A 2D and 3D visual inspection mechanism and inspection method for chip DB and gold wire WB

Abstract

The present invention relates to a visual inspection mechanism, and discloses a 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB and an inspection method thereof. The visual inspection mechanism comprises a visual inspection station (31) and a tray conveying station (32). The tray conveying station (32) is provided with a tray conveying mechanism (5), and the tray conveying mechanism (5) comprises a tray conveying track (51). The visual inspection station (31) is provided with a 2D visual inspection camera (33) and a 3D visual inspection camera (34), and further comprises two tray suction plates (8) capable of moving up and down and used for adsorbing the tray on the tray conveying track (51). The tray suction plate (8) corresponding to the 2D visual inspection camera (33) is made of a transparent material and is provided with a backlight source below. The present invention can effectively ensure the stability and position accuracy of the inspected part during the inspection process by setting the tray suction plate.

Description

Technical Field

[0001] The present invention relates to the field of visual inspection, and in particular to a 2D and 3D visual inspection mechanism and an inspection method for a chip DB and a gold wire WB. Background Art

[0002] DB is the abbreviation of "DieBond", which means die bonding. Sticking the die bonding to the LeadFrame can be understood as sticking the chip to the PCB or other substrates through glue. WB is the abbreviation of "WireBond", which means welding wires. Connecting wires on the die bonding can be understood as using equipment to connect the chip and PCB through gold wires or aluminum wires. These are two processes before semiconductor packaging and testing.

[0003] DB and WB need to be tested to determine whether the product is qualified. The prior art provides automated detection for DB and WB. For example, the patent application document with application publication number CN 113075231 A discloses an automated intelligent detection method and system for chip DB and gold wire WB, which can use artificial intelligence methods to simulate the operation of detection personnel, realize automatic movement, automatic data collection, and automatic measurement results.

[0004] For the most important detection mechanism part of this type of detection system, the stability and position accuracy of the detected part during the detection process will directly affect the detection result. Therefore, how to ensure the stability of the detection process and the accuracy of the position of the detected part is a technical problem that needs to be solved urgently. Summary of the invention

[0005] The present invention aims at the problem of how to improve the stability of the detection process and the position accuracy of the detected parts in the visual detection mechanism of the chip DB and the gold wire WB, and provides a 2D and 3D visual detection mechanism and a detection method of the chip DB and the gold wire WB.

[0006] In order to solve the above technical problems, the present invention is solved by the following technical solutions:

[0007] A 2D and 3D visual inspection mechanism for chips DB and gold wires WB, comprising a visual inspection station and a tray conveying station, wherein a tray conveying mechanism is provided at the tray conveying station, wherein the tray conveying mechanism comprises a tray conveying track, wherein a 2D visual inspection camera and a 3D visual inspection camera are sequentially provided at the visual inspection station along the conveying direction of the tray conveying track, and further comprising two tray suction plates capable of moving up and down and used for adsorbing the tray on the tray conveying track, wherein the two tray suction plates are both arranged below the tray conveying track and respectively correspond to the 2D visual inspection camera and the 3D visual inspection camera, wherein the tray suction plate corresponding to the 2D visual inspection camera is made of a transparent material and has a backlight source below, and further comprising an ink dotting machine arranged at the 3D visual inspection camera for dotting ink on defective products.

[0008] Preferably, the visual inspection station is also provided with a 2D camera adjustment mechanism and a 3D camera adjustment mechanism for adjusting the positions of the 2D visual inspection camera and the 3D visual inspection camera, respectively. The 2D camera adjustment mechanism and the 3D camera adjustment mechanism include a 2D camera linear motor module and a 3D camera linear motor module that can respectively realize the movement of the 2D visual inspection camera and the 3D visual inspection camera in the horizontal plane along the length and width direction of the tray conveying track. The 2D camera adjustment mechanism and the 3D camera adjustment mechanism can realize the adjustment of the positions of the 2D visual inspection camera and the 2D visual inspection camera, so that they can better detect the materials on the tray.

