copper alloy wire in each temperature controllable zone; wherein the score in the normal temperature zone is a first score, the score in the high temperature zone is a second score, and the score in the low temperature zone is a third score;

[0041] an analysis unit, configured to obtain images of each scratch and input the images into a scratch image analysis model, so as to output analysis information of the images of each scratch through the scratch image analysis model;

[0042] A scoring unit, configured to obtain corresponding quality scoring data based on analysis information of the image of each scratch;

[0043] The comparison unit is used to compare the quality score data with the reference quality score data, mark the line segments with unqualified quality according to the comparison results, and generate production improvement suggestions and output them to the operation console.

[0044] In a third aspect, an embodiment of the present application provides a tinned copper alloy wire quality control device, comprising:

[0045] A feeding device, wherein the feeding device is provided with a plurality of temperature-controllable areas and is used for conveying tinned copper alloy wire;

[0046] a plurality of cameras, wherein the plurality of cameras are arranged on the feeding device and are used to capture images of the tinned copper alloy wire;

[0047] an operating table, disposed on one side of the feeding device; and

[0048] a plurality of scoring devices, disposed on the feeding device and correspondingly disposed in the plurality of temperature-controllable regions, the scoring devices being used to score the tinned copper alloy wires in the temperature-controllable regions;

[0049] In which, the feeding device, multiple cameras and multiple engraving devices are respectively electrically connected to the operating table; the operating table includes a memory, a processor and a computer program stored in the memory and runnable on the processor, and when the processor executes the computer program, the tinned copper alloy wire quality control method described in any one of the first aspects above is implemented.

[0050] In a possible implementation of the third aspect, the tinned copper alloy wire quality control device further includes a plurality of temperature regulating devices, wherein the plurality of temperature regulating devices are movably disposed on the feeding device and are spaced apart along a feeding direction of the feeding device; the temperature regulating devices are configured to regulate the temperature within the temperature-controllable area to a preset temperature;

[0051] The temperature control device corresponds to the temperature controllable area one by one, and the temperature control range of the temperature control device is adjustable so that the range of the temperature controllable area changes with the temperature control range of the temperature control device, and the temperature controllable area moves with the movement of the temperature control device.

[0052] In a possible implementation of the third aspect, the tinned copper alloy wire quality control equipment further includes a plurality of moving components, wherein the moving components are arranged on the feeding device, and the power output end of each of the moving components is connected to each of the temperature control devices one by one, and is electrically connected to the operating table so that the operating table can control the movement of the temperature control device under the drive of the moving component.

[0053] In a fourth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a tinned copper alloy wire quality control device, the terminal device executes the tinned copper alloy wire quality control method described in any one of the first aspects above.

[0054] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0056] Figure 1 This is a flow chart of a method for controlling the quality of tinned copper alloy wires provided in one embodiment of the present application;

[0057] Figure 2 1 is a schematic diagram of the implementation process of step S100 in the tinned copper alloy wire quality control method provided in one embodiment of the present application;

[0058] Figure 3 This is a partial flow chart of a method for controlling the quality of tinned copper alloy wires provided in one embodiment of the present application;

[0059] Figure 4This is a schematic diagram of the implementation process of step S200 in the tinned copper alloy wire quality control method provided in one embodiment of the present application;

[0060] Figure 5 This is another partial flow chart of a method for controlling the quality of tinned copper alloy wires provided by another embodiment of the present application;

[0061] Figure 6 This is a schematic diagram of the implementation process of step S400 in the tinned copper alloy wire quality control method provided in one embodiment of the present application;

[0062] Figure 7 This is another partial flow chart of a method for controlling the quality of tinned copper alloy wires provided in another embodiment of the present application;

[0063] Figure 8 This is a schematic structural diagram of a tinned copper alloy wire quality control system provided in an embodiment of the present application;

[0064] Figure 9 Schematic diagram of the structure of the tinned copper alloy wire quality control device provided in an embodiment of the present application;

[0065] Figure 10 It is a structural schematic diagram of the operating table of the tinned copper alloy wire quality control equipment provided in an embodiment of the present application.

[0066] Among them, the reference numerals in the figures are:

[0067] 100. Tinned copper alloy wire quality control equipment; 10. Feeding device; 101. Feed end; 102. Temperature-controlled area; 20. Camera; 30. Operating table; 40. Scribing device; 50. Temperature control device. DETAILED DESCRIPTION

[0068] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0069] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0070] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0071] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0072] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0073] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0074] In related technologies, the adhesion of the wire surface coating is usually only tested at room temperature. However, the temperature of the actual working environment of the wire often has both low and high temperatures. Therefore, the test results at room temperature cannot accurately reflect the actual performance of the wire in different temperature environments, and cannot accurately control the quality of the wire.

[0075] To address the above-mentioned issues, embodiments of the present application provide a tinned copper alloy wire quality control method and apparatus. In this method, a tinned copper alloy wire quality control apparatus is controlled to feed the tinned copper alloy wire through multiple temperature-controllable zones; a scoring device is controlled to score the tinned copper alloy wire within each temperature-controllable zone; an image of each scratch is acquired and input into a scratch image analysis model, which outputs analysis information for each scratch image; corresponding quality score data is obtained based on the analysis information for each scratch image; the quality score data is compared with reference quality score data, and line segments with unqualified quality are marked based on the comparison results. Production improvement suggestions are generated and output to an operation console. The method scratches the tinned copper alloy wire at different temperatures and analyzes the resulting scratches to detect the adhesion quality of the coating on the tinned copper alloy wire at different temperatures. This method is beneficial for controlling the quality of the produced tinned copper alloy wire at different temperatures, making the tinned copper alloy wire more durable, reducing the loss caused by wire quality problems, improving reliability during use, and better protecting the safety of users and equipment.

