New semiconductor clamp test station

Abstract

The invention discloses a novel semiconductor clamping test station, which relates to the field of semiconductor testing technology, and comprises: a base, on which a bracket is fixed; two symmetrically arranged pin assemblies, which are arranged on the bracket and are used to provide test pins; a chip providing assembly, which is used to provide a chip; a first limiting assembly and a second limiting assembly, which are used to limit and press the test pins from different directions, and then electrically connect the chip with the test pins to realize power-on testing of the chip; wherein the first limiting assembly and the second limiting assembly are both vertically slidably arranged on the bracket; wherein a motor is also arranged on the bracket, and a cam is installed at the output end of the motor, a groove body is opened in the cam, and a first cam follower and a second cam follower symmetrically distributed are slidably connected in the groove body, wherein the first cam follower is connected to the first limiting assembly, and the second cam follower is connected to the second limiting assembly.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor testing, in particular to a novel semiconductor clamping test station. Background Art

[0002] With the rapid development of semiconductor technology, new requirements have been put forward for the accuracy, stability and efficiency of chip testing. However, the current semiconductor testing field is facing a series of technical challenges, which limit the further development and application of testing technology.

[0003] First, the existing technology has obvious deficiencies in chip positioning. During the test process, the chip needs to be accurately placed on the test fixture to ensure the accuracy of the test data. However, traditional test equipment often cannot provide a sufficiently accurate positioning mechanism, which causes the chip to easily shift or shake during the transmission and positioning process. This instability not only increases the complexity of the test, but also directly affects the reliability of the test results, making it difficult for the test data to truly reflect the performance of the chip.

[0004] Secondly, temperature control is also a major problem in existing technologies. In specific test scenarios, strictly controlling the temperature of the chip is crucial to obtaining accurate test results. However, existing technologies may lack effective temperature control methods, resulting in large temperature fluctuations in the chip during the test. Such temperature fluctuations will not only affect the accuracy of the test data, but may also cause damage to the chip itself. Therefore, how to achieve precise temperature control has become an important direction for improving test technology.

[0005] In addition, existing testing technologies generally rely on manual operation and adjustment, which makes the testing process cumbersome and inefficient. Manual operation not only increases the time cost of testing, but also easily introduces errors due to human factors. At the same time, the lack of intelligent monitoring and feedback mechanisms also limits the accuracy and reliability of test results. In today's rapidly developing semiconductor industry, this inefficient testing method has been unable to meet market demand.

[0006] Therefore, it is necessary to develop a new type of semiconductor clamp test station to solve the above problems. Summary of the invention

[0007] To solve the above problems, the present invention provides the following technical solutions: A novel semiconductor clamping test station, comprising:

[0008] a base, on which a bracket is fixed;

[0009] Two symmetrically arranged pin assemblies, which are arranged on the bracket and are used to provide test pins;

[0010] A chip providing component, used for providing chips;

[0011] The first limiting component and the second limiting component are used to limit and press the test pins from different directions, thereby electrically connecting the chip with the test pins to implement a power-on test on the chip;

[0012] Wherein, the first limiting assembly and the second limiting assembly are both vertically slidably arranged on the bracket;

[0013] In which, a motor is also arranged on the bracket, a cam is installed at the output end of the motor, a groove is opened in the cam, a first cam follower and a second cam follower which are symmetrically distributed are slidably connected in the groove, wherein the first cam follower is connected to the first limit assembly, and the second cam follower is connected to the second limit assembly.

[0014] Further, preferably, the first limiting component comprises:

[0015] A first limiting plate, located below the test pin;

[0016] a first top block, which is fixed to the upper surface of the first limiting plate;

[0017] A first sliding shaft, which is fixed below the first limiting plate, and the first sliding shaft is vertically slidably arranged on the bracket;

[0018] a first yielding plate, which is fixed below the first sliding shaft and connected to the first cam follower;

[0019] A limiting screw is fixed on the upper surface of the first relief plate, and when the first top block presses against the test pin, the limiting screw begins to contact the bracket.