[0009] Preferably, the 2D visual inspection camera includes a camera body, a coaxial light source and an annular light source assembly arranged below the camera body, the annular light source assembly includes three types of annular light sources which are connected in sequence from top to bottom and whose light holes have gradually increasing diameters, and the annular light source angles of the three types of annular light sources are 10°, 45° and 70° from top to bottom, respectively.

[0010] Preferably, the tray conveying mechanism includes a fixed conveying frame and a movable conveying frame that can move toward or away from the fixed conveying frame, the fixed conveying frame and the movable conveying frame respectively include a fixed track plate and a movable track plate, the fixed track plate and the movable track plate are arranged in parallel and the upper ends of the opposite sides are both constructed with tray edge supports, the tray edge supports on the fixed track plate and the tray edge supports on the movable track plate together constitute a tray conveying track. The fixed track plate and the movable track plate can move relative to each other, thereby making it suitable for conveying and detecting trays of different widths.

[0011] Preferably, track guide plates are provided on the fixed track plate and the movable track plate and at the inlet and outlet ends of the tray conveying track. The side of the track guide plate is structured with a tray edge upper limit platform arranged above the tray edge support platform. The tray edge support platform and the lower end surface of the tray edge upper limit platform together constitute a tray edge guide groove. The lower end surface of the tray edge upper limit platform includes a horizontal limit surface parallel to the tray edge support platform and an inclined guide surface arranged at the starting end of the horizontal limit surface. The setting of the inclined guide surface can accurately guide the pushed tray to the tray edge support platform.

[0012] Preferably, the tray conveying mechanism further comprises a movable clamping jaw capable of moving along the length direction of the tray conveying track for clamping the edge of the tray, and the movable clamping jaw comprises two clamping plates capable of relative movement. The movable clamping jaw not only realizes the transportation of the tray between the two detection positions, but also has the function of clamping the detected tray and pushing it into the empty tray.

[0013] Preferably, an inkjet positioning mechanism is provided at the lower part of the ink dispenser at the tray conveying track, and the inkjet positioning mechanism includes an inkjet positioning frame, and an inkjet positioning plate capable of blocking and positioning the tray on the tray conveying track is installed on the inkjet positioning frame, and the inkjet positioning plate can move up and down along the height direction of the tray conveying track to the upper part or the lower part of the tray; the inkjet positioning frame includes a positioning frame bottom plate and a positioning plate bracket arranged on the positioning frame bottom plate, and the positioning plate bracket is slidingly arranged on the positioning frame bottom plate along the width direction of the tray conveying track, and the inkjet positioning plate is arranged on the positioning plate bracket. The setting of the inkjet positioning plate can effectively realize the positioning of the tray on the tray conveying track, so that it can reach the accurate inkjet position, and then achieve more accurate inkjet positioning.

[0014] Preferably, a tray support assembly is further provided on the positioning plate bracket, and the tray support assembly includes a tray support rod capable of supporting the bottom of the tray on the tray conveying track; the length direction of the tray support rod is arranged along the length direction of the tray conveying track, and the upper end surface of the tray support rod is an arc surface. The arrangement of the tray support rod can support the middle part of the tray, and prevent the middle part from sinking during the tray detection process, which may cause inaccurate detection results. The arrangement of the arc surface of the tray support rod makes it in line contact with the tray, which can effectively prevent the tray support rod from scratching the tray.

[0015] Preferably, the inkjet positioning plate is constructed as a U-shaped plate with an open upper end. The inkjet positioning plate is arranged below the tray support rod and can move upward until the tray support rod is located inside the inkjet positioning plate.

[0016] Preferably, a bracket limit plate is fixed on the bottom plate of the positioning frame, and a long limit plate groove is provided on the bracket limit plate along the width direction of the track. A plurality of bolt holes arranged at intervals and cooperating with the long groove are provided on the positioning plate bracket, and a tightening wrench is provided at the bolt hole for achieving relative fixed limitation of the positioning plate bracket and the bracket limit plate.