[0076] The tinned copper alloy wire quality control method provided in the embodiment of the present application can be applied to a tinned copper alloy wire quality control device. In this case, the tinned copper alloy wire quality control device is the executor of the tinned copper alloy wire quality control method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the tinned copper alloy wire quality control device.

[0077] In some embodiments, see Figure 9 The tinned copper alloy wire quality control equipment 100 may include a feeding device 10, multiple cameras 20, an operating table 30, and multiple scoring devices 40. The feeding device 10 is a device for conveying tinned copper alloy wire. It can be a variety of wire conveying devices, including existing conveying devices or improved versions of existing conveying devices. For example, a motor-driven gear or chain can be used to pull the tinned copper alloy wire along a predetermined track. The feeding device 10 is provided with multiple temperature-controllable zones 102. The camera 20 is provided on the feeding device 10 and is used to capture images of scratches. The operating table 30 is provided on one side of the feeding device 10 and can be a tablet computer, laptop computer, desktop computer, or the like. Each scoring device 40 is provided on the feeding device 10 and corresponds to one of the multiple temperature-controllable zones 102. The scoring devices 40 are used to score the tinned copper alloy wire within the temperature-controllable zones. The feeding device 10 , the plurality of cameras 20 and the plurality of scribing devices 40 are electrically connected to the operating table 30 respectively.

[0078] In some optional embodiments, the scoring device 40 may include a base, a lifting rod, and a scoring head. The base is fixedly mounted on the feed device; the lifting rod is connected to the base and electrically connected to the operating platform 30; and the scoring head is connected to the lifting rod. When scoring is required on the tinned copper alloy wire, the operating platform 30 controls the lifting rod to descend, bringing the scoring head into contact with the tinned copper alloy wire. When scoring is not required, the operating platform 30 controls the lifting rod to raise, separating the scoring head from the tinned copper alloy wire.

[0079] It is understood that the lifting rod can be various types of electric lifting rods, such as a lifting motor or a linear motor, or an electric cylinder, but is not limited thereto. The scoring head can have a scoring structure of various shapes, such as a regular or irregular plate-shaped structure, a columnar structure, etc., but is not limited thereto.

[0080] With this arrangement, the operating table 30 can control the feeding device 10 to convey the tinned copper alloy wire along a preset track. When the tinned copper alloy wire is on the feeding device 10, the operating table 30 can control the camera 20 to capture an image of the tinned copper alloy wire. The feeding device 10 conveys the tinned copper alloy wire through multiple temperature-controlled areas 102 on the feeding device 10. When scoring is required, the operating table 30 controls the lifting rod of the scoring device 40 to descend, so that the scoring head contacts the tinned copper alloy wire to produce a scratch. When scoring is not required, the operating table 30 controls the lifting rod to rise. Using the operating table to control the feeding and scoring of the tinned copper alloy wire eliminates the need for manual operation, reduces the risk of accidental injury to the operator, and effectively improves work efficiency.

[0081] Optionally, in some embodiments, see Figure 9 The tinned copper alloy wire quality control device 100 further includes a plurality of temperature control devices 50, which are movably mounted on the feed device 10 and spaced apart along the feed direction of the feed device 10. The plurality of temperature control devices 50 are electrically connected to the operating table. The temperature control devices 50 are used to control the temperature within the temperature controllable area 102 to a preset temperature.

[0082] Among them, the temperature control device 50 corresponds to the temperature controllable area one by one, and the temperature control range of the temperature control device 50 is adjustable so that the range of the temperature controllable area changes with the temperature control range of the temperature control device 50, and the temperature controllable area moves with the movement of the temperature control device 50.

[0083] It can be understood that the temperature control device 50 is a device that can adjust the temperature within the temperature-controllable area 102 and can include a heating unit and a cooling unit. The heating unit can be a resistance heating wire or a hot air blower, but is not limited thereto. The cooling unit can be an air conditioner or a water cooler, but is not limited thereto. The temperature control device 50 can be moved on the feeding device 10 by providing a chute on the feeding device 10 and connecting the temperature control device 50 to a sliding structure that can move within the chute. The temperature control device 50 can also include a temperature sensor and two heat insulation plates spaced apart along the feeding direction. The temperature sensor is electrically connected to the operating table 30 and is used to detect the temperature within the temperature-controllable area 102 and send the detected temperature data to the operating table 30 in real time. The heat insulation plates can be moved along the feeding direction via the chute and the slide, and the two heat insulation plates can move relative to each other. The heat insulation plates are used to separate the temperature-controllable area 102 from the outside world to limit the range of the temperature-controllable area 102.