[0020] Further, preferably, the second limiting component comprises:

[0021] A second limiting plate, located above the test pin;

[0022] a second top block, fixed to the lower surface of the second limiting plate;

[0023] A second sliding shaft, which is fixed below the second limiting plate, and the second sliding shaft is vertically slidably arranged on the bracket;

[0024] The second yielding plate is fixed below the second sliding shaft and connected with the second cam follower.

[0025] Further, preferably, the pin assembly comprises:

[0026] An adjustment seat, which is slidably arranged on the bracket along the front-back direction;

[0027] A waist-shaped hole is provided on the adjustment seat, and a threaded hole corresponding to the waist-shaped hole is provided on the bracket;

[0028] An adjusting screw passes through the waist-shaped hole and is then screwed into the threaded hole;

[0029] The pin mounting piece is fixed on the adjustment seat and is used for mounting the test pin.

[0030] Further, as a preference, a pressure plate is provided on the lower surface of the first yield plate, and a pressure sensor corresponding to the pressure plate is provided on the bracket;

[0031] An origin plate is fixed below the cam, and an origin sensor corresponding to the origin plate is arranged on the bracket.

[0032] Further, preferably, the chip providing component is a nozzle.

[0033] Further, preferably, the chip providing component is a conveyor belt component, and the conveyor belt component comprises:

[0034] Two symmetrically arranged rotating wheels, which are rotatably arranged on a substrate and driven by a stepping motor;

[0035] A transmission belt, which is connected between the two rotating wheels;

[0036] Wherein, a plurality of limiting strips are evenly spaced and distributed on a surface of one side of the transmission belt close to the rotating wheel, and a limiting space is formed between two adjacent limiting strips so as to limit the placement of the chip;

[0037] Wherein, the rotating wheel is provided with protrusions corresponding to the limiting spaces.

[0038] Further, as a preference, a chip positioning component is provided between the two rotating wheels, and the chip positioning component comprises:

[0039] A lifting member having a lifting end;

[0040] An outer cylinder is mounted on the lifting end, and a groove is provided at the lower part of the outer cylinder;

[0041] Four positioning bars are respectively installed on four inner side surfaces of the groove.

[0042] Further, preferably, a temperature sensor is embedded in the positioning bar;

[0043] A temperature control component is also arranged in the groove.

[0044] Further, preferably, a heat expansion member is fixed above the positioning strip, and the cross section of the heat expansion member is "side L" shaped to form an accommodating space, and the accommodating space accommodates an elastic member, and the upper surface of the elastic member is higher than the upper surface of the chip.

[0045] Compared with the prior art, the present invention provides a novel semiconductor clamp test station, which has the following beneficial effects:

[0046] This test station can efficiently and accurately complete the chip positioning work through the first limit component, the second limit component and the chip providing component to carry out power-on testing, and the overall degree of automation is high, providing strong support for the quality control of semiconductor production lines;

[0047] In the present invention, the chip positioning assembly can not only improve the accuracy of chip positioning, but also provide accurate temperature control or temperature monitoring, wherein the thermal expansion member can automatically adjust its size when the temperature changes, and work with the elastic member to form a dynamic compensation for the gap between the chip and the test environment. This adaptive sealing can improve the reliability and stability of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a schematic diagram of the main structure of a new semiconductor clamp test station;

[0049] Figure 2 It is a schematic diagram of the three-dimensional structure of a new type of semiconductor clamp test station;

[0050] Figure 3 It is a structural schematic diagram of the first limit assembly in the novel semiconductor clamping test station;

[0051] Figure 4 It is a structural schematic diagram of the second limit assembly in the novel semiconductor clamp test station;

[0052] Figure 5 It is a top view structural diagram of a novel semiconductor clamp test station;