[0017] A 2D and 3D visual inspection method for a chip DB and a gold wire WB is implemented by a 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB, and specifically comprises the following steps:

[0018] Step S1, the material tray to be inspected loaded with materials on the tray conveyor track is transported to the 2D visual inspection station below the 2D visual inspection camera for 2D inspection;

[0019] Step S2: After the 2D inspection is completed, the 3D inspection station is transported to the lower part of the 3D visual inspection camera for 3D inspection.

[0020] Step S3, after the visual inspection is completed, if it is a NG product, an ink dotting machine will be used to mark the NG position and then transported to the unloading station; if it is a good product, it will be directly transported to the unloading station.

[0021] The present invention has significant technical effects due to the adoption of the above technical solution:

[0022] Under the action of the material tray suction plate, the material tray of the present invention can ensure that the material tray is completely fixed and flat without deformation during the detection process, thereby effectively ensuring the stability and position accuracy of the detected part during the detection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the visual detection mechanism in Example 1 of the present invention.

[0024] Figure 2 yes Figure 1 Schematic diagram of the structure of the 2D camera adjustment mechanism.

[0025] Figure 3 yes Figure 1 Schematic diagram of the structure of the 3D camera adjustment mechanism.

[0026] Figure 4 yes Figure 1 Schematic diagram of the structure of the middle material tray conveying mechanism.

[0027] Figure 5 yes Figure 4 A partial enlarged view of the fixed conveyor rack or the movable conveyor rack.

[0028] Figure 6 yes Figure 5 Schematic diagram of the structure of the middle track guide plate.

[0029] Figure 7 yes Figure 1 Schematic diagram of the structure of the middle clamping jaw drive mechanism.

[0030] Figure 8 yes Figure 1 Schematic diagram of the structure of the inkjet positioning mechanism. DETAILED DESCRIPTION

[0031] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0032] Example 1

[0033] This embodiment provides a 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB, such as Figure 1-Figure 8 As shown, it includes a visual inspection station 31 and a tray conveying station 32.

[0034] Among them, a 2D visual inspection camera 33 and a 3D visual inspection camera 34 are sequentially arranged at the visual inspection station 31 along the conveying direction of the tray conveying track 51, and also include two tray suction plates 8 that can move up and down and are used to adsorb the trays on the tray conveying track 51. The two tray suction plates 8 are both arranged below the tray conveying track 51 and correspond to the 2D visual inspection camera 33 and the 3D visual inspection camera 34 respectively. The tray suction plate 8 corresponding to the 2D visual inspection camera 33 is made of transparent material and is provided with a backlight source underneath. It also includes an ink dotting machine 35 that is arranged at the 3D visual inspection camera 34 and located on the 3D camera linear motor module 304 for marking defective products with ink.

[0035] A backlight source is arranged at the bottom of the tray suction plate 8, so that the backlight source illuminates from below the product, which can make the 2D visual inspection camera 33 take clearer pictures and more accurate results. The backlight source has a better inspection effect on hollowed-out materials, which can make the hollowed-out edges clearer. In addition, a ring light source is arranged below the 2D visual inspection camera 33, which can effectively eliminate the shadows caused by the backlight source installation connector.

[0036] In this embodiment, the 2D visual inspection camera 33 includes a camera body 331, a coaxial light source 332 arranged below the camera body 331, and an annular light source assembly 333. The annular light source assembly 333 includes three types of annular light sources that are connected in sequence from top to bottom and whose light holes have gradually increasing diameters. The annular light source angles of the three types of annular light sources are 10°, 45° and 70° from top to bottom, respectively.

[0037] In this embodiment, when the lens working distance allows, a coaxial + three-angle ring light source design is adopted. The angles of the ring light source are 10°, 45°, and 70° from bottom to top. Generally, 10° is used. 10° is a low-angle light source, which is suitable for detecting scratches and is also the main defect object to be detected. 45° is suitable for scenes with protruding or concave features, and 70° is suitable for detecting features on the surface of objects, such as characters and inkjet codes. 45° and 70° are used when on-site customers add detection objects. By filling in the program to close 10° and open the 45° or 70° ring light source, its features can be detected.