[0084] Optionally, in some embodiments, the tinned copper alloy wire quality control equipment 100 further includes a plurality of moving components, each of which is arranged on the feeding device 10, and the power output end of each moving component is connected to each temperature control device 50 one by one, and is electrically connected to the operating table 30, so that the operating table 30 can control the movement of the temperature control device 50 under the drive of the moving component.

[0085] For example, the moving assembly can be a screw slide assembly, which can include a slide and a drive mechanism. The slide can be slidably arranged on the feeding device 10 along the feeding direction of the wire. The power output end of the drive mechanism is connected to the slide to drive the slide to slide. The cooling and heating units of the temperature control device 50 can be arranged on the slide, and the drive mechanism drives the slide to move so that the heating and cooling units of the temperature control device 50 move. The drive mechanism can use a linear motor and a screw to drive the slide to slide, or a stepper motor and a transmission mechanism (such as a gear rack combination structure) to drive the slide to slide, but is not limited to this.

[0086] With this configuration, the operating console 30 can control the temperature control device 50 to move to a preset position and the heat shield to move, adjusting the temperature controllable area to a preset value. It can then control the temperature control device 50 to adjust the temperature within the temperature controllable area 102 to the preset value, and control the temperature control device 50 to stop operating when the temperature sensor detects that the temperature has reached the preset value. In this way, the operating console 30 can control the temperature control device 50 to adjust the temperature based on various parameters, eliminating the need for manual operation and effectively preventing potential operator injury due to high or low temperatures. Furthermore, it can precisely control the temperature control process of the tinned copper alloy wire, resulting in more accurate and reliable test results.

[0087] In order to better understand the quality control method of the tinned copper alloy wire provided in the embodiment of the present application, the specific implementation process of the quality control method of the tinned copper alloy wire provided in the embodiment of the present application is exemplarily introduced below.

[0088] Figure 1 A schematic flow chart of a tinned copper alloy wire quality control method provided in an embodiment of the present application is shown. The tinned copper alloy wire quality control method includes:

[0089] S100, controlling the tinned copper alloy wire quality control device 100 to send the tinned copper alloy wire through a plurality of temperature controllable zones 102; wherein the plurality of temperature controllable zones 102 include a normal temperature zone, a high temperature zone and a low temperature zone.

[0090] It can be understood that the temperature controllable area 102 is an area provided on the tinned copper alloy wire quality control device 100 where the temperature can be controlled.

[0091] As an optional embodiment of this application, please refer to Figure 2 S100, controlling the tinned copper alloy wire quality control device 100 to send the tinned copper alloy wire through multiple temperature controllable areas 102, including:

[0092] S110 , controlling the tinned copper alloy wire quality control device 100 to continuously feed the tinned copper alloy wire, and randomly marking an initial point on the continuously fed tinned copper alloy wire.

[0093] It is understood that the initial point can be randomly marked on the continuously fed tinned copper alloy wire by the tinned copper alloy wire quality control device 100, or can be randomly marked on the tinned copper alloy wire by the operator. The marking method can be to virtually calibrate a point by establishing a coordinate axis on the tinned copper alloy wire through image processing, or to actually calibrate a point on the tinned copper alloy wire by chiseling or engraving, but is not limited to these methods.

[0094] S120, when it is detected that the initial point enters the temperature controllable area 102 farthest from the feed end 101 of the tinned copper alloy wire quality control equipment 100, the tinned copper alloy wire quality control equipment 100 is controlled to adjust the temperature of the tinned copper alloy wire in the temperature controllable area 102 to a preset temperature.

[0095] It can be understood that when the initial point enters the temperature-controllable area 102 farthest from the feed end 101 of the tinned copper alloy wire quality control equipment 100, the temperature in the temperature-controllable area 102 is adjusted to a preset temperature, so that the tinned copper alloy wire that subsequently enters the temperature-controllable area 102 can be in a preset temperature environment.

[0096] In this way, the initial point is determined by random marking, and the tinned copper alloy wire segment entering the temperature controllable area 102 is randomly selected. This can reduce the deviation of the quality inspection results of the tinned copper alloy wire, make the quality inspection results universally applicable, and the obtained results can better reflect the overall quality of the tinned copper alloy wire.

[0097] In one possible implementation, see Figure 3 Before the tinned copper alloy wire quality control device 100 controls the temperature of the tinned copper alloy wire in the temperature controllable area 102 to a preset temperature, the tinned copper alloy wire quality control method further includes:

[0098] S01a, receiving the maximum operating temperature data and the minimum operating temperature data input by the operator.

[0099] It will be understood that the maximum operating temperature data is the highest temperature that the tinned copper alloy wire may reach during actual use, and the minimum operating temperature data is the lowest temperature that the tinned copper alloy wire may reach during actual use. When the operator knows the specific maximum and minimum operating temperature data, the temperature of the temperature-controllable area 102 can be set directly by receiving the data input by the operator.

[0100] In addition to the method of step S01a, the following method may also be used:

[0101] S01b, receiving the working environment information input by the operator, matching and obtaining the working environment temperature information in the working environment database according to the working environment information; wherein the working environment database includes multiple working environment temperature information, the multiple working environment temperature information has a corresponding relationship with the multiple working environment information, and one working environment temperature information includes a maximum working temperature data and a minimum working temperature data.