[0053] Figure 6 It is a schematic diagram of the structure of the cam in the new semiconductor clamping test station;

[0054] Figure 7 A schematic diagram of the structure of a conveyor belt assembly in a new semiconductor clamping test station;

[0055] Figure 8 It is a schematic diagram of the structure of the chip positioning component in the new semiconductor clamp test station;

[0056] In the figure: 1, base; 2, bracket; 3, pin assembly; 4, first limit assembly; 5, second limit assembly; 6, cam; 7, pressure sensor; 8, origin plate; 9, origin sensor; 10, nozzle; 11, motor; 12, rotating wheel; 13, transmission belt; 14, limit strip; 15, chip; 16, chip positioning assembly; 17, first cam follower; 18, second cam follower; 161, lifting member; 162, outer cylinder; 163. Positioning strip; 164. Temperature sensor; 165. Temperature control element; 166. Thermal expansion element; 167. Elastic element; 31. Adjustment seat; 32. Adjustment screw; 33. Pin mounting element; 34. Test pin; 41. First limit plate; 42. First top block; 43. First sliding shaft; 44. First clearance plate; 45. Limit screw; 51. Second limit plate; 52. Second top block; 53. Second sliding shaft; 54. Second clearance plate. DETAILED DESCRIPTION

[0057] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned description of the drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is merely a way of distinguishing the objects of the same attributes when describing them in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0058] Example 1: Please refer to Figure 1-Figure 6 In an embodiment of the present invention, a novel semiconductor clamp test station is provided, comprising:

[0059] A base 1, on which a bracket 2 is fixed;

[0060] Two symmetrically arranged pin assemblies 3, which are arranged on the bracket 2 and are used to provide test pins 34;

[0061] A chip providing component, used for providing a chip 15;

[0062] The first limiting component 4 and the second limiting component 5 are used to limit and press the test pin 34 from different directions, thereby electrically connecting the chip 15 with the test pin 34 to implement a power-on test on the chip 15;

[0063] Wherein, the first limiting assembly 4 and the second limiting assembly 5 are both vertically slidably arranged on the bracket 2;

[0064] In which, the bracket 2 is also provided with a motor 11, and a cam 6 is installed at the output end of the motor 11. A groove body is opened in the cam 6, and a first cam follower 17 and a second cam follower 18 which are symmetrically distributed are slidably connected in the groove body, wherein the first cam follower 17 is connected to the first limit assembly 4, and the second cam follower 18 is connected to the second limit assembly 5.

[0065] Based on this, the implementation includes the following steps:

[0066] Step 1: The chip providing assembly starts working, and the chip 15 to be tested is placed near the test pin 34 of the pin assembly 3. At this time, the chip 15 has not yet established an electrical connection with the test pin 34;

[0067] Step 2: The motor 11 is started, and its output end drives the cam 6 to rotate. As the cam 6 rotates, the first cam follower 17 and the second cam follower 18 slide along the slot body.

[0068] Since the first cam follower 17 is connected to the first limit assembly 4, and the second cam follower 18 is connected to the second limit assembly 5, as the cam followers (the first cam follower 17, the second cam follower 18) move, the first limit assembly 4 and the second limit assembly 5 also slide vertically on the bracket 2 (the two move closer to each other);

[0069] Step 3: As the limiting components (first limiting component 4, second limiting component 5) slide, they approach the test pin 34 and the chip 15 from different directions. When the limiting components reach the predetermined position, they press the test pin 34 and the chip 15 at the same time to ensure a good electrical connection between the chip 15 and the test pin 34;

[0070] Step 4: The test system starts to perform power-on test on the chip 15, and the test content includes multiple aspects such as function verification, performance evaluation, and fault detection;

[0071] Step 5: After the test is completed, the motor 11 is reversed to drive the cam 6 to rotate in the opposite direction, so that the first cam follower 17 and the second cam follower 18 slide in the opposite direction along the slot body, thereby driving the first limit assembly 4 and the second limit assembly 5 to reset to the initial position;

[0072] Then, the chip providing component moves the tested chip 15 out of the testing area to prepare for the next round of testing.