[0038] The diameters of the light holes of the other three angles of the ring light sources are gradually increased, which can effectively meet the lighting requirements of the upper ring light source.

[0039] The visual inspection station 31 is also provided with a 2D camera adjustment mechanism 301 and a 3D camera adjustment mechanism 302 for adjusting the positions of the 2D visual inspection camera 33 and the 3D visual inspection camera 34 respectively. The 2D camera adjustment mechanism 301 and the 3D camera adjustment mechanism 302 include a 2D camera linear motor module 303 and a 3D camera linear motor module 304 which can respectively realize the movement of the 2D visual inspection camera 33 and the 3D visual inspection camera 34 in the horizontal plane along the length and width directions of the tray conveying track 51.

[0040] A tray conveying mechanism 5 is provided at the tray conveying station 32 . The tray conveying mechanism 5 comprises a tray conveying track 51 . A tray discharge position 15 and a tray receiving position 16 are respectively located at both ends of the inlet and outlet of the tray conveying track 51 .

[0041] Among them, the tray conveying mechanism 5 includes a fixed conveying frame 501 and a movable conveying frame 502 that can move toward or away from the fixed conveying frame 501. In order to realize the movement of the movable conveying frame 502, it also includes a conveying frame driving mechanism. The conveying frame driving mechanism includes a conveying frame driving motor 516, a conveying frame driving screw 517 connected to the conveying frame driving motor 516, and a driving frame 518 connected to the conveying frame driving screw 517. The driving frame 518 is fixed on the movable conveying frame 502.

[0042] To further ensure the movement stability of the movable conveyor frame 502, the movable conveyor frame 502 also includes two movable support plates 519 arranged at both ends of the movable track plate 504 and used to support the movable track plate 504. The conveyor frame driving mechanism also includes a support plate rail 520 arranged at the lower part of the movable support plate 519 for the movable support plate 519 to slide and a driving frame rail 521 arranged at the lower part of the driving frame 518 for the driving frame 518 to slide.

[0043] The fixed conveying frame 501 and the movable conveying frame 502 respectively include a fixed track plate 503 and a movable track plate 504. The fixed track plate 503 and the movable track plate 504 are arranged in parallel and the upper ends of the opposite sides are constructed with a tray edge support 505. The tray edge support 505 on the fixed track plate 503 and the tray edge support 505 on the movable track plate 504 together constitute the tray conveying track 51.

[0044] Track guide plates 506 are provided on the fixed track plate 503 and the movable track plate 504 and at the inlet and outlet ends of the tray conveying track 51. The side of the track guide plate 506 is constructed with a tray edge upper positioning platform 507 arranged above the tray edge support platform 505. The lower end surfaces of the tray edge support platform 505 and the tray edge upper positioning platform 507 together constitute a tray edge guide groove 508; the lower end surface of the tray edge upper positioning platform 507 includes a horizontal limiting surface 509 parallel to the tray edge support platform 505 and an inclined guide surface 510 arranged at the starting end of the horizontal limiting surface 509.

[0045] Under the action of the track guide plate 506, the pushed material tray can be accurately guided to the material tray edge support 505, and under the joint action of the track guide plate 506 and the material tray suction plate 8, it can ensure that the material tray is completely fixed and flat without deformation during the detection process, thereby ensuring the accuracy of the detection results.

[0046] The tray conveying mechanism 5 also includes a plurality of movable jaws 52 that can move along the length direction of the tray conveying track 51 for clamping the edge of the tray. The movable jaws 52 include two clamping plates 511 that can move relative to each other. The movable jaws 52 near the tray receiving position 16 constitute a second tray pushing mechanism.

[0047] The mobile clamp 52 clamps the material tray on the material tray conveying track 51 and transports it to different inspection stations. After the inspection is completed, the mobile clamp 52 pushes the inspected products one by one into the empty material box. After the material box is full, it is transported to the unloading mechanism 12 by the material box grasping mechanism 104 in the material box transport frame 14 at the unloading mechanism 12 for further transportation to the subsequent station.