[0102] It is understood that when the operator is only able to determine the working environment information of the tinned copper alloy wire, the tinned copper alloy wire quality control device 100 can search and match the working environment information in the working environment database, and then obtain the corresponding maximum working temperature data and minimum working temperature data based on the working environment information input by the operator. The working environment temperature information in the working environment database and the maximum working temperature data and minimum working temperature data contained in the working environment temperature information can be obtained through laboratory experiments, on-site measurements and monitoring, and previous experience. After obtaining the data, the collected data is sorted, classified, and archived to extract useful information and patterns, and the relevant data is then saved in the database to form a working environment database.

[0103] With this configuration, the tinned copper alloy wire quality control device 100 can adjust the temperature of the temperature-controllable region 102 based on temperature data directly input by the operator, or it can retrieve and match corresponding temperature data based on working environment information input by the operator and then adjust the temperature of the temperature-controllable region 102. This can reduce the operator requirements of the tinned copper alloy wire quality control device 100, improve the adaptability of the tinned copper alloy wire quality control device 100, and reduce the influence of human subjective factors, making the results more accurate and reliable.

[0104] S02: setting a preset temperature for the high temperature zone according to the obtained maximum operating temperature data, and setting a preset temperature for the low temperature zone according to the obtained minimum operating temperature data.

[0105] In this configuration, by setting the temperature of the high-temperature zone according to the maximum operating temperature data and the temperature of the low-temperature zone according to the minimum operating temperature data, the actual operating environment temperature can be simulated within each temperature-controllable area 102. This allows the tinned copper alloy wire to be tested under multiple different conditions and obtains test results that best match actual usage conditions. This helps improve the applicability and credibility of the test results, ensuring that the test results fully represent the overall quality of the tinned copper alloy wire.

[0106] S200, controlling the scoring device 40 to score marks on the tinned copper alloy wire in each temperature controllable area 102; wherein, the score in the normal temperature area is the first score, the score in the high temperature area is the second score, and the score in the low temperature area is the third score.

[0107] It is understood that the scoring device 40 produces the scratch by releasing and moving relative to the tinned copper alloy wire. The scoring device 40 may be fixed or movable in a direction opposite to the feed direction of the tinned copper alloy wire, but is not limited thereto. The contact area between the scoring device 40 and the tinned copper alloy wire may be a point or a straight line, but is not limited thereto.

[0108] As an optional embodiment of this application, please refer to Figure 4 S200, controlling the scoring device 40 to score marks on the tinned copper alloy wire in each temperature controllable area 102, including:

[0109] S210, receiving the scratch length data, scratch pressure data and scratch angle data input by the operator, and controlling the scratching device 40 according to the scratch length data, scratch pressure data and scratch angle data.

[0110] It can be understood that when the scoring device 40 performs scoring in each temperature-controllable area 102, the scratch length data, scoring pressure data and scoring angle data should be the same.

[0111] S220, when the temperature of the tinned copper alloy wires in each temperature controllable area 102 reaches the preset temperature, the scoring device 40 is controlled to form a first scratch, a second scratch and a third scratch on the tinned copper alloy wires in the normal temperature area, the high temperature area and the low temperature area respectively.

[0112] It is understood that the preset temperature of each temperature-controllable area 102 is the normal temperature, maximum operating temperature data, or minimum operating temperature data corresponding to each temperature-controllable area 102. In addition, when the temperature of each temperature-controllable area 102 just reaches the preset temperature, it cannot accurately simulate the state of the tinned copper alloy wire in the actual working environment. At this time, the tinned copper alloy wire may still be in the heating stage. Therefore, the scratching should be performed after the temperature of the tinned copper alloy wire in each temperature-controllable area 102 reaches the preset temperature to ensure that the state of the tinned copper alloy wire in the actual working environment is accurately simulated. In some embodiments, a temperature sensor can be respectively provided in each temperature-controllable area 102 on the feeding device 10, and the temperature sensor is electrically connected to the operating table 30 to detect the temperature of the tinned copper alloy wire in each temperature-controllable area 102.

[0113] In one possible implementation, see Figure 5 Before the temperature of the tinned copper alloy wires in each temperature controllable area 102 reaches the preset temperature, the process includes:

[0114] S10 , obtaining the feeding speed of the tinned copper alloy wire and the temperature adjustment power of the tinned copper alloy wire quality control device 100 .

[0115] It will be understood that the feed speed refers to the speed at which the tinned copper alloy wire enters the tinned copper alloy wire quality control device 100. The feed speed can be detected by providing a radar speed meter or a photoelectric speed sensor at the input end of the feed device 10. The temperature control power refers to the output power of the tinned copper alloy wire quality control device 100 when regulating the temperature within the temperature controllable area 102. The output power of the temperature control device 50 can be detected using an electric energy meter or a power meter.

[0116] S20, obtaining temperature adjustment time data required to adjust the temperature of the tinned copper alloy wire in each temperature controllable area 102 to a preset temperature based on the maximum operating temperature data, the minimum operating temperature data and the temperature adjustment power.

[0117] It can be understood that the temperature difference data can be obtained based on the difference between the maximum working temperature data or the minimum working temperature data and the normal temperature data. The diameter, density, specific heat capacity and thermal conductivity of the tinned copper alloy wire are determined according to the model. The mass entering the temperature controllable area 102 per unit time is the product of the diameter, feed speed, density and unit time. The energy required to control this section to the preset temperature is the product of the mass, specific heat capacity, thermal conductivity and temperature difference. The required energy is divided by the temperature control power to obtain the temperature control time data.