[0073] It can be seen from the above process that the test station can efficiently and accurately complete the positioning of the chip 15 for power-on testing, and has a high overall degree of automation, providing strong support for quality control of semiconductor production lines.

[0074] In this embodiment, the first limiting component 4 includes:

[0075] A first limiting plate 41, which is located below the test pin 34;

[0076] a first top block 42 fixed to the upper surface of the first limiting plate 41;

[0077] A first sliding shaft 43, which is fixed below the first limiting plate 41, and the first sliding shaft 43 is vertically slidably disposed on the bracket 2;

[0078] a first yielding plate 44, which is fixed below the first sliding shaft 43 and connected to the first cam follower 17;

[0079] A limiting screw 45 is fixed on the upper surface of the first relief plate 44 . When the first top block 42 presses against the test pin 34 , the limiting screw 45 begins to contact the bracket 2 .

[0080] The first top block 42 is fixed to the upper surface of the first limiting plate 41 , and directly participates in the process of tightening the test pin 34 and the chip 15 to ensure good contact with the test pin 34 and the chip 15 .

[0081] The first sliding shaft 43 is fixed below the first limiting plate 41 and is a key component that enables the first limiting assembly 4 to slide vertically on the bracket 2. Through the cooperation between the first sliding shaft 43 and the ball bushing on the bracket 2, the first limiting assembly 4 can move vertically accurately.

[0082] The limit screw 45 is fixed to the upper surface of the first clearance plate 44 to limit the vertical movement range of the first limit assembly 4. When the first top block 42 presses against the test pin 34, the limit screw 45 begins to contact the bracket 2, which ensures the reliability of the electrical connection and prevents the first limit assembly 4 from excessive movement.

[0083] Based on this, when the motor 11 is started, it drives the cam 6 to rotate, and the first cam follower 17 is pushed, thereby driving the first limit plate 41 and the first top block 42 to move vertically through the first yield plate 44 and the first slide shaft 43 .

[0084] When the first top block 42 contacts the test pin 34 and continues to move upward, it will gradually press against the test pin 34 and the chip 15 to ensure a good electrical connection between them. At the same time, the limit screw 45 will gradually approach the bracket 2 as the first yielding plate 44 moves.

[0085] When the first top block 42 completely presses the test pin 34 , the limit screw 45 begins to contact the bracket 2 . At this time, the vertical movement of the first limit assembly 4 is restricted, and the entire test process enters a stable state.

[0086] In this embodiment, the second limiting component 5 includes:

[0087] A second limiting plate 51, which is located above the test pin 34;

[0088] a second top block 52 fixed to the lower surface of the second limiting plate 51;

[0089] A second sliding shaft 53, which is fixed below the second limiting plate 51, and the second sliding shaft 53 is vertically slidably disposed on the bracket 2;

[0090] The second yielding plate 54 is fixed below the second sliding shaft 53 and connected to the second cam follower 18 .

[0091] Similar to the first limiting assembly 4 , after the motor 11 is started, it drives the cam 6 to rotate. At this time, the second cam follower 18 is pushed, and then drives the second limiting plate 51 and the second top block 52 to move vertically through the second yielding plate 54 and the second sliding shaft 53 .

[0092] When the second top block 52 contacts the test pin 34, it will continue to move downward and apply pressure, gradually pressing the test pin 34 and the chip 15 to ensure a good electrical connection between them. At this time, the first top block 42 of the first limit assembly 4 has also pressed the test pin 34 and the chip 15 from below, and the two work together to form a stable electrical connection.

[0093] During the test, the second limiting assembly 5 and the first limiting assembly 4 maintain a stable pressing state, ensuring good contact and reliable electrical connection between the chip 15 and the test pin 34 .