[0048] In this embodiment, the movable clamp 52 is arranged on the side of the fixed conveying frame 501, and also includes a clamp driving mechanism. The clamp driving mechanism includes a clamp linear motor module 512 arranged along the length direction of the tray conveying track 51. A clamp mounting seat 513 is installed on the clamp linear motor module 512. The clamp mounting seat 513 is provided with two oppositely arranged clamping plate mounting arms 514 and a mounting arm driving cylinder 515 that can drive the clamping plate mounting arms 514 to move along the width direction of the tray conveying track 51. The two clamping plates 511 are respectively mounted on the two clamping plate mounting arms 514 and the two clamping plate mounting arms 514 can move toward or away from each other. The specific movement driving method can be driven by a conventional bidirectional motor or a bidirectional cylinder.

[0049] When a defect is detected, the defective product needs to be marked with inkjet. Since the chip is small, the positioning requires precision, and the material is very thin, when the clamp drags the material over, there is a possibility of relative sliding between the clamp and the material. The positioning cannot be accurately determined by simply moving the clamp 52 along the X-axis. Therefore, an inkjet positioning mechanism 7 is designed.

[0050] In this embodiment, an inkjet positioning mechanism 7 located at the lower part of the ink dispenser 35 is provided at the tray conveying track 51, and the inkjet positioning mechanism 7 includes an inkjet positioning frame 71, and an inkjet positioning plate 701 is installed on the inkjet positioning frame 71, which can block and position the tray on the tray conveying track 51, and the inkjet positioning plate 701 can move up and down along the height direction of the tray conveying track 51 to the upper part or the lower part of the tray; the inkjet positioning frame 71 includes a positioning frame bottom plate 702 and a positioning plate bracket 703 arranged on the positioning frame bottom plate 702, and the positioning plate bracket 703 is slidingly arranged on the positioning frame bottom plate 702 along the width direction of the tray conveying track 51, and the inkjet positioning plate 701 is arranged on the positioning plate bracket 703, and a vertically arranged fixed plate driving cylinder 704 is fixed on the positioning plate bracket 703, and the inkjet positioning plate 701 is connected to the piston rod of the fixed plate driving cylinder 704.

[0051] A tray support assembly is also provided on the positioning plate bracket 703, and the tray support assembly includes a tray support rod 522 that can support the bottom of the tray on the tray conveying track 51; the tray support rod 522 is arranged along the length direction of the tray conveying track 51 and the upper end face of the tray support rod 522 is an arc surface.

[0052] The inkjet positioning plate 701 is constructed in a U-shaped plate shape with an open upper end. The inkjet positioning plate 701 is arranged below the material tray support rod 522 and can move upward until the material tray support rod 522 is inside the inkjet positioning plate 701. The U-shaped plate shape of the inkjet positioning plate 701 can prevent the material tray support rod 522 from blocking the inkjet positioning plate 701 when the inkjet positioning plate 701 moves upward.

[0053] A bracket limiting plate 705 is fixed on the positioning frame base plate 702, and a limiting plate long groove 706 is provided on the bracket limiting plate 705 along the width direction of the track. A plurality of bolt holes 707 arranged at intervals and cooperating with the long groove are provided on the positioning plate bracket 703, and a tightening wrench 708 is provided at the bolt hole 707 for achieving relative fixed limiting of the positioning plate bracket 703 and the bracket limiting plate 705.

[0054] Positioning frame fixing plates 709 are further provided at both ends of the positioning frame bottom plate 702 , and the positioning frame fixing plates 709 are provided with vertically arranged fixing plate long grooves 710 for adjusting the installation height of the positioning frame fixing plates 709 .