[0118] S30, obtaining temperature adjustment stroke data based on the feed speed and temperature adjustment time data; wherein the temperature adjustment stroke data reflects the length of the tinned copper alloy wire fed from the initial point into the temperature controllable area 102 farthest from the feed end 101 of the tinned copper alloy wire quality control equipment 100, until the temperature of the tinned copper alloy wires in each temperature controllable area 102 reaches a preset temperature.

[0119] It can be understood that the temperature adjustment stroke data is the product of the feed speed and the temperature adjustment time data.

[0120] S40, controlling the tinned copper alloy wire quality control device 100 to space the temperature controllable areas 102 apart; wherein the distance between the temperature controllable areas 102 is greater than the sum of the temperature adjustment stroke data and the scratch length data.

[0121] For example, a chute may be provided on the feeding device 10 , and the temperature regulating device 50 is connected to a slide that can move in the chute, thereby moving on the feeding device 10 , thereby changing the spacing between the temperature controllable areas 102 .

[0122] With this arrangement, the interval between each temperature-controllable zone 102 is greater than the sum of the temperature adjustment stroke data and the scratch length data. After the initial point enters the temperature-controllable zone 102, the tinned copper alloy wire quality control device 100 begins temperature adjustment. When the wire in the temperature-controllable zone 102 is adjusted to the preset temperature, the tinned copper alloy wire is fed a distance equal to the temperature adjustment stroke data. Subsequently, scratching begins, and the tinned copper alloy wire is fed a distance equal to the scratch length. At this time, the scratch is still some distance away from the adjacent temperature-controllable zone 102 near the feed end 101, so that adjacent temperature-controllable zones 102 do not affect the tinned copper alloy wire in their respective zones due to different preset temperatures. This can prevent the mutual influence of the tested wire segments, improve the accuracy of the test results, and thus ensure the reliability of the quality of the tinned copper alloy wire and the safety of the users of the tinned copper alloy wire.

[0123] S300 , acquiring images of each scratch and inputting them into a scratch image analysis model, so that analysis information of the image of each scratch is outputted by the scratch image analysis model.

[0124] For example, the scratch image analysis model is trained using multiple sets of training data, each of which includes a scratch image and identification information for identifying the scratch depth and peeling form in the scratch image. The analysis information includes scratch depth data and peeling form information.

[0125] It is understood that the scratch depth is the vertical distance from the deepest point of the scratch to the surface of the tinned copper alloy wire. The peeling form reflects the shape and size of the coating peeling produced during the scratching process, and may be, for example, a flake with a length and width of 0.02 mm, a block with a diameter of 0.02 mm, or a powder with a diameter of less than 0.01 mm, but is not limited to these.

[0126] With this setup, the use of machine learning models can automate the processing of scratch images, reducing the need for manual intervention and improving work efficiency. It also enhances the scientific nature of the analysis process and the reliability of the data, thereby further improving the efficiency of the analysis process and the accuracy of the analysis results.

[0127] S400: Obtain corresponding quality score data based on analysis information of the image of each scratch.

[0128] It can be understood that the quality score data is derived from the scratch depth and peeling form in the analysis information to reflect the plating quality of the tinned copper alloy wire.

[0129] As an optional embodiment of this application, please refer to Figure 6 S400: Obtain corresponding quality score data based on the analysis information of each scratch image, including:

[0130] S410, assigning values ​​to the spalling form information in the analysis information to obtain spalling value data.

[0131] It is understood that the spalling form information may include, but is not limited to, the shape of the spalled material or its diameter. For different spalling form information, corresponding values ​​can be preset. For example, if the spalled material is flake-shaped and has a diameter of 0.5 mm, its spalling value data can be set to 1; if the spalled material is block-shaped and has a diameter of 0.3 mm, its spalling value data can be set to 2. It should be noted that the values ​​given above do not represent actual data and are only provided for ease of understanding. The specific spalling value data will depend on the actual situation and will not be detailed here.

[0132] S420 , performing weighted calculation on the scratch depth data and the peeling value data of the first scratch, the second scratch, and the third scratch, respectively, to obtain corresponding first quality score data, second quality score data, and third quality score data.

[0133] For example, the quality score data is obtained by multiplying the scratch depth data by the weight, plus the product of the peeling value data by the weight. Assuming that the weight of the scratch depth data is 0.7 and the weight of the peeling value data is 0.3, the scratch depth data of the first scratch is 0.2 and the peeling value data is 1, the scratch depth data of the second scratch is 0.1 and the peeling value data is 2, and the scratch depth data of the third scratch is 0.15 and the peeling value data is 3, then the first quality score data is 0.44 (0.2*0.7+0.3*1=0.44), the second quality score data is 0.67 (0.1*0.7+0.3*2=0.67), and the third quality score data is 1.005 (0.15*0.7+0.3*3=1.005), and so on. It should be noted that the above given values ​​do not represent actual data, but are set for the convenience of understanding and will not be repeated here.

[0134] By calculating the quality score data corresponding to each scratch, the information reflected by the scratch image is visualized and intuitively expressed as a numerical value, which makes it more convenient to evaluate the quality of tinned copper alloy wire and improves work efficiency.