[0094] After the test is completed, the motor 11 reverses to drive the cam 6 to rotate in the opposite direction. The second cam follower 18 moves accordingly, and drives the second stop assembly 5 to reset to the initial position through the second yielding plate 54 and the second slide shaft 53, ready for the next round of testing.

[0095] Through such structural design and working process, the second limiting component 5 works in coordination with the first limiting component 4 to ensure a stable electrical connection between the chip 15 and the test pin 34 during the test, thereby improving the accuracy and reliability of the test.

[0096] In this embodiment, the pin assembly 3 includes:

[0097] An adjustment seat 31, which is slidably disposed on the bracket 2 along the front-rear direction;

[0098] A waist-shaped hole is provided on the adjustment seat 31, and a threaded hole corresponding to the waist-shaped hole is provided on the bracket 2;

[0099] An adjusting screw 32 passes through the waist-shaped hole and is screwed into the threaded hole;

[0100] The pin mounting member 33 is fixed on the adjustment seat 31 and is used for mounting the test pin 34 .

[0101] In this embodiment, when installing or adjusting the position of the test pin 34, firstly, the adjusting screw 32 is loosened, and then the adjusting seat 31 is slid along the front-back direction to the desired position, and then the adjusting screw 32 is tightened.

[0102] Through this design, the pin assembly 3 is not only highly flexible and can adjust the position of the test pin 34 according to actual needs; it is also stable and can ensure the stability and reliability of the test pin 34 during the test process.

[0103] During the test, the first stopper assembly 4 and the second stopper assembly 5 press the chip 15 and the test pin 34 from the upper and lower directions respectively to form a stable electrical connection. At this time, the adjustment seat 31 and the test pin 34 thereon remain fixed to ensure the accuracy of the test.

[0104] In this embodiment, a pressure plate is provided on the lower surface of the first yield plate 44, and a pressure sensor 7 corresponding to the pressure plate is provided on the bracket 2;

[0105] An origin plate 8 is fixed below the cam 6 , and an origin sensor 9 corresponding to the origin plate 8 is disposed on the bracket 2 .

[0106] In this embodiment, a pressure plate is provided on the lower surface of the first stop plate 44, which is a mechanical contact component, and is used for the pressure sensor 7 to sense the contact pressure change and convert it into an electrical signal output when the first stop assembly 4 moves downward or upward to make a contact change with the pressure sensor 7. This signal can be used in the control system to monitor whether the first stop assembly 4 has reached a predetermined position.

[0107] In addition, the origin sensor 9 cooperates with the origin plate 8 to detect whether the cam 6 is at the starting point or reference point of the rotation. The origin sensor 9 may be a laser sensor.

[0108] The chip providing component is a nozzle 10 , which can be driven by an external robot arm to move in three dimensions so as to deliver the chip 15 to the test area (near the test pin 34 ).

[0109] Example 2: Please refer to Figure 7-Figure 8 , which is different from Example 1 in that: the chip providing component is a conveyor belt component, and the conveyor belt component includes:

[0110] Two symmetrically arranged rotating wheels 12, the rotating wheels 12 are rotatably arranged on the substrate and driven by a stepping motor;

[0111] A transmission belt 13, which is connected between the two rotating wheels 12;

[0112] A plurality of limiting strips 14 are evenly spaced and distributed on one side of the transmission belt 13 close to the rotating wheel 12, and a limiting space is formed between two adjacent limiting strips 14 so as to limit the placement of the chip 15;

[0113] The rotating wheel 12 is provided with protrusions corresponding to the limiting spaces.

[0114] These protrusions are designed to cooperate with the limiting strips 14 on the transmission belt 13 to ensure that the transmission belt 13 can move stably;

[0115] In addition, the limiting strips 14 are also the main support and limiting structure of the chip 15 during the transmission process. The limiting space formed between two adjacent limiting strips 14 can just accommodate one chip 15, ensuring the stability and accuracy of the chip during the transmission process.