[0055] During the operation of the inkjet positioning mechanism 7, after adjusting the width of the tray conveying track 51, the entire positioning plate bracket 703 is moved relative to the positioning frame bottom plate 702 to the middle position of the tray conveying track 51 by loosening the tightening wrench 708. At this time, the inkjet positioning plate 701 and the tray support rod 522 are centrally arranged in the tray conveying track 51. Since the tray is thin and has a certain flexibility, the tray support rod 522 supports the middle part of the tray, which can avoid the concave deformation of the middle part of the tray during the tray detection process. The upper surface of the tray support rod 522 is configured as a circular arc surface, which can make the tray support rod 522 and the lower surface of the tray in line contact, thereby reducing the potential risk of scratching the product.

[0056] When product inspection is completed and defective products are found, the inkjet positioning plate 701 is lifted up. When the material moves into place, it is blocked in the center by the inkjet positioning plate 701. The sensor in the inkjet positioning plate 701 detects that it is in place, and the flow direction is hard limited to ensure the accuracy of inkjet in the process. After the inkjet at the defective part is completed, the inkjet positioning plate 701 is lowered and the product is transported to the next station.

[0057] During the operation of the entire visual inspection system of this embodiment, the material tray to be inspected loaded with materials on the material tray conveying track 51 is transported to the 2D visual inspection station below the 2D visual inspection camera 33 for 2D inspection; after the 2D inspection is completed, it is transported to the 3D visual inspection station below the 3D visual inspection camera 34 for 3D inspection;

[0058] After the visual inspection is completed, if it is a NG product, the ink dotting machine 35 will mark the NG position and then transport it to the unloading station; if it is a good product, it will be directly transported to the unloading station.

[0059] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application to obtain other embodiments based on one or several embodiments provided in the present application, and these embodiments do not exceed the protection scope of the present application.

[0060] In conclusion, the above is only a preferred embodiment of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the patent of the present invention.

Claims

1. A 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB, comprising a visual inspection station (31) and a tray conveying station (32), wherein a tray conveying mechanism (5) is provided at the tray conveying station (32), characterized in that: The tray conveying mechanism (5) comprises a tray conveying track (51), a 2D visual inspection camera (33) and a 3D visual inspection camera (34) are sequentially arranged at the visual inspection station (31) along the conveying direction of the tray conveying track (51), and also comprises two tray suction plates (8) capable of moving up and down and used for adsorbing the trays on the tray conveying track (51), the two tray suction plates (8) are both arranged below the tray conveying track (51) and are respectively arranged corresponding to the 2D visual inspection camera (33) and the 3D visual inspection camera (34), the tray suction plate (8) corresponding to the 2D visual inspection camera (33) is made of transparent material and is provided with a backlight source below, and also comprises an ink dotting machine (35) arranged at the 3D visual inspection camera (34) for dotting ink marks on defective products; The tray conveying mechanism (5) comprises a fixed conveying frame (501) and a movable conveying frame (502) capable of moving toward or away from the fixed conveying frame (501); the fixed conveying frame (501) and the movable conveying frame (502) respectively comprise a fixed track plate (503) and a movable track plate (504); the fixed track plate (503) and the movable track plate (504) are arranged in parallel and the upper ends of the opposite sides are both configured with a tray edge support (505); the tray edge support (505) on the fixed track plate (503) and the tray edge support (505) on the movable track plate (504) together constitute a tray conveying track (51); the tray conveying mechanism (5) further comprises a movable clamping jaw (52) capable of moving along the length direction of the tray conveying track (51) for clamping the edge of the tray; the movable clamping jaw (52) comprises two clamping plates (511) capable of moving relative to each other; The movable clamping claw (52) constitutes a tray pushing mechanism for clamping and transporting the tray on the tray conveying track (51) to different inspection stations and pushing the inspected tray into an empty material box; Track guide plates (506) are provided on the fixed track plate (503) and the movable track plate (504) at the inlet and outlet ends of the tray conveying track (51); the side of the track guide plate (506) is provided with a tray edge upper positioning platform (507) arranged above the tray edge support platform (505); the lower end surfaces of the tray edge support platform (505) and the tray edge upper positioning platform (507) together form a tray edge guide groove (508).