[0135] S500, compare the quality score data with the reference quality score data, mark the line segments with unqualified quality according to the comparison results, and generate production improvement suggestions and output them to the operation console.

[0136] It is understood that the reference quality score data can be a preset value or a value obtained based on experimental testing of the wire currently in the tinned copper alloy wire quality control device 100. Production improvement suggestions can be manually analyzed and input, or obtained from an improvement database, but are not limited to such. The improvement database refers to a database containing all production improvement suggestions. This data can be obtained through laboratory experiments, on-site measurements and monitoring, and previous experience. After acquisition, the collected data is organized, classified, and archived, useful information and patterns are extracted, and the relevant data is stored in the database to form the improvement database. For example, a production improvement suggestion may be to increase the coating formation time by 3 seconds or to increase the plating solution temperature by 5 degrees, but are not limited to such. Regarding the comparison results, a comparison result where the quality score data is greater than or equal to the reference quality score data can be considered qualified, or a comparison result where the quality score data is less than or equal to the reference quality score data can be considered qualified. For example, using the example data of steps S410 and S420 above as an example, according to the calculation logic of the example data, the quality score data of the tinned copper alloy wire obtained is less than or equal to the reference quality score data, which is considered qualified. It should be noted that the above given values ​​do not represent actual data, but are set for ease of understanding. The specific judgment logic shall be based on the actual situation and will not be elaborated here.

[0137] This setup allows for real-time quality assessment of produced wire and timely adjustment of production equipment parameters to achieve quality control of tinned copper alloy wire. This allows for timely correction of incorrect production equipment parameters, reducing the output of substandard products, thereby minimizing losses, effectively lowering costs, and improving efficiency.

[0138] As an optional embodiment of this application, please refer to Figure 7 Before comparing the quality score data with the reference quality score data, including:

[0139] S610, selecting a section of qualified sample wire, and controlling the scoring device 40 to score the qualified sample wire multiple times at room temperature based on the scratch length data, the scoring pressure data, and the scoring angle data.

[0140] It can be understood that the qualified sample wire selected is of the same model as the tinned copper alloy wire on the tinned copper alloy wire quality control equipment 100, and is scored using the same scratch length data, scoring pressure data and scoring angle data, so that the quality score data obtained is of reference value.

[0141] S620, collecting scratch images generated by scratching the qualified sample wire rod multiple times to obtain multiple standard scratch images.

[0142] It can be understood that by performing multiple scratching operations on a qualified sample wire and collecting multiple scratch images, the obtained results can be representative and universal and can be used as a reference standard.

[0143] S630: Input a plurality of standard scratch images into a scratch image analysis model to obtain a plurality of standard scratch information output by the scratch image analysis model; wherein the standard scratch information includes standard scratch depth data and standard peeling form information.

[0144] S640: Assign values ​​to the standard peeling form information to obtain standard peeling value data.

[0145] It can be understood that the logic for assigning the standard peeling form information obtained for the qualified sample wire is the same as the logic for assigning the peeling form information for the tinned copper alloy wire mentioned above.

[0146] S650: Obtain reference scratch depth data and reference peeling value data based on a plurality of standard scratch depth data and standard peeling value data of the qualified sample wire rod.

[0147] For example, a plurality of standard scratch depth data may be averaged to obtain reference scratch depth data. A plurality of standard peeling value data may be averaged to obtain reference peeling value data.

[0148] S660: Perform weighted calculation on the reference scratch depth data and the reference peeling value data to obtain reference quality score data.

[0149] It can be understood that the weighted calculation logic for the reference scratch depth data and the reference peeling value data is the same as the weighted calculation logic for the scratch depth data and the peeling value data of the tinned copper alloy wire mentioned above.

[0150] With this setting, qualified sample wires are scored with the same scoring parameters, and the reference quality score data obtained according to the same calculation logic can be compared with the quality score data of tinned copper alloy wires. Only based on the correct comparison results can reasonable production improvement suggestions be generated, effectively improving the quality of tinned copper alloy wires, reducing production losses, and improving efficiency.

[0151] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0152] Corresponding to the tinned copper alloy wire quality control method of the above embodiment, the embodiment of the present application also provides a tinned copper alloy wire quality control system, and each unit of the system can implement each step of the tinned copper alloy wire quality control method. Figure 8 A structural block diagram of a tinned copper alloy wire quality control system provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0153] Reference Figure 8 , the system comprises:

[0154] a first control unit, configured to control the tinned copper alloy wire quality control apparatus 100 to feed the tinned copper alloy wire through a plurality of temperature-controllable zones 102; wherein the plurality of temperature-controllable zones 102 include a normal temperature zone, a high temperature zone, and a low temperature zone;

[0155] The second control unit is configured to control the scoring device 40 to score marks on the tinned copper alloy wire in each temperature controllable zone 102; wherein the score in the normal temperature zone is a first score, the score in the high temperature zone is a second score, and the score in the low temperature zone is a third score;

[0156] an analysis unit, configured to obtain images of each scratch and input the images into a scratch image analysis model, so as to output analysis information of the images of each scratch through the scratch image analysis model;

[0157] A scoring unit, configured to obtain corresponding quality scoring data based on analysis information of the image of each scratch;

[0158] The comparison unit is used to compare the quality score data with the reference quality score data, mark the line segments with unqualified quality according to the comparison results, and generate production improvement suggestions and output them to the operation console.