[0116] Before starting the transmission, the chip 15 is placed in the limiting space on the conveyor belt 13. Due to the existence of the limiting strip 14, the chip 15 can be firmly positioned at a predetermined position to prevent deviation or falling during the transmission process.

[0117] That is to say, by using the conveyor belt assembly as the chip providing assembly, the test station in this embodiment realizes the automatic transmission and precise positioning of the chip, thereby improving the test efficiency and accuracy. At the same time, the precise control of the stepper motor and the matching design of the limit bar 14 and the bump also ensure the stability and reliability of the transmission process.

[0118] When the stepper motor starts and drives the rotating wheel 12 to rotate, the transmission belt 13 starts to move in a circular motion. The chip 15 is transported forward along with the movement of the transmission belt 13 until it reaches the test area.

[0119] Of course, the loading and unloading process of the chip 15 can also be achieved by components such as a robot.

[0120] In this embodiment, a chip positioning component 16 is disposed between the two rotating wheels 12, and the chip positioning component 16 includes:

[0121] A lifting member 161 having a lifting end;

[0122] An outer cylinder 162 is mounted on the lifting end, and a groove is formed at the lower portion of the outer cylinder 162;

[0123] Four positioning bars 163 are respectively installed on the four inner side surfaces of the groove.

[0124] In this embodiment, when the chip 15 is conveyed to a designated position by the conveyor belt 13 , the lifting member 161 starts to work, driving the outer cylinder 162 and the positioning bar 163 to move downward to a suitable height.

[0125] At this time, the top of the chip 15 enters the groove of the outer cylinder 162. Four positioning bars 163 are located around the edges of the chip to accurately limit the chip in the groove.

[0126] By adding the chip positioning component 16, the test station in this embodiment can achieve more accurate and stable positioning of the chip, which not only improves the accuracy and reliability of the test, but also reduces the number of test failures and retests caused by inaccurate chip positioning.

[0127] In addition, a temperature sensor 164 is embedded in the positioning bar 163;

[0128] A temperature control element 165 is also provided in the groove.

[0129] In this embodiment, the temperature sensor 164 can monitor the temperature of the surface of the chip 15 close to the positioning bar 163 in real time. In semiconductor testing, the temperature of the chip is a key parameter because it directly affects the performance and test results of the chip. By monitoring the temperature in real time, it can be ensured that the chip is kept within a suitable temperature range during the test, thereby improving the accuracy and reliability of the test.

[0130] If the chip overheats during the test, the temperature sensor 164 can quickly sense it and feed this information back to the control system. The control system can adjust the test conditions or take other measures (such as suspending the test, reducing the test voltage, etc.) according to the feedback from the temperature sensor 164 to prevent the chip from being damaged due to overheating.

[0131] In addition, by collecting and analyzing the data from the temperature sensor 164, the temperature variation pattern of the chip under different test stages and conditions can be understood, which helps to optimize the test process and adjust the test parameters to reduce the impact of temperature fluctuations on the test results.

[0132] The temperature sensor 164 can be embedded in or on the surface of the positioning bar 163 to ensure accurate temperature measurement of the chip 15. The embedding method should be selected according to the type of the temperature sensor 164 and the material of the positioning bar 163 to ensure the accuracy of the measurement and the stability of the sensor.

[0133] In this embodiment, the temperature control element 165 can provide a stable heat source and a cold source for the chip during the test process, thereby controlling the temperature of the chip. This is particularly important for chips that need to be tested under specific temperature conditions, such as semiconductor devices with high temperature sensitivity.

[0134] Taking the temperature control component 165 providing a stable heat source for the chip as an example, in some cases, the test time can be shortened and the test efficiency can be improved by increasing the temperature of the chip.