2. The 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 1, characterized in that: A 2D camera adjustment mechanism (301) and a 3D camera adjustment mechanism (302) are also provided at the visual inspection station (31) for adjusting the positions of the 2D visual inspection camera (33) and the 3D visual inspection camera (34), respectively. The 2D camera adjustment mechanism (301) and the 3D camera adjustment mechanism (302) include a 2D camera linear motor module (303) and a 3D camera linear motor module (304) that can respectively enable the 2D visual inspection camera (33) and the 3D visual inspection camera (34) to move in a horizontal plane along the length and width directions of the tray conveying track (51).

3. A 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 1 or 2, characterized in that: The 2D visual inspection camera (33) comprises a camera body (331), a coaxial light source (332) arranged below the camera body (331), and an annular light source assembly (333), wherein the annular light source assembly (333) comprises three types of annular light sources which are sequentially connected from top to bottom and whose light holes have gradually increasing diameters, wherein the annular light source angles of the three types of annular light sources are 10°, 45°, and 70°, respectively, from top to bottom.

4. The 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 1, characterized in that: The lower end surface of the tray edge upper limit platform (507) comprises a horizontal limit surface (509) parallel to the tray edge support platform (505) and an inclined guide surface (510) arranged at the starting end of the horizontal limit surface (509).

5. The 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 1, characterized in that: An inkjet positioning mechanism (7) located at the bottom of the ink dispenser (35) is provided at the material tray conveying track (51). The inkjet positioning mechanism (7) comprises an inkjet positioning frame (71). An inkjet positioning plate (701) capable of blocking and positioning the material tray on the material tray conveying track (51) is installed on the inkjet positioning frame (71). The inkjet positioning plate (701) can move up and down along the height direction of the material tray conveying track (51) to the upper part or the lower part of the material tray. The inkjet positioning frame (71) comprises a positioning frame bottom plate (702) and a positioning plate bracket (703) arranged on the positioning frame bottom plate (702). The positioning plate bracket (703) is slidably arranged on the positioning frame bottom plate (702) along the width direction of the material tray conveying track (51). The inkjet positioning plate (701) is arranged on the positioning plate bracket (703).

6. The 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 5, characterized in that: A material tray support assembly is also provided on the positioning plate bracket (703), and the material tray support assembly comprises a material tray support rod (522) capable of supporting the bottom of the material tray on the material tray conveying track (51); the length direction of the material tray support rod (522) is arranged along the length direction of the material tray conveying track (51), and the upper end surface of the material tray support rod (522) is an arc surface.

7. The 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 5, characterized in that: The inkjet positioning plate (701) is constructed in the shape of a U-shaped plate with an open upper end. The inkjet positioning plate (701) is arranged below the material tray support rod (522) and can move upwards until the material tray support rod (522) is located inside the inkjet positioning plate (701).

8. The 2D and 3D visual inspection mechanism for a chip DB and a gold wire WB according to claim 5, characterized in that: A bracket limiting plate (705) is fixed on the positioning frame bottom plate (702); the bracket limiting plate (705) is provided with a limiting plate long groove (706) arranged along the width direction of the track; the positioning plate bracket (703) is provided with a plurality of bolt holes (707) arranged at intervals and matched with the long groove; and a tightening wrench (708) for achieving relative fixed limiting of the positioning plate bracket (703) and the bracket limiting plate (705) is provided at the bolt hole (707).

9. A 2D and 3D visual inspection method for chip DB and gold wire WB, characterized in that: It is implemented by using a 2D and 3D visual detection mechanism of a chip DB and a gold wire WB as described in any one of claims 1 to 8, and specifically includes the following steps: Step S1, a material tray to be inspected loaded with materials on a tray conveying track (51) is transported to a 2D visual inspection station below a 2D visual inspection camera (33) for 2D inspection; Step S2: After the 2D inspection is completed, the 3D visual inspection station below the 3D visual inspection camera (34) is transported to perform 3D inspection; Step S3, after the visual inspection is completed, if it is a NG product, the ink dotting machine (35) will be used to dot the NG position and then transported to the unloading station; if it is a good product, it will be directly transported to the unloading station.

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