[0159] It should be noted that the information interaction, execution process, etc. between the above-mentioned units are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0160] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units as needed, that is, the internal structure of the system can be divided into different functional units to complete all or part of the functions described above. The functional units in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0161] The embodiment of the present application also provides a tinned copper alloy wire quality control device 100, Figure 10 This is a structural diagram of the control console 30 of the tinned copper alloy wire quality control device 100 provided in one embodiment of the present application. Figure 10 As shown, the console 30 of this embodiment includes: at least one processor 31 ( Figure 10 Only one is shown), at least one memory 32 ( Figure 10 Only one is shown in the figure) and a computer program 33 stored in the at least one memory 32 and executable on the at least one processor 31, the processor 31 executes the computer program 33 to enable the tinned copper alloy wire quality control device 100 to implement the steps of any of the above-mentioned tinned copper alloy wire quality control method embodiments, or to enable the tinned copper alloy wire quality control device 100 to implement the functions of each unit in the above-mentioned system embodiments.

[0162] For example, the computer program 33 may be divided into one or more units, which are stored in the memory 32 and executed by the processor 31 to implement the present application. The one or more units may be a series of computer program instruction segments capable of implementing specific functions, and the instruction segments are used to describe the execution process of the computer program 33 in the operating console 30.

[0163] The operating table 30 can be a computing device such as a desktop computer or a notebook. The tinned copper alloy wire quality control device 100 can include, but is not limited to, a processor 31 and a memory 32. It can be understood by those skilled in the art that Figure 10 The operating console 30 is merely an example and does not limit the operating console 30 . The operating console 30 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the operating console 30 may also include input and output devices, network access devices, buses, etc.

[0164] The processor 31 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0165] In some embodiments, the memory 32 can be an internal storage unit of the operating console 30, such as a hard disk or memory of the operating console 30. In other embodiments, the memory 32 can also be an external storage device of the operating console 30, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the operating console 30. Furthermore, the memory 32 can also include both an internal storage unit of the operating console 30 and an external storage device. The memory 32 is used to store an operating system, an application program, a boot loader, data, and other programs, such as the program code of the computer program. The memory 61 can also be used to temporarily store data that has been output or is about to be output.

[0166] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0167] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and when the computer program is executed by the processor, it can implement the steps of the above-mentioned various method embodiments. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device capable of carrying the computer program code to the tinned copper alloy wire equipment, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0168] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0169] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0170] In the embodiments provided herein, it should be understood that the disclosed tinned copper alloy wire quality control device and method can be implemented in other ways. For example, the above-described embodiment of the tinned copper alloy wire quality control device is merely illustrative. For example, the division of the units is merely a logical functional division. In actual implementation, other division methods may be used, such as combining or integrating multiple units or components into another system, or ignoring or not implementing certain features. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device, or unit, and may be electrical, mechanical, or other forms.

[0171] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0172] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A method for controlling the quality of tinned copper alloy wire, characterized in that: Applicable to tinned copper alloy wire quality control equipment, the tinned copper alloy wire quality control equipment includes a scoring device, and the method includes: Controlling the tinned copper alloy wire quality control device to send the tinned copper alloy wire through a plurality of temperature-controllable zones; wherein the plurality of temperature-controllable zones include a normal temperature zone, a high temperature zone, and a low temperature zone; Controlling the scoring device to score the tinned copper alloy wire in each of the temperature-controllable regions; wherein the score in the normal temperature region is a first score, the score in the high temperature region is a second score, and the score in the low temperature region is a third score; Acquire images of the scratches and input them into a scratch image analysis model, respectively, so as to output analysis information of the scratch images through the scratch image analysis model; Obtaining corresponding quality score data according to the analysis information of each scratch image; The quality score data is compared with the reference quality score data, and the line segments with unqualified quality are marked according to the comparison results, and production improvement suggestions are generated and output to the operation console.

2. The tinned copper alloy wire quality control method according to claim 1, wherein: The step of controlling the tinned copper alloy wire quality control device to send the tinned copper alloy wire through a plurality of temperature controllable zones comprises: Controlling the tinned copper alloy wire quality control device to continuously feed the tinned copper alloy wire, and randomly marking an initial point on the continuously fed tinned copper alloy wire; When it is detected that the initial point enters the temperature-controllable area farthest from the feed end of the tinned copper alloy wire quality control equipment, the tinned copper alloy wire quality control equipment is controlled to adjust the temperature of the tinned copper alloy wire in the temperature-controllable area to a preset temperature.

3. The tinned copper alloy wire quality control method according to claim 2, wherein: Before controlling the tinned copper alloy wire quality control device to adjust the temperature of the tinned copper alloy wire in the temperature controllable area to a preset temperature, the method further includes: receiving the maximum operating temperature data and the minimum operating temperature data input by the operator; and / or receiving working environment information input by an operator, matching the working environment information in a working environment database and obtaining working environment temperature information; wherein the working environment database includes a plurality of working environment temperature information, the plurality of working environment temperature information and the plurality of working environment information have a corresponding relationship, and one piece of working environment temperature information includes a maximum working temperature data and a minimum working temperature data; The preset temperature of the high temperature zone is set according to the obtained maximum operating temperature data, and the preset temperature of the low temperature zone is set according to the obtained minimum operating temperature data.