[0135] The temperature control element 165 can be designed as a heating plate or heating wire that matches the shape of the groove to ensure that heat can be evenly transferred to the chip.

[0136] It is worth mentioning that the temperature sensor 164 can monitor the temperature of the temperature control element and the chip in real time and feed back the information to the control system. The control system adjusts the power of the temperature control element 165 according to the feedback of the temperature sensor 164 to achieve accurate temperature control.

[0137] In addition, a heat expansion member 166 is fixed above the positioning strip 163 . The cross section of the heat expansion member 166 is “side L” shaped so as to form an accommodation space. The accommodation space accommodates an elastic member 167 . The upper surface of the elastic member 167 is higher than the upper surface of the chip 15 .

[0138] The “side L” shape means that the cross section of the heat expansion member 166 is similar to the cross section of the corner guard plate, both of which are “side L” shapes.

[0139] In this embodiment, the heat expansion member 166 expands when heated, and this expansion effect can be converted into mechanical force to push the components connected thereto to move or deform. In this design, the expansion of the heat expansion member 166 will push the elastic member 167 to move horizontally inward (toward the chip) and downward, so that it forms a closer contact with the surface of the chip 15.

[0140] In this embodiment, the cross-section of the heat expansion member 166 is designed to be a “side L” shape. This design cleverly utilizes the thermal expansion characteristics of the material while providing sufficient space to accommodate the elastic member 167 .

[0141] The elastic member 167 is located in the accommodation space of the heat expansion member 166, and its upper surface is higher than the upper surface of the chip 15 in the initial state. When the heat expansion member 166 expands due to heat, the elastic member 167 is pushed downward and elastically deformed, and its upper surface gradually approaches and finally forms a sealed connection with the upper surface of the chip 15, ensuring the stability of the test environment (temperature) and the accuracy of the test results.

[0142] Of course, the temperature control element 165 can also provide a cold source to reset the thermal expansion element.

[0143] In this embodiment, by utilizing the thermal expansion effect, the thermal expansion member 166 can automatically adjust its size when the temperature changes, and work together with the elastic member 167 to form a dynamic compensation for the gap between the chip 15 and the test environment. This adaptive sealing can ensure that a stable sealing effect can be maintained under different test conditions, such as temperature changes, mechanical vibrations, etc., thereby improving the reliability and stability of the test.

[0144] Traditional sealing methods may rely on rigid contact or complex sealing structures, which are prone to wear and damage when used for a long time or in complex environments. The combination of the thermal expansion member 166 and the elastic member 167 can reduce the wear on the sealing surface through flexible contact and adaptive adjustment, extend the service life of the thermal expansion member 166 and the elastic member 167, and reduce maintenance costs.

[0145] Compared with complex mechanical seal structures or high-cost sealing materials, the combined design of the thermal expansion member 166 and the elastic member 167 is simpler and can reduce the complexity of production and manufacturing. This simplified design is not only conducive to improving production efficiency, but also can reduce overall costs, making the test equipment more economical and practical.

[0146] The quality of sealing directly affects the stability of the test environment and the accuracy of the test results. By achieving a tight seal between the chip and the test environment, the interference of external factors on the test results, such as temperature fluctuations, gas exchange, etc., can be reduced, thereby improving the accuracy and reliability of the test. This is especially important for chip testing that requires high-precision measurement and data analysis.