4. The tinned copper alloy wire quality control method according to claim 3, characterized in that: Controlling the scoring device to score marks on the tinned copper alloy wire in each of the temperature controllable areas comprises: receiving scratch length data, scratch pressure data, and scratch angle data input by an operator, and controlling the scratching device according to the scratch length data, the scratch pressure data, and the scratch angle data; When the temperature of the tinned copper alloy wire in each of the temperature-controllable areas reaches a preset temperature, the scoring device is controlled to form the first scratch, the second scratch and the third scratch on the tinned copper alloy wire in the normal temperature zone, the high temperature zone and the low temperature zone respectively.

5. The tinned copper alloy wire quality control method according to claim 4, characterized in that: Before the temperature of the tinned copper alloy wire in each of the temperature controllable areas reaches a preset temperature, the method further comprises: Obtaining a feed speed of the tinned copper alloy wire and a temperature adjustment power of a tinned copper alloy wire quality control device; Obtaining temperature adjustment time data required to adjust the temperature of the tinned copper alloy wire in each temperature controllable area to the preset temperature based on the maximum operating temperature data, the minimum operating temperature data, and the temperature adjustment power; Temperature adjustment stroke data is obtained based on the feed speed and the temperature adjustment time data; wherein the temperature adjustment stroke data reflects the length of the tinned copper alloy wire fed from the initial point into the temperature controllable area farthest from the feed end of the tinned copper alloy wire quality control device to the time when the temperature of the tinned copper alloy wire in each temperature controllable area reaches the preset temperature; Control the tinned copper alloy wire quality control equipment to set the temperature controllable areas at intervals; wherein the interval distance between the temperature controllable areas is greater than the sum of the temperature adjustment stroke data and the scratch length data.

6. The tinned copper alloy wire quality control method according to claim 4, characterized in that: The scratch image analysis model is trained using multiple sets of training data, each of which includes a scratch image and identification information for identifying the scratch depth and peeling form in the scratch image; the analysis information includes scratch depth data and peeling form information; Obtaining corresponding quality score data based on the analysis information of each scratch image includes: Assigning a value to the spalling form information in the analysis information to obtain spalling value data; A weighted calculation is performed on the scratch depth data and the peeling value data of the first scratch, the second scratch, and the third scratch, respectively, to obtain corresponding first quality score data, second quality score data, and third quality score data.

7. The method for controlling the quality of tinned copper alloy wire according to claim 6, wherein: Before comparing the quality score data with reference quality score data, the method includes: Selecting a section of qualified sample wire, and controlling the scoring device to score the qualified sample wire multiple times at room temperature based on the score length data, the scoring pressure data, and the scoring angle data; Collecting scratch images generated by scratching the qualified sample wire rod multiple times to obtain a plurality of standard scratch images; Inputting the plurality of standard scratch images into the scratch image analysis model to obtain a plurality of standard scratch information output by the scratch image analysis model; wherein the standard scratch information includes standard scratch depth data and standard peeling form information; Assigning a value to the standard peeling form information to obtain standard peeling value data; Based on the plurality of standard scratch depth data and the standard peeling value data of the qualified sample wire rod, reference scratch depth data and reference peeling value data are obtained; The reference scratch depth data and the reference peeling value data are weightedly calculated to obtain reference quality score data.

8. A tinned copper alloy wire quality control device, characterized in that: include: A feeding device, wherein the feeding device is provided with a plurality of temperature-controllable areas for conveying tinned copper alloy wire; a plurality of cameras, wherein the plurality of cameras are arranged on the feeding device and are used to capture images of the tinned copper alloy wire; an operating table, arranged on one side of the feeding device; as well as a plurality of scoring devices, disposed on the feeding device and correspondingly disposed in the plurality of temperature-controllable regions, the scoring devices being used to score the tinned copper alloy wires in the temperature-controllable regions; Wherein, the feeding device, the multiple cameras and the multiple engraving devices are electrically connected to the operating table respectively; the operating table includes a memory, a processor and a computer program stored in the memory and runnable on the processor, and when the processor executes the computer program, it implements the method according to any one of claims 1 to 7.

9. The tinned copper alloy wire quality control device according to claim 8, characterized in that: The tinned copper alloy wire quality control equipment further includes a plurality of temperature regulating devices, which are movably arranged on the feeding device and spaced apart along the feeding direction of the feeding device, and are electrically connected to the operating table; the temperature regulating devices are used to regulate the temperature in the temperature-controllable area to a preset temperature; The temperature control device corresponds to the temperature controllable area one by one, and the temperature control range of the temperature control device is adjustable so that the range of the temperature controllable area changes with the temperature control range of the temperature control device, and the temperature controllable area moves with the movement of the temperature control device.

10. The tinned copper alloy wire quality control device according to claim 9, characterized in that: The tinned copper alloy wire quality control equipment further comprises: Multiple moving components are arranged on the feeding device, and the power output end of each moving component is connected to each temperature control device one by one, and is electrically connected to the operating table so that the operating table can control the movement of the temperature control device under the drive of the moving component.

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