[0147] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. New semiconductor clamp test station, characterized by: include: A base (1) on which a bracket (2) is fixed; Two symmetrically arranged pin assemblies (3), which are arranged on the bracket (2) and are used to provide test pins (34); A chip providing component, used for providing a chip (15); A first limiting component (4) and a second limiting component (5), which are used to limit and press the test pin (34) from different directions, thereby electrically connecting the chip (15) and the test pin (34) to achieve power-on testing of the chip (15); Wherein, the first limiting assembly (4) and the second limiting assembly (5) are both vertically slidably arranged on the bracket (2); The bracket (2) is further provided with a motor (11), the output end of the motor (11) being provided with a cam (6), the cam (6) being provided with a slot, the slot being provided with a symmetrically distributed first cam follower (17) and a second cam follower (18), wherein the first cam follower (17) is connected to the first limit assembly (4), and the second cam follower (18) is connected to the second limit assembly (5); The first limiting component (4) comprises: A first limiting plate (41), located below the test pin (34); A first top block (42) fixed to the upper surface of the first limiting plate (41); A first sliding shaft (43) fixed below the first limiting plate (41), and the first sliding shaft (43) is vertically slidably disposed on the bracket (2); a first clearance plate (44) fixed below the first sliding shaft (43) and connected to the first cam follower (17); A limit screw (45) is fixed on the upper surface of the first clearance plate (44), and when the first top block (42) presses against the test pin (34), the limit screw (45) begins to contact the bracket (2); The second limiting component (5) comprises: A second limiting plate (51), located above the test pin (34); A second top block (52) fixed to the lower surface of the second limiting plate (51); A second sliding shaft (53) is fixed below the second limiting plate (51), and the second sliding shaft (53) is vertically slidably arranged on the bracket (2); A second clearance plate (54) is fixed below the second sliding shaft (53) and is connected to the second cam follower (18).

2. The novel semiconductor clamp test station according to claim 1, characterized in that: The pin assembly (3) comprises: An adjustment seat (31) slidably disposed on the bracket (2) along a front-rear direction; A waist-shaped hole is formed on the adjustment seat (31), and a threaded hole corresponding to the waist-shaped hole is formed on the bracket (2); An adjusting screw (32) passes through the waist-shaped hole and is screwed into the threaded hole; A pin mounting member (33) is fixed on the adjustment seat (31) and is used to mount the test pin (34).

3. The novel semiconductor clamp test station according to claim 1, characterized in that: A pressure plate is provided on the lower surface of the first clearance plate (44), and a pressure sensor (7) corresponding to the pressure plate is provided on the bracket (2); An origin plate (8) is fixed below the cam (6), and an origin sensor (9) corresponding to the origin plate (8) is provided on the bracket (2).

4. The novel semiconductor clamp test station according to claim 1, characterized in that: The chip providing component is a suction nozzle (10).

5. The novel semiconductor clamp test station according to claim 1, characterized in that: The chip providing component is a conveyor belt component, and the conveyor belt component includes: Two symmetrically arranged rotating wheels (12), the rotating wheels (12) being rotatably arranged on a substrate and driven by a stepping motor; A transmission belt (13) which is transmission-connected between the two rotating wheels (12); A plurality of limiting strips (14) are evenly spaced and distributed on a surface of one side of the transmission belt (13) close to the rotating wheel (12), and a limiting space is formed between two adjacent limiting strips (14) so ​​as to limit the placement of the chip (15); Wherein, the rotating wheel (12) is provided with a protrusion corresponding to the limiting space.

6. The novel semiconductor clamp test station according to claim 5, characterized in that: A chip positioning component (16) is arranged between the two rotating wheels (12), and the chip positioning component (16) comprises: A lifting member (161) having a lifting end; An outer cylinder (162) is mounted on the lifting end, and a groove is provided at the lower portion of the outer cylinder (162); Four positioning bars (163) are respectively mounted on four inner side surfaces of the groove.

7. The novel semiconductor clamp test station according to claim 6, characterized in that: A temperature sensor (164) is embedded in the positioning strip (163); A temperature control component (165) is also provided in the groove.

8. The novel semiconductor clamp test station according to claim 7, characterized in that: A heat expansion member (166) is fixed above the positioning strip (163), and the cross section of the heat expansion member (166) is "side L" shaped so as to form an accommodation space, and the accommodation space accommodates an elastic member (167), and the upper surface of the elastic member (167) is higher than the upper surface of the chip (15).

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